JPH0687485B2 - IC module - Google Patents

Description

The present invention relates to an IC module, and more particularly to an IC module (hereinafter simply referred to as a module) to be mounted on a thin semiconductor device such as an IC card.

[Conventional technology]

FIG. 5 is a side sectional view showing a module to be mounted on a conventional thin semiconductor device such as an IC card. In the figure, 1 is a module, 2 is a substrate core material 21 and the core material 21 is arranged on the surface thereof. The circuit board 3 made of glass epoxy resin, which is composed of the wiring circuit 22 and the connection terminals 24 arranged on the back surface and electrically connected to the wiring circuit 22 through the through holes 23, is provided on the circuit board 2 with the die-bonding material 4. IC chip fixed by 5
Is a gold wire for connecting the IC chip 3 to the wiring circuit 22 at the connecting portion 51, 6 is a sealing resin for covering the IC chip 3, the gold wire 5, the connecting portion 51 and the periphery thereof, and 25 is a sealing resin for the circuit board 2. 6 is a board boundary portion for 6.

FIG. 6 is an example of another conventional type of module, in which a frame 7 is provided to prevent the resin from flowing out when the sealing resin 6 is potted.
Is the same as that shown in FIG.

FIG. 7 shows the IC card 8 in which the module 1 having a rectangular cross section is mounted on the card base 81, and FIG. 8 shows the shape of the module 1 mounted on the IC card 8 at the boundary between the module 1 and the card base 81. The terminal surface of the module 1 is shown to have a wide shape so as to prevent the back portion 811 from cracking.

[Problems to be Solved by the Invention]

In this conventional module 1, since the circuit board 2 is, for example, a glass epoxy printed wiring board and cannot be heated to a very high temperature, the material of the die bond material 4 that can be used for die bonding of the IC chip 3 is limited, and the gold wire to the IC chip 3 is limited. There were also restrictions on the conditions for wirebonding according to 5 and the like. Since the IC chip 3 itself is not packaged with resin, the module 1 usually has to be manufactured in a clean room or the like, and not only the productivity is very poor, but the module 1 with sufficient reliability is also available. I couldn't get it.

Further, regarding the resin sealing of the IC chip 3, there is a problem that the workability and the dimensional stability are low because the resin sealing is mainly performed by potting or the like. Further, even when the resin sealing is performed by molding and sealing, there is a problem that the dimensional matching accuracy between the circuit board 2 and the resin is poor due to the difference in the coefficient of thermal expansion of the circuit board 2.

Next, when the IC card 8 is manufactured, as shown in FIGS. 7 and 8, when the module 1 is embedded or mounted in the card base 81, the module 1 is hard as shown in JIS-X6303, for example. It is mounted on a laminated card base made of vinyl chloride sheet material. Therefore, the shape of the module 1 is required to have reproducibility of shape accuracy suitable for mounting, and it is required that the mounted card does not fall out of the card or crack even when it is repeatedly bent. It Therefore, regarding the durability of the card with the module attached, the twisting and bending test of the card is stipulated in the ISO standard (ISO 7316-1par4), and the shape of the module is also required to be suitable for it.

In the IC card 8 shown in FIG. 7, when the card 8 is repeatedly bent, the module 1 is disengaged from the card base 81, or the back 81 of the boundary between the module 1 and the card base 81 of the card 8 is removed.
There was a problem that 1 was broken. For this purpose, as shown in FIG. 8, the shape of the module 1 is changed to a shape having a wide irregular cross section on the terminal surface of the module to disperse the stress due to bending,
I try to prevent the back from cracking. However, even with such a shape of the module 1, when the card mounted on the card is bent, the circuit board 2 and the sealing resin 6 are peeled off at the board boundary portion 25 of the module 1 due to bending stress, and the IC chip 3 is connected. In some cases, part 51 was destroyed.

On the other hand, although not shown in the figure, an integrated circuit packaged in resin is
In the case of directly embedding it in the card and joining it to the terminal part of the IC card, since multiple card bases are stacked and pressed, the connection pins of the integrated circuit may be crushed or the back surface of the IC card may be uneven. I got it. In order to avoid this, additional work such as providing a recess in a portion of the card base body corresponding to the connection pin or sandwiching the connection pin between the card base bodies is required.

In the case of joining the resin packaged integrated circuit and the terminal part of the IC card in this way, since the shape of the joint part, especially the periphery of the connection pin of the resin package integrated circuit, is complicated, it is embedded or mounted in the IC card base. It was difficult.

The present invention is concerned with problems in manufacturing such a module and problems in mounting on an IC card base, and mounting ICs.
It was made to solve the problem of strength of the module mounting part of the card, etc. It is possible to efficiently produce a highly reliable module and easily mount it on the IC card base. The purpose is to obtain an IC module with high practical reliability such as bending strength.

[Means for Solving the Problems]

The IC module according to the present invention is such that a resin-sealed semiconductor integrated circuit previously sealed with a resin is mounted on a terminal board having a connection terminal and is electrically connected to the connection terminal, and the connection is made by a molding resin. The IC module is formed by integrally molding the terminal substrate and the resin-sealed semiconductor integrated circuit so as to cover the portion, and the thickness of the outer peripheral portion of the IC module is made thinner than the central portion.

[Action]

In the present invention, the resin package integrated circuit, which has been completed as an integrated circuit and whose reliability has been confirmed, is mounted on the terminal board and molded, so that the molding resin does not come into direct contact with the IC chip. A high resin can be selected, and it is easy to complete a product with an appropriate shape as an IC module.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

That is, in FIGS. 1 and 2, 10 is a module. 11
Is an insulator 111 and a connection terminal 11 attached to the insulator 111.
A terminal board consisting of 2 is an IC chip previously resin-sealed with a mold resin such as an epoxy resin, and a resin-sealed with the resin portion fixed on the insulator 111 of the terminal board 11 with an adhesive material 13. A semiconductor integrated circuit, for example, a resin package integrated circuit 121 is an insulator 111 of a portion connected to the terminal board 11.
The connection pins of the resin package integrated circuit 12 soldered to the connection terminals 112 at the connection portions 122 through the opening portions 113 of the connection package 12, 14 at least the connection pins 121, and the connection portion 122 and the central portion 141 and continuous to this. It is a molding resin having a thin peripheral portion 142 formed by. The resin package integrated circuit 12 may be temporarily held without using the adhesive material 13.

In such a structure, the periphery of the resin package integrated circuit 12 is covered with the molding resin 14, and the peripheral portion of the module is covered.
A terminal board in which the resin package integrated circuit 12 is mounted on a mold having a cavity (not shown) capable of integrally forming 142.
11 is sandwiched and attached, and the connection pin 121 of the resin package integrated circuit 12, the joint 122, and the peripheral portion 142 of the module 10 are attached.
Molding resin 14, for example, thermoplastic resin liquid crystal polymer (Polyplastics, trade name "Vectra c-130"), which is a thermoplastic resin, is injected and integrated to produce a module 10 having a thinly spread portion at the terminal peripheral edge. To do. This thermotropic liquid crystal polymer is a resin with a large elastic modulus and a small coefficient of thermal expansion, which allows it to easily enter even in a narrow gap, and allows the resin to crystallize by running in a specific direction during injection. Since the structure is oriented, the strength of the peripheral portion of the module is greatly enhanced. In addition, molding with the molding resin 14 can be completed in about 20 seconds in one cycle when a thermoplastic resin is injection-molded, for example. The property is improved.

The shape of the module has a great influence on, for example, the bending strength of the card in which the module is mounted. For example, in the case of a card in which the module having a rectangular cross section as shown in FIG. 7 is mounted, the module is removed by repeated bending. Or, a practical problem as an IC card occurs such that a crack is generated from the module board boundary portion 25 of the card itself.

This is because there is a large difference between the modulus of elasticity of the module and the elastic modulus of the card base 81, and stress concentrates on those portions.
Card base 81 is hard vinyl chloride or equivalent and JIS-X
6303, etc., and in order to solve these problems, the thickness of the peripheral part of the module is thinned as in the module shown in this embodiment, and the stress is dispersed so that external force such as bending of the IC card The durability against can be dramatically improved.

Further, even in the case of a module having a shape as in this embodiment, when the conventional circuit board 2 is formed outside the sealing resin 6 as shown in FIG. Is the board boundary where the thickness of the terminal board extended due to the bending of the card and the terminal board suddenly changes.
25 is peeled off so as to be torn, and damages an internal circuit portion, for example, the joint portion 51.

In this embodiment, since such a portion is integrally and continuously molded by the molding resin 14, and is molded in a preferred shape with a resin having a strong alignment property such as a liquid crystal polymer, It is possible to obtain a card with high reliability against external force.

3 and 4 are side sectional views showing other embodiments of the present invention. The module 10 shown in Fig. 3 is
The resin package integrated circuit 12 is completely embedded by the molding resin 14. FIG. 4 shows that the terminal board 11 having the through holes 114 is a double-sided board and the module 10
A flange 143 projecting in a ring shape is provided on the peripheral edge portion 142 of the module to strengthen the bond between the module 10 and the card base 81 when adhered to a card. Both are examples of molding with the molding resin 14, similar to that shown in FIG.

In the module thus constructed, a thin resin package integrated circuit 12 which is mass-produced in a standard shape and whose reliability is established is used. Therefore, unlike the conventional module that uses the IC chip as it is, it is not necessary to manufacture it in a clean room or the like, so that the production efficiency is improved and the manufacturing cost is reduced.

Further, the resin package integrated circuit 12 is mounted on a separately prepared substrate, and the electrically connecting portions thereof are integrally molded so as to efficiently obtain a predetermined shape. Moreover, when the module is attached to the card, it is accurately shaped and has good reproducibility so as to disperse stress such as bending of the card.
And since the part where the cross-sectional shape of the module changes suddenly is also integrated, when the module is mounted on the IC card base, not only can the module and the IC card base be mated smoothly, The card itself is also highly reliable against external forces such as bending.

Furthermore, there is no need to perform additional work to prevent the contact pins from being crushed or the IC card to have unevenness, as in the case of directly embedding a resin packaged integrated circuit in an IC card.
It can be easily attached to an IC card.

In the above-mentioned examples, the thermotropic liquid crystal polymer which is a thermoplastic resin is used as the molding resin 14,
The same effect can be obtained by using other thermoplastic resins such as glass fiber reinforced polycarbonate and ABS resin.

〔The invention's effect〕

As described above, the IC module according to the present invention is provided with a resin-encapsulated semiconductor integrated circuit previously sealed with a resin on a terminal board having a connection terminal and electrically connected to the connection terminal. Also, the IC module is formed by integrally molding the resin-sealed semiconductor integrated circuit, and the outer peripheral part of this IC module is made thinner than the central part, which is resistant to external forces such as bending without impairing the reliability of the integrated circuit. Shaped modules can be manufactured.

[Brief description of drawings]

1 and 2 are views showing an embodiment of the present invention.
FIG. 1 is a side sectional view, FIG. 2 is a partially broken plan view, FIGS. 3 and 4 are side sectional views showing other embodiments of the present invention, and FIGS. FIG. 7 and FIG. 8 are side sectional views of an IC card, showing a conventional IC module of this type. In the figure, 10 is an IC module, 11 is a circuit board, 112 is a connection terminal, 12 is a resin package integrated circuit, 13 is an adhesive, and 14 is a molding resin. The same reference numerals in the drawings indicate the same or corresponding parts.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP 58-125892 (JP, A) JP 59-170982 (JP, A) JP 62-27195 (JP, A) JP 62- 202796 (JP, A)

Claims (1)

[Claims] 1. A terminal board having a connection terminal, a resin-sealed semiconductor integrated circuit provided on the terminal board and electrically connected to the connection terminal, and electrical connection between the connection terminal and the resin-sealed semiconductor integrated circuit. An IC module including a molding resin that integrally molds the terminal board and the resin-sealed semiconductor circuit so as to cover the physical connection portion so as not to be exposed, and has a peripheral portion thinner than a central portion.