HK1164419A - Lighting equipment and manufacturing method of lighting equipment - Google Patents

Description

Lighting apparatus and method for manufacturing lighting apparatus

Technical Field

The present invention relates to a lighting device and a method for manufacturing the same, and more particularly to a lighting device using a light emitting diode light source and having excellent water resistance, durability, and the like.

Background

Conventionally, lighting fixtures used in construction sites, vinyl houses, barns, and the like are configured such that a light bulb is screwed into a lamp socket, and the lamp socket is electrically connected to a power supply via a cable. The waterproof socket for construction shown in patent document 1 has sufficient waterproofness and durability as a socket, but it is desired to further improve the complete waterproofness, durability, and impact resistance of the entire lighting fixture.

In recent years, it has been known to use light emitting diode elements as light sources for lighting fixtures because of their durability and energy saving properties. A technique of fixing the light emitting diode with a resin and molding the light emitting diode into a light source unit is known. For example, patent documents 2 to 5 each disclose an illumination device using a light emitting diode. These lighting devices using a light emitting diode module are configured by disposing a light emitting diode module in a rectangular parallelepiped case and filling the case with a resin material, and cannot be said to be lighting equipment that operates like a light bulb. The resin to be filled is used only for fixing the light emitting diode module, and does not have a structure for obtaining complete water resistance, high durability, and impact resistance. Further, patent document 6 discloses an underwater illuminator, which is an illumination device assumed to be used in water, and which is configured to seal a light emitting diode in an air chamber, and which is not configured to have pressure resistance to a degree capable of withstanding water pressure in deep sea, although a certain degree of water resistance can be obtained.

Prior art documents

Patent document

Patent document 1: japanese laid-open patent publication No. 6-163132

Patent document 2: japanese laid-open patent publication No. 2009-198597

Patent document 3: japanese laid-open patent publication No. 2009-181808

Patent document 4: japanese patent laid-open No. 2008-277116

Patent document 5: japanese patent laid-open publication No. 2003-303504

Patent document 6: japanese patent laid-open No. 2008-305837

Summary of the invention

Technical problem to be solved by the invention

However, lighting fixtures used mainly outdoors in construction sites, vinyl houses, barns, and the like are required to have good water resistance, durability, and impact resistance. That is, it is desired that the steel sheet is not damaged even when used in a severe environment such as a construction site, and has impact resistance capable of withstanding the impact of explosive explosion or the like in some cases. Further, it is desired to provide a lighting device having a complete waterproof property, which does not allow water to enter the inside and does not cause electrical leakage even if rainwater or water is sprayed on a construction site, or a disinfectant or a cleaning liquid in a vinyl house, a chicken house, or the like is sprayed on the lighting device. Further, it is also desirable to provide a lighting fixture having a complete waterproof property to the extent that it can be used in a pool or sea, and a high pressure resistance to withstand the water pressure even when used in a deep sea. Accordingly, an object of the present invention is to provide a lighting device using a light emitting diode as a light source, which has excellent water resistance, durability, impact resistance, and pressure resistance and can be used in various places such as a construction site, a vinyl house, a henhouse, or underwater and marine environments.

Disclosure of Invention

Means for solving the problems

In order to achieve the above object, a lighting fixture according to the present invention is characterized in that a wire is connected to a substrate on which a light emitting diode is mounted, and the wire, the substrate, and the light emitting diode are integrally covered with a synthetic resin material in close contact with each other and molded.

Further, the synthetic resin material on the light emitting diode mounting side of the substrate on which the light emitting diode is mounted is a translucent resin material, and the illumination portion is formed.

The light irradiation section is formed in a planar shape, a convex lens shape, a concave lens shape, or a spherical shape.

Further, the synthetic resin material is a thermosetting resin material.

Further, the synthetic resin material is mixed with a heat conductive material.

Further, the thermally conductive material is spherical alumina or ceramic.

Further, a heat conductive member is disposed outside the synthetic resin material.

Further, the heat conductive member is formed as a bowl, box or cylinder made of a heat conductive material.

Further, the heat conductive member is provided with a plurality of heat dissipating fins.

The method for manufacturing a lighting fixture according to the present invention is characterized in that an electric wire is connected to a substrate on which a light emitting diode is mounted, the substrate is set in a mold, a synthetic resin material is filled in the mold, the electric wire, the substrate, and the light emitting diode are integrally covered with the synthetic resin material in a close contact manner, and the synthetic resin material on the light emitting diode mounting side of the substrate is used as an illumination portion.

The light emitting diode module is characterized in that an electric wire is connected to a substrate on which a light emitting diode is mounted, the substrate is set in a mold, a synthetic resin material is filled in the mold, injection molding is performed, the electric wire, the substrate and the light emitting diode are integrally covered in close contact with each other by the synthetic resin material, and the synthetic resin material on the light emitting diode mounting side of the substrate is used as an illumination portion.

The light emitting diode lighting device is characterized in that an electric wire is connected to a substrate on which a light emitting diode is mounted, a heat conductive member of a bowl-shaped body or a box-shaped body is arranged outside the substrate on which the light emitting diode is mounted, a molten synthetic resin material is filled in the heat conductive member, the synthetic resin material is solidified, the electric wire, the substrate and the light emitting diode are integrally covered by the synthetic resin material in a close contact manner, and the synthetic resin material on the light emitting diode mounting side of the substrate is used as a lighting part.

The method is characterized in that an electric wire is connected to a substrate on which a light emitting diode is mounted, a connection portion of the electric wire and the substrate and the light emitting diode are immersed in a cap filled with a molten synthetic resin material, the synthetic resin material is solidified, the electric wire, the substrate and the light emitting diode are integrally covered with the synthetic resin material in a close contact manner, and the synthetic resin material on the side where the light emitting diode is mounted is used as an illumination portion.

ADVANTAGEOUS EFFECTS OF INVENTION

The lighting fixture is formed by connecting wires to a substrate on which light emitting diodes are mounted, and integrally covering the wires, the substrate, and the light emitting diodes in close contact with a synthetic resin material. Further, since the light emitting diode, the substrate on which the light emitting diode is mounted, and the light emitting diode are covered with the synthetic resin material in a tight manner, sufficient durability and impact resistance can be obtained. Further, since there is no gap between the parts, pressure resistance can be obtained which can be used without worrying about water intrusion and damage and deformation due to water pressure even in a pool, sea, or the like. Therefore, it is possible to provide a lighting apparatus which can be used in a construction site, a vinyl house, a chicken house, a pool, or the sea without fear of damage or electric leakage.

Since the synthetic resin material on the light emitting diode mounting side of the substrate on which the light emitting diode is mounted is a translucent resin material and the illuminating portion is formed, the electric wire, the substrate, the light emitting diode, and the illuminating portion are all integrally formed of the synthetic resin material, and the translucent resin material emits light as in a conventional electric bulb, and has a sufficient illumination effect.

Since the illuminating section is formed in a planar shape, a convex lens shape, a concave lens shape, or a spherical shape, light irradiated from the light emitting diode is reflected on the inner wall of the translucent resin material portion, and the light is condensed on the illuminating section, so that desired illuminance and an illuminated area can be obtained. In particular, by appropriately adjusting the length and shape of the translucent resin material filled on the light emitting diode mounting side of the substrate, it is possible to provide a lighting fixture capable of obtaining illuminance and an irradiation area according to the application.

Since the synthetic resin material is a thermosetting resin material, the thermosetting resin is hard and has a strong resistance to heat and solvents, and therefore, the molding is easy, and a lighting device having excellent water resistance, durability, impact resistance, pressure resistance, and heat resistance can be provided.

Since the heat conductive material is mixed into the light transmissive resin material, and the portion mixed with the heat conductive material functions as a heat sink, sufficient heat radiation can be obtained even when the substrate on which the light emitting diode is mounted is heated, and sufficient heat radiation can be obtained even without providing a separate heat conductive member.

Since the thermally conductive material is spherical alumina or ceramic, it has a good affinity with the resin-containing material and can obtain sufficient heat dissipation.

Since the heat conductive member is disposed outside the light transmissive resin material, the heat conductive member functions as a heat sink, and sufficient heat radiation performance can be obtained.

Since the heat conductive member is a bowl-shaped body, a box-shaped body, or a cylindrical body having a heat radiating portion made of a heat conductive material, each component can be integrally and closely covered and molded only by filling a transparent resin in the heat conductive member and curing the resin. Further, by selecting the shape of the heat conductive member, the illumination section having a desired shape can be formed.

Since the heat conductive member is provided with the plurality of heat dissipating fins, the heat dissipating area of the heat sink can be increased, and the heat dissipating effect can be improved.

The wire is connected to a substrate on which the light emitting diode is mounted, the substrate is set in a mold, a synthetic resin material is filled in the mold, and molding is performed, so that the wire, the substrate, and the light emitting diode are integrally covered with the synthetic resin material in close contact, the wire, the substrate, and the light emitting diode can be tightly covered with the synthetic resin material in close contact, and the wire, the substrate, and the light emitting diode can be integrally molded, and the lighting fixture can obtain complete waterproofness. Further, since the light emitting diode, the substrate on which the light emitting diode is mounted, and the light emitting diode are covered with the synthetic resin material closely, sufficient durability can be obtained. Further, since there is no gap between the parts, pressure resistance can be obtained that can be used without worrying about water intrusion, damage or deformation due to water pressure even in a pool, sea, or the like.

The wire, the substrate and the light emitting diode can be tightly covered and integrally molded by connecting the wire to the substrate on which the light emitting diode is mounted, placing the wire in a mold, filling a synthetic resin material, and injection molding, and integrally covering the wire, the substrate and the light emitting diode with the synthetic resin material in a tight contact manner, and the lighting fixture can obtain complete waterproofness. Further, since the light emitting diode, the substrate on which the light emitting diode is mounted, and the light emitting diode are covered with the synthetic resin material closely, sufficient durability can be obtained. Further, since there is no gap between the parts, pressure resistance can be obtained that can be used without worrying about water intrusion, damage or deformation due to water pressure even in a pool, sea, or the like. Further, by injection molding, the molding can be performed at once, the manufacturing process is easy, and uniform durability can be obtained.

The heat can be dissipated even when the substrate or the like generates heat by connecting an electric wire to the substrate on which the light emitting diode is mounted, disposing a heat conductive member of a bowl-shaped body or a box-shaped body outside the substrate on which the light emitting diode is mounted, filling a molten synthetic resin material in the heat conductive member, and solidifying the synthetic resin material to integrally cover the electric wire, the substrate, and the light emitting diode in close contact with each other. Further, the connection portion between the electric wire and the substrate on which the light emitting diode is mounted, and the light emitting diode can be molded by closely and integrally covering them in close contact with each other only by filling the heat conductive member of the bowl-shaped body or the box-shaped body with the molten translucent resin material and curing the resin material.

The wire, the substrate, and the light emitting diode can be tightly and integrally molded and the light transmitting resin material can be molded into the illumination section of a desired shape by connecting the wire to the substrate on which the light emitting diode is mounted, immersing the connection portion of the wire and the substrate and the light emitting diode in a cap filled with a molten synthetic resin material, and curing the synthetic resin material, thereby integrally covering the connection portion of the wire and the substrate and the light emitting diode in close contact with each other, and merely fitting the cap filled with the light transmitting resin material and filling the light transmitting resin material between the respective components to cure the cap. Further, by using the cap, a special die is not required, and the lighting fixture can be manufactured easily and inexpensively.

Drawings

Fig. 1 is a perspective view showing a lighting fixture according to a first embodiment of the present invention.

Fig. 2 is a partial cross-sectional view of the lighting fixture shown in fig. 1.

Fig. 3 is a diagram showing a configuration of an LED circuit of the lighting apparatus shown in fig. 1.

Fig. 4 is a partial sectional view showing a lighting fixture according to a second embodiment of the present invention.

Fig. 5 is a partial sectional view showing a lighting fixture according to a third embodiment of the present invention.

Fig. 6 is a partial sectional view showing a lighting fixture according to a fourth embodiment of the present invention.

Fig. 7 is a partial sectional view showing a lighting fixture according to a fifth embodiment of the present invention.

Fig. 8 is a plan view of the lighting fixture shown in fig. 7.

Fig. 9 is a partial sectional view showing a lighting fixture according to a sixth embodiment of the present invention.

Fig. 10 is an exploded cross-sectional view illustrating a method of manufacturing a lighting fixture according to a first embodiment of the present invention.

Description of the reference symbols

11 Lighting apparatus main body

12 Lighting apparatus main body

13 Lighting apparatus body

14 Lighting apparatus main body

15 Lighting apparatus main body

16 Lighting apparatus main body

2 light-transmitting resin Material

21 illuminating part

22 attachment site

23 attachment site

24 light-transmitting resin material

25 light-transmitting resin Material

26 alumina beads

27 illuminating part

28 light emitting part

29 illumination part

3 base plate

31 light emitting diode

32 light emitting diode

33 light emitting diode

34 hole part

35 LED circuit

36 LED circuit

37 LED circuit

4 radiator

41 Heat radiation blade

42 radiator part

43 Heat dissipation blade

5 Cable

51 electric cable

52 electric wire

53 electric wire

54 electric wire

55 electric wire

56 electric cable

57 cable

58 cable

6 connection site

7 Cable bifurcation

8 radiator

9 Cap body

91 rectifier

92 plug

Detailed Description

Fig. 1 to 3 show a lighting fixture according to a first embodiment of the present invention. The lighting apparatus of the first embodiment includes a lighting apparatus body 11 and a cable 5, and the lighting apparatus body 1 is electrically connected to a power supply, not shown, via wires 52 and 53, a rectifier 91, a plug 92, a switch, not shown, and the like located inside the cable 5. In the present embodiment, the lighting apparatus main body 11 is disposed at the tip of the cable 51 branched from the main cable 56 connected to the power supply in the cable 5, but the lighting apparatus main body 11 may be directly connected to the main cable 56 covering the electric wires 54 and 55, and the form of branching of the cable 51 may be freely selected.

The lighting apparatus body 11 shown in fig. 1 to 3 is composed of a substrate 3 on which light emitting diodes 31, 32, and 33 as light emitting elements are mounted, a heat sink 4, and a lighting section 21, and electric wires 52 and 53 are connected to the substrate 3. In this lighting fixture, the light-transmitting resin material 2, which is a synthetic resin material, integrally covers the connection portions 22 and 23 of the wires 52 and 53 to the substrate 3 on which the light-emitting diodes 31, 32, and 33 are mounted, in close contact with the light-emitting diodes 31, 32, and 33, and the light-transmitting resin material 2 on the side on which the light-emitting diodes 31, 32, and 33 are mounted is formed into a convex lens shape to serve as the light-emitting portion 21.

As shown in fig. 3, light emitting diodes 31, 32, and 33 and LED circuits 35, 36, and 37 are mounted on the substrate 3, and power is supplied to the 3 light emitting diodes. Further, wires 52 and 53 are connected to the substrate 3, and the light emitting diodes 31, 32, and 33 are caused to emit light via the LED circuits 35, 36, and 37. Further, the substrate 3 is preferably a mesh substrate formed with holes 34, and the holes 34 allow the molten light-transmissive resin material 2 to flow freely. The number of light emitting diodes may be 1, 2, or 4 or more, and the configuration of the LED circuit is not limited to the above configuration.

The heat sink 4 is made of a member having good thermal conductivity such as metal, and is formed into a cylindrical body having a plurality of heat radiating fins 41 for improving heat radiation performance. The heat sink 4 is disposed outside the translucent resin material 2 on the side opposite to the side on which the light emitting diodes 31, 32, and 33 are mounted so as to be in contact with the substrate 3, and dissipates heat when the substrate 3 generates heat, thereby preventing the temperature of the lighting fixture body 11 from rising. The heat sink may be a cylindrical body without the heat radiating fins 41, or may have another structure suitable for heat radiation, such as a honeycomb structure, instead of the heat radiating fins 41. Further, if a sufficient heat radiation effect can be obtained only by the translucent resin material 2, the heat sink 4 is not necessarily required.

The wires 52 and 53 are electrically connected to the substrate 3, and portions closer to the power source than the connection portions 22 and 23 are covered with an insulating cable 51. The connection portion 6 between the cable 51 and the heat sink 4, the connection portion such as the cable branch portion 7, and the like are covered with an insulating member made of thermoplastic resin, and are formed to have flexibility. The material of the thermoplastic resin is preferably a material having good heat resistance, chemical resistance, electrical characteristics, dimensional stability, moldability, and flame retardancy, such as polyethylene terephthalate.

The light-transmitting resin material 2 is made of an insulating synthetic resin material, is transparent or translucent, or is a light-transmitting resin material mixed with a pigment of a desired color, and transmits light emitted from the light-emitting diodes 31, 32, and 33. The translucent resin material 2 covers the wires 52 and 53 in close contact with the connection portions 22 and 23 of the substrate 3 and the light emitting diodes 31, 32, and 33 integrally, and covers these components tightly without any gap. The light-transmitting resin material 2 on the side where the light-emitting diodes 31, 32, and 33 are mounted is formed into a convex lens shape to form the illumination portion 21, and light emitted from the light-emitting diodes 31, 32, and 33 is reflected inside the light-transmitting resin material 2 to be condensed, thereby brightly emitting light. The synthetic resin material on the side opposite to the side on which the light emitting diodes 31, 32, 33 are mounted may not necessarily have translucency.

Further, the translucent resin material 2 also functions as an adhesive for the heat sink 4, and the heat sink 4 is disposed in close contact with the outside of the translucent resin material 2 on the side opposite to the side on which the light emitting diodes 31, 32, and 33 are mounted. The light-transmitting resin material 2 is preferably a thermosetting resin having good light-transmitting properties such as a polyester resin, a polyurethane resin, an epoxy resin, or silicon. However, the translucent resin material may be a thermoplastic resin as long as the melting point is higher than the temperature at which the substrate 3 and the like generate heat.

One of the methods of manufacturing the lighting apparatus according to the first embodiment is as follows: the substrate 3 on which the light emitting diodes 31, 32, 33 are mounted and the connection portions between the substrate 3 and the electric wires 52, 53 are arranged in a mold, the mold is formed (mold) by filling the molten translucent resin material 2, the heat sink 4 is arranged around the mold, the translucent resin material 2 is cured, the members are integrally covered with each other in close contact, and the light emitting portion 21 is formed. Further, the translucent resin material 2 may be filled at least on the side where the light emitting diodes 31, 32, 33 are mounted, or the non-translucent resin material may be filled on the side opposite to the side where the light emitting diodes 31, 32, 33 are mounted and molded.

Other manufacturing methods include the following methods: the substrate 3 on which the light emitting diodes 31, 32, 33 are mounted and the connection portions between the substrate 3 and the wires 52, 53 are disposed in the mold, and the heat sink 4 is disposed around the substrate, and these are injection-molded with the translucent resin material 2. The members are integrally covered by close contact, and the illumination section is formed. Further, the translucent resin material 2 may be filled on the side where at least the light emitting diodes 31, 32, 33 are mounted, or the non-translucent resin material may be filled on the side opposite to the side where the light emitting diodes 31, 32, 33 are mounted and injection molded.

In another manufacturing method, as shown in fig. 10, electric wires 52 and 53 are connected to a substrate 3 on which light emitting diodes 31, 32 and 33 are mounted, and the cap body 9 is fixed in a state in which the light emitting diodes 31, 32 and 33, and connection portions 22 and 23 between the substrate 3 and the electric wires 52 and 53 are immersed in the convex lens-shaped cap body 9 filled with the molten translucent resin material 2, and the translucent resin material 2 is cured to integrally mold the members in close contact with each other, thereby molding the illumination portion 21. Further, the cap body 9 can be taken out after the light-transmissive resin material 2 is cured, and can be repeatedly used.

Fig. 4 shows a lighting fixture according to a second embodiment of the present invention. In the lighting apparatus of the second embodiment, not only the connection portions 22 and 23 of the electric wires 52 and 53 with the substrate 3 are integrally covered with the translucent resin material 2 in close contact with each other, but also all of the electric wires 52 and 53, the substrate 3 on which the light emitting diodes 31, 32, and 33 are mounted, the light emitting diodes 31, 32, and 33, and the light emitting portion 21 are integrally covered with the translucent resin material 2 in close contact with each other. That is, the translucent resin material 24 positioned around the wires 52, 53 forms the cable 57. The synthetic resin material covering the wires 52 and 53 may not necessarily have translucency.

The lighting apparatus is composed of a lighting apparatus main body 12 and a cable 57, and the lighting apparatus main body 12 is electrically connected to a power supply, not shown, via wires 52 and 53, a rectifier 91, a plug 92, a switch, not shown, and the like located inside the cable 57. In the present embodiment, the lighting apparatus main body 1 is disposed at the tip of the cable 57 branched from the main cable 56 connected to the power supply, but the lighting apparatus 12 may be directly connected to the main cable 56, and the form of branching of the cable 57 may be freely selected.

As shown in fig. 4, the lighting apparatus body 12 is composed of a substrate 3 on which light emitting diodes 31, 32, 33 as light emitting elements are mounted, a heat sink 4, and an illumination section 21, and electric wires 52, 53 are connected to the substrate 3. The light-transmitting resin material 2 for a lighting device is a lighting device in which the wires 52 and 53, the substrate 3 on which the light-emitting diodes 31, 32, and 33 are mounted, and the light-emitting diodes 31, 32, and 33 are integrally covered in close contact with each other, the light-transmitting resin material 2 on the side on which the light-emitting diodes 31, 32, and 33 are mounted is used as the light-emitting section 21, and all of the cables 57 extending from the light-emitting section 21 to the light-transmitting resin material 24 covering the wires 52 and 53 are integrally molded with the light-transmitting resin material 2. Further, the main cable 56 may be integrally formed.

The structures and shapes of the substrate 3 and the heat sink 4 are the same as those of the first embodiment, and therefore, are omitted.

The translucent resin material 2 is made of an insulating thermosetting resin material, is a translucent resin material in which a pigment of a desired color is mixed, is transparent or translucent, and is formed of a material that transmits light emitted from the light emitting diodes 31, 32, and 33. The translucent resin material 2 covers the wires 52 and 53, the substrate 3, and the light emitting diodes 31, 32, and 33 in an integrated manner, and covers these components tightly without any gap. The light-transmitting resin material 2 on the side where the light-emitting diodes 31, 32, and 33 are mounted is formed into a convex lens shape to form the illumination portion 21, and light emitted from the light-emitting diodes 31, 32, and 33 is reflected inside the light-transmitting resin material 2 to be condensed, thereby brightly emitting light. The synthetic resin material on the side opposite to the side on which the light emitting diodes 31, 32, 33 are mounted may not necessarily have translucency.

Further, the translucent resin material 2 also functions as an adhesive for the heat sink 4, and the heat sink 4 is disposed in close contact with the outside of the translucent resin material 2 on the side opposite to the side on which the light emitting diodes 31, 32, and 33 are mounted. The light-transmitting resin material 2 is preferably a material having good light-transmitting properties such as a polyester resin, a polyurethane resin, an epoxy resin, or silicon. However, the translucent resin material may be a thermoplastic resin as long as the melting point is higher than the temperature at which the substrate 3 and the like generate heat.

One of the methods of manufacturing the lighting apparatus according to the second embodiment is as follows: a substrate 3 on which light emitting diodes 31, 32, 33 are mounted, wires 52, 53 connected to the substrate 3, and a heat sink 4 are disposed around the substrate 3, and the light transmitting resin material 2 is cured to integrally adhere the members to each other, thereby forming a light emitting section 21. Further, the translucent resin material 2 may be filled at least on the side where the light emitting diodes 31, 32, 33 are mounted, or the non-translucent resin material may be filled on the side opposite to the side where the light emitting diodes 31, 32, 33 are mounted and molded.

Other manufacturing methods include the following methods: the substrate 3 on which the light emitting diodes 31, 32, 33 are mounted and the wires 52, 53 connected to the substrate 3 are arranged in the mold, and they are injection-molded with the translucent resin material 2, whereby the members are integrally adhered to each other, and the illumination section 21 is formed. Further, the translucent resin material 2 may be filled at least on the side where the light emitting diodes 31, 32, 33 are mounted, or the non-translucent resin material may be filled on the side opposite to the side where the light emitting diodes 31, 32, 33 are mounted and molded.

Fig. 5 shows a lighting fixture according to a third embodiment of the present invention. The lighting apparatus of the third embodiment is formed by integrally closely covering the wires 52 and 54, the substrate 3 on which the light emitting diodes 31, 32, and 33 are mounted, the light emitting diodes 31, 32, and 33, the illumination portion 21, and the heat sink portion 42 with the translucent resin material 2.

The lighting apparatus is composed of a lighting apparatus main body 13 and a cable 5, and the lighting apparatus main body 13 is electrically connected to a power supply, not shown, via electric wires 52 and 53, a rectifier 91, a plug 92, and the like positioned inside the cable 5. In the present embodiment, the lighting apparatus main body 1 is disposed at the tip of the cable 51 branched from the main cable 56 connected to the power supply, but the lighting apparatus 12 may be directly connected to the main cable 56, and the form of branching of the cable 51 may be freely selected.

As shown in fig. 5, the lighting apparatus body 13 is composed of a substrate 3 on which light emitting diodes 31, 32, and 33 as light emitting elements are mounted, and a heat sink 4, and wires 52 and 53 are connected to the substrate 3. The wires 52 and 53, the substrate 3 on which the light emitting diodes 31, 32, and 33 are mounted, and the light emitting diodes 31, 32, and 33 are integrally covered with the translucent resin material 2 in close contact, and the translucent resin material 2 on the side on which the light emitting diodes 31, 32, and 33 are mounted is used as the light-emitting section 21, and the translucent resin material 2 on the side opposite to the side on which the light emitting diodes 31, 32, and 33 are mounted is used as the heat sink section 42.

The structure and shape of the substrate 3 are the same as those of the first embodiment, and therefore, are omitted. The wires 52 and 53 are electrically connected to the substrate 3 in an exposed state, the wires 52 and 53 are covered with the translucent resin material 2, and the translucent resin material 2 also functions as the heat sink 42.

The light-transmitting resin material 2 is made of an insulating thermosetting resin material, is a light-transmitting member that is transparent, translucent, or mixed with a pigment of a desired color, and is formed of a material that transmits light. The translucent resin material 2 covers the wires 52 and 53, the substrate 3, and the light emitting diodes 31, 32, and 33 in an integrated manner, and covers these components tightly without any gap.

The light-transmitting resin material 2 on the side where the light-emitting diodes 31, 32, and 33 are mounted is formed into a convex lens shape to form the illumination portion 21, and light emitted from the light-emitting diodes 31, 32, and 33 is reflected inside the light-transmitting resin material 2 to be condensed, thereby brightly emitting light. Further, the alumina beads 26 formed in a fine spherical shape as a heat conductive material are mixed into the translucent resin material 2 on the side opposite to the side on which the light emitting diodes 31, 32, 33 are mounted, and function as the heat sink portion 42. Thus, the wires 52 and 53, the substrate 3, the light emitting diodes 31, 32, and 33, the illumination section 21, and the heat sink section 42 are integrally molded with the translucent resin material 2.

The heat sink 42 is formed in a shape having a plurality of heat radiating fins 43 for improving heat radiation by mixing the alumina beads 26 into the translucent resin material 2 as described above. When the substrate 3 generates heat, heat is radiated to prevent the temperature of the lighting fixture body 13 from rising. The heat sink may not have the heat radiating fins 43, and may have another structure suitable for heat radiation, such as a honeycomb structure, instead of the heat radiating fins 43. The kind of the thermal conductive material is not limited to alumina, and may be other thermal conductive materials such as ceramic and metal. The shape is not limited to spherical, and may be powdery or granular.

The light-transmitting resin material 2 is preferably a material having good light-transmitting properties such as a polyester resin, a polyurethane resin, an epoxy resin, and silicon. However, the translucent resin material may be a thermoplastic resin as long as the melting point is higher than the temperature at which the substrate 3 and the like generate heat.

One of the methods of manufacturing the lighting apparatus according to the third embodiment is as follows: the substrate 3 on which the light emitting diodes 31, 32, 33 are mounted and the connecting portions between the substrate 3 and the electric wires 52, 53 are arranged in the mold, alumina powder is mixed into the portion where the heat sink portion 42 is formed, and these are molded with the light-transmitting resin material 2, whereby the respective members are integrally adhered to each other, and the light-emitting portion 21 and the heat sink portion 42 are formed.

Other manufacturing methods include the following methods: the substrate 3 on which the light emitting diodes 31, 32, 33 are mounted and the connection portions between the substrate 3 and the electric wires 52, 53 are arranged in the mold, alumina powder is mixed into the portion where the heat sink portion 42 is formed, and these are injection-molded with the translucent resin material 2, whereby the respective members are integrally adhered to each other, and the light-emitting portion 21 and the heat sink portion 42 are molded.

Fig. 6 shows a fourth embodiment of the illumination member of the present invention. In the lighting apparatus of the fourth embodiment, a bowl-shaped heat sink 8 is disposed around the wires 52 and 53, the substrate 3 on which the light emitting diodes 31, 32, and 33 are mounted, and the light emitting diodes 31, 32, and 33, and the heat sink 8 is filled with the translucent resin material 2 to integrally mold the respective components.

The lighting apparatus is composed of a lighting apparatus main body 14 and a cable 5, and the lighting apparatus main body 14 is connected to a power supply, not shown, via wires 52 and 53, a rectifier 91, a plug 92, a switch, not shown, and the like positioned inside the cable 51. In the present embodiment, the lighting apparatus main body 1 is disposed at the tip of the cable 51 branched from the main cable 56 connected to the power supply, but the lighting apparatus main body 14 may be directly connected to the main cable 56, and the form of branching of the cable 51 may be freely selected.

As shown in fig. 6, the lighting apparatus main body 14 includes a substrate 3 on which light emitting diodes 31, 32, and 33 as light emitting elements are mounted, and a bowl-shaped heat sink 8 disposed outside the substrate 3, and wires 52 and 53 are connected to the substrate 3 through the heat sink 8. The light-emitting portion 27 is formed by filling the translucent resin material 2 in the heat sink 8.

The heat sink 8 is made of a heat conductive member such as a metal, and has a function as a heat sink by passing the wires 52 and 53 through a hole formed in the bottom thereof, and a function as a container filled with the molten translucent resin material 2. The shape of the heat sink 8 is not limited to this, and may be a box shape or another shape.

The translucent resin material 2 is made of an insulating thermosetting resin material, is a translucent resin material in which a pigment of a desired color is mixed, is transparent or translucent, and is formed of a material that transmits light irradiated from the light emitting diodes 31, 32, and 33. The translucent resin material 2 is filled in the heat sink 8 in which the respective components are arranged, and the planar illumination portion 27 is formed by integrally closely covering the respective components.

One of the methods of manufacturing the lighting apparatus according to the fourth embodiment is as follows: the substrate 3 on which the light emitting diodes 31, 32, 33 are mounted and the connection portions between the substrate 3 and the wires 52, 53 are disposed in the heat sink 8, and the heat sink 8 is filled with the molten translucent resin material 2 and molded.

Fig. 7 and 8 show a fifth embodiment of the illumination member of the present invention. The lighting device of the fifth embodiment is a lighting device having a convex illumination portion 28, and a bowl-shaped heat sink 8 is disposed around the wires 52, 53, the substrate 3 on which the light emitting diodes 31, 32, 33 are mounted, and the light emitting diodes 31, 32, 33, and the heat sink 8 is filled with the translucent resin material 2 to integrally mold the respective components.

The lighting apparatus is composed of a lighting apparatus main body 15 and a cable 51, and the lighting apparatus main body 15 is electrically connected to a power supply, not shown, via wires 52 and 53, a rectifier 91, a plug 92, a switch, not shown, and the like located inside the cable 51. In the present embodiment, the lighting apparatus main body 1 is disposed at the tip of the cable 51 branched from the main cable 56 electrically connected to the power supply, but the lighting apparatus main body 15 may be directly connected to the main cable 56, and the form of branching of the cable 51 may be freely selected.

As shown in fig. 7, the lighting apparatus main body 15 includes a substrate 3 on which light emitting diodes 31, 32, and 33 as light emitting elements are mounted, and a bowl-shaped heat sink 8 disposed outside the substrate 3, and wires 52 and 53 are connected to the substrate 3 through the heat sink 8. The light-transmitting resin material 2 is filled in the heat sink 8, and the light-transmitting resin material 2 is protruded to form the light-emitting portion 28.

The heat sink 8 is made of a heat conductive member such as a metal formed in a bowl shape, and has a function as a heat sink by passing the wires 52 and 53 through a hole formed in the bottom thereof, and a function as a container filled with the molten translucent resin material 2. The shape of the heat sink 8 is not limited to this, and may be a box shape or another shape.

The light-transmitting resin material 2 is made of an insulating thermosetting resin material, is a light-transmitting resin material in which a pigment of a desired color is mixed, is transparent or translucent, and is formed of a material that transmits light. The translucent resin material 2 is filled into the heat sink 8 in which the respective components are arranged, and is provided in a protruding manner, and the respective components are integrally covered in close contact with each other to form a planar illumination portion 27. The projecting illuminating portion 28 has projections and depressions formed on the side surface as shown in fig. 8, and light irradiated from the light emitting diodes 31, 32, and 33 on the side surface is diffusely reflected, so that the illuminating portion 28 brightly emits light.

One of the manufacturing methods of the lighting fixture of the fifth embodiment is as follows: the substrate 3 on which the light emitting diodes 31, 32, 33 are mounted and the connection portions between the substrate 3 and the wires 52, 53 are disposed in the heat sink 8, and the heat sink 8 is filled with the molten translucent resin material 2, and the mold in which the convex portions assigned to the heat sink are formed is also filled with the translucent resin material 2, and the molding is performed.

Fig. 9 shows a sixth embodiment of the illumination member according to the present invention. The lighting fixture of the sixth embodiment is the simplest embodiment of the present invention, in which the wires 52 and 54, the substrate 3 on which the light emitting diodes 31, 32, and 33 are mounted, and the light emitting diodes 31, 32, and 33 are molded by integrally covering them with the translucent resin material 2 in close contact therewith.

The lighting fixture is composed of a lighting fixture main body 16 and a cable 58 which are integrally formed, and the lighting fixture main body 16 is electrically connected to a power supply, not shown, via electric wires 52 and 53, a rectifier 91, a plug 92, a switch, not shown, and the like which are located inside the cable 58. In the present embodiment, the lighting apparatus main body 16 is disposed at the tip of the cable 58 branched from the main cable 56 connected to the power supply, but the lighting apparatus main body 16 may be directly connected to the main cable 56, and the form of branching of the cable 58 may be freely selected.

As shown in fig. 9, the lighting apparatus main body 16 integrally covers the substrate 3 on which the light emitting diodes 31, 32, 33 as light emitting elements are mounted and the wires 52, 53 connected to the substrate 3 in close contact with each other, and forms the light transmitting resin material 2 on the side of the substrate 3 on which the light emitting diodes 31, 32, 33 are mounted in a spherical shape, and forms the light emitting portion 29 in a convex lens shape in front of the light emitting portion.

The light-transmitting resin material 2 is made of an insulating thermosetting resin material, is a light-transmitting material that is transparent or translucent or mixed with a pigment of a desired color, and is formed of a material that transmits light emitted from the light-emitting diodes 31, 32, and 33. The light-transmitting resin material 2 integrally covers the components in close contact with each other, and forms an illuminating section 29 in a spherical shape in which the front of the illuminating section is formed in a convex lens shape. The light emitted from the light emitting diodes 31, 32, and 33 is reflected in the light emitting section 29, and the light emitting section 29 emits light brightly.

One of the methods of manufacturing the lighting apparatus according to the sixth embodiment is as follows: the substrate 3 on which the light emitting diodes 31, 32, 33 are mounted, the substrate 3, and the wires 52, 53 are placed in a mold, and the mold is filled with the molten translucent resin material 2 and molded.

Other manufacturing methods include the following methods: the substrate 3 on which the light emitting diodes 31, 32, 33 are mounted, the substrate 3, and the wires 52, 53 are arranged in the mold, and these are injection-molded with the translucent resin material 2, whereby the respective members are integrally molded in close contact with each other.

In the present embodiment, various shapes of the light irradiation section are shown, but the shape of the light irradiation section is not limited to this, and it is needless to say that the light irradiation section may be formed in a desired shape corresponding to the application, such as a convex shape, a convex lens shape, or a spherical shape, or may be formed in a concave shape, a concave lens shape, or the like.

In the present embodiment, the lighting apparatus main body is formed at the tip of the cable branched from the main cable, but the presence or absence of branching of the cable, the shape, and the number of connected cables are not limited to these.

Industrial applicability

The lighting fixture can be completely waterproof by connecting wires to a substrate on which light emitting diodes are mounted, and molding the wires, the substrate, and the light emitting diodes by integrally covering them in close contact with a synthetic resin material. Further, since the light emitting diode, the substrate on which the light emitting diode is mounted, and the light emitting diode are covered with the synthetic resin material tightly, sufficient durability and impact resistance can be obtained. Further, since there is no gap between the parts, pressure resistance can be obtained which can be used even in a pool, sea, or the like without worrying about water intrusion and damage or deformation due to water pressure. Therefore, it is possible to provide a lighting apparatus which can be used in a construction site, a vinyl house, a chicken house, a pool, or the sea without fear of damage or electric leakage.

Claims (13)

1. A lighting device is characterized in that a lamp body is provided,

the wire is connected to a substrate on which the light emitting diode is mounted, and the wire, the substrate, and the light emitting diode are integrally covered with a synthetic resin material in close contact with each other and molded.

2. The lighting apparatus of claim 1,

the synthetic resin material on the light emitting diode mounting side of the substrate on which the light emitting diode is mounted is a translucent resin material, and the light emitting section is formed.

3. The lighting apparatus according to claim 1 or 2,

the light irradiation section is shaped in a planar shape, a convex lens shape, a concave lens shape, or a spherical shape.

4. The lighting device according to any one of claims 1 to 3,

the synthetic resin material is a thermosetting resin material.

5. The lighting device according to any one of claims 1 to 4,

the synthetic resin material is mixed with a heat conductive material.

6. The lighting device according to any one of claims 1 to 5,

the thermally conductive material is spherical alumina or ceramic.

7. The lighting device according to any one of claims 1 to 6,

a heat conductive member is disposed outside the synthetic resin material.

8. The lighting device according to any one of claims 1 to 7,

the heat conductive member is formed as a bowl, box or cylinder made of a heat conductive material.

9. The lighting device according to any one of claims 1 to 8,

the heat conductive member is provided with a plurality of heat dissipating fins.

10. A method of manufacturing a lighting device, characterized in that,

a wire is connected to a substrate on which a light emitting diode is mounted, the substrate is set in a mold, a synthetic resin material is filled in the mold, molding is performed, the wire, the substrate and the light emitting diode are integrally covered in close contact with each other by the synthetic resin material, and the synthetic resin material on the light emitting diode mounting side of the substrate is used as an illumination section.

11. A method of manufacturing a lighting device, characterized in that,

the wire is connected to a substrate on which the light emitting diode is mounted, the substrate is set in a mold, a synthetic resin material is filled in the mold, injection molding is performed, the wire, the substrate, and the light emitting diode are integrally covered in close contact, and the synthetic resin material on the light emitting diode mounting side of the substrate is used as an illumination section.

12. A method of manufacturing a lighting device, characterized in that,

a heat conductive member of a bowl-shaped body or a box-shaped body is arranged outside a substrate on which a light emitting diode is mounted, and a molten synthetic resin material is filled in the heat conductive member to solidify the synthetic resin material, so that the electric wire, the substrate, and the light emitting diode are integrally covered in close contact with each other, and the synthetic resin material on the light emitting diode mounting side of the substrate is used as an illumination portion.

13. A method of manufacturing a lighting device, characterized in that,

a wire is connected to a substrate on which a light emitting diode is mounted, and a connection portion between the wire and the substrate and the light emitting diode are immersed in a cap filled with a molten synthetic resin material, the synthetic resin material is cured, the wire, the substrate, and the light emitting diode are integrally covered with the synthetic resin material in close contact, and the synthetic resin material on the side where the light emitting diode is mounted is used as a light-emitting portion.