JP5715411B2 - めっき液中から不純物を除去する方法 - Google Patents
めっき液中から不純物を除去する方法 Download PDFInfo
- Publication number
- JP5715411B2 JP5715411B2 JP2010292150A JP2010292150A JP5715411B2 JP 5715411 B2 JP5715411 B2 JP 5715411B2 JP 2010292150 A JP2010292150 A JP 2010292150A JP 2010292150 A JP2010292150 A JP 2010292150A JP 5715411 B2 JP5715411 B2 JP 5715411B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plating solution
- benzenesulfonic acid
- copper
- electroless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007747 plating Methods 0.000 title claims description 284
- 238000000034 method Methods 0.000 title claims description 82
- 239000012535 impurity Substances 0.000 title claims description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 90
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 85
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 claims description 65
- 229940092714 benzenesulfonic acid Drugs 0.000 claims description 65
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 57
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 53
- 229910052802 copper Inorganic materials 0.000 claims description 52
- 239000010949 copper Substances 0.000 claims description 52
- 239000002244 precipitate Substances 0.000 claims description 39
- 239000007788 liquid Substances 0.000 claims description 29
- 150000003839 salts Chemical class 0.000 claims description 26
- -1 thiourea compound Chemical class 0.000 claims description 25
- MVIOINXPSFUJEN-UHFFFAOYSA-N benzenesulfonic acid;hydrate Chemical compound O.OS(=O)(=O)C1=CC=CC=C1 MVIOINXPSFUJEN-UHFFFAOYSA-N 0.000 claims description 24
- 238000001556 precipitation Methods 0.000 claims description 24
- 238000007772 electroless plating Methods 0.000 claims description 22
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 17
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 16
- 229910001431 copper ion Inorganic materials 0.000 claims description 16
- 238000000926 separation method Methods 0.000 claims description 14
- 230000001172 regenerating effect Effects 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 description 70
- 230000007423 decrease Effects 0.000 description 10
- 238000006467 substitution reaction Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- LROWILPKXRHMNL-UHFFFAOYSA-N copper;thiourea Chemical compound [Cu].NC(N)=S LROWILPKXRHMNL-UHFFFAOYSA-N 0.000 description 6
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 150000003585 thioureas Chemical class 0.000 description 4
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 3
- 239000008139 complexing agent Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000007726 management method Methods 0.000 description 3
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 238000005119 centrifugation Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229940098779 methanesulfonic acid Drugs 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 230000008929 regeneration Effects 0.000 description 2
- 238000011069 regeneration method Methods 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- JAEZSIYNWDWMMN-UHFFFAOYSA-N 1,1,3-trimethylthiourea Chemical compound CNC(=S)N(C)C JAEZSIYNWDWMMN-UHFFFAOYSA-N 0.000 description 1
- JLLFFHVWBDFRIZ-UHFFFAOYSA-N 1,1-di(propan-2-yl)thiourea Chemical compound CC(C)N(C(C)C)C(N)=S JLLFFHVWBDFRIZ-UHFFFAOYSA-N 0.000 description 1
- SCHUEKCWLASERH-UHFFFAOYSA-N 1,3-bis(3-hydroxypropyl)thiourea Chemical compound OCCCNC(=S)NCCCO SCHUEKCWLASERH-UHFFFAOYSA-N 0.000 description 1
- ATFGELNRYVQGAY-UHFFFAOYSA-N 1-(3-hydroxypropyl)-3-methylthiourea Chemical compound CNC(=S)NCCCO ATFGELNRYVQGAY-UHFFFAOYSA-N 0.000 description 1
- LTNCVBJIALHSKL-UHFFFAOYSA-N 1-(3-methoxypropyl)-3-methylthiourea Chemical compound CNC(=S)NCCCOC LTNCVBJIALHSKL-UHFFFAOYSA-N 0.000 description 1
- GCZZOZBWAZHCAN-UHFFFAOYSA-N 1-phenyl-3-(1,3-thiazol-2-yl)thiourea Chemical compound C=1C=CC=CC=1NC(=S)NC1=NC=CS1 GCZZOZBWAZHCAN-UHFFFAOYSA-N 0.000 description 1
- DFCALCCOFVSDET-UHFFFAOYSA-N 3-hydroxypropylthiourea Chemical compound NC(=S)NCCCO DFCALCCOFVSDET-UHFFFAOYSA-N 0.000 description 1
- VLCDUOXHFNUCKK-UHFFFAOYSA-N N,N'-Dimethylthiourea Chemical compound CNC(=S)NC VLCDUOXHFNUCKK-UHFFFAOYSA-N 0.000 description 1
- FLVIGYVXZHLUHP-UHFFFAOYSA-N N,N'-diethylthiourea Chemical compound CCNC(=S)NCC FLVIGYVXZHLUHP-UHFFFAOYSA-N 0.000 description 1
- KQJQICVXLJTWQD-UHFFFAOYSA-N N-Methylthiourea Chemical compound CNC(N)=S KQJQICVXLJTWQD-UHFFFAOYSA-N 0.000 description 1
- IPCRBOOJBPETMF-UHFFFAOYSA-N N-acetylthiourea Chemical compound CC(=O)NC(N)=S IPCRBOOJBPETMF-UHFFFAOYSA-N 0.000 description 1
- 241000047703 Nonion Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- HTKFORQRBXIQHD-UHFFFAOYSA-N allylthiourea Chemical compound NC(=S)NCC=C HTKFORQRBXIQHD-UHFFFAOYSA-N 0.000 description 1
- 229960001748 allylthiourea Drugs 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 239000003011 anion exchange membrane Substances 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000003287 bathing Methods 0.000 description 1
- QWICHYWTBZTTRD-UHFFFAOYSA-N benzenesulfonic acid;dihydrate Chemical compound O.O.OS(=O)(=O)C1=CC=CC=C1 QWICHYWTBZTTRD-UHFFFAOYSA-N 0.000 description 1
- WJAASTDRAAMYNK-UHFFFAOYSA-N benzyl carbamimidothioate;hydron;chloride Chemical compound Cl.NC(=N)SCC1=CC=CC=C1 WJAASTDRAAMYNK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- JHXKRIRFYBPWGE-UHFFFAOYSA-K bismuth chloride Chemical compound Cl[Bi](Cl)Cl JHXKRIRFYBPWGE-UHFFFAOYSA-K 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 238000005341 cation exchange Methods 0.000 description 1
- 239000003010 cation ion exchange membrane Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229940044175 cobalt sulfate Drugs 0.000 description 1
- 229910000361 cobalt sulfate Inorganic materials 0.000 description 1
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229940046892 lead acetate Drugs 0.000 description 1
- HWSZZLVAJGOAAY-UHFFFAOYSA-L lead(II) chloride Chemical compound Cl[Pb]Cl HWSZZLVAJGOAAY-UHFFFAOYSA-L 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- AICMYQIGFPHNCY-UHFFFAOYSA-J methanesulfonate;tin(4+) Chemical compound [Sn+4].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O AICMYQIGFPHNCY-UHFFFAOYSA-J 0.000 description 1
- DQMWMUMCNOJLSI-UHFFFAOYSA-N n-carbamothioylbenzamide Chemical compound NC(=S)NC(=O)C1=CC=CC=C1 DQMWMUMCNOJLSI-UHFFFAOYSA-N 0.000 description 1
- 238000006864 oxidative decomposition reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- 239000012488 sample solution Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
以下の組成の無電解スズめっき液(基本浴1)を調製した。
ホウフッ化スズ (Sn2+として) 30g/L
メタンスルホン酸 50g/L
次亜リン酸 15g/L
チオ尿素 100g/L
ノニオン系界面活性剤 30g/L
上記基本浴1にベンゼンスルホン酸を60g/L添加した以外は実施例1と同様の操作を行い、銅濃度を測定した。測定した銅濃度は6.6g/Lであった。
上記基本浴1に対し、ベンゼンスルホン酸を加えない(比較例1)か、表1に記載の化合物を30g/L加えたもの(比較例2〜5)について、実施例1と同様の操作を行った。結果を表1に示す。なお、比較例1〜5はいずれも沈殿が析出しなかったため、銅濃度測定は比較例1のみ行った。
めっき浴の組成を実施例1から変更し、以下の組成の無電解スズめっき液(基本浴2)を作製した。
メタンスルホン酸スズ (Sn2+として) 30g/L
メタンスルホン酸 50g/L
次亜リン酸 15g/L
チオ尿素 100g/L
ノニオン系界面活性剤 30g/L
ベンゼンスルホン酸を添加し不純物を除去した後のめっき液の性能確認試験を行った。めっき浴として、実施例1で使用した基本浴1を準備した。
Claims (6)
- チオ尿素又はチオ尿素化合物を含有する無電解スズめっき液を用いて銅又は銅合金に無電解スズめっきを行った後、前記無電解スズめっき液に、ベンゼンスルホン酸もしくはベンゼンスルホン酸水和物又はこれらの塩を添加して析出物を生成させることにより、無電解スズめっき液中から不純物を除去する方法。
- チオ尿素又はチオ尿素化合物を含有する無電解スズめっき液を用いて銅又は銅合金に無電解スズめっきを行った後、前記無電解スズめっき液にベンゼンスルホン酸もしくはベンゼンスルホン酸水和物又はこれらの塩を添加し、生成する析出物を除去する、めっき液の再生方法。
- チオ尿素又はチオ尿素化合物を含むスズめっき液を用いて銅又は銅合金に無電解スズめっき皮膜を形成する方法であって、前記無電解スズめっきを行うめっき槽からめっき液の一部又は全部を固液分離装置を経由して前記めっき槽に循環させるとともに、無電解スズめっきを行っためっき液にベンゼンスルホン酸もしくはベンゼンスルホン酸水和物又はこれらの塩を添加し、生成する析出物を前記固液分離装置により捕捉除去する、めっき皮膜の形成方法。
- 無電解めっきを行う本槽、析出物を形成する析出槽、本槽と析出槽との間を無電解めっき液が循環可能となるように接続する循環配管、及び析出槽から本槽への間に設置される固液分離装置を有する複槽型めっき装置を用い、チオ尿素又はチオ尿素化合物を含有するスズめっき液を用いて銅又は銅合金を表面に有する被めっき物に無電解めっきを行う方法であって、前記析出槽中の無電解スズめっきを行っためっき液にベンゼンスルホン酸もしくはベンゼンスルホン酸水和物又はこれらの塩を添加する工程、及び生成する析出物を前記固液分離装置を用いて捕捉する工程を有する、めっき方法。
- めっき液を貯留し無電解めっきを行うめっき槽、めっき液の一部又は全部を循環可能となるように前記めっき槽に接続する循環配管及びめっき液の循環経路に設置される固液分離装置を有する単槽型めっき装置を用い、チオ尿素又はチオ尿素化合物を含有するスズめっき液を用いて銅又は銅合金を表面に有する被めっき物に無電解めっきを行う方法であって、被めっき物を前記めっき槽中のめっき液に浸漬する工程、無電解スズめっきを行っためっき液にベンゼンスルホン酸もしくはベンゼンスルホン酸水和物又はこれらの塩を添加する工程、生成する析出物を前記固液分離装置を用いてめっき液から除去する工程を有する、めっき方法。
- チオ尿素又はチオ尿素化合物を含有する銅又は銅合金用の無電解スズめっき液の管理方法であって、前記無電解スズめっき液を用いて銅又は銅合金に無電解めっきを行った後、前記めっき液にベンゼンスルホン酸もしくはベンゼンスルホン酸水和物又はこれらの塩を添加し、析出物を生成させることによりめっき液中の銅イオン濃度を減少させる、めっき液の管理方法。
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010292150A JP5715411B2 (ja) | 2010-12-28 | 2010-12-28 | めっき液中から不純物を除去する方法 |
| EP11195167.9A EP2471977B1 (en) | 2010-12-28 | 2011-12-22 | Method for removing impurities from plating solution |
| CN201110463300.XA CN102560570B (zh) | 2010-12-28 | 2011-12-28 | 从镀液中去除杂质的方法 |
| US13/338,483 US20120164341A1 (en) | 2010-12-28 | 2011-12-28 | Method for removing impurities from plating solutions |
| KR1020110145049A KR101797517B1 (ko) | 2010-12-28 | 2011-12-28 | 도금액으로부터 불순물을 제거하는 방법 |
| TW100149133A TWI588291B (zh) | 2010-12-28 | 2011-12-28 | 從鍍覆溶液移除雜質之方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010292150A JP5715411B2 (ja) | 2010-12-28 | 2010-12-28 | めっき液中から不純物を除去する方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012140649A JP2012140649A (ja) | 2012-07-26 |
| JP5715411B2 true JP5715411B2 (ja) | 2015-05-07 |
Family
ID=45507355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010292150A Expired - Fee Related JP5715411B2 (ja) | 2010-12-28 | 2010-12-28 | めっき液中から不純物を除去する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20120164341A1 (ja) |
| EP (1) | EP2471977B1 (ja) |
| JP (1) | JP5715411B2 (ja) |
| KR (1) | KR101797517B1 (ja) |
| CN (1) | CN102560570B (ja) |
| TW (1) | TWI588291B (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9404194B2 (en) | 2010-12-01 | 2016-08-02 | Novellus Systems, Inc. | Electroplating apparatus and process for wafer level packaging |
| JP5830242B2 (ja) * | 2010-12-28 | 2015-12-09 | ローム・アンド・ハース電子材料株式会社 | めっき液中から不純物を除去する方法 |
| JP5937320B2 (ja) * | 2011-09-14 | 2016-06-22 | ローム・アンド・ハース電子材料株式会社 | めっき液中から不純物を除去する方法 |
| US9534308B2 (en) | 2012-06-05 | 2017-01-03 | Novellus Systems, Inc. | Protecting anodes from passivation in alloy plating systems |
| JP6569237B2 (ja) | 2014-03-06 | 2019-09-04 | 三菱マテリアル株式会社 | 酸化第一錫の製造方法、Snめっき液の製造方法 |
| US20190345624A1 (en) * | 2018-05-09 | 2019-11-14 | Applied Materials, Inc. | Systems and methods for removing contaminants in electroplating systems |
| CN109546191B (zh) * | 2018-11-07 | 2021-06-18 | 大连理工大学 | 一种混合基质型阴离子膜及其制备方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0830274B2 (ja) | 1991-03-01 | 1996-03-27 | 上村工業株式会社 | 無電解錫、鉛又はそれらの合金めっき浴中の銅イオン濃度の分析方法 |
| JP2525521B2 (ja) * | 1991-06-25 | 1996-08-21 | 日本リーロナール株式会社 | 無電解スズ―鉛合金めっき浴 |
| JPH0522540A (ja) | 1991-07-15 | 1993-01-29 | Murata Mach Ltd | メールボツクスを有したフアクシミリ装置 |
| CA2083196C (en) | 1991-11-27 | 1998-02-17 | Randal D. King | Process for extending the life of a displacement plating bath |
| JP3162243B2 (ja) * | 1994-03-28 | 2001-04-25 | 株式会社日立製作所 | 無電解めっき方法 |
| JP3030534B2 (ja) * | 1994-09-07 | 2000-04-10 | 日本マクダーミッド株式会社 | 錫系合金めっき浴の再生方法 |
| EP0848084B1 (en) * | 1996-06-05 | 2002-10-09 | Sumitomo Light Metal Industries, Ltd. | Internally tin-plated copper pipe manufacturing method |
| DE19719020A1 (de) | 1997-05-07 | 1998-11-12 | Km Europa Metal Ag | Verfahren und Vorrichtung zum Regenerieren von Verzinnungslösungen |
| DE19954613A1 (de) * | 1999-11-12 | 2001-05-17 | Enthone Omi Deutschland Gmbh | Verfahren zur stromlosen Verzinnung von Kupfer oder Kupferlegierungen |
| US6821323B1 (en) * | 1999-11-12 | 2004-11-23 | Enthone Inc. | Process for the non-galvanic tin plating of copper or copper alloys |
| GB0106131D0 (en) * | 2001-03-13 | 2001-05-02 | Macdermid Plc | Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |
| JP2002317275A (ja) | 2001-04-17 | 2002-10-31 | Toto Ltd | 無電解スズめっき液の長寿命化方法 |
| US6562221B2 (en) * | 2001-09-28 | 2003-05-13 | David Crotty | Process and composition for high speed plating of tin and tin alloys |
| TWI268292B (en) * | 2002-03-05 | 2006-12-11 | Shipley Co Llc | Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions |
| JP4016326B2 (ja) * | 2002-08-02 | 2007-12-05 | 石原薬品株式会社 | 無電解スズメッキ浴 |
| US20080149884A1 (en) * | 2006-12-21 | 2008-06-26 | Junaid Ahmed Siddiqui | Method and slurry for tuning low-k versus copper removal rates during chemical mechanical polishing |
| CN101624714B (zh) * | 2009-08-18 | 2010-12-29 | 杜强 | 含有机添加剂的铜锡锌镀液及利用该镀液进行电镀的工艺 |
| JP5830242B2 (ja) * | 2010-12-28 | 2015-12-09 | ローム・アンド・ハース電子材料株式会社 | めっき液中から不純物を除去する方法 |
-
2010
- 2010-12-28 JP JP2010292150A patent/JP5715411B2/ja not_active Expired - Fee Related
-
2011
- 2011-12-22 EP EP11195167.9A patent/EP2471977B1/en not_active Not-in-force
- 2011-12-28 US US13/338,483 patent/US20120164341A1/en not_active Abandoned
- 2011-12-28 CN CN201110463300.XA patent/CN102560570B/zh not_active Expired - Fee Related
- 2011-12-28 KR KR1020110145049A patent/KR101797517B1/ko not_active Expired - Fee Related
- 2011-12-28 TW TW100149133A patent/TWI588291B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI588291B (zh) | 2017-06-21 |
| EP2471977A3 (en) | 2012-08-08 |
| US20120164341A1 (en) | 2012-06-28 |
| EP2471977A2 (en) | 2012-07-04 |
| TW201243103A (en) | 2012-11-01 |
| CN102560570A (zh) | 2012-07-11 |
| KR20120075438A (ko) | 2012-07-06 |
| JP2012140649A (ja) | 2012-07-26 |
| CN102560570B (zh) | 2016-05-04 |
| EP2471977B1 (en) | 2017-01-25 |
| KR101797517B1 (ko) | 2017-11-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5715411B2 (ja) | めっき液中から不純物を除去する方法 | |
| JP5830242B2 (ja) | めっき液中から不純物を除去する方法 | |
| TWI728217B (zh) | 錫電鍍浴液及於基板之表面上沉積錫或錫合金之方法 | |
| TWI570269B (zh) | 具有改良之銅離子移除的沈浸式錫或錫合金鍍浴 | |
| TW562880B (en) | Electrolytic copper plating method, phosphorous copper anode for electrolytic copper plating method, and semiconductor wafer having low particle adhesion plated with said method and anode | |
| TWI577836B (zh) | High purity tin manufacturing methods, high purity tin electrolytic refining devices and high purity tin | |
| US8801844B2 (en) | Autocatalytic plating bath composition for deposition of tin and tin alloys | |
| JP5937320B2 (ja) | めっき液中から不純物を除去する方法 | |
| JP5247142B2 (ja) | 銀めっき方法 | |
| US20140083322A1 (en) | Method of removing impurities from plating liquid | |
| WO2022080191A1 (ja) | 錫又は錫合金めっき液及びそのめっき液を用いたバンプの形成方法 | |
| JP7282136B2 (ja) | パラジウムめっき液及びパラジウムめっき補充液 | |
| KR20240122442A (ko) | 기판으로부터 금속 침착물을 전해 제거하기 위한 수성 스트리핑 조성물 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20131226 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140616 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140829 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141017 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150305 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150313 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5715411 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |