JP2000101220A - Electronic component mounting method and system - Google Patents

Abstract

(57) [Summary] (with correction) [PROBLEMS] To provide a mounting method and a system for mounting an electronic component to be flip-chip connected to a circuit board using an anisotropic conductive film. A solder mounting process for soldering and mounting electronic components such as a package component and a chip component on a circuit board, and an anisotropic conductive film having a separator at a desired position on the circuit board. Anisotropic conductive film sticking step of sticking by pressing, and a deformable or displaceable member 1
A separator peeling step of relatively moving the member and the circuit board while holding down the adhesive tape 3 to transfer the attached anisotropic conductive film separator to the adhesive tape and peeling the separator, A flip-chip connection mounting step of curing the anisotropic conductive film by pressing and heating the semiconductor chip on the peeled anisotropic conductive film and flip-chip connecting and mounting the semiconductor chip. This is a method for mounting electronic components.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microcomputer, a CPU, and an ASIC (Application Specif.) Which are flip-chip connected to a circuit board using an anisotropic conductive film.
ic Integrated Cicuit: Application specific IC), chip set, etc.
DC-DC converter, switch regulator, SRA
The present invention relates to a method and system for mounting electronic components for manufacturing a mounting structure in which package components such as RAM and ROM such as M and chip components such as resistors and capacitors are mounted at high density.

[0002]

2. Description of the Related Art Conventionally, an anisotropic conductive film has been used as a method of connecting a semiconductor chip such as a liquid crystal display in a flip chip connection method in which a semiconductor chip is electrically connected directly to a glass substrate face-down. Generally, in this flip chip connection method, first, an anisotropic conductive film is preliminarily pressure-bonded to a position of a glass substrate on which a semiconductor chip is mounted, and the semiconductor chip is mounted on the anisotropic conductive film, and then pressurized and heated. Then, the semiconductor chip and the glass substrate are electrically connected. As described above, the anisotropic conductive film protects the adhesive surface of the anisotropic conductive film with an interlayer paper called a separator, and when the semiconductor chip is connected, a step of peeling the separator from the anisotropic conductive film. is necessary. As an example, there is a method disclosed in JP-A-06-243726. Normally, only semiconductor chips of the same size are mounted on a glass substrate of a liquid crystal display. Therefore, the separator peeling device is a mechanism for peeling a separator of substantially the same size. Also, the mounted components on the glass substrate are only semiconductor chips of substantially the same size, and no chip components or package components are mounted.

[0003]

On the other hand, in order to manufacture a small product such as a mobile phone, a personal computer, a digital camera, or the like, a microcomputer which is flip-chip connected to a circuit board using an anisotropic conductive film. , CPU, ASIC
(Application Specific Integrated Cicuit), package parts such as DC-DC converters, switch regulators, RAMs such as SRAMs, RAMs such as SRAMs, ROMs, etc., as well as semiconductor chips such as chip sets and resistors and capacitors. It is necessary to manufacture a mounting structure in which chip components such as are mounted at a high density. As described above, in addition to the semiconductor chip that is flip-chip connected to the circuit board using the anisotropic conductive film, a package structure in which package components, resistors, and chip components are mounted at high density around the semiconductor chip. When manufacturing a body, it is necessary to solder and mount package components, chip components, and the like on a circuit board first. However, in the prior art, a packaged chip or a chip component is soldered and mounted on a circuit board first, and then a semiconductor chip is densely placed around the package component or the chip component. The point of flip-chip connection mounting using the method has not been sufficiently considered.

[0004] An object of the present invention is to solve the above problems.
In addition to a semiconductor chip such as a microcomputer, CPU, ASIC, or chip set, which is flip-chip connected to a circuit board using an anisotropic conductive film, a DC-DC converter, a switch regulator,
Provided is an electronic component mounting method and a system therefor that enables a mounting structure in which a package component such as a RAM such as a RAM, a ROM or the like, or a chip component such as a resistor or a capacitor is mounted at a high density with high production efficiency. It is in.

[0005]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a solder mounting process for soldering electronic components such as package components and chip components on a circuit board. Anisotropic conductive film sticking step of pressing and applying an anisotropic conductive film having a separator at a desired position on a circuit board to which electronic components have been soldered in the process, and holding an adhesive tape with a deformable or displaceable member A separator peeling step of relatively moving the member and the circuit board and transferring and separating the separator of the anisotropic conductive film stuck in the anisotropic conductive film sticking step to the adhesive tape; The semiconductor chip is pressed on the anisotropic conductive film that is attached in the isotropic conductive film attaching step and the separator is removed in the separator removing step. A mounting method of electronic components and having a flip-chip bonding mounting step of flip-chip connecting a semiconductor chip is mounted and hardening the anisotropic conductive film by heating Te. Further, the present invention provides a solder mounting process for soldering and mounting electronic components such as package components and chip components on a circuit board, and a desired position on the circuit board where the electronic components are soldered in the solder mounting process. Anisotropic conductive film attaching step of applying an anisotropic conductive film having a separator by applying pressure, and an adhesive tape formed of a member which can be deformed or displaced more than approximately the height of the electronic component soldered and mounted in the soldering mounting step A separator peeling step of relatively moving the member and the circuit board while holding down and transferring and separating the separator of the anisotropic conductive film stuck in the anisotropic conductive film sticking step to the adhesive tape; Attached in the anisotropic conductive film sticking step, on the anisotropic conductive film from which the separator was peeled in the separator peeling step A mounting method of electronic components and having a flip-chip bonding mounting step of flip-chip connecting a semiconductor chip is mounted and hardening the anisotropic conductive film by heating the conductor chip pressurized.

Further, the present invention provides a solder mounting step of soldering and mounting electronic parts such as package parts and chip parts on a circuit board, and a method of mounting the electronic parts on the circuit board by soldering in the solder mounting step. An anisotropic conductive film attaching step of applying an anisotropic conductive film having a separator at a desired position by pressing, and an elastic roller capable of deforming at least approximately the height of the electronic component soldered and mounted in the solder mounting step The elastic roller and the circuit board are relatively moved while holding the adhesive tape with, and the separator of the anisotropic conductive film attached in the anisotropic conductive film attaching step is transferred to the adhesive tape and peeled off. Separating the separator, and anisotropically affixed in the anisotropic conductive film affixing step, the separator is peeled in the separator peeling step A flip-chip connection mounting step of hardening the anisotropic conductive film by pressing and heating the semiconductor chip on the electronic film and flip-chip connecting and mounting the semiconductor chip. is there. In addition, the present invention, on a circuit board,
A solder mounting process for soldering and mounting electronic components such as package components and chip components, and pressing an anisotropic conductive film having a separator at a desired position on a circuit board on which the electronic components are soldered in the solder mounting process. Anisotropic conductive film sticking step of attaching and sticking the adhesive tape with an elastic roller provided on the outer periphery of a hard roll core with an elastic layer thicker than the height of the electronic component soldered and mounted in the solder mounting step. A separator peeling step of relatively moving the elastic roller and the circuit board while pressing, and transferring and separating the separator of the anisotropic conductive film stuck in the anisotropic conductive film sticking step to the adhesive tape; And an anisotropic conductive film adhered in the anisotropic conductive film adhering step, and the separator is peeled off in the separator peeling step A mounting method of electronic components and having a flip-chip bonding mounting step of flip-chip connecting a semiconductor chip is mounted and hardening the anisotropic conductive film by heating the semiconductor chip pressurized to.

Further, the present invention provides a soldering mounting means for soldering and mounting an electronic component such as a package component or a chip component on a circuit board, and a circuit board on which the electronic component is soldered by the soldering mounting means. Anisotropic conductive film sticking means for pressing and applying an anisotropic conductive film having a separator at a desired position, and relatively moving the member and the circuit board while holding the adhesive tape with a deformable or displaceable member The separator of the anisotropic conductive film applied by the anisotropic conductive film affixing means is transferred to the pressure-sensitive adhesive tape and peeled off, and the separator is affixed by the anisotropic conductive film affixing means, the separator The semiconductor chip is pressed and heated on the anisotropic conductive film from which the separator has been peeled off by the peeling means, so that the anisotropic conductive film is removed. The cured is an electronic component mounting system, characterized in that a flip-chip connection mounting means of flip-chip connecting a semiconductor chip is mounted.

As described above, according to the above configuration,
Microcomputer, CPU, ASIC (Appl.) Which is flip-chip connected to circuit board using anisotropic conductive film
ication Specific Integrated Cicuit: Application Specific I
C) In addition to a semiconductor chip such as a chip set and the periphery of the semiconductor chip, package components such as a DC-DC converter, a switch regulator, a RAM such as an SRAM and a ROM, and chip components such as a resistor and a capacitor are densely mounted. The mounted structure can be manufactured with high production efficiency, and as a result, small products such as mobile phones, mobile terminals, personal computers, and digital cameras can be manufactured at low cost.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for mounting electronic components such as a semiconductor chip, a package component, and a chip component on a circuit board according to the present invention will be described with reference to the drawings. The present invention achieves high-density mounting by mounting the package component 7 and the chip component 8 by soldering on the circuit board 6 and directly mounting the semiconductor chip 14 by flip-chip connection on the circuit board 6. It is intended to reduce the size of products such as mobile phones, personal computers, digital cameras, and the like, thereby reducing the size of the products. That is, in the present invention, in the case of products such as a mobile phone, a personal computer, and a digital camera, a microcomputer, a CPU, an ASIC (Application Specific Integrator)
ted Cicuit: Application specific IC), DC outside the semiconductor chip 14 such as a chipset, and around the semiconductor chip 14
-It is necessary to manufacture a high-density mounting structure on which package parts 7 such as DC converters, switch regulators, RAMs such as SRAMs and ROMs, and chip parts 8 such as resistors and capacitors are mounted.

Next, a method of high-density mounting the semiconductor chip 14, the package component 7, the chip component 8 and the like on the circuit board 6 for manufacturing such a high-density mounting structure will be described with reference to FIGS. 3A and 3B. , And FIG. 3C. First, as shown in step 1 in FIG. 3A, the solder 12 is placed on a desired location (electrode) on the circuit board 6 on which the terminals or leads of the package component 7 and the chip component 8 are mounted on the stage 11a. Supply. As a method of supplying the solder 12, for example, a solder printing method is used. Next, as shown in step 2, the package component 7
The terminals or leads of the chip component 8 are mounted on the circuit board 6. Next, as shown in step 3, by applying heat to the circuit board 6 by reflow or the like to melt the solder 12 and perform reflow soldering, the terminals or leads of the package component 7 and the chip component 8 are connected. It is connected to the circuit wiring formed on the circuit board 6.

Next, flip-chip connection for mounting the semiconductor chip 14 on the circuit board 6 is performed. As described above, in order to manufacture a high-density mounting structure, the package component 7 and the chip component 8 are connected and mounted on the circuit board 6, and then the semiconductor chip 14 is mounted on the circuit board 6 by flip chip connection. If the semiconductor chip 14 is to be flip-chip connected and mounted before the package component 7 and the chip component 8 are connected and mounted on the circuit board 6, the semiconductor chip 14 is mounted on the circuit board 6. It is difficult to print the solder 12 at the time of supplying the solder 12, and it is particularly difficult to print the solder 12 around the semiconductor chip 14, and it is difficult to perform high-density mounting close to the periphery of the semiconductor chip 14. Therefore, as described above, the package component 7 and the chip component 8 are connected and mounted on the circuit board 6 first, and then the semiconductor chip 14 is mounted on the circuit board 6 by flip chip connection.

Hereinafter, the flip chip connection will be described.
It will be described in detail. First, in a state where the package component 7 and the chip component 8 are connected and mounted on the circuit board 6, first, as shown in step 4 in FIG. 3A, the semiconductor chip 14 is mounted on the circuit board 6 on which the semiconductor chip 14 is mounted. The anisotropic conductive film 5 cut into a shape corresponding to the shape is bonded to a bonding tool 1.
Paste using 3. That is, the anisotropic conductive film 5 cut into a shape corresponding to the shape of the semiconductor chip 14 is held by the bonding tool 13, and the anisotropic conductive film 5
Is transported to a desired position on the circuit board 6 on which the semiconductor chip 14 mounted on the stage 11 is mounted, and the anisotropic conductive film 5 is transferred to the desired position on the circuit board 6. Is pressed, the anisotropic conductive film 5 is stuck.
By the way, on the circuit board 6 mounted on the stage 11a, the anisotropic conductive film 5 is stuck on the anisotropic conductive film 5 where the semiconductor chip 14 is mounted when the anisotropic conductive film 5 is attached. In order to prevent the adhesive from bonding to the bonding tool 13, the separator 4 is provided. Next, in a state where the package component 7 and the chip component 8 are connected and mounted on the circuit board 6, FIG.
As shown by 7, the separators 4 are efficiently peeled off at once from the anisotropic conductive films 5 stuck on the circuit board 6, and on each of the anisotropic conductive films 5 from which these separators 4 have been peeled off. The semiconductor chip 14 is mounted using flip chip connection.

FIG. 1 is a perspective view of one embodiment of a separator peeling device according to the present invention. FIG. 2 is a sectional view taken along line AA ′. 1 and 2, 1 is an elastic roller, 1A is a roll core, 1B is an elastic layer, 2 is an auxiliary roller, 3 is an adhesive tape, 4 is a separator, 5 is an anisotropic conductive film, and 6 is a circuit board. , 7 is a package component, 8 is a chip component, 11
b is a stage. Hereinafter, the structure of the separator peeling device according to the present invention will be described with reference to FIGS.
The method of peeling the separator 4 will be described using B. The separator peeling device according to the present invention has a long elastic roller 1 and a long auxiliary roller 2 on the left and right sides thereof, a pressure-sensitive adhesive tape 3 immediately below the elastic roller 1 and the auxiliary roller 2, and a package component. A mechanism is provided in which the adhesive tape 3 can be pressed against the circuit board 6 by lowering the long elastic roller 1 in a state where the chip 7 and the chip components 8 are connected and mounted on the circuit board 6. The long elastic roller 1 uses a hard material for the roll core 1A, and forms an elastic layer 1B on the outer periphery of the roll core 1A. The hard material of the roll core 1A of the elastic roller 1 is preferably plastic, aluminum, or stainless steel.
The elastic layer 1B formed on the outer periphery of the roll core 1A of the elastic roller 1 is preferably made of a cushion material such as rubber or sponge. Further, the roll core 1A of the elastic roller 1 is not necessarily limited to a hard material, but may be an elastic material. However, first, the package component 7 and the chip component 8 are mounted and connected to the circuit board 6, and the long elastic roller 1 and the circuit board 6 mounted on the stage 11b are relatively moved (moved). In order to separate the separator 4 from the plurality of anisotropic conductive films 5 attached close to the periphery of the package component 7 in FIG. It is necessary to make the mounting component such as the chip component 8 thicker than the height T2 (T1> T2).

In the above description, the package component 7
To separate the separator 4 from the plurality of anisotropic conductive films 5 attached close to the periphery of the elastic layer 1B.
Has been described with a long elastic roller 1 that can be deformed. In addition, as shown in FIG. 4, for example, ball-shaped members 20 are arranged in a line in a groove 22, and these one-line The thin plate member 2 which is largely bent with respect to the ball member 20
1 and a structure in which a pressure is applied to the thin plate member 21 by a spring or a pressure applying means 23 such as gas or liquid can be used. That is, the height T of the mounted components such as the package component 7 and the chip component 8
It is only necessary that the ball-shaped member 20 can be largely displaced according to FIG. 1, 2 and 3 on the circuit board 6.
As shown in B, mounting components such as package components 7 and chip components 8 mounted in advance and the anisotropic conductive film 5 which has been temporarily compressed are closely mounted, so that the circuit board 6
In this case, a component height difference of the height T2 of the mounted component is generated on the upper surface of.

In the separator peeling device according to the present invention, when the elastic roller 1 is pressed against the circuit board 6, as shown in FIG. 2, the elastic layer 1B of the elastic roller 1 has a height T2 of the mounted component. Elastic layer 1 of the elastic roller 1
B follows the circuit board 6. Elastic roller 1
When the elastic roller 1 comes into contact with the upper surface of the circuit board 6, the adhesive tape 3 previously provided immediately below the adhesive tape 3 also comes into contact with the upper surface of the circuit board 6. Therefore,
The pressure-sensitive adhesive tape 3 pressed against the upper surface of the circuit board 6 by the elastic roller 1 also contacts the anisotropic conductive film 5 thinner than the height T2 of the mounted component, and the separator 4 provided on the surface of the anisotropic conductive film 5 Can be transferred to the adhesive tape 3. Meanwhile, as shown in FIG. 3B, a mechanism 9 capable of supplying the adhesive tape 3 in a reel shape is provided in the separator peeling device.
And a mechanism 10 for recovering the adhesive tape 3 to which the separator 4 has been transferred into a reel shape. Accordingly, the adhesive tape 3 is supplied from the supply mechanism 9 via the auxiliary roller 2 to the location where the elastic roller 1 is located, and the adhesive tape 3 on which the separator 4 has been transferred at this location passes through the auxiliary roller 2. It will be collected by the collection mechanism 10.

The width of the adhesive tape 3 is preferably adjusted to the size of the circuit board 6, but need not necessarily be adjusted to the size of the circuit board 6. In short, even if the width of the adhesive tape 3 is smaller than the size of the circuit board 6, the adhesive tape 3 is aimed at the plurality of anisotropic conductive films 5 stuck on the circuit board 6 by the elastic roller 1, What is necessary is just to be pressed against the plurality of anisotropic conductive films 5.
Next, the procedure of the method for separating the separator 4 according to the present invention will be described with reference to FIG. 3B. Reference numeral 9 denotes a supply mechanism including an adhesive tape supply reel and the like, and reference numeral 10 denotes a collection mechanism including an adhesive tape take-up reel and the like. First, a circuit board 6 on which a package component 7 and a chip component 8 are mounted in advance, and on which a plurality of anisotropic conductive films 5 each having a separator 4 on the surface are temporarily press-fitted, is placed on a stage 11b. The adhesive tape 3 is conveyed to the lower side of the roller 1, and the supply mechanism 9 and the recovery mechanism 10 are driven to rotate to send out the adhesive tape 3 directly below the elastic roller 1 and the auxiliary roller 2 (step 5).

Next, the elastic roller 1 is lowered while pressing the adhesive tape 3 to bring the adhesive tape 3 into contact with the start end of the circuit board 6, and the longitudinal direction of the adhesive tape 3 is pressed while pressing the circuit board 6 with a constant force. The circuit board 6 is moved (runs) by moving the stage 11b in the direction, and at the same time as the circuit board 6 is moved, the moving speed of the adhesive tape immediately below the elastic roller 1 by the supply mechanism 9 and the recovery mechanism 10 is the movement of the circuit board 6. Control is performed so that the speed becomes the same as the speed (step 6).
As a result, the elastic layer 1B of the long elastic roller 1 is deformed in accordance with the height T2 of the mounting components 7, 8, 5, and the anisotropic conductive film 5 at a plurality of positions on the circuit board 6 is formed. Since the adhesive force of the pressure-sensitive adhesive tape 3 is greater than the adhesive force of the anisotropic conductive film 5 that has been temporarily pressed, the separator 4 is peeled off from the anisotropic conductive film 5 and is entirely transferred to the pressure-sensitive adhesive tape 3 ( Step 7). According to the separator peeling process (steps 5, 6, and 7) described above, the long elastic roller 1 and the adhesive tape 3 in which the elastic layer 1B is deformed according to the height T2 of the mounted components 7, 8, and 5 are used. And using
The semiconductor chip 14 is moved relatively (moved) with respect to the circuit board 6 on which the package component 7 and the chip component 8 are closely mounted around the anisotropic conductive film 5.
By separating a large number of separators 4 of the anisotropic conductive film 5 which is one step of the flip chip connection in a short time, the separator separation step time can be greatly reduced and the production efficiency of the flip chip connection can be improved. it can.

Next, as shown in FIG. 3C, the circuit board 6 having the plurality of anisotropic conductive films from which the separator 4 has been peeled is transferred onto a stage 11c in an apparatus on which a semiconductor chip 14 is mounted. Next, each semiconductor chip 14 is pressed from above each anisotropic conductive film 5 with a bonding tool 13, and each semiconductor chip 14 is pressed and heated.
The anisotropic conductive film 5 is cured, and the circuit board 6 and each semiconductor chip 14 are connected and mounted (Step 8). As described above, the semiconductor chip 14 that is flip-chip connected to the circuit board 6 using the anisotropic conductive film 5, and the package component 7 around the semiconductor chip 14.
And a mounting structure in which the chip components 8 are mounted at a high density can be efficiently manufactured (step 9).

[0019]

According to the present invention, a microcomputer, a CPU, and an ASIC (Application Specific Int.) Which are flip-chip connected to a circuit board using an anisotropic conductive film.
egrated Cicuit: Application-specific IC), DC-
A mounting structure in which package components such as DC converters, switch regulators, RAMs such as SRAMs, ROMs such as ROMs, and chip components such as resistors and capacitors are mounted at high density can be manufactured with high production efficiency. This has the effect that small products such as terminals, personal computers and digital cameras can be manufactured at low cost.

[Brief description of the drawings]

FIG. 1 is a perspective view showing one embodiment of a separator peeling device according to the present invention.

FIG. 2 is a sectional view taken along the line A-A 'of FIG.

FIG. 3A is a process diagram showing a mounting process of a package component or a chip component and a bonding process of an anisotropic conductive film, which are one embodiment of the electronic component mounting method according to the present invention.

FIG. 3B is a process diagram showing a separator peeling step which is one embodiment of the electronic component mounting method according to the present invention.

FIG. 3C is a process diagram showing a semiconductor chip mounting step which is one embodiment of the electronic component mounting method according to the present invention.

FIG. 4 is a view showing another modification example of the elastic roller shown in FIGS. 1 and 2;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1: Elastic roller, 1A: Roll core, 1B: Elastic layer,
2 ... Auxiliary roller, 3 ... Adhesive tape, 4 ... Separator, 5
... anisotropic conductive film, 6 ... circuit board, 7 ... package parts, 8 ... chip parts, 9 ... supply mechanism, 10 ... recovery mechanism, 11a, 11b, 11c ... stage, 12 ... solder, 13 ... bonding tool, 14 ... semiconductor chips,
Reference numeral 20: ball member, 21: thin plate member, 22: groove, 2
3: pressure applying means, T1: thickness of elastic layer 1B, T2:
Height of mounted component.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Norie Ueda 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside of Hitachi, Ltd.Production Technology Research Institute (72) Inventor Yasuo Amano 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Hitachi, Ltd. Production Technology Research Laboratories (72) Inventor Toshihiro Yaya 1410 Inada, Hitachinaka-shi, Ibaraki Prefecture F-term in the Visual Information Media Division, Hitachi, Ltd. F-term (reference) 5E313 AA03 AA04 CC05 EE22 FG05 FG10 5E319 AA03 AB01 AB06 BB16 CC22 CC61 CD26 GG01

Claims (5)

[Claims] An electronic component such as a package component or a chip component is mounted on a circuit board by soldering, and the electronic component is soldered in a desired position on the circuit board in the solder mounting process. Anisotropic conductive film attaching step of applying anisotropic conductive film having a separator by applying pressure, and moving the member and the circuit board relatively while holding the adhesive tape with a deformable or displaceable member. A separator peeling step of transferring the separator of the anisotropic conductive film stuck in the isotropic conductive film sticking step to the adhesive tape and peeling it; and a separator peeled in the anisotropic conductive film sticking step, and separated in the separator peeling step. The anisotropic conductive film is cured by pressing and heating the semiconductor chip on the anisotropic conductive film from which Mounting method of electronic components and having a flip-chip bonding mounting step of flip-chip connecting a semiconductor chip is mounted. 2. A solder mounting process for soldering and mounting an electronic component such as a package component or a chip component on a circuit board, and at a desired position on the circuit board where the electronic component is soldered in the solder mounting process. Anisotropic conductive film attaching step of applying anisotropic conductive film having a separator by applying pressure, and an adhesive tape that can be deformed or displaced at least approximately the height of the electronic component soldered and mounted in the soldering mounting step. A separator peeling step of relatively moving the member and the circuit board while pressing, transferring the separator of the anisotropic conductive film stuck in the anisotropic conductive film sticking step to the adhesive tape and peeling, The separator is peeled in the anisotropic conductive film sticking step and the separator is peeled in the separator peeling step. Mounting method of electronic components and having a flip-chip bonding mounting step of flip-chip connecting a semiconductor chip is mounted and hardening the anisotropic conductive film by heating the body tip pressurized. 3. A solder mounting process for soldering and mounting electronic components such as package components and chip components on a circuit board, and at a desired position on the circuit board where the electronic components are soldered in the solder mounting process. Anisotropic conductive film attaching step of applying anisotropic conductive film having a separator by applying pressure, and applying an adhesive tape with an elastic roller capable of deforming at least approximately the height of the electronic component soldered and mounted in the soldering mounting step. A separator peeling step of relatively moving the elastic roller and the circuit board while pressing, and transferring and separating the separator of the anisotropic conductive film stuck in the anisotropic conductive film sticking step to the adhesive tape; And on the anisotropic conductive film that is attached in the anisotropic conductive film attaching step and the separator is removed in the separator removing step Mounting method of electronic components and having a flip-chip bonding mounting step of flip-chip connecting a semiconductor chip is mounted and hardening the anisotropic conductive film by heating the semiconductor chip pressurized. 4. A solder mounting process for soldering and mounting electronic components such as package components and chip components on a circuit board, and at a desired position on the circuit board where the electronic components are soldered in the solder mounting process. An anisotropic conductive film attaching step of applying an anisotropic conductive film having a separator by applying pressure; and an elastic layer thicker than the height of the electronic component soldered and mounted in the soldering mounting step. The elastic roller and the circuit board are relatively moved while pressing the adhesive tape with the elastic roller provided in the above, and the anisotropic conductive film separator adhered in the anisotropic conductive film attaching step is adhered to the adhesive. A separator peeling step of transferring and peeling to a tape, and the separator is attached in the anisotropic conductive film sticking step, and the separator is separated in the separator peeling step. And a flip-chip connection mounting step of curing the anisotropic conductive film by pressing and heating the semiconductor chip on the separated anisotropic conductive film and flip-chip mounting the semiconductor chip. How to mount electronic components. 5. A solder mounting means for soldering and mounting an electronic component such as a package component or a chip component on a circuit board, and at a desired position on the circuit board where the electronic component is soldered by the solder mounting means. Anisotropic conductive film attaching means for applying an anisotropic conductive film having a separator by applying pressure; and pressing said adhesive tape with a deformable or displaceable member to relatively move said member and said circuit board, thereby making said anisotropic conductive film stick. A separator peeling means for transferring the separator of the anisotropic conductive film stuck on the anisotropic conductive film sticking means to the pressure-sensitive adhesive tape and peeling the separator; The anisotropic conductive film is cured by pressing and heating the semiconductor chip on the anisotropic conductive film from which Electronic component mounting system, characterized in that a flip-chip connection mounting means of flip-chip connecting implement conductor chip.