JP2019149421A - 検査装置及び検査装置の動作方法 - Google Patents
検査装置及び検査装置の動作方法 Download PDFInfo
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- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K37/00—Special means in or on valves or other cut-off apparatus for indicating or recording operation thereof, or for enabling an alarm to be given
- F16K37/0025—Electrical or magnetic means
- F16K37/005—Electrical or magnetic means for measuring fluid parameters
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/56—Investigating or analyzing materials by the use of thermal means by investigating moisture content
- G01N25/66—Investigating or analyzing materials by the use of thermal means by investigating moisture content by investigating dew-point
- G01N25/68—Investigating or analyzing materials by the use of thermal means by investigating moisture content by investigating dew-point by varying the temperature of a condensing surface
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2881—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to environmental aspects other than temperature, e.g. humidity or vibrations
-
- H10P74/207—
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/56—Investigating or analyzing materials by the use of thermal means by investigating moisture content
- G01N25/66—Investigating or analyzing materials by the use of thermal means by investigating moisture content by investigating dew-point
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- Eye Examination Apparatus (AREA)
- Automatic Analysis And Handling Materials Therefor (AREA)
Abstract
Description
本発明の実施形態に係る検査装置についてプローバ装置を例に挙げて説明する。図1は、本発明の実施形態に係るプローバ装置の一例を示す概略図である。
本発明の実施形態に係るプローバ装置1の動作の一例について説明する。以下に説明するプローバ装置1の動作は、制御装置100によって制御される。
10 検査室
20 ドライエア供給部
22 配管
30 露点計
32 配管
40 バイパス配管
100 制御装置
V1 バルブ
V2 バルブ
V3 バルブ
Claims (6)
- 被検査体に対して高温検査及び低温検査を実施できる検査装置であって、
前記被検査体の検査を行う検査室と、
前記検査室に第1バルブを介して接続され、前記検査室内にドライエアを供給するドライエア供給部と、
前記検査室に第2バルブを介して接続され、前記検査室内の露点を測定する露点計と、
前記ドライエア供給部と前記露点計とを第3バルブを介して接続するバイパス配管と、
を有する、
検査装置。 - 前記検査室において前記被検査体に対して実施する検査の種類に応じて前記第1バルブ、前記第2バルブ及び前記第3バルブの開閉動作を制御する制御装置を有する、
請求項1に記載の検査装置。 - 前記制御装置は、前記検査室において前記被検査体に対して高温検査を実施する場合、前記ドライエア供給部から前記検査室内にドライエアを供給することなく、前記ドライエア供給部から前記バイパス配管を介して前記露点計にドライエアを供給するように、前記第1バルブ、前記第2バルブ及び前記第3バルブの開閉動作を制御する、
請求項2に記載の検査装置。 - 前記制御装置は、前記検査室において前記被検査体に対して低温検査を実施する場合、前記ドライエア供給部から前記検査室内を介して前記露点計にドライエアを供給するように、前記第1バルブ、前記第2バルブ及び前記第3バルブの開閉動作を制御する、
請求項2又は3に記載の検査装置。 - 前記制御装置は、前記検査室において前記被検査体に対して高温検査を実施できる状態から低温検査を実施できる状態へ切り替える場合、前記検査室内に結露が生じない露点に安定化するまで前記検査室内にドライエアを供給し、前記検査室の露点が安定化した後に前記検査室内に供給された前記ドライエアを前記検査室に接続された露点計に供給するように、前記第1バルブ、前記第2バルブ及び前記第3バルブの開閉動作を制御する、
請求項2乃至4のいずれか一項に記載の検査装置。 - 被検査体の検査を行う検査室と、前記検査室に接続され、前記検査室内にドライエアを供給するドライエア供給部と、前記検査室に接続され、前記検査室内の露点を測定する露点計と、前記ドライエア供給部と前記露点計とを接続するバイパス配管と、を有する検査装置の動作方法であって、
前記被検査体に対して高温検査を実施する場合、前記ドライエア供給部から前記検査室にドライエアを供給することなく、前記ドライエア供給部から前記バイパス配管を介して前記露点計にドライエアを供給し、
前記被検査体に対して前記高温検査を実施する状態から低温検査を実施する状態へ切り替える場合、前記検査室内に結露が生じない露点に安定化するまで前記検査室内にドライエアを供給し、前記検査室の露点が安定化した後に前記検査室内に供給された前記ドライエアを前記検査室に接続された露点計に供給し、
前記検査室において前記被検査体に対して前記低温検査を実施する場合、前記ドライエア供給部から前記検査室内を介して前記露点計にドライエアを供給する、
検査装置の動作方法。
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018032363A JP7012558B2 (ja) | 2018-02-26 | 2018-02-26 | 検査装置及び検査装置の動作方法 |
| CN201980013900.0A CN111727496B (zh) | 2018-02-26 | 2019-02-13 | 检查装置及检查装置的动作方法 |
| US16/975,506 US11614477B2 (en) | 2018-02-26 | 2019-02-13 | Inspection device and method for operating inspection device |
| KR1020207023798A KR102527533B1 (ko) | 2018-02-26 | 2019-02-13 | 검사 장치 |
| PCT/JP2019/005134 WO2019163608A1 (ja) | 2018-02-26 | 2019-02-13 | 検査装置及び検査装置の動作方法 |
| TW108104694A TWI798355B (zh) | 2018-02-26 | 2019-02-13 | 檢查裝置及檢查裝置之動作方法 |
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| JP2018032363A JP7012558B2 (ja) | 2018-02-26 | 2018-02-26 | 検査装置及び検査装置の動作方法 |
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| Publication Number | Publication Date |
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| JP2019149421A true JP2019149421A (ja) | 2019-09-05 |
| JP7012558B2 JP7012558B2 (ja) | 2022-01-28 |
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| US (1) | US11614477B2 (ja) |
| JP (1) | JP7012558B2 (ja) |
| KR (1) | KR102527533B1 (ja) |
| CN (1) | CN111727496B (ja) |
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| WO (1) | WO2019163608A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11860083B2 (en) | 2020-12-07 | 2024-01-02 | Samsung Electronics Co, Ltd. | Apparatus and method of testing an object within a dry gas environment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE102018008636B4 (de) * | 2018-11-02 | 2020-10-29 | Bauer Kompressoren Gmbh | Feuchtemessvorrichtung für Gase |
| KR102886775B1 (ko) * | 2020-12-07 | 2025-11-21 | 한국전기안전공사 | 인공지능 네트워크 시스템을 포함하는 배터리실 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004273967A (ja) * | 2003-03-12 | 2004-09-30 | Sumitomo Heavy Ind Ltd | チャンバ温度制御方式 |
| JP2005528781A (ja) * | 2002-04-15 | 2005-09-22 | イーアールエス エレクトロニック ゲーエムベーハー | 半導体ウェハー及び/又はハイブリッドを調整する方法及び装置 |
| JP2009105339A (ja) * | 2007-10-25 | 2009-05-14 | Mitsumi Electric Co Ltd | 検査装置及び検査方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3435410B2 (ja) * | 1996-05-09 | 2003-08-11 | 東京エレクトロン株式会社 | 低温試験装置及び低温試験方法 |
| JP2000097890A (ja) * | 1998-09-21 | 2000-04-07 | Sony Corp | ガス中の水分量測定装置およびクライオポンプ再生終了時の検知方法 |
| JP2000294606A (ja) * | 1999-04-07 | 2000-10-20 | Nec Corp | 半導体ウエハの検査装置 |
| JP2002231777A (ja) * | 2001-01-31 | 2002-08-16 | Orion Mach Co Ltd | 半導体ウェーハ用検査装置 |
| JP3783075B2 (ja) * | 2001-12-13 | 2006-06-07 | 東京エレクトロン株式会社 | プローブ装置及びローダ装置 |
| KR100486690B1 (ko) * | 2002-11-29 | 2005-05-03 | 삼성전자주식회사 | 기판 이송 모듈의 오염을 제어할 수 있는 기판 처리 장치및 방법 |
| CN100355161C (zh) * | 2004-05-26 | 2007-12-12 | 夏普株式会社 | 氮化物半导体激光器件 |
| JP4653588B2 (ja) * | 2005-08-12 | 2011-03-16 | 株式会社オーク製作所 | 露光装置および露光方法 |
| KR100789699B1 (ko) * | 2006-10-10 | 2008-01-02 | (주) 쎄믹스 | 고온 및 저온의 테스트 가능한 웨이퍼 프로버 장치 |
| JP4867786B2 (ja) * | 2007-05-18 | 2012-02-01 | 株式会社日立プラントテクノロジー | 低露点圧縮空気製造装置 |
| JP5377915B2 (ja) * | 2008-09-30 | 2013-12-25 | 東京エレクトロン株式会社 | 検査装置及び検査方法 |
| KR20130032647A (ko) * | 2011-09-23 | 2013-04-02 | 삼성전자주식회사 | 웨이퍼 테스트 장치 |
| US9389129B2 (en) * | 2011-11-25 | 2016-07-12 | Kamal Mahajan | Device feedback sensor testing methodology for humidity and temperature probes |
| US9267875B2 (en) * | 2013-11-21 | 2016-02-23 | Medtronic Minimed, Inc. | Accelerated life testing device and method |
| KR101357858B1 (ko) * | 2013-12-04 | 2014-02-05 | 김한일 | 드라이룸의 노점온도 관리장치 및 방법 |
| JP6500498B2 (ja) * | 2015-02-27 | 2019-04-17 | シンフォニアテクノロジー株式会社 | 搬送室及び搬送室のケミカルフィルタの湿度管理方法 |
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- 2018-02-26 JP JP2018032363A patent/JP7012558B2/ja active Active
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- 2019-02-13 CN CN201980013900.0A patent/CN111727496B/zh active Active
- 2019-02-13 WO PCT/JP2019/005134 patent/WO2019163608A1/ja not_active Ceased
- 2019-02-13 US US16/975,506 patent/US11614477B2/en active Active
- 2019-02-13 KR KR1020207023798A patent/KR102527533B1/ko active Active
- 2019-02-13 TW TW108104694A patent/TWI798355B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005528781A (ja) * | 2002-04-15 | 2005-09-22 | イーアールエス エレクトロニック ゲーエムベーハー | 半導体ウェハー及び/又はハイブリッドを調整する方法及び装置 |
| JP2004273967A (ja) * | 2003-03-12 | 2004-09-30 | Sumitomo Heavy Ind Ltd | チャンバ温度制御方式 |
| JP2009105339A (ja) * | 2007-10-25 | 2009-05-14 | Mitsumi Electric Co Ltd | 検査装置及び検査方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11860083B2 (en) | 2020-12-07 | 2024-01-02 | Samsung Electronics Co, Ltd. | Apparatus and method of testing an object within a dry gas environment |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102527533B1 (ko) | 2023-04-28 |
| US20210132135A1 (en) | 2021-05-06 |
| WO2019163608A1 (ja) | 2019-08-29 |
| JP7012558B2 (ja) | 2022-01-28 |
| TWI798355B (zh) | 2023-04-11 |
| CN111727496A (zh) | 2020-09-29 |
| TW201946170A (zh) | 2019-12-01 |
| KR20200113223A (ko) | 2020-10-06 |
| CN111727496B (zh) | 2024-03-19 |
| US11614477B2 (en) | 2023-03-28 |
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