JP2019029650A - Semiconductor chip pickup device, semiconductor chip mounting apparatus and mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stably peel a semiconductor chip from an adhesive sheet. SOLUTION: This is a semiconductor chip pickup device that picks up a semiconductor chip t attached and held on an adhesive sheet 11 from the adhesive sheet 11, and has the same axis as a pickup mechanism that picks up the semiconductor chip t from the adhesive sheet 11. It has a plurality of push-up bodies 62a to 62d which are arranged so as to be movable in the axial direction of each other. A negative pressure is applied to the portion of the pressure-sensitive adhesive sheet 11 where the semiconductor chip t to be picked up is located from the side opposite to the semiconductor chip t, and when the semiconductor chip t is picked up by the pickup mechanism, a plurality of the semiconductor chips t are used. It is provided with a push-up mechanism 60 that is pushed up by the push-up bodies 62a to 62d, and a negative pressure adjusting mechanism 63b that sets the magnitude of the negative pressure to −85 kPa or less in gauge pressure. [Selection diagram] Fig. 3

Description

The present invention relates to a semiconductor chip pickup device, a semiconductor chip mounting apparatus, and a mounting method.

A mounting process for mounting a semiconductor chip on a substrate such as a lead frame, a wiring substrate, or an interposer substrate is known. In this mounting process, semiconductor chips are taken out one by one from the wafer ring, transferred onto a substrate, and mounted. The wafer ring is a ring-shaped member that holds an adhesive sheet to which a semiconductor wafer cut and separated into individual semiconductor chips is attached. For taking out the semiconductor chip from the wafer ring, a pickup mechanism having an adsorption nozzle for adsorbing the semiconductor chip and a semiconductor chip adsorbed to the adsorption nozzle are pushed up from the lower surface by a push-up pin, and the semiconductor chip is peeled off from the adhesive sheet. 2. Description of the Related Art A pickup device is used that includes a push-up mechanism that assists removal.

By the way, recent semiconductor chips are being thinned to have a thickness of 50 μm or less. If such a thin semiconductor chip is simply pushed up with a push-up pin with a sharp tip, the risk of damage such as breaking of the semiconductor chip increases. Therefore, as shown in Patent Document 1, a pickup device having a plurality of push-up bodies has been developed. The plurality of push-up bodies are provided concentrically with their axes aligned, and operate so that the peeling of the adhesive sheet attached to the lower surface of the semiconductor chip gradually proceeds from the periphery to the center of the semiconductor chip. . The upper surface shape of the plurality of push-up bodies is usually formed in the same shape as the semiconductor chip to be picked up, for example, a quadrangle.

In such a pickup device, first, a plurality of push-up bodies are simultaneously raised to a predetermined height to push up the entire lower surface of the semiconductor chip to be picked up. Then, the push-up body located on the outermost side is left, and the other push-up bodies are further raised to a predetermined height. Next, the other push-up body is raised while leaving the second push-up body. Support by the push-up body on the lower surface of the semiconductor chip is sequentially released from the periphery toward the center. Therefore, the adhesive sheet is gradually peeled from the outer peripheral side of the semiconductor chip. Furthermore, in order to promote the peeling of the pressure-sensitive adhesive sheet from the lower surface of the semiconductor chip, a concave portion for applying a suction force to the pressure-sensitive adhesive sheet may be provided on the contact surface (upper surface) of the push-up body with the pressure-sensitive adhesive sheet. Proposed. The concave portion provided in the push-up body becomes a place where the pressure-sensitive adhesive sheet starts to peel from the semiconductor chip, and can promote the peeling of the pressure-sensitive adhesive tape from the semiconductor chip.

JP 2010-056466 A

However, the present inventors have found that the semiconductor chip may be damaged even when the above-described pickup device is used. That is, in the mounting apparatus used by the inventors of the present invention for experiments, a mounting experiment was performed using a plurality of types of semiconductor chips. It was confirmed that there is.

As a result of intensive studies by the inventors of the present application, it has been found that a semiconductor chip having a thickness of approximately 30 μm or less is relatively easily damaged. Therefore, an experiment was conducted in which a predetermined number of semiconductor chips were picked up using a plurality of semiconductor chips of 30 μm or less. As a result, it has been found that even in the case of semiconductor chips of the same type, the frequency of breakage may vary greatly depending on the number of units. Specifically, in a pickup experiment conducted in the morning of a certain day for a semiconductor chip having a thickness of 27 μm, the occurrence rate of breakage was 92%. On the other hand, in the pickup experiment conducted with the same type of semiconductor chip in the morning of the next day, the occurrence frequency of breakage was 4%. Further, in an experiment conducted on another day, there was a certain number of units in which damage was concentrated in the first half and almost no damage was seen in the second half.

As a result of further intensive studies by the inventors and others based on these results, it has been found that the suction force acting between the push-up body and the pressure-sensitive adhesive sheet at the time of push-up varies. That is, the suction force is obtained from a negative pressure supply piping facility installed in the laboratory. The negative pressure of this piping facility fluctuated depending on the use situation of other experimental devices that both use negative pressure. That is, the inventors of the present application have found that there is a close relationship between the damage of the semiconductor chip and the suction force at the time of pushing up.

An object of the present invention is to provide a semiconductor chip pickup device, a semiconductor chip mounting apparatus, and a mounting method that can stably peel the semiconductor chip from the adhesive sheet.

The semiconductor chip pickup device of the present embodiment is a semiconductor chip pickup device that picks up a semiconductor chip adhered and held on an adhesive sheet from the adhesive sheet, and a pickup mechanism that picks up the semiconductor chip from the adhesive sheet; A plurality of push-up bodies that are arranged with the same axial center and are provided so as to be movable in the axial direction with respect to each other, and the semiconductor chip is located in a portion where the semiconductor chip picked up by the pickup mechanism is located in the adhesive sheet When the semiconductor chip is picked up by the pickup mechanism by applying a negative pressure from the opposite side, a push-up mechanism that pushes up the semiconductor chip by the plurality of push-up bodies, and the magnitude of the negative pressure is a gauge pressure. Negative pressure adjustment set to -85 kPa or less It includes a structure, a.

The semiconductor chip mounting apparatus of the present embodiment includes a supply device that holds an adhesive sheet on which a semiconductor chip is adhered and held, a substrate stage on which a substrate is placed, and the semiconductor chip from the adhesive sheet that is held by the supply device. The pickup device for picking up, and a mounting mechanism for mounting the semiconductor chip taken out by the pickup device on the substrate.

The semiconductor chip mounting method of the present embodiment is a semiconductor chip mounting method for picking up a semiconductor chip adhered and held on an adhesive sheet from the adhesive sheet, and mounting the picked-up semiconductor chip on a substrate. When picking up the semiconductor chip from the pressure-sensitive adhesive sheet by a pickup mechanism for picking up the semiconductor chip from the sheet, a negative pressure is applied to the pressure-sensitive adhesive sheet from the opposite side of the semiconductor chip and the axis is made the same When the semiconductor chip is pushed up by a plurality of push-up members that are arranged and are movable in the axial direction, the magnitude of the negative pressure is set to −85 kPa or less in terms of gauge pressure.

According to the present invention, the semiconductor chip can be stably peeled from the adhesive sheet.

It is a side view showing a schematic structure of a mounting device of a semiconductor chip of an embodiment. It is a perspective view which shows the pushing-up mechanism of the pick-up apparatus of the semiconductor chip of embodiment. It is a schematic sectional drawing which shows the pushing-up mechanism shown in FIG. It is a top view which shows the raising body of the raising mechanism shown in FIG. It is sectional drawing which shows operation | movement of the pick-up apparatus of embodiment. It is sectional drawing which shows operation | movement of the pick-up apparatus of embodiment. It is sectional drawing which shows operation | movement of the pick-up apparatus of embodiment.

Hereinafter, embodiments of the present invention (hereinafter referred to as embodiments) will be specifically described with reference to the drawings. Note that the position and size of each component are merely convenient for easy understanding of the structure.

FIG. 1 is a side view showing a schematic configuration of a semiconductor chip mounting apparatus according to an embodiment. The semiconductor chip mounting apparatus 1 is disposed between a supply device 10 for supplying a semiconductor chip t, a substrate stage 20 for placing a substrate K on which the semiconductor chip t is mounted, and between the supply device 10 and the substrate stage 20. The intermediate stage 30 on which the semiconductor chip t is placed, the pickup mechanism 40 that picks up the semiconductor chip t from the supply device 10 one by one and transfers it to the intermediate stage 30, and the semiconductor chip t placed on the intermediate stage 30 is sucked and held. A mounting mechanism 50 that mounts at a predetermined position on the substrate K placed on the substrate stage 20; a push-up mechanism 60 that is disposed in the supply device 10 and pushes up the semiconductor chip t picked up by the pickup mechanism 40; and Control supply device 10, substrate stage 20, pickup mechanism 40, mounting mechanism 50, push-up mechanism 60, and the like Controller 70 comprises a. The pickup mechanism 40 and the push-up mechanism 60 are components of the pickup device.

In the supply apparatus 10, a wafer ring 12 that holds an adhesive sheet 11 to which a plurality of semiconductor chips t separated by cutting a semiconductor wafer W is attached is supplied by a wafer ring supply apparatus (not shown). It has a table 13. The wafer table 13 can be moved in the X, Y, and θ (horizontal rotation) directions by an XYθ direction driving device (not shown). The X direction and the Y direction are horizontal directions orthogonal to each other. The Z direction shown in the figure is a direction perpendicular to the horizontal direction.

The substrate stage 20 is supplied and mounted with the substrate K before mounting by a substrate carry-in device (not shown), and the substrate K after the semiconductor chip t is mounted is taken out and carried out by a substrate carry-out device (not shown). The substrate stage 20 is supported by an XYθ direction driving device (not shown) and is movable in the X, Y, and θ (horizontal rotation) directions.

The intermediate stage 30 is a stage on which the semiconductor chip t is temporarily placed when the semiconductor chip t picked up by the pickup mechanism 40 is transferred to the mounting mechanism 50.

The pickup mechanism 40 includes a suction nozzle 41 that sucks and holds the semiconductor chip t, and a drive device (not configured) that moves the suction nozzle 41 between the supply device 10 and the intermediate stage 30 as indicated by broken line arrows in FIG. As shown).

The mounting mechanism 50 sucks and holds the semiconductor chip t, and presses and mounts the sucked and held semiconductor chip t on a predetermined position on the substrate K (in some cases, heating may be used together), A drive device (not shown) is provided for moving the mounting tool 51 between the intermediate stage 30 and the substrate stage 20 as indicated by a broken line arrow.

Next, the push-up mechanism 60 will be further described with reference to FIGS.

The push-up mechanism 60 pushes up the semiconductor chip t built in the backup body 61 and attached to the pressure-sensitive adhesive sheet 11 so as to face the lower surface of the pressure-sensitive adhesive sheet 11 supported by the wafer table 13. And a mechanism 62.

The backup body 61 is fixedly arranged in accordance with the pickup position of the semiconductor chip t by the suction nozzle 41. The backup body 61 has a hollow cylindrical shape whose upper and lower surfaces are closed, and the upper surface thereof is a backup surface 61a that sucks and supports the adhesive sheet 11 from the lower side. The hollow portion of the backup body 61 is an internal space 61b.

The backup surface 61a is provided with an annular suction groove 61c and a plurality of suction holes 61d for sucking the adhesive sheet 11 positioned around the semiconductor chip t to be picked up. The suction grooves 61c and the plurality of suction holes 61d communicate with the internal space 61b of the backup body 61 through the communication grooves 61e and communication holes (not shown). That is, a vacuum pipe 63a communicating with the suction pump 63 is connected to the internal space 61b of the backup body 61 so that a negative pressure can be supplied into the internal space 61b. A negative pressure can be applied to the suction groove 61c and the plurality of suction holes 61d by making the internal space 61b a negative pressure. Further, the vacuum pipe 63a is provided with a pressure control device 63b such as an electropneumatic regulator and an on-off valve 63c such as an electromagnetic valve in this order from the suction pump 63 side, and the suction groove 61c and a plurality of suction holes are provided. The negative pressure on / off applied to 61d and the magnitude of the negative pressure can be controlled. The pressure control device 63b functions as a negative pressure adjustment mechanism. The pressure control device 63b may be set so that a negative pressure of −85 kPa or less, preferably −90 kPa or less in terms of gauge pressure acts on the suction groove 61c and the plurality of suction holes 61d. In the present embodiment, an example in which −90 kPa is used will be described. Here, the gauge pressure is a relative pressure with reference to atmospheric pressure (0 kPa). Therefore, the gauge pressure of −85 kPa or less includes a pressure lower than the atmospheric pressure by 85 kPa, and indicates a pressure having a higher degree of vacuum than this pressure (−85 kPa). That is, -90 kPa is a pressure having a higher degree of vacuum than -85 kPa. In addition, expressions such as “negative pressure of −85 kPa or less” and “negative pressure magnitude of −85 kPa” may be used, and both indicate pressure values at gauge pressure.

Note that the pressure set in the pressure control device 63b is considered to act on the internal space 61b, the suction groove 61c, and the suction hole 61d as they are. Therefore, in the present embodiment, the pressure detector 63d is provided in a portion between the on-off valve 63c and the internal space 61b in the vacuum pipe 63a. The control pressure of the pressure control device 63b is set so that the detection value of the pressure detector 63d is −90 kPa. The pressure acting on the internal space 61b, or the suction groove 61c or the plurality of suction holes 61d is detected, and the control pressure of the pressure control device 63b is set so that the detected value falls within the above pressure range. Also good. The suction pump 63 may be incorporated as a component in the mounting apparatus 1, but is not limited thereto, and may be prepared separately from the mounting apparatus 1, for example, installed in a factory or the like. It may be a piping facility for supplying negative pressure. In short, any negative pressure source that can stably supply a negative pressure of −85 kPa or less as a gauge pressure to the pressure control device 63b may be used.

The push-up mechanism 62 is provided corresponding to the first to fourth push-up bodies 62a, 62b, 62c, 62d and the first to fourth push-up bodies 62a to 62d, and the first to fourth push-up bodies 62a to 62d. 1st-4th raising / lowering drive device 62e, 62f, 62g, 62h which raises / lowers 62d separately is provided.

Among the first to fourth push-up bodies 62a to 62d, the first to third push-up bodies 62a to 62c have a rectangular prismatic shape in plan view and have a triple structure with the same axis. . The fourth push-up body 62d has a prismatic shape and is arranged at the center with the same axis as the first to third push-up bodies 62a to 62c. In the present embodiment, four push-up bodies 62a to 62d are provided, but the number is not limited to four, and may be two, three, or five or more.

The first push-up body 62a is the push-up body located on the outermost side, and the edge of the opening 61f is placed in the upper surface of the backup body 61, that is, in the rectangular opening 61f provided at the center of the backup surface 61a. Are arranged with a gap between them. That is, the opening 61f is similar to the outer shape of the first push-up body 62a, and is slightly larger than the outer shape of the first push-up body 62a. The front end surface of the first push-up body 62a has a shape similar to that of the semiconductor chip t to be pushed up and is slightly smaller than the semiconductor chip t in plan view. Therefore, when the semiconductor chip t is pushed up, the edge of the semiconductor chip t slightly protrudes from the periphery of the first push-up body 62a.

The second push-up body 62b is disposed inside the first push-up body 62a so as to be guided by the inner surface of the first push-up body 62a. The third push-up body 62c is arranged inside the second push-up body 62b so as to be guided by the inner surface of the second push-up body 62b. The fourth push-up body 62d is arranged inside the third push-up body 62c while being guided by the inner surface of the third push-up body 62c.

These push-up bodies 62a to 62d move up and down according to preset operation conditions by the first to fourth elevating drive devices 62e to 62h. In the present embodiment, first, all the push-up bodies 62a to 62d are raised from the height of the backup surface 61a to a height protruding by a predetermined amount. Thereafter, the operating conditions are set so as to descend sequentially from the outer side, that is, in order of the first, second, third, and fourth push-up bodies to the height of the backup surface 61a or less. In addition, what is necessary is just to set operation conditions to the operation | movement according to the kind etc. of the semiconductor sheet t of pick-up object, the adhesive sheet 11 to which the semiconductor chip t is stuck.

Further, as shown in FIG. 4A, convex portions 64 and 65 and a concave portion 66 are provided at the upper end portions of the first to third push-up bodies 62a to 62c, respectively. In FIG. 4, the formation position of the concave portion 66 is hatched to clearly distinguish the convex portions 64 and 65 from each other. Convex portions 64A are respectively formed at the four corner portions of the upper end surface forming the rectangular frame shape of the first push-up body 62a. A plurality of convex portions 65A are provided at substantially equal intervals on the four side portions of the upper end surface of the rectangular frame shape of the first push-up body 62a. And the recessed part 66A is provided between the convex part 64A and the convex part 65A, and between convex parts 65A, respectively. Convex portions 64B are respectively formed at the four corner portions of the upper end surface of the rectangular frame shape of the second push-up body 62b. A plurality of convex portions 65B are provided at substantially equal intervals on the four side portions of the upper end surface of the rectangular frame of the second push-up body 62b. And the recessed part 66B is provided between the convex part 64B and the convex part 65B, and between convex parts 64B, respectively. In addition, the arrangement of the convex portions 65B and the concave portions 66B of the second push-up body 62b has an alternating relationship with the arrangement of the convex portions 65A and the concave portions 66A of the first push-up body 62a. Similarly to the first and second push-up bodies 62a and 62b, convex portions 64C and 65C and a concave portion 66C are also formed on the upper end surface of the third push-up body 62c in the rectangular frame shape. The arrangement of the convex portions 65C and the concave portions 66C of the third push-up body 62c has an alternating relationship with the arrangement of the convex portions 65B and the concave portions 66B of the second push-up body 62b. The upper surfaces of the convex portions 64A to 64C and 65A to 65C and the upper surface of the fourth push-up body 62d are formed so as to support the adhesive sheet 11 on the same plane as the backup surface 61a. Then, the surface accuracy of the plane formed by the upper surfaces of the convex portions 64A to 64C and 65A to 65C and the upper surface of the fourth push-up body 62d is 20 μm or less.

Moreover, it is preferable to form each convex part 65A-65C provided in the side part so that the length of the direction along a side part may be 0.4 mm or more and 2.0 mm or less. Further, the lengths of the concave portions 66A to 66C in the direction along the side portions may be the same as or different from the lengths of the convex portions 65A to 65C, but as with the convex portions 65A to 65C, The length in the direction along the side is preferably 0.4 mm or more and 2.0 mm or less. The adjacent recesses 66A and 66B and the recesses 66B and 66C may be arranged so as to partially overlap, but the length of the overlapping portions is the length of the recesses 66A to 66C in the direction along the side portion. It is preferable to make it 20% or less. Therefore, the length of the recesses 66A to 66C is preferably formed to be 0.8 times or more and 1.2 times or less than the length of the projections 65A to 65C.

Further, in a state where the first to fourth push-up bodies 62a to 62d support the adhesive sheet 11 together with the backup body 61, between the upper end surfaces of the first to fourth push-up bodies 62a to 62d and the adhesive sheet 11. The negative pressure can be applied. That is, the opening 61f of the backup body 61 communicates with the internal space 61b, and there is a gap between the first push-up body 62a and the edge of the opening 61f. There is also a gap between the push-up bodies 62a to 62d. Therefore, the negative pressure in the internal space 61 b acts between the upper end surfaces of the first to fourth push-up bodies 62 a to 62 d and the adhesive sheet 11 through these gaps. That is, the negative pressure set in the above-described pressure range, specifically, the negative pressure of −90 kPa is applied between the push-up mechanism 60 and the adhesive sheet 11.

The control device 70 includes a storage unit 71. The storage unit 71 stores data necessary for the operation of the mounting apparatus 1 such as the operating conditions of the push-up bodies 62a to 62d. The control device 70 refers to the data stored in the storage unit 71 and controls the supply device 10, the substrate stage 20, the pickup mechanism 40, the mounting mechanism 50, the push-up mechanism 60, and the like.
(Description of operation)
Next, operations of the mounting apparatus 1 and the pickup apparatus will be described with reference to FIGS. 1 and 5 to 7.

First, the wafer ring 12 in which a plurality of semiconductor chips t are bonded to the adhesive sheet 11 is set on the wafer table 13 of the supply device 10. A substrate K before mounting is placed on the substrate stage 20 by a substrate carry-in device (not shown).

In this state, the suction nozzle 41 of the pickup mechanism 40 picks up the semiconductor chip t positioned at the pickup position on the supply device 10 and transfers it to the intermediate stage 30. The mounting tool 51 of the mounting mechanism 50 receives the semiconductor chip t transferred to the intermediate stage 30 and mounts it on a predetermined mounting position of the substrate K placed on the substrate stage 20. Such an operation is repeatedly executed, and the semiconductor chip t is sequentially mounted on each mounting position of the substrate K.

When picking up by the pickup device, that is, when the suction nozzle 41 picks up the semiconductor chip t, the push-up mechanism 60 operates as follows.

As shown in FIG. 5A, when the semiconductor chip t to be picked up is positioned immediately above the push-up mechanism 60, that is, at the pickup position, the push-up device 60 supports the lower surface of the adhesive sheet 11 by the backup surface 61a. Then, by opening the on-off valve 63c, a predetermined negative pressure (negative pressure of −90 kPa) is applied to the suction groove 61c and the suction hole 61d to hold the adhesive sheet 11 by suction.

If the adhesive sheet 11 is sucked and held by the backup surface 61a, the suction nozzle 41 is lowered and brought into contact with the semiconductor chip t as shown in FIG. 5B, and the semiconductor chip t is sucked and held.

If the suction nozzle 41 sucks the semiconductor chip t, as shown in FIG. 5C, the first to fourth push-up bodies 62a to 62d are raised by a preset height. At this time, the suction nozzle 41 rises synchronously. Thereby, the adhesive sheet 11 is pushed up convexly by the 1st-4th push-up body 62a-62d. At this time, a negative pressure of −90 kPa is applied between the adhesive sheet 11, the backup surface 61a, and the upper end surfaces of the first to fourth push-up bodies 62a to 62d. Therefore, in the pressure-sensitive adhesive sheet 11, a force that is pulled down by negative pressure acts on the inclined portion 11 a that is pushed up by the first to fourth push-up bodies 62 a to 62 d. As a result, at the outer edge portion of the semiconductor chip t, more specifically, at the outer edge portion of the semiconductor chip t that protrudes from the first push-up body 62a, the adhesive sheet 11 is subjected to a force for peeling off from the semiconductor chip t. To do. Thereby, the adhesive sheet 11 peels from the said outer edge part of the semiconductor chip t. At this time, since the protruding amount of the semiconductor chip t is small, even if the peeling of the adhesive sheet t is started all at once in the entire area of each side of the semiconductor chip t, the semiconductor chip t is not damaged.

At this time, a negative pressure of −90 kPa also acts on the recess 66A of the first push-up body 62a. Therefore, in the portion of the edge of the semiconductor chip t facing the recess 66A, the negative pressure acting on the pressure-sensitive adhesive sheet 11 promotes the peeling of the pressure-sensitive adhesive sheet 11 from the semiconductor chip t more than other edges. FIG. 4B is a plan view schematically showing a state in which the peeling of the pressure-sensitive adhesive sheet 11 has progressed in the concave portion 66, and the concave portion 66 has a roughly crescent shape (diagonal line) as indicated by a symbol P in the drawing. The exfoliation part of the white part in the crevice 66 shown in Drawing 5 arises. In FIG. 4B, the peeling portions P are shown in all the concave portions 66A, 66B, 66C. However, at this stage, the peeling portions P are formed only in the concave portions 66A of the first push-up body 62a. Further, the peeling portion P expands so as to extend toward the second push-up body 62b by the action of the negative pressure until the later-described second push-up body 62b starts to descend.

After a predetermined waiting time elapses after the first to fourth push-up bodies 62a to 62d are lifted, the first push-up body 62a is lowered as shown in FIG. The first push-up body 62a is lowered to a position where the upper end surface of the first push-up body 62a is lower than the backup surface 61a by a predetermined height. As a result, the first pusher 62a is separated from the semiconductor chip t. When the first push-up body 62a is lowered, the portion of the adhesive sheet 11 that has been supported by the first push-up body 62a until now is pulled down by its own tension and negative pressure, that is, from the semiconductor chip t. A force acts in the direction of peeling. Due to this force, the peeling of the adhesive sheet 11 proceeds toward the center of the semiconductor chip t. The state shown in FIG. 6A is a state in which the adhesive sheet 11 supported by the first pusher 62a is peeled off from the semiconductor chip t. At this time, since negative pressure also acts on the recess 66B of the second push-up body 62b, peeling of the adhesive sheet 11 proceeds at a portion facing the recess 66B. As a result, as shown in FIG. 4B, a peeling portion P is generated at a portion corresponding to the recess 66B of the second push-up body 62b.

Further, after a predetermined waiting time has elapsed, as shown in FIG. 6B, the second push-up body 62b is lowered to the position of the first push-up body 62a. At this time, as in the case where the first push-up body 62a is lowered, the peeling of the portion of the adhesive sheet 11 supported by the second push-up body 62b proceeds. Further, as shown in FIG. 6B, the peeling of the pressure-sensitive adhesive sheet 11 proceeds at a portion facing the recess 66C of the third push-up body 62c, and a peeling portion P is generated. Further, after a predetermined waiting time has elapsed, as shown in FIG. 6C, the third push-up body 62c is lowered to the positions of the first and second push-up bodies 62a and 62b. At this time, as in the case where the first and second push-up bodies 62a and 62b are lowered, the part of the pressure-sensitive adhesive sheet 11 supported by the third push-up body 62c is peeled off.

After a predetermined waiting time has elapsed since the third push-up body 62c is lowered, as shown in FIG. 7A, the fourth push-up body 62d is replaced with the first to third push-up bodies 62a to 62c. Lower to position. Thereby, peeling of the part currently supported by the 4th push-up body 62d among the adhesive sheets 11 advances. The state shown in FIG. 7A shows the progress of this peeling.

Note that the standby time until the pushers 62a to 62d are lowered may be set to the same time, or may be set to individual times. However, setting this standby time long leads to a decrease in productivity, so it is preferable to set it in consideration of productivity. That is, UPH (Unit Per Hour) representing the number of semiconductor chips t that can be mounted per hour in the mounting apparatus 1 used in the mounting process of the semiconductor chip t is an important factor that affects productivity. Therefore, in order to improve productivity, it is preferable that the UPH value is high. In order to increase this numerical value, it is necessary to mount each semiconductor chip t in as short a time as possible. At this time, it is not possible to shorten the time during which the semiconductor chip t is pressure bonded to the substrate K (heating may be used together), so-called bonding time. Therefore, it is required that the time required for transferring the semiconductor chip t, which is executed in parallel with the pressure bonding of the semiconductor chip t, be within the bonding time. Note that the time required for the transfer is that the suction nozzle 41 descends toward the semiconductor chip t positioned at the pickup position after the suction nozzle 41 is positioned immediately above the pickup position, picks up the semiconductor chip t, and moves onto the intermediate stage 30. It is the time required to transfer and place.

Therefore, the above-described standby time is required to be set under the condition that the time required for transfer is within the bonding time. For example, the bonding time is 1.2 seconds, the time when the suction nozzle 41 positioned immediately above the pickup position is lowered to the semiconductor chip t, and the semiconductor chip t picked up by the suction nozzle 41 is transferred to the intermediate stage 30 and placed. When the total time required for this is 0.5 seconds, the time available for pushing up the semiconductor chip t by the push-up mechanism 62 is less than 1.2 seconds−0.5 seconds = 0.7 seconds. In this case, the above-described standby time needs to be set to about 0.1 seconds to about 0.3 seconds. That is, the settable range of the waiting time is limited to a very short time range by the bonding time, and the pickup device is required to peel the adhesive sheet 11 from the semiconductor chip t within this short time. It is done.

As in the present embodiment, by applying a negative pressure set in the above-described pressure range between the push-up mechanism 60 and the adhesive sheet 11, the above-described standby time is about 0.1 seconds to about 0.3 seconds. Even if the time is set to a short time, it is possible to sufficiently apply a force capable of separating the portion of the pressure-sensitive adhesive sheet 11 from which the support of the push-up bodies 62a to 62c is released from the semiconductor chip t. Become.

Note that, after a predetermined waiting time has elapsed after the fourth push-up body 62d is lowered, the suction nozzle 41 is raised to pick up the semiconductor chip t as shown in FIG. 7B. Further, the on-off valve 63c is closed and the negative pressure is stopped, and the first to fourth push-up bodies 62a to 62d are raised to the original height, that is, the height where the upper end coincides with the backup surface 61a.
(Function and effect)
According to the mounting apparatus 1 of such an embodiment, the pickup apparatus including the pickup mechanism 40 and the push-up mechanism 60 is provided, and the semiconductor chip t is picked up from the adhesive sheet 11 by the suction nozzle 41 of the pickup mechanism 40. At this time, the picked-up semiconductor chip t is pushed up from the lower side of the adhesive sheet 11 by using the push-up mechanism 62 of the push-up mechanism 60. The magnitude of the negative pressure applied between the push-up mechanism 60 and the pressure-sensitive adhesive sheet 11 during the push-up was set to −85 kPa or less in terms of gauge pressure. Specifically, the negative pressure applied between the push-up mechanism 60 and the adhesive sheet 11 is the suction groove 61c and the suction hole 61d of the backup body 61, and between the push-up bodies 62a to 62d and the adhesive sheet 11. The negative pressure applied to the recesses 66A to 66C of the push-up bodies 62a to 62d.

By applying such a negative pressure, when the semiconductor chip t is pushed up from under the adhesive sheet 11 by the push-up mechanism 62, the support area of the semiconductor chip t by the push-up bodies 62a to 62d is gradually reduced. Sometimes, the pressure-sensitive adhesive sheet can be peeled off from the semiconductor chip t following the decrease in the support area.

Further, since the pressure range of the negative pressure to be set is set to −85 kPa or less, the time from when one of the plurality of push-up bodies 62a to 62d is separated from the semiconductor chip t until the next push-up body is separated (described above) In the meantime, the portion of the pressure-sensitive adhesive sheet 11 from which the support of the push-up bodies 62a to 62c is released is peeled off from the semiconductor chip t. be able to. For this reason, even a semiconductor chip having a thickness of 30 μm or less can be quickly peeled off from the pressure-sensitive adhesive sheet 11, and productivity can be prevented from being impaired.

Moreover, the convex parts 64 and 65 and the recessed part 66 were formed in the upper end part of the 1st-3rd push-up body 62a-62c alternately. Thereby, in the site | part of the adhesive sheet 11 which opposes the recessed part 66 provided between the convex parts 64 and the convex parts 65, and between the convex parts 65, the negative pressure (-85 kPa or less) set to the above-mentioned pressure range is carried out. Negative pressure). Therefore, in the part of the pressure-sensitive adhesive sheet 11 corresponding to the recess 66, the peeling of the pressure-sensitive adhesive sheet 11 from the semiconductor chip t is allowed to proceed without waiting for the pushers 62a to 62c to descend (separate from the semiconductor chip t). Is possible. As a result, when the push-up bodies 62a to 62c are lowered, the peeling of the pressure-sensitive adhesive sheet 11 from the semiconductor chip t can be advanced more rapidly. Moreover, when the push-up bodies 62a to 62c begin to descend, peeling from the semiconductor chip t is progressing in the portion of the adhesive sheet 11 corresponding to the recess 66 of the push-up bodies 62a to 62c. For this reason, the part of the pressure-sensitive adhesive sheet 11 that is supported by the push-up bodies 62a to 62c is peeled off in two steps. Therefore, the peel-off of the parts starts only when the push-up bodies 62a to 62c are lowered. Compared to the case, the stress acting on the semiconductor chip t can be remarkably reduced. Therefore, even a thin semiconductor chip t that is easily damaged, for example, a semiconductor chip t with a thickness of 30 μm or less can be picked up satisfactorily. Further, when the portion of the adhesive sheet 11 corresponding to the recess 66 is peeled off from the semiconductor chip t, the semiconductor chip t protrudes from both sides of the recess 66 (both sides in the direction along the side of the semiconductor chip t) and from the three sides on the center side. 64, 65. Therefore, even when a force in the direction of peeling from the semiconductor chip t is applied to the adhesive sheet 11, compared to a case where the force is applied to the adhesive sheet 11 in a state where the support of the entire peripheral portion of the semiconductor chip t is released, The stress generated in the semiconductor chip t can be significantly reduced.

Moreover, the length along the circumferential direction of the recessed part 66 provided in the upper end part of the rectangular 1st-3rd push-up body 62a-62c, ie, the length along the side part, is 0.4 mm or more. It formed so that it might become 0 mm or less. When the length of the concave portion 66 is shorter than 0.4 mm, even if a negative pressure of −85 kPa or less is applied in the concave portion 66, the area where the negative pressure acts on the pressure-sensitive adhesive sheet 11 becomes too small, and the peeling portion P is good. It becomes difficult to form. On the other hand, if the length of the recess 66 is longer than 2.0 mm, the area where the negative pressure acts on the pressure-sensitive adhesive sheet 11 becomes excessive, and excessive stress is applied to the semiconductor chip t when the peeling portion P is formed, causing damage. May occur. By making the length of the recessed part 66 0.4 mm or more and 2.0 mm or less, the peelability of the adhesive sheet 11 can be ensured while ensuring the supportability of the semiconductor chip t. As a result, it becomes possible to form the peeling part P satisfactorily while suppressing the stress applied to the semiconductor chip t, and the semiconductor chip t can be peeled from the adhesive sheet 11 quickly and satisfactorily.

  Further, the length along the circumferential direction of the concave portion 66 provided at the upper ends of the first to third push-up bodies 62 a to 62 c having a square shape, that is, the length in the direction along the side portion is set as the side edge of the convex portion 65. It was set to 0.8 to 1.2 times the length in the direction along the part. When smaller than 0.8 times, the ratio of the area | region where the peeling part P is formed becomes small with respect to the length of the side part of each pushing-up body 62a-62c. Therefore, when the pressure-sensitive adhesive sheet 11 is peeled by the subsequent lowering of the push-up bodies 62a, 62b, and 62c, the peeling portion P serving as a separation starting point is small, and the probability that the progress of peeling is delayed increases. On the contrary, when larger than 1.2 times, the ratio of the area | region supported by the convex parts 64 and 65 with respect to the length of the side part of each pushing-up body 62a-62c decreases. Therefore, the stress applied to the semiconductor chip t when the peeling portion P is formed increases, and the probability of damage to the semiconductor chip t increases. Further, by forming the recesses 66A, 66B, and 66C in an alternate positional relationship, it is possible to prevent the peeling portion P from being continuously formed to the center of the semiconductor chip t, and to reduce the stress applied to the semiconductor chip t. I am trying. However, if the length of the concave portion 66 exceeds 1.2 times, the peeling portion P easily spreads to the center of the semiconductor chip t through the adjacent concave portions 66A, 66B and 66B, 66C. If it does so, the inhibitory effect of the damage by forming recessed part 66A, 66B, 66C by turns will fall. Therefore, the recess 66 is preferably set to a length that is 0.8 times or more and 1.2 times or less that of the projection 65.

(Other embodiments)
In addition, this invention is not limited to said embodiment. For example, in the above-described mounting form, the operations of the first to fourth push-up bodies 62a to 62d of the push-up mechanism 60 are positioned outside after the first to fourth push-up bodies 62a to 62d are lifted together. Although it was set as the example which descends in order from the 1st push-up body 62a, it is not restricted to this. For example, you may make it raise the 1st-4th push-up body 62a-62d so that the push-up body located inside may become so high. That is, after the first to fourth push-up bodies 62a to 62d are raised together by a predetermined height, the second to fourth push-up bodies 62b to 62d are further raised to a predetermined height, and then the third to third The fourth push-up bodies 62c to 62d may be further raised by a predetermined height, and finally the fourth push-up body 62d may be further raised by a predetermined height. In short, the plurality of push-up bodies 62a to 62d may be operated so as to be sequentially separated from the semiconductor chip t.

In the above embodiment, the substrate stage 20 that moves the substrate K in the XYθ direction has been described as the substrate stage. However, the present invention is not limited to this. For example, a pair of guide rails are arranged along a direction intersecting the arrangement direction of the supply device 10 and the intermediate stage 30 so that the substrate K is transported and positioned on the guide rails at the mounting work position by the mounting mechanism 50. You may comprise. That is, the substrate stage also includes a transport unit that carries the substrate K into the mounting work position by the mounting mechanism 50, positions the board K at the mounting work position, and carries it out of the mounting work position.

(Examples and comparative examples)
Next, examples of the present invention and evaluation results thereof will be described.

A pick-up test was performed under the following conditions by the mounting apparatus 1 of the above-described embodiment. The semiconductor chip t picked up by the pickup mechanism 40 was placed on a test glass substrate placed on the substrate stage 20 by the mounting mechanism 50. An adhesive film was attached to the glass substrate so that the arranged semiconductor chip t did not move during the movement of the substrate stage 20. As the push-up mechanism, the push-up mechanism 60 shown in FIG. 3 was used, and the push-up was performed by the operation shown in FIGS.

Fifty semiconductor chips t were picked up from a wafer having a diameter of 300 mm, and the number of semiconductor chips t that were cracked during pick-up was measured. Specifically, before picking up, it is confirmed that 50 semiconductor chips t to be picked up are not cracked, and a semiconductor in which cracks are generated in the 50 semiconductor chips t arranged on the glass substrate. By counting the number of chips t, the number of semiconductor chips t that were cracked during pickup was measured.

<Test conditions>
・ Semiconductor chip size: 3 × 4mm
・ Thickness of semiconductor chip: three types of 35 μm, 25 μm, and 15 μm. ・ Negative pressure applied between push-up mechanism 60 and adhesive sheet 11: −90 kPa, −88 kPa, −85 kPa. 5 conditions of -83 kPa and -80 kPa ・ Push-up amount: 1 mm
* The push-up amount is an amount by which the first to fourth push-up bodies 62a to 62d shown in FIG.
・ Standby time: 0.2 seconds

Example 1
Among the above test conditions, a negative pressure was set to −90 kPa, and a pickup test was performed using a semiconductor chip t having a thickness of 35 μm. The results are shown in Table 1.
(Example 2)
Among the above test conditions, a negative pressure was set to −90 kPa, and a pick-up test was performed using a semiconductor chip t having a thickness of 25 μm. The results are shown in Table 1.
(Example 3)
Among the above test conditions, a negative pressure was set to −90 kPa, and a pickup test was performed using a semiconductor chip t having a thickness of 15 μm. The results are shown in Table 1.
Example 4
Among the above test conditions, a negative pressure was set to −88 kPa, and a pick-up test was performed using a semiconductor chip t having a thickness of 35 μm. The results are shown in Table 1.
(Example 5)
Among the above test conditions, a negative pressure was set to −88 kPa, and a pickup test was performed using a semiconductor chip t having a thickness of 25 μm. The results are shown in Table 1.
(Example 6)
Among the above test conditions, a negative pressure was set to −88 kPa, and a pickup test was performed using a semiconductor chip t with a thickness of 15 μm. The results are shown in Table 1.
(Example 7)
Among the above test conditions, a negative pressure was set to −85 kPa, and a pickup test was performed using a semiconductor chip t having a thickness of 35 μm. The results are shown in Table 1.
(Example 8)
Among the above test conditions, a pick-up test was performed using a semiconductor chip t with a negative pressure of −85 kPa and a thickness of 25 μm. The results are shown in Table 1.
Example 9
Among the above test conditions, a negative pressure was set to −85 kPa, and a pickup test was performed using a semiconductor chip t having a thickness of 15 μm. The results are shown in Table 1.

(Comparative Example 1)
Among the above test conditions, a negative pressure was set to −83 kPa, and a pickup test was performed using a semiconductor chip t having a thickness of 35 μm. The results are shown in Table 1.
(Comparative Example 2)
Among the above test conditions, a pick-up test was performed using a semiconductor chip t with a negative pressure of −83 kPa and a thickness of 25 μm. The results are shown in Table 1.
(Comparative Example 3)
Among the above test conditions, a pick-up test was performed using a semiconductor chip t having a negative pressure of −83 kPa and a thickness of 15 μm. The results are shown in Table 1.
(Comparative Example 4)
Among the above test conditions, a negative pressure was set to −80 kPa, and a pickup test was performed using a semiconductor chip t having a thickness of 35 μm. The results are shown in Table 1.
(Comparative Example 5)
Among the above test conditions, a negative pressure was set to −80 kPa, and a pickup test was performed using a semiconductor chip t with a thickness of 25 μm. The results are shown in Table 1.
(Comparative Example 6)
Among the above test conditions, a negative pressure was set to −80 kPa, and a pickup test was performed using a semiconductor chip t having a thickness of 15 μm. The results are shown in Table 1.

  The embodiments, examples, and comparative examples of the present invention have been described above, but these are not intended to limit the scope of the invention. The above-described novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention and included in the invention described in the claims.

DESCRIPTION OF SYMBOLS 1 Mounting apparatus 10 Supply apparatus 11 Adhesive sheet 12 Wafer ring 13 Wafer table 20 Substrate stage 30 Intermediate stage 40 Pickup mechanism 41 Adsorption nozzle 50 Mounting mechanism 51
60 Push-up mechanism 61 Backup body 61a Backup surface 61b Internal space 61c Suction groove 61d Suction hole 61e Communication groove 61f Opening part 62 Push-up mechanism 62a First push-up body 62b Second push-up body 62c Third push-up body 62d Fourth push-up Body 62e Lift drive device 62f Lift drive device 62g Lift drive device 62h Lift drive device 63 Suction pump 63a Vacuum piping 63b Pressure control device (negative pressure adjustment mechanism)
63c On-off valve 63d Pressure detector 64 Convex part 65 Convex part 66 Concave part 70 Control device 71 Storage part t Semiconductor chip K Substrate W Wafer

Claims (7)

A semiconductor chip pick-up device for picking up a semiconductor chip adhered and held on an adhesive sheet from the adhesive sheet,
A pickup mechanism for picking up the semiconductor chip from the adhesive sheet;
The semiconductor chip has a plurality of push-up bodies that are arranged with the same axial center and are provided so as to be movable in the axial direction. The semiconductor chip is located in the adhesive sheet where the semiconductor chip picked up by the pickup mechanism is located. A push-up mechanism that applies a negative pressure from the opposite side and pushes up the semiconductor chip by the plurality of push-up bodies when the semiconductor chip is picked up by the pickup mechanism;
And a negative pressure adjusting mechanism for setting the magnitude of the negative pressure to -85 kPa or less as a gauge pressure.   The plurality of push-up bodies include a prismatic push-up body arranged in the center, and at least one square tube-like push-up body arranged with the same axis as that of the prismatic push-up body. 2. The semiconductor chip pick-up device according to claim 1.   3. The semiconductor chip pick-up device according to claim 2, wherein a plurality of the rectangular cylindrical push-up bodies are provided and are arranged in multiples with the same axis.   4. The pick-up device for a semiconductor chip according to claim 2, wherein the square cylindrical push-up body has a convex portion and a concave portion provided alternately along the circumferential direction at an upper end portion thereof.   The length along the circumferential direction of the concave portion is set to be 0.8 times or more and 1.2 times or less than the length of the convex portion along the circumferential direction. Semiconductor chip pickup device. A supply device for holding an adhesive sheet on which a semiconductor chip is adhered and held;
A substrate stage on which the substrate is placed;
A pickup device that picks up the semiconductor chip from the adhesive sheet held by the supply device;
A mounting mechanism for mounting the semiconductor chip taken out by the pickup device on the substrate,
6. A semiconductor chip mounting apparatus, wherein the pickup apparatus is the pickup apparatus according to claim 1. A semiconductor chip mounting method for picking up a semiconductor chip adhered and held on an adhesive sheet from the adhesive sheet and mounting the picked-up semiconductor chip on a substrate,
When picking up the semiconductor chip from the pressure-sensitive adhesive sheet by a pickup mechanism that picks up the semiconductor chip from the pressure-sensitive adhesive sheet, negative pressure is applied to the pressure-sensitive adhesive sheet from the opposite side to the semiconductor chip, and the axis is the same When the semiconductor chip is pushed up by a plurality of push-up bodies arranged in such a manner as to be movable in the axial direction with respect to each other,
A semiconductor chip mounting method, wherein the negative pressure is set to a gauge pressure of −85 kPa or less.

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