JP2018085443A - Electronic components - Google Patents

Abstract

An electronic component is provided in which peeling of a conductive resin layer is suppressed. A laminated common mode filter CF is arranged on the first main surface 1a so as to be in contact with the element body 1 having the first main surface 1a to be mounted. , and a resin film I having electrical insulation. The first and second external electrodes 11, 12 have electrode portions 11a, 12a arranged on the first main surface 1a. Electrode portions 11 a and 12 a each include a second electrode layer E 2 arranged on element body 1 . A second electrode layer E2 included in the electrode portions 11a and 12a is arranged on the resin film I so as to be in contact with the resin film I. As shown in FIG. [Selection drawing] Fig. 4

Description

  The present invention relates to an electronic component.

  An electronic component including an element body and an external electrode disposed on the surface of the element body is known (see, for example, Patent Document 1). In the electronic component described in Patent Document 1, the external electrode has a sintered metal layer disposed on the surface of the element body and a conductive resin layer disposed so as to cover the sintered metal layer. doing.

JP 2014-143387 A

  An object of one aspect of the present invention is to provide an electronic component in which peeling of a conductive resin layer is suppressed.

  As a result of our research, the following matters were found. The conductive resin layer is in contact with the element body. In the electronic component described in Patent Document 1, since the conductive resin layer is disposed so as to cover the sintered metal layer, the edge of the conductive resin layer is in contact with the element body. Since the conductive resin layer generally includes a conductive material (for example, metal powder) and a resin (for example, a thermosetting resin), the conductive resin layer adheres to the element body as compared with a resin that does not include the conductive material. Low strength.

  When the electronic component is mounted on the electronic device, an external force that acts on the electronic component from the electronic device may act as a stress on the external electrode. For example, when the electronic device is a substrate, the external force acts on the electronic component by bending the substrate. Since the stress acting on the external electrode tends to act on the portion of the external electrode that is disposed on the main surface, which is the mounting surface, the conductive resin layer included in the portion is removed from the element body. There is a risk of peeling.

  When the conductive resin layer peels from the element body, the mounting strength of the electronic component may be reduced. In addition, there is a possibility that the electrical characteristics of the electronic component may deteriorate due to moisture intrusion from between the element body and the conductive resin layer.

  An electronic component according to one aspect of the present invention includes an element body having a main surface as a mounting surface and a side surface adjacent to the main surface, and a first electrode portion disposed on the main surface. A first electrode comprising: an external electrode having a second electrode portion disposed on a side surface; and a resin film disposed on the main surface so as to be in contact with the main surface and having an electrical insulating property. The part and the second electrode part each include a conductive resin layer disposed on the element body, and the conductive resin layer included in the first electrode part is disposed on the resin film so as to be in contact with the resin film. Yes.

  In the electronic component according to one aspect of the present invention, the conductive resin layer included in the first electrode portion is in contact with the resin film in contact with the main surface of the element body. That is, the resin film is interposed between the conductive resin layer included in the first electrode portion and the main surface of the element body. Unlike the conductive resin layer, the resin film does not contain a conductive material and has high adhesive strength with the element body. Since the conductive resin layer contains a resin similarly to the resin film, the adhesive strength with the resin film is high. Therefore, according to this aspect, peeling of the conductive resin layer included in the first electrode portion hardly occurs.

  An inner conductor disposed in the element body and having an end exposed on the side surface is further provided, and the second electrode portion is connected to the end of the inner conductor and is disposed on the side surface so as to be in contact with the side surface. The conductive resin layer including the binder metal layer and included in the second electrode portion may be disposed on the element body via the sintered metal layer. In this case, the inner conductor is electrically connected to the conductive resin layer via the sintered metal layer. For this reason, in this embodiment, the connection strength between the internal conductor and the external electrode is high as compared with the configuration in which the internal conductor and the conductive resin layer are directly connected, and the internal conductor and the external electrode are reliably electrically connected. Connected to.

  The resin film may cover the edge of the sintered metal layer and may be in contact with the edge. In this case, since the end portion of the resin film is sandwiched between the sintered metal layer and the conductive resin layer, the resin film hardly peels off.

  The element body may further include a side surface facing the side surface, and a plurality of external electrodes may be arranged at both ends of the element body in a direction in which the pair of side surfaces oppose each other. When a plurality of external electrodes are arranged at both ends of the element body in the direction in which the pair of side surfaces face each other, the external electrodes are not formed so as to cover the entire side surface. The area must be small. Therefore, the area of the conductive resin layer is also reduced, and the adhesive strength of the conductive resin layer may be reduced. However, also in this embodiment, since the conductive resin layer included in the first electrode portion is in contact with the resin film in contact with the main surface of the element body, the conductive resin layer included in the first electrode portion. Is unlikely to occur.

  The resin film may be in contact with the conductive resin layer included in the first electrode portions of at least two adjacent external electrodes. In this case, the resin film can be easily formed.

  The resin film is provided for each external electrode, and may be in contact with the conductive resin layer included in the first electrode portion of the corresponding external electrode. In this case, the amount of resin used to form the resin film is reduced.

  According to one aspect of the present invention, it is possible to provide an electronic component in which peeling of the conductive resin layer is suppressed.

It is a perspective view which shows the lamination | stacking common mode filter which concerns on one Embodiment. It is a top view which shows the lamination | stacking common mode filter which concerns on this embodiment. It is a disassembled perspective view which shows the structure of an element body. It is a figure for demonstrating the cross-sectional structure of a 1st external electrode, a 2nd external electrode, and a resin film. It is a figure for demonstrating the cross-sectional structure of a 3rd external electrode, a 4th external electrode, and a resin film. It is a figure for demonstrating the mounting structure of the lamination | stacking common mode filter which concerns on this embodiment. It is a figure for demonstrating the mounting structure of the lamination | stacking common mode filter which concerns on this embodiment. It is a top view which shows the lamination | stacking common mode filter which concerns on the modification of this embodiment. It is a top view which shows the lamination | stacking common mode filter which concerns on the modification of this embodiment. It is a top view which shows the lamination | stacking common mode filter which concerns on the modification of this embodiment. It is a top view which shows the lamination | stacking common mode filter which concerns on the modification of this embodiment. It is a figure for demonstrating the cross-sectional structure of a 1st external electrode, a 2nd external electrode, and a resin layer. It is a figure for demonstrating the cross-sectional structure of a 3rd external electrode, a 4th external electrode, and a resin layer.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

  With reference to FIGS. 1-5, the structure of the lamination | stacking common mode filter CF which concerns on this embodiment is demonstrated. FIG. 1 is a perspective view showing a laminated common mode filter according to the present embodiment. FIG. 2 is a plan view showing the laminated common mode filter according to the present embodiment. FIG. 3 is an exploded perspective view showing the configuration of the element body. FIG. 4 is a diagram for explaining a cross-sectional configuration of the first external electrode, the second external electrode, and the resin film. FIG. 5 is a diagram for explaining a cross-sectional configuration of the third external electrode, the fourth external electrode, and the resin film. In the present embodiment, a laminated common mode filter CF will be described as an example of an electronic component.

  As shown in FIGS. 1 to 3, the laminated common mode filter CF includes an element body 1, a first external electrode 11, a second external electrode 12, and a third external electrode 13 disposed on the outer surface of the element body 1. , And a fourth external electrode 14. The laminated common mode filter CF includes an electronic device (for example, a circuit board or a circuit board) such that the first external electrode 11, the second external electrode 12, the third external electrode 13, and the fourth external electrode 14 are connected to the signal lines, respectively. Solder mounted on electronic components).

  The element body 1 has a rectangular parallelepiped shape. The element body 1 has, as its outer surfaces, a first main surface 1a and a second main surface 1b facing each other, a first side surface 1c and a second side surface 1d facing each other, and a first surface facing each other. It has three side surfaces 1e and a fourth side surface 1f. The direction in which the first main surface 1a and the second main surface 1b face each other is the first direction D1, and the direction in which the first side surface 1c and the second side surface 1d face each other is the second direction D2. A direction in which the third side surface 1e and the fourth side surface 1f are opposed to each other is a third direction D3. In the present embodiment, the first direction D1 is the height direction of the element body 1, the second direction D2 is the longitudinal direction of the element body 1, and the third direction D3 is the width direction of the element body 1. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which corners and ridge lines are chamfered and a rectangular parallelepiped shape in which corners and ridge lines are rounded.

  The first side surface 1c and the second side surface 1d extend in the first direction D1 so as to connect the first main surface 1a and the second main surface 1b. The first side surface 1c and the second side surface 1d are adjacent to the first main surface 1a and are also adjacent to the second main surface 1b. The first side surface 1c and the second side surface 1d also extend in the third direction D3 (the short side direction of the first main surface 1a and the second main surface 1b).

  The third side surface 1e and the fourth side surface 1f extend in the first direction D1 so as to connect the first main surface 1a and the second main surface 1b. The first side surface 1c and the second side surface 1d are adjacent to the first main surface 1a and are also adjacent to the second main surface 1b. The third side surface 1e and the fourth side surface 1f also extend in the second direction D2 (the long side direction of the first main surface 1a and the second main surface 1b).

  The element body 1 includes a nonmagnetic body portion 3 and a pair of magnetic body portions 5 arranged so as to sandwich the nonmagnetic body portion 3 in the first direction D1. The element body 1 is composed of a plurality of laminated insulator layers. In the nonmagnetic part 3, a plurality of nonmagnetic layers 4 are laminated as an insulator layer. That is, the nonmagnetic body portion 3 is constituted by a plurality of laminated nonmagnetic body layers 4. In each magnetic part 5, a plurality of magnetic layers 6 are laminated as an insulator layer. That is, the magnetic body portion 5 is composed of a plurality of laminated magnetic body layers 6. The plurality of insulator layers include a plurality of nonmagnetic layers 4 and a plurality of magnetic layers 6.

  Each nonmagnetic layer 4 is made of a sintered body of a ceramic green sheet containing, for example, a nonmagnetic material (such as a Cu—Zn ferrite material, a dielectric material, or a glass ceramic material). Each magnetic layer 6 is made of a sintered body of a ceramic green sheet containing, for example, a magnetic material (Ni—Cu—Zn ferrite material, Ni—Cu—Zn—Mg ferrite material, Ni—Cu ferrite material, etc.). Composed.

  In the actual element body 1, the nonmagnetic material layers 4 and the magnetic material layers 6 are integrated so that the boundary between the layers cannot be visually recognized. In the first direction D1, that is, the direction in which the first main surface 1a and the second main surface 1b are opposed to each other, a plurality of insulator layers, that is, a plurality of nonmagnetic layers 4 and a plurality of magnetic layers 6 are laminated. This corresponds to the direction (hereinafter simply referred to as “stacking direction”).

  As shown in FIG. 3, the multilayer common mode filter CF includes a first coil conductor 21, a second coil conductor 22, a third coil conductor 23, and a fourth coil conductor 24 in the nonmagnetic body portion 3. . The first coil conductor 21, the second coil conductor 22, the third coil conductor 23, and the fourth coil conductor 24 are internal conductors disposed in the element body 1. Each of the conductors 21 to 24 includes a conductive material (for example, Ag or Pd). Each of the conductors 21 to 24 is configured as a sintered body of a conductive paste containing a conductive material (for example, Ag powder or Pd powder).

  The first coil conductor 21 has a spiral shape and is disposed between a pair of nonmagnetic layers 4 adjacent to each other in the stacking direction. One end (outer end) 21a of the first coil conductor 21 is exposed on the first side face 1c. The other end (inner end) 21 b of the first coil conductor 21 is connected to a first pad conductor 41 located on the same layer as the first coil conductor 21. In the present embodiment, the first coil conductor 21 and the first pad conductor 41 are integrally formed.

  The second coil conductor 22 has a spiral shape and is disposed between a pair of nonmagnetic layers 4 adjacent in the stacking direction. One end (outer end) 22a of the second coil conductor 22 is exposed at the second side surface 1d. The other end (inner end) 22 b of the second coil conductor 22 is connected to a second pad conductor 42 located on the same layer as the second coil conductor 22. In the present embodiment, the second coil conductor 22 and the second pad conductor 42 are integrally formed.

  The third coil conductor 23 has a spiral shape and is disposed between a pair of nonmagnetic layers 4 adjacent in the stacking direction. One end (outer end) 23a of the third coil conductor 23 is exposed at the first side surface 1c. The other end (inner end) 23 b of the third coil conductor 23 is connected to a third pad conductor 43 located on the same layer as the third coil conductor 23. In the present embodiment, the third coil conductor 23 and the third pad conductor 43 are integrally formed.

  The fourth coil conductor 24 has a spiral shape and is disposed between a pair of nonmagnetic layers 4 adjacent in the stacking direction. One end (outer end) 24a of the fourth coil conductor 24 is exposed at the second side face 1d. The other end (inner end) 24 b of the fourth coil conductor 24 is connected to a fourth pad conductor 44 located in the same layer as the fourth coil conductor 24. In the present embodiment, the fourth coil conductor 24 and the fourth pad conductor 44 are integrally formed.

  The first coil conductor 21 and the third coil conductor 23 are adjacent to each other via the nonmagnetic layer 4 in the stacking direction, and the second coil conductor 22 and the fourth coil conductor 24 are stacked via the nonmagnetic layer 4. Next to each other in the direction. The third coil conductor 23 is located between the first coil conductor 21 and the second coil conductor 22 in the stacking direction. That is, the first to fourth coil conductors 21 to 24 are arranged in the order of the first coil conductor 21, the third coil conductor 23, the second coil conductor 22, and the fourth coil conductor 24 in the stacking direction. The first to fourth coil conductors 21 to 24 are wound in the same direction as viewed from the stacking direction and are positioned so as to overlap each other.

  The first pad conductor 41 and the second pad conductor 42 are positioned so as to overlap each other when viewed from the stacking direction. Between the first pad conductor 41 and the second pad conductor 42, a fifth pad conductor 45 located in the same layer as the third coil conductor 23 is seen from the stacking direction, and the first and second pad conductors 41, 42 and are arranged so as to overlap each other. That is, the first pad conductor 41 and the fifth pad conductor 45 are adjacent to each other through the nonmagnetic layer 4 in the stacking direction, and the fifth pad conductor 45 and the second pad conductor 42 are adjacent to each other in the stacking direction. 4 next to each other.

  The first pad conductor 41, the fifth pad conductor 45, and the second pad conductor 42 are connected via the first through-hole conductor 51, respectively. The first through-hole conductor 51 is a non-magnetic layer 4 positioned between the first pad conductor 41 and the fifth pad conductor 45 and a non-magnetic layer positioned between the fifth pad conductor 45 and the second pad conductor 42. And the magnetic layer 4.

  The third pad conductor 43 and the fourth pad conductor 44 are positioned so as to overlap each other when viewed from the stacking direction. Between the third pad conductor 43 and the fourth pad conductor 44, a sixth pad conductor 46 located in the same layer as the second coil conductor 22 is seen from the stacking direction, and the third and fourth pad conductors 43, 44 and are arranged so as to overlap each other. That is, the third pad conductor 43 and the sixth pad conductor 46 are adjacent to each other through the nonmagnetic layer 4 in the stacking direction, and the sixth pad conductor 46 and the fourth pad conductor 44 are nonmagnetic layers in the stacking direction. 4 next to each other.

  The third pad conductor 43, the sixth pad conductor 46, and the fourth pad conductor 44 are connected via the second through-hole conductor 52, respectively. The second through-hole conductor 52 is a nonmagnetic layer 4 positioned between the third pad conductor 43 and the sixth pad conductor 46 and a non-magnetic layer positioned between the sixth pad conductor 46 and the fourth pad conductor 44. And the magnetic layer 4.

  The first coil conductor 21 and the second coil conductor 22 are electrically connected through the first pad conductor 41, the fifth pad conductor 45, the second pad conductor 42, and the first through-hole conductor 51. The first coil conductor 21 and the second coil conductor 22 constitute a first coil C1. The third coil conductor 23 and the fourth coil conductor 24 are electrically connected through the third pad conductor 43, the sixth pad conductor 46, the fourth pad conductor 44, and the second through-hole conductor 52. The third coil conductor 23 and the fourth coil conductor 24 constitute a second coil C2.

  The laminated common mode filter CF includes a first coil C1 and a second coil C2 in the element body 1 (nonmagnetic body portion 3). In the first coil C1 and the second coil C2, the first coil conductor 21 and the third coil conductor 23 are adjacent to each other in the stacking direction, and the third coil conductor 23 and the second coil conductor 22 are adjacent to each other in the stacking direction. And the second coil conductor 22 and the fourth coil conductor 24 are arranged in the non-magnetic member 3 so as to be adjacent to each other in the stacking direction. The first coil C1 and the second coil C2 are magnetically coupled to each other.

  The fifth and sixth pad conductors 45 and 46 and the first and second through-hole conductors 51 and 52 include a conductive material (for example, Ag or Pd). The fifth and sixth pad conductors 45 and 46 and the first and second through-hole conductors 51 and 52 are configured as a sintered body of a conductive paste containing a conductive material (for example, Ag powder or Pd powder). . The first and second through-hole conductors 51 and 52 are formed by sintering a conductive paste filled in a through-hole formed in a ceramic green sheet that constitutes the corresponding nonmagnetic layer 4. The

  The first external electrode 11 and the third external electrode 13 are disposed on the first side surface 1 c side of the element body 1. That is, the first external electrode 11 and the third external electrode 13 are arranged at one end of the element body 1 in the second direction D2. The first external electrode 11 and the third external electrode 13 are disposed on the first side surface 1c so as to cover a part of the first side surface 1c along the first direction D1, and are provided on the first main surface 1a. It is arranged on the part and on a part of the second main surface 1b. The first external electrode 11 is located closer to the third side face 1e, and the third outer electrode 13 is located closer to the fourth side face 1f.

  The second external electrode 12 and the fourth external electrode 14 are disposed on the second side surface 1 d side of the element body 1. That is, the second external electrode 12 and the fourth external electrode 14 are disposed at the other end of the element body 1 in the second direction D2. The second external electrode 12 and the fourth external electrode 14 are disposed on the second side surface 1d so as to cover a part of the second side surface 1d along the first direction D1, and one of the first main surfaces 1a. It is arranged on the part and on a part of the second main surface 1b. The second external electrode 12 is located closer to the third side face 1e, and the fourth outer electrode 14 is located closer to the fourth side face 1f.

  As shown in FIG. 4, the first external electrode 11 includes an electrode part 11a disposed on the first main surface 1a, an electrode part 11b disposed on the second main surface 1b, and a first side surface 1c. It has the electrode part 11c arrange | positioned on the top. The first external electrode 11 is not disposed on the second side surface 1d, the third side surface 1e, and the fourth side surface 1f. That is, the first external electrode 11 is disposed only on the three surfaces 1a, 1b, and 1c. The adjacent electrode portions 11a, 11b, and 11c are connected at the ridge portion of the element body 1 and are electrically connected.

  The electrode portion 11 c covers all ends exposed at the first side surface 1 c of the first coil conductor 21. The first coil conductor 21 is connected to the electrode portion 11c at the end exposed at the first side surface 1c. That is, the first external electrode 11 and the first coil conductor 21 are electrically connected. One end 21 a of the first coil conductor 21 functions as a connection conductor with the first external electrode 11.

  As shown in FIG. 4, the second external electrode 12 includes an electrode portion 12a disposed on the first major surface 1a, an electrode portion 12b disposed on the second major surface 1b, and a second side surface 1d. It has the electrode part 12c arrange | positioned on the top. The second external electrode 12 is not disposed on the first side surface 1c, the third side surface 1e, and the fourth side surface 1f. That is, the first external electrode 11 is disposed only on the three surfaces 1a, 1b, and 1d. The adjacent electrode portions 12a, 12b, and 12c are connected at the ridge portion of the element body 1, and are electrically connected.

  The electrode portion 12 c covers all ends exposed at the second side surface 1 d of the second coil conductor 22. The second coil conductor 22 is connected to the electrode portion 12c at the end exposed at the second side surface 1d. That is, the second external electrode 12 and the second coil conductor 22 are electrically connected. One end 22 a of the second coil conductor 22 functions as a connection conductor with the second external electrode 12.

  As shown in FIG. 5, the third external electrode 13 includes an electrode portion 13a disposed on the first major surface 1a, an electrode portion 13b disposed on the second major surface 1b, and a first side surface 1c. It has the electrode part 13c arrange | positioned on the top. The third external electrode 13 is not disposed on the second side surface 1d, the third side surface 1e, and the fourth side surface 1f. That is, the first external electrode 11 is disposed only on the three surfaces 1a, 1b, and 1c. The adjacent electrode portions 13a, 13b, and 13c are connected at the ridge portion of the element body 1 and are electrically connected.

  The electrode portion 13 c covers all end portions exposed to the first side surface 1 c of the third coil conductor 23. The third coil conductor 23 is connected to the electrode portion 13c at the end exposed at the first side surface 1c. That is, the third external electrode 13 and the third coil conductor 23 are electrically connected. One end 23 a of the third coil conductor 23 functions as a connection conductor with the third external electrode 13.

  As shown in FIG. 5, the fourth external electrode 14 includes an electrode portion 14a disposed on the first major surface 1a, an electrode portion 14b disposed on the second major surface 1b, and a second side surface 1d. It has the electrode part 14c arrange | positioned on the top. The fourth external electrode 14 is not disposed on the first side surface 1c, the third side surface 1e, and the fourth side surface 1f. That is, the first external electrode 11 is disposed only on the three surfaces 1a, 1b, and 1d. The adjacent electrode portions 14a, 14b, and 14c are connected at the ridge portion of the element body 1 and are electrically connected.

  The electrode portion 14 c covers all ends exposed at the second side surface 1 d of the fourth coil conductor 24. The fourth coil conductor 24 is connected to the electrode portion 14c at the end exposed at the second side surface 1d. That is, the fourth external electrode 14 and the fourth coil conductor 24 are electrically connected. One end 24 a of the fourth coil conductor 24 functions as a connection conductor with the fourth external electrode 14.

  The first external electrode 11, the second external electrode 12, the third external electrode 13, and the fourth external electrode 14 are a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. Is included. In this embodiment, each electrode part 11c, 12c, 13c, 14c contains the 1st electrode layer E1, the 2nd electrode layer E2, the 3rd electrode layer E3, and the 4th electrode layer E4. Each electrode part 11a, 11b, 12a, 12b, 13a, 13b, 14a, 14b contains the 2nd electrode layer E2, the 3rd electrode layer E3, and the 4th electrode layer E4. That is, each electrode part 11a, 11b, 12a, 12b, 13a, 13b, 14a, 14b does not include the first electrode layer E1. The fourth electrode layer E4 constitutes the outermost layer of the first external electrode 11, the second external electrode 12, the third external electrode 13, and the fourth external electrode 14, respectively.

  The first electrode layer E1 is formed by applying and baking an electrically conductive paste on the surface of the element body 1 (first and second side surfaces 1c and 1d in this embodiment). The first electrode layer E1 is a sintered metal layer formed by sintering a metal component (metal powder) contained in the conductive paste. That is, the first electrode layer E1 is a sintered metal layer disposed on the element body 1.

  The first electrode layer E1 is included in the electrode portions 11c, 12c, 13c, and 14c. The first electrode layer E1 included in the electrode portions 11c and 13c is disposed on the first side surface 1c so as to be in contact with the first side surface 1c. The first electrode layer E1 included in the electrode portions 12c and 14c is disposed on the second side surface 1d so as to be in contact with the second side surface 1d. In the present embodiment, the first electrode layer E1 is not disposed on the first and second main surfaces 1a and 1b.

  The first electrode layer E1 included in the electrode portion 11c is connected to one end 21a of the first coil conductor 21. The first electrode layer E1 included in the electrode portion 12c is connected to one end 22a of the second coil conductor 22. The first electrode layer E1 included in the electrode portion 13c is connected to one end 23a of the third coil conductor 23. The first electrode layer E1 included in the electrode portion 14c is connected to one end 24a of the fourth coil conductor 24.

  In the present embodiment, the first electrode layer E1 is a sintered metal layer made of Ag. The first electrode layer E1 may be a sintered metal layer made of Pd. As the conductive paste, a powder made of Ag or Pd mixed with a glass component, an organic binder, and an organic solvent is used.

  The second electrode layer E2 is a conductive resin layer. As the conductive resin, a thermosetting resin mixed with a conductive material and an organic solvent is used. For example, metal powder is used as the conductive material. For example, Ag powder is used as the metal powder. As the thermosetting resin, for example, phenol resin, acrylic resin, silicone resin, epoxy resin, or polyimide resin is used.

  The third electrode layer E3 is a plating layer and is formed on the second electrode layer E2 by a plating method. In the present embodiment, the third electrode layer E3 is a Ni plating layer formed by Ni plating on the second electrode layer E2. The third electrode layer E3 may be a Cu plating layer.

  The fourth electrode layer E4 is a plating layer, and is formed on the third electrode layer E3 by a plating method. In the present embodiment, the fourth electrode layer E4 is an Sn plating layer formed by Sn plating on the third electrode layer E3. The third electrode layer E3 and the fourth electrode layer E4 constitute a plating layer disposed on the second electrode layer E2. That is, in this embodiment, the plating layer formed in the second electrode layer E2 has a two-layer structure.

  The second electrode layer E2 included in each of the electrode portions 11a to 11c, 12a to 12c, 13a to 13c, and 14a to 14c is integrally formed. The third electrode layer E3 included in each of the electrode portions 11a to 11c, 12a to 12c, 13a to 13c, and 14a to 14c is integrally formed. The fourth electrode layer E4 included in each of the electrode portions 11a to 11c, 12a to 12c, 13a to 13c, and 14a to 14c is also integrally formed.

  In each electrode part 11a-11c, 12a-12c, 13a-13c, 14a-14c, the whole 2nd electrode layer E2 is covered with the plating layer comprised by the 3rd electrode layer E3 and the 4th electrode layer E4. ing.

  The laminated common mode filter CF is solder-mounted on an electronic device (for example, a circuit board or an electronic component). In the laminated common mode filter CF, the first main surface 1a is a mounting surface facing the electronic device.

  The laminated common mode filter CF includes one resin film I as shown in FIGS. 2, 4, and 5. The resin film I has electrical insulation. The resin film I is disposed on the first main surface 1a so as to be in contact with the first main surface 1a. In the present embodiment, the resin film I covers the entire first main surface 1a.

  The resin film I covers an end edge (end portion) on the first main surface 1a side in the first electrode layer E1, and is in contact with the end edge. That is, the end of the resin film I in the second direction D2 has a region I1 located on the first electrode layer E1 and overlapping the first electrode layer E1. The region I1 of the resin film I is in contact with the first electrode layer E1.

  The second electrode layer E2 included in the electrode portions 11a, 12a, 13a, and 14a is disposed on the resin film I so as to be in contact with the resin film I. The second electrode layer E2 included in the electrode portions 11a, 12a, 13a, and 14a is disposed on the first main surface 1a of the element body 1 with the resin film I interposed therebetween. The second electrode layer E2 included in the electrode portions 11a, 12a, 13a, and 14a is not in contact with the element body 1 (first main surface 1a). The electrode portions 11a, 12a, 13a, and 14a are formed on the resin film I and are positioned on the resin film I. The second electrode layer E2 included in each electrode portion 11b, 12b, 13b, 14b is disposed on the second main surface 1b so as to be in contact with the second main surface 1b.

  The region I1 of the resin film I is located below the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, and 14a and overlaps the second electrode layer E2. Accordingly, the region I1 of the resin film I is sandwiched between the first electrode layer E1 and the second electrode layer E2. The region I1 of the resin film I is in contact with the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, and 14a.

  The resin film I is in contact with the second electrode layer E2 included in each of the electrode portions 11a, 12a, 13a, and 14a of the four first to fourth external electrodes 11, 12, 13, and 14 adjacent to each other. The resin film I is also in contact with the first electrode layer E1 included in each of the electrode portions 11a, 12a, 13a, and 14a of the four first to fourth external electrodes 11, 12, 13, and 14 adjacent to each other.

  The resin film I is made of an insulating resin such as an epoxy resin, for example. The resin film I is formed, for example, by applying an insulating resin coating agent and solidifying it. For the application of the insulating resin coating agent, a screen printing method, a spray coating method, or the like can be used. As the insulating resin coating agent, a thermosetting insulating resin coating agent, an ultraviolet curable insulating resin coating agent, or a coating agent containing both of these insulating resin coating agents can be used.

  As shown in FIGS. 6 and 7, the laminated common mode filter CF is solder-mounted on the electronic device ED. The electronic device ED is, for example, a circuit board or an electronic component. A solder fillet SF is formed on the first external electrode 11, the second external electrode 12, the third external electrode 13, and the fourth external electrode 14 by solidification of the molten solder. 6 and 7 are views for explaining the mounting structure of the laminated common mode filter according to the present embodiment.

  When the multilayer common mode filter CF is solder-mounted on the electronic device ED, the external force that acts on the multilayer common mode filter CF from the electronic device ED acts as a stress on the element body 1 through the solder fillet SF and the external electrodes 11 to 14. Sometimes. At this time, the external force tends to act on the element body 1 from the electrode portions 11a, 12a, 13a, and 14a.

  In the laminated common mode filter CF, the electrode portions 11a, 12a, 13a, and 14a include the second electrode layer E2. For this reason, even when an external force acts on the laminated common mode filter CF, the external force is relaxed by the second electrode layer E2, so that stress is hardly generated in the element body 1. Therefore, the generation of cracks in the element body 1 is suppressed.

  In the laminated common mode filter CF, the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, and 14a is in contact with the resin film I in contact with the first main surface 1a. That is, the resin film I is interposed between the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, and 14a and the first main surface 1a. Unlike the second electrode layer E2, the resin film I does not contain a conductive material (metal powder) and has high adhesive strength with the element body 1. Similar to the resin film I, the second electrode layer E2 contains a resin, so that the adhesive strength with the resin film I is high. Therefore, in the laminated common mode filter CF, even when an external force is applied to the laminated common mode filter CF, the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, and 14a is hardly peeled off.

  The second electrode layer E2 included in the electrode portions 11a, 12a, 13a, and 14a is in contact with the resin film I as a whole. Therefore, the adhesive strength between the second electrode layer E2 and the resin film I is even higher.

  The second electrode layer E2 included in the electrode portions 11a, 12a, 13a, and 14a may be partially in contact with the resin film I. The edge (end) in the second direction D2 in the second electrode layer E2 may be a starting point from which the second electrode layer E2 is peeled off. Therefore, if the edge of the second electrode layer E2 in the second direction D2 is in contact with the resin film I, the peeling of the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, and 14a is suppressed. The effect is secured.

  The laminated common mode filter CF is disposed in the element body 1, and the first coil conductor 21, the second coil conductor 22, the third coil conductor 23, and the first coil conductors whose ends are exposed at the corresponding side surfaces 1 c and 1 d. A four-coil conductor 24 is provided. The electrode portions 11c, 12c, 13c, and 14c include the first electrode layer E1. The second electrode layer E2 included in the electrode portions 11c, 12c, 13c, and 14c is disposed on the element body 1 via the first electrode layer E1. The first coil conductor 21, the second coil conductor 22, the third coil conductor 23, and the fourth coil conductor 24 are electrically connected to the second electrode layer E2 via the first electrode layer E1. Therefore, in the laminated common mode filter CF, the first coil conductor 21, the second coil conductor 22, the third coil conductor 23, the fourth coil conductor 24, and the second electrode layer E2 are directly connected. Thus, the connection strength between the coil conductors 21 to 24 and the corresponding external electrodes 11 to 14 is high, and the coil conductors 21 to 24 and the corresponding external electrodes 11 to 14 are reliably electrically connected.

  The resin film I covers the edge of the first electrode layer E1 on the first main surface 1a side and is in contact with the edge. For this reason, since the edge part (area | region I1) of the resin film I is pinched | interposed by the 1st electrode layer E1 and the 2nd electrode layer E2, peeling of the resin film I does not arise easily.

  In the laminated common mode filter CF, the first external electrode 11 and the third external electrode 13 are disposed on the first side surface 1 c side of the element body 1. For this reason, the first external electrode 11 and the third external electrode 13 are not formed so as to cover the entire first side surface 1c, and the respective surface areas of the first external electrode 11 and the third external electrode 13 do not have to be small. I do not get. Similarly, since the second external electrode 12 and the fourth external electrode 14 are disposed on the second side surface 1d side of the element body 1, the surface areas of the second external electrode 12 and the fourth external electrode 14 need not be small. I do not get. Therefore, the area of the second electrode layer E2 is also reduced, and the adhesive strength of the second electrode layer E2 may be reduced. However, in the laminated common mode filter CF, the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, and 14a is in contact with the resin film I in contact with the first main surface 1a. , 12a, 13a, and 14a are not easily peeled off.

  In the present embodiment, the resin film I includes the second electrode layer E2 included in each of the electrode portions 11a, 12a, 13a, and 14a of the four first to fourth external electrodes 11, 12, 13, and 14 adjacent to each other. It touches. For this reason, it is easy to form the resin film I in the laminated common mode filter CF.

  Next, the configuration of the multilayer common mode filter CF according to the modification of the present embodiment will be described with reference to FIGS. 8 to 10 are plan views of the laminated common mode filter according to the present modification. In each modification, the shape of the resin film is different from the above-described laminated common mode filter CF.

  The laminated common mode filter CF shown in FIG. 8 includes two resin films Ia and Ib. The two resin films Ia and Ib are separated in the second direction D2, and the first main surface 1a is exposed between the resin film Ia and the resin film Ib. The resin film Ia is in contact with the second electrode layer E2 included in the electrode portions 11a and 13a of the two first and third external electrodes 11 and 13 that are adjacent to each other in the third direction D3. The resin film Ib is in contact with the second electrode layer E2 included in the electrode portions 12a and 14a of the two second and fourth external electrodes 12 and 14 adjacent to each other in the third direction D3.

  The laminated common mode filter CF shown in FIG. 9 also includes two resin films Ia and Ib. The two resin films Ia and Ib are separated in the third direction D3, and the first main surface 1a is exposed between the resin film Ia and the resin film Ib. The resin film Ia is in contact with the second electrode layer E2 included in each of the electrode portions 11a and 12a of the two first and second external electrodes 11 and 12 that are adjacent to each other in the second direction D2. The resin film Ib is in contact with the second electrode layer E2 included in each of the electrode portions 13a and 14a of the two third and fourth external electrodes 13 and 14 that are adjacent to each other in the second direction D2.

  In the laminated common mode filter CF of each modification shown in FIGS. 8 and 9, the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, and 14a hardly peels off, and the resin film I Easy to form.

  The laminated common mode filter CF shown in FIG. 10 includes four resin films Ic, Id, Ie, and If. The four resin films Ic, Id, Ie, If are provided for each of the first to fourth external electrodes 11, 12, 13, and 14 and are separated from each other. The resin film Ic is in contact with the second electrode layer E2 included in the electrode portion 11a of the first external electrode 11. The resin film Id is in contact with the second electrode layer E2 included in the electrode portion 12a of the second external electrode 12. The resin film Ie is in contact with the second electrode layer E2 included in the electrode portion 13a of the third external electrode 13. The resin film If is in contact with the second electrode layer E2 included in the electrode portion 14a of the fourth external electrode 14.

  Even in the laminated common mode filter CF of the modification shown in FIG. 10, the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, and 14a is hardly peeled off. In this modification, resin films Ic, Id, Ie, If are provided for each of the first to fourth external electrodes 11, 12, 13, 14, and the corresponding first to fourth external electrodes 11, 12, The electrode portions 11a, 12a, 13a, and 14a of the 13 and 14 are in contact with the second electrode layer E2 included. For this reason, the amount of the resin used for forming the resin films Ic, Id, Ie, If is reduced.

  Next, the configuration of the multilayer common mode filter CF according to the modification of the present embodiment will be described with reference to FIGS. FIG. 11 is a plan view of a laminated common mode filter according to this modification. FIG. 12 is a diagram for explaining a cross-sectional configuration of the first external electrode, the second external electrode, and the resin layer. FIG. 13 is a diagram for explaining a cross-sectional configuration of the third external electrode, the fourth external electrode, and the resin layer.

  As shown in FIGS. 11 to 13, the resin film I may not be in contact with the first electrode layer E1. In the present modification, the entire resin film I is in contact with the first main surface 1a. Also in this modification, since the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, and 14a is in contact with the resin film I in contact with the first main surface 1a, an external force is applied to the laminated common mode filter CF. Even if this works, peeling of the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, and 14a hardly occurs.

  As mentioned above, although embodiment of this invention has been described, this invention is not necessarily limited to embodiment mentioned above, A various change is possible in the range which does not deviate from the summary.

  The laminated common mode filter CF includes not only the resin film I disposed on the first major surface 1a but also the resin film disposed on the second major surface 1b so as to be in contact with the second major surface 1b. May be. The 2nd electrode layer E2 which each electrode part 11b, 12b, 13b, 14b contains may be arrange | positioned on the said resin film so that the resin film arrange | positioned on the 2nd main surface 1b may be contact | connected. In this case, the second electrode layer E2 included in the electrode portions 11b, 12b, 13b, and 14b is unlikely to peel off.

  The resin film disposed on the second main surface 1b may cover an edge on the second main surface 1b side in the first electrode layer E1 and may be in contact with the edge. In this case, since the end portion of the resin film is sandwiched between the first electrode layer E1 and the second electrode layer E2, the resin film hardly peels off. The resin film disposed on the second main surface 1b may not be in contact with the first electrode layer E1.

  The 1st external electrode 11, the 2nd external electrode 12, the 3rd external electrode 13, and the 4th external electrode 14 do not necessarily need to have electrode part 11b, 12b, 13b, 14b. That is, the first external electrode 11 and the third external electrodes 11 and 13 may be disposed only on the two surfaces 1a and 1c, and the second external electrode 12 and the fourth external electrodes 12 and 14 You may arrange | position only to 1a and 1d.

  The plating layer disposed on the second electrode layer E2 does not necessarily have a two-layer structure including the third electrode layer E3 and the fourth electrode layer E4. The plating layer disposed on the second electrode layer E2 may be a single layer or may have a laminated structure of three or more layers. For example, the plating layer disposed on the second electrode layer E2 has a three-layer structure including a Ni plating layer, a Cu plating layer formed on the Ni plating layer, and a Sn plating layer formed on the Cu plating layer, Alternatively, a three-layer structure including a Cu plating layer, a Ni plating layer formed on the Cu plating layer, and a Sn plating layer formed on the Ni plating layer may be used.

  The number of external electrodes respectively disposed at the end portions in the second direction D2 of the element body 1 is not limited to “two”. The number of external electrodes respectively disposed at the end portions of the element body 1 in the second direction D2 may be “three” or more.

  In the present embodiment and the modification, the multilayer common mode filter CF is described as an example of the electronic component, but applicable electronic components are not limited to the multilayer capacitor and the multilayer common mode filter. Applicable electronic components are, for example, multilayer electronic components such as multilayer capacitors, multilayer inductors, multilayer varistors, multilayer piezoelectric actuators, multilayer thermistors, or multilayer composite components, or electronic components other than multilayer electronic components.

  DESCRIPTION OF SYMBOLS 1 ... Element body, 1a ... 1st main surface, 1c ... 1st side surface, 1d ... 2nd side surface, 11 ... 1st external electrode, 11a, 11c ... Electrode part which 1st external electrode has, 12 ... 1st Two external electrodes, 12a, 12c ... electrode part of the second external electrode, 13 ... third external electrode, 13a, 13c ... electrode part of the third external electrode, 14 ... fourth external electrode, 14a, 14c ... electrode portion of the fourth external electrode, 21 ... first coil conductor, 22 ... second coil conductor, 23 ... third coil conductor, 24 ... fourth coil conductor, CF ... laminated common mode filter , D2 ... second direction, E1 ... first electrode layer, E2 ... second electrode layer, E3 ... third electrode layer, E4 ... fourth electrode layer, I, Ia, Ib, Ic, Id, Ie, If ... resin film.

Claims (6)

An element body having a main surface as a mounting surface and a side surface adjacent to the main surface;
An external electrode having a first electrode portion disposed on the main surface and a second electrode portion disposed on the side surface;
A resin film disposed on the main surface so as to be in contact with the main surface, and having an electrical insulating property,
The first electrode portion and the second electrode portion each include a conductive resin layer disposed on the element body,
The electrically conductive resin layer included in the first electrode portion is an electronic component disposed on the resin film so as to be in contact with the resin film. An inner conductor disposed in the element body and having an end exposed at the side surface;
The second electrode portion includes a sintered metal layer connected to the end of the inner conductor and disposed on the side surface so as to contact the side surface,
The electronic component according to claim 1, wherein the conductive resin layer included in the second electrode portion is disposed on the element body via the sintered metal layer.   The electronic component according to claim 2, wherein the resin film covers an edge of the sintered metal layer and is in contact with the edge. The element body further includes a side surface facing the side surface,
4. The electronic component according to claim 1, wherein a plurality of the external electrodes are respectively disposed at both end portions of the element body in a direction in which the pair of side surfaces face each other.   The electronic component according to claim 4, wherein the resin film is in contact with the conductive resin layer included in the first electrode portions of at least two adjacent external electrodes.   The electronic component according to claim 4, wherein the resin film is provided for each external electrode and is in contact with the conductive resin layer included in the first electrode portion of the corresponding external electrode.

Images