JP2020021754A - Multilayer electronic components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated electronic component capable of suppressing the occurrence of cracks in a prime field. SOLUTION: A laminated electronic component 1 is provided on a prime field 2 in which a plurality of insulator layers 10 are laminated, a first electrode layer E1 provided on the prime field 2, and a first electrode layer E1. The second electrode layer E2 and the first terminal electrode 4 having the second electrode layer E2 are provided. The prime field 2 includes a main surface 2a as a mounting surface, a main surface 2b facing the main surface 2a, a side surface 2e extending in the opposite direction of the main surface 2a and the main surface 2b, and a main surface 2a. It has a connecting portion 2g that connects to the side surface 2e. The first terminal electrode 4 is provided so as to straddle the main surface 2a, the connecting portion 2g, and the side surface 2e. The connecting portion 2g is located inside a virtual plane H1 connecting the main surface 2a and the side surface 2e. [Selection diagram] Fig. 2

Description

  One aspect of the present invention relates to a laminated electronic component.

  Patent Literature 1 describes a multilayer ceramic electronic component including a ceramic body in which a plurality of ceramic layers are stacked, and external electrodes. The external electrode has a sintered metal layer provided on the end face of the ceramic body, and a conductive resin layer provided on the sintered metal layer. In this ceramic electronic component, the ratio of glass contained in the material of the sintered metal layer to be deposited on the surface of the sintered metal layer is regulated, thereby suppressing the equalization series resistance.

JP 2015-46644 A

  When the above-mentioned ceramic electronic component is mounted on a substrate and used, a connection portion between the ceramic electronic component and the substrate has a stress corresponding to a change in environmental temperature or the like due to a difference in thermal expansion coefficient between the ceramic electronic component and the substrate. Works. In particular, at the ridge of the element body, the thickness of the external electrode tends to be thin, so that stress concentration tends to occur. For this reason, there is a possibility that a crack originating from the ridgeline portion of the element body may occur in the element body.

  One aspect of the present invention provides a laminated electronic component capable of suppressing generation of cracks in a body.

  A multilayer electronic component according to one aspect of the present invention includes a base body including a plurality of insulator layers stacked, a base electrode layer provided on the base body, and a conductive resin layer provided on the base electrode layer. And an electrode having a first body, a first main surface to be a mounting surface, a second main surface facing the first main surface, and a first main surface and a second main surface. It has a side surface extending in the opposite direction, and a connecting portion connecting the first main surface and the side surface, and the electrode is provided over the first main surface, the connecting portion and the side surface, The portion is located inside a virtual plane connecting the first main surface and the side surface.

  In this multilayer electronic component, the connection portion is located inside a virtual plane connecting the first main surface and the side surface. For this reason, the thickness of the electrode at the connection portion can be increased as compared with the case where the connection portion is located outside this virtual plane. This makes it difficult for the electrode to be thin even in the vicinity of the connection portion. Therefore, stress concentration on the connection portion and the vicinity thereof can be reduced. Therefore, generation of cracks in the element body can be suppressed.

  The thickness of the electrode at the connection portion may be greater than the thickness of the electrode at the side surface. In this case, stress concentration on the connection portion and its vicinity can be further reduced.

  The radius of curvature of the connecting portion may be larger than the radius of curvature of the end of the first main surface. In this case, an electrode can be easily formed at the connection portion.

  In the connection portion, the surface of the base electrode layer on the conductive resin layer side may have a shape along the connection portion. In this case, the thickness of the conductive resin layer at the connection portion can be increased.

  The thickness of the conductive resin layer in the connection part may be larger than the thickness of the base electrode layer in the connection part. Since the conductive resin layer is softer than the underlying metal layer, in this case, the thickness of the conductive resin layer at the connecting portion is closer to the connecting portion than when the thickness of the underlying electrode layer at the connecting portion is smaller. Stress concentration on the ridge portion and its vicinity can be further reduced.

  According to one aspect of the present invention, it is possible to provide a laminated electronic component capable of suppressing occurrence of cracks in a body.

FIG. 1 is a perspective view showing the multilayer electronic component according to the first embodiment. FIG. 2 is a sectional view of the laminated electronic component shown in FIG. FIG. 3 is a diagram illustrating an equivalent circuit of the multilayer electronic component according to the first embodiment. FIG. 4 is an exploded perspective view of the element body. FIG. 5 is a perspective view showing the configuration inside the body. FIG. 6 is a sectional view of a terminal electrode of the multilayer electronic component according to the second embodiment. FIG. 7 is a sectional view of a terminal electrode of the multilayer electronic component according to the third embodiment. FIG. 8 is a sectional view of a terminal electrode of the multilayer electronic component according to the fourth embodiment.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements will be denoted by the same reference symbols, without redundant description.

[First embodiment]
FIG. 1 is a perspective view showing the multilayer electronic component according to the first embodiment. As shown in FIG. 1, the laminated electronic component 1 includes a body 2, a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, a fourth terminal electrode 7, and a fifth terminal An electrode 8 and a sixth terminal electrode 9 are provided. The multilayer electronic component 1 is, for example, a multilayer filter in which a plurality of insulator layers are stacked. The multilayer electronic component 1 is a diplexer.

  FIG. 2 is a sectional view of the laminated electronic component shown in FIG. 2, illustration of a coil conductor, an internal conductor, and an internal electrode, which will be described later, is omitted. In FIG. 2, hatching is omitted. As shown in FIGS. 1 and 2, the element body 2 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which corners and ridges are chamfered, and a rectangular parallelepiped in which the corners and ridges are rounded. The element body 2 has, as outer surfaces thereof, a pair of main surfaces 2a and 2b, a pair of side surfaces 2c and 2d, a pair of side surfaces 2e and 2f, four connecting portions 2g, four ridge portions 2h, and four And two ridges 2i.

  The pair of main surfaces 2a and 2b face each other. The pair of side surfaces 2c and 2d extend so as to connect between the pair of main surfaces 2a and 2b, and face each other. The pair of side surfaces 2e and 2f extend to connect between the pair of main surfaces 2a and 2b, and face each other. The main surface 2a is defined as a surface (mounting surface) facing the other electronic device when the multilayer electronic component 1 is mounted on another electronic device (for example, a circuit board or an electronic component or the like) not shown. .

  The direction D1 in which the pair of main surfaces 2a, 2b face each other, the direction D2 in which the pair of side surfaces 2c, 2d face each other, and the direction D3 in which the pair of side surfaces 2e, 2f face each other, They are substantially orthogonal to each other. The length of the element body 2 in the direction D1 is, for example, 0.9 mm, the length of the element body 2 in the direction D2 is, for example, 2 mm, and the length of the element body 2 in the direction D3 is, for example, 1. 25 mm.

  Each connection part 2g connects the main surface 2a and each side surface 2c, 2d, 2e, 2f. Each ridge 2h is located between the main surface 2b and each of the side surfaces 2c, 2d, 2e, 2f. Each ridge 2i is located between the side surface 2c and the side surface 2e, between the side surface 2e and the side surface 2d, between the side surface 2d and the side surface 2f, and between the side surface 2f and the side surface 2c.

  A connection portion 2g between the main surface 2a and the side surface 2c extends along the direction D3. The connection portion 2g between the main surface 2a and the side surface 2d extends along the direction D3. A connection portion 2g between the main surface 2a and the side surface 2e extends along the direction D2. A connection portion 2g between the main surface 2a and the side surface 2f extends along the direction D2. These connection portions 2g extend along the outer edge of the main surface 2a and surround the entire periphery of the outer edge of the main surface 2a.

  Each connection portion 2g has a concave curved surface shape that is concave toward the inside of the element body 2. That is, each connection portion 2g is located inside a virtual plane H1 connecting the main surface 2a and the side surfaces 2c, 2d, 2e, 2f. The plane H1 is, specifically, the end 2j on the side surface 2c, 2d, 2e, 2f side of the main surface 2a (that is, the outer edge of the main surface 2a) and the main surface 2a of the side surface 2c, 2d, 2e, 2f. Side end 2k. The end 2j and the end 2k constitute a ridge line of the element body 2. The end 2j and the end 2k are rounded so as to be curved, and have a convex shape, similarly to the ridge 2h and the ridge 2i described later. The plane H1 is defined as a plane circumscribing each of the end 2j and the end 2k. The plane H1 connects the curved top of the end 2j and the curved top of the end 2k.

  The connecting portion 2g is a curved surface, and the radius of curvature of the connecting portion 2g is larger than the radius of curvature of the end 2j and the radius of curvature of the end 2k. The radius of curvature of the connection portion 2g is, for example, 30 μm. The radius of curvature of the end 2j is, for example, 15 μm. The radius of curvature of the end 2k is, for example, 15 μm. The height of the connection 2g (that is, the length of the connection 2g in the direction D1) is, for example, 100 μm. The width of the connection 2g is, for example, equal to the height of the connection 2g. The width of the connection portion 2g is the length of the connection portion 2g between the main surface 2a and the side surfaces 2c and 2d in the direction D2 of the connection portion 2g, and the width between the main surface 2a and the side surfaces 2e and 2f. About the connection part 2g, it is the length of the direction D3 of the connection part 2g.

  The ridge 2h between the main surface 2b and the side surface 2c extends along the direction D3. The ridge 2h between the main surface 2b and the side surface 2d extends along the direction D3. The ridge 2h between the main surface 2b and the side surface 2e extends along the direction D2. The ridge 2h between the main surface 2b and the side surface 2f extends along the direction D2. Each ridge 2h has a convex shape protruding outside the element body 2. That is, each ridge line portion 2h is located outside the virtual plane H2 connecting the main surface 2b and the side surfaces 2c, 2d, 2e, 2f. The plane H2 is, specifically, an end 2m (ie, an outer edge) on the side surface 2c, 2d, 2e, 2f side of the main surface 2b, and an end portion on the main surface 2b side of the side surface 2c, 2d, 2e, 2f. 2n.

  Each ridge 2i extends along the direction D1. Each ridge 2i has a convex shape protruding outside the element body 2 similarly to each ridge 2h. The ridge portions 2h and 2i are rounded so as to be curved by performing so-called R chamfering on the element body 2.

The element body 2 is configured by stacking a plurality of insulator layers 10 (see FIG. 4). Each insulator layer 10 is stacked in the direction D1. That is, the laminating direction of each insulator layer 10 matches the direction D1. Each insulator layer 10 has a substantially rectangular shape in plan view. In the actual element body 2, the insulator layers 10 are integrated so that the boundaries between the layers are not visible. Each insulator layer 10 is made of a ceramic containing, for example, a dielectric material (BaTiO ₃ material, Ba (Ti, Zr) O ₃ material, (Ba, Ca) TiO ₃ material, glass material, alumina material, or the like). It is composed of a green sheet sintered body.

  Each of the terminal electrodes 4 to 6 is arranged on the side surface 2 e of the element body 2. Each of the terminal electrodes 4 to 6 is formed so as to cover a part of the side surface 2 e along the stacking direction of the element body 2. Each of the terminal electrodes 4 to 6 is also formed on a part of the main surface 2a, a part of the main surface 2b, a part of the connection part 2g, and a part of the ridge line part 2h. Each of the terminal electrodes 4 to 6 is provided so as to continuously cover a part of the side surface 2e, a part of the main surface 2a, a part of the main surface 2b, a part of the connection part 2g, and a part of the ridge part 2h. Have been. In other words, each of the terminal electrodes 4 to 6 is provided over a part of the side surface 2e, a part of the main surface 2a, a part of the main surface 2b, a part of the connection part 2g, and a part of the ridge part 2h. ing. Each of the terminal electrodes 4 to 6 has a substantially U shape when viewed from the direction D2.

  In the body 2, the second terminal electrode 5 is located at the center in the direction D2, the first terminal electrode 4 is located closer to the side surface 2c than the second terminal electrode 5, and the third terminal electrode 6 is located It is located on the side surface 2 d side of the two-terminal electrode 5. In the present embodiment, the terminal electrodes 4 to 6 are provided only on the side surface 2e and the main surfaces 2a and 2b. The terminal electrodes 4 to 6 are not provided on the side surfaces 2c, 2d, and 2f, but are provided separately from the side surfaces 2c, 2d, and 2f. The side surfaces 2c, 2d, and 2f are not covered with the terminal electrodes 4 to 6, but are exposed from the terminal electrodes 4 to 6.

  Each of the terminal electrodes 7 to 9 is arranged on the side surface 2 f of the element body 2. Each of the terminal electrodes 7 to 9 is formed so as to cover a part of the side surface 2 f along the stacking direction of the element body 2. Each of the terminal electrodes 7 to 9 is also formed on a part of the main surface 2a, a part of the main surface 2b, a part of the connection part 2g, and a part of the ridge part 2h. Each of the terminal electrodes 7 to 9 is provided so as to continuously cover a part of the side surface 2f, a part of the main surface 2a, a part of the main surface 2b, a part of the connecting part 2g, and a part of the ridge part 2h. Have been. In other words, each of the terminal electrodes 7 to 9 is provided over a part of the side surface 2f, a part of the main surface 2a, a part of the main surface 2b, a part of the connection part 2g, and a part of the ridge line part 2h. ing. Each of the terminal electrodes 7 to 9 has a substantially U shape when viewed from the direction D2.

  In the body 2, the fifth terminal electrode 8 is located at the center in the direction D2, the fourth terminal electrode 7 is located closer to the side surface 2c than the fifth terminal electrode 8, and the sixth terminal electrode 9 is It is located on the side surface 2 d side of the five terminal electrodes 8. In the present embodiment, the terminal electrodes 7 to 9 are provided only on the side surface 2f and the main surfaces 2a and 2b. The terminal electrodes 7 to 9 are not provided on the side surfaces 2c, 2d, and 2e, but are provided separately from the side surfaces 2c, 2d, and 2e. The side surfaces 2c, 2d, and 2e are not covered with the terminal electrodes 7 to 9, but are exposed from the terminal electrodes 7 to 9.

  FIG. 2 shows a cross-sectional view of the first terminal electrode 4 as an example, but each of the terminal electrodes 4 to 9 has, for example, the same shape as each other. The width (the length of the direction D2) of each of the terminal electrodes 4 to 9 is, for example, about 15 to 20% of the length of the element body 2 in the direction D2. Each of the terminal electrodes 4 to 9 has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4.

  The first electrode layer E1 is provided on the element body 2. The first electrode layer E1 includes a part of the main surface 2a, a part of the side surface 2e or the side surface 2f, a part of the main surface 2b, a part of the connection part 2g, and a part of the ridge part 2h. It is provided on these so as to cover continuously. The first electrode layer E1 is formed, for example, by baking a conductive paste applied to the outer surface of the element body 2. The first electrode layer E1 is a sintered metal layer formed by sintering a metal component (metal powder) contained in the conductive paste. As the metal component, for example, Ag, Au, Cu, and an Ag / Pd alloy are used. The conductive paste contains, for example, a metal component, a glass component, an organic binder, and an organic solvent. The first electrode layer E1 is a base metal layer for forming the second electrode layer E2.

  The conductive paste is applied by, for example, screen printing. The screen printing is performed on each of the main surface 2a, the side surface 2e, and the side surface 2f, for example. Since the conductive paste wraps around the main surface 2b from the side surfaces 2e and 2f, the conductive paste is also applied to the main surface 2b and the ridge portion 2h. According to such wraparound, the conductive paste is also applied to the main surface 2a and the connection portion 2g. In addition, by further performing screen printing on the main surface 2a, the terminal electrodes 4 to 9 can be reliably formed on the main surface 2a and the connection portion 2g. Thereby, the mounting strength when the multilayer electronic component 1 is soldered to another electronic device is improved.

  The first electrode layer E1 includes an electrode portion E1a provided on the main surface 2a, an electrode portion E1b provided on the side surface 2e or 2f, an electrode portion E1c provided on the connection portion 2g, and a ridge portion. It has an electrode portion E1d provided on 2h and an electrode portion E1e provided on the main surface 2b.

  The second electrode layer E2 is provided on the first electrode layer E1 so as to cover the entire first electrode layer E1. The second electrode layer E2 is a conductive resin layer formed by curing the conductive resin provided on the first electrode layer E1. The conductive resin includes a resin (for example, a thermosetting resin), a conductive material (for example, metal powder), and an organic solvent. As the conductive material, for example, Ag is used. As the thermosetting resin, for example, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin is used. In the present embodiment, the electric conductivity of the second electrode layer E2 is lower than the electric conductivity of the first electrode layer E1. Further, the second electrode layer E2 is softer than the first electrode layer E1.

  The second electrode layer E2 includes an electrode portion E2a provided on the main surface 2a, an electrode portion E2b provided on the side surface 2e or 2f, an electrode portion E2c provided on the connection portion 2g, and a ridge portion. It has an electrode portion E2d provided on 2h and an electrode portion E2e provided on the main surface 2b.

  The third electrode layer E3 is provided on the second electrode layer E2 so as to cover the entire second electrode layer E2. The third electrode layer E3 is a plating layer formed on the second electrode layer E2 by a plating method. The third electrode layer E3 is a Ni plating layer formed by, for example, Ni plating. That is, the third electrode layer E3 contains Ni. The third electrode layer E3 may be a Sn plating layer, a Cu plating layer, or an Au plating layer. That is, the third electrode layer E3 may include Sn, Cu, or Au.

  The fourth electrode layer E4 is provided on the third electrode layer E3 so as to cover the entire third electrode layer E3. The fourth electrode layer E4 is a plating layer formed on the third electrode layer E3 by a plating method. The fourth electrode layer E4 is an Sn plating layer formed by, for example, Sn plating. That is, the fourth electrode layer E4 contains Sn. The fourth electrode layer E4 may be a Cu plating layer or an Au plating layer. That is, the fourth electrode layer E4 may include Cu or Au.

  As described above, each of the terminal electrodes 4 to 9 of the present embodiment has a multilayer structure including the first electrode layer E1, the second electrode layer E2, the third electrode layer E3, and the fourth electrode layer E4 (specifically, Typically, it has a four-layer structure). The plating layer formed on the second electrode layer E2 has a multilayer structure (specifically, a two-layer structure) including the third electrode layer E3 and the fourth electrode layer E4. Each of the terminal electrodes 4 to 9 may not have the third electrode layer E3 and the fourth electrode layer E4.

  In the connection portion 2g, the surface P1 of the first electrode layer E1 has a shape along the connection portion 2g, the surface P2 of the second electrode layer E2 has a shape along the plane H1, and the surface P1 of the third electrode layer E3 has a shape along the plane H1. The surface has a shape along the plane H1, and the surface of the fourth electrode layer E4 has a shape along the plane H1. In this embodiment, since the surface of the fourth electrode layer E4 forms the surface of each of the terminal electrodes 4 to 9, the surface of each of the terminal electrodes 4 to 9 has a shape along the plane H1 in the connection portion 2g. are doing.

  The thickness of each terminal electrode 4-9 is defined by the length of each terminal electrode 4-9 in a direction perpendicular to the surface of each terminal electrode 4-9. Therefore, the thickness t1 of each of the terminal electrodes 4 to 9 in the connection portion 2g is defined by the length of each of the terminal electrodes 4 to 9 in a direction perpendicular to the plane H1. The thickness t1 increases as the distance from the end 2j and the end 2k increases. The minimum value of the thickness t1 is larger than the thickness t2 of each of the terminal electrodes 4 to 9 on the side surface 2e or the side surface 2f. The maximum value of the thickness t1 is, for example, not less than 80 μm and not more than 130 μm. The thickness t2 is substantially constant, for example, not less than 30 μm and not more than 80 μm.

  The thickness of each of the electrode layers E1 to E4 is defined by the length of each of the electrode layers E1 to E4 in a direction perpendicular to the surface of each of the electrode layers E1 to E4. Accordingly, the thickness t3 of the first electrode layer E1 at the connection portion 2g (the thickness of the electrode portion E1c) is equal to the thickness t5 of the first electrode layer E1 at the side surface 2e or the side surface 2f (the thickness of the electrode portion E1b). It is. The thickness t3 and the thickness t5 are substantially constant, for example, not less than 10 μm and not more than 30 μm. The thickness t3 and the thickness t5 can be, for example, 20 μm.

  The thickness t4 (the thickness of the electrode portion E2c) of the second electrode layer E2 in the connection portion 2g is defined by the length of the second electrode layer E2 in a direction perpendicular to the plane H1. The thickness t4 increases as the distance from the end 2j and the end 2k increases. The minimum value of the thickness t4 is larger than the thickness t6 (the thickness of the electrode portion E2b) of the second electrode layer E2 on the side surface 2e or the side surface 2f. The maximum value of the thickness t4 is, for example, not less than 50 μm and not more than 100 μm. The thickness t6 is substantially constant, for example, not less than 10 μm and not more than 30 μm. The thickness t6 can be set to, for example, 20 μm. The thickness t4 is greater than the thickness t3. The thickness t6 may be thicker than the thickness t5.

Subsequently, after describing the circuit configuration of the multilayer electronic component 1, the internal configuration of the multilayer electronic component 1 will be described. As shown in FIG. 3, the laminated electronic component 1 includes an input terminal T _{IN to} which a signal is input, a first output terminal T _{OUT1 to} which a signal is output, and a second output terminal T _OUT2 to which a signal is output. , a first filter _{F 1} provided in line S1, which connects the input terminal _{T iN} and the first output terminal _{T OUT1,} the second provided to the input terminal _{T iN} and the line S2 for connecting the second output terminal _{T OUT2} a filter _{F 2,} and a, and an open inductor _{L oPEN.}

The first filter _{F 1} includes a first LC resonant circuit RC1, a second LC resonant circuit RC2, the. The first LC resonance circuit RC1 and the second LC resonance circuit RC2 are connected in series. The first LC resonance circuit RC1 forms a high-pass filter. The first LC resonance circuit RC1 includes a first signal having a frequency in the first frequency band and a second signal having a frequency in a second frequency band higher than the first frequency band. Selectively pass the second signal. The first LC resonance circuit RC1 is configured to include an inductor L1 and three capacitors _{C1 1, C1 2, C1 3} . Capacitor C1 ₁ and the capacitor C1 ₃ are connected in series. Capacitor C1 ₂ is connected in parallel to the capacitor C1 ₁ and a capacitor C1 _3. Inductor L1 has one end is connected between the capacitor C1 ₁ and a capacitor C1 _3, the other end is connected to the ground terminal.

  The second LC resonance circuit RC2 forms a low-pass filter. The second LC resonance circuit RC2 selectively passes the first signal of the first signal and the second signal. The second LC resonance circuit RC2 includes an inductor L2 and a capacitor C2. The inductor L2 and the capacitor C2 are connected in parallel.

The second filter _{F 2} includes a third LC resonant circuit RC3, the fourth LC resonant circuit RC4, and a capacitor C, and. The third LC resonance circuit RC3 and the fourth LC resonance circuit RC4 are connected in series. The third LC resonance circuit RC3 and the fourth LC resonance circuit RC4 constitute a low-pass filter. The third LC resonance circuit RC3 includes an inductor L3 and a capacitor C3. The inductor L3 and the capacitor C3 are connected in parallel. The fourth LC resonance circuit RC4 includes an inductor L4 and a capacitor C4. The inductor L4 and the capacitor C4 are connected in parallel. One end of the capacitor C is connected between the third LC resonance circuit RC3 and the fourth LC resonance circuit RC4, and the other end is connected to the ground terminal G.

The open inductor L _OPEN has one end connected to the ground terminal G and the other end open.

The first terminal electrode 4 shown in FIG. 1 constitutes a ground terminal G. The second terminal electrode 5 constitutes the input terminal _TIN . The third terminal electrode 6 constitutes a ground terminal G. The fourth terminal electrode 7 forms a second output terminal T _OUT2 . The fifth terminal electrode 8 constitutes a ground terminal G. The sixth terminal electrode 9 constitutes a first output terminal T _OUT1 . A first filter _{F 1,} the second filter _{F 2,} open inductor _{L OPEN} is disposed inside the element body 2.

  4 and 5, the inductor L1 includes a coil conductor 12, a coil conductor 15, and a coil conductor 17. The inductor L1 is formed in a loop with the direction along the stacking direction as the axis. One end of the coil conductor 12 is connected to the fifth terminal electrode 8. One end of the coil conductor 17 is electrically connected to the internal electrodes 28 and 31 by through-hole conductors. The coil conductor 12 and the coil conductor 17 are formed including, for example, at least one of Ag and Pd as a conductive material. The coil conductor 12 and the coil conductor 17 are configured as a sintered body of a conductive paste containing at least one of Ag and Pd as a conductive material. In the following description, a coil conductor and an internal electrode are formed similarly.

Capacitor C1 ₁ includes an internal electrode 32, and the internal electrodes 34 are constituted by. The internal electrode 34 is connected to the second terminal electrode 5. Capacitor C1 ₂ includes an internal electrode 31, and the internal electrodes 34 are constituted by. Capacitor C1 ₃ includes an internal electrode 28, and the internal electrodes 32 are constituted by.

  The inductor L2 includes a coil conductor 13, a coil conductor 16, and a coil conductor 18. The inductor L2 is formed in a loop with the direction along the stacking direction as the axis. One end of the coil conductor 18 is electrically connected to the internal electrode 32 by a through-hole conductor. The capacitor C2 includes the internal electrode 32 and the internal electrode 35. The internal electrode 35 is connected to the sixth terminal electrode 9.

  The inductor L3 includes the coil conductor 11 and the coil conductor 14. The inductor L3 is formed in a loop with the direction along the stacking direction as the axis. One end of the coil conductor 11 is connected to the second terminal electrode 5. The capacitor C3 includes an internal electrode 26 and an internal electrode 27. The internal electrode 26 is connected to the second terminal electrode 5. The internal electrode 27 is electrically connected to the coil conductor 22 by a through-hole conductor.

  The inductor L4 includes a coil conductor 19 and a coil conductor 22. The inductor L4 is formed in a loop with the direction along the stacking direction as the axis. One end of the coil conductor 22 is electrically connected to one end of the coil conductor 14 by a through-hole conductor. The capacitor C4 includes the internal electrode 30, the internal electrode 27, and the internal electrode 33. The internal electrode 30 is connected to the fourth terminal electrode 7.

  The capacitor C includes the internal electrodes 29 and 36, and the internal electrodes 27 and 33. The internal electrode 29 is connected to the first terminal electrode 4. The internal electrode 36 is connected to the first terminal electrode 4 and the fifth terminal electrode 8.

The open inductor L _OPEN includes a coil conductor 20, a coil conductor 23, a coil conductor 24, and a coil conductor 25. The open inductor L _OPEN is formed in a loop shape with the direction along the stacking direction as the axis. One end of the coil conductor 20 is connected to the third terminal electrode 6. The open inductor L _OPEN is arranged at a position facing the inductor L2 of the second LC resonance circuit RC2. That is, the open inductor L _OPEN and the inductor L2 are adjacent to each other in the stacking direction. Specifically, the coil conductor 20 of the open inductor L _OPEN is arranged at a position facing the coil conductor 18 of the inductor L2 (overlapping in the stacking direction of the element body 2) with the insulator layer 10 interposed therebetween. .

[Second embodiment]
FIG. 6 is a sectional view of a terminal electrode of the multilayer electronic component according to the second embodiment. In FIG. 6, hatching is omitted. As shown in FIG. 6, the multilayer electronic component 1A according to the second embodiment mainly has a multilayer electronic component 1 (see FIG. 2) mainly in the configuration of the first electrode layer E1 and the second electrode layer E2 in the connection portion 2g. ). In the following, description will be made focusing on differences from the multilayer electronic component 1. In the connection portion 2g of the multilayer electronic component 1A according to the second embodiment, both the surface P1 of the first electrode layer E1 and the surface P2 of the second electrode layer E2 have a shape along the plane H1. For this reason, the thickness t3 of the first electrode layer E1 in the connection portion 2g increases as the distance from the end 2j and the end 2k increases. The thickness t4 of the second electrode layer E2 at the connection portion 2g is substantially constant. The thickness t3 is larger than the thickness t5 of the first electrode layer E1 on the side surface 2e or the side surface 2f. The maximum value of the thickness t3 is, for example, 50 μm or more and 100 μm. The maximum value of the thickness t3 is larger than the thickness t4. The thickness t4 is equal to the thickness t6 of the second electrode layer E2 on the side surface 2e or the side surface 2f, and is, for example, 10 μm or more and 30 μm or less. The thicknesses t1, t2, t5, and t6 are the same as in the case of the multilayer electronic component 1.

[Third embodiment]
FIG. 7 is a sectional view of a terminal electrode of the multilayer electronic component according to the third embodiment. In FIG. 7, hatching is omitted. As shown in FIG. 7, the multilayer electronic component 1B according to the third embodiment is different from the multilayer electronic component 1 (see FIG. 2) mainly in the shape of the connection portion 2g. In the following, description will be made focusing on differences from the multilayer electronic component 1. In the multilayer electronic component 1B according to the third embodiment, the height of the connection 2g is larger than the width of the connection 2g. The height of the connection portion 2g is, for example, 150 μm. The width of the connection portion 2g is, for example, 100 μm. In the connection portion 2g, the surface P1 of the first electrode layer E1 has a shape along the connection portion 2g, and the surface P2 of the second electrode layer E2 has a shape along the plane H1. The thickness t3 of the first electrode layer E1 at the connection 2g is substantially constant. The thickness t4 of the second electrode layer E2 in the connection portion 2g increases as the distance from the end 2j and the end 2k increases. The thickness t3 is equivalent to the thickness t5 of the first electrode layer E1 on the side surface 2e or the side surface 2f, and is, for example, 10 μm or more and 30 μm or less. The thickness t4 is larger than the thickness t6 of the second electrode layer E2 on the side surface 2e or the side surface 2f. The maximum value of the thickness t4 is, for example, 50 μm or more and 100 μm. The thickness t4 is greater than the thickness t3. The thicknesses t1, t2, t5, and t6 are the same as in the case of the multilayer electronic component 1.

[Fourth embodiment]
FIG. 8 is a sectional view of a terminal electrode of the multilayer electronic component according to the fourth embodiment. In FIG. 8, hatching is omitted. As shown in FIG. 8, the multilayer electronic component 1C according to the fourth embodiment mainly has a multilayer electronic component 1B (see FIG. 7) mainly in the configuration of the first electrode layer E1 and the second electrode layer E2 in the connection portion 2g. ). In the following, description will be made focusing on differences from the multilayer electronic component 1B. In the connection portion 2g of the multilayer electronic component 1C according to the fourth embodiment, both the surface P1 of the first electrode layer E1 and the surface P2 of the second electrode layer E2 have a shape along the plane H1. For this reason, the thickness t3 of the first electrode layer E1 in the connection portion 2g increases as the distance from the end 2j and the end 2k increases. The thickness t4 of the second electrode layer E2 at the connection portion 2g is substantially constant. The thickness t3 is larger than the thickness t5 of the first electrode layer E1 on the side surface 2e or the side surface 2f. The maximum value of the thickness t3 is, for example, 50 μm or more and 100 μm. The maximum value of the thickness t3 is larger than the thickness t4. The thickness t4 is equal to the thickness t6 of the second electrode layer E2 on the side surface 2e or the side surface 2f, and is, for example, not less than 10 μm and not more than 30 μm. The thicknesses t1, t2, t5, and t6 are the same as in the case of the multilayer electronic component 1B.

  As described above, in the multilayer electronic components 1, 1A, 1B, and 1C, the connection portion 2g is located inside the plane H1. Therefore, the thickness t1 of each of the terminal electrodes 4 to 9 in the connection portion 2g can be increased as compared with the case where the connection portion 2g is located outside the plane H1. This makes it difficult for the terminal electrodes 4 to 9 to be thinner at the end 2j and the end 2k adjacent to the connection 2g. Therefore, stress concentration on the connection portion 2g, the end 2j, and the end 2k can be reduced. Therefore, generation of cracks can be suppressed. In addition, since the concentration of stress on the connection portion 2g and the vicinity thereof is reduced, the separation of the terminal electrodes 4 to 9 can be suppressed.

  In the multilayer electronic components 1, 1A, 1B, and 1C, the thickness t1 of each of the terminal electrodes 4 to 9 at the connection portion 2g is greater than the thickness t2 of each of the terminal electrodes 4 to 9 at the side surface 2e or the side surface 2f. Therefore, stress concentration on the connection portion 2g and its vicinity can be further reduced.

  If the radius of curvature of the connection portion 2g is too small, there is a possibility that the conductive paste for forming the first electrode layer E1 is not applied to the depression of the connection portion 2g. In the multilayer electronic components 1, 1A, 1B, and 1C, the radius of curvature of the connection portion 2g is larger than the radius of curvature of the end 2j of the main surface 2a. For this reason, the conductive paste can be applied to the depressions in the connection portion 2g. Thereby, each of the terminal electrodes 4 to 9 can be easily formed.

  In the multilayer electronic components 1 and 1B, in the connection portion 2g, the surface P1 of the first electrode layer E1 has a shape along the connection portion 2g. Therefore, the thickness t4 of the second electrode layer E2 in the connection portion 2g can be increased. Since the second electrode layer E2, which is a conductive resin layer, is softer than the first electrode layer E1, which is a sintered metal layer, by increasing the thickness t4, stress concentration on the connection portion 2g and its vicinity can be further reduced. Can be eased.

  In the multilayer electronic components 1 and 1B, the thickness t4 of the second electrode layer E2 at the connection 2g is greater than the thickness t3 of the first electrode layer E1 at the connection 2g. As described above, since the second electrode layer E2, which is a conductive resin layer, is softer than the first electrode layer E1, which is a sintered metal layer, the connection is smaller than when the thickness t4 is smaller than the thickness t3. Stress concentration on the portion 2g and its vicinity can be further reduced.

  The present invention is not necessarily limited to the embodiment described above, and various modifications can be made without departing from the gist thereof.

  In the above embodiment, the diplexer is described as an example of the multilayer electronic component. However, the present invention is not limited to this example, and may be applied to a multilayer electronic component such as a capacitor, an inductor, a varistor, or a thermistor.

  In the above-described embodiment, the form in which the terminal electrodes 4 to 9 are arranged on the side surface 2e or the side surface 2f and the main surfaces 2a and 2b has been described as an example, but the shape (arrangement form) of each of the terminal electrodes 4 to 9 is different from this. Not limited.

  Each of the terminal electrodes 4 to 9 is provided over at least a part of the main surface 2a to be a mounting surface, a part of the connection part 2g, and a part of any one of the side surfaces 2c, 2d, 2e, and 2f. It should just be. For example, the terminal electrodes 4 to 9 are not provided on the main surface 2b, and may be provided separately from the main surface 2b. That is, the main surface 2b may not be covered with the terminal electrodes 4 to 9, but may be exposed from the terminal electrodes 4 to 9.

  In the above embodiment, the terminal electrodes 4 to 9 are provided so as to continuously cover three surfaces, but may be provided so as to continuously cover four or more surfaces. For example, a terminal provided such that the laminated electronic component 1 continuously covers five surfaces (for example, all of the side surface 2c or the side surface 2d, and a part of the main surface 2a, the main surface 2b, the side surface 2e, and the side surface 2f). An electrode may be provided. As in the above embodiment, each of the terminal electrodes 4 to 9 provided so as to continuously cover only three surfaces is smaller than the terminal electrodes provided so as to continuously cover four or more surfaces. Therefore, stress concentration on the connection portion 2g and the vicinity thereof is not easily reduced. Therefore, a configuration in which the connection portion 2g is located inside the plane H1 is effective in reducing stress concentration on the connection portion 2g and the vicinity thereof.

  In the above-described embodiment, the entirety of each connection portion 2g is located inside each plane H1, but at least a portion of each connection portion 2g where the terminal electrodes 4 to 9 are provided is inside each plane H1. And the portion where the terminal electrodes 4 to 9 are not provided may be located outside each plane H1. As in the above-described embodiment, by adopting a configuration in which the entirety of each connection portion 2g is located inside each plane H1, the connection portion 2g can be easily formed.

  Hereinafter, the present invention will be described more specifically with reference to Examples, but the present invention is not limited to the following Examples.

  As multilayer electronic components according to Examples 1 to 4, multilayer electronic components having configurations corresponding to multilayer electronic components 1, 1A, 1B, and 1C were created. The first electrode layer was formed as a sintered body of a conductive paste containing Ag. The thickness of the first electrode layer on the side surface was 16 μm, and the thickness of the second electrode layer on the side surface was 20 μm. In the case where the laminated electronic component according to each of the examples was solder-mounted on a substrate, a stress value applied to the first electrode layer according to a change in environmental temperature or the like was obtained by simulation. As a result, the stress applied to the first electrode layer at the connection portion was 87 MPa in Example 1, 94 MPa in Example 2, 116 MPa in Example 3, and 133 MPa in Example 4. The stress applied to the first electrode layer on the mounting surface was 78 MPa in Example 1, 96 MPa in Example 2, 91 MPa in Example 3, and 89 MPa in Example 4.

  1, 1A, 1B, 1C: laminated electronic component, 2: elementary body, 2a: main surface (first main surface), 2b: main surface (second main surface), 2c, 2d, 2e, 2f: side surface, 2g ... connecting parts, 2j, 2k end parts, 4 ... first terminal electrodes, 5 ... second terminal electrodes, 6 ... third terminal electrodes, 7 ... fourth terminal electrodes, 8 ... fifth terminal electrodes, 9 ... sixth Terminal electrodes, 10: insulator layer, E1: first electrode layer (base electrode layer), E2: second electrode layer (conductive resin layer), H1: plane, P1: surface.

Claims (5)

A body formed by laminating a plurality of insulator layers,
An electrode having a base electrode layer provided on the element body and a conductive resin layer provided on the base electrode layer,
The element body extends in a direction in which the first main surface to be a mounting surface, a second main surface facing the first main surface, and the first main surface and the second main surface are opposed to each other. A side surface, and a connecting portion connecting the first main surface and the side surface,
The electrode is provided over the first main surface, the connection portion and the side surface,
The multilayer electronic component, wherein the connection portion is located inside a virtual plane connecting the first main surface and the side surface.   2. The multilayer electronic component according to claim 1, wherein a thickness of the electrode at the connection portion is greater than a thickness of the electrode on the side surface. 3.   The multilayer electronic component according to claim 1, wherein a radius of curvature of the connection portion is larger than a radius of curvature of an end of the first main surface.   4. The multilayer electronic component according to claim 1, wherein in the connection portion, a surface of the base electrode layer on the conductive resin layer side has a shape along the connection portion. 5.   5. The multilayer electronic component according to claim 1, wherein a thickness of the conductive resin layer in the connection portion is larger than a thickness of the base electrode layer in the connection portion.

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