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KR900005860A - 다층 인쇄된 배선반의 제조방법 - Google Patents

다층 인쇄된 배선반의 제조방법 Download PDF

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Publication number
KR900005860A
KR900005860A KR1019890012890A KR890012890A KR900005860A KR 900005860 A KR900005860 A KR 900005860A KR 1019890012890 A KR1019890012890 A KR 1019890012890A KR 890012890 A KR890012890 A KR 890012890A KR 900005860 A KR900005860 A KR 900005860A
Authority
KR
South Korea
Prior art keywords
aqueous solution
manufacturing
wiring board
concentration
reducing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019890012890A
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English (en)
Other versions
KR970004029B1 (ko
Inventor
야스오 다나까
나오히또 요시무라
고이찌 나까노
도우루 노오또미
모리오 가꾸
Original Assignee
니시가와 레이지
미쓰비시가스가가꾸 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63221373A external-priority patent/JPH0271586A/ja
Priority claimed from JP63221374A external-priority patent/JPH0271587A/ja
Priority claimed from JP63282364A external-priority patent/JPH02129996A/ja
Application filed by 니시가와 레이지, 미쓰비시가스가가꾸 가부시끼가이샤 filed Critical 니시가와 레이지
Publication of KR900005860A publication Critical patent/KR900005860A/ko
Application granted granted Critical
Publication of KR970004029B1 publication Critical patent/KR970004029B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63—Treatment of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

요약 없음.

Description

다층 인쇄된 배선반의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (5)

  1. 내층의 구리 표면이 화학적으로 산화되어, 브라운 또는 흑색의, 산화된 구리 표면을 내층판 상에 형성시키고 ; 상기 내층판의 산화된 구리 표면을, 진크 포름알데히드 술폭실레이트 및 하이포아인산나트륨으로 구성되는 군으로부터 선택된 최소한 한 물질을 함유하는 환원제의 산성 수용액으로 처리함을 특징으로 하는 다층 인쇄된 배선반의 제조방법.
  2. 제1항에 있어서, 환원제의 산성 수용액의 진크 포름알데히드 술폭실레이트 농도가 5~30g/1이고, pH가 1 이상 7 이하이고, 40~80℃의 온도에서 0.5~5분간 처리하는 다층 인쇄된 배선반의 제조방법.
  3. 제1항에 있어서, 환원제의 산성 수용액의 하이포아인산나트륨의 농도가 5~300g/1이고, pH가 1 이상 7 이하이고, 40~80℃의 온도에서 0.5~5분간 처리하는 다층 인쇄된 배선반의 제조방법.
  4. 제1항에 있어서, 환원제의 산성 수용액이 하이포아인산나트륨 및 유기 또는 무기산의 구리염 중 최소한 하나를 함유하는 다층 인쇄된 배선반의 제조방법.
  5. 제4항에 있어서, 수용액의 하이포아인산 나트륨의 농도가 5~300g/1이고, 유기 또는 무기산의 구리염의 농도가 0.1~200g/1이고, pH가 1 이상 7 이하이고, 40~80℃의 온도에서 0.5~5분간 처리하는 다층 인쇄된 배선반의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890012890A 1988-09-06 1989-09-06 다층 인쇄된 배선반의 제조방법 Expired - Fee Related KR970004029B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP63221373A JPH0271586A (ja) 1988-09-06 1988-09-06 多層プリント板の製造法
JP63221374A JPH0271587A (ja) 1988-09-06 1988-09-06 多層プリント板の製造法
JP63-221374 1988-09-06
JP63-221373 1988-09-06
JP63282364A JPH02129996A (ja) 1988-11-10 1988-11-10 多層プリント板の製造法
JP63-282364 1988-11-10

Publications (2)

Publication Number Publication Date
KR900005860A true KR900005860A (ko) 1990-04-14
KR970004029B1 KR970004029B1 (ko) 1997-03-24

Family

ID=27330542

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890012890A Expired - Fee Related KR970004029B1 (ko) 1988-09-06 1989-09-06 다층 인쇄된 배선반의 제조방법

Country Status (5)

Country Link
US (1) US5076864A (ko)
EP (1) EP0358480B1 (ko)
KR (1) KR970004029B1 (ko)
DE (1) DE68920383T2 (ko)
MY (1) MY104191A (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69122573T2 (de) * 1990-07-30 1997-03-13 Mitsubishi Gas Chemical Co Verfahren zur Herstellung von Mehrschichtplatinen
EP0488299B1 (en) * 1990-11-30 1995-08-16 Toppan Printing Co., Ltd. Method of manufacturing a multi-layered wiring board
US5289630A (en) * 1991-07-22 1994-03-01 Macdermid, Incorporated Process for fabricating multilayer printed circuits
US5286530A (en) * 1993-01-13 1994-02-15 General Electric Company Method for providing adherent metal coatings on cyanate ester polymer surfaces
JP2694802B2 (ja) * 1993-12-28 1997-12-24 日本電気株式会社 プリント配線板の製造方法
KR100633678B1 (ko) 1998-02-26 2006-10-11 이비덴 가부시키가이샤 필드 바이어 구조를 갖는 다층프린트 배선판
US6294220B1 (en) 1999-06-30 2001-09-25 Alpha Metals, Inc. Post-treatment for copper on printed circuit boards
JP3067021B2 (ja) * 1998-09-18 2000-07-17 インターナショナル・ビジネス・マシーンズ・コーポレ−ション 両面配線基板の製造方法
JP4287622B2 (ja) * 2002-06-28 2009-07-01 デュポン帝人アドバンスドペーパー株式会社 コーティングセパレータ、その製造方法およびそれを用いた電気電子部品
US6986023B2 (en) * 2002-08-09 2006-01-10 Intel Corporation Conditional execution of coprocessor instruction based on main processor arithmetic flags
TW573327B (en) * 2002-12-27 2004-01-21 Ultratera Corp Plasma etching method
JP4784066B2 (ja) * 2004-10-28 2011-09-28 三菱瓦斯化学株式会社 樹脂組成物及び銅張積層板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61176192A (ja) * 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
US4717439A (en) * 1985-10-24 1988-01-05 Enthone, Incorporated Process for the treatment of copper oxide in the preparation of printed circuit boards
US4775444A (en) * 1987-08-26 1988-10-04 Macdermid, Incorporated Process for fabricating multilayer circuit boards

Also Published As

Publication number Publication date
DE68920383D1 (de) 1995-02-16
EP0358480A2 (en) 1990-03-14
KR970004029B1 (ko) 1997-03-24
US5076864A (en) 1991-12-31
DE68920383T2 (de) 1995-06-01
EP0358480B1 (en) 1995-01-04
MY104191A (en) 1994-02-28
EP0358480A3 (en) 1991-04-10

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