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WO2008114091A3 - Method of connecting an antenna to a transponder chip and corresponding inlay substrate - Google Patents

Method of connecting an antenna to a transponder chip and corresponding inlay substrate Download PDF

Info

Publication number
WO2008114091A3
WO2008114091A3 PCT/IB2007/004589 IB2007004589W WO2008114091A3 WO 2008114091 A3 WO2008114091 A3 WO 2008114091A3 IB 2007004589 W IB2007004589 W IB 2007004589W WO 2008114091 A3 WO2008114091 A3 WO 2008114091A3
Authority
WO
WIPO (PCT)
Prior art keywords
integrated circuit
wire
antenna
loops
inlays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2007/004589
Other languages
French (fr)
Other versions
WO2008114091A2 (en
Inventor
Ulrich Lang
Lionel Carre
Viroel-Marian Hasegan
David Finn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASSA ABLOY IDENTIFICATION
Original Assignee
ASSA ABLOY IDENTIFICATION
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/733,756 external-priority patent/US7546671B2/en
Application filed by ASSA ABLOY IDENTIFICATION filed Critical ASSA ABLOY IDENTIFICATION
Priority to KR1020097008529A priority Critical patent/KR101346050B1/en
Priority to AU2007349611A priority patent/AU2007349611C1/en
Priority to CA002664872A priority patent/CA2664872A1/en
Priority to JP2009529801A priority patent/JP5408720B2/en
Priority to CN2007800413375A priority patent/CN101627400B/en
Priority to EP07872847A priority patent/EP2070013A2/en
Publication of WO2008114091A2 publication Critical patent/WO2008114091A2/en
Publication of WO2008114091A3 publication Critical patent/WO2008114091A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
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    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
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    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
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    • H01Q1/00—Details of, or arrangements associated with, antennas
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    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Aerials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Near-Field Transmission Systems (AREA)

Abstract

A method and apparatus are provided for making radio frequency (RF) inlays. The RF inlays include an integrated circuit and an antenna affixed to a substrate material carrying the integrated circuit. During processing, portions of the wire forming the antenna are located adjacent to, but not directly over the integrated circuit such that the wire may be subject to further processing, such as removing insulation without potentially damaging the integrated circuit. In the subsequent processing step, the wire ends are placed in contact with and secured to the integrated circuit terminal areas. Methods of the invention include forming loops with the wire ends wherein the loops extend above a plane of the substrate, and in another processing step, the loops are displaced to be electrically connected to the terminal areas. Methods also include repositioning the wire and using a brush or comb device.
PCT/IB2007/004589 2006-09-26 2007-09-26 Method of connecting an antenna to a transponder chip and corresponding inlay substrate Ceased WO2008114091A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020097008529A KR101346050B1 (en) 2006-09-26 2007-09-26 Method of connecting an antenna to a transponder chip and corresponding inlay substrate
AU2007349611A AU2007349611C1 (en) 2006-09-26 2007-09-26 Method of connecting an antenna to a transponder chip and corresponding inlay substrate
CA002664872A CA2664872A1 (en) 2006-09-26 2007-09-26 Method and apparatus for making a radio frequency inlay
JP2009529801A JP5408720B2 (en) 2006-09-26 2007-09-26 Method for connecting antenna to transponder chip and corresponding inlay substrate
CN2007800413375A CN101627400B (en) 2006-09-26 2007-09-26 Method for connecting antenna to transponder chip and corresponding inlay substrate
EP07872847A EP2070013A2 (en) 2006-09-26 2007-09-26 Method of connecting an antenna to a transponder chip and corresponding inlay substrate

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US82692306P 2006-09-26 2006-09-26
US60/826,923 2006-09-26
US82986206P 2006-10-17 2006-10-17
US60/829,862 2006-10-17
US11/733,756 2007-04-10
US11/733,756 US7546671B2 (en) 2006-09-26 2007-04-10 Method of forming an inlay substrate having an antenna wire
US91375307P 2007-04-24 2007-04-24
US60/913,753 2007-04-24

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WO2008114091A2 WO2008114091A2 (en) 2008-09-25
WO2008114091A3 true WO2008114091A3 (en) 2009-01-22

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JP (1) JP5408720B2 (en)
KR (1) KR101346050B1 (en)
AU (1) AU2007349611C1 (en)
CA (1) CA2664872A1 (en)
WO (1) WO2008114091A2 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7707706B2 (en) 2007-06-29 2010-05-04 Ruhlamat Gmbh Method and arrangement for producing a smart card
US8522431B2 (en) 2008-01-09 2013-09-03 Féines Amatech Teoranta Mounting and connecting an antenna wire in a transponder
DE102009038620B4 (en) * 2009-08-26 2012-05-24 Melzer Maschinenbau Gmbh Method and device for producing a transponder unit
JP5861251B2 (en) * 2010-11-26 2016-02-16 凸版印刷株式会社 Wire conductor arrangement method and module substrate
EP2492847A1 (en) * 2011-02-25 2012-08-29 NagraID S.A. Card comprising a transponder
ITMO20110331A1 (en) * 2011-12-22 2013-06-23 Fabele S R L METHOD AND APPARATUS FOR THE REALIZATION OF A RADIO FREQUENCY IDENTIFICATION DEVICE EQUIPPED WITH AN ANTENNA MADE WITH AN ELECTRICALLY DRIVEN WIRE
GB2502600B8 (en) 2012-05-31 2015-01-07 Improvements in touch sensitive displays
US9501733B2 (en) 2012-07-12 2016-11-22 Assa Abloy Ab Method of manufacturing a functional inlay
JP5886174B2 (en) * 2012-11-16 2016-03-16 株式会社トッパンＴｄｋレーベル Non-contact communication medium manufacturing method, non-contact communication medium, and antenna and circuit device connection method
KR101427339B1 (en) * 2013-12-24 2014-08-06 주식회사포지스 RFID card and preparing method for the same
WO2016097817A1 (en) 2014-12-15 2016-06-23 Assa Abloy Ab Method of producing a functional inlay and inlay produced by the method
KR102001243B1 (en) * 2017-11-28 2019-07-17 신혜중 Embedding head for forming an antenna wire
DE102018005569A1 (en) * 2018-07-13 2020-01-16 Mühlbauer Gmbh & Co. Kg Device and method for producing RFID transponders
GB2576498A (en) * 2018-08-14 2020-02-26 The Francis Crick Institute Ltd Forming electrical connection between wire electrode and metallic contact surface
US11694057B2 (en) * 2020-01-03 2023-07-04 Sensormatic Electronics, LLC RFID tag and method of making same
US20240244758A1 (en) * 2023-01-16 2024-07-18 Sciperio, Inc Wire Dispensing Device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010054230A1 (en) * 1996-02-12 2001-12-27 David Finn Method and device for bonding a wire conductor
DE102004011929A1 (en) * 2004-03-11 2005-09-29 Conti Temic Microelectronic Gmbh Electrical contact surfaces connection establishing method, involves arranging contact surfaces by irradiating surfaces with laser radiation having power density within specific range
DE102004045896A1 (en) * 2004-09-22 2006-03-30 Mühlbauer Ag Transponder has antenna wires on substrate with laterally offset connection to flip chip modules using contact surfaces on connection bridge substrate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2146989T3 (en) * 1996-02-12 2000-08-16 David Finn PROCEDURE AND DEVICE FOR THE CONTACT OF A WIRE CONDUCTOR.

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010054230A1 (en) * 1996-02-12 2001-12-27 David Finn Method and device for bonding a wire conductor
DE102004011929A1 (en) * 2004-03-11 2005-09-29 Conti Temic Microelectronic Gmbh Electrical contact surfaces connection establishing method, involves arranging contact surfaces by irradiating surfaces with laser radiation having power density within specific range
DE102004045896A1 (en) * 2004-09-22 2006-03-30 Mühlbauer Ag Transponder has antenna wires on substrate with laterally offset connection to flip chip modules using contact surfaces on connection bridge substrate

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EP2070013A2 (en) 2009-06-17
KR20090066309A (en) 2009-06-23
JP2010541189A (en) 2010-12-24
KR101346050B1 (en) 2013-12-31
WO2008114091A2 (en) 2008-09-25
CA2664872A1 (en) 2008-09-25
JP5408720B2 (en) 2014-02-05
AU2007349611B2 (en) 2012-02-09
AU2007349611C1 (en) 2015-08-06
AU2007349611A1 (en) 2008-09-25

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