JP4681071B1 - 照明器具 - Google Patents
照明器具 Download PDFInfo
- Publication number
- JP4681071B1 JP4681071B1 JP2009286747A JP2009286747A JP4681071B1 JP 4681071 B1 JP4681071 B1 JP 4681071B1 JP 2009286747 A JP2009286747 A JP 2009286747A JP 2009286747 A JP2009286747 A JP 2009286747A JP 4681071 B1 JP4681071 B1 JP 4681071B1
- Authority
- JP
- Japan
- Prior art keywords
- resin material
- substrate
- light emitting
- light
- emitting diodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000463 material Substances 0.000 claims abstract description 151
- 239000000758 substrate Substances 0.000 claims abstract description 99
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 32
- 239000000057 synthetic resin Substances 0.000 claims abstract description 32
- 229920005989 resin Polymers 0.000 claims description 115
- 239000011347 resin Substances 0.000 claims description 115
- 239000004020 conductor Substances 0.000 claims description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000010276 construction Methods 0.000 abstract description 8
- 244000144977 poultry Species 0.000 abstract description 6
- 238000000465 moulding Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000005286 illumination Methods 0.000 description 38
- 238000004519 manufacturing process Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 229920001187 thermosetting polymer Polymers 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 7
- 239000000049 pigment Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- 239000011324 bead Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 229920005749 polyurethane resin Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000003760 hair shine Effects 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000249 desinfective effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/04—Provision of filling media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
- F21S8/06—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures by suspension
- F21S8/068—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures by suspension from a stretched wire
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
- F21V21/008—Suspending from a cable or suspension line
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
本願発明は、工事現場、ビニールハウス、鶏舎や、水中、海中等さまざまな場所で用いることのできる防水性、耐久性、耐衝撃性、耐圧性に優れた発光ダイオードを光源とする照明器具を提供すること。
【解決手段】
本願発明は、発光ダイオード31,32,33を実装してなる基板3に電線を接続するとともに、合成樹脂材にて電線52,53と、基板3と、発光ダイオード31,32,33とを一体に密着被覆して成形したことを特徴とする照明器具である。
【選択図】 図1
Description
12 照明器具本体
13 照明器具本体
14 照明器具本体
15 照明器具本体
16 照明器具本体
2 透光性樹脂材
21 照光部
22 接続個所
23 接続個所
24 透光性樹脂材
25 透光性樹脂材
26 アルミナビーズ
27 照光部
28 照光部
29 照光部
3 基板
31 発光ダイオード
32 発光ダイオード
33 発光ダイオード
34 孔部
35 LED回路
36 LED回路
37 LED回路
4 ヒートシンク
41 放熱羽根
42 ヒートシンク部
43 放熱羽根
5 ケーブル
51 ケーブル
52 電線
53 電線
54 電線
55 電線
56 ケーブル
57 ケーブル
58 ケーブル
6 接続個所
7 ケーブル分岐部
8 ヒートシンク
9 キャップ体
91 整流器
92 プラグ
Claims (5)
- 発光ダイオードを実装してなる基板に電線を接続するとともに、前記電線と前記基板の接続個所と、前記基板と、前記発光ダイオードとを、電源に電気的接続されてなる前記電線に一体に固着されケーブルを形成する合成樹脂材にて、一体に密着被覆するとともに、前記基板の発光ダイオード実装側の前記合成樹脂材を透光性樹脂材とし平面状、凸状、凸レンズ状、凹状、凹レンズ状または球状の照光部を成形し、ヒートシンク部を形成する前記合成樹脂材には熱伝導性材料を混入したことを特徴とする照明器具。
- 熱伝導性材料は、球状のアルミナまたはセラミックであることを特徴とする請求項1に記載の照明器具。
- 合成樹脂材の外方には、熱伝導性部材を配設したことを特徴とする請求項1または請求項2に記載の照明器具。
- 熱伝導性部材は、熱伝導性材料からなる、椀状体、筐状体、または、筒状体に形成したことを特徴とする請求項3に記載の照明器具。
- 熱伝導性部材には、複数の放熱羽根を配設したことを特徴とする請求項3または請求項4に記載の照明器具。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009286747A JP4681071B1 (ja) | 2009-12-17 | 2009-12-17 | 照明器具 |
| KR1020117022946A KR101177658B1 (ko) | 2009-12-17 | 2010-12-14 | 조명기구 |
| CN2010800122920A CN102356273A (zh) | 2009-12-17 | 2010-12-14 | 照明器具及照明器具的制造方法 |
| PCT/JP2010/072840 WO2011074692A1 (ja) | 2009-12-17 | 2010-12-14 | 照明器具および照明器具の製造方法 |
| US13/203,330 US8633502B2 (en) | 2009-12-17 | 2010-12-14 | Lighting apparatus encapsulated with synthetic resin material having translucent illumination section and also having heat sink section mixed with thermal conductive material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009286747A JP4681071B1 (ja) | 2009-12-17 | 2009-12-17 | 照明器具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP4681071B1 true JP4681071B1 (ja) | 2011-05-11 |
| JP2011129379A JP2011129379A (ja) | 2011-06-30 |
Family
ID=44114127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009286747A Active JP4681071B1 (ja) | 2009-12-17 | 2009-12-17 | 照明器具 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8633502B2 (ja) |
| JP (1) | JP4681071B1 (ja) |
| KR (1) | KR101177658B1 (ja) |
| CN (1) | CN102356273A (ja) |
| WO (1) | WO2011074692A1 (ja) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101335734B1 (ko) * | 2012-02-06 | 2013-12-02 | 김영탁 | 계량 주전자 |
| WO2013132389A1 (en) * | 2012-03-06 | 2013-09-12 | Koninklijke Philips N.V. | Lighting module and method of manufacturing a lighting module |
| JP2014013700A (ja) * | 2012-07-04 | 2014-01-23 | Japan Agengy For Marine-Earth Science & Technology | 光源システム及び撮像システム |
| DE102013205858A1 (de) * | 2013-04-03 | 2014-10-09 | Tridonic Gmbh & Co. Kg | Gehäustes LED-Modul |
| KR101343794B1 (ko) * | 2013-05-22 | 2013-12-20 | 이슬기 | 다기능 방열 플랜지를 구비한 발광다이오드 조명기구 |
| KR101550335B1 (ko) | 2014-01-27 | 2015-09-08 | ㈜바이브 | 유체에 의한 방열·방수·방습구조를 구비하고 지상과 수중에서 사용이 가능한 발광다이오드 조명장치 |
| FR3024210B1 (fr) * | 2014-07-24 | 2019-05-31 | Sieled | Dispositif d'eclairage en milieu aquatique |
| GB201503487D0 (en) * | 2015-03-02 | 2015-04-15 | Buster & Punch Ltd | Light Bulb |
| US20170175992A1 (en) | 2015-12-16 | 2017-06-22 | Sieled | Underwater lighting device |
| US10408392B2 (en) * | 2016-05-27 | 2019-09-10 | Ningbo Well Electric Applance Co., Ltd. | Outdoor lamp holder and outdoor lamp string using same |
| US11134618B2 (en) * | 2016-08-30 | 2021-10-05 | Current Lighting Solutions, Llc | Luminaire including a heat dissipation structure |
| USD887067S1 (en) | 2017-03-13 | 2020-06-09 | Buster And Punch Limited | Light fixture |
| USD893085S1 (en) * | 2019-05-27 | 2020-08-11 | Shenzhen Jindian Electronic Technology Co., Ltd. | Lamp |
| CA197092S (en) | 2020-01-30 | 2022-01-19 | Buster & Punch Ltd | Light fitting |
| USD979104S1 (en) | 2020-02-28 | 2023-02-21 | Buster And Punch Limited | Light fitting |
| USD956276S1 (en) * | 2020-09-09 | 2022-06-28 | Zhongshan Fanmao Information Technology Co., Ltd. | Hemp rope chandelier |
| USD987860S1 (en) | 2021-02-25 | 2023-05-30 | Buster And Punch Limited | Light bulb |
| USD987859S1 (en) | 2021-02-25 | 2023-05-30 | Buster And Punch Limited | Light bulb |
| CN215674855U (zh) * | 2021-07-27 | 2022-01-28 | 东莞市莞益灯饰有限公司 | 一种可快速插接的防水防摔灯串 |
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| JPH03142719A (ja) * | 1989-10-30 | 1991-06-18 | Toshiba Corp | 光ディスク装置 |
| JP2843071B2 (ja) * | 1989-11-09 | 1999-01-06 | 富士通株式会社 | 論理回路の試験装置及びその試験方法 |
| JP3152951B2 (ja) | 1991-03-14 | 2001-04-03 | 富士通株式会社 | 半導体装置の評価方法 |
| JP2769663B2 (ja) | 1992-11-18 | 1998-06-25 | 株式会社 スズデン | 工事用防水型ソケットの製造方法 |
| JP3142719B2 (ja) | 1994-07-26 | 2001-03-07 | セイコーインスツルメンツ株式会社 | アナログ電子時計 |
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| JP2003303504A (ja) | 2002-04-10 | 2003-10-24 | Meiji Natl Ind Co Ltd | 発光ダイオードを用いた照明器具 |
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| JP4236544B2 (ja) * | 2003-09-12 | 2009-03-11 | 三洋電機株式会社 | 照明装置 |
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| JP2005294334A (ja) * | 2004-03-31 | 2005-10-20 | Nan Ya Plast Corp | 高散熱led発光素子及びその製造方法 |
| US20060046327A1 (en) * | 2004-08-30 | 2006-03-02 | Nan Ya Plastics Corporation | High heat dissipation LED device and its manufacturing method |
| US7922359B2 (en) * | 2006-07-17 | 2011-04-12 | Liquidleds Lighting Corp. | Liquid-filled LED lamp with heat dissipation means |
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| JP2008207450A (ja) * | 2007-02-27 | 2008-09-11 | Towa Corp | 発光素子の圧縮成形方法 |
| JP2008277116A (ja) | 2007-04-27 | 2008-11-13 | Toshiba Lighting & Technology Corp | 放電ランプ用点灯装置および照明器具 |
| JP2008305837A (ja) | 2007-06-05 | 2008-12-18 | Oki Electric Ind Co Ltd | 半導体装置 |
| KR100919842B1 (ko) | 2007-09-27 | 2009-09-30 | 에이피엘시스템(주) | 엘이디 램프 |
| JP2009181808A (ja) | 2008-01-30 | 2009-08-13 | Toshiba Lighting & Technology Corp | 電子機器及びこの電子機器を用いた照明器具 |
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| JP3142719U (ja) * | 2008-03-13 | 2008-06-26 | 秀信 堀之内 | 蛍光灯型のled灯 |
| TWM353308U (en) * | 2008-06-09 | 2009-03-21 | qiu-shuang Ke | LED illumination device |
| KR20110094298A (ko) * | 2008-11-25 | 2011-08-23 | 덴끼 가가꾸 고교 가부시키가이샤 | 발광 소자 패키지용 기판의 제조 방법 및 발광 소자 패키지 |
| US8465177B2 (en) * | 2009-06-19 | 2013-06-18 | Chih-Ming Yu | Heat dissipation enhanced LED lamp |
| CN102339928A (zh) * | 2010-07-29 | 2012-02-01 | 展晶科技(深圳)有限公司 | 发光二极管封装结构 |
-
2009
- 2009-12-17 JP JP2009286747A patent/JP4681071B1/ja active Active
-
2010
- 2010-12-14 WO PCT/JP2010/072840 patent/WO2011074692A1/ja not_active Ceased
- 2010-12-14 CN CN2010800122920A patent/CN102356273A/zh active Pending
- 2010-12-14 KR KR1020117022946A patent/KR101177658B1/ko active Active
- 2010-12-14 US US13/203,330 patent/US8633502B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN102356273A (zh) | 2012-02-15 |
| US20110309403A1 (en) | 2011-12-22 |
| WO2011074692A1 (ja) | 2011-06-23 |
| US8633502B2 (en) | 2014-01-21 |
| JP2011129379A (ja) | 2011-06-30 |
| KR20110117266A (ko) | 2011-10-26 |
| KR101177658B1 (ko) | 2012-08-27 |
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