KR20180016713A - Board of radiant heat led - Google Patents

Abstract

The present invention relates to an LED heat dissipation board, and more particularly, to an LED heat dissipation board, in which heat generated in an LED is transmitted to a substrate through a metallic conductive portion in contact with the LED bottom portion, effectively dissipating heat from the LED, (Alumina layer) is formed by plasma deposition so that the thickness of the conductive parts and the substrate is not made thick, thereby making the heat radiation good and the weight lighter.
According to an aspect of the present invention, there is provided a heat dissipating base plate including a heat dissipating conductive portion provided at an upper portion of the heat dissipating base plate, an electrode terminal portion connected to the LED at one or both sides of the heat dissipating conductive portion, The heat dissipating board includes a heat dissipating base plate and an insulating resin layer formed on the upper surface of the heat dissipating base plate to electrically heat the electrode terminal unit and the heat dissipating base plate.

Description

LED BOARD OF RADIANT HEAT LED}

[0001] The present invention relates to a heat dissipation LED board, and more particularly, to a heat dissipation board which is capable of efficiently transferring heat generated from an LED through a metallic conductive portion in contact with an LED base to effectively dissipate heat of the LED, Thereby forming a conductive portion to be insulated.

Electronic components mounted on electronic products are mounted on a PCB substrate, which is mainly made of epoxy resin.

Since the main material of the PCB substrate is made of epoxy resin, etc., it has a low thermal conductivity and a high withstand voltage, making it difficult to discharge heat generated from electronic parts to the outside. In order to compensate for this, a plurality of cooling fans are provided inside each electronic product.

However, in the case of the LED, since it is mostly mounted in a narrow mounting space, it is difficult to install a separate cooling fan. Therefore, it is made to have a structure for allowing heat radiation.

However, LEDs developed and installed in recent years have many high-power, high-power LEDs, such as street lamps, automobile headlights, flat panel LEDs, and the like.

On the other hand, it is difficult to use a high power LED appropriately because development of a structure for generating heat is not effective. In particular, in the case of the LED, when the LED is heated to a temperature higher than the threshold temperature, the lifetime of the LED is shortened and power for operation of the LED is also excessively consumed. Therefore, development of heat generation technology for a high power LED is urgently required.

In order to solve the above-described problems, the present invention has an object of allowing heat generated from an LED to be transferred to a substrate through a metallic conductive portion in contact with an LED bottom, thereby effectively radiating heat from the LED.

In particular, the conductive portion and the substrate are made of aluminum or copper so that the heat transfer efficiency and the heat radiation efficiency are good, so that a large amount of heat generated from the high power LED of high capacity and high output is effectively dissipated.

Further, an aluminum oxide layer (alumina layer) is formed by plasma deposition to form a conductive portion so that the substrate and the substrate are electrically insulated from each other. Thus, the thickness of the conductive portion and the substrate is not thickened, .

A heat dissipating conductive plate 13 is provided on an upper part of the heat dissipating base plate 11 and the LED 10 is connected to one side or both sides of the heat dissipating conductive part 13, And an electrode terminal portion 15 connected to the heat sink base plate 11 so that the heat conductive portion 13 contacts the bottom of the LED 10 and the heat conducted from the LED 10 is conducted to the heat sink base plate 11, An insulating resin layer 17 is formed on the upper surface of the heat dissipating base plate 11 around the heat dissipating conductive portion 13 so that the electrode terminal portion 15 and the heat dissipating base plate 11 are electrically isolated from each other And the electrode terminal part 15 is provided on the insulating resin layer 17.

According to the present invention configured as described above, there is an excellent effect that the heat generated from the LEDs is transferred to the substrate through the metallic conductive portion contacting the LED bottom portion, effectively radiating the heat of the LEDs.

In particular, the conductive portion and the substrate are made of aluminum or copper so that the heat transfer efficiency and the heat radiation efficiency are good, so that a large amount of heat generated from the high power LED of high capacity and high output is effectively dissipated.

Further, an aluminum oxide layer (alumina layer) is formed by plasma deposition to form a conductive portion so that the substrate and the substrate are electrically insulated from each other. Thus, the thickness of the conductive portion and the substrate is not thickened, .

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of an embodiment of a copper base insulation structure of a heat radiating LED board according to the present invention; FIG.
FIG. 2 is a sectional view of a copper base insulating structure of a heat radiating LED board according to the present invention in an exploded state in an embodiment. FIG.
FIGS. 3 and 4 are flowcharts of a manufacturing process in an embodiment of a copper-based insulating structure of a heat radiating LED board according to the present invention.
5 is a cross-sectional view of an embodiment of an aluminum base insulation structure of a heat radiating board according to the present invention.
6 is a cross-sectional view of an embodiment of a copper base direct contact structure of a heat radiating LED board according to the present invention.
7 and 8 are cross-sectional views of an aluminum base direct contact structure embodiment of a heat radiating board according to the present invention.

FIG. 1 is a cross-sectional view of an embodiment of a copper base insulating structure of a heat radiating LED board according to the present invention, FIG. 2 is a sectional view of the copper base insulating structure of the heat radiating LED board according to the present invention, FIG. 5 is a cross-sectional view of an embodiment of an aluminum base insulation structure of a heat dissipating board according to the present invention, and FIG. 6 is a sectional view of a heat dissipating board according to an embodiment of the present invention. 7 and 8 are cross-sectional views of an aluminum base direct contact structure of a heat dissipating board according to the present invention, and FIGS. 9 and 10 are cross- And FIG. 11 is a flowchart illustrating a manufacturing process of the heat radiating LED board according to the present invention. FIG. 11 is a plan view and a cross-sectional view illustrating a state in which the LED is mounted on the heat radiating LED board, Is the angle shown.

1 to 11, the heat dissipating conductive board 13 according to the present invention is provided with the heat dissipating conductive part 13 on the upper side of the heat dissipating base plate 11 and the heat dissipating conductive board 13 is provided on one side or both sides of the heat dissipating conductive part 13 And an electrode terminal portion 15 connected to the LED 10 is provided.

The heat dissipating conductive board 13 is brought into contact with the bottom of the LED 10 so that the heat conducted from the LED 10 is conducted to the heat dissipating base plate 11 to provide the heat dissipating board A.

An insulating resin layer 17 is formed on the upper surface of the heat dissipating base plate 11 around the heat dissipating conductive portion 13 to electrically heat the electrode terminal portion 15 and the heat dissipating base plate 11, And the electrode terminal portion 15 is provided on the insulating resin layer 17.

The heat-dissipating base plate 11 is made of a metal material having excellent thermal conductivity, easy processing, and high economic efficiency. Preferably, copper or aluminum or an alloy containing at least one of these metals can be used. And may have a thickness of about 0.1 to 10 mm.

Thus, the heat conducted from the LED 10 is thermally conducted and spread throughout the heat-dissipating base plate 11, so that the heat is radiated to the outside over the entire heat-dissipating base plate 11. The area for heat radiation is larger than the area for heat dissipation through the large external contact area of the heat dissipation base plate 11 compared with the heat dissipation base plate 11, So that the heat radiating effect is excellent.

The heat conductive portion 13 is made of aluminum and has excellent thermal conductivity so that the heat conducted by the LED 10 is efficiently transferred to the heat dissipation base plate 11 by the heat conductive portion 13 It becomes conductive.

In particular, when the LED 10 is in a high capacity, the heat generated in the LED 10 is significant, and the heat generated by the LED 10 is conducted to the heat dissipation base plate 11 from the heat dissipation conductive portion 13. Thus, even if the LED 10 having a large heating value is mounted, heat dissipation is effectively performed, and thus the LED 10 can be stably operated.

The LED 10 is positioned above the heat dissipating conductive portion 13 on the upper surface of the heat dissipating base plate 11 so that the bottom surface of the LED 10 directly contacts the upper surface of the heat dissipating conductive portion 13.

On the other hand, on the upper surface of the heat-dissipating base plate 11 where the heat-dissipating conductive part 13 is not provided, a circuit pattern part having circuit patterns for supplying power to the LEDs 10 is provided. And an electrode terminal portion 15 for electrically connecting the terminals of the LED 10 is provided in a part of them.

The circuit pattern portion and the electrode terminal portion 15 and the like should be electrically isolated from the metallic heat-dissipating base plate 11 and the heat-dissipating conductive portion 13 having electrical conductivity.

For this purpose, the insulating resin layer 17, which is a resin layer for electrical insulation, is formed on the upper surface of the heat-dissipating base plate 11 as a surrounding portion excluding the heat-dissipating conductive portion 13.

Such an insulating resin layer 17 may be formed by a generally known resin layer forming method.

Particularly, when the insulating resin layer 17 is formed of TGFR (Track Gap Filled Resin), it is possible to form the insulating resin layer 17 with excellent electrical insulation, good withstand voltage characteristics, and with a thin thickness, There will be an advantage that the entire thickness of the LED board (A) can be reduced.

Thus, the electrode terminal portion 15 is formed on the insulating resin layer 17 so as to be electrically connected to the terminal of the LED 10. Therefore, it is preferable that the surface treatment layer 151 such as OSP (Organic Solderability Preservative) is formed for the surface stabilization because the electrode terminal portion 15 is made of copper (Cu) material.

A circuit pattern for supplying power to the LEDs 10 may be formed on the insulating resin layer 17 together with the electrode terminal portions 15. The patterns and the components mounted on the patterns may be formed by a general LED circuit You will be able to follow the production.

In addition, in the heat dissipating board A according to the present invention, an upper resin layer 19 is formed on the upper portion of the insulating resin layer 17 around the heat radiating conductive part 13 and the electrode terminal part 15 . Thus, the heat radiating and conductive portion 13, the electrode terminal portion 15, and the like having a conductive layer may be protected from the outside. Of course, the upper resin layer 19 may be formed of a general resin layer, or may be formed of TGFR (Track Gap Filled Resin).

In the case where the resin layer is formed of TGFR (Track Gap Filled Resin) in the heat radiation LED board A according to the present invention, such as the insulating resin layer 17 and the upper resin layer 19, There is a heat-stable property.

Accordingly, when a high-capacity LED 10 is mounted, high-temperature heat may be generated, and the LED performance may be deteriorated. In addition, an electric field may be formed around the LED, The heat transfer efficiency by the heat dissipating conductive portion 13 is excellent and the resin layer of each portion is layered by the TGFR (Track Gap Filled Resin) as heat is dissipated in the heat dissipating base plate 11 effectively. The operation of the LED 10 can be smoothly performed.

The heat dissipation board (A) according to the present invention can be provided as described above. The heat dissipation base plate (11) is formed on the lowermost layer, the heat dissipation conductive portion (13) is formed on the portion where the LED (10) An insulating resin layer (17) is formed around the heat dissipating conductive portion (13). An electrode terminal portion 15 for connecting the terminals of the LED 10 is formed on the insulating resin layer 17 and an upper resin layer 19 is formed around the electrode terminal portion 15. An aluminum oxide layer (Al2O3, alumina layer) 111 may be formed on the bottom surface of the heat dissipating base plate 11 of the heat dissipating LED board A and a surface treatment such as OSP (Organic Solderability Preservative) The heat sink base plate 11 can be prevented from being damaged. When the LED 10 is mounted on only one side of the heat-dissipating base plate 11 as shown in FIG. 1, an aluminum oxide layer or a surface treatment layer may be formed. In addition, 10 may be mounted.

The heat radiating conductive portion, the electrode terminal portion, the insulating resin layer, and the upper resin layer can be formed on both sides of the heat dissipating base plate 11, The circuit pattern portion may be formed on both sides.

The heat-radiating board A according to the present invention may have different embodiments according to the structure of the heat-radiating conductor 13 according to LED characteristics.

1 to 5, the uppermost portion of the heat-dissipating conductive portion 15 is formed to contact the bottom surface of the LED 10, so that the bottom surface of the LED 10 and the heat-dissipating base plate 11 are electrically insulated from each other May be provided as an embodiment of an insulating structure.

In the case of this insulation structure embodiment, the case where the terminal for electrical connection with the circuit pattern portion is provided on the bottom surface of the LED 10 mounted on the heat dissipating board A is considered. In the case of such an LED 10, since the bottom portion must be electrically insulated from the heat-dissipating base plate 11, the electric insulation layer must be provided together. In the embodiment of the present invention, electrical insulation is provided by the alumina layer 25 made of aluminum oxide (Al 2 O 3, alumina).

Therefore, the heat-dissipating conductive portion 13 according to the embodiment of the insulating structure is provided with the aluminum conductive layer 21 made of aluminum and the fast layer 23 contacting the LED 10, An alumina layer 25 made of an aluminum oxide material is formed between the first layer 21 and the fast layer 23.

Thus, the fast layer 23 and the aluminum conductive layer 21 are electrically insulated from each other by the alumina layer 25.

In particular, the alumina layer 25 may be formed by plasma deposition. When the alumina layer 25 is formed by such plasma deposition, the formation time of the alumina layer 25 is shortened, and the thickness of the alumina layer 25 can be made thin. 10 and 11, the heat transmitted from the LED 10 mounted on the heat-dissipating base plate 11 is effectively transferred to the heat-dissipating base plate 11, and the electrical insulation characteristics become the same.

1 to FIG. 1, FIG. 10, FIG. 11, and the like, the heat-radiating base plate 11 is made of copper (Cu, copper, copper). The heat dissipation base plate 11 made of copper is excellent in thermal conductivity and is suitable for the case where heat of high temperature is generated in the LED 10 to be mounted.

In recent years, not only LEDs have been applied for simple lamp operation, but also have been required to be operated at a high capacity such as LEDs for digital appliances and LEDs for flat panel displays (FPDs), streetlight LEDs, automobile indicator lights and headlight LEDs High-capacity, high-power LEDs. These high-capacity LEDs are brightly lit while the heat generated is high, so the heat must be dissipated quickly. If the heat-dissipating base plate 11 is made of a copper material, the heat transferred through the heat-dissipating conductive portion 13 may be effectively dissipated due to the rapid thermal conductivity characteristics of the copper.

In the case where a relatively small amount of heat is generated in the LED according to the embodiment of the insulation structure, the heat-dissipating base plate 11 may be made of aluminum as shown in FIG. An alumina layer 25 for insulation may be formed on the aluminum heat-dissipating base plate 11 and a fast layer 23 may be formed on the upper surface of the alumina layer 25. As a matter of course, other surface treatment may be used as long as it is a means for replacing the fast layer 23 to protect the alumina layer 25 mechanically, physically, and chemically stably.

Therefore, in the embodiment of the aluminum base insulation structure, the LEDs can be mounted on the fast layer 23, and the terminals of the LEDs can be electrically connected to the electrode terminal portions 15 on both sides.

Alternatively, as shown in FIGS. 6 to 8, a direct contact structure may be provided in which the bottom surface of the LED 10 and the heat-dissipating base plate 11 are electrically connected to each other even if the heat-conducting portion 15 is in contact with the heat- . In the case where such electrical insulation is not required, the electrical conduction is good and the heat transfer efficiency is good, so that it is more effective in heat radiation.

The heat radiating conductive part 13 of this direct contact structure embodiment is provided with an aluminum conductive layer 21 made of aluminum and a fast layer 23 contacting the LED 10 on the aluminum conductive layer 21, .

Also, this direct contact structure embodiment may be implemented with a copper base direct contact structure in which the heat-radiating base plate 11 is made of a copper material as shown in Fig. In the case of such a copper base direct contact structure embodiment, it would be suitable for the mounting of an LED having a relatively large calorific value. Thus, the heat dissipation base plate 11 made of a copper material having a high thermal conductivity and a good heat radiation efficiency will be effective for stably dissipating heat from a high power LED.

7 and 8, the heat dissipation base plate 11 may be made of an aluminum base direct contact structure made of aluminum. That is, as shown in FIG. 7, the heat-dissipating base plate 11 may be made of aluminum and the heat-radiating and conductive portion 13 may be formed of an aluminum material layer, a copper material layer, and a fast layer. As shown in FIG. 8, the heat-dissipating base plate 11 may be made of aluminum and the heat-dissipating conductive portion 13 may be formed of an 'aluminum layer' and a 'fast layer'.

In the case of such an aluminum base direct contact structure, the present invention can be applied to an LED having a relatively small heating value.

In the case of the heat radiating board A according to the present invention, the process of manufacturing the heat radiating board A will be described below. First, the manufacturing process of the heat radiating board (A) according to the present invention will be described with reference to an embodiment of a copper base insulating structure in which the heat radiating base plate 11 is made of a copper material and an aluminum oxide layer is formed as an insulating layer in the heat radiating conductor 13 Let us take an example as an example. However, the manufacturing method that can be inferred from the embodiment of the method of manufacturing such a copper-based insulating structure can be applied to other embodiments as well.

As shown in FIGS. 1 to 4, the method of manufacturing the copper-based insulating structure is such that the heat-dissipating conductive portion 13, the electrode terminal portion 15, and the like are formed on the upper surface of the flat heat dissipating base plate 11.

First, a base plate preparing step (S01) is performed in which a heat-dissipating base plate 11 made of copper or aluminum is prepared so as to be suitable for a heat-dissipating LED board. Of course, not only the heat dissipation base plate 11 but also the apparatus for forming the alumina layer, the apparatus for forming the surface treatment layer, the heat dissipation conduction unit, the electrode terminal unit, the apparatus for forming each resin layer, The preparation process of each material is performed.

A heat radiating conductive portion forming step S02 is performed to form a heat radiating conductive portion 13 positioned below the LED 10 to be mounted on the upper side of the heat radiating base plate 11. [

The step S02 of forming the heat-radiating conductive part may be a detailed step for forming the plurality of layers constituting the heat-radiating conductive part 13. [

An aluminum conductive layer forming step S021 is performed to form an aluminum conductive layer 21 made of aluminum on the upper surface of the heat dissipating base plate 11 which is the position of the heat dissipating conductive portion 13. [

The aluminum conductive layer 21 is made of an aluminum material and can be implemented in an embodiment of the copper base direct contact structure in Fig. 6 in addition to the embodiment of the copper base insulating structure in Fig. 1, 11 are made of a copper material, an aluminum conductive layer 21 made of aluminum is formed.

7 and 8, the heat-dissipating base plate 11 is made of an aluminum material. In this embodiment, the heat-dissipating base plate 11 11) so that the aluminum material layer of the same material protrudes. The aluminum conductive layer 21 may be formed by a method such as adhesion, vapor deposition, peripheral etching, cutting, or the like.

An insulating resin layer forming step (S022) may be performed to form an insulating resin layer (17) on the upper surface of the heat dissipating base plate (11) around the aluminum conductive layer (21).

The insulating resin layer 17 may be formed by a general resin layer forming method so that the LED terminals and the circuit pattern portion are insulated from the heat dissipating base plate 11. It is preferable that the insulating resin layer 17 is made of TGFR.

Then, an alumina layer forming step (S023) is performed to form an alumina layer (25) to be alumina by plasma deposition on the upper surface of the aluminum conductive layer (21).

Particularly, in the case of the plasma deposition, since the heat dissipating base plate 11 and the aluminum conductive layer 21 side of the heat radiation conductive portion 13 are made of the negative electrode, the alumina layer 25, . That is, since the insulating resin layer 17 except for the alumina layer 25 has an electrically insulated state, there is no polarity, and an alumina layer will not be formed in the plasma deposition. Particularly, when the alumina layer 25 is formed by the plasma deposition, deposition can be performed in a short period of time, and the alumina layer is formed into a stable structure to form a layer. In addition, the alumina layer formed by the plasma deposition can be formed thinner than the bonding method, and the heat transmitted from the upper LED can be quickly transmitted to the heat dissipation base plate side.

In this alumina layer forming step S023, the aluminum conductive layer 21 is formed as a cathode and the alumina layer 25 is formed on the aluminum conductive layer 21 in the plasma deposition process. However, an undesired irregular surface may be formed in a part of the insulating resin layer 17 which is the periphery of the aluminum conductive layer 21. [ Therefore, a step of polishing the surface of the insulating resin layer 17 after the alumina layer forming step (S023) may be further performed. And a surface polishing process for the upper surface of the alumina layer 25 may be further performed.

Further, the polishing process for polishing the upper surface of each of the other layers may be further performed during each process of forming each layer.

The fast layer forming step S024 is performed to form the fast layer 23 for contacting the bottom surface of the LED 10 with the upper surface of the alumina layer 25 of the heat radiating conductive part 13. [

When the heat dissipating conductive portion 13 is formed of the aluminum conductive layer 21, the alumina layer 25, and the fast layer 23 by the step of forming the heat conductive portion (S02), as shown in the lowermost end of FIG. 3, The heat radiating conductive portion 13 is formed at a height higher than that of the resin layer 17.

Forming an electrode terminal portion 15 on the heat dissipating base plate 11 around the heat dissipating conductive portion 13 so as to form an electrode terminal portion 15 for electrical connection with the terminal of the LED 10, (S03) is performed.

The electrode terminal portion 15 is formed with a surface treatment layer such as an OSP on the upper side together with the conductive layer made of the same material. A circuit pattern for supplying power to the LED is also formed. The formation of the electrode terminal portion and the formation of the circuit pattern portion may be formed by a general PCB manufacturing process.

Thus, the electrode terminal portion 15 and the heat-dissipating conductive portion 13 are protrudingly formed on the insulating resin layer 17. The step of forming the upper resin layer 19 may be performed so that the electrode terminal portion 15, the heat radiation conductive portion 13, the circuit pattern portion, and the like are not unnecessarily brought into electrical contact from the outside.

An LED mounting step S04 for mounting the LED 10 so that the bottom surface of the LED 10 is in contact with the upper surface of the heat dissipating conductive portion 13 and the terminal of the LED 10 is electrically connected to the electrode terminal portion 15 ) Is performed. 9 and 10, when the LED 10 is mounted on the heat radiating board A according to the present invention, the heat radiating conductor 13 is provided on the heat radiating base plate 11 and the heat radiating conductor 13 The electrode terminal portion 15 is formed to be connected to the LED 10.

A: Heat sink LED board 10: LED
11: heat-radiating base plate 13: heat-
15: electrode terminal part 17: insulating resin layer
19: upper resin layer 21: aluminum conductive layer

Claims (4)

The heat radiating conductive portion 13 is provided on the upper portion of the heat dissipating base plate 11 and the electrode terminal portion 15 connected to the LED 10 on one side or both sides of the heat radiating conductive portion 13 is provided, The heat radiating conductive part 13 is brought into contact with the heat radiating base plate 11 so that the heat conducted from the LED 10 is conducted to the heat radiating base plate 11,
An insulating resin layer 17 is formed on the upper surface of the heat dissipating base plate 11 around the heat dissipating conductive portion 13 to electrically heat the electrode terminal portion 15 and the heat dissipating base plate 11,
And the electrode terminal part (15) is provided on an upper portion of the insulating resin layer (17). The method according to claim 1,
Wherein the heat dissipating conductive part (13) and the electrode terminal part (15) are positioned around the upper resin layer (19) located on the insulating resin layer (17). The method according to claim 1,
The heat-dissipating conductive portion 13 is provided with an aluminum conductive layer 21 made of aluminum,
And a fast layer (23) contacting the LED (10) is provided on the aluminum conductive layer (21). The method according to claim 1,
The heat-dissipating conductive portion 13 includes an aluminum conductive layer 21 made of aluminum and a fast layer 23 contacting the LED 10,
An alumina layer 25 made of aluminum oxide is formed between the aluminum conductive layer 21 and the fast layer 23 so that the fast layer 23 and the aluminum conductive layer 21 ) Are electrically insulated from each other.

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