TWI690038B - Semiconductor wafer pick-up device, semiconductor wafer packaging device - Google Patents

Abstract

The present invention stably peels off the semiconductor wafer from the adhesive sheet. The present invention is a pick-up device for picking up a semiconductor wafer t attached to an adhesive sheet 11 from a semiconductor wafer picked up on the adhesive sheet 11, which includes: a pickup mechanism 40 that picks up the semiconductor wafer t from the adhesive sheet 11; , With a plurality of push-up bodies (62a~62d) arranged so that the axis is the same and arranged movably with each other in the axis direction, so that the negative pressure acts on the picked semiconductor wafer from the side opposite to the semiconductor wafer t t is in the part where the adhesive sheet 11 is located, when the semiconductor wafer t is picked up by the pickup mechanism, the semiconductor wafer t is pushed up by a plurality of push-up bodies (62a to 62d); and the negative pressure adjustment mechanism 63b, the negative The magnitude of the pressure is set to -85 kPa or less with a gauge pressure gauge.

Description

Semiconductor wafer pick-up device, semiconductor wafer packaging Set

The invention relates to a semiconductor wafer pick-up device, a semiconductor wafer packaging device and a packaging method.

Packaging steps for packaging semiconductor chips on substrates such as lead frames, wiring substrates, and interposer substrates are known. In this packaging step, the semiconductor chips are taken out one by one from the wafer ring and transferred to the substrate for packaging. The wafer ring is a ring-shaped member that holds an adhesive sheet to which a semiconductor wafer that is cut into individual semiconductor wafers is singulated. When taking out the semiconductor wafer from the wafer ring, the following pick-up device is used, which is provided with: a pick-up mechanism having a suction nozzle for sucking the semiconductor wafer; and an ejection mechanism, which is sucked on the suction nozzle from the lower surface by using an ejector pin The semiconductor wafer assists in peeling and removing the semiconductor wafer from the adhesive sheet.

However, recent semiconductor wafers are thinned as if their thickness is 50 μm or less. When only the thin semiconductor wafer is pushed up by the tip ejector, the risk of damage such as cracking of the semiconductor wafer increases. Therefore, as shown in Patent Document 1, a pickup device having a plurality of push-up bodies has been developed. The plurality of push-up bodies are arranged concentrically and concentrically, and operate so that the peeling of the adhesive sheet attached to the lower surface of the semiconductor wafer slowly proceeds from the peripheral portion toward the center portion of the semiconductor wafer. The shape of the upper surface of the plurality of push-up bodies is generally formed in the same shape as the semiconductor wafer being picked up, for example, a quadrilateral.

In such a pick-up device, first, a plurality of push-up bodies are simultaneously raised to a predetermined height, and the entire lower surface of the picked-up semiconductor wafer is pushed up. Thereafter, the push-up body located on the outermost side is left, and the other push-up bodies are further raised to a prescribed height. Then, the second push-up body is left and the other push-up bodies are raised. The support of the lower surface of the semiconductor wafer by the push-up body is sequentially opened from the periphery toward the center. Therefore, the adhesive sheet is slowly peeled off from the outer peripheral side of the semiconductor wafer. Furthermore, in order to promote the peeling of the adhesive sheet from the lower surface of the semiconductor wafer, it is proposed to provide a recessed portion on the contact surface (upper surface) of the pusher body with the adhesive sheet, the recessed portion for applying a suction force to the contact Between the surface (upper surface) and the adhesive sheet. The concave portion provided on the push-up body becomes a portion where the adhesive sheet starts to peel off from the semiconductor wafer, which can promote the peeling of the adhesive sheet from the semiconductor wafer. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2010-056466

[Problems to be Solved by the Invention] However, the inventors of the present application have found that even when the pickup device as described above is used, the semiconductor wafer may be damaged. That is, the inventors of the present application confirmed that in a packaging device used for experimental purposes, as a result of a packaging experiment using a plurality of types of semiconductor wafers, there was a semiconductor wafer that was damaged when peeled off from the adhesive sheet and picked up.

The inventors of the present application conducted intensive studies and found that semiconductor wafers with a thickness of approximately 30 μm or less are more likely to be damaged. Therefore, experiments using a plurality of types of semiconductor wafers of 30 μm or less to pick up a predetermined number of semiconductor wafers were performed. As a result, it was found that even with the same type of semiconductor wafer, the frequency of occurrence of breakage may be significantly different in each unit number. Specifically, for a semiconductor wafer with a thickness of 27 μm, in the pick-up experiment conducted before noon on a certain day, the occurrence rate of damage was 92%. In contrast, in the pick-up experiment using the same type of semiconductor wafer before noon the next day, the frequency of occurrence of damage was 4%. In addition, in an experiment conducted on another day, among the predetermined number of units, the damage was concentrated in the first half, and in the latter half, there was a person who hardly saw the damage.

The inventors obtained these results and worked hard to find out the fluctuations in the suction force acting between the push-up body and the adhesive sheet during push-up. That is, the suction force is obtained from the piping equipment for negative pressure supply provided in the laboratory. The negative pressure of this piping equipment varies depending on the use conditions of other experimental devices that use negative pressure together. That is, the inventors of the present application have found that there is a close relationship between the breakage of the semiconductor wafer and the suction force at the time of ejection.

An object of the present invention is to provide a semiconductor wafer pick-up device, a semiconductor wafer packaging device, and a packaging method that can stably peel off a semiconductor wafer from an adhesive sheet.

[Means for Solving the Problems] The semiconductor wafer pickup device of this embodiment is a semiconductor wafer pickup device that picks up and holds a semiconductor wafer attached to an adhesive sheet from the adhesive sheet, and includes a pickup mechanism that picks up from the adhesive sheet The semiconductor wafer; the top-up mechanism has a plurality of push-up bodies that are arranged so that the shaft center becomes the same and move freely in the direction of the shaft center, and from the side opposite to the semiconductor wafer, the negative pressure acts on the The portion of the semiconductor wafer picked up by the pickup mechanism in the adhesive sheet, when the semiconductor wafer is picked up by the pickup mechanism, the semiconductor wafer is pushed up by the plurality of push-up bodies; and the negative pressure The adjustment mechanism sets the magnitude of the negative pressure to -85 kPa or less with a gauge pressure gauge.

The semiconductor wafer packaging apparatus of this embodiment includes: a supply device that holds an adhesive sheet attached to and holds a semiconductor wafer; a substrate platform on which a substrate is placed; and the pickup device that picks up from the adhesive sheet held by the supply device The semiconductor wafer; and a packaging mechanism that packages the semiconductor wafer taken out by the pickup device on the substrate.

The packaging method of the semiconductor wafer of this embodiment is a method of packaging a semiconductor wafer that picks up the semiconductor wafer attached to the adhesive sheet from the adhesive sheet and encapsulates the picked semiconductor wafer on the substrate. When picking up the semiconductor wafer on the adhesive sheet and picking up the semiconductor wafer from the adhesive sheet, a negative pressure is applied to the adhesive sheet from the side opposite to the semiconductor wafer, and by making the axis center the same When a plurality of push-up bodies that are arranged and move freely in the axial direction are pushed up against the semiconductor wafer, the magnitude of the negative pressure is set to -85 kPa or less with a gauge pressure.

[Effect of the Invention] According to the present invention, the semiconductor wafer can be stably peeled off from the adhesive sheet.

Hereinafter, an embodiment of the present invention (hereinafter, referred to as an embodiment) will be specifically described with reference to the drawings. In addition, the position, size, etc. of each component are merely expedient expressions for easy understanding of the structure.

FIG. 1 is a side view showing a schematic configuration of a semiconductor wafer packaging device of an embodiment. The semiconductor wafer packaging device 1 includes: a supply device 10 that supplies a semiconductor wafer t; a substrate platform 20 that mounts a substrate K that encapsulates the semiconductor wafer t; an intermediate platform 30 that is disposed between the supply device 10 and the substrate platform 20 and is mounted The semiconductor wafer t; the pickup mechanism 40, which picks up the semiconductor wafer t one by one from the supply device 10 and transfers it to the intermediate platform 30; the packaging mechanism 50, sucks and holds the semiconductor wafer t mounted on the intermediate platform 30, and packages it At a predetermined position on the substrate K placed on the substrate stage 20; the top-up mechanism 60, which is arranged in the supply device 10, and pushes up the semiconductor wafer t picked up by the pickup mechanism 40; and the control device 70, which controls The supply device 10, the substrate stage 20, the pickup mechanism 40, the packaging mechanism 50, the top-up mechanism 60, and the like. Furthermore, the pickup mechanism 40 and the jacking mechanism 60 are constituent elements of the pickup device.

The supply device 10 has a wafer table 13 that supplies adhesion to a plurality of semiconductor wafers t to which a semiconductor wafer W is cut and singulated by a wafer ring supply device (not shown). Wafer ring 12 holding sheet 11. The wafer stage 13 can be moved in the X direction, the Y direction, and the θ (horizontal rotation) direction by an unillustrated XYθ direction driving device. The X direction and the Y direction are horizontal directions orthogonal to each other. The illustrated Z direction is a direction perpendicular to the horizontal direction.

The substrate platform 20 is supplied with a substrate K before mounting by a substrate loading device (not shown), and the substrate K after packaging the semiconductor wafer t is taken out and carried out by a substrate removal device (not shown). The substrate stage 20 is supported by an unillustrated XYθ direction driving device, and can be moved in the X direction, Y direction, and θ (horizontal rotation) direction.

The intermediate platform 30 is a platform on which the semiconductor wafer t is temporarily placed when the semiconductor wafer t picked up by the pickup mechanism 40 is transferred to the packaging mechanism 50.

The pickup mechanism 40 includes: a suction nozzle 41 that sucks and holds the semiconductor wafer t; and a drive device (not shown) that moves the suction nozzle 41 between the supply device 10 and the intermediate stage 30 as indicated by the broken arrows in FIG. 1. .

The packaging mechanism 50 includes: a packaging tool 51 that sucks and holds the semiconductor wafer t, pressurizes the semiconductor wafer t that is sucked and held (there may be a combination of heating), and packages it at a predetermined position on the substrate K; and driving A device (not shown) moves the packaging tool 51 between the intermediate stage 30 and the substrate stage 20 as indicated by the dotted arrow.

Next, the jacking mechanism 60 will be further described using FIGS. 2 and 3.

The top-up mechanism 60 includes: a support body 61 provided to face the lower surface of the adhesive sheet 11 supported by the wafer table 13; and a push-up mechanism 62 built into the support body 61 and attached to the top of the adhesive sheet 11 Semiconductor wafer t.

The support 61 is fixedly arranged against the position where the suction nozzle 41 picks up the semiconductor wafer t. The support body 61 is formed into a hollow cylindrical shape in which the upper and lower surfaces are blocked, and the upper surface thereof is set as a support surface 61 a that sucks and supports the adhesive sheet 11 from the lower side. In addition, the hollow portion of the support 61 becomes an internal space 61b.

The support surface 61a is provided with a ring-shaped suction groove 61c and a plurality of suction holes 61d for sucking the adhesive sheet 11 around the picked-up semiconductor wafer t. The suction groove 61c and the plurality of suction holes 61d communicate with the internal space 61b of the support 61 via the communication groove 61e or a communication hole (not shown). That is, the vacuum piping 63a communicating with the suction pump 63 is connected to the internal space 61b of the support 61, and a negative pressure can be supplied into the internal space 61b. By making the internal space 61b a negative pressure, the negative pressure can be applied to the suction groove 61c and the plurality of suction holes 61d. In addition, a pressure control device 63b such as an electropneumatic regulator and an on-off valve 63c such as an electromagnetic valve are provided in order from the suction pump 63 side on the vacuum piping 63a to control the action on the suction tank 61c and a plurality of suctions The opening and closing of the negative pressure in the hole 61d and the magnitude of the negative pressure. The pressure control device 63b functions as a negative pressure adjustment mechanism. The pressure control device 63b is preferably set in such a manner that a negative pressure of -85 kPa or less, preferably -90 kPa or less, acts on the suction groove 61c and the plurality of suction holes 61d with a gauge pressure. In this embodiment, an example of -90 kPa will be described. Here, the gauge pressure refers to a relative pressure based on atmospheric pressure (0 kPa). Therefore, a gauge pressure of -85 kPa or less means a pressure that includes a pressure 85 kPa lower than atmospheric pressure and a vacuum degree higher than this pressure (-85 kPa). That is, -90 kPa is a pressure with a vacuum degree higher than -85 kPa. In addition, expressions such as "negative pressure of -85 kPa or less" and "setting the magnitude of negative pressure to -85 kPa" are sometimes used, but all refer to the pressure value by a gauge pressure.

Furthermore, it can be considered that the pressure set in the pressure control device 63b directly acts on the internal space 61b, the suction groove 61c, and the suction hole 61d. Therefore, in this embodiment, the pressure detector 63d is provided in the portion between the on-off valve 63c and the internal space 61b in the vacuum piping 63a. Then, the control pressure of the pressure control device 63b is set so that the detection value of the pressure detector 63d becomes -90 kPa. Furthermore, the pressure acting on the internal space 61b, or the suction groove 61c or the plurality of suction holes 61d may be detected, and the control pressure of the pressure control device 63b may be set so that the detected value becomes the pressure range. In addition, the suction pump 63 may be assembled into the packaging device 1 as a component, but it is not limited to this, and may be prepared separately from the packaging device 1, for example, may be used in a factory, etc. Equipped with piping equipment for negative pressure supply. In short, as long as it is a negative pressure source that can stably supply negative pressure of -85 kPa or less with a gauge pressure to the pressure control device 63b.

The push-up mechanism 62 includes: the first push-up body to the fourth push-up body (62a, 62b, 62c, 62d); and the first lift-up driving device to the fourth lift-up driving device (62e, 62f, 62g, 62h), corresponding to The first push-up body 62a to the fourth push-up body 62d are provided, and the first push-up body 62a to the fourth push-up body 62d are individually moved up and down.

Among the first push-up body 62a to the fourth push-up body 62d, the first push-up body 62a to the third push-up body 62c are formed in a rectangular angular cylindrical shape in a plan view, and have a triple structure in which the axes are the same. The fourth push-up body 62d is formed in the shape of a prism, so that its axis is the same as that of the first push-up body 62a to the third push-up body 62c, and is arranged at the center of the push-up bodies. Furthermore, in this embodiment, four push-up bodies (62a to 62d) are provided, but it is not limited to these four, and may be two, three, or more than five.

The first push-up body 62a is the push-out body located on the outermost side, and is provided in the rectangular opening 61f provided on the upper surface of the support 61, that is, in the center of the support surface 61a, and between the edge of the opening 61f Gap to configure. That is, the shape of the opening 61f is similar to the outer shape of the first push-up body 62a, and is formed slightly larger than the outer shape of the first push-up body 62a. Further, in a plan view, the shape of the front end surface of the first push-up body 62a is similar to the semiconductor wafer t to be pushed up, and is formed to have a slightly smaller size than the semiconductor wafer t. Therefore, when the semiconductor wafer t is pushed up, the edge of the semiconductor wafer t is slightly exposed from the periphery of the first push-up body 62a.

The second push-up body 62b is arranged inside the first push-up body 62a while being guided to the inner side surface of the first push-up body 62a. The third push-up body 62c is arranged inside the second push-up body 62b in a state of being guided to the inner surface of the second push-up body 62b. The fourth push-up body 62d is arranged inside the third push-up body 62c while being guided to the inner side surface of the third push-up body 62c.

The push-up bodies 62a to 62d are moved up and down by the first lift drive device 62e to the fourth lift drive device 62h in accordance with the operating conditions set in advance. In this embodiment, initially, all the push-up bodies (62a to 62d) are raised from the height of the support surface 61a to a height that protrudes by a predetermined amount. Thereafter, in order from the outside, that is, in order of the first push-up body, the second push-up body, the third push-up body, and the fourth push-up body, they are sequentially lowered to below the height of the support surface 61a, Set the operating conditions. In addition, the operation condition may be set to correspond to the operation of the semiconductor wafer t to be picked up, the type of the adhesive sheet 11 to which the semiconductor wafer t is attached, and the like.

In addition, as shown in FIG. 4(A), convex portions 64, convex portions 65, and concave portions 66 are respectively provided at the upper end portions of the first push-up body 62 a to the third push-up body 62 c. In addition, in FIGS. 4(A) and 4(B), a diagonal line is added to the formation position of the concave portion 66 to make the difference from the convex portion 64 and the convex portion 65 clear. Convex portions 64A are formed at the four corners of the upper end surface of the first push-up body 62a that form a rectangular frame shape, respectively. In addition, a plurality of convex portions 65A are provided on the four side portions of the rectangular frame-like upper end surface of the first push-up body 62a at substantially equal intervals. Further, recesses 66A are provided between the convex portions 64A and the convex portions 65A and between the convex portions 65A. Convex portions 64B are formed on the four corners of the rectangular frame-like upper end surface of the second push-up body 62b, respectively. In addition, a plurality of convex portions 65B are provided at substantially equal intervals on the four side portions of the rectangular frame-like upper end surface of the second push-up body 62b. Moreover, the concave portion 66B is provided between the convex portion 64B and the convex portion 65B and between the convex portion 64B. In addition, the arrangement of the convex portions 65B and the concave portions 66B of the second push-up body 62b has a different relationship from the arrangement of the convex portions 65A and the concave portions 66A of the first push-up body 62a. A convex portion 64C, a convex portion 65C, and a concave portion 66C are also formed on the rectangular frame-shaped upper end surface of the third push-up body 62c, similar to the first push-up body 62a and the second push-up body 62b. The arrangement of the convex portions 65C and the concave portions 66C of the third push-up body 62c has a different relationship from the arrangement of the convex portions 65B and the concave portions 66B of the second push-up body 62b. The upper surfaces of the convex portions 64A to 64C, the convex portions 65A to 65C, and the upper surface of the fourth push-up body 62d are formed so as to support the adhesive sheet 11 on the same plane as the support surface 61a. Further, the plane accuracy formed by the upper surface of the convex portion 64A to the convex portion 64C, the convex portion 65A to the convex portion 65C, and the upper surface of the fourth push-up body 62d becomes 20 μm or less.

In addition, each convex portion (65A to 65C) provided in the side portion is preferably formed such that the length in the direction of the side portion becomes 0.4 mm or more and 2.0 mm or less. In addition, the length of each concave portion (66A to 66C) in the direction along the side portion may be the same as or different from the length of the convex portion 65A to the convex portion 65C, but it is preferably the same as that of the convex portion 65A to the convex portion 65C Similarly, it is formed so that the length along the direction of the side portion becomes 0.4 mm or more and 2.0 mm or less. In addition, the adjacent recesses 66A and 66B and the recesses 66B and 66C may be arranged to partially overlap, but the length of the overlapping portion is preferably set to the recesses 66A to 66C in the direction along the side edges. Less than 20% of the length. Therefore, the lengths of the concave portions 66A to 66C are preferably formed such that the lengths of the convex portions 65A to 65C become 0.8 times or more and 1.2 times or less.

Furthermore, in a state where the first push-up body 62a to the fourth push-up body 62d supports the adhesive sheet 11 together with the support 61, a negative pressure can be applied to the first push-up body 62a to the fourth push-up body 62d Between the end surface and the adhesive sheet 11. That is, the opening 61f of the support 61 communicates with the internal space 61b, and there is a gap between the first pusher 62a and the edge of the opening 61f. In addition, there is also a gap between the push-up bodies 62a to 62d. Therefore, the negative pressure in the internal space 61 b passes through these gaps and acts between the upper end surfaces of the first pusher 62 a to the fourth pusher 62 d and the adhesive sheet 11. That is, the negative pressure set in the pressure range, specifically, the negative pressure of -90 kPa acts between the jacking mechanism 60 and the adhesive sheet 11.

The control device 70 includes a storage unit 71. The storage unit 71 stores data necessary for the operation of the packaging device 1 such as the operating conditions of the push-up bodies 62 a to 62 d. The control device 70 refers to the data stored in the storage unit 71 and controls the supply device 10, the substrate stage 20, the pickup mechanism 40, the packaging mechanism 50, the top-up mechanism 60, and the like. (Description of Operation) Next, the operations of the packaging device 1 and the pickup device will be described using FIGS. 1 and 5(A) to 7(B).

First, the wafer ring 12 with a plurality of semiconductor chips t attached to the adhesive sheet 11 is placed on the wafer table 13 of the supply device 10. In addition, the substrate K before packaging is placed on the substrate stage 20 by a substrate loading device (not shown).

In this state, the suction nozzle 41 of the pickup mechanism 40 picks up the semiconductor wafer t positioned on the pickup position on the supply device 10 and transfers it to the intermediate stage 30. The packaging tool 51 of the packaging mechanism 50 receives the semiconductor wafer t transferred onto the intermediate platform 30 and packages it at a predetermined packaging position of the substrate K placed on the substrate platform 20. Repeating this operation, the semiconductor wafer t is sequentially packaged at each package position of the substrate K.

Furthermore, during pickup by the pickup device, that is, when the suction nozzle 41 picks up the semiconductor wafer t, the jacking mechanism 60 operates as follows.

As shown in FIG. 5(A), if the semiconductor wafer t to be picked is positioned directly above the lifting mechanism 60, that is, at the pickup position, the lifting device 60 supports the lower surface of the adhesive sheet 11 by the support surface 61a . Then, by opening the on-off valve 63c, a predetermined negative pressure (a negative pressure of -90 kPa) acts on the suction groove 61c and the suction hole 61d to attract and hold the adhesive sheet 11.

When the support surface 61a sucks and holds the adhesive sheet 11, as shown in FIG. 5(B), the suction nozzle 41 is lowered to abut on the semiconductor wafer t, and the semiconductor wafer t is sucked and held.

When the suction nozzle 41 sucks the semiconductor wafer t, as shown in FIG. 5(C), the first push-up body 62a to the fourth push-up body 62d are raised by a predetermined height. At this time, the suction nozzle 41 rises synchronously. As a result, the adhesive sheet 11 is pushed up by the first push-up body 62a to the fourth push-up body 62d into a convex shape. At this time, a negative pressure of -90 kPa acts between the adhesive sheet 11 and the support surface 61a and the upper end surfaces of the first push-up body 62a to the fourth push-up body 62d. Therefore, the force pulled down by the negative pressure acts on the portion 11a of the adhesive sheet 11 which is inclined upward by being pushed upward by the first push-up body 62a to the fourth push-up body 62d. By this, the outer edge portion of the semiconductor wafer t, more specifically, the outer edge portion exposed from the first push-up body 62a in the semiconductor wafer t, the force to be peeled off the semiconductor wafer t acts on the adhesive sheet 11 on. Thereby, the adhesive sheet 11 is peeled from the outer edge portion of the semiconductor wafer t. Furthermore, since the amount of exposure of the semiconductor wafer t is small at this time, even if the peeling of the adhesive sheet t starts over the entire area of each side of the semiconductor wafer t, damage to the semiconductor wafer t will not occur.

At this time, the negative pressure of -90 kPa also acts on the recess 66A of the first push-up body 62a. Therefore, the portion of the edge of the semiconductor wafer t facing the recess 66A promotes the peeling of the adhesive sheet 11 from the semiconductor wafer t by the negative pressure acting on the adhesive sheet 11 more than other edges. 4(B) is a plan view schematically showing a state where the peeling of the adhesive sheet 11 has proceeded in the concave portion 66, and a roughly crescent shape (shown by diagonal lines) as shown by the symbol P in the figure is generated in the concave portion 66. The blank portion in the concave portion 66) is a peeling portion. In addition, in FIG. 4(B), peeling portions P are shown in all the concave portions (66A, 66B, 66C), but at this stage, peeling is likely to occur only in the portion of the concave portion 66A of the first push-up body 62a Department P. In addition, the peeling portion P expands so as to extend toward the second push-up body 62b by the action of negative pressure during the period before the second push-up body 62b described later starts to fall.

After a predetermined waiting time has elapsed since the first push-up body 62 a to the fourth push-up body 62 d have risen, as shown in FIG. 6(A), the first push-up body 62 a is lowered. The first push-up body 62a is lowered to a position where the upper end surface of the first push-up body 62a is lower than the support surface 61a by a predetermined height. As a result, the first push-up body 62a is separated from the semiconductor wafer t. By the first push-up body 62a descending, in the direction of being pulled down by its own tension and negative pressure, that is, in the direction of peeling off from the semiconductor wafer t, the force acts on the adhesive sheet 11 so far from the first On the portion supported by the push body 62a. With this force, the adhesive sheet 11 is peeled toward the center of the semiconductor wafer t. The state shown in FIG. 6(A) is a state where the adhesive sheet 11 supported by the first push-up body 62a has been peeled off the semiconductor wafer t. In addition, at this time, the negative pressure also acts on the concave portion 66B of the second push-up body 62b, so the adhesive sheet 11 is peeled off at the portion facing the concave portion 66B. Thereby, as shown in FIG. 4(B), a peeling portion P occurs in a portion corresponding to the recess 66B of the second push-up body 62b.

Furthermore, after a predetermined standby time has passed, as shown in FIG. 6(B), the second push-up body 62b is lowered to the position of the first push-up body 62a. At this time, in the same manner as when the first push-up body 62a is lowered, the portion of the adhesive sheet 11 supported by the second push-up body 62b is also peeled off. In addition, as shown in FIG. 6(B), the adhesive sheet 11 is peeled off at a portion facing the concave portion 66C of the third push-up body 62 c, and a peeling portion P is generated. In addition, after a predetermined waiting time has passed, as shown in FIG. 6(C), the third push-up body 62c is lowered to the positions of the first push-up body 62a and the second push-up body 62b. At this time, as in the case where the first push-up body 62a and the second push-up body 62b are lowered, the portion of the adhesive sheet 11 supported by the third push-up body 62c is also peeled off.

After a predetermined waiting time has elapsed since the third push-up body 62c is lowered, as shown in FIG. 7(A), the fourth push-up body 62d is lowered to the position of the first push-up body 62a to the third push-up body 62c . With this, the portion of the adhesive sheet 11 supported by the fourth push-up body 62d is peeled off. The state shown in FIG. 7(A) shows the progress of the peeling.

Furthermore, the standby time before lowering each push-up body (62a-62d) may be set to the same time, or an individual time may be set. However, setting the standby time longer will result in a decrease in productivity, so it is appropriate to set it in consideration of productivity. That is, in the packaging device 1 used in the packaging step of the semiconductor wafer t, the unit capacity per unit (UPH) indicating the number of semiconductor wafers t that can be packaged per hour is an important factor affecting productivity. Therefore, in order to improve productivity, it is preferable that the value of UPH is high. In order to increase this value, the semiconductor wafers t must be packaged one by one in a very short time. At this time, it is impossible to shorten the time for the semiconductor wafer t to be pressure-bonded (sometimes combined with heating) on the substrate K, that is, the so-called bonding time. Therefore, it is required to incorporate the time required for the transfer of the semiconductor wafer t performed in parallel with the pressure bonding of the semiconductor wafer t into the bonding time. In addition, the time required for the transfer refers to the time from when the suction nozzle 41 is located directly above the pickup position to when the semiconductor wafer t positioned at the pickup position is lowered, the semiconductor wafer t is picked up, transferred, and placed on the intermediate platform 30 The time required.

Therefore, it is required to set the standby time under the condition that the time required for the transfer becomes within the engagement time. For example, when the bonding time is 1.2 seconds, the time until the suction nozzle 41 directly above the pickup position descends to the semiconductor wafer t and the time until the semiconductor wafer t picked up by the suction nozzle 41 is transferred and placed on the intermediate stage 30 When the total is 0.5 seconds, the time available for the push-up mechanism 62 to lift the semiconductor wafer t becomes less than 1.2 seconds-0.5 seconds = 0.7 seconds. In this case, the standby time must be set to less than about 0.1 second to 0.3 second. That is, the standby time is within a range where the settable range is limited to an extremely short time due to the bonding time, and the pickup device is required to peel off the adhesive sheet 11 from the semiconductor wafer t within the short time.

As in the present embodiment, the negative pressure set in the pressure range acts between the jacking mechanism 60 and the adhesive sheet 11, so that even if the standby time is set to a short time of less than about 0.1 seconds to 0.3 seconds, During this period, it is also possible to sufficiently exert the force that can peel only the portion of the push-up body 62a to the push-up body 62c from the semiconductor wafer t that supports the released adhesive sheet 11.

Furthermore, after a predetermined waiting time has elapsed since the fourth pusher 62d descended, as shown in FIG. 7(B), the suction nozzle 41 is raised to pick up the semiconductor wafer t. In addition, the on-off valve 63c is closed to stop the negative pressure, and the first to fourth pushers 62a to 62d rise to the original height, that is, the height at which the upper end coincides with the support surface 61a. (Functions and effects) According to the packaging device 1 of this embodiment, the pickup device including the pickup mechanism 40 and the ejection mechanism 60 is provided. When the suction nozzle 41 of the pickup mechanism 40 picks up the semiconductor wafer t from the adhesive sheet 11 At this time, the push-up mechanism 62 of the push-up mechanism 60 is used to push up the picked-up semiconductor wafer t from the lower side of the adhesive sheet 11. During this jacking, the magnitude of the negative pressure acting between the jacking mechanism 60 and the adhesive sheet 11 is set to -85 kPa or less with a gauge pressure. The negative pressure acting between the jacking mechanism 60 and the adhesive sheet 11 specifically refers to the suction groove 61c and the suction hole 61d acting on the support 61, and the push-up bodies (62a to 62d) and Between the adhesive sheets 11, the negative pressure in the recesses 66A to 66C of the push-up bodies 62a to 62d.

By making this negative pressure work, when the semiconductor wafer t is lifted from below the adhesive sheet 11 by the push-up mechanism 62, the area of the semiconductor wafer t supported by the plurality of push-up bodies (62a to 62d) can be stepwise When the ground area decreases, the adhesive sheet is peeled from the semiconductor wafer t following the decrease in the supporting area.

In addition, since the pressure range of the set negative pressure is -85 kPa or less, even if one of the plurality of push-up bodies (62a to 62d) is separated from the semiconductor wafer t until the next push-up body is separated The time (the standby time) is a short time of less than about 0.1 second to 0.3 second. During this period, the adhesive sheet 11 from which the support of the push-up bodies 62a to 62c is released can be peeled from the semiconductor wafer t section. Therefore, even a semiconductor wafer with a thickness of 30 μm or less can be quickly peeled off from the adhesive sheet 11 to prevent damage to productivity.

In addition, convex portions 64, convex portions 65, and concave portions 66 are alternately formed on the upper end portions of the first push-up body 62a to the third push-up body 62c. With this, the negative pressure set in the pressure range (negative pressure of −85 kPa or less) acts on the adhesive sheet 11 facing the concave portion 66 provided between the convex portion 64 and the convex portion 65 and between the convex portions 65. On the site. Therefore, in the portion of the adhesive sheet 11 corresponding to the recess 66, the adhesive sheet 11 can be peeled off the semiconductor wafer t without waiting for the push-up bodies 62a to 62c to fall (separation from the semiconductor wafer t). As a result, when the push-up bodies 62a to 62c are lowered, peeling of the adhesive sheet 11 from the semiconductor wafer t can be performed more quickly. Then, when the push-up bodies 62a to 62c have started to descend, peeling off from the semiconductor wafer t occurs at the portion of the adhesive sheet 11 corresponding to the recess 66 of the push-up bodies 62a to 62c. Therefore, the peeling of the adhesive sheet 11 of the portion supported by the push-up body 62a to the push-up body 62c is performed in two steps, so it is the same as the case where the peeling of the part starts only after the push-up body 62a to the push-up body 62c are lowered In comparison, the stress acting on the semiconductor wafer t can be reduced particularly. Therefore, even a thin semiconductor wafer t that is prone to breakage, such as a semiconductor wafer t with a thickness of 30 μm or less, can be picked up satisfactorily. Furthermore, when the portion of the adhesive sheet 11 corresponding to the concave portion 66 is peeled from the semiconductor wafer t, the convex portion 64 and the convex portion 65 are separated from both sides of the concave portion 66 (both sides along the direction of the side of the semiconductor wafer t) ) The semiconductor wafer t is supported on three sides with the center side. Therefore, even if the force in the direction of peeling off from the semiconductor wafer t acts on the adhesive sheet 11, compared with the case where the force acts on the adhesive sheet 11 in the state where the support of the entire peripheral portion of the semiconductor wafer t is released In addition, the stress generated in the semiconductor wafer t can be particularly reduced.

In addition, the length of the concave portion 66 provided in the upper end portions of the rectangular first push-up body 62a to the third push-up body 62c in the circumferential direction, that is, the length in the direction along the side portion becomes 0.4 mm or more, 2.0 mm or less. When the length of the concave portion 66 is shorter than 0.4 mm, even if a negative pressure of -85 kPa or less is applied to the concave portion 66, the area where the negative pressure acts on the adhesive sheet 11 becomes too small, and it is difficult to form a good peeling Department P. On the other hand, when the length of the concave portion 66 is longer than 2.0 mm, the area where the negative pressure acts in the adhesive sheet 11 becomes too large, and excessive stress is applied to the semiconductor wafer t when the peeling portion P is formed. Risk of damage. By setting the length of the recess 66 to 0.4 mm or more and 2.0 mm or less, the supportability of the semiconductor wafer t can be ensured, and the peelability of the adhesive sheet 11 can be ensured. As a result, the stress applied to the semiconductor wafer t can be suppressed to form the peeling portion P satisfactorily, and the semiconductor wafer t can be peeled off from the adhesive sheet 11 quickly and satisfactorily.

In addition, the length of the concave portion 66 provided in the upper end of the first pusher 62a to the third pusher 62c of the quadrangle along the circumferential direction, that is, the length in the direction along the side portion is relative to the convex portion 65 The length in the direction of the side portion is set to 0.8 times or more and 1.2 times or less. When it is smaller than 0.8 times, the ratio of the area where the peeling portion P is formed decreases with respect to the length of the side portion of each push-up body (62a to 62c). Therefore, when the adhesive sheet 11 is peeled by the lowering of the push-up body 62a, the push-up body 62b, and the push-up body 62c thereafter, the peeling portion P, which becomes the starting point of the peeling, is small, and the probability of delaying the peeling increases. Conversely, when it is larger than 1.2 times, the ratio of the area supported by the convex portion 64 and the convex portion 65 decreases with respect to the length of the side portions of the push-up bodies (62a to 62c). Therefore, when the peeling portion P is formed, the stress applied to the semiconductor wafer t becomes large, and the probability of breakage of the semiconductor wafer t becomes high. In addition, by forming the concave portion 66A, the concave portion 66B, and the concave portion 66C with each other in a different positional relationship, the peeling portion P is prevented from being continuously formed up to the center of the semiconductor wafer t, and the stress applied to the semiconductor wafer t is reduced. However, if the length of the concave portion 66 exceeds 1.2 times, the peeling portion P tends to spread to the center of the semiconductor wafer t along the adjacent concave portion 66A, concave portion 66B, concave portion 66B, and concave portion 66C. As a result, the effect of suppressing damage caused by mutually forming the concave portion 66A, the concave portion 66B, and the concave portion 66C decreases. Therefore, it is preferable to set the concave portion 66 to a length of 0.8 times or more and 1.2 times or less of the convex portion 65.

(Other Embodiments) Furthermore, the present invention is not limited to the above embodiments. For example, in the above-mentioned package form, the operations of the first push-up body 62a to the fourth push-up body 62d of the jack-up mechanism 60 are set to raise the first push-up body 62a to the fourth push-up body 62d together. The example of descending sequentially from the first push-up body 62a located on the outer side is not limited to this. For example, the first push-up body 62a to the fourth push-up body 62d can be lifted so that the push-up body located inside becomes higher. That is, after the first push-up body 62a to the fourth push-up body 62d are raised together only by a predetermined height, the second push-up body 62b to the fourth push-up body 62d may be further raised by a predetermined height, and then the third push-up body 62d The pusher 62c to the fourth pusher 62d are further raised by a predetermined height, and finally the fourth pusher 62d is further raised by a predetermined height. In short, it suffices to operate so that the plurality of push-up bodies (62a to 62d) are sequentially separated from the semiconductor wafer t.

In addition, in the above embodiment, the example of the substrate stage 20 in which the substrate K is moved in the XYθ direction has been described as the substrate stage, but it is not limited to this. For example, it may be configured such that a pair of guide rails are arranged in a direction crossing the arrangement direction of the supply device 10 and the intermediate stage 30, and the substrate K is transported and positioned to the packaging operation position of the packaging mechanism 50 on the guide rails. That is, the substrate K is carried into the packaging operation position of the packaging mechanism 50 and positioned at the packaging operation position, and the conveying part carried out from the packaging operation position is also included in the substrate platform.

(Examples and Comparative Examples) Next, examples and evaluation results of the present invention will be described.

Using the packaging device 1 of the above embodiment, a pickup test was performed under the following conditions. Furthermore, the semiconductor wafer t picked up by the pickup mechanism 40 is placed on the test glass substrate placed on the substrate stage 20 by the packaging mechanism 50. First, an adhesive film is adhered to the glass substrate, so that the arranged semiconductor wafer t does not move during the movement of the substrate platform 20. As the jacking mechanism, the jacking mechanism 60 shown in FIG. 3 is used, and jacking is performed by the operations shown in FIGS. 5(A) to 7(B).

Fifty semiconductor wafers t were picked from a wafer with a diameter of 300 mm, and the number of semiconductor wafers t that had broken during picking was measured. Specifically, before picking, it was confirmed that there were no cracks in the 50 semiconductor wafers t to be picked up, and several of the 50 semiconductor wafers t arranged on the glass substrate were cracked. The number of cracked semiconductor wafers t that occurred during pickup.

<Test conditions> ・Semiconductor wafer size: 3×4 mm ・Semiconductor wafer thickness: three types: 35 μm, 25 μm, and 15 μm ・The size of the negative pressure acting between the jacking mechanism 60 and the adhesive sheet 11:- Five conditions: 90 kPa, -88 kPa, -85 kPa, -83 kPa, and -80 kPa. Top-up amount: 1 mm ※The top-up amount is the first push-up body 62a shown in Figure 5(C) ~ The amount by which the fourth pusher 62d rises.・Standby time: 0.2 seconds

(Example 1) The negative pressure in the test conditions was set to -90 kPa, and a pick-up test was performed using a semiconductor wafer t with a thickness of 35 μm. The results are shown in Table 1. (Example 2) The negative pressure in the test conditions was set to -90 kPa, and a pickup test was performed using a semiconductor wafer t with a thickness of 25 μm. The results are shown in Table 1. (Example 3) The negative pressure in the test conditions was set to -90 kPa, and a pick-up test was performed using a semiconductor wafer t with a thickness of 15 μm. The results are shown in Table 1. (Example 4) The magnitude of the negative pressure in the test conditions was set to -88 kPa, and a pick-up test was performed using a semiconductor wafer t with a thickness of 35 μm. The results are shown in Table 1. (Example 5) The negative pressure in the test conditions was set to -88 kPa, and a pickup test was performed using a semiconductor wafer t with a thickness of 25 μm. The results are shown in Table 1. (Example 6) The negative pressure in the test conditions was set to -88 kPa, and a semiconductor wafer t with a thickness of 15 μm was used to perform a pickup test. The results are shown in Table 1. (Example 7) The magnitude of the negative pressure in the test conditions was set to -85 kPa, and a pickup test was performed using a semiconductor wafer t with a thickness of 35 μm. The results are shown in Table 1. (Example 8) The negative pressure in the test conditions was set to -85 kPa, and a pickup test was performed using a semiconductor wafer t with a thickness of 25 μm. The results are shown in Table 1. (Example 9) The negative pressure in the test conditions was set to -85 kPa, and a pick-up test was performed using a semiconductor wafer t with a thickness of 15 μm. The results are shown in Table 1.

(Comparative Example 1) The magnitude of the negative pressure in the test conditions was set to -83 kPa, and a pickup test was performed using a semiconductor wafer t with a thickness of 35 μm. The results are shown in Table 1. (Comparative Example 2) The magnitude of the negative pressure in the test conditions was set to -83 kPa, and a pickup test was performed using a semiconductor wafer t with a thickness of 25 μm. The results are shown in Table 1. (Comparative Example 3) The negative pressure in the test conditions was set to -83 kPa, and a pickup test was performed using a semiconductor wafer t with a thickness of 15 μm. The results are shown in Table 1. (Comparative Example 4) The magnitude of the negative pressure in the test conditions was set to -80 kPa, and a pickup test was performed using a semiconductor wafer t with a thickness of 35 μm. The results are shown in Table 1. (Comparative Example 5) The negative pressure in the test conditions was set to -80 kPa, and a pickup test was performed using a semiconductor wafer t with a thickness of 25 μm. The results are shown in Table 1. (Comparative Example 6) The magnitude of the negative pressure in the test conditions was set to -80 kPa, and a pickup test was performed using a semiconductor wafer t with a thickness of 15 μm. The results are shown in Table 1.

[Table 1]

The embodiments, examples, and comparative examples of the present invention have been described above, but these embodiments, examples, and comparative examples are not intended to limit the scope of the invention. The new embodiment can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments or modifications are included in the scope or gist of the invention, and included in the invention described in the scope of the patent application.

1‧‧‧Packaging device 10‧‧‧Supply device 11‧‧‧ Adhesive sheet 11a‧‧‧Slanted part 12‧‧‧ Wafer ring 13‧‧‧ Wafer table 20‧‧‧Substrate platform 30‧‧‧ Middle Platform 40 ‧ ‧ ‧ picking mechanism 41 ‧ ‧ ‧ suction nozzle 50 ‧ ‧ ‧ packaging mechanism 51 ‧ ‧ ‧ packaging tool 60 ‧ ‧ ‧ lifting mechanism / lifting device 61 ‧ ‧ ‧ support 61a ‧ ‧ ‧ support surface 61b ‧ ‧‧Internal space 61c‧‧‧Suction groove 61d‧‧‧Suction hole 61e‧‧‧Communication groove 61f‧‧‧Opening part 62‧‧‧Push mechanism 62a‧‧‧First push body 62b‧‧‧‧ 2nd pusher 62c‧‧‧3rd pusher 62d‧‧‧4th pusher 62e‧‧‧lift drive 62f‧‧‧lift drive 62g‧‧‧lift drive 62h‧‧‧lift drive Device 63‧‧‧Suction pump 63a‧‧‧Vacuum piping 63b‧Pressure control device (negative pressure adjustment mechanism) 63c‧‧‧Switch valve 63d‧‧‧Pressure detector 64, 64A, 64B, 64C‧‧‧ Convex part 65, 65A, 65B, 65C‧‧‧Convex part 66, 66A, 66B, 66C‧‧‧Concave part 70‧‧‧Control device 71‧‧‧Storage part P‧‧‧Peeling part K‧‧‧T ‧‧Semiconductor chip W‧‧‧wafer X, Y, Z, θ‧‧‧ direction

FIG. 1 is a side view showing a schematic configuration of a semiconductor wafer packaging device of an embodiment. FIG. 2 is a perspective view showing the jacking mechanism of the semiconductor wafer pick-up device of the embodiment. 3 is a schematic cross-sectional view showing the jacking mechanism shown in FIG. 2. 4(A) and 4(B) are plan views showing the push-up body of the push-up mechanism shown in FIG. 3. 5(A) to 5(C) are cross-sectional views showing the operation of the pickup device of the embodiment. 6(A) to 6(C) are cross-sectional views showing the operation of the pickup device of the embodiment. 7(A) and 7(B) are cross-sectional views showing the operation of the pickup device of the embodiment.

11: Adhesive sheet

60: jacking mechanism

61: Support

61a: bearing surface

61b: interior space

61f‧‧‧Opening

62‧‧‧Pushing mechanism

62a‧‧‧First push

62b‧‧‧2th push-up body

62c‧‧‧3rd pusher

62d‧‧‧4th push-up body

62e‧‧‧Elevating drive device

62f‧‧‧Elevating drive device

62g‧‧‧Elevating drive device

62h‧‧‧Elevating drive device

63‧‧‧Suction pump

63a‧‧‧Vacuum piping

63b‧‧‧Pressure control device (negative pressure adjustment mechanism)

63c‧‧‧ On-off valve

63d‧‧‧pressure detector

t‧‧‧Semiconductor chip

Claims (6)

A pick-up device for semiconductor wafers is a pick-up device for picking up a semiconductor wafer attached to an adhesive sheet from the adhesive sheet, characterized in that it includes a pick-up mechanism to pick up the semiconductor wafer from the adhesive sheet; The jack-up mechanism has a plurality of push-up bodies that are arranged so that the shaft center is the same and are movably arranged in the shaft center direction, and the negative pressure acts on the pickup mechanism from the side opposite to the semiconductor wafer The portion of the semiconductor wafer picked up in the adhesive sheet, when the semiconductor wafer is picked up by the picking mechanism, the semiconductor wafer is pushed up by the plurality of push-up bodies; a negative pressure source, Negative pressure with a gauge pressure of -85 kPa or less is stably supplied to the jacking mechanism; a pressure detector detects the magnitude of the negative pressure supplied from the negative pressure source to the jacking mechanism; and a negative pressure adjustment mechanism, The detection value of the pressure detector is set to a predetermined pressure of -85 kPa or less with a gauge pressure gauge. The semiconductor wafer pick-up device according to item 1 of the patent application range, wherein the plurality of push-up bodies have a prismatic push-up body arranged in the center, and the axis and the prismatic push-up body become At least one angular tube-shaped push-up body configured in the same way. A semiconductor wafer pick-up device as described in item 2 of the patent application range, wherein a plurality of angular cylinder-shaped push-up bodies are provided, and the axis centers become the same Multiple configurations. The semiconductor wafer pick-up device according to claim 2 or claim 3, wherein the angular cylindrical push-up body is formed by alternately providing convex portions and concave portions at the upper end portion thereof along the circumferential direction. The pickup device for a semiconductor wafer according to item 4 of the patent application range, wherein the length of the concave portion in the circumferential direction is set to 0.8 times the length of the convex portion in the circumferential direction Above and below 1.2 times. A semiconductor wafer packaging device, characterized in that it includes a supply device that holds an adhesive sheet attached to and holds a semiconductor wafer; a substrate platform on which a substrate is placed; a pickup device that picks up the adhesive sheet held by the supply device The semiconductor wafer; and a packaging mechanism that packages the semiconductor wafer taken out by the pickup device on the substrate; and the pickup device is as described in any one of claims 1 to 5 Picking device.

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