JP2018197001A - Sheet-like laminate used for manufacturing method of printed wiring board - Google Patents

Abstract

The present invention provides a method for manufacturing a printed wiring board that is extremely excellent in manufacturing efficiency. A printed wiring board manufacturing method according to an embodiment of the present invention includes a functional part, a peelable film provided on one side of the functional part, and an adhesive layer (A) provided on the other side. Placing the sheet-like laminate having the adhesive layer on the printed wiring board via the adhesive layer (A); removing the cushion film having the adhesive layer (B1) via the adhesive layer (B1). Placing on the surface to produce an intermediate laminate; and hot pressing the intermediate laminate to bond the functional part of the sheet-like laminate to the printed wiring board via the adhesive layer (A) And adhering the cushion film and the peelable film through the adhesive layer (B1). [Selection] Figure 1

Description

The present invention relates to a sheet-like laminate used in a method for producing a printed wiring board.

  As a method for attaching a sheet-like laminate to a printed wiring board, a method is known in which a printed wiring board and a sheet-like laminate are sandwiched with a press plate through a printed wiring board protective film having cushioning properties and heat-pressed. (For example, Patent Document 1 or 2). As a sheet-like laminated body, an electromagnetic wave shield film and a conductive adhesive film are mentioned, for example. These sheet-like laminates typically have an insulating protective layer for protecting the sheet-like laminate from mechanical or electrical damage on the first main surface side, and on the second main surface side. Has an adhesive layer for adhering to the printed wiring board. A peelable film is affixed to the outer surface of the insulating protective layer for the purpose of preventing foreign matter from adhering to the insulating protective layer and scratching at the time of product shipment and / or affixing to a printed wiring board. ing. As this peelable film, generally, a resin film such as a polyester film having a surface subjected to a peeling treatment is used. The peelable film is peeled off manually after the sheet-like laminate is attached to the printed wiring board by the hot press.

  By the way, recent electronic devices are required to be small and light, and printed wiring boards used for electronic devices and sheet-like laminates attached to the printed wiring boards are also required to be adapted to small sizes. ing. However, when the size of the sheet-like laminate is reduced, the number of pieces (pieces) of the sheet-like laminate that are supplied to one batch of the hot press process increases. The problem of increasing the load of the work of peeling the film has become apparent.

JP-A-10-272700 International Publication No. 2005/002850

The present invention has been made to solve the above-described conventional problems, and an object of the present invention is to provide a sheet-like laminate that can be used in a method for producing a printed wiring board that is extremely excellent in production efficiency. It is in.

The sheet-like laminate according to the embodiment of the present invention has an adhesive layer (A), a peelable film, and an adhesive layer (B2) in this order, and the adhesive layer (A) is a conductive adhesive layer. .
Another sheet-like laminate of the present invention has an adhesive layer (A), a functional part, a peelable film, and an adhesive layer (B2) in this order.
In one embodiment, the above-mentioned functional part has an electromagnetic wave shield layer and a protection layer in order from the above-mentioned adhesive layer (A) side.
In one embodiment, the adhesive layer (A) is a conductive adhesive layer, and the functional unit is a protective layer.

  According to an embodiment of the present invention, in a manufacturing method including affixing a sheet-like laminate to a printed wiring board by pressing (typically, hot pressing), the peelable film of the sheet-like laminate at the time of pressing. Is transferred to the printed wiring board protective film, the operation of manually peeling and removing the peelable film from the sheet-like laminate after pressing can be omitted. As a result, it is possible to realize a printed wiring board manufacturing method that is extremely excellent in manufacturing efficiency. In particular, when the number of pieces (pieces) of the printed wiring board and the sheet-like laminate that are supplied to one batch of the pressing process is large, the effect is remarkable.

FIG. 1A to FIG. 1D are schematic cross-sectional views illustrating each step in a method for manufacturing a printed wiring board according to one embodiment of the present invention. FIG. 2A to FIG. 2D are schematic cross-sectional views illustrating each step in a method for manufacturing a printed wiring board according to another embodiment of the present invention. FIG. 3A to FIG. 3D are schematic cross-sectional views illustrating each step in the method for manufacturing a printed wiring board according to still another embodiment of the present invention. 4 (a) to 4 (e) are schematic cross-sectional views illustrating each step in a method for manufacturing a printed wiring board according to still another embodiment of the present invention.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to these embodiments. In all the illustrated examples, the sheet-like laminate is provided with a functional unit. However, the functional unit is an arbitrary component and may be omitted depending on the purpose. For example, when the sheet-like laminate is a circuit connection member, the functional unit can be omitted.

<First Embodiment>
FIG. 1A to FIG. 1D are schematic cross-sectional views illustrating each step in a method for manufacturing a printed wiring board according to one embodiment of the present invention. First, as shown in FIG. 1A, the printed wiring board 10 is placed on the release sheet 40. Preferably, a plurality of printed wiring boards 10 are placed on the release sheet 40 as in the illustrated example. The release sheet 40 may be omitted. In this case, the printed wiring board 10 is directly placed on a lower press plate 52 described later with reference to FIG.

  Further, the sheet-like laminate 20 is placed on the printed wiring board 10. The sheet-shaped laminate is typically composed of a functional part 21, a peelable film 22 provided on one side of the functional part 21, and an adhesive layer (A) provided on the other side of the functional part 21. Have The sheet-like laminate 20 is typically placed on a cover lay (not shown) of the printed wiring board 10 via an adhesive layer (A). As a sheet-like laminated body, an electromagnetic wave shield film and a circuit connection member are mentioned, for example. When the sheet-shaped laminate is an electromagnetic wave shielding film, the functional unit 21 includes an electromagnetic wave shielding layer and a protective layer in order from the adhesive layer (A) side. In this case, the adhesive layer (A) may be a conductive adhesive layer, or may be either an anisotropic conductive adhesive layer or an isotropic conductive adhesive layer. When the adhesive layer (A) is an isotropic conductive adhesive layer, the electromagnetic wave shielding layer can be omitted from the functional part, and the conductive adhesive layer can also serve as the electromagnetic wave shielding layer. When the sheet-like laminate is a circuit connection member, the adhesive layer (A) is typically configured as a conductive adhesive, and the functional unit can be omitted as described above (that is, the circuit connection member is A conductive adhesive layer (A) and a peelable film). A typical example of the circuit connection member is a conductive adhesive film having a thermosetting resin or a photocurable resin and a conductive filler. Practically, another peelable film is temporarily attached to the surface of the adhesive layer (A) of the sheet-like laminate until it is used, and foreign substances adhere to the adhesive layer and / or the adhesive. Prevents damage to the layer.

  Next, as shown in FIG. 1B, the printed wiring board protective film 30 is placed on the sheet-like laminate 20. The printed wiring board protective film 30 includes a main body 31 and an adhesive layer (B1). The printed wiring board protective film 30 is placed on the sheet-like laminate 20 via the adhesive layer (B1). Preferably, the printed wiring board protective film 30 is placed so as to cover all of the plurality of sheet-like laminates with one large-sized printed wiring board protective film as in the illustrated example. If it is such composition, in the below-mentioned press, peelable film 22 will be collectively transferred to a printed wiring board protective film about all the plurality of sheet-like laminated bodies 20, and peelable film from all the sheet-like laminated bodies Can be peeled and removed together. Hereinafter, the laminate of the release sheet 40 (if present), the printed wiring board 10, the sheet-like laminate 20, and the printed wiring board protective film 30 may be referred to as an intermediate laminate for convenience.

  Next, the intermediate laminated body obtained by the process of FIG. By pressing the intermediate laminate, the printed wiring board protective film 30 and the peelable film 22 are bonded via the adhesive layer (B1). The timing at which the sheet-like laminate 20 is bonded to the printed wiring board 10 (hereinafter referred to as timing (1)) is the timing at which the printed wiring board protective film 30 and the peelable film 22 are bonded (hereinafter referred to as timing (2). )) Or may be timing (2) after timing (1), but timing (1) and timing (2) are preferably simultaneous. In the case of timing (2) after timing (1), the protection is carried out from the state shown in FIG. 1 (a) by applying a known method (heating and pressing through a printed wiring board protective film having no adhesiveness). The sheet laminate and the printed wiring board are bonded to the printed wiring board via the adhesive layer (A) of the sheet laminate, thereby producing an intermediate laminate. The printed wiring board protective film 30 and the peelable film 22 are bonded via the adhesive layer (B1) by pressing the intermediate laminate. When the timing (1) and the timing (2) are the same, the printed wiring board protective film 30 and the peelable film 22 are bonded via the adhesive layer (B1), and at the same time, the sheet-like laminate 20 The functional part 21 (if present) and the printed wiring board 10 can be bonded via the adhesive layer (A). By simultaneously bonding, the step of attaching the sheet-like laminate to the printed wiring board and the step of adhering the printed wiring board protective film and the peelable film can be performed at the same time. A printed wiring board provided with a corresponding function (for example, electromagnetic wave shielding property, conductive adhesive property) can be efficiently produced.

  The case where the timing (1) and the timing (2) are simultaneous will be described in more detail. By pressing the intermediate laminate in a manner as shown in FIG. 1C, the sheet-like laminate 20 and the printed wiring board 10 are bonded together and the printed wiring board protective film 30 and the peelable film 22 are bonded simultaneously. be able to. The press is typically a hot press. Specifically, the hot pressing is performed by sandwiching the intermediate laminate between the upper press plate 51 and the lower press plate 52 heated to a predetermined temperature, and applying a predetermined pressure for a predetermined time. The temperature of the hot press (substantially, the temperature of the upper press plate 51 and the lower press plate 52), the pressure and the time are the type, material and characteristics of the adhesive layers (A) and (B1), printed wiring, respectively. Material and surface characteristics of the main part of the board protective film, functional part (if any) of the sheet-like laminate and material and surface characteristics of the peelable film, adhesive strength between the adhesive layer (A) and the printed wiring board, adhesion It can be appropriately set according to the adhesive force between the agent layer (B1) and the peelable film and / or the adhesive force between the peelable film and the functional part of the sheet-like laminate or the adhesive layer (A). The temperature of the hot press is, for example, 150 ° C. to 200 ° C. The pressure of the hot press is, for example, 2 MPa to 5 MPa. The hot press time is, for example, 1 minute to 5 minutes.

  The functional part 21 of the sheet-like laminate 20 and the printed wiring board 10 are bonded via the adhesive layer (A) by hot pressing of the intermediate laminate. When the functional unit 21 is omitted, the adhesive layer (A) of the sheet-like laminate 20 and the printed wiring board 10 are bonded by hot pressing of the intermediate laminate. Thereby, the printed wiring board provided with the function (for example, electromagnetic wave shielding property, conductive adhesiveness) according to the kind of sheet-like laminated body is obtained. At the same time, the printed wiring board protective film 30 and the peelable film 22 are bonded via the adhesive layer (B1) by hot pressing. As a result, when the pressure of the hot press is released, the peelable film 22 is transferred from the sheet-like laminate 20 to the printed wiring board protective film 30 as shown in FIG. Such transfer includes the types, materials and characteristics of the adhesive layers (A) and (B1), the material and surface characteristics of the main body part of the printed wiring board protective film, the functional part (if present) of the sheet-like laminate, and Material and surface characteristics of peelable film, adhesive force between adhesive layer (A) and printed wiring board, adhesive force between adhesive layer (B1) and peelable film, functional part of peelable film and sheet-like laminate Or it can implement | achieve by adjusting suitably the adhesive force with an adhesive bond layer (A), and / or the conditions of a hot press. For example, the adhesive force between the surface of the peelable film 22 on the printed wiring board protective film 30 side and the adhesive layer (B1) is set so that the opposite surface of the peelable film 22 (substantially the peel-treated surface) and the functional part 21 By making it larger than the adhesive strength with the adhesive layer (A when omitted), the above transfer can be realized.

  Hereinafter, a printed wiring board, a film, a sheet, an adhesive and the like used in this embodiment will be briefly described. Since these configurations are well known in the art, a detailed description is omitted. For parts not described in the present specification, configurations well known in the art may be employed.

  The printed wiring board 10 may be a flexible printed wiring board, a rigid printed wiring board, or a rigid flexible printed wiring board.

  As the adhesive (adhesive composition) constituting the adhesive layer (A) of the sheet-like laminate, the sheet-like laminate and the printed wiring board are well bonded, and the above transfer is realized. Any suitable adhesive can be used as long as possible. Specifically, the adhesive may be a hot melt adhesive, a thermosetting resin adhesive, a thermoplastic resin adhesive, or an active energy ray curable adhesive. It may be an agent or a pressure-sensitive adhesive. Examples of the base resin of the hot melt adhesive include urethane resin, polyamide resin, polyester resin, polyolefin resin, styrene resin, ethylene-vinyl acetate resin, and thermoplastic elastomer. Examples of the base resin of the thermosetting resin adhesive include epoxy resin, phenol resin, (meth) acrylic resin, urethane resin, polyolefin resin, and isocyanate resin. Examples of the base resin of the thermoplastic resin adhesive include (meth) acrylic resin, polyvinyl acetal resin, styrene resin, polyimide resin, polyamide resin, and polyamideimide resin. Examples of the base resin of the active energy ray-curable adhesive include (meth) acrylic resin and epoxy resin. The adhesive layer (A) having desired characteristics can be formed by appropriately adjusting the composition ratio of the monomer components of the base resin and the type, number, blending amount, and combination of additives. The adhesive constituting the adhesive layer (A) is preferably a thermosetting resin adhesive or an active energy ray curable adhesive, and more preferably a thermosetting resin adhesive. Since such an adhesive can achieve a desired adhesive force between the sheet-like laminate and the printed wiring board, the sheet-like laminate and the printed wiring board can be bonded well and a peelable film can be printed. It can be satisfactorily transferred to the wiring board protective film. The thickness of the adhesive layer (A) is preferably 0.5 μm to 20 μm. When the thickness of the adhesive layer (A) is 0.5 μm or more, it becomes easy to follow the step of the printed wiring board, and when it is 20 μm or less, the entire thickness of the sheet-like laminate can be reduced and the flexibility is good. It becomes.

  When the sheet-like laminate 20 is an electromagnetic wave shielding film, the electromagnetic wave shielding layer is typically a layer made of a metal thin film or a layer having a conductive filler. When the electromagnetic wave shielding layer is a layer made of a metal thin film, examples of the metal material constituting the thin film include aluminum, silver, copper, gold, nickel, tin, palladium, chromium, titanium, and zinc, or these And an alloy containing two or more of the following. The metal material can be appropriately selected depending on the desired shielding characteristics. When the electromagnetic wave shielding layer is a layer having a conductive filler, a conductive filler used in a conductive adhesive film described later can be used. The thickness of the electromagnetic wave shielding layer is preferably 0.1 μm to 10 μm, more preferably 0.3 μm to 7 μm, and further preferably 1 μm to 6 μm. The protective layer is typically composed of any suitable resin film having electrical insulation and / or scratch resistance. The resin constituting the resin film may be a thermosetting resin, a thermoplastic resin, or an electron beam (eg, visible light, ultraviolet ray) curable resin. Specific examples of the resin include epoxy resin, phenol resin, amino resin, alkyd resin, urethane resin, (meth) acrylic resin, polyimide resin, and polyamideimide resin. The thickness of the protective layer is, for example, 1 μm to 10 μm.

  When the sheet-like laminate 20 is an electromagnetic wave shielding film, the adhesive layer (A) is obtained by adding a conductive filler to the above-mentioned adhesive so that the anisotropic conductive adhesive layer or the isotropic conductive adhesive layer. It can be. In the case of an anisotropic conductive adhesive layer, an anisotropic conductive adhesive layer is formed by adding 10 to 150 parts by weight of a conductive filler to 100 parts by weight of the base resin of the adhesive. Can do. Moreover, when it is an isotropic conductive adhesive layer, it can be set as an isotropic conductive adhesive layer by adding 150 mass parts-500 mass parts of conductive fillers to the base resin of the said adhesive agent. As such an electroconductive filler, the electroconductive filler used with the below-mentioned electroconductive adhesive film can be used.

  When the sheet-like laminate 20 is a conductive adhesive film, the conductive adhesive is typically an arbitrary adhesive composition (for example, an adhesive composition that constitutes the above-described adhesive layer (A)). A conductive filler is blended with the product). Any appropriate conductive filler can be used as the conductive filler. Specific examples of conductive fillers include carbon, silver, copper, nickel, solder, aluminum, silver-coated copper filler obtained by silver plating on copper powder, and filler obtained by metal plating on resin balls and glass beads. . Silver coated copper filler or nickel is preferable. This is because it is relatively inexpensive, has excellent conductivity, and is highly reliable. A conductive filler may be used independently and may be used in combination of 2 or more type. Any appropriate shape can be adopted as the shape of the conductive filler according to the purpose. Specific examples include true spherical shape, flake shape, flake shape, plate shape, dendritic shape, elliptical spherical shape, rod shape, needle shape, and irregular shape. The blending amount of the conductive filler in the conductive adhesive is preferably 10 to 150 parts by weight with respect to 100 parts by weight of the base resin.

  The peelable film 22 is typically a film having a surface subjected to a peeling treatment. Examples of the film include polyester films (for example, polyethylene terephthalate film), polyolefin films (for example, polyethylene film, polypropylene film, polymethylpentene film), polyvinyl chloride films, and cellulose films (for example, acetylcellulose butyrate film, Resin film such as triacetyl cellulose film), polystyrene film, polycarbonate film, and polysulfone film; papers such as glassine paper, fine paper, kraft paper, coated paper, synthetic paper; various nonwoven fabrics; metal foil; And a composite film combining these. Among these, a polyethylene terephthalate (PET) film is preferable from the viewpoint of availability and cost. Examples of the release treatment include application of a release agent on one or both sides of the film and formation of an uneven shape on the film surface. Examples of the release agent include hydrocarbon resins such as polyethylene and polypropylene, higher fatty acids and metal salts thereof, higher fatty acid soaps, waxes, animal and vegetable oils and fats, mica, talc, silicone surfactants, silicone oils, silicone resins, Examples include melamine resins, fluorine-based surfactants, fluorine resins, and fluorine-containing silicone resins. Examples of the method for applying the release agent include gravure coating, kiss coating, die coating, lip coating, comma coating, blade coating, roll coating, knife coating, spray coating, bar coating, spin coating, and dip coating. Examples of the method for forming the concavo-convex shape include embossing, kneading of fine particles into the film, roughening by spraying dry ice etc. on the film surface, and curing of the thermosetting resin in the mold having the concavo-convex shape. It is done.

  The main body 31 of the printed wiring board protection film 30 only needs to have a property of protecting the printed wiring board from damage due to contact with the press board. A typical example of the main body 31 having such properties is a cushion film made of any appropriate resin film. Representative examples of the resin constituting the resin film include polyolefin resins (for example, polyethylene, polypropylene, polymethylpentene), polyester resins (for example, polyethylene terephthalate, polybutylene terephthalate), (meth) acrylic resins (for example, And ethylene-ethyl acrylate copolymer resin (EEA), ethylene-methyl acrylate copolymer resin (EMA), ethylene-methyl methacrylate copolymer resin (EMMA)), and polyvinyl chloride resin. The thickness of the main body is, for example, 10 μm to 250 μm.

  As an adhesive (adhesive composition) constituting the adhesive layer (B1), any appropriate adhesive can be used as long as transfer from the sheet-like laminate of the peelable film to the printed wiring board protective film is realized. Can be used. Specifically, the adhesive may be a hot melt adhesive, a thermosetting resin adhesive, a thermoplastic resin adhesive, or an active energy ray curable adhesive. An agent may be used. Examples of the base resin of the hot melt adhesive include urethane resin, polyamide resin, polyester resin, polyolefin resin, styrene resin, ethylene-vinyl acetate resin, and thermoplastic elastomer. Examples of the base resin of the thermosetting resin adhesive include epoxy resin, phenol resin, (meth) acrylic resin, urethane resin, polyolefin resin, and isocyanate resin. Examples of the base resin of the thermoplastic resin adhesive include (meth) acrylic resin, polyvinyl acetal resin, styrene resin, polyimide resin, polyamide resin, and polyamideimide resin. Examples of the base resin of the active energy ray-curable adhesive include (meth) acrylic resin and epoxy resin. An adhesive layer having desired characteristics can be formed by appropriately adjusting the composition ratio of the monomer components of the base resin and the type, number, blending amount, and combination of additives. The adhesive constituting the adhesive layer (B1) is preferably a hot melt adhesive, and more preferably a hot melt adhesive having a styrene resin as a base resin. Since such an adhesive can achieve a desired adhesive force between the sheet-like laminate and the printed wiring board, the sheet-like laminate and the printed wiring board can be bonded well and a peelable film can be printed. It can be satisfactorily transferred to the wiring board protective film. The thickness of the adhesive layer (B1) is preferably 1 μm to 15 μm, more preferably 3 μm to 10 μm. If thickness is 1 micrometer or more, a peelable film can be favorably transcribe | transferred to a printed wiring board protective film. When the thickness is 15 μm or less, the adhesive layer (B1) can be prevented from bleeding when the intermediate laminate is hot-pressed.

<Second Embodiment>
FIG. 2A to FIG. 2D are schematic cross-sectional views illustrating each step in a method for manufacturing a printed wiring board according to another embodiment of the present invention. Hereinafter, only the characteristic features of this embodiment will be described. The same printed circuit boards, films, sheets, adhesives and the like as those used in the first embodiment are denoted by the same reference numerals and description thereof is omitted. Moreover, when there is no specific description about operation conditions etc., the description regarding 1st Embodiment may be applied.

  In this embodiment, instead of the printed wiring board protective film 30 having the main body 31 and the adhesive layer (B1), as shown in FIG. 2B, a predetermined temperature range (typically a hot press) In the temperature region), a printed wiring board protective film comprising the main body 32 having tackiness is used. According to the present embodiment, the printed wiring board protective film 32 and the peelable film 22 are bonded using the tackiness of the printed wiring board protective film 32 in the hot pressing of the intermediate laminate shown in FIG. . As a result, when the pressure of the hot press is released, the peelable film 22 is transferred from the sheet-like laminate 20 to the printed wiring board protective film 32 as shown in FIG. Examples of the constituent material of the printed wiring board protective film 32 having tackiness in the temperature range of hot pressing include polyester resins, acrylic resins, urethane resins, and epoxy resins. The printed wiring board protective film is described in, for example, Japanese Patent Application Laid-Open No. 2009-191099, and the description in the publication is incorporated herein by reference. Further, in the printed wiring board protective film in the present embodiment, the main body portion 32 may be formed from a single material having tackiness, and at least a part of the surface is formed from a plurality of layers having tackiness. May be.

<Third Embodiment>
FIG. 3A to FIG. 3D are schematic cross-sectional views illustrating each step in the method for manufacturing a printed wiring board according to still another embodiment of the present invention. Similar to the second embodiment, only the characteristic part of this embodiment will be described.

  In this embodiment, as shown to Fig.3 (a), the sheet-like laminated body 20 'which further has an adhesive bond layer (B2) on the surface (printed wiring board protective film side) of the peelable film 22 is used. In this regard, in this embodiment, as shown in FIG. 3B, instead of the printed wiring board protective film 30 having the main body 31 and the adhesive layer (B1) in the first embodiment. A printed wiring board protective film made of the main body 31 is used. That is, the printed wiring board protective film in the present embodiment may not have the adhesive layer on the surface facing the adhesive layer (B2). According to this embodiment, the printed wiring board protective film 31 and the peelable film 22 are bonded via the adhesive layer (B2) in the hot pressing of the intermediate laminate shown in FIG. As a result, when the pressure of the hot press is released, the adhesive layer (B2) and the peelable film 22 are transferred from the sheet-like laminate 20 ′ to the printed wiring board protective film 31, as shown in FIG. . The adhesive layer (B2) can be composed of the same adhesive as the adhesive layer (B1).

<Fourth Embodiment>
4 (a) to 4 (e) are schematic cross-sectional views illustrating each step in a method for manufacturing a printed wiring board according to still another embodiment of the present invention. Similar to the second and third embodiments, only characteristic portions of this embodiment will be described.

  In this embodiment, an adhesive film 60 is used as shown in FIG. 4 (b), this adhesive film 60 is placed on the surface of the peelable film 22, and then bonded as shown in FIG. 4 (c). A printed wiring board protective film composed of the main body 31 is placed on the surface of the conductive film. According to this embodiment, the printed wiring board protection film 31 and the peelable film 22 are bonded via the adhesive film 60 in the hot pressing of the intermediate laminate shown in FIG. As a result, when the pressure of the hot press is released, the peelable film 22 is transferred from the sheet-like laminate 20 to the printed wiring board protective film 31 as shown in FIG. Examples of the adhesive film 60 include a film composed of a hot melt adhesive, a thermosetting resin-based adhesive, a thermoplastic resin-based adhesive, and an active energy ray-curable adhesive.

  EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited by these Examples.

<Example 1>
A commercially available electromagnetic wave shielding film (manufactured by Tatsuta Electric Wire Co., Ltd., trade name SF-PC5600) was used as the sheet-like laminate. This electromagnetic wave shielding film has a peelable PET film (thickness 60 μm) provided with a melamine release layer on one surface / a protective layer (thickness 5 μm) made of a thermosetting epoxy resin / an electromagnetic shielding layer (thickness 0) made of a silver vapor deposition layer. .1 μm) / anisotropic conductive adhesive layer (containing 13 parts by mass of dendritic silver-coated copper powder with respect to 100 parts by mass of thermosetting epoxy resin: 5 μm in thickness). On the surface opposite to the protective layer of the peelable film of the electromagnetic wave shielding film, styrene-based thermoplastic resin (manufactured by Toagosei Co., Ltd., trade name: Aronmelt PPET-2000S) is methylethylketone (MEK) / toluene (50/50 : A solution (concentration: 30% by weight) dissolved in a mixed solvent of volume%) is applied and dried at 80 ° C. for 3 minutes to form a hot melt adhesive layer (thickness 5 μm) on the peelable film of the electromagnetic shielding film. did. Next, the electromagnetic wave shielding film on which the hot melt adhesive layer was formed was cut into a size of 10 cm long × 5 cm wide to obtain a film piece. Eight pieces of film were placed on a polyimide film (length 25 cm × width 25 cm) at 1 cm intervals. At that time, the conductive adhesive layer was placed on the polyimide film side. Next, the polyimide film on which the film piece was placed was placed on the lower press plate of a hot press apparatus (manufactured by Sumizui Machinery Co., Ltd., model number AHC007-014). Furthermore, a printed wiring board protective film (polyolefin film, Mitsui Chemicals, trade name “Opyran CR1012MT4”, thickness 0.15 mm, length 28 cm × width 30 cm) is covered with a hot melt adhesive layer so as to cover all the film pieces. Placed on top. The upper press plate (silicon rubber) is lowered from above the printed wiring board protective film and hot pressed at 170 ° C. and 3 MPa for 3 minutes to bond the electromagnetic wave shielding film and the polyimide film through the conductive adhesive layer. The peelable film and the printed wiring board protective film were bonded via the melt adhesive layer. When the film piece was cooled to 25 ° C. after the hot press was completed and then the printed wiring board protective film was removed, the peelable film was transferred to the printed wiring board protective film for all eight film pieces. Thus, it was confirmed that the peelable film can be removed well from the film piece (electromagnetic wave shielding film) by removing the printed wiring board protective film.

  The manufacturing method by embodiment of this invention can be used suitably for manufacture of a printed wiring board.

DESCRIPTION OF SYMBOLS 10 Printed wiring board 20 Sheet-like laminated body 22 Peelable film 30 Printed wiring board protective film 31 Main-body part 51 Press board 52 Press board 60 Adhesive film (A) Adhesive layer (B1) Adhesive layer (B2) Adhesive layer

Claims (4)

  A sheet-like laminate having an adhesive layer (A), a peelable film, and an adhesive layer (B2) in this order, wherein the adhesive layer (A) is a conductive adhesive layer.   The sheet-like laminated body which has an adhesive bond layer (A), a functional part, a peelable film, and an adhesive bond layer (B2) in this order.   The sheet-like laminate according to claim 2, wherein the functional part has an electromagnetic wave shielding layer and a protective layer in order from the adhesive layer (A) side. The sheet-like laminate according to claim 2, wherein the adhesive layer (A) is a conductive adhesive layer and the functional part is a protective layer.

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