JP2010056466A - Device and method for picking up semiconductor chip - Google Patents

Abstract

An object of the present invention is to provide a pickup device that can reliably and easily pick up a semiconductor chip from an adhesive sheet.
A back-up body 1 that sucks and holds a portion corresponding to a peripheral portion of a semiconductor chip to be picked up by an adhesive sheet, and a plurality of push-up bodies 34 to 36 provided in the back-up body, and is located at least at the outermost periphery. A push-up means 33 having a concave portion 49b having a first convex portion 49a that partially supports the side portion of the semiconductor chip and a second convex portion 50 that supports a corner portion formed on the upper surface of the push-up body; The plurality of push-up bodies are driven in the upward direction to press the lower surface of the part where the semiconductor chip to be picked up of the adhesive sheet is stuck to push up the semiconductor chip together with the adhesive sheet from the upper surface of the backup body and from the semiconductor chip of the adhesive sheet Motor that advances the peeling of the concave portion from the first convex portion of the concave portion, and the semiconductor chip where the peeling of the adhesive sheet has advanced It comprises a pick-up to the suction nozzle body.
[Selection] Figure 3

Description

  The present invention relates to a pickup apparatus and a pickup method for picking up a semiconductor chip attached to an adhesive sheet.

  The semiconductor chips formed by cutting the semiconductor wafer into dice are stuck to the adhesive sheet, and when this semiconductor chip is mounted on the substrate, it is picked up one by one from the adhesive sheet by the suction nozzle. .

  In the case of picking up a semiconductor chip from an adhesive sheet, conventionally, the peripheral part of the semiconductor chip of the adhesive sheet to which the semiconductor chip picked up by a pickup tool comprising an adsorption nozzle is attached is adsorbed and held by the upper surface of the backup body. Then, the adhesive sheet is peeled off from the semiconductor chip by picking up the semiconductor chip from the lower surface side with a push-up pin having a sharp tip, and picked up by the suction nozzle.

  By the way, recently, the thickness of a semiconductor chip may be very thin as 50 μm or less, and such a thin semiconductor chip has flexibility to bend and deform when a load is applied. Therefore, if such a thin semiconductor chip is pushed up while the adhesive sheet is stretched by a push-up pin, the tension of the pressure-sensitive adhesive sheet is applied to the peripheral portion of the pushed-up semiconductor chip. It may be curved and deformed.

  If the semiconductor chip is curved and deformed downward, the adhesive sheet becomes difficult to peel off from the peripheral portion of the semiconductor chip. Therefore, the semiconductor chip may not be picked up by the suction nozzle, or if the degree of curvature increases, the semiconductor chip May be damaged.

Therefore, as shown in Patent Document 1, when the semiconductor chip is pushed up, the semiconductor chip is prevented from being bent and deformed, and the peeling of the adhesive sheet attached to the lower surface of the semiconductor chip is the peripheral part of the semiconductor chip. Pickup devices have been developed that gradually move from the center toward the center.

  The pick-up device has a plurality of push-up bodies provided concentrically with their axes aligned. The upper surface shape formed by the plurality of push-up bodies is usually formed in the same shape as the semiconductor chip to be picked up, usually a quadrangle.

  And the said pick-up apparatus raises several push-up bodies simultaneously to predetermined height, presses and pushes up the whole lower surface of the semiconductor chip picked up, leaves the push-up body located in the outermost side, and other push-up bodies Is further raised to a predetermined height. Next, the other thruster is raised while leaving the second thruster.

  In this way, by sequentially raising the plurality of push-up bodies, the plurality of push-up bodies gradually increase from the outside toward the center, and the support by the push-up bodies on the lower surface of the semiconductor chip is sequentially opened from the peripheral part toward the center part. Is done.

As a result, the adhesive tape is peeled off from the portion of the semiconductor chip that has been lifted by the support, and the adhesive tape is finally attached only to the central portion of the semiconductor chip. It can be picked up by a pick-up tool.
JP-A-1-321650

  By the way, according to the pickup device having the above-described configuration, when the plurality of push-up bodies whose upper surfaces are rectangular are first lifted at the same time and the rectangular semiconductor chip is pushed up while stretching the adhesive sheet, the push-out body located on the outermost side is a semiconductor. The entire periphery of the lower surface periphery of the chip is supported. Therefore, in that state, the adhesive sheet hardly peels from the peripheral portion of the semiconductor chip.

  Next, when the other push-up bodies excluding the outermost push-up body are raised to a predetermined position, the support state of the lower surface peripheral portion of the semiconductor chip by the outermost push-up body is released. However, since the adhesive sheet is not peeled off from the peripheral portion of the semiconductor chip in the previous stage, the peripheral portion of the semiconductor chip whose support state is released is pulled as a whole by the tension of the stretched adhesive sheet. .

  In other words, if the tension of the adhesive sheet is applied to the entire periphery of the semiconductor chip, the tension does not act strongly on a part of the semiconductor chip and is dispersed throughout the periphery, so that the adhesive sheet is peeled off from the semiconductor chip. Not only is it difficult, but the adhesive sheet is difficult to peel off, and if the peripheral portion of the semiconductor chip bends downward, the adhesive sheet is further difficult to peel off.

  In other words, the conventional push-up body was not structured to generate a location where the adhesive sheet begins to peel from the semiconductor chip, that is, an inducement site for peeling when the plurality of push-up bodies are first raised to the same height. In addition to the fact that the peeling tape is difficult to peel from the semiconductor chip, the semiconductor chip may be excessively bent and damaged.

  It is an object of the present invention to provide a pickup device and a pickup method that can be reliably peeled from an adhesive sheet without damaging a semiconductor chip.

This invention is a semiconductor chip pickup device for picking up a rectangular semiconductor chip attached to an adhesive sheet,
A backup body formed on the suction surface that holds the portion corresponding to the peripheral portion of the semiconductor chip from which the upper surface is picked up by the adhesive sheet;
It has a plurality of push-up bodies provided in the backup body so that they can move relative to each other with the same axis, and at least the upper surface of the push-up body located at the outermost periphery corresponds to the four side portions of the semiconductor chip. A push-up means in which a concave portion having a first convex portion that partially supports the side portion thereof in the portion to be formed and a second convex portion that supports the corner portion in a portion corresponding to the corner portion of the semiconductor chip are formed When,
The plurality of push-up bodies of the push-up means are driven in the ascending direction to press the lower surface of the part to which the semiconductor chip to be picked up of the adhesive sheet is stuck so that the semiconductor chip is attached together with the adhesive sheet to the upper surface of the backup body. Driving means that pushes up from the first chip of the recess to advance the adhesive sheet from the semiconductor chip;
A pickup device for a semiconductor chip, comprising: pick-up means for picking up the semiconductor chip pushed up by the drive means and the peeling of the pressure-sensitive adhesive sheet from the pressure-sensitive adhesive sheet.

  The concave portion is preferably provided with a plurality of mountain-shaped first convex portions.

  It is preferable that a rectangular second convex portion is provided in the middle of the concave portion.

  It is preferable that a suction hole opening in the recess is formed.

  Preferably, the driving means pushes up the plurality of push-up bodies of the push-up means to the same height, and then pushes up sequentially so that the push-up bodies positioned inside are higher than the push-up bodies located outside.

This invention is a semiconductor chip pickup method of picking up a rectangular semiconductor chip attached to an adhesive sheet with a pickup tool,
A portion of the pressure-sensitive adhesive sheet that is located around the semiconductor chip picked up by the pickup tool is sucked and held, and a portion corresponding to the lower surface of the semiconductor chip, excluding four side portions, and four side sides A step of supporting only a part of the portion by the lifting means;
Raising the push-up means to push up the semiconductor chip together with the pressure-sensitive adhesive sheet, and peeling the pressure-sensitive adhesive sheet from the part of the side of the semiconductor chip that is separated from the part supported by the push-up means;
If the pressure-sensitive adhesive sheet is peeled off from a portion of the side portion of the semiconductor chip that is not supported by the push-up means, the support area of the semiconductor chip by the push-up means is sequentially reduced to sequentially reduce the semiconductor chip of the pressure-sensitive adhesive tape. A step of proceeding with peeling from,
And picking up the semiconductor chip from which the adhesive tape has been peeled off from the adhesive sheet.

  According to the present invention, only the portion excluding the four side portions and part of the four side portions of the rectangular semiconductor chip are supported by the push-up means that pushes up the semiconductor chip. When is pushed up, peeling of the adhesive tape is started from a portion not supported by the pushing-up means on the side portion. That is, peeling from the adhesive tape is started from the side portion of the semiconductor chip.

  If the peeling of the adhesive tape is started from a part of the side portion of the semiconductor chip, the peeling spreads over the entire semiconductor chip. Therefore, the peeling of the adhesive tape is performed reliably and quickly without damaging the semiconductor chip. It becomes possible.

Embodiments of the present invention will be described below with reference to the drawings.
1 to 4 show a first embodiment of the present invention. The pickup apparatus shown in FIG. 1 includes a backup unit 10. This backup unit 10 is provided opposite to the lower surface side of the adhesive sheet 2 stretched on a wafer ring (not shown), and the upper surface of the backup body 1 is made to adhere to the adhesive sheet 2 in the Z direction by a Z drive source (not shown) as will be described later. A position between the contact position and a position away from the adhesive sheet 2 is driven.

  A plurality of semiconductor chips 3 obtained by dividing a semiconductor wafer into dice-like shapes are attached to the upper surface of the adhesive sheet 2. The wafer ring is driven in the horizontal direction by an X and Y drive source (not shown).

  Thereby, the semiconductor chip 3 attached to the adhesive sheet 2 can be positioned in the X and Y directions with respect to the backup unit 10. Instead of the backup unit 10, the wafer ring may be driven in the Z direction. In short, the wafer ring and the backup unit 10 are relatively driven in the X, Y, and Z directions. That's fine.

  On the upper surface side of the pressure-sensitive adhesive sheet 2, a suction nozzle body 4 constituting pickup means is provided above the backup unit 10. The suction nozzle body 4 has a pickup shaft 5 that is driven in the X, Y, and Z directions by an X, Y, and Z drive source (not shown). A convex portion 6 is provided on the lower end surface of the pickup shaft 5.

  The pickup shaft 5 is formed with a suction hole 7 whose tip is opened at the end face of the convex portion 6 along the axial direction. The suction hole 7 is connected to a suction pump 31 shown in FIG. An upper suction nozzle 8 made of an elastic material such as rubber or soft synthetic resin is detachably attached to the convex portion 6. The upper suction nozzle 8 is formed with a nozzle hole 9 having one end communicating with the suction hole 7 and the other end opened to the tip surface, and further having a lower surface formed on a flat surface 8a.

  Note that it is preferable to use a voice coil motor or the like as a Z drive source for driving the pickup shaft 5 in the Z direction, and to control the pressing load applied by the suction nozzle body 4 to be constant.

  As shown in FIGS. 2 and 3, the backup body 1 has a rectangular tube shape in the upper end surface, in this embodiment, a rectangular opening 23, and a rectangular tube shape in which the lower end surface is closed. That is, the backup body 1 is formed with a hollow prismatic accommodating portion 24 along the vertical direction. The opening 23 is formed in a rectangular shape that is slightly smaller than the rectangular semiconductor chip 3 to be picked up indicated by a chain line in FIG. That is, the opening 23 is formed in a similar shape to the semiconductor chip 3.

  In addition, the semiconductor chip 3 may not be rectangular but may be a square. In this case, the opening 23 formed in the backup body 1 may be a slightly smaller square than the semiconductor chip 3.

  Three annular grooves 25 surrounding the opening 23 are concentrically formed on the upper surface of the backup body 1. The three annular grooves 25 are communicated with each other by four communication grooves 26 formed along the radial direction of the backup body 1. One end of the suction hole 28 is opened in one of the four communication grooves 26. The suction hole 28 is formed in the peripheral wall of the backup body 1 along the vertical direction, and the other end is opened on the lower side surface of the backup body 1.

  The suction pump 31 is connected to the other end of the suction hole 28 by a pipe 32 (both shown in FIG. 1). When the suction pump 31 is operated, a suction force is generated in the three annular grooves 25 via the suction holes 28 and the communication grooves 26. Therefore, if the upper surface of the backup body 1 is brought into contact with the lower surface of the adhesive sheet 2, the upper surface thereof The adhesive sheet 2 is held by suction. That is, the upper surface of the backup body 1 is an adsorption surface for adsorbing and holding the adhesive sheet 2.

  A pushing-up means 33 for pushing up the semiconductor chip 3 to be picked up is housed in the prismatic housing portion 24 of the backup body 1. The push-up means 33 is composed of first to third push-up bodies 34 to 36 which are provided concentrically with the same axis. The first push-up body 34 is located on the outermost side, and the third push-up body 36 is located at the center.

  That is, the first push-up body 34 has a rectangular tube shape in which the outer shape connecting the apexes of the four corners is substantially the same rectangular shape as the housing portion 24, and a pair of side surfaces opposed to the outer peripheral surface of the lower end portion thereof. As shown in FIG. 2, a pair of first ridges 37 having an L-shaped cross section are provided. The first rod 37 is accommodated in a first recess 38 formed on a pair of opposed inner surfaces of the accommodating portion 24 so as to be movable in the vertical direction. That is, the height dimension of the first recess 38 is set larger than the height dimension of the first flange 37.

  A first spring 39 is accommodated in a compressed state between the first flange 37 and the upper surface of the first recess 38. Accordingly, the first push-up body 34 is elastically held at a position where the lower end surface of the first flange 37 contacts the lower end surface of the first recess 38. In this state, the upper end surface of the first push-up body 34 is the same height as the upper surface of the backup body 1.

  The second push-up body 35 is a rectangular tube having a size accommodated in the first push-up body 34, and a pair of side surfaces facing each other at the lower end thereof has a pair of L-shaped cross sections. A second ridge 41 is provided. The second rod 41 is accommodated in a second recess 42 formed on a pair of opposed inner surfaces of the first push-up body 34 so as to be movable in the vertical direction. That is, the height dimension of the second recess 42 is set larger than the height dimension of the second flange 41.

  Between the second flange 41 and the upper surface of the second recess 42, a second spring 43 having a smaller deformation amount with respect to the load than the first spring 39, that is, a strong second spring 43 is accommodated in a compressed state. . Thereby, the second push-up body 35 is elastically held at a position where the lower end surface of the second flange 41 contacts the lower end surface of the second recess 42. In this state, the upper end surface of the second push-up body 35 is flush with the upper surfaces of the backup body 1 and the first push-up body 34.

  The third push-up body 36 has an angular axis shape that is sized to be accommodated in the second push-up body 35, and a pair of side surfaces facing each other at the lower end thereof has a pair of L-shaped cross sections. A third collar 44 is provided. The third flange 44 is accommodated in a third recess 45 formed on a pair of opposed inner surfaces of the second push-up body 35 so as to be movable in the vertical direction. That is, the height dimension of the third recess 45 is set larger than the height dimension of the third flange 44.

  A third spring 46 stronger than the second spring 43 is accommodated in a compressed state between the third flange 44 and the upper surface of the third recess 45. Accordingly, the third push-up body 36 is elastically held at a position where the lower end surface of the third flange 44 abuts on the lower end surface of the third recess 45. In this state, the upper end surface of the third push-up body 36 is level with the upper surfaces of the backup body 1 and the first and second push-up bodies 34 and 35.

  In the upper part including the upper surface of the first push-up body 34, the four side portions of the quadrilateral are formed in a mountain shape with a predetermined length except for the corners. Thereby, a plurality of triangular first convex portions 49a are formed on the four side portions, and the concave portions 49b corresponding to the first convex portions 49a are formed on portions other than the first convex portions 49a. Is formed in a mountain shape.

  The vertices of the plurality of first protrusions 49a are located on the same straight line. In addition, the four corners of the first push-up body 34 are second projections 50 having an angle of 90 degrees, and the vertex of the second projection 50 is the same as the vertex of the first projection 49a. It is located in a straight line.

  Thereby, when the semiconductor chip 3 is sucked and held on the upper surface of the backup body 1 as indicated by a chain line in FIG. 3, the vertexes of the plurality of first protrusions 49 a and the vertexes of the second protrusions 50 are the semiconductor chip 3. Located at the same distance to the sides of That is, each side portion of the semiconductor chip 3 is supported by the plurality of first convex portions 49a and the second convex portions 50 in a state where the entire length in the length direction is uniform.

  When the picked-up semiconductor chip 3 attached to the adhesive sheet 2 is positioned as indicated by the chain line in FIG. 3, the first convex portion 49 a and the concave portion 49 b are formed on the lower surface of each side portion of the semiconductor chip 3. Opposite positions are located via the pressure-sensitive adhesive sheet 2, and the corners are located opposite to the second convex portions 50 via the pressure-sensitive adhesive sheet 2.

  Accordingly, when the first to third push-up bodies 34 to 36 are lifted while stretching the adhesive sheet 2 as will be described later, each side portion of the semiconductor chip 3 is partially supported by the first convex portions 49a. The corner portion is supported by the second convex portion 50. Since the vertices of the first convex portion 49a and the second convex portion 50 are located on the same straight line, the semiconductor chip 3 is in a state where each side portion is uniform by the convex portions 49a and 50, that is, the adhesive sheet 2 When the tension is applied, the amount of bending is supported over the entire length of the side portion.

  A drive shaft portion 48 extends downward at the lower end of the third push-up body 36. The drive shaft 48 protrudes airtightly from a through hole 51 formed in the bottom wall of the backup body 1, and a cam follower 52 is provided at the lower end thereof.

  The cam follower 52 is in contact with the outer peripheral surface of the cam body 53. The cam body 53 is rotationally driven by a rotary motor 54. When the cam body 53 is driven to rotate, the third push-up body 36 is driven up and down between the top dead center and the bottom dead center of the cam body 53. FIG. 2 shows a state where the third pusher 36 is in the lowered position. The cam follower 52, the cam body 53, and the rotary motor 54 constitute drive means for driving the push-up means 33 in the vertical direction.

  When the cam body 53 is driven to rotate and the third push-up body 36 is driven in the upward direction, the second push-up body 35 and the first push-up body 34 are lifted by the third push-up body 36. The third and second springs 46 and 43 are linked to each other. At this time, the first pusher 34 located on the outermost side of the pusher 33 compresses the first spring 39.

  When the first push-up body 34 rises while compressing the first spring 39 and the upper end of the first flange 37 hits the upper surface of the first recess 38, the rise of the first push-up body 34 stops. . However, the second push-up body 35 further rises while compressing the second spring 43, and the third push-up body 36 is interlocked with the third spring 46 via the third spring 46.

  When the second spring 43 is compressed and the upper end of the second flange 41 of the second push-up body 35 hits the upper surface of the second recess 42, the second push-up body 35 stops rising and the third push-up body 35 stops. Only the push-up body 36 rises while compressing the third spring 46.

  When the cam follower 52 provided on the drive shaft portion 48 shifts to the top dead center of the cam body 53, the third push-up body 36 rises to the maximum. Then, with the subsequent rotation of the cam body 53, the third to first push-up bodies 36, 35, 34 are sequentially returned to the lowered position by the restoring force of the third to first springs 46, 42, 39, respectively. .

  That is, by sequentially increasing the strength of the first to third springs 39, 43, and 46, the three push-up bodies 34 to 36 are raised together at first, but the first push-up body 34 is moved to the upper limit. If it raises, the 2nd, 3rd push-up bodies 35 and 35 will raise in steps.

  As shown in FIG. 3, a plurality of suction holes 34a, 35a penetrating in the vertical direction are formed in the circumferential wall of the first and second push-up bodies 34, 35 at predetermined intervals in the circumferential direction. At the center of the third push-up body 36, a suction hole 36a having one end opened on the upper surface is formed. As shown in FIG. 2, the other end of the suction hole 36a is opened on the outer peripheral surface of the portion of the drive shaft 48 that extends from the lower end of the third push-up body 36 and is located in the accommodating portion 24. .

  A branch suction hole 34 b is branched at the upper end of the suction hole 34 a formed in the first push-up body 34, and the branch suction hole 34 b is a recess 49 b formed in the upper outer peripheral surface of the first push-up body 34. Is open.

  A communication hole 55 communicating with the housing portion 24 is formed at the lower end of the peripheral wall of the backup body 1, and the communication hole 55 is connected to the suction pump 31 by a pipe 32. Accordingly, the suction force of the suction pump 31 acts on the upper surfaces of the push-up bodies 34 to 36 through the suction holes 34 a to 36 a formed in the push-up bodies 34 to 36.

Next, an operation when the semiconductor chip 3 is picked up from the adhesive sheet 2 by the pickup device having the above configuration will be described.
When the semiconductor chip 3 to be picked up is positioned with respect to the opening 23 on the upper surface of the backup body 1 as indicated by a chain line in FIG. 3, the adhesive sheet 2 is moved to the annular groove 25 of the backup body 1 by the suction force of the suction pump 31. And the upper surfaces of the first to third push-up bodies 34 to 36 accommodated in the backup body 1.

  That is, in the adhesive sheet 2, the portion corresponding to the lower surface of the semiconductor chip 3 to be picked up is sucked and held by the upper surfaces of the first to third push-up bodies 34 to 36, and the portion corresponding to the peripheral portion of the semiconductor chip 3 is It is sucked and held by the upper surface of the backup body 1.

  If the pressure-sensitive adhesive sheet 2 is sucked and held in this way, the suction nozzle body 4 is lowered and the upper surface of the semiconductor chip 3 picked up by the upper suction nozzle 8 is sucked, and then the cam body 53 is rotated.

  Thereby, first, as shown in FIG. 4A, the first to third push-up bodies 34 to 36 are simultaneously raised to a predetermined height to push up the semiconductor chip 3. At this time, the suction nozzle body 4 rises together with the semiconductor chip 3. When the 1st thru | or 3rd push-up bodies 34-36 raise and push up the semiconductor chip 3, the adhesive sheet 2 will be extended. Thereby, the tension and the suction force of the suction pump 31 act on the part of the adhesive sheet 2 where the peripheral part of the semiconductor chip 3 is adhered.

  The peripheral portion of the semiconductor chip 3 is partly formed by the first convex portion 49a and the second convex portion 50 formed on the side portion of the first push-up body 34, and the apex of each convex portion 49a, 50. Are uniformly supported by being located on the same straight line, and the portion corresponding to the concave portion 49a where the first convex portion 49a is not formed is not supported.

  Therefore, when the semiconductor chip 3 is pushed up, the portion of the pressure-sensitive adhesive sheet 2 corresponding to the peripheral portion of the semiconductor chip 3 is pulled by tension, and when the suction force of the suction pump 31 is sucked, the semiconductor of the pressure-sensitive adhesive sheet 2 A portion of the side portion of the chip 3 that is not supported by the first convex portion 49a, that is, a portion corresponding to the mountain-shaped concave portion 49b starts to peel off.

  In addition, since the branch suction hole 34b branched from the suction hole 34a formed in the first push-up body 34 is opened in the recess 49b, the branch corresponding to the recess 49b of the pressure-sensitive adhesive sheet 2 is formed in the branch 49b. A suction force generated in the suction hole 34b acts.

  More specifically, the side portion of the semiconductor chip 3 is partially supported uniformly by the first convex portion 49a and the second convex portion 50 formed on the first push-up body 34. Tension and suction force are easily applied to a portion corresponding to the concave portion 49a that is not supported by the convex portion 49a.

  In addition, the side portion of the semiconductor chip 3 is partially supported by the first convex portion 49 a, and the corner portion is supported by the second convex portion 50. That is, since the side part of the semiconductor chip 3 is uniformly supported by the first convex part 49a and the second convex part 50, the peripheral part of the semiconductor chip 3 is bent downward by the tension on the adhesive sheet 2. There is almost no. As a result, the pressure-sensitive adhesive sheet 2 starts to be peeled off from a portion corresponding to the mountain-shaped recess 49 a formed in the first push-up body 34 in the peripheral portion of the semiconductor chip 3.

  Thus, when peeling of the adhesive sheet 2 is started and the rising of the first push-up body 34 is stopped, the second push-up body 35 and the third push-up body 36 are then raised. Thereby, as shown in FIG. 4B, the entire part of the adhesive sheet 2 that is supported by the first push-up body 34 including the first convex portion 49 a of the semiconductor chip 3 is peeled off.

  When the second and third push-up bodies 35, 36 are raised to the ascent limit and the rise is stopped, then only the third push-up body 36 is raised as shown in FIG. 4 (c). As a result, the adhesive sheet 2 is separated from the semiconductor chip 3 by the portion supported by the second push-up body 35 following the portion supported by the first push-up body 34. Only the supported part remains as a stuck state.

  The third push-up body 36 has an angular axis shape, and the area of the upper end surface is set to be sufficiently smaller than the first and second push-up bodies 34 and 35. Therefore, when only the third push-up body 36 finishes rising, the suction nozzle body 4 that sucks the upper surface of the semiconductor chip 3 as shown in FIG. It will be peeled off relatively easily.

  In this manner, the concave portion 49b having the first convex portion 49a is formed in a mountain shape in the peripheral portion of the first push-up body 34 located on the outermost side of the push-up means 33, and the corners of the first push-up body 34 are also formed. The second convex part 50 is formed on the part.

  In addition, on each side of the first push-up body 34, the corners of the first convex portion 49a and the second convex portion 5090 degrees are positioned on the same straight line so that each side of the semiconductor chip 3 is located. The part can be supported uniformly.

  Therefore, when the push-up means 33 is raised, the tension generated by the pressure-sensitive adhesive sheet 2 being stretched and the suction force for sucking the pressure-sensitive adhesive sheet 2 concentrate on the portion corresponding to the concave portion 49a of the pressure-sensitive adhesive sheet 2. The pressure-sensitive adhesive sheet 2 is smoothly peeled off from the portion corresponding to the recess 49a.

  In addition, the branch suction path 34b opens into the recess 49a, and the suction force generated in the branch suction path 34b acts on the portion of the adhesive sheet 2 corresponding to the recess 49a. Peeling is promoted from the location corresponding to 49a.

  The concave portion 49a is formed in the peripheral portion of the first push-up body 34. The concave portion 49a is provided with the first convex portion 49a, and the second convex portion 50 is provided at the corner portion of the first push-up body 34. Is provided.

  Therefore, when peeling the adhesive sheet 2 from the peripheral part of the semiconductor chip 3, each side part of the semiconductor chip 3 is supported by the first convex part 49 a and the corner part is supported by the second convex part 50. The peripheral portion of the semiconductor chip 3 is not greatly bent downward and is not damaged.

  In addition, each side portion including the corner of the semiconductor chip 3 is uniformly supported by the first and second convex portions 49a and 50 that are located on the same straight line. It is also prevented that the tension of the pressure-sensitive adhesive sheet 2 is applied unevenly to the side portion and the side portion is damaged.

  FIG. 5 is a plan view of push-up means 33A showing a second embodiment of the present invention. In the push-up means 33A of this embodiment, only one rectangular first convex portion 60 is formed in the middle of the concave portion 49B formed in the side portion of the first push-up body 34. Similar to the first embodiment, second convex portions 61 are formed at the corners of the first push-up body 34.

  Even if the first push-up body 34 has such a shape, as in the first embodiment, when the semiconductor chip 3 is raised, the tension of the pressure-sensitive adhesive sheet 2 and the suction force of the suction pump 31 are the pressure-sensitive adhesive sheet. 2 is concentrated on the portion corresponding to the concave portion 49B, and the pressure-sensitive adhesive sheet 2 is easily peeled off from the portion.

  Although not shown, in the second embodiment, a plurality of rectangular first convex portions are formed in the concave portions 49b on the side portions of the first push-up body 34 in accordance with the size of the semiconductor chip 3. You may do it.

  In the first embodiment, the recess formed in the first push-up body is formed with a predetermined length on the upper part including the upper surface of the first push-up body. You may make it form over. Then, the suction force of the suction pump acting on the portion of the adhesive sheet corresponding to the peripheral portion of the semiconductor chip can be increased, so that the adhesive sheet is peeled off from the peripheral portion of the semiconductor chip even better. It becomes possible.

  In each of the above embodiments, the case where the semiconductor chip is directly attached to the adhesive sheet has been described as an example. However, the semiconductor chip having the DAF (Die Attach Film) attached to the back surface is attached via the DAF. In some cases, the present invention can be applied even when the semiconductor chip is stuck to the adhesive sheet.

Moreover, although the recessed part was formed only in the outer peripheral surface of the 1st pushing-up body of a raising means, you may make it form a recessed part also in the outer peripheral surface of a 2nd, 3rd pushing-up body. That is, it is only necessary to form a recess on the outer peripheral surface of at least the first push-up body.
If a recessed part is formed in the outer peripheral surface of a 2nd, 3rd push-up body, it will become possible to perform peeling of an adhesive sheet from a semiconductor chip still more favorably by the recessed part.

1 is a schematic configuration diagram of a pickup device showing a first embodiment of the present invention. FIG. Longitudinal section of backup means The top view which shows the upper surface of the 1st thru | or 3rd push-up body of a backup body. (A)-(d) is explanatory drawing which showed sequentially the operation | movement when picking up a semiconductor chip. The top view which shows the upper surface of the 1st thru | or 3rd raising body which comprises the pushing-up means of 2nd Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Backup body, 2 ... Adhesive sheet, 3 ... Semiconductor chip, 4 ... Adsorption nozzle body (pickup means), 31 ... Suction pump, 33 ... Push-up means, 34-36 ... 1st thru | or 3rd push-up body.

Claims (6)

A semiconductor chip pickup device for picking up a rectangular semiconductor chip adhered to an adhesive sheet,
A backup body formed on the suction surface that holds the portion corresponding to the peripheral portion of the semiconductor chip from which the upper surface is picked up by the adhesive sheet;
It has a plurality of push-up bodies provided in the backup body so that they can move relative to each other with the same axis, and at least the upper surface of the push-up body located at the outermost periphery corresponds to the four side portions of the semiconductor chip. A push-up means in which a concave portion having a first convex portion that partially supports the side portion thereof in the portion to be formed and a second convex portion that supports the corner portion in a portion corresponding to the corner portion of the semiconductor chip are formed When,
The plurality of push-up bodies of the push-up means are driven in the ascending direction to press the lower surface of the part to which the semiconductor chip to be picked up of the adhesive sheet is stuck so that the semiconductor chip is attached together with the adhesive sheet to the upper surface of the backup body. Driving means that pushes up from the first chip of the recess to advance the adhesive sheet from the semiconductor chip;
A pick-up device for a semiconductor chip, comprising: pick-up means for picking up the semiconductor chip, which has been pushed up by the driving means and peeled off the pressure-sensitive adhesive sheet, from the pressure-sensitive adhesive sheet.   2. The semiconductor chip pick-up device according to claim 1, wherein the concave portion is provided with a plurality of mountain-shaped first convex portions.   2. The semiconductor chip pick-up device according to claim 1, wherein a second convex portion having a rectangular shape is provided in the middle of the concave portion.   2. The semiconductor chip pick-up device according to claim 1, wherein a suction hole is formed in the recess.   The drive means pushes up a plurality of push-up bodies of the push-up means to the same height, and then pushes up sequentially so that the push-up bodies located inside are pushed higher than the push-up bodies located outside. 2. A pick-up device for a semiconductor chip according to 1. A semiconductor chip pickup method of picking up a rectangular semiconductor chip attached to an adhesive sheet with a pickup tool,
A portion of the pressure-sensitive adhesive sheet that is located around the semiconductor chip picked up by the pickup tool is sucked and held, and a portion corresponding to the lower surface of the semiconductor chip, excluding four side portions, and four side sides A step of supporting only a part of the portion by the lifting means;
Raising the push-up means to push up the semiconductor chip together with the pressure-sensitive adhesive sheet, and peeling the pressure-sensitive adhesive sheet from the part of the side of the semiconductor chip that is separated from the part supported by the push-up means;
If the pressure-sensitive adhesive sheet is peeled off from a portion of the side portion of the semiconductor chip that is not supported by the push-up means, the support area of the semiconductor chip by the push-up means is sequentially reduced to sequentially reduce the semiconductor chip of the pressure-sensitive adhesive tape. A step of proceeding with peeling from,
Picking up the semiconductor chip from which the adhesive tape has been peeled off from the pressure-sensitive adhesive sheet.

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