KR102160936B1 - 접착성 수지층, 접착성 수지 필름, 적층체 및 적층체의 제조 방법 - Google Patents
접착성 수지층, 접착성 수지 필름, 적층체 및 적층체의 제조 방법 Download PDFInfo
- Publication number
- KR102160936B1 KR102160936B1 KR1020197011623A KR20197011623A KR102160936B1 KR 102160936 B1 KR102160936 B1 KR 102160936B1 KR 1020197011623 A KR1020197011623 A KR 1020197011623A KR 20197011623 A KR20197011623 A KR 20197011623A KR 102160936 B1 KR102160936 B1 KR 102160936B1
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive resin
- resin layer
- temperature
- laminate
- meth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000178 monomer Substances 0.000 claims abstract description 60
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- 239000000203 mixture Substances 0.000 claims abstract description 43
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- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 claims description 4
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- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 claims description 4
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 claims description 2
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- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 claims description 2
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 claims description 2
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 claims description 2
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 claims description 2
- 239000004342 Benzoyl peroxide Substances 0.000 claims description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical group C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 2
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 claims description 2
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- XJOBOFWTZOKMOH-UHFFFAOYSA-N decanoyl decaneperoxoate Chemical compound CCCCCCCCCC(=O)OOC(=O)CCCCCCCCC XJOBOFWTZOKMOH-UHFFFAOYSA-N 0.000 claims description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 claims description 2
- OBETXYAYXDNJHR-UHFFFAOYSA-N 2-Ethylhexanoic acid Chemical compound CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 claims 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 claims 1
- SHZIWNPUGXLXDT-UHFFFAOYSA-N caproic acid ethyl ester Natural products CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 claims 1
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- 125000000524 functional group Chemical group 0.000 description 6
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- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
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- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
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- 230000014759 maintenance of location Effects 0.000 description 2
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
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- 125000001424 substituent group Chemical group 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- FLBSSWRVLODATR-UHFFFAOYSA-N 2-(1,3-dicyanobutyldiazenyl)-4-methylpentanedinitrile Chemical compound N(=NC(C#N)CC(C)C#N)C(C#N)CC(C)C#N FLBSSWRVLODATR-UHFFFAOYSA-N 0.000 description 1
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- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- PFHOSZAOXCYAGJ-UHFFFAOYSA-N 2-[(2-cyano-4-methoxy-4-methylpentan-2-yl)diazenyl]-4-methoxy-2,4-dimethylpentanenitrile Chemical compound COC(C)(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)(C)OC PFHOSZAOXCYAGJ-UHFFFAOYSA-N 0.000 description 1
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- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
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Abstract
Description
도 2는 단차를 갖는 기재의 일 예를 나타내는 단면도이다.
도 3은 2장의 기재 사이에 접착성 수지층이 적층된 적층체의 일 예를 나타내는 단면도이다.
도 4는 도 3의 적층체를 금형 사이에 협지된 상태의 일 예를 나타내는 단면도이다.
도 5는 접착성 수지층이 가열 경화된 적층체의 일 예를 나타내는 단면도이다.
Claims (11)
- 투명성을 갖는 아크릴계의 접착성 수지 조성물을 포함하는 단층의 접착성 수지층으로서,
상기 접착성 수지 조성물이 (A) 아크릴계 폴리머 100중량부와, (B) 아크릴계 모노머 4∼20중량부와, (C) 열중합 개시제 0.001∼5중량부와, 상기 (A) 아크릴계 폴리머에 대해 1.5당량 이하의 (D) 가교제를 함유하고,
상기 (B) 아크릴계 모노머로서, 2-히드록시에틸(메타)아크릴레이트, 2-히드록시프로필(메타)아크릴레이트, 3-히드록시프로필(메타)아크릴레이트, 4-히드록시부틸(메타)아크릴레이트, 6-히드록시헥실(메타)아크릴레이트, 8-히드록시옥탄(메타)아크릴레이트 및 시클로헥산디메탄올모노(메타)아크릴레이트로 이루어진 군에서 선택되는 1종 이상의 히드록시기를 갖는 (메타)아크릴레이트의 모노머만을 포함하고,
상기 (C) 열중합 개시제가, 과산화벤조일, 과산화아세틸, 과산화데카노일, 과산화라우로일, 디쿠밀퍼옥사이드, 디-t-부틸퍼옥사이드, t-부틸퍼옥시벤조에이트, t-부틸퍼옥시-2-에틸헥사노에이트, 쿠멘히드로퍼옥사이드 및 t-부틸히드로퍼옥사이드로 이루어진 군에서 선택되는 1종 이상의 과산화물계 열중합 개시제이고,
상기 접착성 수지층이 상온에서 양면에 점착성을 갖고, 100∼250℃의 온도 및 30초∼10분의 시간 동안 열 프레스 가열에 의해 열경화할 수 있는 것을 특징으로 하는 접착성 수지층. - 제 1 항에 있어서,
가열 전의 온도 23℃에 있어서의 저장 탄성률보다도, 상기 가열에 의해 열경화된 후의 온도 23℃에 있어서의 저장 탄성률이 높고, 가열 전의 온도 23℃에 있어서의 저장 탄성률이 1×104∼1×106㎩이고, 상기 가열에 의해 열경화된 후의 온도 23℃에 있어서의 저장 탄성률이 1×104∼1×109㎩인 것을 특징으로 하는 접착성 수지층. - 제 1 항의 접착성 수지층이 2장의 세퍼레이터 사이에 적층되어 이루어지는 것을 특징으로 하는 접착성 수지 필름.
- 제 1 항의 접착성 수지층을 개재하여, 2장의 기재가 적층되어 이루어지는 것을 특징으로 하는 적층체.
- 제 4 항에 있어서,
상기 2장의 기재 중 적어도 한쪽의 기재가 상기 접착성 수지층과 접하는 측의 면 내에 5㎛∼1㎜의 단차를 1 이상 포함하는 것을 특징으로 하는 적층체. - 제 5 항에 있어서,
상기 단차가 50㎛∼1㎜인 것을 특징으로 하는 적층체. - 제 1 항의 접착성 수지층을 개재하여, 2장의 기재를 적층하여 얻어진 적층체를 2개의 금형 사이에 협지된 상태에서 상기 접착성 수지층을 가열 경화하는 것을 특징으로 하는 적층체의 제조 방법.
- 제 7 항에 있어서,
상기 접착성 수지층의 원재료 조성물에 포함되는 용매의 끓는점을 온도 A, 상기 열중합 개시제가 1분간의 반감기를 갖는 온도를 온도 B, 상기 접착성 수지층의 제조 공정에 있어서 상기 용매를 제거하기 위한 가열 시의 온도를 온도 C, 상기 접착성 수지층을 가열 경화시키는 공정에 있어서의 금형의 프레스 온도를 온도 D로 했을 때, 각 온도가 하기 식(1)의 순서인 것을 특징으로 하는 적층체의 제조 방법:
식(1) 온도 A<온도 C<온도 B<온도 D. - 제 7 항에 있어서,
상기 2장의 기재 중 적어도 한쪽의 기재가 상기 접착성 수지층과 접하는 측의 면 내에 5㎛∼1㎜의 단차를 1 이상 포함하는 것을 특징으로 하는 적층체의 제조 방법. - 제 9 항에 있어서,
상기 단차가 50㎛∼1㎜인 것을 특징으로 하는 적층체의 제조 방법. - 제 7 항에 있어서,
상기 가열 경화할 때의 금형의 온도가 150∼300℃의 온도인 것을 특징으로 하는 적층체의 제조 방법.
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| JP7437185B2 (ja) * | 2020-02-26 | 2024-02-22 | 藤森工業株式会社 | 複合成型体、接着性樹脂層及び複合成型体の製造方法 |
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| JP2013221065A (ja) * | 2012-04-16 | 2013-10-28 | Nippon Synthetic Chem Ind Co Ltd:The | アクリル系樹脂組成物、アクリル系粘着剤、粘着シート、両面粘着シート、透明電極用粘着剤、タッチパネル及び画像表示装置、並びに粘着剤層含有積層体の製造方法 |
| JP2013234322A (ja) * | 2012-04-10 | 2013-11-21 | Nippon Synthetic Chem Ind Co Ltd:The | 粘着シート、粘着剤層付き積層体の製造方法、およびその用途 |
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| KR101023837B1 (ko) | 2008-01-11 | 2011-03-22 | 주식회사 엘지화학 | 점착제 조성물, 상기를 포함하는 편광판 및 액정표시장치 |
| JP5657900B2 (ja) * | 2010-03-08 | 2015-01-21 | 株式会社カネカ | 熱伝導材料 |
| JP2011184582A (ja) * | 2010-03-09 | 2011-09-22 | Three M Innovative Properties Co | 光学用粘着シート |
| US20120156456A1 (en) | 2010-03-14 | 2012-06-21 | Mitsubishi Plastics, Inc. | Transparent double-sided self-adhesive sheet |
| JP2012035431A (ja) | 2010-08-04 | 2012-02-23 | Lintec Corp | 保護フィルム用粘着シート |
| US9272406B2 (en) * | 2010-09-30 | 2016-03-01 | Ethicon Endo-Surgery, Llc | Fastener cartridge comprising a cutting member for releasing a tissue thickness compensator |
| JP5651073B2 (ja) | 2011-06-14 | 2015-01-07 | 綜研化学株式会社 | 粘着剤、粘着シートおよびタッチパネル用積層体 |
| KR101422662B1 (ko) * | 2011-09-08 | 2014-07-23 | 제일모직주식회사 | 위상차 점착필름, 그 제조방법 및 이를 포함하는 광학부재 |
| JP6067964B2 (ja) * | 2011-08-12 | 2017-01-25 | スリーエム イノベイティブ プロパティズ カンパニー | 放射線硬化性粘着シート |
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| JP2014026337A (ja) | 2012-07-24 | 2014-02-06 | Fujitsu Component Ltd | タッチパネルの製造方法及びタッチパネル |
| EP2982727B1 (en) * | 2013-04-02 | 2020-09-02 | Showa Denko K.K. | Conductive adhesive, anisotropic conductive film and electronic devices using both |
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| JP2011162659A (ja) * | 2010-02-09 | 2011-08-25 | Fujimori Kogyo Co Ltd | 粘着剤組成物、粘着フィルム、粘着剤組成物の製造方法及び粘着フィルムの製造方法 |
| JP2013234322A (ja) * | 2012-04-10 | 2013-11-21 | Nippon Synthetic Chem Ind Co Ltd:The | 粘着シート、粘着剤層付き積層体の製造方法、およびその用途 |
| JP2013221065A (ja) * | 2012-04-16 | 2013-10-28 | Nippon Synthetic Chem Ind Co Ltd:The | アクリル系樹脂組成物、アクリル系粘着剤、粘着シート、両面粘着シート、透明電極用粘着剤、タッチパネル及び画像表示装置、並びに粘着剤層含有積層体の製造方法 |
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| WO2023229171A1 (ko) * | 2022-05-25 | 2023-11-30 | 주식회사 엘지에너지솔루션 | 전지 모듈 및 이의 제조 방법 |
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| TWI738637B (zh) | 2021-09-11 |
| EP3252121A1 (en) | 2017-12-06 |
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| US10919276B2 (en) | 2021-02-16 |
| CN107109147B (zh) | 2021-01-19 |
| TW201634625A (zh) | 2016-10-01 |
| KR20170091670A (ko) | 2017-08-09 |
| KR20190045402A (ko) | 2019-05-02 |
| KR102092056B1 (ko) | 2020-03-23 |
| EP3252121A4 (en) | 2018-08-15 |
| TWI786586B (zh) | 2022-12-11 |
| CN107109147A (zh) | 2017-08-29 |
| TW202128909A (zh) | 2021-08-01 |
| EP3252121B1 (en) | 2022-12-14 |
| JP2016141706A (ja) | 2016-08-08 |
| JP6460525B2 (ja) | 2019-01-30 |
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