JP2019125628A - Treating liquid supply device and deaeration method therefor - Google Patents

Abstract

A deaeration efficiency can be improved by controlling a pressure of a discharge pipe. After a thinner is taken into a chamber, when the volume of the chamber is changed by a three-way valve in a state where the on-off valves are closed, the pressure in the chamber is reduced. Therefore, the gas dissolved in the thinner can be released into the chamber 15. Further, the pressure adjusting mechanism 37 is operated and the on-off valve V3 is opened to perform deaeration. However, since the pressure in the discharge pipe 9 is made lower than that in the chamber 15 by the pressure adjusting mechanism 37, the inside of the chamber 15 is The gas is smoothly discharged through the discharge pipe 9. Therefore, the gas released into the chamber 15 can be prevented from being dissolved again into the thinner, and the degassing efficiency can be improved. [Selection diagram] Fig. 1

Description

  The present invention relates to a substrate for an FPD (Flat Panel Display) such as a semiconductor wafer, a substrate for liquid crystal display, an organic EL (Electroluminescence) display device, a substrate for optical display, a substrate for magnetic disk, a substrate for magneto-optical disk, a substrate for photomask The present invention relates to a processing liquid supply apparatus for supplying a processing liquid such as a developer or a thinner to a solar cell substrate (hereinafter simply referred to as a substrate), and a degassing method thereof.

  Conventionally, as an apparatus of this type, an intake pipe for taking in the processing liquid, a delivery pipe for delivering the processing liquid to the substrate, a chamber for sucking in the processing liquid from the intake pipe and delivering the processing liquid to the delivery pipe, and moving in the chamber And a discharge pipe for discharging the air in the chamber, and an on-off valve provided on each of the intake pipe, the delivery pipe, and the discharge pipe to control the flow of the processing liquid and the gas. (See, for example, Patent Document 1).

  In this apparatus, air is mixed into the processing liquid when the processing liquid is newly introduced into the chamber through the intake pipe. When the processing liquid mixed with air is supplied from the delivery pipe to the substrate, the air dissolved in the processing liquid causes a problem in processing. Therefore, in order to prevent this problem, degassing is performed to remove air from the processing liquid in the chamber. In this degassing, the diaphragm is first moved downward to increase the volume of the chamber and reduce the pressure in the chamber. Thereby, the air dissolved in the processing solution is released from the processing solution into the chamber. Then, the diaphragm is moved upward to reduce the volume of the chamber and open the on-off valve of the discharge pipe. Thereby, the air in the chamber is exhausted through the exhaust pipe.

Patent No. 3561438 (FIGS. 5 and 7)

However, in the case of the conventional example having such a configuration, there are the following problems.
That is, since the conventional apparatus moves the diaphragm to reduce the volume of the chamber and then opens the on-off valve of the discharge pipe, the pressure in the chamber is positive, though for a short time. Therefore, the air released from the processing solution into the chamber may be again dissolved in the processing solution, and the degassing efficiency may be reduced.

  In order to eliminate such a problem, it is conceivable to open the on-off valve of the discharge pipe in a state where the pressure in the chamber is not a positive pressure. Another problem arises that the air can not be discharged. Furthermore, in order to prevent this problem, it is also conceivable to attach a check valve to the discharge pipe, but this is not realistic because particles generated by the check valve may be mixed into the processing solution.

  The present invention has been made in view of such circumstances, and provides a processing liquid supply apparatus capable of improving the degassing efficiency by controlling the pressure of the discharge pipe, and the degassing method thereof. With the goal.

The present invention has the following configuration in order to achieve such an object.
That is, according to the first aspect of the present invention, there is provided a processing liquid supply apparatus for supplying a processing liquid for processing a substrate, the chamber for storing the processing liquid, the chamber being in communication with the chamber, and the processing liquid being supplied to the chamber. An intake port for taking in, a delivery port for communicating with the chamber, and a delivery port for delivering the processing liquid of the chamber, an exhaust port for communicating with the chamber, for discharging the gas of the chamber, and a processing liquid to be taken into the chamber from the intake port A pump having a chamber drive unit for changing the volume of the chamber to discharge the treatment liquid from the chamber through the outlet and discharge the gas from the outlet; An intake pipe connecting the processing liquid supply source and the intake port in communication, and an intake opening / closing for controlling the flow of the processing liquid in the intake pipe And a delivery piping connected to the delivery port for supplying the processing liquid in the chamber to the substrate, a delivery on-off valve for controlling the flow of the processing liquid in the delivery piping, and the discharge port. An exhaust pipe for exhausting the gas in the chamber, an exhaust on-off valve for controlling the flow of gas in the exhaust pipe, and a pressure adjusting mechanism for adjusting the pressure in the exhaust pipe to a pressure lower than the pressure in the chamber The chamber drive unit may increase the volume of the chamber in a state in which the intake on-off valve, the delivery on-off valve, and the discharge on-off valve are closed after the processing liquid is taken in the chamber. It is characterized in that the pressure adjustment mechanism is operated and the discharge on-off valve is opened to perform degassing by changing the pressure adjustment mechanism.

  [Operation and Effect] According to the invention as set forth in claim 1, after the processing liquid is taken into the chamber, the chamber drive section is in a state in which the intake on-off valve, the delivery on-off valve, and the discharge on-off valve are closed. When the volume of the chamber is changed to be large, the pressure in the chamber is reduced. Therefore, the gas dissolved in the processing solution can be released into the chamber. Furthermore, the pressure adjustment mechanism is operated and the discharge on-off valve is opened to perform degassing, but since the pressure in the discharge pipe is lower than that in the chamber by the pressure adjustment mechanism, the pressure in the chamber does not become positive. Gas in the chamber is smoothly exhausted through the exhaust pipe. Therefore, it is possible to prevent the gas released into the chamber from being dissolved again in the processing solution, and the degassing efficiency can be improved.

  In the present invention, preferably, the pressure adjusting mechanism is an aspirator (claim 2).

  Since the aspirator has no movable part, the discharge pipe can be depressurized with a simple configuration.

  Further, in the present invention, preferably, the pressure adjusting mechanism is operated before the discharge on-off valve is opened (claim 3).

  As the discharge pipe open / close valve is inactivated until it is opened, the consumption of resources for operating the pressure adjustment mechanism can be suppressed.

  Further, in the present invention, it is preferable that in the pump, the chamber includes a diaphragm (claim 4).

  The deformation of the diaphragm allows the treatment liquid to be taken into the chamber and the treatment liquid to be discharged from the chamber.

  Further, in the present invention, the discharge pipe is provided with a bubble sensor for detecting a bubble in the processing liquid, and after degassing is started, the discharge on-off valve is closed when the bubble sensor does not detect the bubble. Is preferred (claim 5).

  After the air bubbles are discharged from the chamber, the processing liquid is sucked from the chamber into the discharge pipe, and by closing the discharge on-off valve at that time, the consumption of the processing liquid associated with the degassing can be suppressed.

  The invention according to claim 6 is the degassing method of the processing liquid supply apparatus for supplying the processing liquid for processing a substrate, wherein the chamber driving unit changes the volume of the chamber for storing the processing liquid. A process of taking the processing liquid into the chamber from the intake pipe connected in communication with the intake port of the chamber while changing the volume to be large, a delivery pipe for delivering the processing liquid from the chamber to the substrate, and the intake pipe. Changing the volume of the chamber to a larger value by the chamber drive section in the closed state, and adjusting the pressure in the discharge pipe for discharging the gas from the chamber to a lower pressure than that in the chamber; And degassing by bringing the chamber and the discharge pipe into communication with each other.

  [Operation and Effect] According to the sixth aspect of the present invention, after the processing liquid is taken into the chamber, the chamber drive section changes the volume of the chamber so as to be further increased. As a result, the pressure in the chamber is reduced, so that the gas dissolved in the processing liquid can be released into the chamber. After that, when degassing, the chamber and the discharge pipe are communicated, but since the pressure in the discharge pipe is lower than the pressure in the chamber, the gas in the chamber does not become positive pressure in the chamber. It is discharged smoothly through the discharge pipe. Therefore, it is possible to prevent the gas released into the chamber from being dissolved again in the processing solution, and the degassing efficiency can be improved.

  According to the processing liquid supply device according to the present invention, after the processing liquid is taken into the chamber, the volume of the chamber is increased by the chamber drive unit in a state in which the intake on-off valve, the delivery on-off valve, and the discharge on-off valve are closed. When it is changed to be large, the pressure in the chamber is reduced. Therefore, the gas dissolved in the processing solution can be released into the chamber. Furthermore, the pressure adjustment mechanism is operated and the discharge on-off valve is opened to perform degassing, but since the pressure in the discharge pipe is lower than that in the chamber by the pressure adjustment mechanism, the pressure in the chamber does not become positive. Gas in the chamber is smoothly exhausted through the exhaust pipe. Therefore, it is possible to prevent the gas released into the chamber from being dissolved again in the processing solution, and the degassing efficiency can be improved.

It is a block diagram which shows schematic structure of a process liquid supply apparatus. It is a time chart which shows an example of operation. It is a schematic block diagram which shows the substrate processing apparatus provided with the processing liquid supply apparatus. It is a block diagram which shows schematic structure in the modification of a process liquid supply apparatus.

  <Processing liquid supply device>

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a block diagram showing a schematic configuration of a processing liquid supply apparatus.

  The processing liquid supply device 1 according to the embodiment includes a pump 3, an intake pipe 5, a delivery pipe 7, a discharge pipe 9, and a processing liquid container 11.

  The pump 3 in the present embodiment is, for example, a diaphragm type pump. Specifically, the pump 3 includes a pump body 13, a chamber 15, a cylinder 17, a diaphragm 19, an intake port 21, a delivery port 23, a discharge port 25, and a suction and discharge port 27. The external shape of the pump body 13 is cylindrical, and a cylinder 17 is vertically movable relative to the chamber 15 below the chamber 15 which is an internal space for storing the treatment liquid. The lower surface of the diaphragm 19 is fixed to the upper surface of the cylinder 17. The outer peripheral edge of the diaphragm 19 is fixed to the inner peripheral surface of the chamber 15 at a predetermined height. The inlet 21, the outlet 23, and the outlet 25 are formed in communication with the chamber 15 in the pump body 13.

  The inlet 21 takes the processing liquid into the chamber 15. One end side of the intake pipe 5 is connected in communication with the intake port 21. The other end side of the intake pipe 5 is communicably connected to the processing liquid container 11 storing the processing liquid. The treatment liquid container 11 is replaced with another treatment liquid container 11 when the supply of the treatment liquid of the inner volume is completed. That is, in the processing liquid container 11, the intake piping 5 is configured to be removable. The intake pipe 5 is provided with a filter 29 and an on-off valve V1 from the processing liquid container 11 side. The filter 29 removes particles and the like in the processing liquid delivered from the processing liquid container 11. The on-off valve V <b> 1 controls the flow of the processing liquid in the intake pipe 5.

  The processing liquid container 11 described above corresponds to the "processing liquid supply source" in the present invention.

  The outlet 23 delivers the processing liquid stored in the chamber 15. One end side of the delivery pipe 7 is connected in communication with the discharge port 23. The other end side of the delivery pipe 7 is communicably connected to a flow rate adjusting valve for adjusting the flow rate, a nozzle (not shown) for supplying the treatment liquid, and the like. The delivery pipe 7 is provided with a filter 31 and an on-off valve V2 from the delivery port 23 side. The filter 31 removes particles and the like in the processing liquid sent from the chamber 15. The on-off valve V <b> 2 controls the flow of the processing liquid in the delivery pipe 7.

  The exhaust port 25 exhausts the gas in the chamber 15. One end side of the discharge pipe 9 is connected in communication with the discharge port 25. The other end side of the discharge pipe 9 is connected in communication with the collection container 33. The recovery container 33 recovers the gas such as air discharged from the discharge pipe 9 together with the droplets of the processing liquid. The discharge pipe 9 includes an air bubble sensor 35, an on-off valve V3, and a pressure adjustment mechanism 37 from the side of the discharge port 23. The on-off valve V3 controls the flow of gas or the like in the discharge pipe 9.

  The air bubble sensor 35 detects that the fluid flowing through the discharge pipe 9 contains air bubbles made of gas such as air. Specifically, for example, the air bubble sensor 35 irradiates the fluid flowing in the discharge pipe 9 with ultrasonic waves, and compared with the case of the liquid, when the air bubble is a gas, the propagation efficiency decreases and the reception intensity By detecting the presence or absence of air bubbles. Also, the bubble sensor 35 may use the difference in the Doppler effect of microwaves or the difference in the refractive index of the fluid.

  The on-off valve V1 described above corresponds to the "take-in on-off valve" in the present invention, the on-off valve V2 corresponds to the "delivery on-off valve" in the present invention, and the on-off valve V3 corresponds to the "discharge on-off valve" in the present invention Do.

  The pressure adjustment mechanism 37 adjusts the pressure in the discharge pipe 9 so that the pressure in the discharge pipe 9 is lower than the pressure in the chamber 15 when performing degassing described later. Examples of the pressure adjustment mechanism 37 include an aspirator. The aspirator uses pure water and air to reduce pressure by the venturi effect. The pressure when the pressure adjustment mechanism 37 performs pressure reduction is previously adjusted and set so as to be lower than the pressure of the discharge pipe 9 at the time of degassing.

  The suction and discharge port 27 is formed in the pump main body 13 which is opposite to the chamber 15 across the cylinder 17. One end side of a suction and discharge pipe 39 is connected in communication with the suction and discharge port 27. The common side of the three-way valve V4 is connected to the other end side of the suction and discharge pipe 39 in communication. An air supply source and a suction source are connected in communication with each other on two switching sides of the three-way valve V4. When the three-way valve V4 is switched to the air supply source side, air is supplied to the suction and discharge port 27, so the cylinder 17 is raised and the volume of the chamber 15 is reduced. On the other hand, when the three-way valve V4 is switched to the suction source side, air is discharged from the suction and discharge port 27, so the cylinder 17 is lowered and the volume of the chamber 15 is increased. Although the pump 3 can raise and lower the cylinder 17 in this way, for example, its height position is movable from the first lowered position BL1 to the raised position TP. Here, a position raised by a predetermined distance from the first lowered position BL1 is taken as a second lowered position BL2.

  Next, with reference to FIG. 2, the operation of the processing liquid supply device 1 having the above-described configuration will be described. FIG. 2 is a time chart showing an example of the operation.

  Here, for example, it is assumed that the processing liquid container 11 storing the thinner as the processing liquid is emptied and replaced with a new processing liquid container 11. In this case, the intake pipe 5 is removed from the processing liquid container 11 that has become empty, and the intake pipe 5 is attached to the new processing liquid container 11. At this time, it is inevitable that air bubbles are mixed in the mounting pipe 5. Further, gas such as air is originally dissolved in the thinner of the processing liquid container 11 to a certain extent. In the initial state, it is assumed that the pump 3 has supplied all the thinner in the chamber 15 and the cylinder 17 is located at the raised position TP.

  First, the on-off valves V2 and V3 are closed at time zero, and the on-off valve V1 is opened. Then, in this state, the switching side of the three-way valve V4 is switched to the suction source. As a result, the cylinder 17 starts to descend from the raised position TP, and the thinner is taken from the processing liquid container 11 and taken into the chamber 15 through the piping 5. At time t1 when the height position of the cylinder 17 reaches the second lowered position BL2, the on-off valve V1 is closed.

  The point in time 0 to the point in time t1 corresponds to the "incorporating process" in the present invention.

  The cylinder 17 continues to gradually descend toward the first lowered position BL1 while the chamber 15 is closed. Therefore, the volume of the chamber 15 is further increased to reduce the pressure of the chamber 15, so that the gas dissolved in the thinner taken into the chamber 15 is released to the chamber 15. This state is maintained until t3.

  The time point from t1 to t3 corresponds to the "changing process" in the present invention.

  Next, at time t2 slightly earlier than time t3 at which the cylinder 17 reaches the first lowered position BL1, the pressure adjustment mechanism 37 is operated. As a result, the pressure in the discharge pipe 9 is reduced to a pressure lower than the pressure in the chamber 15. Further, the on-off valve V3 is opened at time t3 which is a predetermined time after time t2. Thereby, the gas released to the chamber 15 is discharged from the discharge pipe 9 and discharged to the recovery container 33. At this time, the bubble sensor 35 detects a bubble made of gas, but when the gas in the chamber 15 is exhausted, the thinner in the chamber 15 is sucked out together with the gas, and at time t4, the bubble is finally It is lost and only thinner will be discharged. Then, the bubble sensor 33 does not detect the bubble.

  At time t4 when the air bubble sensor 33 is not detected, the on-off valve V3 is closed. Thereafter, at time t5, the pressure adjustment mechanism 37 is deactivated. Although not shown, the degassing process moves the cylinder 17 to a position slightly elevated from the first lowered position BL1 due to the pressure reduction.

  The time t2 to t5 corresponds to the "adjustment process" in the present invention, and the time t3 to t4 corresponds to the "degassing process" in the present invention.

  When the degassing of the thinner is completed as described above, for example, at the time t6 when the supply timing of the thinner is reached, the following supply operation is performed. That is, at the time t6, the switching side of the three-way valve V4 is switched to the air supply source side and the on-off valve V2 is opened. Thus, thinner is supplied from the delivery pipe 7. Then, this is maintained until time t7 at which the supply amount of thinner in the chamber 15 reaches a predetermined amount necessary for processing. At time t7, the on-off valve V2 is closed, and the switching side of the three-way valve V4 is switched to the suction source. Then, at time t8 when the supply timing of the thinner is reached again, the above-described supply operation is repeated. This supply operation is stopped when the thinner in the chamber 15 does not reach the required amount for supply. This detection can be determined from the height position of the cylinder 17.

  Then, after the thinner is supplied from the processing liquid container 11 to the chamber 15 again, the degassing process is performed as described above to perform the supply operation.

  According to the present embodiment, after the thinner is taken into the chamber 15 and the on / off valves V1 to V3 are closed, if the volume of the chamber 15 is changed by the three-way valve V4, the pressure in the chamber 15 is reduced. Ru. Therefore, the gas dissolved in the thinner can be released into the chamber 15. Furthermore, the pressure adjustment mechanism 37 is operated and the on-off valve V3 is opened to perform degassing. However, since the pressure in the discharge pipe 9 is made lower than that in the chamber 15 by the pressure adjustment mechanism 37, The gas in the chamber 15 is smoothly exhausted through the exhaust pipe 9 without the positive pressure. Therefore, it is possible to prevent the gas released into the chamber 15 from being dissolved in the thinner again, and the degassing efficiency can be improved.

  Further, since the pressure adjustment mechanism 37 is configured by an aspirator, there is no movable part, and the discharge pipe can be depressurized with a simple configuration.

  Furthermore, since the operation timing of the pressure adjustment mechanism 37 is immediately before the on-off valve V3 is opened, it is possible to suppress the consumption of the fluid for operating the aspirator that is the pressure adjustment mechanism 37.

  Further, after the gas is exhausted from the chamber 15, the thinner is sucked into the exhaust pipe 9 from the chamber 15. However, since the air bubble sensor 35 is provided in the discharge pipe 9, closing the on-off valve V3 at that time can suppress the consumption of thinner accompanying degassing.

  <Substrate processing apparatus>

  Next, with reference to FIG. 3, an example of a substrate processing apparatus provided with the processing liquid supply apparatus described above will be described. FIG. 3 is a schematic configuration view showing a substrate processing apparatus provided with a processing liquid supply device. In FIG. 3, a supply system for supplying another processing solution, for example, a photoresist solution, is not shown.

  The substrate processing apparatus includes a spin chuck 51, an electric motor 53, a scattering prevention cup 55, and a nozzle 57.

  The spin chuck 51 holds the substrate W to be processed in a horizontal posture. The electric motor 53 rotationally drives the spin chuck 51 around an axis in the vertical direction. The scattering prevention cup 55 encloses the side of the spin chuck 51 and the substrate W, and is supplied to the substrate W and collects the processing liquid scattered around. The nozzle 57 is configured such that the discharge port on the tip end side is movable across the rotation center of the substrate W and the side of the scattering prevention cup 55. The delivery pipe 7 is connected in communication with the proximal end of the nozzle 57. The delivery pipe 7 is provided with a flow control valve 59 for adjusting the supply flow rate of the thinner in the delivery pipe 7. By operating the pump 3, thinner of a predetermined flow rate is discharged from the nozzle 57 to the substrate W. Note that the above-described degassing is already performed until the thinner is discharged from the nozzle 57.

  In this substrate processing apparatus, the gas is not dissolved, and the thinner containing no bubbles is supplied to the substrate W. Therefore, the adverse effect of the dissolved gas or bubbles on the processing of the substrate W can be suppressed. Therefore, subsequent processing with a processing solution (for example, photoresist solution) can be suitably performed.

  <Modification>

  Here, FIG. 4 is referred to. FIG. 4 is a block diagram showing a schematic configuration in a modification of the processing liquid supply device. About the same composition as an Example mentioned above, it omits about detailed explanation by attaching a same sign.

  In the processing liquid supply device 1 in the above-described embodiment, the pump 3 is driven by air supply and suction by the three-way valve V4. However, the pump 3 in the present invention may be driven by the motor 61, for example.

  The treatment liquid supply apparatus 1A according to the modification includes a pump 3A. The pump 3A incorporates a motor 61. The motor 61 includes a coil portion 63 disposed in the lower portion of the pump body 13 and a drive shaft 65 rotationally driven around the vertical axis by the coil portion 63. The cylinder 17A is screwed with the drive shaft 65.

  According to such a configuration, when the motor 61 is operated, the drive shaft 65 is rotationally driven. Then, the screwed cylinder 17A moves up and down according to the rotation direction and speed of the drive shaft 65. Even with the motor 61 configured as described above, degassing can be performed as in the above-described embodiment.

  The present invention is not limited to the above embodiment, and can be modified as follows.

  (1) In the embodiment described above, the configuration in which the chamber 15 includes the diaphragm 19 has been described as an example, but the present invention may be configured to include a tube diaphragm instead of the diaphragm 19.

  (2) In the above-described embodiment, the pressure adjusting mechanism 37 is an aspirator, but a pump may be used instead. In that case, since the degree of pressure reduction is stronger than that of the aspirator, it is preferable to reduce the pressure in the collection container 33 indirectly to reduce the pressure in the discharge pipe 9 instead of directly reducing the pressure in the discharge pipe 9.

  (3) In the embodiment described above, the air discharge sensor 9 is provided in the discharge pipe 9, but the present invention is not essential. For example, instead of the air bubble sensor 35, a sensor that detects the processing liquid may be provided. As a result, when the sensor detects the thinner in the discharge pipe 9, the on-off valve V3 may be closed.

  (4) In the above-mentioned embodiment, although the thinner is taken as an example of the processing liquid, the present invention is not limited to this. For example, the processing liquid may be a photoresist liquid, a developer, a rinse liquid, a pretreatment liquid, or the like.

DESCRIPTION OF SYMBOLS 1 ... Processing liquid supply apparatus 3 ... Pump 5 ... Intake piping 7 ... Delivery piping 9 ... Discharge pipe 11 ... Treatment liquid container 13 ... Pump main body 13
DESCRIPTION OF SYMBOLS 15 ... Chamber 17 ... Cylinder 19 ... Diaphragm 21 ... Intake port 23 ... Delivery port 25 ... Exhaust port V1-V3 ... On-off valve V4 ... Three-way valve 35 ... Bubble sensor

Claims (6)

In a processing liquid supply apparatus for supplying a processing liquid for processing a substrate,
A chamber for storing the processing liquid, an inlet communicating with the chamber, for taking in the processing liquid to the chamber, an outlet communicating for the chamber, and an outlet for discharging the processing liquid for the chamber, and an opening for communicating the chamber An exhaust port for exhausting gas from the chamber, and a processing liquid is taken into the chamber from the intake port, the processing liquid is delivered from the chamber through the delivery port, and the gas is exhausted from the exhaust port. A pump having a chamber drive unit that changes the volume of the
An intake pipe connecting the processing liquid supply source storing the processing liquid and the intake port;
A loading on-off valve for controlling the flow of the processing liquid in the loading pipe;
A delivery pipe connected in fluid communication with the delivery port to supply the processing liquid in the chamber to the substrate;
A delivery on-off valve for controlling the flow of the treatment liquid in the delivery pipe;
An exhaust pipe connected in communication with the exhaust port and exhausting the gas in the chamber;
A discharge on-off valve for controlling the flow of gas in the discharge pipe;
A pressure control mechanism for adjusting the pressure in the discharge pipe to a pressure lower than the pressure in the chamber;
Equipped with
After the processing liquid is taken into the chamber, the chamber drive unit changes the volume of the chamber to be larger in a state in which the intake on-off valve, the delivery on-off valve, and the discharge on-off valve are closed. A processing liquid supply apparatus characterized in that the pressure adjustment mechanism is operated and the discharge on / off valve is opened to perform degassing. In the processing liquid supply apparatus according to claim 1,
The treatment liquid supply apparatus, wherein the pressure adjustment mechanism is an aspirator. In the processing liquid supply apparatus according to claim 1 or 2,
The processing liquid supply apparatus, wherein the pressure adjusting mechanism is operated before the discharge on-off valve is opened. In the processing liquid supply apparatus according to any one of claims 1 to 3,
The processing liquid supply device according to claim 1, wherein the chamber includes a diaphragm. In the processing liquid supply device according to any one of claims 1 to 4.
The discharge pipe is provided with a bubble sensor that detects bubbles in the treatment liquid,
A processing liquid supply apparatus characterized by closing the discharge on-off valve when the air bubble sensor stops detecting air bubbles after degassing is started. In a degassing method of a processing liquid supply apparatus for supplying a processing liquid for processing a substrate,
A process of changing the volume of the chamber for storing the treatment liquid so as to increase the volume of the chamber by the chamber drive unit, and taking the treatment liquid into the chamber from the intake pipe connected in communication with the intake port of the chamber When,
With the intake pipe, the delivery pipe for delivering the processing liquid from the chamber to the substrate, and the exhaust pipe for exhausting the gas in the chamber closed, the chamber drive changes so that the volume of the chamber is further increased. And the process of
Adjusting the pressure in the exhaust pipe for discharging the gas from the chamber to a pressure lower than that in the chamber;
Degassing the chamber and the discharge pipe in communication with each other;
A degassing method for a processing liquid supply apparatus, characterized in that:

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