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TWI645450B - Processing liquid supply device, processing liquid supply method, and recording medium - Google Patents

Processing liquid supply device, processing liquid supply method, and recording medium Download PDF

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Publication number
TWI645450B
TWI645450B TW105101617A TW105101617A TWI645450B TW I645450 B TWI645450 B TW I645450B TW 105101617 A TW105101617 A TW 105101617A TW 105101617 A TW105101617 A TW 105101617A TW I645450 B TWI645450 B TW I645450B
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Taiwan
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processing liquid
valve
liquid supply
volume
supply path
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TW105101617A
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Chinese (zh)
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TW201642310A (en
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Toshinobu Furusho
古庄智伸
Terutaka Yamaoka
山岡輝貴
Takashi Sasa
佐佐卓志
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Tokyo Electron Limited
東京威力科創股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1026Valves

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

本發明旨在提供抑制透過抗蝕液供給通路51由噴嘴7吐出抗蝕液後,處理液停止時產生粒子之技術。 依本發明,在使抗蝕液斷液時,將吸回閥3由吸回狀態調整至準備狀態,在抗蝕液由抗蝕液暫時停止狀態回復流通前,用200ms以上之時間關閉氣動閥2。因此,不急劇地關閉氣動閥2亦可達成急速之斷液及停止吐液,故可減少因急劇地關閉氣動閥2而產生粒子。此外,在其他例子中,藉使氣動閥2由開度100%關閉至20%,使抗蝕液暫時地停止,然後,使氣動閥2由開度20%關閉至0%而停止吐液。The present invention aims to provide a technique for suppressing the generation of particles when the processing liquid stops after the resist liquid is discharged from the nozzle 7 through the resist liquid supply path 51. According to the present invention, when the resist liquid is cut off, the suction return valve 3 is adjusted from the sucked-back state to the prepared state, and before the resist liquid returns to circulation from the temporarily stopped state of the resist liquid, the pneumatic valve is closed for more than 200ms. 2. Therefore, rapid shut-off and stop of liquid discharge can be achieved without closing the pneumatic valve 2 abruptly, so that particles generated by closing the pneumatic valve 2 abruptly can be reduced. In addition, in other examples, the pneumatic valve 2 is closed from the opening degree of 100% to 20% to temporarily stop the resist solution, and then the pneumatic valve 2 is closed from the opening degree of 20% to 0% to stop the liquid discharge.

Description

處理液供給裝置、處理液供給方法及記錄媒體Process liquid supply device, process liquid supply method, and recording medium

本發明係關於透過處理液供給通路及噴嘴將處理液供給至被處理體之處理液供給裝置的技術領域。 The present invention relates to the technical field of a processing liquid supply device that supplies a processing liquid to a subject through a processing liquid supply path and a nozzle.

在半導體製程中,具有由噴嘴對基板供給處理液來進行液處理之步驟。可舉例如:在抗蝕圖案形成系統中塗布抗蝕液或形成防反射膜用之藥液、或塗布形成絕緣膜用之藥液等。如此之塗布膜的形成係使用使藥液由噴嘴吐出至基板,並藉旋轉基板形成塗布膜的旋塗法。藥液之供給及中斷係驅動藥液供給通路之泵並且開啟閥而由噴嘴吐出設定量之藥液,接著藉由使泵停止並且關閉閥而停止供給藥液。 The semiconductor manufacturing process includes a step of supplying a processing liquid from a nozzle to a substrate to perform liquid processing. For example, a resist solution or a chemical solution for forming an antireflection film, or a chemical solution for forming an insulating film may be applied to a resist pattern forming system. The coating film is formed by a spin coating method in which a chemical solution is discharged from a nozzle to a substrate, and the coating film is formed by rotating the substrate. The supply and interruption of the chemical solution is to drive the pump of the chemical solution supply path and open the valve to discharge a set amount of the chemical solution from the nozzle, and then stop the pump and close the valve to stop supplying the chemical solution.

另一方面,由於設計規則不斷微細化,附著於基板上之粒子的容許尺寸越來越嚴格,且粒子檢查裝置之性能提高而可檢測到例如大約20nm之粒子。因此,減少在藥液供給通路產生之粒子成為重要之課題。藥液供給通路之主要塵產生源係閥,且被稱為分配閥等停止供給藥液之吐出閥產生的塵特別多。 On the other hand, due to the continuous refinement of design rules, the allowable size of particles attached to the substrate is becoming stricter and the performance of the particle inspection device is improved to detect, for example, particles of approximately 20 nm. Therefore, it is an important issue to reduce particles generated in the chemical solution supply path. The main source of dust generation of the chemical liquid supply path is a valve, and a large amount of dust is generated by a discharge valve such as a distribution valve that stops supplying the chemical liquid.

其原因是若例如在擴散抗蝕液後產生液滴流,就必須急速地斷液以防止對膜厚分布產生不良影響,因此不得不加快吐出閥之關閉速度而使關閉時之衝擊大。若對例如由氣動閥構成之吐出閥進行開關之嚴格測試,可確認可能是起因於閥材質之細長微細粒子。因此需要減少吐出閥之塵產生。 The reason is that, for example, if a droplet flow is generated after the diffusion of the resist solution, the liquid must be cut off quickly to prevent the film thickness distribution from being adversely affected. Therefore, the closing speed of the discharge valve must be increased to increase the impact at the time of closing. Strict testing of the opening and closing of a discharge valve made up of, for example, a pneumatic valve, confirms that the elongated fine particles may be caused by the material of the valve. Therefore, it is necessary to reduce the dust generation of the discharge valve.

在專利文獻1中,雖然有為防止液滴流而使開關閥之關閥時間為300ms的記載,但如此長時間實際上無法達成急速之斷液。此外,由於同時進行吸回閥之吸引準備及開關閥之關閥動作,處理液供給通路內之處理液的動作複雜,因此由此觀點來看無法達成急速之斷液。 In Patent Document 1, there is a description that the closing time of the on-off valve is set to 300 ms in order to prevent the liquid droplet from flowing, but it is impossible to achieve a rapid shut-off in practice for such a long time. In addition, since suction preparation and suction valve closing operations are performed simultaneously, the operation of the processing liquid in the processing liquid supply path is complicated, so from this point of view, it is not possible to achieve rapid shutoff.

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2010-171295號公報(段落0041、0043及圖6) [Patent Document 1] Japanese Patent Application Publication No. 2010-171295 (paragraphs 0041, 0043, and FIG. 6)

本發明係在如此之情況下作成,其目的在於提供可抑制透過處理液供給通路由該噴嘴吐出處理液後,處理液停止時產生粒子之技術。 The present invention has been made in such a case, and an object thereof is to provide a technology capable of suppressing the generation of particles when the processing liquid stops after the processing liquid is discharged from the nozzle through the processing liquid supply path.

本發明係一種處理液供給裝置,其藉由送液機構透過處理液供給通路及噴嘴將處理液供給至被處理體,且特徵在於包含:開關閥,其設於前述處理液供給通路中;流路調整部,其設於前述開關閥與噴嘴間之處理液供給通路中,並改變處理液供給通路之一部分的截面積來調整容積;及控制部,其為了暫時停止處理液由前述噴嘴吐出,對前述流路調整部輸出控制信號,使處理液供給通路之一部分的容積由第一容積變成小於第一容積且大於零之第二容積,並且前述處理液供給通路之一部分的容積調整至第二容積後,在停止吐出之處理液再開始流通前對前述開關閥輸出控制信號,使處理液供給通路關閉。 The present invention is a processing liquid supply device that supplies a processing liquid to a to-be-processed object through a processing liquid supply path and a nozzle through a liquid feeding mechanism, and is characterized by including: a switching valve provided in the processing liquid supply path; A channel adjusting section provided in the processing liquid supply path between the on-off valve and the nozzle, and changing a cross-sectional area of a portion of the processing liquid supply path to adjust a volume; and a control section for temporarily stopping the processing liquid from being discharged from the nozzle, A control signal is output to the aforementioned flow path adjusting section, so that the volume of a part of the processing liquid supply path is changed from the first volume to a second volume smaller than the first volume and greater than zero, and the volume of a part of the processing liquid supply path is adjusted to the second After the volume is reached, a control signal is output to the on-off valve before the processing liquid that has been discharged is stopped and the circulation is started, so that the processing liquid supply path is closed.

另一發明係一種處理液供給裝置,其藉由送液機構透過處理液供給通路及噴嘴將處理液供給至被處理體,且特徵在於包含:開關閥,其設於前述處理液供給通路中;及控制部,其為了暫時停止處理液由前述噴嘴吐出,對前述開關閥輸出控制信號,使處理液供給通路之容積由第一容積變成小於第一容積且大於零之第二容積,並且在停止吐出之處理液再開始流通前對前述開關閥輸出控制信號,使處理液供給通路關閉。 Another invention is a processing liquid supply device that supplies a processing liquid to a to-be-processed body through a processing liquid supply path and a nozzle through a liquid feeding mechanism, and is characterized by including: a switching valve provided in the processing liquid supply path; And a control unit for temporarily stopping the discharge of the processing liquid from the nozzle, outputting a control signal to the on-off valve, changing the volume of the processing liquid supply path from a first volume to a second volume smaller than the first volume and greater than zero, and stopping Before the discharged processing liquid starts to flow again, a control signal is output to the on-off valve to close the processing liquid supply path.

再一發明係一種處理液供給方法,其藉由送液機構透過處理液供給通路及噴嘴將處理液供給至被處理體,且特徵在於:使用:開關閥,其設置於前述處理液供給通路中;及流路調整部,其設於前述開關閥與噴嘴間之處理液供給通路中,並改變處理液供給通路之一部分的截面積來調整容積,進行以下步驟:由前述噴嘴吐出處理液並供給至被處理體;然後,為了暫時停止由該噴嘴吐出處理液,藉由前述流路調整部,將處理液供給通路之容積由第一容積調整至小於第一容積且大於零之第二容積;及前述處理液供給通路之容積調整至第二容積後,在停止吐出之處理液再開始流通前藉由前述開關閥關閉處理液供給通路。 Still another invention is a processing liquid supply method, which supplies a processing liquid to a to-be-processed object through a processing liquid supply path and a nozzle through a liquid feeding mechanism, and is characterized by using: a switching valve provided in the processing liquid supply path. And a flow path adjusting section, which is provided in the processing liquid supply path between the on-off valve and the nozzle, and changes the cross-sectional area of a part of the processing liquid supply path to adjust the volume, and performs the following steps: the processing liquid is discharged from the nozzle and supplied To the object to be processed; then, in order to temporarily stop the processing liquid from being discharged from the nozzle, the volume of the processing liquid supply passage is adjusted from the first volume to a second volume smaller than the first volume and greater than zero by the aforementioned flow path adjusting section; After the volume of the processing liquid supply path is adjusted to a second volume, the processing liquid supply path is closed by the on-off valve before the processing liquid that has been discharged is stopped and the circulation is started.

又一發明係一種處理液供給方法,其藉由送液機構透過處理液供給通路及噴嘴將處理液供給至被處理體,且特徵在於進行以下步驟:由前述噴嘴吐出處理液並供給至被處理體;然後,為了暫時停止由該噴嘴吐出處理液,藉由設於前述處理液供給通路中之開關閥,將處理液供給通路之容積由第一容積調整至小於第一容積且大於零之第二容積;及在停止吐出之處理液再開始流通前藉由前述開關閥關閉處理液供給通路。 Still another invention is a processing liquid supply method, which supplies a processing liquid to a to-be-processed object through a processing liquid supply path and a nozzle through a liquid feeding mechanism, and is characterized by performing the following steps: discharging the processing liquid from the nozzle and supplying it to the processing object Then, in order to temporarily stop the processing liquid from being ejected from the nozzle, the volume of the processing liquid supply path is adjusted from the first volume to a first volume smaller than the first volume and greater than zero by means of a switching valve provided in the foregoing processing liquid supply path. Two volumes; and closing the processing liquid supply path by the aforementioned on-off valve before the processing liquid that has been discharged is resumed.

本發明之記錄媒體記錄了用於處理液供給裝置之電腦程式,而該處理液供給裝置藉由送液機構透過處理液供給通路及噴嘴將處理液供給至被處理體,該記錄媒體之特徵在於:前述電腦程式編成步驟群,以便實行上述處理液供給方法。 The recording medium of the present invention records a computer program for a processing liquid supply device, and the processing liquid supply device supplies a processing liquid to a subject through a processing liquid supply path and a nozzle through a liquid feeding mechanism. The recording medium is characterized in that : The aforementioned computer program is compiled into a group of steps in order to implement the above-mentioned method for supplying a processing liquid.

本發明在處理液之斷液方面,著眼於藉由使處理液供給通路即使未完全關閉亦變窄來暫時地斷液。因此,藉由流路調整部,將處理液供給通路之容積由第一容積調整至小於第一容積且大於零之第二容積,在處理液由處理液暫時停止吐出狀態回復流通前藉由前述開關閥關閉處理液供給通路。因此,即使不急劇地關閉亦可達成急速之斷液及停止吐液,故可減少因急劇地關閉開關閥而產生粒子。 The present invention is directed to temporarily shut off the liquid by narrowing the processing liquid supply passage even if the processing liquid supply path is not completely closed, in terms of the liquid breaking of the processing liquid. Therefore, the volume of the processing liquid supply path is adjusted from the first volume to a second volume smaller than the first volume and greater than zero by the flow path adjusting section. The on-off valve closes the processing liquid supply path. Therefore, even if the liquid is not shut off abruptly, rapid liquid cut-off and liquid discharge stop can be achieved. Therefore, particles generated by abruptly closing the on-off valve can be reduced.

1‧‧‧閥單元 1‧‧‧valve unit

2‧‧‧氣動閥 2‧‧‧pneumatic valve

3‧‧‧吸回閥 3‧‧‧ Suction valve

6‧‧‧處理液容器 6‧‧‧ treatment liquid container

7‧‧‧噴嘴 7‧‧‧ Nozzle

9‧‧‧控制部 9‧‧‧ Control Department

10‧‧‧承杯模組 10‧‧‧Cup bearing module

11‧‧‧旋轉夾盤 11‧‧‧Rotary Chuck

12‧‧‧旋轉軸 12‧‧‧rotation axis

13‧‧‧旋轉機構 13‧‧‧rotating mechanism

14‧‧‧第一流路 14‧‧‧First Stream

15‧‧‧第二流路 15‧‧‧Second stream

16‧‧‧第三流路 16‧‧‧ Third Stream

17‧‧‧耦合件 17‧‧‧ Coupling

18‧‧‧耦合件 18‧‧‧ coupling

20‧‧‧第一殼體 20‧‧‧First case

21‧‧‧閥室 21‧‧‧Valve Chamber

22‧‧‧閥座 22‧‧‧Valve seat

23‧‧‧閥體 23‧‧‧Valve body

24‧‧‧驅動室 24‧‧‧Drive Room

25‧‧‧閥桿 25‧‧‧ Stem

26‧‧‧彈簧構件 26‧‧‧Spring member

27‧‧‧圓板部 27‧‧‧Circular Department

28‧‧‧上方區域 28‧‧‧upper area

29‧‧‧下方區域 29‧‧‧ area below

30‧‧‧第二殼體 30‧‧‧Second shell

31‧‧‧隔膜室 31‧‧‧ Diaphragm Room

32‧‧‧隔膜 32‧‧‧ diaphragm

34‧‧‧驅動室 34‧‧‧Drive Room

35‧‧‧閥桿 35‧‧‧ Stem

36‧‧‧彈簧構件 36‧‧‧Spring member

37‧‧‧圓板部 37‧‧‧Circular Department

38‧‧‧上方區域 38‧‧‧upper area

39‧‧‧下方區域 39‧‧‧ area below

41‧‧‧空氣流路 41‧‧‧air flow path

43‧‧‧供給閥 43‧‧‧supply valve

44‧‧‧排出閥 44‧‧‧Exhaust valve

45‧‧‧電磁繼電器電路 45‧‧‧Electromagnetic relay circuit

46‧‧‧孔部 46‧‧‧ Hole

51‧‧‧抗蝕液供給通路 51‧‧‧ resist supply channel

52‧‧‧過濾器 52‧‧‧Filter

54‧‧‧流量調整部 54‧‧‧Flow adjustment department

55‧‧‧氣體供給通路 55‧‧‧Gas supply channel

56‧‧‧緩衝槽 56‧‧‧ buffer tank

57‧‧‧大氣開放路 57‧‧‧Atmosphere Open Road

58‧‧‧開關閥 58‧‧‧On-off valve

59‧‧‧開關閥 59‧‧‧On-off valve

60‧‧‧開關閥 60‧‧‧On-off valve

61‧‧‧空氣流路 61‧‧‧air flow path

63‧‧‧供給閥 63‧‧‧supply valve

64‧‧‧排出閥 64‧‧‧Exhaust valve

65‧‧‧電磁繼電器電路 65‧‧‧ electromagnetic relay circuit

66‧‧‧孔部 66‧‧‧ Hole

71‧‧‧塊體 71‧‧‧block

72‧‧‧抗蝕液導入埠 72‧‧‧ resist introduction port

73‧‧‧抗蝕液排出埠 73‧‧‧ resist discharge port

91‧‧‧閥室 91‧‧‧valve

92‧‧‧閥座 92‧‧‧Valve seat

93‧‧‧閥體 93‧‧‧Valve body

100‧‧‧抗蝕液供給裝置 100‧‧‧ resist supply device

200‧‧‧開關閥 200‧‧‧On-off valve

201‧‧‧馬達 201‧‧‧ Motor

202‧‧‧馬達軸 202‧‧‧Motor shaft

t1‧‧‧時刻 t1‧‧‧time

t2‧‧‧時刻 t2‧‧‧time

t3‧‧‧時刻 t3‧‧‧time

t4‧‧‧時刻 t4‧‧‧time

t5‧‧‧時刻 t5‧‧‧time

t6‧‧‧時刻 t6‧‧‧time

t7‧‧‧時刻 t7‧‧‧time

t8‧‧‧時刻 t8‧‧‧time

LC‧‧‧時點 LC‧‧‧ hour

P‧‧‧泵 P‧‧‧Pump

W‧‧‧晶圓 W‧‧‧ Wafer

[圖1]係顯示本發明處理液供給裝置之抗蝕液供給通路的說明圖。 [FIG. 1] An explanatory view showing a resist liquid supply path of a processing liquid supply device of the present invention.

[圖2]係顯示本發明處理液供給裝置之閥單元的剖面圖。 [FIG. 2] A sectional view showing a valve unit of the processing liquid supply device of the present invention.

[圖3]係顯示習知處理液供給裝置之閥開關順序的說明圖。 [Fig. 3] Fig. 3 is an explanatory diagram showing a valve opening and closing sequence of a conventional treatment liquid supply device.

[圖4](a)、(b)、(c)係顯示利用水鎚現象之斷液原理的說明圖。 [Fig. 4] (a), (b), and (c) are explanatory diagrams showing the principle of liquid-cutting using the water hammer phenomenon.

[圖5]係顯示本發明處理液供給裝置之閥開關順序的說明圖。 [Fig. 5] Fig. 5 is an explanatory diagram showing a valve opening / closing sequence of the processing liquid supply device of the present invention.

[圖6]係顯示閥單元之作用的說明圖。 [FIG. 6] An explanatory view showing an operation of a valve unit.

[圖7]係顯示閥單元之作用的說明圖。 [Fig. 7] An explanatory view showing an operation of a valve unit.

[圖8]係顯示閥單元之作用的說明圖。 [Fig. 8] Fig. 8 is an explanatory diagram showing an operation of a valve unit.

[圖9]係顯示本發明實施形態之閥單元另一例的剖面圖。 [FIG. 9] A sectional view showing another example of a valve unit according to the embodiment of the present invention.

[圖10]係顯示本發明實施形態之閥單元再一例的剖面圖。 [FIG. 10] A sectional view showing still another example of the valve unit according to the embodiment of the present invention.

[圖11]係顯示第二實施形態之閥單元的剖面圖。 [FIG. 11] A sectional view showing a valve unit of a second embodiment.

[圖12]係顯示實施例之效果的特性圖。 Fig. 12 is a characteristic diagram showing the effect of the embodiment.

[第一實施形態] [First Embodiment]

圖1顯示本發明液處理裝置實施形態之抗蝕液塗布裝置的概略圖,且抗蝕液塗布裝置具有處理液供給裝置之抗蝕液供給裝置100、及承杯模組10。承杯模組10係組配成藉由承杯90承接由基板之半導體晶圓(以下稱為「晶圓」)W飛散之抗蝕液並由排氣管101排出,且具有吸附晶圓W之背面中央部使其保持水平之旋轉夾盤11。旋轉夾盤11透過垂直延伸之旋轉軸12而與旋轉機構13連接。旋轉機構13具有未圖示之旋轉馬達等之旋轉驅動源,且組配成可以預定之速度旋轉。 FIG. 1 shows a schematic view of a resist coating apparatus according to an embodiment of the liquid processing apparatus of the present invention. The resist coating apparatus includes a resist liquid supply apparatus 100 and a cup holder module 10 for a processing liquid supply apparatus. The cup receiving module 10 is configured to receive the scattered semiconductor wafer (hereinafter referred to as "wafer") W from the substrate through the cup 90 and discharge it from the exhaust pipe 101, and has an adsorption wafer W The central part of the rear surface keeps the rotating chuck 11 horizontal. The rotating chuck 11 is connected to the rotating mechanism 13 through a vertically extending rotating shaft 12. The rotation mechanism 13 includes a rotation drive source such as a rotation motor (not shown), and is configured to rotate at a predetermined speed.

抗蝕液供給裝置100具有:處理液容器6,其形成貯留處理液,即例如在25℃下黏度1cP至10cP之抗蝕液的處理液供給源;噴嘴7,其吐出抗蝕液(處理液)至被處理基板,即晶圓W;及抗蝕液供給通路51,係由連接處理液容器6及噴嘴7之配管構成的處理液流路。抗蝕液供給通路51由上游側依序設有:暫時地貯存來自處理液容器6之處理液的緩衝槽56;過濾抗蝕液以便去除異物的過濾器52; 送液機構之泵P;流量調整部54;及作為處理液之供給開關閥的操作閥(以下稱為「氣動閥」)2及吸回閥3。 The resist liquid supply device 100 includes a processing liquid container 6 that forms a processing liquid supply source that stores a processing liquid, that is, a resist liquid having a viscosity of 1 cP to 10 cP at 25 ° C., and a nozzle 7 that discharges the resist liquid (processing liquid ) To the substrate to be processed, that is, the wafer W; and the resist liquid supply path 51 is a processing liquid flow path formed by a pipe connecting the processing liquid container 6 and the nozzle 7. The resist liquid supply path 51 is sequentially provided from the upstream side: a buffer tank 56 for temporarily storing the processing liquid from the processing liquid container 6; a filter 52 for filtering the resist liquid to remove foreign matter; The pump P of the liquid-feeding mechanism; the flow rate adjusting unit 54; and an operation valve (hereinafter referred to as a “pneumatic valve”) 2 and a suction return valve 3 as a supply switching valve for the processing liquid.

處理液容器6之氣相中設有與惰性氣體,例如氮(N2)氣之供給源連接的氣體供給通路55。此外,緩衝槽56之上部設有使滯留於緩衝槽56上部之惰性氣體,例如氮(N2)氣開放至大氣的大氣開放路57。另外,圖中之58至60係開關閥。 A gas supply path 55 connected to a supply source of an inert gas such as nitrogen (N 2 ) gas is provided in the gas phase of the processing liquid container 6. In addition, an upper part of the buffer tank 56 is provided with an atmosphere open path 57 for allowing an inert gas, such as nitrogen (N 2 ) gas, to be trapped in the upper portion of the buffer tank 56 to the atmosphere. In addition, 58 to 60 series on-off valves are shown in the figure.

氣動閥2及吸回閥3構成互相連接設置之2連閥。若將該2連閥之結構體稱為閥單元,則如圖2所示地,閥單元1具有由例如氟樹脂等構成之大略長方體形的塊體71,且塊體71之一側面上形成有供給處理液之抗蝕液導入埠72,而與一側面對向之側面上形成有抗蝕液排出埠73。 The pneumatic valve 2 and the suction return valve 3 constitute two connected valves which are connected to each other. If the two-valve structure is referred to as a valve unit, as shown in FIG. 2, the valve unit 1 has a substantially rectangular parallelepiped block 71 made of, for example, a fluororesin, and one side of the block 71 is formed. A resist liquid introduction port 72 is provided for supplying the processing liquid, and a resist liquid discharge port 73 is formed on a side facing the side.

塊體71中形成有連接於抗蝕液導入埠72,並水平延伸後向上方延伸之第一流路14。此外,塊體71之內部形成有圓筒狀之閥室21,而第一流路14在閥室21之底面的周緣部開口。在閥室21之底面的中央,第二流路15開口,且以包圍第二流路15之開口周圍的方式設有閥座22。閥座22係組配成越向上端寬度越小。閥室21中配置有開關閥座22之閥體23。 A first flow path 14 is formed in the block 71 and is connected to the resist introduction port 72 and extends horizontally and extends upward. In addition, a cylindrical valve chamber 21 is formed inside the block 71, and the first flow path 14 is opened at a peripheral portion of a bottom surface of the valve chamber 21. In the center of the bottom surface of the valve chamber 21, the second flow path 15 is opened, and a valve seat 22 is provided so as to surround the periphery of the opening of the second flow path 15. The valve seat 22 is assembled so that the width becomes smaller toward the upper end. A valve body 23 that opens and closes the valve seat 22 is disposed in the valve chamber 21.

塊體71之上面側的閥室21上方設有第一殼體20。第一殼體20具有驅動室24,且驅動室24中設有下端連接於閥體23並在驅動室24內升降之閥桿25。此外,閥桿25之周圍設有圓板部27,且圓板部27連接於驅動室24之內周壁並氣密地界 定驅動室24之上方區域28及下方區域29。藉由設於圓板部27之上面與驅動室24之頂板間並經常賦予勢能的彈簧構件26,朝下方側推壓閥桿25。 A first case 20 is provided above the valve chamber 21 on the upper side of the block 71. The first housing 20 has a driving chamber 24, and a valve stem 25 having a lower end connected to the valve body 23 and lifting in the driving chamber 24 is provided in the driving chamber 24. In addition, a circular plate portion 27 is provided around the valve stem 25, and the circular plate portion 27 is connected to the inner peripheral wall of the driving chamber 24 and is air-tightly bounded The upper region 28 and the lower region 29 of the fixed driving chamber 24. A spring member 26 provided between the upper surface of the circular plate portion 27 and the top plate of the drive chamber 24 and constantly imparting potential energy pushes the valve stem 25 downward.

在驅動室24之下方區域29連接於用以進行加壓空氣之供給排出的空氣流路41,而上方區域28設有用以將上方區域28內之空氣排出至外部的孔部46。空氣流路41連接於將加壓空氣送至下方區域29之供給閥43及由下方區域29排出加壓空氣之排出閥44。供給閥43、排出閥44係組配成藉由電磁繼電器電路45控制開關,例如,若電磁繼電器電路45內之螺線管通電而導通,則供給閥43呈「開」狀態,而排出閥44呈「關」狀態,且加壓空氣由空氣流路41供給至下方區域29。若加壓空氣供給至下方區域29,使壓力升高,則閥桿25抵抗彈簧構件26之賦勢力而上升,使閥體23與閥座22分離。此外,若螺線管停止通電而斷路,則供給閥43呈「關」狀態,而排出閥44呈「開」狀態,且下方區域29之加壓空氣由空氣流路41排出。結果,若下方區域29之壓力下降,閥桿25因彈簧構件26之賦勢力而下降,使閥體23安放在閥座22上。在該例中,第一殼體20、閥室21、閥體23及閥座22相當於氣動閥2。 A region 29 below the drive chamber 24 is connected to an air flow path 41 for supplying and discharging pressurized air, and a hole 46 for discharging air in the upper region 28 to the outside is provided in the upper region 28. The air flow path 41 is connected to a supply valve 43 that sends pressurized air to the lower region 29 and a discharge valve 44 that discharges pressurized air from the lower region 29. The supply valve 43 and the discharge valve 44 are configured to be controlled by an electromagnetic relay circuit 45. For example, if the solenoid in the electromagnetic relay circuit 45 is energized and turned on, the supply valve 43 is in an "open" state, and the discharge valve 44 It is in the "off" state, and pressurized air is supplied from the air flow path 41 to the lower region 29. When pressurized air is supplied to the lower region 29 to increase the pressure, the valve stem 25 rises against the biasing force of the spring member 26 and separates the valve body 23 from the valve seat 22. In addition, if the solenoid is turned off and disconnected, the supply valve 43 is in the "off" state, the discharge valve 44 is in the "on" state, and the pressurized air in the lower region 29 is discharged from the air flow path 41. As a result, if the pressure in the lower region 29 decreases, the valve stem 25 is lowered by the urging force of the spring member 26, so that the valve body 23 is placed on the valve seat 22. In this example, the first housing 20, the valve chamber 21, the valve body 23, and the valve seat 22 correspond to the pneumatic valve 2.

回到第二流路15,第二流路15之另一端連接於隔膜室31。第三流路16之一端開口於隔膜室31,且第三流路16之另一端側連接於抗蝕液排出埠73。隔膜室31之頂板由可撓性構件之隔膜32構成,且組配成若隔膜32朝下方側彎曲,隔膜室31之容積減少,而若隔膜32朝上方側彎曲,隔膜室31之容積增加。隔膜室31可說是構成處理液由第二流路15流入且流出至第三流路16之抗蝕液供給通路51的一部分。因此,藉由使隔膜室31之容積變化,可調整抗蝕液供給通路51之截 面積,且使隔膜32彎曲至最下方側時,抗蝕液供給通路51之容積最小,而使隔膜32彎曲至最上方側時,抗蝕液供給通路51之容積最大。此外,隔膜32亦設置成在彎曲至最下方側時使抗蝕液供給通路51之截面積不為零。 Returning to the second flow path 15, the other end of the second flow path 15 is connected to the diaphragm chamber 31. One end of the third flow path 16 is opened in the diaphragm chamber 31, and the other end side of the third flow path 16 is connected to the resist liquid discharge port 73. The top plate of the diaphragm chamber 31 is composed of the diaphragm 32 of a flexible member, and is configured such that if the diaphragm 32 is bent downward, the volume of the diaphragm chamber 31 decreases, and if the diaphragm 32 is bent upward, the volume of the diaphragm chamber 31 increases. The diaphragm chamber 31 can be said to constitute a part of the resist liquid supply path 51 in which the processing liquid flows in from the second flow path 15 and flows out to the third flow path 16. Therefore, by changing the volume of the diaphragm chamber 31, the cutoff of the resist supply path 51 can be adjusted. When the diaphragm 32 is bent to the lowermost side, the volume of the resist liquid supply path 51 is the smallest, and when the diaphragm 32 is bent to the uppermost side, the volume of the resist liquid supply path 51 is the largest. In addition, the diaphragm 32 is also provided so that the cross-sectional area of the resist liquid supply path 51 does not become zero when it is bent to the lowermost side.

塊體71之上面側的隔膜室31上方配置有用以使隔膜32朝上方側及下方側彎曲之第二殼體30。第二殼體30具有驅動室34,且驅動室34設有連接於隔膜32之中央部上面側並在驅動室34內升降的閥桿35。此外,閥桿35之周圍設有圓板部37,且圓板部37連接於驅動室34之內周壁並氣密地界定驅動室34之上方區域38及下方區域39。藉由設於驅動室34之底面與圓板部37之下面間並經常賦予勢能的彈簧構件36,朝上方側推壓閥桿35。 A second case 30 is disposed above the diaphragm chamber 31 on the upper side of the block 71 so that the diaphragm 32 is bent upward and downward. The second housing 30 has a driving chamber 34, and the driving chamber 34 is provided with a valve stem 35 connected to the upper surface side of the central portion of the diaphragm 32 and lifting in the driving chamber 34. In addition, a circular plate portion 37 is provided around the valve stem 35, and the circular plate portion 37 is connected to the inner peripheral wall of the driving chamber 34 and hermetically defines an upper region 38 and a lower region 39 of the driving chamber 34. A spring member 36 provided between the bottom surface of the drive chamber 34 and the lower surface of the circular plate portion 37 and constantly imparting potential energy pushes the valve stem 35 toward the upper side.

在驅動室34之圓板部37的上方區域38連接於用以進行加壓空氣之供給排出的空氣流路61,且下方區域39設有用以將下方區域39內之空氣排出至外部的孔部66。空氣流路61連接於將加壓空氣送至上方區域38之供給閥63及由上方區域38排出加壓空氣之排出閥64。供給閥63、排出閥64係組配成藉由電磁繼電器電路65控制開關,例如,若電磁繼電器電路65內之螺線管通電而導通,則供給閥63呈「開」狀態,而排出閥64呈「關」狀態,且加壓空氣由空氣流路61供給至上方區域38。若加壓空氣供給至上方區域38,使壓力升高,則閥桿35抵抗彈簧構件36之賦勢力而下降,使隔膜32朝下方側彎曲。此外,若螺線管停止通電而斷路,則供給閥63呈「關」狀態,而排出閥64呈「開」狀態,使上方區域38之加壓空氣由空氣流路61排出。結果,上方區域38之壓力下降,且閥桿35因彈簧 構件36之賦勢力而上升,使隔膜32朝上方側彎曲。在該例中,第二殼體30、隔膜室31及隔膜32相當於吸回閥3。 The upper region 38 of the circular plate portion 37 of the driving chamber 34 is connected to the air flow path 61 for supplying and discharging pressurized air, and the lower region 39 is provided with a hole portion for exhausting the air in the lower region 39 to the outside. 66. The air flow path 61 is connected to a supply valve 63 that sends pressurized air to the upper region 38 and a discharge valve 64 that discharges pressurized air from the upper region 38. The supply valve 63 and the discharge valve 64 are configured to be controlled by an electromagnetic relay circuit 65. For example, if the solenoid in the electromagnetic relay circuit 65 is energized and turned on, the supply valve 63 is in an "open" state, and the discharge valve 64 It is in the "off" state, and pressurized air is supplied from the air flow path 61 to the upper region 38. When pressurized air is supplied to the upper region 38 to increase the pressure, the valve stem 35 is lowered against the biasing force of the spring member 36, and the diaphragm 32 is bent downward. In addition, if the solenoid is turned off and disconnected, the supply valve 63 is in the "off" state and the discharge valve 64 is in the "open" state, so that the pressurized air in the upper region 38 is discharged through the air flow path 61. As a result, the pressure in the upper region 38 decreases, and the valve stem 35 The energizing force of the member 36 rises, and the diaphragm 32 is bent upward. In this example, the second case 30, the diaphragm chamber 31, and the diaphragm 32 correspond to the suction check valve 3.

閥單元1中之抗蝕液導入埠72及抗蝕液排出埠73分別藉由耦合件17、18連接於抗蝕液供給通路51。 The resist liquid introduction port 72 and the resist liquid discharge port 73 in the valve unit 1 are connected to the resist liquid supply path 51 through the coupling members 17 and 18, respectively.

請再參閱圖1,抗蝕液供給裝置100設有例如由電腦構成之控制部9。控制部9具有程式儲存部,且程式儲存部中儲存依據後述順序編成切換圖2所示之電磁繼電器電路45、65、調整流量調整部54及藉泵P傳送抗蝕液等之命令的程式。該程式藉由例如軟碟、光碟、硬碟、MO(光磁碟)、記憶卡等之記錄媒體儲存並安裝在控制部9中。 Referring to FIG. 1 again, the resist supply device 100 is provided with a control unit 9 composed of, for example, a computer. The control unit 9 has a program storage unit. The program storage unit stores a program that is programmed to switch the electromagnetic relay circuits 45 and 65 shown in FIG. 2, the flow rate adjustment unit 54, and the pump P to transmit a resist solution in accordance with the sequence described later. The program is stored and installed in the control section 9 through a recording medium such as a floppy disk, an optical disk, a hard disk, an MO (Optical Disk), a memory card, and the like.

以下說明上述實施形態之作用。作為基板之晶圓W在藉由未圖示之搬送臂傳送至承杯模組10內之旋轉夾盤11後,使晶圓W旋轉預定轉數,以預先設定之吐出量由噴嘴7吐出作為處理液之抗蝕液至晶圓W的中心部。抗蝕液之吐出係藉由開啟氣動閥2並且使泵P動作,使由處理液容器6送出之緩衝槽56內的抗蝕液通過抗蝕液供給通路51朝下游側移動。因此,以藉例如流量調整部54設定之流量由噴嘴7吐出抗蝕液。接著,吐出設定量之抗蝕液後,停止泵P之動作並且藉由吸回閥3及氣動閥2之動作停止吐出抗蝕液。 The effect of the above embodiment will be described below. The wafer W as a substrate is transferred to the rotating chuck 11 in the cup holder module 10 by a transfer arm (not shown), and the wafer W is rotated by a predetermined number of rotations, and is ejected by the nozzle 7 at a preset ejection amount as The resist of the processing liquid reaches the center of the wafer W. The discharge of the resist liquid is to open the pneumatic valve 2 and operate the pump P to move the resist liquid in the buffer tank 56 sent from the processing liquid container 6 to the downstream side through the resist liquid supply path 51. Therefore, the resist liquid is discharged from the nozzle 7 at a flow rate set by, for example, the flow rate adjustment unit 54. Next, after a predetermined amount of the resist solution is discharged, the operation of the pump P is stopped and the discharge of the resist solution is stopped by the operations of the suction valve 3 and the pneumatic valve 2.

在此,在詳細說明本實施形態中之抗蝕液的停止吐出,即噴嘴7之斷液前,以習知實施之藉由氣動閥2之關動作來斷液的情形作為比較例,一面參照圖3及圖4一面說明。圖3顯示抗蝕液之吐出及停止、螺線管之導通及斷路(在圖3之例 中,顯示氣動閥2之螺線管)、及氣動閥2及吸回閥3之開關的時間圖。首先由抗蝕液之吐出動作說明,在時刻t1依據來自控制部9之信號令用以進行氣動閥2之開關的電磁繼電器電路45導通(通電於螺線管),使氣動閥2開始開啟,並在時刻t2成為全開之狀態。使抗蝕液一面隨著氣動閥2之開度增大而緩緩地增加由噴嘴7的吐出流量一面吐出,並在時刻t2以設定流量吐出。 Here, before stopping the discharge of the resist liquid in this embodiment, that is, before the liquid is cut off from the nozzle 7, a case where the liquid is cut off by the closing operation of the pneumatic valve 2 as a comparative example is used as a comparative example. Figures 3 and 4 are explained on the one hand. Figure 3 shows the discharge and stop of the resist solution, the on and off of the solenoid (the example in Figure 3 In the figure, the time charts of the solenoids of the pneumatic valve 2 and the switches of the pneumatic valve 2 and the suction valve 3 are shown. First, the operation of discharging the resist solution is explained. At time t1, the electromagnetic relay circuit 45 for turning on and off the pneumatic valve 2 is turned on according to a signal from the control unit 9 (powered on the solenoid), so that the pneumatic valve 2 starts to open. And it becomes fully open at time t2. The resist liquid is gradually discharged while increasing the discharge flow rate of the nozzle 7 as the opening degree of the pneumatic valve 2 is increased, and is discharged at a set flow rate at time t2.

另一方面,吸回閥3在時刻t1前,呈開度大之吸回狀態,在時刻t1開度開始變小,並維持於預定小開度之狀態,即準備狀態。此外,為方便記載,在以下之說明中,為簡化吸回閥開度之說明,使用所謂「吸回狀態」、「準備狀態」之用語。 On the other hand, before the time t1, the suction check valve 3 is in a sucking state with a large opening degree, and at the time t1, the opening degree becomes small and is maintained at a predetermined small opening degree, that is, in a ready state. In addition, for the convenience of description, in the following description, in order to simplify the explanation of the opening degree of the suction valve, the terms "suction state" and "ready state" are used.

接著在時刻t3螺線管依據來自控制部9之控制信號斷路(停止螺線管之通電),而氣動閥2在時刻t3後之時刻t5呈全關之狀態。即氣動閥2急劇地關閉並在時刻t5停止由噴嘴7吐出抗蝕液。此外,在時刻t3吸回閥3之開度由準備之狀態開始增加,並在時刻t6成為吸回狀態的開度。藉由增加該吸回閥3之開度,噴嘴7側之抗蝕液被吸引至吸回閥3側而拉高噴嘴7中之液面高度,因此可防止液滴流。 Then at time t3, the solenoid is disconnected according to a control signal from the control unit 9 (stops the solenoid from being energized), and the pneumatic valve 2 is fully closed at time t5 after time t3. That is, the pneumatic valve 2 closes abruptly and stops discharging the resist solution from the nozzle 7 at time t5. In addition, the opening degree of the suction valve 3 is increased from the ready state at time t3, and becomes the opening degree of the suction state at time t6. By increasing the opening degree of the suction-return valve 3, the resist liquid on the nozzle 7 side is attracted to the suction-return valve 3 side and the height of the liquid surface in the nozzle 7 is raised, so that the liquid droplet flow can be prevented.

在此,圖4顯示關閉氣動閥2時之抗蝕液供給通路51內的情形。藉由關閉氣動閥2,氣動閥2之上游側的抗蝕液流量如圖4(a)所示地按照氣動閥2之開度減少而減少,並在全閉時流量成為零。相對於此,在氣動閥2之下游側,即使氣動閥2全閉,抗蝕液亦可因慣性力而流至噴嘴7側,因此,如圖4(b)所示地,氣動閥2 之吐出口附近成為負壓狀態。因此,成為類似於拉伸負壓彈簧時之現象的現象,且呈負壓之區域向噴嘴7之前端傳播,並在噴嘴7之前端(開放端)反射,接著產生拉回作用。此時分離成由噴嘴7下降之液體及欲返回之液體,結果形成在噴嘴7前端之斷液。然後抗蝕液供給通路51之流動方向的抗蝕液振動持續衰減,最後停止振動。圖4(c)顯示噴嘴7前端之壓力的時間推移,且抗蝕液之負壓變成最大後在負壓開始減少之時點LC產生斷液。 Here, FIG. 4 shows a state in the resist supply path 51 when the pneumatic valve 2 is closed. By closing the pneumatic valve 2, the flow rate of the resist liquid on the upstream side of the pneumatic valve 2 decreases as the opening degree of the pneumatic valve 2 decreases as shown in FIG. 4 (a), and the flow rate becomes zero when fully closed. In contrast, on the downstream side of the pneumatic valve 2, even if the pneumatic valve 2 is fully closed, the resist liquid can flow to the nozzle 7 side due to inertial force. Therefore, as shown in FIG. 4 (b), the pneumatic valve 2 The vicinity of the spit outlet becomes a negative pressure state. Therefore, it is a phenomenon similar to the phenomenon when the negative pressure spring is stretched, and the area under negative pressure propagates toward the front end of the nozzle 7, reflects at the front end (open end) of the nozzle 7, and then pulls back. At this time, it is separated into the liquid lowered by the nozzle 7 and the liquid to be returned, and as a result, the liquid cut off at the front end of the nozzle 7 is formed. Then, the vibration of the resist in the flow direction of the resist supply path 51 is continuously attenuated, and finally the vibration is stopped. FIG. 4 (c) shows that the pressure at the front end of the nozzle 7 has elapsed over time, and after the negative pressure of the resist solution becomes the maximum, the liquid is cut off at the point when the negative pressure starts to decrease.

由以上說明可知,關閉氣動閥2後,抗蝕液呈負壓狀態,可說是藉由負壓彈簧之作用在後來拉回時產生斷液。回到本實施形態之說明,在本實施形態中,著眼於該現象並控制氣動閥2及吸回閥3之各動作。圖5係包含本實施形態之氣動閥2及吸回閥3的各開關狀態的時間圖。開始供給抗蝕液時,吸回閥3之狀態與圖3所示之先前比較例不同,維持在開度比準備狀態之開度大的吸回狀態。即,雖然在時刻t1氣動閥2側之電磁繼電器電路45的螺線管成為導通狀態而開啟氣動閥2,但吸回閥3由時刻t1之前成為吸回狀態,並在時刻t2以後亦維持該狀態。圖6顯示時刻t2至t3之氣動閥2及吸回閥3的狀態。 As can be seen from the above description, after the pneumatic valve 2 is closed, the resist liquid is in a negative pressure state, and it can be said that the liquid is cut off when it is pulled back later by the action of the negative pressure spring. Returning to the description of this embodiment, in this embodiment, each operation of the pneumatic valve 2 and the suction valve 3 is controlled by focusing on this phenomenon. FIG. 5 is a time chart including each switching state of the pneumatic valve 2 and the suction valve 3 of the present embodiment. When the supply of the resist is started, the state of the suction return valve 3 is different from that of the previous comparative example shown in FIG. 3, and is maintained in a suction return state with an opening degree larger than that of the preparation state. That is, although the solenoid of the electromagnetic relay circuit 45 on the pneumatic valve 2 side is turned on at time t1 and the pneumatic valve 2 is opened, the suction valve 3 becomes a suction state from time t1 and maintains the same after time t2 status. FIG. 6 shows the states of the pneumatic valve 2 and the suction return valve 3 from time t2 to t3.

接著為停止吐出噴嘴7中之抗蝕液,在氣動閥2之關閉動作前,在時刻t3吸回閥3側之電磁繼電器電路65的螺線管斷路,使吸回閥3由吸回狀態減少開度並在時刻t4成為準備狀態。圖7顯示該時點之氣動閥2及吸回閥3的狀態。即,由吸回閥3之開度大的狀態,不成為全閉之狀態而成為稍微開啟之小開度狀態。結果,在吸回閥3之下游側產生如前所述之負壓彈簧的作用而產生斷液,並在時刻t5停止吐出抗蝕液。 Next, to stop the discharge of the resist solution in the nozzle 7, before the closing action of the pneumatic valve 2, the solenoid of the electromagnetic relay circuit 65 on the valve 3 side is cut off at time t3, so that the suction valve 3 is reduced from the suction state. The opening degree is in a ready state at time t4. FIG. 7 shows the state of the pneumatic valve 2 and the suction return valve 3 at this time. In other words, the state in which the opening degree of the suction check valve 3 is large does not become the state in which it is fully closed, but the state in which the degree of opening is slightly opened. As a result, as described above, the action of the negative pressure spring occurs on the downstream side of the suction and return valve 3 to cause a liquid cutoff, and the discharge of the resist liquid is stopped at time t5.

產生負壓彈簧之作用的原因推測如下。由於吸回閥3之隔膜32動作使流路變窄,即,使隔膜32下方之流路部位的容積減少,隔膜32壓入抗蝕液,結果下游側之抗蝕液流速變快,且由於流路變窄,吸回閥3之上游側的抗蝕液流速變慢,另一方面,下游側之抗蝕液可藉慣性力保持流動。因此在吸回閥3之下游側如前所述地產生負壓而產生抗蝕液之振動,故考慮使吸回閥3呈準備狀態後,一小段時間後產生斷液。在該例中,吸回狀態相當於第一狀態,且準備狀態相當於第二狀態。 The reason for the action of the negative pressure spring is presumed as follows. Due to the action of the diaphragm 32 of the suction and return valve 3, the flow path is narrowed, that is, the volume of the flow path portion below the diaphragm 32 is reduced, and the diaphragm 32 is pressed into the resist solution. As a result, the flow rate of the resist solution on the downstream side becomes faster. The flow path becomes narrower, and the flow rate of the resist liquid on the upstream side of the suction return valve 3 becomes slower. On the other hand, the resist liquid on the downstream side can be kept flowing by inertial force. Therefore, a negative pressure is generated on the downstream side of the suction return valve 3 and vibration of the resist liquid is generated as described above. Therefore, after the suction return valve 3 is prepared, it is considered that a liquid cutoff occurs after a short period of time. In this example, the suck-back state corresponds to the first state, and the ready state corresponds to the second state.

若吸回閥3由吸回狀態轉變成準備狀態之時間,即由吐出抗蝕液時之開度到用以產生斷液之小開度的時間很長,斷液會不穩定,因此宜為例如100ms以下。該時間之下限在技術上不需要特別限制,可按照使用之吸回閥3的性能來決定。 If the time for the suction return valve 3 to change from the suction-back state to the ready state, that is, the time from the opening degree when the resist solution is ejected to the small opening degree used to generate the liquid cutoff is very long, the liquid cutoff will be unstable, so it should be For example, less than 100ms. The lower limit of the time does not need to be particularly limited technically, and can be determined according to the performance of the suction and return valve 3 used.

吸回閥3由吸回狀態轉變成準備狀態之容量變化率[{(吸回時之容量一準備時之容量)/吸回時之容量}×100%],亦即藉由隔膜32之動作使容量變化之區間,即隔膜32與隔膜32之投影區域間的流路部位的容量變化率宜為5至30%以上。 The capacity change rate of the suction valve 3 from the suction state to the preparation state [{(volume during suction-capacity during preparation) / capacity during suction}} × 100%], that is, by the action of the diaphragm 32 The capacity change interval, that is, the capacity change rate of the flow path portion between the diaphragm 32 and the projection area of the diaphragm 32 is preferably 5 to 30% or more.

請再參閱圖5,雖然在時刻t5產生斷液,但由於氣動閥2未關閉,在此狀態下後來抗蝕液開始流動(抗蝕液再流通)。因此例如在吸回閥3呈準備狀態之時刻t4,依據控制部9之控制信號使用以使氣動閥2動作之電磁繼電器電路45的螺線管斷路,並關閉氣動閥2。圖8顯示在氣動閥2關閉之時刻t7之氣動閥2及吸回閥3的狀態。 Please refer to FIG. 5 again, although the liquid is cut off at time t5, since the pneumatic valve 2 is not closed, the resist solution starts to flow in this state (resist solution recirculation). Therefore, for example, at time t4 when the suction and return valve 3 is in a prepared state, the solenoid of the electromagnetic relay circuit 45 used to operate the pneumatic valve 2 is opened according to the control signal of the control unit 9, and the pneumatic valve 2 is closed. FIG. 8 shows the state of the pneumatic valve 2 and the suction valve 3 at time t7 when the pneumatic valve 2 is closed.

氣動閥2之關閉動作係藉由排出驅動室24之下方區域29中的加壓空氣來進行,例如藉由調整設有排出閥44之排出側的空氣流路41的傳導率,可控制空氣之排出速度,即閥體23之關閉速度。斷液依靠氣動閥2之圖3所示之比較例的順序時,氣動閥2關閉需要之時間設定為大約50ms,若比該速度慢,斷液會不穩定。若斷液不穩定,抗蝕液在晶圓W上藉離心力擴散後,在該表面上液滴滴流並拉長,因此恐有膜厚分布圖案偏離預定圖案之虞。 The closing operation of the pneumatic valve 2 is performed by discharging the pressurized air in the area 29 below the drive chamber 24. For example, by adjusting the conductivity of the air flow path 41 on the discharge side provided with the discharge valve 44, the air can be controlled. The discharge speed is the closing speed of the valve body 23. When the liquid cut depends on the sequence of the comparative example shown in FIG. 3 of the pneumatic valve 2, the time required for the pneumatic valve 2 to close is set to about 50ms. If the speed is slower than this, the liquid cut will be unstable. If the interruption of the liquid is unstable, after the resist is diffused by the centrifugal force on the wafer W, the liquid droplets flow and stretch on the surface, so there is a fear that the film thickness distribution pattern deviates from the predetermined pattern.

相對於此,在本實施形態中,由於藉由吸回閥3進行斷液,氣動閥2之關閉動作只要在斷液後到液流再開始前之時間內進行即可。因此,可和緩地進行氣動閥2之關閉動作,可用比200ms長之時間,例如250ms之時間來關閉氣動閥2。 In contrast, in this embodiment, since the liquid is cut off by the suction and return valve 3, the closing operation of the pneumatic valve 2 may be performed within a period of time after the liquid is cut off and before the liquid flow is restarted. Therefore, the closing operation of the pneumatic valve 2 can be performed gently. The pneumatic valve 2 can be closed for a time longer than 200 ms, for example, 250 ms.

氣動閥2開始關閉之時點可為即使用比200ms長之時間進行氣動閥2之關閉動作,在藉由吸回閥3之動作達成之斷液後液流未再開始的時點。因此,吸回閥3不限於在成為準備狀態之時刻t4開始關閉氣動閥2,氣動閥2開始關閉動作之時點亦可在吸回閥3成為準備狀態之時刻t4後。 The time when the pneumatic valve 2 starts to close may be a time when the closing operation of the pneumatic valve 2 is performed using a time longer than 200ms, and the liquid flow does not restart after the liquid is cut off by the action of the suction valve 3. Therefore, the suction check valve 3 is not limited to the time when the pneumatic valve 2 starts to close at the time t4 when it is in the ready state, and the time at which the air valve 2 starts the closing operation may be after the time t4 when the suction valve 3 is in the ready state.

在氣動閥2之關閉動作開始時點在吸回閥3成為準備狀態之時刻t4前的情形中,由於吸回閥3之動作及氣動閥2之動作重疊,在抗蝕液供給通路51中之2處同時產生體積變化。因此抗蝕液供給通路51中之液動作複雜,恐有斷液量(吸回閥3成為準備狀態後由噴嘴7流落之液體量)增加之虞。相對於此,藉由在吸回閥3成為準備狀態之時刻t4後開始氣動閥2之關閉動作,因使吸回閥3呈準備狀態產生之體積變化及因關閉氣動閥2產生之體積變化可錯開時點地發生。因此,可在抗蝕液供給通路51中之液動作不複雜之情形下抑制斷液量。 In the case where the closing operation of the pneumatic valve 2 is started before the time t4 at which the suction valve 3 becomes in a ready state, since the operation of the suction valve 3 and the operation of the pneumatic valve 2 overlap, 2 in the resist supply path 51 Volume changes occur at the same time. Therefore, the operation of the liquid in the resist liquid supply path 51 is complicated, and there is a possibility that the amount of liquid cutoff (the amount of liquid flowing from the nozzle 7 after the suction return valve 3 becomes ready) may increase. On the other hand, by starting the closing operation of the pneumatic valve 2 after the time t4 when the suction valve 3 is in a ready state, the volume change caused by the suction valve 3 in a prepared state and the volume change caused by closing the pneumatic valve 2 can be Staggered moments happen. Therefore, it is possible to suppress the amount of liquid interruption when the liquid operation in the resist liquid supply path 51 is not complicated.

請再參閱圖5,在氣動閥2關閉之時刻t7吸回閥3側之電磁繼電器電路65的螺線管依據控制信號導通,使吸回閥3向吸回狀態開始加大開度,並在時刻t8成為吸回狀態而停止拉高噴嘴7前端之液面。晶圓W在抗蝕液之拉伸終止後,以分別對應於膜厚調整步驟、乾燥步驟之旋轉速度旋轉,並在一連串製程結束後,由承杯模組10搬送至外部。 Please refer to FIG. 5 again, at time t7 when the pneumatic valve 2 is closed, the solenoid of the electromagnetic relay circuit 65 on the side of the suction valve 3 is turned on according to the control signal, so that the opening of the suction valve 3 to the suction state starts to increase, and at the moment t8 becomes a suck-back state and stops raising the liquid level at the front end of the nozzle 7. After the stretching of the resist solution is terminated, the wafer W is rotated at a rotation speed corresponding to the film thickness adjustment step and the drying step, and is transferred to the outside by the cup holder module 10 after a series of processes are completed.

上述實施形態係在由噴嘴7吐出之抗蝕液之斷液方面,著眼於藉由使抗蝕液之供給通路即使不完全關閉亦變窄來產生負壓彈簧之現象而暫時地斷液。而且在該例中,藉使吸回閥3由吸回狀態成為準備狀態來產生斷液,使吸回閥3之上游側的氣動閥2具有阻止抗蝕液再開始液流而使液體完全停止之機能。因此,無需急劇地關閉氣動閥2,故可減少因急劇地關閉氣動閥2而產生粒子。 In the above-mentioned embodiment, in regard to the stoppage of the resist liquid discharged from the nozzle 7, the focus is on the phenomenon that a negative pressure spring is generated by narrowing the supply path of the resist liquid even if it is not completely closed, thereby temporarily stopping the liquid. In this example, the suction valve 3 is switched from the suction state to the prepared state to cause the liquid to be cut off, so that the pneumatic valve 2 on the upstream side of the suction valve 3 is provided to prevent the resist liquid from restarting the liquid flow and stop the liquid completely. Function. Therefore, it is not necessary to close the pneumatic valve 2 abruptly, so that generation of particles due to the abrupt closing of the pneumatic valve 2 can be reduced.

以下說明本發明實施形態之閥單元1的另一例。如圖9所示地,閥單元1亦可在吸回閥3中設置閥室91來取代前述之隔膜室31。而且在閥室91之周緣部連接第二流路15之下游端,並且在閥室91之底面中央使第三流路16之上游端開口,並在開口部之周圍設有閥座92。此外,閥室91內設有閥體93,並組配成藉由使閥桿35下降,使閥體93安放在閥座92上。 Hereinafter, another example of the valve unit 1 according to the embodiment of the present invention will be described. As shown in FIG. 9, the valve unit 1 may also be provided with a valve chamber 91 in the suction return valve 3 instead of the aforementioned diaphragm chamber 31. Further, a peripheral edge portion of the valve chamber 91 is connected to a downstream end of the second flow path 15, an upstream end of the third flow path 16 is opened at a center of a bottom surface of the valve chamber 91, and a valve seat 92 is provided around the opening portion. In addition, a valve body 93 is provided in the valve chamber 91 and is assembled to lower the valve stem 35 to place the valve body 93 on the valve seat 92.

在此情形下,若設閥體93上升至最高點時開度為100%,設閥體93安放在閥座92上時開度為0%,且設以閥體93高度位置之百分率顯示的值為閥開度,第一容積之吸回狀態係例如開度100%,且第二容積之準備狀態係例如開度20%。而 且藉由使吸回閥3由開度100%關閉至開度20%,第三流路16之開口部上方的容積變小,且閥體93及閥座92上游側之流速變慢。在閥體93及閥座92下游側,由於可藉由慣性力流至噴嘴7側,第三流路16之開口部附近可形成負壓並如前所述地產生斷液而獲得同樣之效果。 In this case, if the opening degree of the valve body 93 is raised to the highest point, the opening degree is 100%, and when the valve body 93 is placed on the valve seat 92, the opening degree is 0%, and the percentage displayed by the height position of the valve body 93 is set. The value is the valve opening degree. The suction state of the first volume is, for example, 100% of the opening degree, and the preparation state of the second volume is, for example, 20% of the opening degree. and By closing the suction valve 3 from an opening degree of 100% to an opening degree of 20%, the volume above the opening of the third flow path 16 becomes smaller, and the flow velocity on the upstream side of the valve body 93 and the valve seat 92 becomes slower. On the downstream side of the valve body 93 and the valve seat 92, since it can flow to the nozzle 7 side by inertial force, a negative pressure can be formed near the opening of the third flow path 16 and the liquid can be cut off as described above to obtain the same effect. .

本發明實施形態之閥單元1的再一例顯示於圖10中。圖10之閥單元1組配成在圖2所示之結構中,將第二流路15之氣動閥2側的垂直部位進一步向下深挖後向吸回閥3側斜上地傾斜。而且藉由使第二流路15之底部比圖2之結構高,可減少隔膜室31之容積。藉如此之結構,使隔膜32朝下側彎曲時容積之變化率,即處理液流路截面積之變化率更大,可更進一步確實地進行斷液。 Another example of the valve unit 1 according to the embodiment of the present invention is shown in FIG. 10. The valve unit 1 of FIG. 10 is assembled in the structure shown in FIG. 2, and the vertical part on the pneumatic valve 2 side of the second flow path 15 is further dug down and then inclined obliquely up to the suction valve 3 side. Moreover, by making the bottom of the second flow path 15 higher than the structure of FIG. 2, the volume of the diaphragm chamber 31 can be reduced. With this structure, the change rate of the volume when the diaphragm 32 is bent downward, that is, the change rate of the cross-sectional area of the processing liquid flow path is larger, and the liquid can be cut off more reliably.

在以上實施形態中,雖然使吸回閥3具有斷液機能,但亦可在用以在進行斷液後拉高噴嘴7之液面的吸回閥3以外,設置使流路之一部分的容積由第一容積變成小於第一容積之第二容積的流路調整部。在此情形中,流路調整部可設於吸回閥3之上游側及下游側的任一側。 In the above embodiment, although the suction return valve 3 is provided with a liquid shut-off function, a volume of a part of the flow path may be provided in addition to the suction return valve 3 for raising the liquid level of the nozzle 7 after the liquid is cut. A flow path adjusting portion that changes from the first volume to a second volume smaller than the first volume. In this case, the flow path adjusting portion may be provided on either the upstream side or the downstream side of the suction return valve 3.

[第二實施形態] [Second Embodiment]

在第一實施形態中,雖然顯示分別藉由不同閥進行斷液及抗蝕液之遮斷的例子,但在第二實施形態中,顯示共用進行斷液及抗蝕液之遮斷的閥的例子。雖然圖11所示之開關閥200的閥室21、閥體23、閥桿25、驅動室24的結構由機能之觀點來看與圖2所示之氣動閥2大致相同,但在使閥桿25動作之驅動源使用馬達201方面是不同的。閥桿25藉由下方區域29內之彈簧構件26經常朝上側賦予勢能,並與馬達201之馬達軸202的下降一起下降,而在馬達軸202上升時藉由彈簧 構件26之回復力上升。在如此之閥中,藉由使開度接近100%,流速上升,且流速隨著使開度接近0%而逐漸下降,並藉使開度為0%,停止供給抗蝕液。因此,由圖5所示之時刻t3到時刻t4時,開關閥200例如由開度100%關閉到開度2至10%。 In the first embodiment, an example is shown in which the liquid cutoff and the resist liquid are blocked by separate valves. However, in the second embodiment, a valve in which the liquid cutoff and the resist liquid are blocked in common is shown. example. Although the structures of the valve chamber 21, the valve body 23, the valve stem 25, and the drive chamber 24 of the on-off valve 200 shown in FIG. 11 are approximately the same as those of the pneumatic valve 2 shown in FIG. 2 from a functional point of view, The driving source for the 25 action is different from the motor 201. The valve rod 25 is always provided with potential energy by the spring member 26 in the lower region 29, and is lowered together with the lowering of the motor shaft 202 of the motor 201. The restoring force of the component 26 increases. In such a valve, the flow rate rises by making the opening degree close to 100%, and the flow rate gradually decreases as the opening degree approaches 0%, and the supply of the resist solution is stopped when the opening degree becomes 0%. Therefore, from time t3 to time t4 shown in FIG. 5, the on-off valve 200 is closed from, for example, an opening degree of 100% to an opening degree of 2 to 10%.

若進行如此之操作,由於閥體23下方側之容積急劇地變小,與藉由第一實施形態之吸回閥3產生之現象同樣地,該閥體23下游側之流速變快而如前所述地產生負壓彈簧的作用,並同樣地產生斷液。由於在此情形下液流可能再開始,可藉由馬達201使馬達軸202下降,在液流再開始前使開關閥200之開度為0%,亦即使開關閥200呈關閉狀態。在此情形中,關閉開關閥200之動作亦可在用以阻止斷液後再開始液流動之動作後,用例如200ms以上之長時間和緩地進行開度由例如2至10%之狀態到0%的關閉動作。 If such an operation is performed, the volume on the lower side of the valve body 23 becomes drastically smaller, and the flow velocity on the downstream side of the valve body 23 becomes faster and the same as the phenomenon caused by the suction valve 3 of the first embodiment. The ground produces the effect of a negative pressure spring and similarly produces a fluid cut. Since the liquid flow may restart in this case, the motor shaft 202 may be lowered by the motor 201, and the opening degree of the on-off valve 200 is 0% before the liquid flow restarts, even if the on-off valve 200 is closed. In this case, the action of closing the on-off valve 200 can also be used to stop the liquid flow and then start the liquid flow, and then slowly open the opening degree from, for example, 2 to 10% to 0 for a period of more than 200ms. % Closing action.

在該例中,雖然開關閥200之開度為100%時相當於第一容積,且2至10%時相當於小於第一容積之第二容積,但相當於用以產生斷液之第一容積、第二容積的開度可事先進行實驗而設定為適當之值。 In this example, although the opening degree of the on-off valve 200 is equivalent to the first volume when the opening degree is 100%, and the second volume is smaller than the first volume when the opening degree is 2 to 10%, it is equivalent to the first volume for generating a liquid cutoff. The openings of the volume and the second volume can be set to appropriate values by performing experiments in advance.

本發明使用之處理液不限於抗蝕液,亦可為防反射膜用之藥液、包含絕緣膜之前驅物物質的藥液、稀釋劑、純水等,但特別適用於要求急速斷液之製程。 The treatment liquid used in the present invention is not limited to a resist liquid, but may also be a chemical liquid for an antireflection film, a chemical liquid containing a precursor substance of an insulating film, a diluent, pure water, etc. Process.

此外,送液機構不限於泵P,亦可為例如供給氣體至空氣流路61之氣相中而對處理液施加壓力,並壓送供給處理液的送液機構。 In addition, the liquid-feeding mechanism is not limited to the pump P, and may be, for example, a liquid-feeding mechanism that supplies gas to the gas phase of the air flow path 61 to apply pressure to the processing liquid and pressure-feeds the processing liquid.

[確認測試] [Confirmation test]

為驗證本發明之效果,進行以下之測試。測試方法係由上游側依序配置泵、圖2所示之閥單元1、噴嘴並且在閥單元1之下游側設置壓力計,並使用稀釋劑作為液體。而且分別在如前述比較例(圖3)地急劇地關閉吸回閥3之情形,及如實施形態(圖5)地使吸回閥3由吸回狀態成為準備狀態之情形中,測量壓力計之檢測壓力的時間推移。測量結果顯示於圖12中,虛線(1)相當於比較例,且實線(2)相當於實施形態。 In order to verify the effect of the present invention, the following tests were performed. The test method is to sequentially arrange the pump, the valve unit 1 and the nozzle shown in FIG. 2 on the upstream side, and set a pressure gauge on the downstream side of the valve unit 1, and use a diluent as a liquid. Furthermore, in the case where the suction return valve 3 is closed abruptly as in the aforementioned comparative example (FIG. 3), and in the case where the suction return valve 3 is changed from the suction state to the prepared state as in the embodiment (FIG. 5), the pressure gauge is measured Time to detect pressure. The measurement results are shown in FIG. 12, the dotted line (1) corresponds to a comparative example, and the solid line (2) corresponds to an embodiment.

由該結果可知,與在比較例產生之壓力的減衰振動同樣地,在實施形態中形成壓力之減衰振動。此外,實施形態中亦可確認暫時之斷液。因此,依據本發明可藉由使流路之一部分的容積由大變化至小來進行斷液,因此可確認獲得前述之效果。 From this result, it can be seen that, in the same manner as the attenuation vibration of pressure generated in the comparative example, the attenuation vibration of pressure was formed in the embodiment. In addition, in the embodiment, a temporary liquid cut-off can be confirmed. Therefore, according to the present invention, the liquid can be shut off by changing the volume of a part of the flow path from large to small, so it can be confirmed that the aforementioned effects are obtained.

Claims (11)

一種處理液供給裝置,其藉由送液機構透過處理液供給通路及噴嘴將處理液供給至被處理體,且特徵在於包含:開關閥,其設於該處理液供給通路中;流路調整部,其設於該開關閥與該噴嘴間之該處理液供給通路中,用以改變該處理液供給通路之一部分的截面積來調整容積;及控制部,其為了暫時停止由該噴嘴吐出處理液,對該流路調整部輸出控制信號,使該處理液供給通路之一部分的容積由第一容積變成小於第一容積且大於零之第二容積,並在該處理液供給通路之一部分的容積調整至第二容積後,對該開關閥輸出控制信號,俾於停止吐出之處理液再開始流通前,使該處理液供給通路關閉。A processing liquid supply device that supplies a processing liquid to a to-be-processed object through a processing liquid supply path and a nozzle through a liquid feeding mechanism, and is characterized in that it includes an on-off valve provided in the processing liquid supply path; a flow path adjustment section It is provided in the processing liquid supply path between the on-off valve and the nozzle to change the cross-sectional area of a part of the processing liquid supply path to adjust the volume; and a control unit for temporarily stopping the discharge of the processing liquid from the nozzle And outputting a control signal to the flow path adjusting section to change the volume of a portion of the processing liquid supply path from the first volume to a second volume smaller than the first volume and greater than zero, and adjust the volume of a portion of the processing liquid supply path After reaching the second volume, a control signal is output to the on-off valve, and the processing liquid supply path is closed before the processing liquid that has stopped being discharged is resumed. 如申請專利範圍第1項之處理液供給裝置,其中,該開關閥之關閉動作所需要的時間設定為200ms以上。For example, the processing liquid supply device of the first patent application range, wherein the time required for the closing operation of the on-off valve is set to 200 ms or more. 如申請專利範圍第1或2項之處理液供給裝置,其中,藉由該流路調整部調整之容積由第一容積到變成小於第一容積且大於零之第二容積所需要的時間設定為100ms以下。For example, the processing liquid supply device according to item 1 or 2 of the scope of patent application, wherein the time required for the volume adjusted by the flow path adjusting section to change from the first volume to a second volume smaller than the first volume and greater than zero is set to Less than 100ms. 如申請專利範圍第1或2項之處理液供給裝置,其中,該開關閥之下游側的該處理液流路中設有用以在停止吐出處理液後拉高噴嘴之液面高度的吸回閥,該吸回閥兼作為該流路調整部。For example, the processing liquid supply device according to item 1 or 2 of the patent application scope, wherein the processing liquid flow path on the downstream side of the switching valve is provided with a suction return valve for raising the liquid level of the nozzle after stopping the discharge of the processing liquid. The suction return valve also serves as the flow path adjusting portion. 如申請專利範圍第1或2項之處理液供給裝置,其中該處理液之黏度在25。C時為1cP至10cP。For example, the processing liquid supply device of the scope of application for patents 1 or 2, wherein the viscosity of the processing liquid is 25. At C it is 1 cP to 10 cP. 一種處理液供給裝置,其藉由送液機構透過處理液供給通路及噴嘴將處理液供給至被處理體,且特徵在於包含:開關閥,其設於該處理液供給通路中;及控制部,其為了暫時停止由該噴嘴吐出處理液,對該開關閥輸出控制信號,使該處理液供給通路之容積由第一容積變成小於第一容積且大於零之第二容積,並對該開關閥輸出控制信號,俾於停止吐出之處理液再開始流通前,使該處理液供給通路關閉。A processing liquid supply device that supplies a processing liquid to a to-be-processed body through a processing liquid supply path and a nozzle through a liquid feeding mechanism, and is characterized by including: an on-off valve provided in the processing liquid supply path; and a control section, In order to temporarily stop discharging the processing liquid from the nozzle, it outputs a control signal to the switching valve, changes the volume of the processing liquid supply path from a first volume to a second volume smaller than the first volume and greater than zero, and outputs to the switching valve. The control signal closes the supply path of the processing liquid before stopping the processing liquid from being discharged again. 一種液處理裝置,其特徵在於包含:基板保持部,其使藉由處理液進行液處理之被處理體的基板保持水平;承杯模組,其設置成包圍該基板保持部,並使其內部排氣;如申請專利範圍第1至6項中任一項之處理液供給裝置;及移動機構,其使該噴嘴移動。A liquid processing apparatus, comprising: a substrate holding section that holds a substrate of a processing object subjected to liquid processing by a processing liquid horizontally; and a cup holder module that is provided to surround the substrate holding section and make the inside thereof Exhaust; a processing liquid supply device such as any one of claims 1 to 6 of the scope of patent application; and a moving mechanism that moves the nozzle. 一種處理液供給方法,其藉由送液機構透過處理液供給通路及噴嘴將處理液供給至被處理體,且特徵在於:使用:開關閥,其設置於該處理液供給通路中;及流路調整部,其設於該開關閥與噴嘴間之處理液供給通路中,並改變處理液供給通路之一部分的截面積來調整容積,進行以下步驟:由該噴嘴吐出處理液並供給至被處理體;然後,為了暫時停止由該噴嘴吐出處理液,藉由該流路調整部,將處理液供給通路之容積由第一容積調整至小於第一容積且大於零之第二容積;及該處理液供給通路之容積調整至第二容積後,在停止吐出之處理液再開始流通前藉由該開關閥關閉處理液供給通路。A processing liquid supply method, which supplies a processing liquid to a to-be-processed object through a processing liquid supply path and a nozzle through a liquid feeding mechanism, and is characterized by using: an on-off valve provided in the processing liquid supply path; and a flow path An adjusting unit is provided in the processing liquid supply path between the on-off valve and the nozzle, and changes the cross-sectional area of a part of the processing liquid supply path to adjust the volume, and performs the following steps: the processing liquid is discharged from the nozzle and supplied to the object to be processed ; Then, in order to temporarily stop the processing liquid from being discharged from the nozzle, the volume of the processing liquid supply path is adjusted from the first volume to a second volume smaller than the first volume and greater than zero by the flow path adjusting section; and the processing liquid After the volume of the supply channel is adjusted to the second volume, the processing liquid supply channel is closed by the on-off valve before the processing liquid that has been discharged is resumed. 如申請專利範圍第8項之處理液供給方法,其中,藉由該開關閥關閉該處理液供給通路之步驟係藉由200ms以上之時間的關閉動作關閉該處理液供給通路的步驟。For example, the method for supplying a processing liquid according to item 8 of the scope of patent application, wherein the step of closing the processing liquid supply path by the on-off valve is a step of closing the processing liquid supply path by a closing action of 200 ms or more. 一種處理液供給方法,其藉由送液機構透過處理液供給通路及噴嘴將處理液供給至被處理體,且特徵在於進行以下步驟:由該噴嘴吐出處理液並供給至被處理體;然後,為了暫時停止由該噴嘴吐出處理液,藉由設於該處理液供給通路中之開關閥,將處理液供給通路之容積由第一容積調整至小於第一容積且大於零之第二容積;及在停止吐出之處理液再開始流通前藉由該開關閥該關閉處理液供給通路。A processing liquid supply method that supplies a processing liquid to a processing object through a processing liquid supply path and a nozzle through a liquid feeding mechanism, and is characterized by performing the following steps: discharging the processing liquid from the nozzle and supplying the processing liquid to the processing object; and In order to temporarily stop the processing liquid from being discharged from the nozzle, the volume of the processing liquid supply path is adjusted from the first volume to a second volume smaller than the first volume and greater than zero by a switching valve provided in the processing liquid supply path; and The processing liquid supply path is closed by the on-off valve before the processing liquid that has been discharged is resumed. 一種記錄媒體,其記錄了用於處理液供給裝置之電腦程式,而該處理液供給裝置藉由送液機構透過處理液供給通路及噴嘴將處理液供給至被處理體,該記錄媒體之特徵在於:該電腦程式包含用來實行如申請專利範圍第8至10項中任一項之處理液供給方法的步驟群。A recording medium that records a computer program for a processing liquid supply device that supplies a processing liquid to a subject through a processing liquid supply path and a nozzle through a liquid feeding mechanism. The recording medium is characterized in that : The computer program includes a group of steps for implementing a method for supplying a processing liquid as described in any one of claims 8 to 10 of the scope of patent application.
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