JP5408720B2 - Method for connecting antenna to transponder chip and corresponding inlay substrate - Google Patents

Description

  The present invention relates to a method and apparatus for making a radio frequency (RF) inlay and the resulting inlay, and more particularly to a method and apparatus for making a high frequency RF device that includes an integrated circuit and an antenna attached to a substrate material. .

  An RF inlay is generally understood to be an integrated circuit and an antenna joined together on some type of substrate. Usually, this inlay is further processed to produce the final product. Further processing can include adding an additional outer layer of material such as plastic to make a card-like device. Other finishing techniques can form the inlay into various final forms, depending on the final application of the product.

  Typically, this integrated circuit is inductively coupled to one or more interrogating devices or readers via an antenna by radio frequency communication. This integrated circuit or chip contains information useful for performing various tasks. One type of information is identification information about the owner or user of the RF device. In this case, the RF device may also be referred to as a radio frequency identification (RFID) device. Not all RF devices contain information about user identity, and some RF devices contain information in addition to user identity.

  Completed RF inlays are used in a variety of applications. For example, RF inlays have been used to create security access devices (RFID devices) or can be used for other applications. Other applications may or may not be related to user identification, access to computers or computer networks and databases, public transit commuter pass, toll road pass Including, but not limited to, vending machine payment devices, and bank debit and / or credit cards, and passports. Given the variety of RF devices and expanding end-user applications, RF devices are sometimes referred to as “smart cards”. Some identification applications, such as passports, currently use RFID inlays or RFID prelams (transponders subjected to stacking) to store identification data and efficiently and quickly store the identification data. Can be forwarded and processed by appropriate government agencies. The identification data may include biometric data such as fingerprints and / or photographs of passport holders and information identifying the holder.

  There are various methods for manufacturing RF inlays. In some methods, a substrate composed of one or more layers is processed in various steps including hot and / or cold lamination. Chip and antenna subassemblies are incorporated into one or more layers, which are joined together by an adhesive or by softening a plastic layer, and these layers are joined together by pressure. In other methods, wires are attached or embedded in the substrate in the form of an antenna, and both ends of the antenna coil are attached to the terminals of an integrated circuit (IC or chip) or to the terminal area of a chip module. A chip module, when using this terminology herein, includes an integrated circuit attached to a lead frame having an enlarged terminal area. The terminal area of the chip is connected to the enlarged terminal area of the lead frame by a very fine and precise wire having a diameter of about 20 to 28 microns or via a conductive adhesive in the case of a flip chip. The electrical connection to the chip and the terminal area of the lead frame is protected within the epoxy layer. The combination or subassembly of the chip / chip module and the wire coil that forms the antenna is sometimes referred to as a transponder. The wires forming the antenna can be fully or partially embedded in the substrate using ultrasonic wire embedding techniques, as will be appreciated by those skilled in the art. The chip / chip module can be fixed to the substrate by placing it on the surface of the substrate or by placing it in a recess formed in the substrate. An adhesive may or may not be used to bond the chip / chip module to the substrate. The end of the wire coil can be glued or connected to the terminal area of the chip or chip module almost simultaneously with the wire being embedded in the substrate, or can be glued in a separate or subsequent manufacturing step. .

  Nominally, the diameter of the wire used in the manufacture of the RF inlay is 110-120 microns, including the outer insulating layer, when the wire is ultrasonically embedded in the substrate. Since the windings of the wires forming the antenna are closely positioned and can come into contact, the wires are insulated to prevent shorting of the antenna. The insulating layer is typically made from polyurethane, polyvinyl butyral, polyamide, polyesterimide, and similar compounds. A thicker or larger diameter wire is easier to handle than a thinner or smaller diameter wire and usually provides a wider read range when inductively coupled to a reader. Larger diameter wires are also more rugged and easier to remove from the RF device without compromising wire integrity or transponder operation and function. The ability to remove and reuse a transponder has several security and confidentiality issues. For example, if a legitimate transponder subassembly (chip / chip module and antenna) can be removed from one passport and placed in another unauthorized passport, serious security issues arise.

  There are a number of patents disclosing various devices and methods for the manufacture of RF devices, including the manufacture of inlays. For example, US Pat. Nos. 6,698,089 and 6,233,818 disclose a method of making an RF device in which at least one chip and one antenna are attached to a chip mounting board or substrate. . The wire forming the antenna is embedded in the substrate using an ultrasonic generator. As part of the wire embedding process disclosed in each of these patents, an insulated antenna wire is first secured to a substrate. The insulated wire is then routed directly above the terminal area of the RFID chip and away from this terminal area, embedded in the substrate on the opposite side of the chip from the first embedding location, The wire is aligned linearly across the terminal area between the two fixed positions. Next, an antenna is formed by embedding an insulated wire in the substrate at a position spaced from the chip and terminal regions. This antenna is formed of a specific number of turns of wire. The antenna wire is then routed over the other terminal area of the RFID chip and finally embedded on the opposite side, with the second end of the wire extending straight across the other terminal area of the chip. Fix it. The wire is then cut and the embedding head (or embedding tool) moves to the location of the second transponder on the substrate and repeats the same process. In the next production stage, the wire portions that pass directly above the terminal area of the RFID chip are connected to the terminal area by thermocompression bonding. Alternatively, the wire can be embedded as described above, and the chip is then positioned in a predesignated recess. In this recess, the terminal of the chip comes into contact with the previously fixed wire. The end of the wire is then bonded to the terminal area of the chip by thermocompression. U.S. Pat. No. 6,088,230 discloses that a first end of a wire is positioned in contact with and bonded to a first terminal area of a chip or chip module, and then embedded. Describes an alternative process in which the wire is embedded in a substrate to form an antenna and then the wire is positioned over the second terminal area of the chip or chip module where the wire is bonded to this terminal area. ing.

  The invention disclosed in these references may be suitable for the intended purpose, but nevertheless includes, but is not limited to, contactless smart cards and other security access devices. There is a need for improved methods of making RF inlays for various applications.

  With regard to improving security for information stored on integrated circuits incorporated within the transponder, it is desirable to improve fraud prevention. For example, it may be desirable to use an electronic passport device to prevent the removal of the transponder from a valid passport and thus prevent the removed transponder from being used with a second unauthorized passport. In this regard, the present invention can utilize a wire having a small diameter, for example, a wire having a diameter of 60 microns or less. The use of thinner wires increases the likelihood that the antenna and / or its connection to the chip or chip module will be destroyed when attempting to remove, so the chip and antenna assembly from an existing product such as a passport The ability to successfully remove is substantially reduced. However, utilizing thinner wires also places more emphasis on the adhesion between the wires and the chip terminals. When using thinner wires, defects or defects in the bonding process can lead to brittle and / or incomplete bonding.

  There is also a need to provide RF and RFID devices with increased lifetime and durability. One factor that limits the useful life of such devices is the quality of the electrical connection between the antenna wire and the chip. Improving the structural stability of the electrical connection or adhesion will inevitably extend the lifetime of the transponder.

  In this regard, another problem is that undesirable oxidation can occur over time due to impurities at the bond sites. For example, an insulating material on the wire, or a by-product of the insulating material that is generated as part of the process of bonding the insulated wire to the chip or leadframe terminal area, can form impurities at the bond site. . More specifically, as described above, the wires used to form the antenna often include an outer insulator or coating. During a typical manufacturing process, antenna wires are bonded to terminal areas or bonding pads by high energy thermocompression techniques. This technique involves applying a high voltage arc through a thermal bonding head, thereby removing the insulator and at the same time creating a local weld that electrically connects the wire to the designated terminal. If all of the insulation is not removed from the wire, the remaining insulation can reduce the quality of the electrical bond and thus the quality of the electrical connection. Furthermore, the by-product of the insulating material formed from the high temperature bonding process may be taken into the bonded portion and may gradually cause oxidation or deterioration of the bonded portion. Current wire-embedding techniques accurately and locally remove the insulator because the embedded wire and terminal area are close enough to damage the chip or chip module during the process I can't do it. In fact, as mentioned above, prior art techniques place the wire directly over the terminal area of the chip as part of the wire embedding process. Furthermore, in order to achieve both the removal of the insulator and the bonding of the wire to the terminal area, a higher voltage needs to be used in the thermal bonding process than when the wire is insulated. As a result, the thermal bonding head must be replaced more frequently, thereby increasing manufacturing costs, including reduced production capacity during head replacement. Furthermore, even if the insulator is completely removed, by-products or residues such as hydrocyanic acid or other compounds may remain at the bond site. It is believed that one or more of these residues can oxidize gradually, thereby further degrading the quality of the bond and potentially reducing the lifetime of the transponder.

  Accordingly, one object of the present invention is to provide a method and apparatus for manufacturing RF and RFID inlays that can prevent fraud by using antenna wires that are relatively thin. Making the antenna wire with the smallest dimensions makes it more difficult to remove the antenna, as the wire is more likely to break or be damaged during the removal attempt.

  Yet another object of the present invention is to extend the life of RF and RFID devices and improve the quality of electrical bonding between antenna and chip bonding pads by removing the insulator from the wire prior to bonding. This also improves the use of thinner antenna wires.

  Yet another object of the present invention is to produce inlays using well known production equipment, thereby ensuring that the inlays of the present invention are also incorporated into existing automated manufacturing processes. To provide a method and apparatus for producing an RF or RFID inlay.

  In accordance with the present invention, a method and apparatus for manufacturing an RF inlay or similar device is provided. In one embodiment of the present invention, a method for manufacturing an inlay can be considered. In another aspect of the invention, it can be considered an apparatus or manufacturing equipment used to make an inlay. In yet another aspect of the invention, it can be considered an apparatus for making an RF inlay that includes various sub-combinations, i.e., various apparatus components for producing an RF inlay. In a further aspect, the present invention can be thought of as the resulting inlay device produced by the method or apparatus.

  According to an apparatus for making an inlay, an antenna wire is partially or fully embedded in a substrate using one or more wire embedding heads, also called sonotrodes. The embedded head can form the wire in virtually any pattern, including forming the antenna windings. The substrate can accommodate one or more antennas. A single antenna may correspond to a single inlay, or two or more antennas may be positioned in close proximity to each other and correspond to a single inlay. In the latter case, the multiple antennas can be connected to a common chip / chip module or to different chips / chip modules and function independently. If multiple embedded heads are utilized, the embedded heads can move together or independently. Once the embedding of the wire at each transponder location is complete, the wire is cut and one or more embedding heads move to the next location, or the substrate moves relative to the one or more embedding heads, Position the new transponder location close to the head. Typically, the chip or chip module is placed on the substrate or in a recess formed in the substrate before the wire is embedded in the substrate. However, according to the present invention, the chip or the chip module can be arranged at a fixed position after the wire embedding process or during the wire embedding process.

  The present invention provides an alternative method of embedding wires into a substrate, as described in the prior art patents identified above and other well known prior art. Embed a wire on one side of the terminal area of the RFID chip or chip module, guide the wire directly above the terminal area, then embed this insulated wire in the substrate opposite the terminal area to form an antenna and then insulate Rather than positioning the resulting wire directly over the second terminal area of the RFID chip and embedding this wire again, the embedding and gluing process is such that the wire is adjacent to the terminal area of the chip or chip module and It is proposed to start with a lateral displacement from the area and that the wire does not pass over the terminal area. Conversely, the two end portions of the wire forming the antenna are not embedded in the substrate, and the wire is embedded in the substrate to form the antenna. These two end portions are positioned adjacent to the terminal areas of the chip or chip module and offset laterally from these terminal areas. In one embodiment, the entire length of each of these end portions of the wire is not secured to the substrate. In the second step, after the antenna is formed, the end portion of the wire is moved to a position above or in contact with the terminal area of the chip or chip module. Until the antenna is fully formed, the wire ends do not come into contact with the terminal area, and no bonding takes place until the antenna is fully formed.

  In a second embodiment of the invention, a first length of wire is embedded in the substrate and the first portion of the first length of wire extends out of the substrate. The first length of wire is positioned adjacent to and laterally offset from the terminal area of the chip or chip module. The next continuous length of wire is not embedded in the substrate but is placed on the substrate. The next length of wire is embedded in the substrate to form the antenna. The next consecutive length is then positioned along the substrate but not embedded. Finally, a length of wire is embedded in the substrate and the last portion of the length of wire extends out of the substrate. The last two lengths of wires are positioned adjacent to and laterally offset from the terminal areas of the chip or chip module. These lengths of wire offset laterally from the terminal area are then positioned so that a portion of these lengths of wire is on or in contact with the terminal area of the chip or chip module. Are rearranged to These lengths of wire do not contact the terminal area until the antenna is fully formed.

  In a third embodiment, the first end of the wire is attached to or embedded in the substrate by a relatively short distance of about 0.5-1.0 centimeters. This length can vary. The ultrasonic transducer is then preferably turned off and the implantation head is lifted a distance from the surface of the substrate. Since the previous length of wire is secured to the substrate, when the implantation head is lifted, an additional or second length of wire is pulled from the wire supply. The embedding head is then moved parallel to the plane of the substrate, so that more wires are drawn from the wire supply. The head is then lowered to a position proximate the substrate, the ultrasonic transducer is turned on, and an additional length of wire is embedded in the substrate. As a result of turning off the ultrasonic transducer and continuously moving the implantation head, a portion of the wire is not fixed to the substrate or embedded in the substrate, but a loop of wire extending above the plane of the substrate or Form a bridge. This wire loop is formed at a position shifted laterally from the terminal region of the chip or chip module. The term lateral displacement is defined by the plane of the substrate. The wire loop is preferably formed perpendicular to the plane of the substrate, but this is not a requirement of the present invention. The process of securing the wire to the substrate or embedding the wire in the substrate continues such that the antenna is formed on or in the substrate, and then the second wire loop or bridge is located at the second position on the substrate. It is formed in the same way. This second position is usually on the opposite side of the chip or chip module from the first wire loop, but this is not necessarily so. In the process of forming two wire loops, these loops are formed in a position offset or spaced from the terminal area and the chip, so any part of the loop is on the chip or part of the terminal area, or It is not positioned in contact with the chip or terminal area.

  In the next processing step, a portion of the insulating material that encapsulates the antenna wire along a portion of the wire loop is removed. More specifically, in the fourth embodiment, a laser is used to remove the insulator from the wire along the discontinuous length of the loop portion of the wire. The location where the insulator is removed from the loop is the region that will be in electrical contact with and bonded to the terminal region. As described above, the loop is offset or spaced from the terminal area so that the loop is not positioned directly above or in contact with the terminal area of the chip or chip module. Positioning in this way allows the laser to be focused on the wire loop and remove discontinuous portions of the insulator from the loop without hitting or damaging the terminal area or chip itself. If the wire loop is positioned directly above, in contact with, or even very close to the terminal area of the chip or chip module, the laser will damage the terminal area. Thus, the ability to bond the wire to the terminal area may be impaired, or a poor quality bond may be formed, or the chip itself may be directly damaged.

  In the next processing step, the apparatus includes a wire transfer tool that is used to move the loop to a position that can then be glued to the designated terminal area. In a preferred embodiment of the present invention, a pair of clamping or fork-like elements is used to engage the loop of wire as well as to move and deform the loop so that the terminal area of the chip or chip module Or just above and / or in contact with the areas or areas where the terminal area will eventually be positioned so that the center of at least some portion of the wire loop is positioned. In another preferred embodiment, instead of a fork-like element for moving or engaging the loop, other means are provided such as by using a brush or comb-like device to contact the loop with the terminal area. Can be positioned. Rather than forming a loop, a length of wire placed adjacent to the terminal area is simply a length of wire located on the substrate, for example, fixed to the substrate or embedded in the substrate. May be a non-length wire and then moved over the terminal area by a fork-like element or other means including but not limited to a brush, comb, or even manual. Is intended. One end of each length of wire is not attached to the substrate, so that each length of wire can simply be moved to a position where it contacts the corresponding terminal area to which the wire is to be attached.

  In a further processing step according to the method and apparatus of the present invention, an adhesive element is provided that electrically connects a length of wire or wire loop positioned over or in contact with the terminal area to the designated terminal area. The Adhesion is not performed until the antenna is completely formed.

  It should be understood that all these processing steps may be performed at a single location or at multiple locations. For example, a single head element may include an ultrasonic embedding tool, a tool that repositions a length of wire over or in contact with the terminal area, a laser, and an adhesive tool. it can. Alternatively, these tools may be positioned on two or more separate heads, or each may be positioned on a separate tool head. Furthermore, the substrate can be moved to different positions while the tool is stationary for some or all of these processing steps.

  Various other features and advantages will become apparent from the following detailed description when considered in conjunction with the drawings.

1 is a partial perspective view of a processing machine used to manufacture an RF and / or RFID inlay. FIG. In particular, it is an enlarged plan view of a portion of an RF or RFID inlay showing the chip module positioned on the substrate and the placement of both ends of the antenna coil adjacent to the chip module. It is another enlarged plan view which shows the both ends of the antenna coil fixed to the terminal area | region of the chip module. FIG. 3 is an enlarged partial perspective view of the inlay of FIG. 2 showing the chip module and the antenna coil including both ends of the antenna coil configured in a loop shape before attaching the end to the terminal region. FIG. 4 is an enlarged partial perspective view of FIG. 3 showing an inlay in which part of both ends of the antenna coil is fixed to a terminal area of the chip module. FIG. 2 shows working components of a processing machine for the manufacture of RF and / or RFID inlays, in particular (i) an embedded tool for securing an antenna coil to a substrate, and (ii) a laser for removing insulation from insulated wires (Iii) It is the schematic which shows the wire movement tool which moves an antenna wire loop before adhesion | attachment to a terminal area | region. and It is the schematic of the embedding tool which shows the order by which the both ends of an antenna coil are arrange | positioned adjacent to a chip module. FIG. 5 is another schematic diagram illustrating another processing step for the manufacture of RF and / or RFID inlays that use a laser to remove insulating material from the insulated wires that form the antenna coil. FIG. 5 is a greatly enlarged elevation view showing a laser with insulating material removed from a specified position on an insulated wire. It is a top view which shows the position of the laser beam which removes an insulating material, and the direction of the laser separated so that a chip module may not be damaged. It is a fragmentary perspective view of the wire movement tool before engaging a wire loop. FIG. 13 is an enlarged end view taken along line 13-13 of FIG. 12 showing one of the clamping assemblies and their orientation relative to one of the wire loops to be engaged. FIG. 5 is an elevational view of a wire transfer tool with the tool lowered and the bottom surface of the clamping assembly placed in contact with the top surface of the substrate. FIG. 15 is an enlarged end view similar to FIG. 13 but showing the clamping assembly in the lowered position of FIG. 14 and showing the back or opposite side of the clamping assembly. FIG. 10 is a perspective view of the wire moving tool after the wire loop is engaged and moved by movement of the clamping assembly. FIG. 17 is an elevation view of the wire moving tool at the position of the tool shown in FIG. 16. FIG. 6 is a perspective view showing the clamping assembly disconnected from the wire loop after moving the loop. Schematic of the thermal bonding head that produces a thermocompression bond between the antenna wire and the terminal area of the chip or chip module, and the resulting electrical connection between the exposed conductor on the wire portion and the respective terminal area. is there. 1 is a schematic view of an implantation tool, such as a sonotrode, with a length of remaining wire extending from the end of a capillary already cut following completion of wire placement within an RF device. FIG. FIG. 21 is a schematic view of an embedded tool in a raised position with an additional length of wire being dispensed from the tool compared to that of FIG. Another RF or RFID where the ends of the antenna coil located adjacent to the chip module are not formed as loops, but are angular extensions that are still offset or spaced from the terminal area It is an enlarged plan view of a part of the inlay. FIG. 6 is a diagram of movement of the angular extension by brushing or combing the angular extension and moving it over the terminal area so that the extension can be thermally bonded to the terminal area.

  Although a chip module is shown in the foregoing figures, it should be understood that a chip can be used in place of a chip module (or vice versa) without departing from the scope of the present invention. Furthermore, unless otherwise specified, the wires shown in FIGS. 1-23 are insulated. However, it should be understood that uninsulated wires can be used in the present invention, provided that care is taken not to create a short circuit. In this case, the insulator removal step should be omitted.

  FIG. 1 illustrates one embodiment of a processing apparatus or machine 10 for manufacturing RF and / or RFID inlays. The machine 10 is generally described as including a power drive group 12 and a flexible communication bus 14 that transfers operating instructions and power from a computer processor (not shown) to the machine's working components. it can. For example, the bus 14 can facilitate the transfer of electronic signals between the processor and the actuating element 16 of the machine that creates the inlay. As discussed further below, the actuating element 16 may include a group or combination of one or more embedded tools, lasers, wire cutting machines, and thermal bonding heads. The actuating element 16 traverses a support base 24 that secures a substrate 26 that forms the body of the inlay. In the example machine shown in FIG. 1, the lateral slide rail 18 allows the actuating element 16 to cross the substrate 26 laterally. A longitudinal frame 20 secured to the lateral side rail 18 causes the machine to traverse or intermittently feed longitudinally along the longitudinal side rail 22. Dashed or phantom lines 28 designate or outline individual inlay devices that are expected to be formed from a common substrate 26. Reference numeral 30 is a chip or chip module previously placed on the substrate, or designates a recess in which the chip or chip module can be placed in the future. As described above, each inlay device has at least one transponder comprising an integrated circuit chip or chip module and a wire antenna connected to the chip or chip module. A CNC or similar control device controls the positioning and movement of the actuating element 16 relative to the substrate 26.

  2 and 3, a portion of an RF or RFID inlay device (hereinafter “device”) is shown. In accordance with the present invention, the device is typically made from a thermoplastic material or other material that readily accepts the implantation of wires (or an adhesive layer that is easily attached to the surface of the substrate, such as an adhesive layer that readily accepts wire bonds. A substrate 26 (which may include a material layer), a chip module 34 and an antenna element formed by a continuous length of wire 32. The chip module 34 in a known structure includes an integrated circuit 36 and at least a pair of terminal pads or terminal regions 40. Bonding pads 38 formed on the integrated circuit 36 are electrically connected to the terminal region 40 by one or more fine leads or conductors 42. A protective layer 44 made of a material such as epoxy covers the integrated circuit 36, a portion of each terminal area 40, and the interconnecting wires 42. Alternatively, the chip module can be constructed and assembled in other ways well known to those skilled in the art, or an integrated circuit 36 can be used in place of the chip module 34, in which case the antenna wire 32 is Directly bonded to the bonding pad 38.

  The portions of insulated wire 32 shown in FIGS. 2 and 3 are the ends of the wire forming the antenna, and will be more readily seen and understood with reference to FIGS. As shown in FIG. 4, during manufacture, portions of both ends of the wire are formed in a loop or bridge shape above the surface of the substrate. Subsequently, the loop is moved from the position shown in FIGS. 2 and 4 to the position shown in FIGS. 3 and 5. A portion of each loop is then bonded to the respective terminal area 40 at a bonding point 48. As shown in FIG. 2, when the wire is positioned or attached to the substrate, the wire 32 and the terminal region 40 are prevented from being guided or positioned on or in contact with the terminal region 40. There is a clear lateral shift or gap defined by the distance D. In the preferred embodiment, the loop is moved only for the purpose of bonding a portion of the loop to the terminal area only after the wire 32 is fully attached to the substrate to form the antenna. Nevertheless, it should be understood that the loop can be moved before the wire embedding process is complete. However, for this first embodiment, it should be understood that before moving the loop, the ends of the loop must be secured in some form, such as embedded in or attached to the substrate at point 46. If only one end is fixed in place and the other end is not fixed to the substrate, or otherwise not fixed in any way, the movement of the loop is reliable or reproducible. Can't do it. As will be appreciated in connection with other embodiments, one end of the wire may be loose or not fixed to the substrate.

  With further reference to FIGS. 4 and 5, a device is shown in which antenna elements are formed in the form of a plurality of tracks or coils 50 arranged concentrically. In FIG. 4, the ends of the wire 32 are formed as a loop 47 that is generally orthogonal above the top surface of the substrate and extends adjacent to the chip module 34 but does not extend over any portion of the chip module 34. When using smaller diameter wires, the loops may not extend perpendicular to the substrate, but can take different positions. The loop 47 protrudes and is spaced apart from the chip module so that a selected amount of insulated material can be removed from the wire before the wire is electrically bonded to the terminal area. . In FIG. 5, the insulated wire 32 has been moved to move the wire loop to a position directly above or in contact with the terminal area 40. A portion of the wire loop is then thermally bonded to the terminal area to make an electrical connection.

  FIG. 6 shows further details of the actuation element 16 of the machine 10. Actuating element 16 includes at least one embedding tool 52 that is used to completely or partially embed insulated wire 32 in substrate 26. As will be appreciated by those skilled in the art, the embedding tool 52 utilizes high frequency or ultrasonic vibrations to embed insulated wires within the substrate. The embedding tool moves in a pre-programmed pattern according to instructions from the processor or controller to form the desired shape or pattern for the antenna. In FIG. 6, the insulated wire 32 is dispensed from the tip 53 of the embedding tool. Insulated wire that has been distributed but not yet attached to the substrate 26 is shown as insulated wire 54. A tube 55 positioned adjacent to the embedding tool can be used to deliver an air flow and cool the embedding head. The other actuating element 16 includes at least one laser 56 used to remove the insulating material from the insulated wire and then the wire to the position shown in FIGS. 3 and 5 so that the wire can be secured to the terminal area. Included is at least one wire moving tool 58 that moves the loop and a wire cutter (not shown) that cuts the wire and allows the machine to move relative to the substrate to form the next antenna. The elements 16 can move together as a single group to create an inlay, or various combinations of the elements 16 can be positioned at different positions, or individually positioned at different positions, common or separate An array of inlays formed from the substrate 26 can be most efficiently manufactured.

  Since the antenna is a single continuous length of insulated wire, the embedded tool 52 moves in a predetermined pattern to form loops and concentric windings without disrupting the continuity of the wire. The wire must then be dispensed. Thus, in the fabrication of the antenna, the first step in the process is to form one of the loops 47 generally in proximity to the chip module 34 but offset laterally from the chip module 34 with respect to the plane of the substrate 26. is there. The wire is then attached to the substrate in the form of an antenna pattern, and then the embedding tool forms the second loop 47 generally close to the opposite side of the chip module but offset from this side. It should be understood that the position of the formed wire loop is generally close to the position of the respective terminal area to which each wire loop will be attached. After the second loop is formed, the insulated wire is cut and then the embedding tool 52 can be moved to the next position on the substrate to form the next antenna, and the substrate is moved to the embedding tool. Or some combination of relative movement between the embedded tool and the substrate.

  Referring to FIGS. 7 and 8, the operation sequence of the embedding tool 52 to form the second loop of the pair of loops 47 is shown, but this process is substantially the same as the process of forming the first loop. I want you to understand. From left to right in FIG. 7, the wires are dispensed from the tool 52 and the insulated wire 32 is embedded in the substrate 26, and then the embedded tool 52 is moved upward to place the insulated wire above the top surface of the substrate 26. The ultrasonic source is turned off in sequence or simultaneously while lifting up to the specified height H, and then the implantation tool is leveled at the specified height for the desired distance to form a wire loop 47 of generally known length. Show the order as crossing. Referring to FIG. 8, the embedding tool 52 is then moved downward, the ultrasonic source is turned on, and the end of the wire is embedded in the substrate 26 a distance. At this point, the insulated wire can be cut and the embedding tool can move to the next location on the substrate to form the next antenna pattern. The embedding tool forms the first loop 47 in the same general order as described above with reference to FIGS. However, rather than cutting the wire after the loop is formed, the embedding tool continues to embed the wire to form the antenna and the second loop. As described above in connection with this embodiment, in order to move the loop for subsequent handling, the wire must be attached to the substrate at 46 on either side of the loop, or otherwise fixed in some form.

  Referring now to FIGS. 9-11, the insulator removal aspect of the present invention during operation is shown. In order to improve the quality of the electrical adhesion between the antenna and the chip or chip module, particularly when working with wires having a diameter of less than 60 microns, a portion of the insulating material encapsulating the metal conductor is removed. It is desirable. Laser 56 generates a laser or ultraviolet light beam 57 that contacts a defined portion of loop 47 to remove a selected amount of insulator. As shown in FIG. 10, the laser beam 57 is directed to remove specified portions of the insulating material 72, thereby exposing the internal metal conductor 74. As shown in FIG. 11, the circular pattern 76 represents a portion of the substrate that is contacted by the laser beam 57. The size and shape of the beam emitted from the laser can be varied to meet system requirements and space limitations. Note that the laser beam 57 does not strike any part of the chip or chip module 34, thereby preventing any damage to the chip, chip module, or their respective terminal areas. The gap or distance D between the insulated wire and the chip module ensures that the use of the laser is controlled so that the insulating material can be removed safely without contaminating or damaging the bond. The laser 56 is moved or intermittently fed from one loop to the next to process each loop in turn. If necessary, a protective jacket or shroud (not shown) may be utilized in combination with laser 56 to limit unintentional reflection of laser light toward the chip module or device operator. Can do. In addition, a temporary protective pad (underneath the wire loop being processed by the laser (to prevent the laser from piercing the substrate or otherwise irreparably damaging the substrate) It may be desirable to place (not shown). The protective pad can be incorporated in a controllable arm incorporated in the actuating element 16, which is placed during laser operation and then retracted. As a result of the foregoing process, the insulator is completely removed from the defined part of the wire and any residues or by-products from this removal process are removed by the laser or the terminals of the chip and / or chip module It adheres to the substrate in a harmless manner at a location that is safely removed from the area.

  Referring now to FIGS. 12-18, the wire moving tool 58 in operation is shown. First, referring to FIGS. 12 to 14, the structure of the tool 58 includes (i) a frame 60, (ii) a pair of vertical supports 62, and (iii) a pair of spaced-apart clamps. A pair of clamping assemblies 63 including 64 and (iv) a pair of springs 68 that bias the rotational motion of the clamping assembly 63 about each pin 70. Each clamp 64 includes a notch 66 that engages the loop 47, as discussed below. The wire moving tool 58 is lowered from the position of FIG. 12, and as a result, the lower edge portion of the clamping portion 64 contacts the upper surface of the substrate 26 as shown in FIG. 14. When the clamping assembly 63 comes into contact with the substrate, the pair of clamping portions 64 rotates around the pins 70 toward each other so that the lower surface of the pair of clamping portions is located in the same plane on the upper surface of the substrate 26. Referring to FIG. 15, the central arch portion 65 of each clamping assembly 63 prevents the clamping assembly or any other portion of the clamping assembly from hitting the chip or chip module, so that the movement of the clamping part is Without taking the risk of changing position, the clamping assembly can be moved towards the chip or chip module. Referring to FIGS. 16 and 17, the clamping portions move toward each other so that each loop 47 is engaged with one of the pair of clamping portions and the wire loop is secured within the notch 66. The loop is moved by the relative movement of the clamping part toward the terminal area of the chip or chip module. More specifically, the wire including the loop 47 bends or deforms as the holding portion moves inward. As best seen in FIG. 3, the deformed loop shape is due to the loop bending at position 49 and position 46 as a result of the position of the embedded or secured region 46 and the shape of the notch 66 of the clamping assembly 63. Includes three distinct straight sections. Accordingly, the loop is moved to a position directly above at least a portion of the terminal area 40 and possibly in contact with at least a portion of the terminal area 40.

  Referring to FIG. 18, the clamping assembly is disconnected and the wire loop is then moved to a position where it can be bonded to the respective or corresponding terminal area. In a preferred embodiment, the inward movement or pinching movement of the opposing clamping parts is limited by an adjustable physical stop that prevents the clamping parts from moving too much. If the clamping part moves too much, the portion of the wire that is fixed in the substrate at the point 46 will be dislodged, potentially causing the loop wire to be misplaced relative to the terminal area of the chip or chip module. is there. The length of the wire forming each loop 47 and its height H, together with the shape or contour of the clamping part, define the maximum distance that the clamping part 64 can move. As should be understood, the distance D by which the wire 32 is displaced from the chip module 34 can be adjusted by adjusting the height H and / or length of the wire loop.

  Referring now to FIG. 19, there is shown another actuating element 16, namely a thermal bonding head 80 that is used to electrically bond a loop 47 whose position has been moved above the respective terminal area 40. In this view, the thermal bonding head 80 is shown as compressing one of the loops 47 into contact with one of the terminal areas 40. The thermal bonding head generates a voltage sufficient to electrically bond the loop to the terminal area. Similar to the laser 56, the bonding head 80 is intermittently fed or moved from one bonding point to the next bonding point so as to bond each loop in turn to its corresponding terminal area.

  FIG. 20 shows an example of an implantation device such as an ultrasonic sonotrode 90. The sonotrode includes a manifold 92 that houses the capillary 94 and a compressed air passage 96 that communicates with the capillary 94. The wire 32 can be dispensed from the sonotrode distal tip 98 through the capillary tube. The wire tightening mechanism 102 controls the supply of the wire. When the clamping parts of the tightening mechanism are closed to each other, the wire is not supplied. The compressed air can control the rate at which the wire is dispensed from the capillary tube when the clamp is open.

  When the laying of the wire with the previous RF device is complete, the wire 32 is cut and the remaining amount of wire 100 remains extended from the distal tip of the implantation tool. This remaining amount of length is equal to the distance between the embedding tool and the cutting tool (not shown). This remaining amount of wire is used to produce the next RF location.

  Referring to FIG. 21, the embedded tool is shown in a raised position relative to the substrate. Compared to that shown in FIG. 20, the remaining wire length is longer. This additional length can be created by forcing a length of wire out of the sonotrode with air flowing through the channel 96. Alternatively, an additional length of wire can be withdrawn from the wire supply by embedding or securing the wire to the substrate and moving the sonotrode.

  Referring now to FIG. 22, an alternative method of configuring the end of the antenna coil so that it can be placed in a position for subsequent electrical connection to the terminal region 40 is shown. As shown, the coil wire end 104 is configured as a cornered extension from the embedded coil and does not contact any part of the chip module 34. Rather, end 104 is simply located on the substrate adjacent to the chip module. These angular extensions can be formed by simultaneously moving the ultrasonic head and flowing air through the channel 96 to exit the device. After this length of wire is placed on the substrate, the coil 50 is formed. Another length of wire is then positioned, generally as shown, to form a second angular extension. Alternatively, a very short portion of the length of the wire end 104 can be embedded, thereby stabilizing the position of this length of wire before changing position and adhering to the terminal area. It is also intended to help.

  In the next step of the manufacturing process, the angular extension is moved to a position above the terminal area as shown in FIG. 23 to interconnect with the terminal area. When any portion of the wire end 104 is embedded, the force of the element that moves the wire end exceeds the embedding force. The angular extension can be placed in place with a brush or comb, as with a rotating brush or comb 106. The brush or comb 106 can also be another element incorporated within the actuation element group 16. Alternatively, the angular extension can be gripped and rotated into place. Gripping can be accomplished manually by a machine or device or by an operator. After the cornered extensions are placed over the terminal areas, the wire ends can be thermally bonded as discussed above. Therefore, in the manufacturing method shown in FIG. 22 and FIG. 23, it is not necessary to form a loop, and a freely extending end portion is disposed on the substrate and then rotated to a fixed position and bonded. As discussed above with respect to insulation removal from the wire, the cornered extensions are spaced from the chip module so that the corners are not damaged without damaging the chip module or any other part of the inlay or transponder device. The insulator can be removed from the extension.

  One possible sequence for laying the antenna as shown in the embodiment of FIGS. 22 and 23 involves first extending a length of wire from the implantation head to form an extension that forms a first corner. . The wire end 104 of the first angular extension may simply be located on the substrate, or a very short length of the wire end 104 may be embedded in the substrate. The embedding tool then crosses the substrate in a corner and leaves it off the chip module without laying wires over any part of the chip module. The embedding tool moves to the periphery of the substrate, and then starts laying concentric coils to form the antenna. When forming the last coil, the embedding tool moves in a cornering direction to form a second cornering extension. Again, the embedding tool does not cross over any part of the chip module. In the illustrated embodiment, the insulated wire is cut at a location where the cornered extensions are approximately the same length and the orientation of the corners is approximately the same for both sides of the terminal region. . However, it should be understood that the lengths and / or orientations of the angular extensions may vary, provided that the repositioning device can position the wires of those lengths in contact with the terminal area. A device such as a brush or comb 106 is then used to move the angular extension over a designated portion of the chip module, such as the terminal area, so that the angular extension is electrically connected to the chip module. Connecting.

  The advantages of the present invention are clear. An RF inlay or transponder device that can achieve improved electrical adhesion between the antenna and the terminal area of the chip module using a laser that effectively removes all insulators from specified portions of the wire loop. A manufacturing process for manufacturing is provided. By creating a protruding loop spaced from the chip module, the laser can operate without damaging the chip module or any other part of the inlay or transponder device. This allows the use of insulated wires with smaller diameters and makes the final RF device less susceptible to physical tampering. The working elements of the processing machine can be integrated into a group, so that a single processing machine can be used to make the inlay completely, so that no additional processing machine or cooperation Eliminate the need for manufacturing components. Alternatively, the processing tools may be placed separately or in different combinations and at the same location.

  Since the insulator is removed from the antenna wire prior to bonding the antenna wire to the terminal area, the thermocompression head can be operated at a lower voltage, thereby extending the life of the thermocompression head. In addition, the lower voltage is also suitable for and facilitates the use of smaller diameter wires. Using a lower voltage allows the antenna wire to be properly bonded to the terminal without completely destroying the wire conductors as might normally occur with a head operating at a much higher voltage.

  While the foregoing invention has been disclosed in terms of preferred embodiments, it should be understood that various other changes and modifications can be made to the invention in accordance with the claims appended hereto.

Claims (20)

A method of manufacturing a radio frequency inlay, comprising:
Providing a substrate defining a substrate plane; an integrated circuit positioned on or in a recess formed on the substrate; and a pair of terminal regions associated with the integrated circuit;
Attaching a wire to the substrate to form an antenna, the attaching step comprising:
(I) The first portion of the wire corresponding to one of both end portions of the antenna is laterally shifted from and spaced from one of the terminal regions to be electrically disconnected from the terminal region. And forming a first wire loop away from the plane of the substrate by a portion of the first portion of the wire;
(Ii) attaching a second portion of the wire to the substrate to form an antenna winding;
(Iii) The third portion of the wire corresponding to the other of both ends of the antenna is shifted from the other of the terminal regions in the lateral direction and separated from the terminal region so as to be electrically disconnected from the terminal region. And forming a second wire loop away from the plane of the substrate by a portion of the third portion of the wire.   The method of claim 1, wherein attaching the wire to the substrate comprises partially or completely embedding the wire within the substrate.   A portion of the first loop is positioned over at least some portion of one of the pair of terminal regions, and a portion of the second wire loop is positioned on the other of the pair of terminal regions. The method of claim 1, further comprising moving the first and second wire loops to be positioned over at least some portion. 4. The method of claim 3, further comprising electrically bonding a portion of the first and second wire loops to the corresponding terminal area. The wire is insulated;
The method of claim 1, further comprising removing the insulator on portions of the first and second wire loops using a laser. 6. The method of claim 5, wherein the processing step comprises applying a laser beam to the portion to be processed. Positioning the first and second wire loops, the laser, and the terminal region, whereby the operation of the laser removes insulator from the wire, but the laser is in the terminal region; The method of claim 6 further comprising the step of not hitting. The method of claim 3, further wherein the first and second wire loops are moved by a mechanical device. The method of claim 8, wherein the mechanical device is a brush or a comb. A method of manufacturing a radio frequency inlay, comprising:
Placing a chip or chip module including at least a first terminal region on a surface of the substrate or in a recess formed in the substrate;
Forming a first wire loop extending from a surface of the substrate, wherein the first wire loop is offset from the chip or chip module but not directly above the chip or chip module, or the chip Or a step formed in a position not in contact with the chip module;
Embedding a length of wire partially or completely within the substrate, the length of wire being electrically connected to the first wire loop;
Moving the first wire loop to a position directly above or in contact with the terminal area;
Electrically connecting the first wire loop to the first terminal region. The method of claim 10, further comprising removing an insulator from the first wire loop before electrically connecting the first wire loop to the first terminal region. The method of claim 11, further comprising removing the insulator using a laser. The method of claim 12, further comprising positioning the laser such that the laser light strikes a portion of the first wire loop but not the terminal area. Forming a second wire loop extending from a surface of the substrate, wherein the second wire loop deviates from a second terminal region associated with the chip or chip module. The method according to claim 10, further comprising the step of: being formed at a position that is not directly above or at a position that does not contact the second terminal region, and wherein the second wire loop and the wire are electrically connected. . Moving the second wire loop to a position directly above or in contact with the second terminal area;
15. The method of claim 14, further comprising electrically connecting the second wire loop to the second terminal region. The method of claim 14, further comprising removing insulator from the second wire loop before electrically connecting the second wire loop to the second terminal region. From the length of the wire consecutive further comprises forming the first wire of the wire loop and said length, A method according to claim 10. 15. The method of claim 14, further comprising forming the first wire loop, the second wire loop, and the length of wire from a continuous length of wire. A substrate defining a substrate plane; and an integrated circuit positioned on the substrate or in a recess formed on the substrate;
A pair of terminal regions associated with and positioned adjacent to the integrated circuit;
A wire attached to the substrate to form an antenna, the first portion being laterally offset and spaced from one of the terminal regions and electrically disconnected from the terminal region; and the first A first wire loop formed from the first portion, a second portion embedded in the substrate so as to form a winding of the antenna, and a laterally shifted and spaced apart from the other of the terminal regions. electrically saw including a third portion of the non-connected state and the terminal region, and a second wire loop formed from said third portion, moving the first wire loop and the second wire loop Each of the radio frequency devices is electrically connected to a corresponding terminal area . The radio frequency inlay of claim 19, wherein the first and second wire loops are positioned above the substrate.

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