TW201430278A - A light emitting device, which has a light emitting diode - Google Patents
A light emitting device, which has a light emitting diode Download PDFInfo
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- TW201430278A TW201430278A TW102103358A TW102103358A TW201430278A TW 201430278 A TW201430278 A TW 201430278A TW 102103358 A TW102103358 A TW 102103358A TW 102103358 A TW102103358 A TW 102103358A TW 201430278 A TW201430278 A TW 201430278A
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- board base
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
本發明係關於一種發光裝置之設計，特別是關於一種具有散熱元件之發光二極體之發光裝置。 The present invention relates to the design of a light-emitting device, and more particularly to a light-emitting device having a light-emitting diode of a heat dissipating component.
發光二極體(Light-Emitting Diode,LED)是一種可發光的半導體電子元件，其係利用電能轉成光能的方式發光。利用發光二極體來發光的發光裝置具有發光效率高、壽命長、不易破損、及反應速度快等優點，所以逐漸取代傳統的鎢絲燈、螢光燈、及省電燈泡。 A Light-Emitting Diode (LED) is a light-emitting semiconductor electronic component that emits light by converting electrical energy into light energy. The light-emitting device that emits light by using the light-emitting diode has the advantages of high luminous efficiency, long life, no breakage, and fast reaction speed, and thus gradually replaces the conventional tungsten filament lamp, the fluorescent lamp, and the power-saving light bulb.
發光二極體的電路在發光作動時會產生許多廢熱，然而發光二極體在高溫情況下，發光效率會受高溫影響而急劇下降，因此會耗費許多電力。而產生的廢熱聚集，會讓溫度進一步上升，形成惡性循環，而進一步會縮短發光二極體的使用壽命。因此，有效將廢熱散出是很重要的，所以習知使用發光二極體來發光的發光裝置都會設置有一散熱元件以將廢熱排出。 The circuit of the light-emitting diode generates a lot of waste heat when the light is emitted. However, in the case of a high temperature, the light-emitting diode is drastically lowered by the high temperature, and thus a lot of power is consumed. The resulting accumulation of waste heat causes the temperature to rise further, forming a vicious circle, which further shortens the service life of the light-emitting diode. Therefore, it is important to effectively dissipate waste heat, so that a light-emitting device that uses a light-emitting diode to emit light is provided with a heat dissipating member to discharge waste heat.
發光裝置中每個元件層之間的導熱層通常塗布一層導熱膏以輔助導熱而提升散元件的散熱效率。然而，導熱膏的性質會隨使用時間而逐漸乾透、硬化而變質，因此其導熱效果也隨之變差而使得廢熱排出的效果變差，並進一步造成發光裝置之發光二極體的發光效率降低，例如光衰(Luminous Decay)，甚至可能造成發光裝置損壞。 The thermally conductive layer between each of the component layers in the illumination device is typically coated with a layer of thermally conductive paste to aid in thermal conduction to enhance the heat dissipation efficiency of the discrete components. However, the properties of the thermal paste gradually deteriorate, harden and deteriorate with the use time, so the heat conduction effect thereof also deteriorates, so that the effect of waste heat discharge is deteriorated, and the luminous efficiency of the light-emitting diode of the light-emitting device is further caused. Reducing, such as Luminous Decay, may even cause damage to the illuminating device.
緣此，本發明之目的即是提供一種具有發光二極體 之發光裝置，用以延長發光裝置的使用壽命，以改善習知技術之問題。 Accordingly, it is an object of the present invention to provide a light-emitting diode The illuminating device is used to extend the service life of the illuminating device to improve the problems of the prior art.
本發明為解決習知技術之問題所採用之技術手段係提供一種具有發光二極體之發光裝置，包括一發光二極體模組、一電路板基座、一燈杯以及一散熱元件。發光二極體模組具有一發光二極體。電路板基座之一側設置有發光二極體模組。燈杯之一側鄰設於電路板基座之另一側。散熱元件鄰設於燈杯之另一側，其中，發光二極體模組及電路板基座之間設置有一第一錫層，電路板基座及燈杯之間設置有一第二錫層或一第一石墨層，以及燈杯及散熱元件之間設置有一第二石墨層。 The technical means for solving the problems of the prior art is to provide a light-emitting device having a light-emitting diode, comprising a light-emitting diode module, a circuit board base, a light cup and a heat dissipating component. The light emitting diode module has a light emitting diode. A light emitting diode module is disposed on one side of the circuit board base. One of the lamp cups is disposed on the other side of the circuit board base. The heat dissipating component is disposed adjacent to the other side of the lamp cup, wherein a first tin layer is disposed between the light emitting diode module and the circuit board base, and a second tin layer is disposed between the circuit board base and the lamp cup A first graphite layer and a second graphite layer are disposed between the lamp cup and the heat dissipating component.
在本發明的一實施例中，第一錫層及第二錫層以印刷塗布方式塗布。 In an embodiment of the invention, the first tin layer and the second tin layer are applied by printing and coating.
在本發明的一實施例中，第一錫層及第二錫層以迴流焊的方式設置。 In an embodiment of the invention, the first tin layer and the second tin layer are disposed by reflow soldering.
在本發明的一實施例中，電路板基座為一金屬核心印刷電路板。 In an embodiment of the invention, the circuit board base is a metal core printed circuit board.
在本發明的一實施例中，散熱元件為一金屬散熱片。 In an embodiment of the invention, the heat dissipating component is a metal heat sink.
在本發明的一實施例中，散熱元件之表面為具有散熱鰭片。 In an embodiment of the invention, the surface of the heat dissipating component has a heat dissipating fin.
在本發明的一實施例中，金屬散熱片為貼合於第二石墨層。 In an embodiment of the invention, the metal fins are attached to the second graphite layer.
在本發明的一實施例中，電路板基座、燈杯與散熱元件以一第一螺固構件而螺固。 In an embodiment of the invention, the circuit board base, the lamp cup and the heat dissipating component are screwed by a first screw member.
在本發明的一實施例中，燈杯與散熱元件以一第二螺固構件而螺固。 In an embodiment of the invention, the lamp cup and the heat dissipating component are screwed by a second screw member.
經由本發明所採用之技術手段，藉由錫層使發光二極體與電路板基座的結合更為緊固，且錫層及石墨具有低熱阻、高導熱的特徵，並且不會隨時間而變質，而能維持良好的散熱效 率，以有效傳導廢熱，使發光裝置的使用壽命得以延長。 Through the technical means adopted by the invention, the bonding of the light emitting diode and the circuit board base is more tightly fixed by the tin layer, and the tin layer and the graphite have the characteristics of low thermal resistance and high thermal conductivity, and do not change with time. Deteriorating while maintaining good heat dissipation The rate is to effectively conduct waste heat to extend the service life of the illuminating device.
本發明所採用的具體實施例，將藉由以下之實施例及附呈圖式作進一步之說明。 The specific embodiments of the present invention will be further described by the following examples and the accompanying drawings.
100、100a、100b‧‧‧具有發光二極體之發光裝置 100, 100a, 100b‧‧‧Lighting device with light emitting diode
1‧‧‧發光二極體模組 1‧‧‧Lighting diode module
11‧‧‧發光二極體 11‧‧‧Lighting diode
12‧‧‧接腳 12‧‧‧ pins
2‧‧‧電路板基座 2‧‧‧Board base
21‧‧‧接點 21‧‧‧Contacts
3‧‧‧燈杯 3‧‧‧light cup
4‧‧‧散熱元件 4‧‧‧Heat components
41‧‧‧散熱鰭片 41‧‧‧Heat fins
5a‧‧‧第一錫層 5a‧‧‧ first tin layer
5b‧‧‧第二錫層 5b‧‧‧Second tin layer
6a‧‧‧第一石墨層 6a‧‧‧First graphite layer
6b‧‧‧第二石墨層 6b‧‧‧Second graphite layer
7a‧‧‧第一螺固構件 7a‧‧‧First screw member
7b‧‧‧第二螺固構件 7b‧‧‧Second screw member
第1圖係顯示依據本發明之第一實施例的具有發光二極體之發光裝置之剖面圖；第2圖係顯示依據本發明之第二實施例的具有發光二極體之發光裝置之剖面圖；第3圖係顯示依據本發明之第三實施例的具有發光二極體之發光裝置之剖面圖。 1 is a cross-sectional view showing a light-emitting device having a light-emitting diode according to a first embodiment of the present invention; and FIG. 2 is a cross-sectional view showing a light-emitting device having a light-emitting diode according to a second embodiment of the present invention. Figure 3 is a cross-sectional view showing a light-emitting device having a light-emitting diode according to a third embodiment of the present invention.
請參閱第1圖，其係顯示依據本發明之第一實施例的具有發光二極體之發光裝置之剖面圖。本發明之第一實施例之具有發光二極體之發光裝置100係包括一發光二極體模組1、一電路板基座2、一燈杯3、一散熱元件4、第一錫層5a、第一石墨層6a、及一第二石墨層6b。 Referring to Fig. 1, there is shown a cross-sectional view of a light-emitting device having a light-emitting diode according to a first embodiment of the present invention. The light emitting device 100 with the light emitting diode according to the first embodiment of the present invention includes a light emitting diode module 1, a circuit board base 2, a light cup 3, a heat dissipating component 4, and a first tin layer 5a. a first graphite layer 6a and a second graphite layer 6b.
發光二極體模組1具有一發光二極體11及二個接腳12。二個接腳12分別電性連接電路板基座2的正、負極接點21以使發光二極體11通電發光。電路板基座2在本實施例中是一種金屬核心印刷電路板(Metal Core Printed Circuit Board,MCPCB)，金屬核心的印刷電路板的結構由線路層(Circuit Layer)、絕緣層(Dielectric Layer)、及基層(Base Layer)所組成。其中絕緣層為一層低熱阻且高導熱的絕緣材料，而基層為金屬基板，通常是鋁或銅。因此金屬核心的印刷電路板除了導熱效果非常好之外，其本身亦能散熱。當然，本發明不限於此，電路板基座2也可以是傳統的印刷電路板。發光二極體11透過第一錫層5a與電路板基座2之一側貼合。在本實施例中，第一錫層5a 是以印刷塗布方式塗布在發光二極體11與電路板基座2的接觸面之間。較佳地，是以發光二極體11與電路板基座2的整個接觸面都印刷塗布上錫膏，再透過迴流焊(Reflow Soldering)的方式將發光二極體11與電路板基座2焊合在一起，因為是採用整個接觸面都焊合的方式，所以發光二極體11與電路板基座2的結合更緊固。且第一錫層5a的導熱效果相當良好也不會隨時間而變質及硬化。 The LED module 1 has a light-emitting diode 11 and two pins 12 . The two pins 12 are electrically connected to the positive and negative contacts 21 of the circuit board base 2 to electrically illuminate the LEDs 11 . In this embodiment, the circuit board base 2 is a metal core printed circuit board (MCPCB). The structure of the metal core printed circuit board is composed of a circuit layer, a dielectric layer, and a Dielectric Layer. And the base layer is composed of. The insulating layer is a layer of insulating material with low thermal resistance and high thermal conductivity, and the base layer is a metal substrate, usually aluminum or copper. Therefore, the printed circuit board of the metal core can dissipate heat in addition to the heat conduction effect. Of course, the invention is not limited thereto, and the circuit board base 2 may also be a conventional printed circuit board. The light-emitting diode 11 is bonded to one side of the circuit board base 2 through the first tin layer 5a. In this embodiment, the first tin layer 5a It is applied between the light-emitting diode 11 and the contact surface of the circuit board base 2 by printing and coating. Preferably, the solder paste is printed on the entire contact surface of the LED body 11 and the circuit board base 2, and the LED body 11 and the circuit board base 2 are reflowed by reflow soldering. The welding is combined, because the entire contact surface is welded, so that the combination of the light-emitting diode 11 and the circuit board base 2 is more tight. Moreover, the heat conduction effect of the first tin layer 5a is quite good and does not deteriorate and harden with time.
電路板基座2之另一側鄰設於燈杯3之一側。燈杯3是用來固定且保護發光二極體模組1及電路板基座2。較佳地，燈杯3採用導熱良好及散熱良好的材質，例如鋁金屬或陶瓷等，以輔助散熱。在較佳實施例中，發光二極體11的上方還會覆蓋一層燈罩以增加保護效果。第一石墨層6a設置於電路板基座2與燈杯3之間，第一石墨層6a是石墨所製成，石墨是一種低熱阻、高導熱、以及導電較金屬差的材料，因此第一石墨層6a可以有效將電路板基座2的熱傳導至燈杯3，並同時保護電路板基座2不被燈杯3傳來的電荷所影響。再者，石墨不會隨著時間而變質及硬化。 The other side of the circuit board base 2 is adjacent to one side of the lamp cup 3. The lamp cup 3 is used to fix and protect the LED module 1 and the circuit board base 2. Preferably, the lamp cup 3 is made of a material having good heat conduction and good heat dissipation, such as aluminum metal or ceramics, to assist heat dissipation. In a preferred embodiment, a light cover is also placed over the light emitting diode 11 to increase the protective effect. The first graphite layer 6a is disposed between the circuit board base 2 and the lamp cup 3. The first graphite layer 6a is made of graphite. The graphite is a material with low thermal resistance, high thermal conductivity, and poor electrical conductivity, so the first The graphite layer 6a can effectively conduct heat of the circuit board base 2 to the lamp cup 3 while protecting the circuit board base 2 from being affected by the electric charge transmitted from the lamp cup 3. Furthermore, graphite does not deteriorate and harden over time.
燈杯3之另一側鄰接散熱元件4，在本實施例中，散熱元件4是一金屬散熱片。第二石墨層6b貼合設置在燈杯3與散熱元件4之間一，第二石墨層6b是石墨所製成，因此也可有效地將燈杯3的熱傳導至散熱元件4。 The other side of the lamp cup 3 is adjacent to the heat dissipating member 4. In the present embodiment, the heat dissipating member 4 is a metal fin. The second graphite layer 6b is disposed between the lamp cup 3 and the heat dissipating member 4, and the second graphite layer 6b is made of graphite, so that the heat of the lamp cup 3 can be efficiently conducted to the heat dissipating member 4.
再者，電路板基座2、燈杯3及散熱元件4藉由一第一螺固構件7a鎖緊螺固，藉此使電路板基座2、第一石墨層6a、燈杯3、第二石墨層6b、及散熱元件4能緊密貼合而提升導熱效果。在本實施例中，第一螺固構件7a包括一螺絲及螺帽。 Furthermore, the circuit board base 2, the lamp cup 3 and the heat dissipating component 4 are locked and screwed by a first screw member 7a, thereby making the circuit board base 2, the first graphite layer 6a, the lamp cup 3, and the first The two graphite layers 6b and the heat dissipating member 4 can be closely adhered to enhance the heat conduction effect. In the embodiment, the first screw member 7a includes a screw and a nut.
藉由上述的技術手段，廢熱將有效地被傳導及排出，使得發光裝置的使用壽命得以延長，而且因為導熱及散熱效果的提升，所以散熱元件可以使用較小的散熱元件，例如金屬散熱片，所以能節省材料或簡化結構。 With the above technical means, waste heat will be effectively conducted and discharged, so that the service life of the light-emitting device can be prolonged, and because of the improvement of heat conduction and heat dissipation, the heat-dissipating component can use a smaller heat-dissipating component, such as a metal heat sink. So you can save material or simplify the structure.
請參閱第2圖所示，其係顯示本發明之第二實施例的具有發光二極體之發光裝置之剖面圖。本發明之第二實施例之具有發光二極體之發光裝置100a與第一實施例之具有發光二極體之發光裝置100的差異在於電路板基座2與燈杯3之間為設置有一第二錫層5b而不是第一石墨層。第二錫層5b的設置方式與第一錫層5a相同，不再贅述。藉由第二錫層5b的焊合，使得電路板基座2與燈杯3能結合緊密，除了導熱效果較好外，也不需要藉由第一螺固構件7a來螺固，所以僅需透過一第二螺固構件7b來將燈杯3及散熱元件4鎖固即可，而且焊合的效果甚至較螺固來的好。 Referring to Fig. 2, there is shown a cross-sectional view of a light-emitting device having a light-emitting diode according to a second embodiment of the present invention. The light-emitting device 100a having the light-emitting diode according to the second embodiment of the present invention is different from the light-emitting device 100 having the light-emitting diode of the first embodiment in that a circuit board base 2 and the lamp cup 3 are provided with a first The tin layer 5b is not the first graphite layer. The second tin layer 5b is disposed in the same manner as the first tin layer 5a, and will not be described again. By soldering the second tin layer 5b, the circuit board base 2 and the lamp cup 3 can be tightly combined, and in addition to the better heat conduction effect, it is not required to be screwed by the first screw member 7a, so only need The lamp cup 3 and the heat dissipating member 4 can be locked by a second screw member 7b, and the soldering effect is even better than that of the screw.
請參閱第3圖所示，其係顯示本發明之第三實施例的具有發光二極體之發光裝置之剖面圖。本發明之第三實施例之具有發光二極體之發光裝置100b與第一實施例之具有發光二極體之發光裝置100的差異在於本實施例之散熱元件4之表面具有散熱鰭片41，透過散熱鰭片41增加與空氣接觸的面積而提升散熱的速率，有效降低發光裝置的溫度。 Referring to Fig. 3, there is shown a cross-sectional view of a light-emitting device having a light-emitting diode according to a third embodiment of the present invention. The light-emitting device 100b having the light-emitting diode according to the third embodiment of the present invention is different from the light-emitting device 100 having the light-emitting diode of the first embodiment in that the surface of the heat dissipating member 4 of the present embodiment has heat-dissipating fins 41. The area in contact with the air is increased by the heat dissipation fins 41 to increase the rate of heat dissipation, thereby effectively reducing the temperature of the light-emitting device.
綜上所述，本發明之具有發光二極體之發光裝置提供較長的使用壽命及較佳的散熱效果，更能適用於各種情況。 In summary, the light-emitting device with the light-emitting diode of the present invention provides a longer service life and better heat dissipation effect, and is more suitable for various situations.
以上之敘述僅為本發明之較佳實施例說明，凡精於此項技藝者當可依據上述之說明而作其它種種之改良，惟這些改變仍屬於本發明之發明精神及以下所界定之專利範圍中。 The above description is only for the preferred embodiment of the present invention, and those skilled in the art can make other improvements according to the above description, but these changes still belong to the inventive spirit of the present invention and the patents defined below. In the scope.
100‧‧‧具有發光二極體之發光裝置 100‧‧‧Lighting device with light-emitting diode
1‧‧‧發光二極體模組 1‧‧‧Lighting diode module
11‧‧‧發光二極體 11‧‧‧Lighting diode
12‧‧‧接腳 12‧‧‧ pins
2‧‧‧電路板基座 2‧‧‧Board base
21‧‧‧接點 21‧‧‧Contacts
3‧‧‧燈杯 3‧‧‧light cup
4‧‧‧散熱元件 4‧‧‧Heat components
5a‧‧‧第一錫層 5a‧‧‧ first tin layer
6a‧‧‧第一石墨層 6a‧‧‧First graphite layer
6b‧‧‧第二石墨層 6b‧‧‧Second graphite layer
7a‧‧‧第一螺固構件 7a‧‧‧First screw member
Claims (9)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102103358A TW201430278A (en) | 2013-01-29 | 2013-01-29 | A light emitting device, which has a light emitting diode |
| CN201310053019.8A CN103972379A (en) | 2013-01-29 | 2013-02-19 | Light-emitting device with light-emitting diodes |
| PCT/CN2013/076791 WO2014127594A1 (en) | 2013-01-29 | 2013-06-05 | Light-emitting device having light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102103358A TW201430278A (en) | 2013-01-29 | 2013-01-29 | A light emitting device, which has a light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201430278A true TW201430278A (en) | 2014-08-01 |
Family
ID=51241654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102103358A TW201430278A (en) | 2013-01-29 | 2013-01-29 | A light emitting device, which has a light emitting diode |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN103972379A (en) |
| TW (1) | TW201430278A (en) |
| WO (1) | WO2014127594A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI587270B (en) * | 2015-11-20 | 2017-06-11 | 友達光電股份有限公司 | Display and its thermoelectric conduction element |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104501120A (en) * | 2014-11-25 | 2015-04-08 | 福建省辉尚光电科技有限公司 | Novel LED lamp heat-radiating structure |
| CN106972096A (en) * | 2016-10-26 | 2017-07-21 | 湾城公司 | A kind of heat-dissipating structure body and application |
| WO2019226438A1 (en) * | 2018-05-20 | 2019-11-28 | Abeyatech, Llc | Light emitting diode for low temperature applications |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012529740A (en) * | 2009-06-10 | 2012-11-22 | シリシュ デビダス デシュパンデ | Customizable, long-life and high thermal efficiency environmentally friendly solid state lighting |
| CN101740712A (en) * | 2009-12-17 | 2010-06-16 | 上海靖耕照明电器有限公司 | LED (Liquid Emitting Diode) crystal grain fixing method |
| CN102234410B (en) * | 2010-04-28 | 2013-12-25 | 上海合复新材料科技有限公司 | Heat-conducting thermosetting molding composite material and application thereof |
| CN202308069U (en) * | 2011-11-04 | 2012-07-04 | 汪荃 | A high-power LED module |
| CN102644866A (en) * | 2012-03-07 | 2012-08-22 | 厦门天力源光电科技有限公司 | LED (Light-Emitting Diode) lamp bulb with good heat radiation |
-
2013
- 2013-01-29 TW TW102103358A patent/TW201430278A/en unknown
- 2013-02-19 CN CN201310053019.8A patent/CN103972379A/en active Pending
- 2013-06-05 WO PCT/CN2013/076791 patent/WO2014127594A1/en not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI587270B (en) * | 2015-11-20 | 2017-06-11 | 友達光電股份有限公司 | Display and its thermoelectric conduction element |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014127594A1 (en) | 2014-08-28 |
| CN103972379A (en) | 2014-08-06 |
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