KR101554269B1 - method for removing the carbide in the step of welding the antenna to the transponder chip and corresponding inlay substrate - Google Patents

Abstract

The present invention relates to a transponder chip and a method of removing weld carbide generated when an antenna is connected to an inlay substrate corresponding to the transponder chip. A method of removing a welded carbide generated when an antenna is connected to a transponder chip and a corresponding inlay substrate according to the present invention includes the steps of placing a chip or a chip module on a substrate on a transponder region of an inlay substrate ; Forming a winding while wiring the antenna wires along the periphery of the substrate so as not to overlap; Attaching both ends of the antenna wire forming the winding to the terminal portions of the chip or chip module, respectively; A welding step of electrically connecting both ends of the antenna wire to an attached chip or chip module terminal portion; And a step of removing the carbide by bringing the grinder means into contact with the welded portion to remove the carbide generated at the electrically connected welded portion. As a result, it is possible to effectively remove the welding carbide generated in the spot welding process for electrically coupling the antenna wire to the chip or the chip module, to prolong the life of the inlay substrate, It is possible to minimize problems such as information errors.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of removing a carbide from a transponder chip and a corresponding inlay substrate,

The present invention relates to a transponder chip and a method of removing weld carbide generated when an antenna is connected to an inlay substrate corresponding to the transponder chip. And more particularly, to a method for removing carbide generated in a step of welding an antenna to an integrated circuit and a substrate material.

RF inlays are used to fabricate security access devices (RFID devices) for debit and credit cards, e-passports, toll road access passes, computer or computer networks and databases, or other forms that allow users to be identified . The diversity and expansion of user usage for RF devices in general is also referred to as "smart cards."

A method of fabricating an inlay including the RFID chip and an antenna inserted in the multi-layer substrate and connected to the terminals (terminal areas) of the RFID chip is known in which a wire conductor is embedded in a lower substrate layer Then, a wire conductor is connected to the first terminal region of the RFID chip, and the wire conductor is wound a plurality of times to form the antenna. Then, the wire conductor is connected to the second terminal region, and the wire conductor is inserted into the uppermost substrate cell, and then the wire is cut to complete the high frequency transponder.

Conductive adhesive or conductive tape or spot welding (e.g., using electrical or laser) may be used to attach the antenna to the chip or chip module. However, in this case, there is a problem that carbide is generated at the welding portion connecting the chip and the antenna, so that information error may occur.

Therefore, the present invention relates to a transponder chip capable of effectively removing welding carbide generated during a spot welding process for electrically coupling an antenna wire to a chip or a chip module, and a welding chip And to provide a method of removing the above-

Another object of the present invention is to provide a transponder chip capable of extending the lifetime of an inlay substrate, and a method for removing a welded carbide generated when an antenna is connected to a corresponding inlay substrate.

Another object of the present invention is to provide a transponder chip capable of minimizing problems such as possible information errors due to the presence of carbide, and a method for removing the welded carbide generated when the antenna is connected to the corresponding inlay substrate.

The object is achieved by a method of manufacturing a radio frequency inlay, comprising: placing a chip or a chip module on a substrate on a transponder area of an inlay substrate in the course of manufacturing a radio frequency inlay; Forming a winding while wiring the antenna wires along the periphery of the substrate so as not to overlap; Attaching both ends of the antenna wire forming the winding to the terminal portions of the chip or chip module, respectively; A welding step of electrically connecting both ends of the antenna wire to an attached chip or chip module terminal portion; And removing the carbide by contacting the welding part with the grinder means to remove the carbide generated at the electrically connected welding part. The welding method according to claim 1, Is achieved.

Removing the carbide by contacting the grinder means, and then bringing the brush into contact with the welding portion to remove secondary carbide remaining in the welding portion.

The grinder means may further include angle adjusting means.

The brush may be contacted with the welding part to remove the remaining carbide from the welding part, and then the third step of removing the remaining carbide from the welding part by using the vacuum suction device.

The welding is preferably spot welding.

According to the transponder chip of the present invention and the corresponding method of removing the welded carbide generated when the antenna is connected to the inlay substrate, the welding carbide generated in the process of spot welding to electrically couple the antenna wire to the chip or chip module Can be effectively removed.

According to the transponder chip of the present invention and the method of removing the welded carbide produced when the antenna is connected to the corresponding inlay substrate, the lifetime of the inlay substrate can be prolonged.

Also, according to the method of removing the welded carbide produced when the antenna is connected to the transponder chip and the corresponding inlay substrate according to the present invention, it is possible to minimize the problem of possible information errors due to the presence of carbide.

1 is a plan view of an inlay substrate according to an embodiment of the present invention,
FIG. 2 is a partially enlarged perspective view of a pre-welded antenna wire according to an embodiment of the present invention disposed on a chip or chip module,
3 is a partially enlarged perspective view of an inlay substrate in which an antenna wire is spot welded on a chip or chip module,
4 is a partially enlarged perspective view of a carbide removing apparatus using a grinder unit according to an embodiment of the present invention,
FIG. 5 is a partially enlarged perspective view of a carbide removing apparatus using a brush unit according to an embodiment of the present invention. FIG.
FIG. 6 is a partially enlarged perspective view illustrating a third step of removing the carbide by using the brush means according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, a method of removing a welded carbide produced when a transponder chip according to the present invention and an antenna connected to the corresponding inlay substrate are connected will be described in detail.

First, a process of forming a chip or a module on an inlay substrate and an arrangement of an antenna will be described before explaining a process of providing a method of removing a carbide generated in the process of welding an antenna.

1 is a plan view of an inlay substrate 100 according to an embodiment of the present invention. 1 shows in detail one region of an inlay substrate 100 having a plurality of transponder regions 110. As shown in FIG. The transponder regions disposed above, below, left, and right of the transponder region 110 on the inlay substrate 100, and the corresponding additional transponders may be omitted, but may be aligned.

As used herein, the term 'substrate 100' may include all materials used in non-conductive materials, paper, ferrite coated materials, and stealth devices capable of absorbing electromagnetic waves. It can also be PVC, PE, PET, PETE, C-FLEX or Cotton / Noil.

As used herein, the term " chip or chip module 130 " can be understood to include a chip module or a chip unit, and may generally refer to an RFID chip or a transponder chip.

The term " wire " as used herein is understood to include metal wires such as gold, aluminum, copper, and silver, which are circular or square in cross-section, as elongated means of transmitting or radiating signals, Wires, insulated coated wires, and color coated wires. It is also possible that the wire is an optical fiber.

The term " antenna " is used herein to refer to either a simple coil antenna with two ends, a simple coil antenna wound at several revolutions, or a dipole antenna with two wire segments with two inner ends, And may include other forms of antenna that may be suitable for connection.

The term " Embedding " in this context includes adhesive or buried fixation in describing the mounting of a self-bonding wire.

As used herein, the term " bonding " is understood to include, but is not limited to, a method of electrically interconnecting the ends of wires or wires or terminals of wires to terminals in the chip or chip module 130 But may also include physical connections and may include, for example, welding, adhesive bonding, brazing, etc., and may include any of thermocompression bonding, ultrasonic bonding, laser welding, and the like.

The term " adjacent " or " adjacent " as used herein shall be understood to mean the side of the transponder chip's mounting location, rather than within the range of the mounting location of the transponder chip. As a result, it can be understood that the terminal end of the antenna wire is arranged closer to the installation position of the transponder chip than the range (or the upper portion) of the installation position of the transponder chip.

More specifically, according to the method of manufacturing the inlay, one or more embedding heads or a sonotrode may be used to partially or completely embed the antenna wire 120 in the substrate. have. The insertion head can be formed in various patterns as long as the wire can form the windings of the antenna. One antenna may be arranged so as to correspond to one inlay, but the present invention is not limited thereto, and when two or more antennas are used, a plurality of antennas may be connected to a common chip or chip module 130 .

According to an embodiment of the present invention, a wire can be inserted into one of the terminal regions of the RFID chip or the chip module 130, but the wire can be guided directly above the terminal region, The antenna can be formed by inserting it into the opposite side of the terminal region. The insertion and bonding process may begin with a wire adjacent to and laterally offset from the terminal region of the chip or chip module 130. At this time, the wire can be inserted into the substrate to form the antenna, and both ends 120a and 120b of the wire forming the antenna are arranged so as not to be buried in the substrate. The two ends may be positioned adjacent to and laterally offset from the terminal region of the chip or chip module 130. In one embodiment of the present invention, both ends of the wire 120a, 120b may be entirely fixed to the substrate, or only a portion thereof may be fixed to the substrate.

The ends of the antenna wire 120a and 120b are moved to the upper or contact position of the terminal region of the chip or chip module 130 after the antenna wire 120 is formed in the next step, It may be arranged so as not to come into contact with the terminal area until fully formed, and the bonding process may be carried out after the antenna is completely formed. In the present invention, a first portion of the wire can be inserted into the substrate, wherein a first portion of the first portion can extend out from the substrate.

 Thereafter, while moving the insertion head, it is possible to form a loop-shaped wire extending over the substrate without fixing or inserting the wire into the substrate. The loop-shaped wire may be formed in a position offset laterally from the terminal region of the chip or chip module 130, and may be formed perpendicularly to the plane of the substrate, or may be formed in another direction. The process of fixing the antenna wire 120 or inserting the wire into the substrate may be such that a second wire in the form of a loop or bridge can be formed at a second location on the substrate, But are not necessarily limited thereto.

Thereafter, the two ends of the antenna wire 120 may be surrounded by an insulating material, so that the portion surrounding the antenna wire 120 can be removed. More specifically, the insulating material is peeled off from both ends 120a and 120b of the wire along the respective loop portions of the antenna wire 120. The position where the insulating material is peeled off from both ends of the looped antenna wire 120a, 120b may be a portion that is in electrical contact with the terminal region or a portion that adheres to the terminal region. The loop may be offset or spaced from the terminal area, which loop is not placed directly above or in contact with the terminal region of the chip or chip module 130.

Figure 2 is a partially enlarged perspective view of a pre-welded antenna wire 120 according to an embodiment of the present invention disposed on a chip or chip module 130, 130 on which the inlay substrate 100 is spot-welded.

2 and 3, when the wire loop is positioned directly above or in contact with or close to the terminal region of the chip or chip module 130, it may be spot welded using a conductive adhesive material or a welding machine 300 spot welding may be used to fix electrical or physical contact.

In the process of fixing the electrical contact between the electrical contact portion of the antenna wire 120 and the chip or chip module 130, when the spot welding, for example, a laser or thermal bonding, is used, .

FIG. 4 is a partially enlarged perspective view of a carbide removing apparatus 400 according to an embodiment of the present invention.

Referring to FIG. 4, there are various ways to remove the carbide formed in the welded portion 200. However, according to one embodiment of the present invention, for more efficient removal, . The structure of the grinder means 400 may be various structures, and any of the grinder means 400 that can meet the purpose in the process used in the inlay manufacturing method may be used. Here, the grinder means 400 may include a driving motor, a grinding means, and a driving means.

The drive motor generates rotation by receiving power supplied from the inside or the outside. For example, an AC motor or a DC motor may be used. The grinding means is an abrasive that abrades the carbide generated in the welded portion 200 and is made as smooth as possible within the range to meet the purpose of removing the carbide of the welded portion 200, 130 can be sufficiently fixed.

The transmission means is a power transmission means that is connected between the rotation axis of the drive motor and the rotation axis of the polishing means to transmit the rotational force.

An angle adjusting means is additionally included to facilitate grinding the grinder means 400 when the grinder means 400 is moved along the surface of the welded portion 200 when the grinder means 400 is brought into contact with the carbide welded portion 200 and removed The grinder means 400 can be used. When the tilting angle of the grinder means is adjusted to move along the curved portion of the curve, the angle adjusting means can easily remove only the carbide without damaging the welded portion 200.

FIG. 5 is a partially enlarged perspective view of the second removal of carbide using the brush unit 500 according to an embodiment of the present invention.

5, in order to more effectively perform the removal of the carbide according to the embodiment of the present invention, after the primary carbide is removed by using the grinder means 400, the secondary carbide is reused by using the brush means 500 And removing it. The brush means 500 may be all of the brush means 500 that can meet the purpose of removing the carbide remaining in the welded portion 200, but it is more effective to use the rotary drive brush to remove the carbide More preferable. For example, the rotary drive brush may be configured to include a drive motor, a brush means, and a transmission means.

The contact portion of the brush means 500 may be a soft material and the carbide remaining in the welded portion 200 may be additionally removed by controlling the driving speed. If the carbide is sufficiently removed from the welded portion 200, the electrical connection can be made smoothly, so that problems such as information errors do not occur.

Additionally, a cleaner may additionally be used to more thoroughly remove foreign matter from the welded portion 200 between the antenna wire 120 and the terminal during the inlay manufacturing step. The carbide described in one embodiment of the present invention can be included in one of the foreign substances, so that the carbide can be more completely removed.

FIG. 6 is a partially enlarged perspective view of a carbide removing device 3 'by using a vacuum suction system 600 according to an embodiment of the present invention.

Referring to FIG. 6, the carbide that has fallen off the welded portion 200 using the grinder means 400 and the brush means remains on the chip or chip module 130, which is connected to the grinder means 400 or the brush means 500 It is difficult to completely remove it. Therefore, it is necessary to completely remove it by using the vacuum suction system 600 in order to remove it. The vacuum suction system 600 can completely absorb the carbide by adjusting the intensity thereof.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.

100: substrate 110: transponder region
120: antenna wire 120a: first antenna wire end
120b: second antenna wire end 130: chip or chip module
200: Welding site 300: Welding machine
400: Grinder means 500: Brush means
600: Vacuum suction system

Claims (5)

Disposing a chip or a chip module on a substrate on a transponder region of an inlay substrate in the course of manufacturing a radio frequency inlay;
Forming a winding while wiring the antenna wires along the periphery of the substrate so as not to overlap;
Attaching both ends of the antenna wire forming the winding to the terminal portions of the chip or chip module, respectively;
A welding step of electrically connecting both ends of the antenna wire to an attached chip or chip module terminal portion; And
And removing the carbide by contacting the welding part with the grinder means to remove the carbide generated at the electrically connected welding part. The welding method according to claim 1, / RTI >
The method according to claim 1,
Further comprising the step of removing the carbide by contacting the grinder means and then again bringing the brush into contact with the welded portion to remove secondary carbide remaining in the welded portion. A method for removing generated welding carbide.
3. The method of claim 2,
Wherein the grinder means further comprises an angle adjusting means, and a method of removing weld carbide generated when an antenna is connected to an inlay substrate corresponding to the transponder chip.
3. The method of claim 2,
Further comprising a third step of removing the remaining carbide from the welded portion by contacting the brush with the welded portion and then removing the remaining carbide from the welded portion by using the vacuum suction device, A method for removing weld carbide generated when an antenna is connected to an inlay substrate.
The method according to claim 1,
Wherein the welding is spot welding, and a method of removing weld carbide generated when an antenna is connected to an inlay substrate corresponding to the transponder chip.

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