JP2018186191A - Component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting apparatus that can sufficiently neutralize static electricity for a component to be neutralized.SOLUTION: A component mounting apparatus 1 includes a neutralization unit 10 that neutralizes an electronic component M to be neutralized and a control device 11 that performs control of at least one of a second forward/static elimination process 15 for preliminarily moving an electronic component M to be neutralized before a predetermined time B1 of a component holding operation to perform static elimination, a buffer process 16 for moving the electronic component M to be neutralized to a static elimination station unit 200 to perform static elimination, and a stop process 17 for stopping the movement of a mounting head 51 for a third predetermined time E3 and performing static elimination on the electronic component M to be neutralized.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a component mounting apparatus, and more particularly, to a component mounting apparatus including a charge removal unit that discharges ions to a component to be discharged.

  2. Description of the Related Art Conventionally, there is known a component mounting apparatus including a static eliminator (static elimination unit) that emits ions to an electronic component (component) to be neutralized (for example, see Patent Document 1).

  The component mounting apparatus described in Patent Document 1 includes a base on which a board is disposed and a supply unit disposed on the side of the base. The supply unit includes a tape feeder that pitch-feeds a tape that holds electronic components (component supply tape), a transfer head (component mounting head) that picks up electronic components at the pickup position, and a tape from the upper side of the pickup position toward the tape. And a static eliminator (static elimination unit) that injects ionized air. The tape also has a main tape provided with a pocket for storing electronic components, and a top tape that covers the main tape and covers the pocket.

  In the component mounting apparatus described in Patent Document 1, when the electronic component in the pocket is sent to the pickup position by the tape feeder, it is exposed by peeling the top tape from the main tape. At this time, the ionized air sprayed from the static eliminator hits the electronic component in the pocket, so that the electronic component is neutralized. Thereby, the electric charge of an electronic component is neutralized and the damage of the electronic component resulting from electric discharge at the time of mounting an electronic component on a board | substrate with a transfer head is suppressed to some extent.

JP 2009-111413 A

  However, in the component mounting apparatus disclosed in Patent Document 1, the static eliminator is applied to the electronic component disposed in the pocket of the main tape in a short time until the electronic component is exposed from the tape and picked up by the transfer head. Since the ionized air jetted from the air is applied, there is a problem that the electronic parts are not sufficiently neutralized. If the electronic device is not sufficiently neutralized, damage to the electronic component due to the discharge cannot be sufficiently suppressed. For this reason, there is a demand for a component mounting apparatus capable of performing sufficient static elimination on a component to be eliminated.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to provide a component mounting apparatus capable of performing sufficient static elimination on a component to be eliminated. That is.

  In order to achieve the above object, a component mounting apparatus according to one aspect of the present invention includes a tape feeder including a component supply tape in which components to be mounted on a substrate are arranged, and holds the components arranged in the component supply tape, A head unit including a component mounting head to be mounted on the board, a static elimination unit that neutralizes the component to be eliminated by releasing ions, and a component to be eliminated held on the component supply tape for a certain period of time before the component holding operation. A first control for performing neutralization by moving forward and exposing a component to be neutralized; a second control for performing neutralization by moving the component to be neutralized from the tape feeder to the static elimination station by a component mounting head; In the state where the component to be neutralized is held by the component mounting head, the movement of the component mounting head is stopped for a predetermined time, and the component to be neutralized is neutralized. And a control unit for performing at least one control of the control.

  In the component mounting apparatus according to one aspect of the present invention, as described above, based on at least one control of the first control, the second control, or the third control for the components arranged in the component supply tape, It is comprised so that static elimination may be performed by the static elimination part. As a result, the static elimination / static elimination station portion by the first control is performed in a state where the static elimination target component held on the component supply tape is moved forward by a predetermined time before the component holding operation and the static elimination target component is exposed. Performing at least one of neutralization by the second control performed by moving the component to be neutralized, or by neutralization by the third control performed by stopping the movement of the component mounting head for a predetermined time. Can do. As a result, sufficient charge removal can be performed on the charge removal target parts arranged on the parts supply tape. Thereby, since static elimination is fully performed with respect to the component of static elimination object, damage to the component resulting from discharge can fully be suppressed.

  In the component mounting apparatus according to the above aspect, preferably, the control unit performs at least one of the first control, the second control, and the third control on the component to be neutralized mounted on the board. Control for mounting on the board is performed, and control for mounting on the board is performed without performing the first control, the second control, and the third control regarding the static elimination on the parts other than the parts to be neutralized. If comprised in this way, static elimination by a static elimination part will be performed only with respect to the component of static elimination object, and it can prevent that static elimination by a static elimination part is not performed to components which are not static elimination object. Thereby, since static elimination by a static elimination part is performed only to the components which need static elimination, it can suppress that work time increases compared with the case where static elimination by a static elimination part is performed with respect to all components.

  In this case, it is preferable that whether the first control, the second control, and the third control are performed can be set for each type of component. With this configuration, it is possible to set whether or not the user performs the first control, the second control, and the third control for each type of component, so the user needs to remove static electricity depending on the type of component. It is possible to select a static elimination method when performing static elimination.

  In the component mounting apparatus according to the above aspect, preferably, when the control unit performs the first control, immediately after holding the component to be neutralized by the component mounting head, the control unit forwards the next component to be neutralized to the holding position. Thus, by removing the next component to be neutralized from the component supply tape, the neutralization by the neutralization unit is performed before the component holding operation. If configured in this way, immediately after holding the component to be neutralized, the next component to be neutralized is advanced to the holding position, so the component is exposed from the component supply tape just before the component is held by the component mounting head. As a result, it is possible to neutralize a part to be neutralized for a longer time by the neutralization unit. As a result, it is possible to suppress an increase in work time of the component mounting apparatus and to perform static elimination for a sufficient time. Note that immediately after holding the parts to be neutralized, holding the parts to be neutralized by the component mounting head from the time when the parts to be neutralized by the component mounting head are held to the time when the parts to be neutralized are mounted on the board. The time point closer to the time point is shown.

  In the component mounting apparatus according to the above one aspect, preferably, a plurality of tape feeders each including a component supply tape are arranged, and the control unit is configured to determine whether the substrate is loaded in each of the plurality of tape feeders. The fourth control is carried out in such a manner that each part to be neutralized is moved forward to the holding position, and each part to be neutralized is exposed to perform neutralization by the neutralization unit. If comprised in this way, since the 4th control by a control part will be performed based on the board | substrate having been carried in, the order which mounts on the board | substrate in each of several tape feeders will carry forward the part of the static elimination object first. Thus, the charge removal by the charge removal unit can be performed. Thereby, it is possible to suppress an increase in the work time of the component mounting apparatus due to the static elimination of the first static elimination target component, and it is possible to sufficiently perform static elimination by the static elimination unit on the first static elimination target component.

  In the component mounting apparatus according to the one aspect described above, preferably, when performing the second control, the control unit applies a charge removal target to the charge removal station unit disposed at a position where ions emitted from the charge removal unit are more likely to hit than the tape feeder. It is configured to perform control to remove static electricity by moving these parts. With this configuration, it is possible to take out a part to be neutralized from the part supply tape and perform static elimination at a static elimination station outside the part supply tape. As a result, it is possible to neutralize the component to be neutralized by the neutralization unit more efficiently than the conventional method in which the neutralization is performed in a state where the component is housed in the component supply tape. In addition, the position where the ions discharged from the charge removal unit are easy to hit refers to a position where the wind blown from the discharge port of the charge removal unit from which ions are discharged.

  In the component mounting apparatus that performs the third control by the control unit, preferably, when performing the third control, the control unit places the component to be neutralized in a region where ions discharged from the neutralization unit are more likely to hit than the tape feeder. It is configured to perform control to remove electricity while moving the component mounting head in a stopped state. According to this configuration, it is possible to take out the component to be neutralized from the component supply tape, and remove the component to be neutralized by the static eliminator while the component mounting head is stopped outside the component supply tape. As a result, it is not necessary to remove the part to be neutralized by the mounting head and remove it again after removing the part to be neutralized from the component supply tape. Misalignment is less likely to occur. In addition, it is possible to more efficiently remove the component to be neutralized by the neutralization unit than the conventional method in which the neutralization is performed in a state where the component is stored in the component supply tape. In addition, the area | region where the ion discharge | released from a static elimination part is easy to hit shows the area | region where the wind which blows off from the discharge port of the static elimination part where ion is discharged | emits reaches.

  In the component mounting apparatus that performs the third control by the control unit, preferably, when performing the third control, the control unit places the component to be neutralized in a region where ions discharged from the neutralization unit are more likely to hit than the tape feeder. The component mounting head is moved so as to be stopped, and the control is performed so as to remove electricity while moving the component mounting head at a speed slower than that of the component not to be eliminated. By configuring in this way, it is possible to eliminate the charge removal target component without stopping the component mounting head in an area where ions discharged from the charge removal unit are likely to hit, thereby suppressing an increase in the work time of the component mounting apparatus. can do.

  The component mounting apparatus according to the above aspect preferably further includes a charge amount measuring unit that measures a charge amount of a component to be neutralized for which at least one of the first control, the second control, and the third control is performed. If comprised in this way, the charge removal amount by the charge removal part based on at least one of 1st control, 2nd control, and 3rd control will be performed by measuring the charge amount of the component of static elimination object by a charge amount measurement part. Can be confirmed more reliably. Thereby, the damage of the components by the electric discharge produced when mounting the component for static elimination on a board | substrate can be suppressed more reliably.

  According to the present invention, as described above, sufficient neutralization can be performed on a component to be neutralized.

It is the top view which showed the outline of the component mounting apparatus by 1st Embodiment of this invention. It is sectional drawing along the 100-100 line of FIG. It is the block diagram which showed the outline of the control apparatus of the component mounting apparatus by 1st Embodiment, 2nd Embodiment, and 3rd Embodiment of this invention. It is typical sectional drawing which showed the mode of the static elimination of the electronic component by the static elimination part of the component mounting apparatus by 1st Embodiment of this invention. It is a timing chart of static elimination using the static elimination part of the component mounting apparatus by 1st Embodiment of this invention. It is a flowchart of the component mounting process of the component mounting apparatus by 1st Embodiment of this invention. It is a flowchart of the 2nd advance / static elimination process of the component mounting apparatus by 1st Embodiment of this invention. It is the top view which showed the outline of the component mounting apparatus by 2nd Embodiment of this invention. It is sectional drawing along the 110-110 line | wire of FIG. It is a timing chart of static elimination using the static elimination part of the component mounting apparatus by 2nd Embodiment of this invention. It is a flowchart of the component mounting process of the component mounting apparatus by 2nd Embodiment of this invention. It is a sectional side view of the component mounting apparatus by 3rd Embodiment of this invention. It is a timing chart of static elimination using the static elimination part of the component mounting apparatus by 3rd Embodiment of this invention. It is a flowchart of the component mounting process of the component mounting apparatus by 3rd Embodiment of this invention. It is the top view which showed the outline of the component mounting apparatus by the 1st modification of this invention.

  Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

[First Embodiment]
With reference to FIGS. 1-7, the structure of the component mounting apparatus 1 by 1st Embodiment of this invention is demonstrated. In particular, in the first embodiment, an example in which the component mounting apparatus 1 exposes the next electronic component M from the tape 41 immediately after the electronic component M is attracted by the nozzle 51 a of the mounting head 51 will be described. The mounting head 51 is an example of the “component mounting head” in the claims. The electronic component M is an example of the “component” in the claims. The tape 41 is an example of the “component supply tape” in the claims.

(Configuration of component mounting device)
As shown in FIG. 1, the component mounting apparatus 1 is configured to mount an electronic component M on a substrate K by a mounting head 51 that can move in the horizontal direction. Specifically, the component mounting apparatus 1 includes a base 2, a pair of conveyors 3, a tape feeder 4, a head unit 5, a support portion 6, a pair of rail portions 7, a component recognition camera 8, A substrate recognition camera 9, a charge removal unit 10, and a control device 11 (see FIG. 3) are provided. Here, a direction in which the substrate K is conveyed by the pair of conveyors 3 is an X direction, a direction perpendicular to the X direction in the horizontal direction is a Y direction, and a direction perpendicular to the X direction and the Y direction is a Z direction. The control device 11 is an example of a “control unit” in the claims.

<Conveyor>
The pair of conveyors 3 extend in the transport direction (X direction) of the substrate K, and both ends of the substrate in the Y direction are placed on the respective upper ends of the pair of conveyors 3 to transport the substrate K in the X direction. The pair of conveyors 3 conveys the substrate K carried in from the X2 direction side to a predetermined work position. The pair of conveyors 3 carry out the worked substrate K to the X1 direction side after the work. Further, at the time of work, the substrate K is fixed at a predetermined position above the base 2 by a clamp mechanism.

<Tape feeder>
The tape feeder 4 is configured to supply the electronic component M mounted on the substrate K. Specifically, the tape feeder 4 includes a plurality of tapes 41, and a plurality of parts recognition cameras 8 are arranged in the X direction on the front side (Y2 direction side) and rear side (Y1 direction side) of the pair of conveyors 3. Two groups) are arranged side by side. Each of the plurality (four) of tape feeders 4 includes a tape 41 on which different types of electronic components M mounted on a substrate K such as an IC, a transistor, and a capacitor are arranged. Then, the tape feeder 4 intermittently supplies the electronic component M to a predetermined component supply position D1 in the vicinity of the pair of conveyors 3. As shown in FIG. 4, the tape 41 has a carrier tape 41b in which a storage pocket 41a for storing the electronic component M is formed, and a cover tape 41c for closing the storage pocket 41a. The component supply position D1 is an example of the “holding position” in the claims.

  As shown in FIG. 2, the tape feeder 4 holds a reel 42 around which a tape 41 shown in FIG. 4 holding a plurality of electronic components M with a predetermined interval is wound. The tape feeder 4 supplies the electronic component M from the tip (component supply position D1) by rotating the reel 42 and sending out the tape 41 on which the electronic component M is arranged. Each tape feeder 4 is electrically connected to the control device 11 (see FIG. 3) via a connector (not shown). Thereby, each tape feeder 4 sends out the tape 41 from the reel 42 based on the control signal from the control device 11. The tape feeder 4 includes a first tape feeder 4a disposed on one side (Y1 side) and a second tape feeder 4b disposed on the other side (Y2 side). Here, the first tape feeder 4a and the second tape feeder 4b have the same configuration, but the first tape feeder 4a and the second tape feeder 4b may have different configurations.

<Rail part>
As shown in FIG. 1, the rail portion 7 is configured to be able to move the support portion 6 in a direction (Y direction) perpendicular to the transport direction. Specifically, the pair of rail portions 7 are formed so as to extend in the Y direction, respectively. The pair of rail portions 7 are fixed to both ends of the base 2 in the X direction. Each of the pair of rail portions 7 includes a ball screw shaft 71 extending in the Y direction, a Y axis motor 72 provided on the ball screw shaft 71, and a guide rail 73. The Y-axis motor 72 rotates the corresponding ball screw shaft 71. The support portion 6 is attached to the ball screw shaft 71 via a ball nut. When the ball screw shaft 71 is rotated by the Y-axis motor 72, the support portion 6 extends in a direction (Y direction) perpendicular to the conveying direction along the pair of rail portions 7. Moving.

<Supporting part>
As shown in FIG. 1, the support unit 6 is configured to be able to move the head unit 5 in the transport direction (X direction). Specifically, the support portion 6 includes a ball screw shaft 61 extending in the X direction, an X axis motor 62 that rotates the ball screw shaft 61, and a guide rail 73 (not shown) extending in the X direction. The head unit 5 is attached to the ball screw shaft 71 via a ball nut, and moves in the transport direction (X direction) along the support portion 6 when the ball screw shaft 61 is rotated by the X-axis motor 62.

  With such a configuration, the head unit 5 is configured to be movable in the horizontal direction (X direction and Y direction) above the base 2. Thereby, the head unit 5 can move, for example, above the tape feeder 4 and suck the electronic component M supplied from the tape feeder 4. Further, the head unit 5 can be moved, for example, above the substrate K on the pair of conveyors 3 to mount the adsorbed electronic component M on the substrate K.

<Head unit>
As shown in FIG. 2, the head unit 5 is configured to perform the mounting operation of the electronic component M on the substrate K on the pair of conveyors 3. The head unit 5 is attached to the base 2 via a support portion 6 and a pair of rail portions 7. The head unit 5 is disposed above (Z1 direction) the pair of conveyors 3 and the tape feeder 4. The mounting operation is an operation in which the head unit 5 sucks the electronic component M supplied from the tape feeder 4 and mounts the sucked electronic component M on the substrate K.

  As shown in FIGS. 1 and 2, the head unit 5 includes a mounting head 51, a ball screw shaft 52, a Z-axis motor 53, and an R-axis motor 54 (see FIG. 4). A plurality of mounting heads 51 are arranged in a line in a straight line along the transport direction (X direction). The ball screw shaft 52 and the Z-axis motor 53 are provided in each of the plurality of mounting heads 51.

  The mounting head 51 is configured to suck the electronic component M disposed on the tape 41 and mount it on the substrate K. Specifically, as shown in FIG. 2, the mounting head 51 has a nozzle 51a attached to the tip (lower end). The mounting head 51 is configured to be able to suck and hold the electronic component M supplied from the tape feeder 4 by a negative pressure generated at the tip of the nozzle 51a by a negative pressure generator (not shown). In addition, the mounting head 51 is configured to be able to mount the electronic component M on the mounting surface of the substrate K by releasing the adsorption of the electronic component M by the positive pressure generated at the tip of the nozzle 51a by a positive pressure generator (not shown). Has been. The R-axis motor 54 is configured to rotate the mounting head 51 around the central axis (Z-axis) of the nozzle 51a.

  As shown in FIG. 2, the ball screw shaft 52 extends in the vertical direction. The Z-axis motors 53 rotate the corresponding ball screw shafts 52, respectively. The mounting head 51 is attached to the ball screw shaft 52 via a ball nut, and is movable up and down along the ball screw shaft 52 when the ball screw shaft 52 is rotated by the Z-axis motor 53.

<Parts recognition camera>
As shown in FIGS. 1 and 2, the component recognition camera 8 is configured to take an image of the electronic component M sucked by the nozzle 51a of the mounting head 51 from the lower side (Z2 direction) prior to mounting the electronic component M. ing. Specifically, the component recognition camera 8 is provided in the vicinity of the tape feeder 4 in the base 2.

<Board recognition camera>
As shown in FIG. 2, the board recognition camera 9 is configured to pick up an image of a position recognition mark attached to the board K from above (Z1 direction) prior to mounting the electronic component M. The position recognition mark is a mark for recognizing the position of the substrate K. Specifically, the substrate recognition camera 9 is provided at the lower end (Z2 direction) of the back surface (Y1 direction) of the head unit 5. The board recognition camera 9 can move in the horizontal direction (X direction and Y direction) above the base 2 together with the head unit 5.

<Staticizer>
As shown in FIGS. 2 and 4, the static elimination unit 10 is configured to neutralize the electronic component M to be neutralized by emitting positive and negative ions. Specifically, the static elimination unit 10 includes a pipe-shaped electrode casing 10b in which an ion emission port 10a is formed, an electrode needle 10c to which a high voltage current from an amplifier (not shown) is supplied, and wind in the electrode casing 10b. 10 d of sending air blowers. In the static elimination part 10, the positive / negative ion which generate | occur | produces by sending a high voltage electric current through the electrode needle | hook 10c and ionizing air is radiated | emitted from the ion discharge port 10a by the ventilation means 10d, and is hit | hung with the electronic component M. The static eliminator 10 includes a first ionizer 12 disposed above the tape feeder 4 on one side (Y1 side), and a second ionizer 13 disposed above the tape feeder 4 on the other side (Y2 side). It is out. Here, the 1st ionizer 12 and the 2nd ionizer 13 have the same structure.

<Control device>
As shown in FIG. 3, the control device 11 includes a CPU 11b (Central Processing Unit), a ROM 11c (Read Only Memory), a RAM 11a (Random Access Memory), and the like, and is configured to control the operation of the component mounting device 1. ing. Specifically, the control device 11 includes a pair of conveyors 3, a head unit 5, a support unit 6, a pair of rail units 7, a component recognition camera 8, a board recognition camera 9, a tape feeder 4, and a charge removal unit 10. Control is performed according to a program stored in advance. The RAM 11a of the control device 11 stores a program for executing a component mounting process 18 including a first advance / discharge process 14, a second advance / discharge process 15, a buffer process 16 and a stop process 17 which will be described later. ing.

(Component mounting process)
In the component mounting apparatus 1, as shown in FIG. 4, when the control device 11 executes a component mounting process 18, an ion released from the static elimination unit 10 is applied to the electronic component M that implements countermeasures against static electricity. The static elimination of the electronic component M is performed. Specifically, as illustrated in FIG. 5, the control device 11 detects the second component immediately after the first component M <b> 1 from the suction of the first component M <b> 1 among the plurality of electronic components M by the mounting head 51. During the mounting of the M2 on the substrate K by the mounting head 51, a time longer than the time N1 taken from the mounting of the first component M1 on the substrate K by the mounting head 51 to the suction of the second component M2 by the mounting head 51. 2 The second part M2 is configured to be exposed to the ions discharged from the static elimination unit 10 for a predetermined time E2.

  As described above, in the component mounting apparatus 1, the electric charge bias of the electronic component M is neutralized by the ions released from the static elimination unit 10, so that when mounting the electronic component M on the substrate K by the mounting head 51, The electronic component M is prevented from being discharged due to the uneven charge of the electronic component M, and the electronic component M is prevented from being damaged. As shown in FIG. 6, in the component mounting apparatus 1 of the first embodiment, the first advance / discharge process 14 and the second advance / charge process 15 are performed for the electronic component M that implements countermeasures against static electricity. Thus, the electronic component M is neutralized. Hereinafter, the first advance / discharge process 14 and the second advance / charge process 15 will be described. The electronic component M that implements countermeasures against static electricity is an example of the “component to be neutralized” in the claims. Further, the first forward / eliminating process 14 is an example of “fourth control” in the claims. The second forward / static elimination process 15 is an example of “first control” in the claims.

表１は、部品実装装置１に供給される電子部品Ｍを種類（部品Ａ、Ｂ）毎に分け、それぞれが、静電気対策を実施するか否か、第１先送り・除電処理１４を実施するか否かおよび第２先送り・除電処理１５を実施するか否かを表している。表１に示すように、制御装置１１は、基板Ｋに実装する複数種類の電子部品Ｍに対して、第１先送り・除電処理１４および第２先送り・除電処理１５のそれぞれを行なうか否かを電子部品Ｍの種類ごとに設定可能に構成されている。基板Ｋに実装する電子部品Ｍに対して、第１先送り・除電処理１４および第２先送り・除電処理１５を行なうか否かは、電子部品Ｍの耐電圧などのパラメータに基づいて、ユーザーが決定する。

Table 1 divides the electronic components M supplied to the component mounting apparatus 1 into types (components A and B), whether or not each implements countermeasures against static electricity, and whether or not the first post-feed / static discharge processing 14 is performed. And whether or not the second forward / static elimination process 15 is executed. As shown in Table 1, the control device 11 determines whether or not to perform each of the first advance / discharge process 14 and the second advance / discharge process 15 for a plurality of types of electronic components M mounted on the substrate K. It can be set for each type of electronic component M. The user decides whether or not to perform the first advance / discharge process 14 and the second advance / discharge process 15 on the electronic component M mounted on the substrate K based on parameters such as a withstand voltage of the electronic component M. To do.

  As shown in FIG. 6, the control device 11 uses the electronic component M (first component M1) that implements the first countermeasure against static electricity in the order of mounting on the substrate K based on the substrate K being carried in the tape feeder 4. ) To the holding position, the first part M1 is exposed, and the first advance / discharge process 14 is performed in which the charge removal unit 10 performs charge removal. Specifically, in the first advance / removal process 14, the first component M <b> 1 is converted into ions released from the charge removal unit 10 immediately after the substrate K is loaded and before the first component M <b> 1 in the mounting order is adsorbed. It has been exposed. Further, in the first advance / discharge process 14, it is possible to advance and move the plurality of electronic components M that implement the first countermeasure against static electricity in the tape feeder to the holding position.

  Here, in the conventional component mounting apparatus, the first component M1 can be neutralized by the neutralization unit only during the period from the suction by the mounting head to the mounting on the substrate K (indicated by a one-dot chain line) It is possible to perform static elimination by the static elimination unit for a first predetermined time E1 when the component M1 is loaded from the board K to the mounting of the first component M1 on the board K.

  As shown in FIGS. 5 and 6, the control device 11 has a constant suction operation of the mounting head 51 with respect to the electronic component M (second component M2) that implements countermeasures against static electricity immediately after the first component M1. Prior to time B1, the second part M2 held on the tape 41 is moved forward to perform the second forward / discharge process 15 in which the second part M2 is discharged while the second part M2 is exposed. Specifically, when performing the second advance / static discharge process 15, the control device 11 advances the next second component M2 to the component supply position D1 immediately after the mounting head 51 attracts the first component M1. The second component M2 is exposed from the tape 41, so that the static elimination unit 10 performs static elimination before the component adsorption operation. In this case, the control device 11 converts the second component M2 into ions previously released from the static elimination unit 10 at a time point between the adsorption of the first component M1 and the mounting of the first component M1 on the substrate K by the mounting head 51. It is configured to expose. The component suction operation is an example of the “component holding operation” in the claims. Also, immediately after the first component M1 is picked up by the mounting head 51, the time from the time when the first component M1 is picked up by the mounting head 51 to the time when the first component M1 is mounted on the substrate K is determined by the mounting head 51. The time point closer to the time point at which the first part M1 is picked up is shown.

  Here, in the conventional component mounting apparatus, the second component M2 can only be neutralized by the neutralization unit during the period from the suction by the mounting head to the mounting on the substrate K (indicated by a one-dot chain line), It is possible to perform static elimination by the static elimination unit for a second predetermined time E2 of mounting the second component M2 on the substrate K immediately after the component M1 is sucked.

(Flow chart of component mounting process)
Next, the component mounting process 18 of the electronic component M on the board K will be described with reference to FIG. The component mounting process 18 is performed by the control device 11. In the following, the electronic component M that is set to “perform” against static electricity, “perform” the first advance / removal process 14, and “perform” the second advance / removal process 15 will be described.

  In step S1, the control device 11 confirms whether or not the substrate K has been loaded. In step S <b> 2, the control device 11 confirms whether the electronic component M is a countermeasure against static electricity. Since the electronic component M is set to take measures against static electricity, the process proceeds to step S3. If the electronic component M is not subjected to countermeasures against static electricity, the process proceeds to step S7, and the mounting operation of the electronic component M is performed.

  In step S <b> 3, the control device 11 confirms whether or not the first advance / discharge process 14 is performed. Since the electronic component M is set to the first advance / discharge process 14, the process proceeds to step S4 and the first advance / discharge process 14 is performed. Here, in the first advance / discharge process 14, if there are a plurality of electronic components M that implement the first countermeasure against static electricity that is supposed to be the first advance / discharge process 14 in the tape feeder 4, The advance / discharge process 14 is performed. If the electronic component M is not to be subjected to the first advance / discharge process 14, the process proceeds to step S5.

  In step S <b> 5, the control device 11 confirms whether or not the second forward / static elimination process 15 is performed. Since the setting of the electronic component M is the second advance / discharge process 15, the process proceeds to step S <b> 6 and the second advance / discharge process 15 is performed. If the electronic component M is not to be subjected to the second advance / discharge process 15, the process proceeds to step S7.

  In step S <b> 7, the control device 11 causes the electronic component M to be mounted and causes the board K to mount the electronic component M. In step S8, the control device 11 confirms whether or not all the electronic components M have been mounted. If the mounting of all electronic components M has been completed, then the component mounting process is terminated, and if not completed, the process returns to step S5.

<Flowchart of second advance / discharge process>
Next, with reference to FIG. 7, the second advance / discharge process 15 will be described. The second advance / discharge process 15 is performed by the control device 11.

  In step S9, the control device 11 sucks the first component M1 exposed from the cover tape 41c. In step S10, the control device 11 confirms whether or not an electronic component M of the same type as the first component M1 is further mounted. When the electronic component M of the same type is further mounted, the controller 11 proceeds to step S11 after the first component M1 is sucked and before it is mounted, and the second component immediately after the first component M1. Postpone M2. When the electronic component M of the same type is not further mounted, the process proceeds to step S12, and the control device 11 does not postpone the second component M2, and thereafter ends the second prefeed / static elimination process 15.

[Effect of the first embodiment]
In the first embodiment, as described above, static elimination is performed on the electronic component M arranged in the tape 41 by the static elimination unit 10 based on the first advance / elimination process 14 and the second advance / electrification process 15. Is going. As a result, for the electronic component M that implements countermeasures against static electricity held on the tape 41, the first component M1 is discharged by the first advance / discharge process 14 and the component adsorption operation by the second advance / discharge process 15 is performed. It is possible to perform static elimination in a state where the second part M2 is exposed by being moved forward by a predetermined time B1. As a result, it is possible to perform sufficient static elimination on the electronic component M that implements countermeasures against static electricity arranged on the tape 41. Thereby, since static elimination is fully performed with respect to the electronic component M which implements a countermeasure against static electricity, damage to the electronic component M caused by discharge can be sufficiently suppressed.

  In the first embodiment, only the electronic component M for which countermeasures against static electricity are performed is neutralized by the neutralization unit 10, and the electronic component M that is not subjected to static countermeasures is not neutralized by the neutralization unit 10. be able to. Thereby, since static elimination by the static elimination part 10 is performed only to the electronic component M which needs static elimination, compared with the case where static elimination by the static elimination part 10 is performed with respect to all the electronic components M, it suppresses that work time increases. can do.

  In the first embodiment, since the user can set whether or not to perform the first advance / discharge process 14 and the second advance / discharge process 15, the user can remove the charge depending on the type of the electronic component M. It is possible to select a necessary electronic component M and a static elimination method for static elimination.

  Further, in the first embodiment, immediately after the electronic component M that implements the countermeasure against static electricity is picked up, the electronic component M that implements the next countermeasure against static electricity is postponed to the component supply position D1, so that the electronic component M is mounted by the mounting head 51. It is possible to remove the electronic component M, which is subjected to the countermeasure against static electricity for a longer time, by the static eliminator 10 than the conventional method in which the electronic component M is exposed from the tape 41 immediately before the suction. In addition, immediately after the suction of the electronic component M that implements the countermeasure against static electricity, the electronic component M that implements the next countermeasure against static electricity is postponed to the component supply position D1, thereby suppressing an increase in work time in the component mounting apparatus 1. Can do.

  Further, in the first embodiment, since the first advance / discharge process 14 is performed by the control device 11 based on the board K being carried in, the order of mounting on the board K in each of the plurality of tape feeders 4 is performed. However, it is possible to carry out the static elimination by the static elimination unit 10 by moving the electronic component M that implements the first countermeasure against static electricity. As a result, an increase in the work time of the component mounting apparatus 1 due to the static elimination of the electronic component M that implements the first countermeasure against static electricity is suppressed, and the neutralization unit 10 applies the electronic component M that implements the first countermeasure against static electricity. Charge removal can be performed sufficiently.

[Second Embodiment]
Next, a component mounting apparatus 201 according to the second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, unlike the first embodiment, the static elimination station unit 200 is arranged on the base 2.

  Hereinafter, a second embodiment of the present invention will be described with reference to the drawings.

(Configuration of component mounting device)
As shown in FIGS. 8 and 9, the component mounting apparatus 201 includes a static elimination station unit 200 disposed at a position H where ions emitted from the static elimination unit 10 are more likely to hit than the tape feeder 4. A plurality of (two) static elimination stations 200 are arranged between the one side (Y1 side) of the pair of conveyors 3 and the tape feeder 4 on one side (Y1 side) on the base 2. 210 is included. Further, a plurality of (two) static elimination station units 200 are disposed between the other side (Y2 side) of the pair of conveyors 3 and the tape feeder 4 on the other side (Y2 side) on the base 2. A static elimination station 220 is included. Here, the first static elimination station 210 and the second static elimination station 220 have the same configuration.

<Static elimination station>
The static elimination station unit 200 is configured so that the electronic component M taken out from the tape 41 can be temporarily placed on the upper surface. Specifically, the static elimination station unit 200 includes a tray 200a and a semiconductor sheet 200b placed on the tray 200a. The plurality of electronic components M taken out from the tape 41 are arranged on the semiconductor sheet 200b.

  Here, as shown in FIG. 9, the first static elimination station 210 is disposed in an emission region A <b> 1 indicated by a broken line that is easily hit by ions emitted from the first ionizer 12. The discharge region A1 indicates a region of ions discharged based on the opening angle θ1 of the ion discharge port 10a of the first ionizer 12 by the wind of the blower 10d. In the emission region A1, the vicinity of the central portion G1 of the opening angle θ1 of the ion emission port 10a is a position where ions are concentrated and easily hit, and is a position H1 where the ionization capability by ions is high. Here, the 1st static elimination station 210 is arrange | positioned rather than the front-end | tip part of the 1st tape feeder 4a at the center part G1 side of discharge | release area | region A1. Thereby, it is easier for the first static elimination station 210 to hit the ion than the first tape feeder 4a.

  In addition, the second static elimination station 220 is disposed in an emission region A2 indicated by a broken line that is easily hit by ions emitted from the second ionizer 13. The discharge region A2 indicates a region of ions discharged based on the opening angle θ2 of the ion discharge port 10a of the second ionizer 13 by the wind of the air blowing means 10d. In the emission region A2, the vicinity of the central part G2 of the opening angle θ2 of the ion emission port 10a is a position where ions are concentrated and easily hit by ions, and is a position H2 where the ionization capability by ions is high. Furthermore, the 2nd static elimination station 220 is arrange | positioned rather than the front-end | tip part of the 2nd tape feeder 4b at the center part G2 side of discharge | release area | region A2. Thereby, it is easier for the second static elimination station 220 to hit more ions than the second tape feeder 4b.

(Component mounting process)
In the component mounting apparatus 201, as shown in FIG. 11, when the control apparatus 11 executes the component mounting process 18, the electronic component M that takes measures against static electricity is applied with the ions released from the static elimination unit 10. The static elimination of the electronic component M is performed. Specifically, the control device 11 detects the first component M1 out of the plurality of electronic components M by the mounting head 51, so that the mounting order of the second component M2 immediately after the first component M1 is the substrate by the mounting head 51. During the mounting to K, during the third predetermined time E3 which is longer than the time N2 from the suction of the first component M1 by the mounting head 51 to the suction of the second component M2 by the mounting head 51, the first component M1 Is exposed to the ions released from the static elimination unit 10.

  In this way, in the component mounting apparatus 201, the bias of the electric charge of the electronic component M is neutralized by the ions released from the static elimination unit 10, so that when mounting the electronic component M on the substrate K by the mounting head 51, The electronic component M is prevented from being discharged due to the uneven charge of the electronic component M, and the electronic component M is prevented from being damaged. In the component mounting apparatus 201 according to the second embodiment, the electronic component M that implements countermeasures against static electricity is subjected to the first advance / removal process 14, the second advance / removal process 15, or the buffer process 16. The part M is neutralized. Hereinafter, the buffer process 16 will be described. The buffer processing 16 is an example of “second control” in the claims.

表２は、部品実装装置２０１に供給される電子部品Ｍを種類（部品Ｃ、Ｄ）毎に分け、それぞれが、静電気対策を実施するか否か、第１先送り・除電処理１４を実施するか否か、第２先送り・除電処理１５を実施するか否か、および、バッファ処理１６を実施するか否かを表している。表２に示すように、制御装置１１は、基板Ｋに実装する複数種類の電子部品Ｍに対して、第１先送り・除電処理１４、第２先送り・除電処理１５およびバッファ処理１６を行なうか否かを電子部品Ｍの種類ごとに設定可能に構成されている。基板Ｋに実装する電子部品Ｍに対して、第１先送り・除電処理１４、第２先送り・除電処理１５およびバッファ処理１６を行なうか否かは、電子部品Ｍの耐電圧などのパラメータに基づいて、ユーザーが決定する。

Table 2 divides the electronic components M supplied to the component mounting apparatus 201 into types (components C and D), and whether or not each implements countermeasures against static electricity or whether or not the first post-feed / static discharge processing 14 is performed. No, whether or not the second forward / static charge processing 15 is performed, and whether or not the buffer processing 16 is performed. As shown in Table 2, the control device 11 performs the first advance / removal process 14, the second advance / removal process 15 and the buffer process 16 on a plurality of types of electronic components M mounted on the substrate K. These can be set for each type of electronic component M. Whether or not to perform the first advance / discharge process 14, the second advance / discharge process 15 and the buffer process 16 on the electronic component M mounted on the substrate K is based on parameters such as a withstand voltage of the electronic component M. The user decides.

  As shown in FIG. 10 and FIG. 11, the control device 11 determines that the first component M1 that implements the first countermeasure against static electricity is mounted on the substrate K based on the substrate K being carried in the tape feeder 4. On the other hand, the first advance / discharge process 14 is performed. In addition, the control device 11 is configured to perform a buffer process 16 for moving the electronic component M for implementing countermeasures against static electricity from the tape feeder 4 to the static elimination station unit 200 by the mounting head 51. Specifically, the control device 11 applies the ions discharged from the static elimination unit 10 to the first component M1 (second component M2) placed in the static elimination station unit 200 for a predetermined time F1 or more.

  Here, as shown in FIG. 10, in the conventional component mounting apparatus, the first component M1 can only be neutralized by the neutralization unit during the period from the suction by the mounting head to the mounting on the substrate K (one-dot chain line). However, in the component mounting apparatus 201 of the second embodiment, the neutralization by the neutralization unit 10 is performed for the third predetermined time E3 of mounting the first component M1 on the substrate K immediately after the first component M1 is attracted. It is possible. In the conventional component mounting apparatus, the second component M2 can only be neutralized by the static eliminator (denoted by an alternate long and short dash line) during the period from the adsorption by the mounting head to the mounting on the substrate K (shown by a one-dot chain line). In the component mounting apparatus 201 of the embodiment, it is possible to perform the static elimination by the static elimination unit 10 for the fourth predetermined time E4 for mounting the second component M2 on the substrate K immediately after the second component M2 is sucked.

(Flow chart of component mounting process)
Next, the component mounting process 18 of the electronic component M on the board K will be described with reference to FIG. The component mounting process 18 is performed by the control device 11. In the following, the electronic component M that is set to “perform” for static electricity countermeasures, “perform” the first advance / removal process 14, “do not” the second advance / removal process 15, and “activate” the buffer process 16. An explanation will be given.

  In step S13, the control device 11 confirms whether or not the substrate K has been loaded. In step S <b> 14, the control device 11 confirms whether the electronic component M is a countermeasure against static electricity. Since the electronic component M is set to take measures against static electricity, the process proceeds to step S15. If the electronic component M is not a countermeasure against static electricity, the process proceeds to step S24, and the mounting operation of the electronic component M is performed.

  In step S <b> 15, the control device 11 confirms whether or not the first advance / discharge process 14 is performed. Since the electronic component M is set to the first advance / discharge process 14, the process proceeds to step S16 and the first advance / charge process 14 is performed. If the electronic component M is not to be subjected to the first advance / discharge process 14, the process proceeds to step S17.

  In step S <b> 17, the control device 11 confirms whether or not the second advance / static elimination process 15 is performed. Since the setting of the electronic component M is not performed by the second forward / eliminating process 15, the process proceeds to step S19. In the case of the electronic component M that performs the second advance / removal process 15, the process proceeds to step S <b> 18 and the second advance / removal process 15 is performed.

  In step S19, the control device 11 confirms whether or not the buffer processing 16 is to be performed. Since the electronic component M is set to be buffered 16, the process proceeds to step S20. If the electronic component M is not to be subjected to the buffer process 16, the process proceeds to step S24.

  In step S20, as the buffer process 16, the control device 11 sucks the electronic component M exposed from the cover tape 41c. In step S <b> 21, as a buffer process, the control device 11 places the sucked electronic component M at a predetermined place in the static elimination station unit 200.

  In step S <b> 22, the control device 11 confirms whether or not there is a space in the static elimination station unit 200. If there is a space in the static elimination station unit 200, the process proceeds to step S17. If there is no space in the static elimination station unit 200, the process proceeds to step S23. In step S23, the control device 11 checks whether or not the electronic component M is placed on the static elimination station unit 200 and the predetermined time F1 has elapsed. As a result, the electronic component M hits the ions discharged from the static elimination unit 10 on the static elimination station unit 200 for a predetermined time F1 or more. When the electronic component M is placed on the static elimination station unit 200 and the predetermined time F1 has elapsed, the process proceeds to step S24.

  In step S <b> 24, the control device 11 causes the electronic component M to be mounted and causes the board K to mount the electronic component M. In step S25, the control device 11 confirms whether or not all the electronic components M have been mounted. If the mounting of all the electronic components M has been completed, then the component mounting process is terminated. If not, the process returns to step S17. In addition, the other structure of 2nd Embodiment is the same as that of the said 1st Embodiment.

(Effect of 2nd Embodiment)
In the second embodiment, the following effects can be obtained.

  In the second embodiment, at least one of the first advance / removal process 14, the second advance / removal process 15, or the buffer process 16 is performed on the electronic component M that implements countermeasures against static electricity held on the tape 41. Can be done. As a result, it is possible to sufficiently remove static electricity from the electronic component M that is disposed on the tape 41 and that takes measures against static electricity. As a result, since the static elimination is sufficiently performed on the parts to be neutralized, it is possible to sufficiently suppress the damage of the electronic parts due to the discharge.

  In the second embodiment, whether or not to perform the first advance / discharge process 14, the second advance / discharge process 15 and the buffer process 16 can be set for each electronic component M. With this configuration, the user can set whether or not to perform the first advance / removal process 14, the second advance / removal process 15, or the buffer process 16. Thus, the user can select an electronic component M that needs to be neutralized and a static elimination method for performing static elimination.

  Further, in the second embodiment, the electronic component M to be subjected to static electricity countermeasures is taken out from the tape 41 and placed in the static elimination station unit 200 where ions emitted from the static elimination unit 10 are more likely to hit than the storage pocket 41a of the tape 41. Can do. As a result, the neutralization unit 10 can neutralize the electronic component M that implements countermeasures against static electricity more efficiently than the conventional method in which the neutralization is performed in a state where the electronic component M is stored in the storage pocket 41a of the tape 41. it can. The remaining effects of the second embodiment are similar to those of the aforementioned first embodiment.

[Third embodiment]
Next, a component mounting apparatus 301 according to a third embodiment of the present invention will be described with reference to FIGS. In the third embodiment, unlike the first embodiment and the second embodiment, the control device 11 stops the movement of the mounting head 51 while holding the electronic component M that takes measures against static electricity by the mounting head 51. Thus, the electronic component M taking countermeasures against static electricity is neutralized.

  Hereinafter, a third embodiment of the present invention will be described with reference to the drawings.

(Component mounting process)
In the component mounting apparatus 301, as shown in FIG. 14, when the control apparatus 11 executes the component mounting process 18, the ions released from the static elimination unit 10 are applied to the electronic component M that implements countermeasures against static electricity. The static elimination of the electronic component M is performed. Specifically, as illustrated in FIG. 13, the control device 11 performs the period from the loading of the substrate K to the mounting of the second component M2 on the substrate K by the mounting head 51 immediately after the first component M1. The first component M1 is discharged from the static elimination unit 10 for a fifth predetermined time E5 that is longer than the time N3 required from the mounting of the first component M1 by the mounting head 51 to the suction of the second component M2 by the mounting head 51. It is configured to be exposed to ions.

  As described above, in the component mounting apparatus 301, the charge bias of the electronic component M is neutralized by the ions released from the static elimination unit 10, so that when mounting the electronic component M on the substrate K by the mounting head 51, The electronic component M is prevented from being discharged due to the uneven charge of the electronic component M, and the electronic component M is prevented from being damaged. In the component mounting apparatus 301 according to the third embodiment, the first pre-feed / discharge process 14, the second pre-charge / discharge process 15, the buffer process 16 or the stop process 17 is performed on the electronic component M that implements countermeasures against static electricity. Thus, the electronic component M is neutralized. Hereinafter, the stop process 17 will be described. The stop process 17 is an example of “third control” in the claims.

  When performing the stop process 17, the control device 11 takes countermeasures against static electricity in a region A indicated by a broken line that is more likely to hit ions discharged from the static eliminator 10 than the tape feeder 4 as shown in FIGS. 12 and 13. The electronic component M to be moved is moved, and the control for discharging is performed while the mounting head 51 is stopped. Specifically, the control device 11 arranges the electronic component M adsorbed by the mounting head 51 in an emission region A1 indicated by a broken line that is easily hit by ions emitted from the first ionizer 12 for a certain time R1. . That is, the electronic component M attracted by the mounting head 51 is located near the upper end of the first tape feeder 4a and at the stop position W (first stop position W1) facing the ion emission port 10a of the first ionizer 12. Is arranged. Thereby, the electronic component M adsorbed by the mounting head 51 is more likely to be hit by the ions than the first tape feeder 4a. The control device 11 places the electronic component M attracted by the mounting head 51 for a certain period of time R1 in the emission region A2 indicated by a broken line that is easily hit by the ions emitted from the second ionizer 13. That is, the electronic component M attracted by the mounting head 51 is located near the upper end of the second tape feeder 4b and at a stop position W (second stop position W2) facing the ion emission port 10a of the second ionizer 13. Has been placed. Thereby, the electronic component M adsorbed by the mounting head 51 is more likely to be hit by the ions than the second tape feeder 4b.

表３は、部品実装装置３０１に供給される電子部品Ｍを種類（部品Ｅ、Ｆ）毎に分け、それぞれが、静電気対策を実施するか否か、第１先送り・除電処理１４を実施するか否か、第２先送り・除電処理１５を実施するか否か、バッファ処理１６、および、停止処理１７を実施するか否かを表している。表３に示すように、制御装置１１は、基板Ｋに実装する複数種類の電子部品Ｍに対して、第１先送り・除電処理１４、第２先送り・除電処理１５、バッファ処理１６および停止処理１７を行なうか否かを電子部品Ｍの種類ごとに設定可能に構成されている。基板Ｋに実装する電子部品Ｍに対して、第１先送り・除電処理１４、第２先送り・除電処理１５、バッファ処理１６および停止処理１７を行なうか否かは、電子部品Ｍの耐電圧などのパラメータに基づいて、ユーザーが決定する。

Table 3 divides the electronic components M supplied to the component mounting apparatus 301 by type (components E and F), and whether or not each implements countermeasures against static electricity or whether or not the first post-feed / static discharge processing 14 is performed. No, whether or not the second forward / static elimination process 15 is performed, whether or not the buffer process 16 and the stop process 17 are performed. As shown in Table 3, the control device 11 performs a first advance / discharge process 14, a second advance / charge process 15, a buffer process 16 and a stop process 17 for a plurality of types of electronic components M mounted on the substrate K. Whether or not to perform is set for each type of electronic component M. Whether or not to perform the first advance / discharge process 14, the second advance / discharge process 15, the buffer process 16 and the stop process 17 on the electronic component M mounted on the substrate K depends on the withstand voltage of the electronic component M, etc. The user decides based on the parameters.

  As shown in FIG. 14, the control device 11 performs the first mounting on the substrate K in the tape feeder 4 with respect to the first component M1 that implements the first countermeasure against static electricity based on the substrate K being loaded. The system is configured to perform one forward / static elimination processing 14. In addition, the control device 11 is configured to perform a stop process 17 that stops the movement of the mounting head 51 that is sucking the electronic component M that takes measures against static electricity. Specifically, the control device 11 causes the first component M1 to be released from the first ionizer 12 to the first component M1 at the first stop position W1.

  Here, as shown in FIG. 13, in the conventional component mounting apparatus, the first component M1 can be neutralized by the neutralization unit only during the period from the suction by the mounting head to the mounting on the substrate K (one-dot chain line). However, in the component mounting apparatus 301 of the third embodiment, from the execution of the first advance / discharge process to the fifth predetermined time E5 of mounting the first component M1 on the board K, the charge removal unit 10 performs the charge removal. Is possible. Further, in the conventional component mounting apparatus, the second component M2 can only be neutralized by the neutralization unit 10 during the period from the suction by the mounting head to the mounting on the substrate K (indicated by a one-dot chain line). In the component mounting apparatus 301 of the embodiment, it is possible to perform static elimination by the static elimination unit 10 for the sixth predetermined time E6 of mounting the second component M2 on the substrate K immediately after the second component M2 is attracted.

(Flow chart of component mounting process)
Next, the component mounting process 18 of the electronic component M on the board K will be described with reference to FIG. The component mounting process 18 is performed by the control device 11. In the following, it is assumed that the countermeasure against static electricity is “executed”, the first advance / removal process 14 is “performed”, the second advance / removal process 15 is “not performed”, the buffer process 16 is “not performed”, and the stop process 17 is “performed”. The set electronic component M will be described.

  In step S26, the control device 11 confirms whether or not the substrate K has been loaded. In step S <b> 27, the control device 11 confirms whether the electronic component M is a countermeasure against static electricity. Since the electronic component M is set to take measures against static electricity, the process proceeds to step S28. If the electronic component M is not subjected to countermeasures against static electricity, the process proceeds to step S37, and the mounting operation of the electronic component M is performed.

  In step S <b> 28, the control device 11 confirms whether or not to implement the first advance / discharge process 14. Since the electronic component M is set to the first advance / discharge process 14, the process proceeds to step S29 and the first advance / discharge process 14 is performed. If the electronic component M is not to be subjected to the first advance / discharge process 14, the process proceeds to step S30.

  In step S <b> 30, the control device 11 confirms whether or not the second advance / static elimination process 15 is performed. Since the setting of the electronic component M is not performed by the second forward / eliminating process 15, the process proceeds to step S32. In the case of the electronic component M that performs the second advance / removal process 15, the process proceeds to step S <b> 31 and the second advance / removal process 15 is performed.

  In step S <b> 32, the control device 11 confirms whether or not to execute the buffer process 16. Since the setting of the electronic component M is not the buffer process 16, the process proceeds to step S39. In the case of the electronic component M that performs the buffer process 16, the process proceeds to step S33.

  In step S39, the control device 11 confirms whether or not the stop process 17 is to be performed. Since the electronic component M is set to stop processing 17, the process proceeds to step S40. If the electronic component M is not subject to the stop process 17, the process proceeds to step S37.

  In step 40, the control device 11 sucks the electronic component M exposed from the cover tape 41 c as the stop process 17. In step S <b> 41, the control device 11 moves the sucked electronic component M to the stop position W as the stop process 17. In step S <b> 42, as the stop process 17, the control device 11 confirms whether or not a predetermined time R <b> 1 has elapsed at the stop position W. In step S <b> 42, as the stop process 17, the control device 11 applies the ions emitted from the charge removal unit 10 to the electronic component M arranged at the stop position W until a predetermined time R <b> 1 elapses. When the ions discharged from the static eliminating unit 10 are applied to the electronic component M arranged at the stop position W until the predetermined time R1 elapses, the process proceeds to step S37.

  In step S <b> 37, the control device 11 causes the electronic component M to be mounted and causes the board K to mount the electronic component M. In step S38, the control device 11 confirms whether or not all the electronic components M have been mounted. If the mounting of all the electronic components M has been completed, then the component mounting process is terminated. If not, the process returns to step S30. The remaining configuration of the third embodiment is similar to that of the aforementioned first embodiment.

(Effect of the third embodiment)
In the third embodiment, the following effects can be obtained.

  In the third embodiment, the electronic component M arranged in the tape 41 is based on at least one of the first advance / discharge process 14, the second advance / discharge process 15, the buffer process 16 or the stop process 17. Thus, static elimination is performed by the static elimination unit 10. As a result, the electronic component M to be subjected to static electricity countermeasures held by the tape 41 is subjected to static electricity removal by the first forward / static discharge processing 14, and static elimination by the second forward / static electricity removal processing 15. At least one of neutralization by the buffer process 16 or neutralization by the stop process 17 can be performed. As a result, since sufficient static elimination is performed on the electronic component M that is disposed on the tape 41 and that takes measures against static electricity, damage to the electronic component M due to discharge can be sufficiently suppressed.

  Whether or not to perform the first advance / discharge process 14, the second advance / discharge process 15, the buffer process 16 and the stop process 17 can be set for each electronic component M. This allows the user to set whether or not to perform the first advance / removal process 14, the second advance / removal process 15, the buffer process 16 and the stop process 17, so that the user can select the user according to the type of electronic component M. However, it is possible to select an electronic component M that needs to be neutralized and a static elimination method that eliminates static electricity.

  Further, in the third embodiment, the electronic component M that takes countermeasures against static electricity is taken out from the tape 41, and in the discharge areas A <b> 1 and A <b> 2 where the ions discharged from the static elimination unit 10 are more likely to hit than the tape feeder 4, The electronic component M that implements countermeasures against static electricity can be neutralized. As a result, it is possible to neutralize the electronic component M that implements countermeasures against static electricity more efficiently than the conventional technique in which static elimination is performed in a state where the electronic component M is stored in the tape 41. Moreover, in the stop process 17, since it is not necessary to re-suck the electronic component M, the position shift of the electronic component M at the time of mounting on the board | substrate K can be suppressed. The remaining effects of the third embodiment are similar to those of the aforementioned first embodiment.

(Modification)
The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiment but by the scope of claims for patent, and further includes all modifications (modifications) within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first embodiment, the control device 11 performs at least one of the first advance / discharge process 14 and the second advance / discharge process 15, but the present invention is not limited to this. In the present invention, the control device may perform at least one of the first advance / removal process and the buffer process, or may perform at least one of the first advance / removal process and the stop process.

  Moreover, in the said 2nd Embodiment, although the control apparatus 11 has combined the 1st advance / discharge process 14, the 2nd advance / charge process 15, and the buffer process 16, this invention is not limited to this. In the present invention, the control device may combine the first advance / removal process, the second advance / removal process, and the stop process.

  In the second embodiment, a plurality of first static elimination stations 210 are arranged between one side (Y1 side) of the pair of conveyors 3 and the tape feeder 4 on one side (Y1 side). The invention is not limited to this. For example, the first static elimination station may be disposed above one side (Y1 side). Moreover, although the 2nd static elimination station 220 is arrange | positioned between the tape feeder 4 of the other side (Y2 side) and the other side (Y2 side) of a pair of conveyor 3, this invention is not limited to this. . For example, the second static elimination station may be disposed above the other side (Y2 side).

  In the first to third embodiments, the electronic component M that implements countermeasures against static electricity includes the first predetermined time E1, the second predetermined time E2, the third predetermined time E3, the fourth predetermined time E4, and the fifth. The static elimination unit 10 performs static elimination for the predetermined time E5 or the sixth predetermined time E6, but the present invention is not limited to this. In the present invention, as shown in FIG. 15, the component mounting apparatus 1 includes a charge amount measurement unit 401 that measures the charge amount of the electronic component M, and based on the charge amount of the electronic component M measured by the charge amount measurement unit 401. The neutralization by the neutralization unit 10 may be performed. Here, the charge amount measuring unit 401 is a non-contact type surface potential meter that measures a potential as a charge amount. Thus, the charge amount measuring unit 401 measures the charge amount of the electronic component M for which countermeasures against static electricity are performed, so that the first advance / discharge process 14, the second advance / discharge process 15, the buffer process 16 and the stop process 17 are performed. It can be confirmed more surely whether or not the charge removal unit 10 based on at least one of the charge removal is performed. Thereby, the damage of the electronic component M by the electric discharge which arises when mounting the electronic component M which implements a countermeasure against static electricity on the board | substrate K can be suppressed more reliably.

  Moreover, in the said 1st Embodiment-3rd Embodiment, after the control apparatus 11 confirmed whether the attracted electronic component M was further required, when the attracted electronic component M was no longer needed, it was attracted | sucked. Although the tape feeder 4 on which the electronic component M is arranged is configured not to be fed, the present invention is not limited to this. For example, after confirming whether or not the sucked electronic component is further necessary, the control device waits for the tape feeder on which the electronic component is arranged until the next board is loaded after confirming whether the sucked electronic component is further necessary. You may comprise.

  Moreover, in the said 1st Embodiment-3rd Embodiment, although the setting of components A, B, C, D, E, and F is performed by the user, this invention is not limited to this. In the present invention, the control device may automatically set based on parameters such as the withstand voltage of the electronic component.

  Moreover, in the said 1st Embodiment-3rd Embodiment, in the 2nd forward feed and static elimination process 15, among the several electronic components M arrange | positioned at the tape 41, the upstream immediately in the tape feed direction of the 1st component M1. However, the present invention is not limited to this. In the present invention, the second component immediately after the first component in the mounting order arranged on a different tape may be advanced.

  Moreover, in the said 2nd Embodiment and 3rd Embodiment, although the 1st static elimination station 210 is multiply arranged (2 pieces) on the base 2, this invention is not limited to this. For example, one or three or more first static elimination stations may be disposed on the base 2. In addition, a plurality (two) of the second static elimination stations 220 are arranged on the base 2, but the present invention is not limited to this. For example, one or three or more second static elimination stations may be arranged on the base 2.

  Moreover, in the said 3rd Embodiment, although the electronic component M is arrange | positioned in the 1st stop position W1 of the upper vicinity of the front-end | tip part of the 1st tape feeder 4a, this invention is not limited to this. In the present invention, the electronic component may be anywhere as long as the ions from the first ionizer are easy to hit. The electronic component M is disposed at the second stop position W2 in the vicinity of the upper portion of the tip of the second tape feeder 4b, but the present invention is not limited to this. In the present invention, the electronic component may be anywhere as long as the ions from the second ionizer are easy to hit.

  In the third embodiment, the electronic component M attracted to the mounting head 51 is stopped at the stop position W in the stop process 17, but the present invention is not limited to this. In the present invention, the electronic component attracted to the mounting head may be rotated by the R-axis motor at the stop position.

  Moreover, in the said 2nd Embodiment, although the control apparatus 11 has put the adsorbed electronic component M in the predetermined place of the static elimination station part 200, this invention is not limited to this. For example, the control device may arrange the adsorbed electronic components in a vacant space on the static elimination station unit using a substrate recognition camera.

  Moreover, in the said 1st Embodiment-3rd Embodiment, although the four tape feeders 4 are arrange | positioned on the base 2, this invention is not limited to this. For example, 1-3 or 5 or more tape feeders may be arranged.

  In the third embodiment, the control device 11 stops the movement of the mounting head 51 in a state where the mounting head 51 holds the electronic component M that takes measures against static electricity. However, the present invention is not limited to this. In the present invention, the control device may be configured to perform control to remove static electricity while preventing the mounting head from moving and moving the mounting head at a slower speed than components not taking static electricity countermeasures. As a result, in a region where ions discharged from the static elimination unit are likely to hit, it is possible to eliminate static electricity from a component that takes measures against static electricity without stopping the mounting head, thereby suppressing an increase in the working time of the component mounting apparatus. .

  In the above embodiment, for convenience of explanation, the processing operation of the control device 11 has been described using a flow-driven flowchart that performs processing in order along the processing flow, but the present invention is not limited to this. In the present invention, the processing operation of the control device may be performed by event-driven (event-driven) processing that executes processing in units of events. In this case, it may be performed by a complete event drive type or a combination of event drive and flow drive.

1, 201, 301 Component mounting device 4 Tape feeder 10 Static elimination unit 11 Control device (control unit)
14 First advance / charge removal process (4th control)
15 Second advance / charge removal process (first control)
16 Buffer processing (second control)
17 Stop processing (third control)
41 tape (component supply tape)
51 Mounting head (component mounting head)
200 Static elimination station B1 Fixed time M Electronic parts (parts)
M1 first part (part)
M2 Second part (parts)
K substrate

Claims (9)

A tape feeder including a component supply tape in which components to be mounted on a substrate are arranged;
A head unit including a component mounting head for holding the component arranged on the component supply tape and mounting the component on the substrate;
A static elimination unit that neutralizes the component to be neutralized by releasing ions; and
A first control for performing charge removal in a state where the component to be neutralized is moved forward by moving the component to be neutralized held on the component supply tape a predetermined time before the component holding operation; and the component mounting head To move the component mounting head while holding the component to be neutralized by the component mounting head by moving the component to be neutralized from the tape feeder to the static elimination station. A component mounting apparatus comprising: a control unit that stops at a predetermined time and performs at least one control of a third control that performs static elimination on the component to be neutralized.   The control unit performs control for mounting on the board after performing at least one of the first control, the second control, or the third control on the part to be neutralized mounted on the board. And performing control for mounting on the substrate without performing the first control, the second control, and the third control related to static elimination on the components other than the static elimination target components. The component mounting apparatus described.   The component mounting apparatus according to claim 2, wherein whether or not to perform the first control, the second control, and the third control can be set for each type of the component.   When the first control is performed, the control unit advances the next part to be neutralized to the holding position immediately after holding the part to be neutralized by the component mounting head, and The component mounting apparatus according to any one of claims 1 to 3, wherein a component is exposed from the component supply tape, and is configured to perform neutralization by the neutralization unit before the component holding operation. . A plurality of the tape feeders each including the component supply tape are arranged,
In each of the plurality of tape feeders, the control unit moves forward each of the parts to be neutralized to the holding position based on the fact that the board is carried in, in the order of mounting on the board. 5. The component mounting apparatus according to claim 1, wherein the component mounting apparatus is configured to perform a fourth control in which each of the components to be neutralized is exposed to perform neutralization by the neutralization unit.   When performing the second control, the control unit moves the parts to be neutralized to the static elimination station unit arranged at a position where ions emitted from the static elimination unit are more likely to hit than the tape feeder, thereby eliminating static electricity. The component mounting apparatus according to claim 1, wherein the component mounting apparatus is configured to perform control.   When performing the third control, the control unit moves the component to be neutralized to a region where ions discharged from the neutralization unit are more likely to hit than the tape feeder, and stops the component mounting head. The component mounting apparatus according to any one of claims 1 to 3, wherein the component mounting apparatus is configured to perform control of discharging in a state.   When performing the third control, the controller does not stop the component mounting head by moving the component to be neutralized to a region where ions discharged from the neutralization unit are more likely to hit than the tape feeder. The component mounting apparatus according to any one of claims 1 to 3, wherein the component mounting apparatus is configured to perform control of discharging while moving at a speed slower than that of the component that is not to be discharged.   The charge amount measuring unit according to claim 1, further comprising a charge amount measurement unit that measures a charge amount of the part to be neutralized, which has performed at least one of the first control, the second control, and the third control. The component mounting apparatus according to the item.

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