JP2019028223A - 露光装置及び物品製造方法 - Google Patents
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
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- G—PHYSICS
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
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- G—PHYSICS
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
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- G03F7/70725—Stages control
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
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Abstract
Description
図1に露光装置100の概略図を示す。光源101からリレーレンズ108の間を構成するユニットを照明光学系120と定義する。光源101は、超高圧水銀ランプ等から成っている。楕円ミラー102は光源101からの光を集光する。楕円ミラー102の第1焦点付近に光源101が配置されている。楕円ミラー102で反射された光は、リレー光学系103に導かれる。リレー光学系103を透過した光はオプティカルインテグレータ104を透過して多数の2次光源が形成される。そして、開口絞り105により、光束断面が所望の光強度形状に成形される。開口絞り105は被照射面とフーリエ変換になる面にあるため、開口絞り105の形状は被照射面の角度分布を決定する。そして、所望の角度分布を持った光はコンデンサレンズ106を介して、視野絞り107をほぼ均一に照射する。視野絞り107で所望の形状の照明領域に形成された光は、リレーレンズ108を介して、被照射面であるマスク(レチクル)109を照明する。
図10は、本実施形態における露光装置の概略図である。第1実施形態の構成と同じ構成については説明を省略する。
露光装置を使用するリソグラフィ工程では、前の工程で基板に形成されたパターンに対して重ね合わせて露光することが一般的である。その際、前の工程で露光処理した露光装置と重ね合わせ露光をするときに使用する露光装置が異なる場合、露光装置の光学的誤差として存在するディストーション成分の装置間差が重ね合わせ誤差となり、重ね合わせ精度に悪影響を及ぼす。ディストーション成分の装置間差は、各露光装置の光学性能の誤差等で決まるため、倍率誤差のような回転対称成分ばかりでなく、高次収差等の影響を受けて発生する回転非対称性のディストーション成分もある。
(物品製造方法)
次に、前述の露光装置を利用した物品(半導体IC素子、液晶表示素子、カラーフィルタ、MEMS等)の製造方法を説明する。物品は、前述の露光装置を使用して、感光剤が塗布された基板(ウェハ、ガラス基板等)を露光する工程と、その基板(感光剤)を現像する工程と、現像された基板を他の周知の加工工程で処理することにより製造される。他の周知の工程には、エッチング、レジスト剥離、ダイシング、ボンディング、パッケージング等が含まれる。本製造方法によれば、従来よりも高品位の物品を製造することができる。
Claims (8)
- 基板を露光する露光装置において、
マスクを照明する照明光学系と、
前記マスクのパターンを基板上に投影する投影光学系と、
前記照明光学系の少なくとも1つの光学素子を前記投影光学系の光軸に対して偏心させる、又は、前記投影光学系の少なくとも1つの光学素子を前記照明光学系の光軸に対して偏心させる偏心機構と、を有し、
前記偏心機構により前記光学素子を偏心させることにより、前記投影光学系の焦点位置からデフォーカスした位置で発生する回転非対称性のディストーションを変更する、ことを特徴とする露光装置。 - 前記照明光学系の光学素子を前記投影光学系の光軸に対して偏心させることにより、前記照明光学系の光軸からの距離に対するテレセントリシティの特性をシフトさせて、前記回転非対称なディストーションを変更することを特徴とする請求項1に記載の露光装置。
- 前記照明光学系の光軸からの距離に対するテレセントリシティの特性は、前記距離の3次の成分を有し、
前記投影光学系の光軸からの距離に対するテレセントリシティの特性は、前記距離の3次の成分を有し、
前記光学素子を偏心させることにより、2次の前記回転非対称性のディストーションを変更することを特徴とする請求項1又は2に記載の露光装置。 - 前記照明光学系の光軸と前記投影光学系の光軸がずれていない状態において、前記照明光学系の光軸からの距離に対するテレセントリシティの特性と、前記投影光学系の光軸からの距離に対するテレセントリシティの特性とは、互いに相殺し合う特性を有することを特徴とする請求項1乃至3の何れか1項に記載の露光装置。
- 前記偏心機構を制御する制御部と、
前記回転非対称なディストーションを計測する計測部と、を有し、
前記制御部は、前記回転非対称なディストーションの計測結果に基づいて、前記光学素子を偏心させて、計測された前記回転非対称性のディストーションを補正するように前記偏心機構を制御する、ことを特徴とする請求項1乃至4の何れか1項に記載の露光装置。 - 前記偏心機構を制御する制御部を有し、
前記制御部は、前記基板を露光するときのデフォーカス量の情報と、前記基板を露光するときの前記回転非対称性のディストーションの目標形状の情報と、を取得し、前記デフォーカス量と前記目標形状に基づいて前記光学素子の偏心量を算出することを特徴とする請求項1乃至4の何れか1項に記載の露光装置。 - 前記照明光学系の光軸と前記投影光学系の光軸を相対的に偏心させることにより前記回転非対称性のディストーションを変更することを特徴とする請求項1乃至6の何れか1項に記載の露光装置。
- 請求項1乃至7の何れか1項に記載の露光装置を用いて基板を露光する工程と、
露光された基板を現像する工程と、を有し、
現像された基板から物品を製造することを特徴とする物品の製造方法。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017146780A JP6980443B2 (ja) | 2017-07-28 | 2017-07-28 | 露光装置及び物品製造方法 |
| TW107121638A TWI695231B (zh) | 2017-07-28 | 2018-06-25 | 曝光裝置和物品製造方法 |
| US16/041,130 US10663867B2 (en) | 2017-07-28 | 2018-07-20 | Exposure apparatus and article manufacturing method |
| KR1020180084451A KR102349633B1 (ko) | 2017-07-28 | 2018-07-20 | 노광 장치 및 물품 제조 방법 |
| CN201810814943.6A CN109307987B (zh) | 2017-07-28 | 2018-07-24 | 曝光装置和物品制造方法 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023003153A (ja) * | 2021-06-23 | 2023-01-11 | キヤノン株式会社 | 露光装置、露光方法および物品の製造方法 |
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| JP2005101314A (ja) * | 2003-09-25 | 2005-04-14 | Canon Inc | 照明装置及び露光装置 |
| JP2006019702A (ja) * | 2004-06-04 | 2006-01-19 | Canon Inc | 照明光学系及び露光装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3067695B2 (ja) * | 1997-06-06 | 2000-07-17 | 日本電気株式会社 | 投影露光装置の検査方法 |
| JP3762323B2 (ja) * | 2002-04-02 | 2006-04-05 | キヤノン株式会社 | 露光装置 |
| US20080204682A1 (en) * | 2005-06-28 | 2008-08-28 | Nikon Corporation | Exposure method and exposure apparatus, and device manufacturing method |
| JP4865270B2 (ja) * | 2005-07-28 | 2012-02-01 | キヤノン株式会社 | 露光装置、及びそれを用いたデバイス製造方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08316123A (ja) * | 1995-05-19 | 1996-11-29 | Nikon Corp | 投影露光装置 |
| JP2000114163A (ja) * | 1998-10-09 | 2000-04-21 | Canon Inc | 投影露光装置及びそれを用いたデバイスの製造方法 |
| JP2001237183A (ja) * | 2000-01-20 | 2001-08-31 | Asm Lithography Bv | マイクロリソグラフィ投影装置 |
| JP2002015987A (ja) * | 2000-04-12 | 2002-01-18 | Nikon Corp | 露光装置、露光装置の製造方法及びマイクロデバイスの製造方法 |
| JP2003059817A (ja) * | 2001-08-21 | 2003-02-28 | Nikon Corp | 露光方法及び露光装置並びにマイクロデバイス製造方法 |
| JP2005101314A (ja) * | 2003-09-25 | 2005-04-14 | Canon Inc | 照明装置及び露光装置 |
| JP2006019702A (ja) * | 2004-06-04 | 2006-01-19 | Canon Inc | 照明光学系及び露光装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023003153A (ja) * | 2021-06-23 | 2023-01-11 | キヤノン株式会社 | 露光装置、露光方法および物品の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6980443B2 (ja) | 2021-12-15 |
| TW201910928A (zh) | 2019-03-16 |
| CN109307987B (zh) | 2021-06-25 |
| US10663867B2 (en) | 2020-05-26 |
| US20190033724A1 (en) | 2019-01-31 |
| KR20190013514A (ko) | 2019-02-11 |
| TWI695231B (zh) | 2020-06-01 |
| KR102349633B1 (ko) | 2022-01-12 |
| CN109307987A (zh) | 2019-02-05 |
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