JP2002204098A - Surface mounting machine - Google Patents

Abstract

(57) [Problem] To provide a surface mounter that can reliably remove even minute static electricity and reliably perform surface mounting without restricting the operation of a head unit or the like. A conveyor, a component supply unit, a head unit, and the like are provided in a housing. An ionizer 30 for discharging ions from a discharge electrode needle is provided on the inner wall surface of the opening / closing cover 22 of the housing. The components that have been adsorbed from the component supply unit by the head are transferred to the substrate 3 transported to the mounting work position, and ions (charges) are discharged from the ionizer 30 toward the space 23 where the components are mounted. The static electricity charged on the substrate or the like is neutralized by ions and removed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounter configured to adsorb an electronic component by a head unit and mount it at a predetermined position on a substrate such as a printed circuit board.
In particular, the present invention relates to a surface mounter capable of removing charged static electricity.

[0002]

2. Description of the Related Art Conventionally, a head unit having a mounting head sucks a component such as an IC from a component supply unit.
2. Description of the Related Art A surface mounter configured to be transferred onto a printed circuit board positioned at a predetermined mounting work position and mounted at a predetermined position on the printed circuit board is generally known.

[0003] In such a surface mounter, it is considered that static electricity that causes a problem cannot be originally generated because each element constituting the device has conductivity.

[0004]

However, since the above-mentioned parts are extremely small, it is considered that a problem may occur even with minute static electricity. That is,
When the component supply unit causes the head to perform the suction operation, the presence of minute static electricity may cause the component to start up, causing a suction error or causing damage to the component itself.

To cope with this, it is conceivable to remove some static electricity by bringing a conductor into contact with a portion where static electricity may be charged. However, if such a conductor is brought into contact, a head unit or the like is considered. Will be restricted, and the degree of freedom of layout will be impaired in configuring the device.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and it is an object of the present invention to reliably remove minute static electricity without restricting the operation of a head unit or the like. To provide a surface mounting machine capable of reliably performing surface mounting.

[0007]

In order to achieve the above object, a surface mounter according to the present invention comprises a conveying means for conveying a substrate to a mounting work position, and a component supply for supplying components to be mounted on the substrate. Unit, a head unit for picking up a component from the component supply unit and mounting it on the board at the mounting work position, and a non-contact state of static electricity charged on at least one of the substrate, the component supply unit and the head unit And a static elimination means for removing the electric charge.

According to this surface mounter, any one of the substrate, the component supply unit, and the head unit is operated by the static elimination means.
Since the static electricity charged as described above can be removed, the components can be reliably mounted on the substrate. In addition, since static electricity is eliminated by the static elimination means in a non-contact state, there is no restriction on the pick-up operation and mounting operation of components by the head unit and the like, and the head unit and the component supply unit and the like are not restricted. There is no hindrance to the layout flexibility.

The static eliminator may neutralize static electricity by discharging electric charges, and the static eliminator is disposed facing a space where at least one of the substrate, the component supply unit and the head unit exists. What should I do? This makes it possible to specifically and reliably realize static electricity elimination in a non-contact state. As a specific arrangement of the static elimination means in such a case, a housing for covering the mounting position, the component supply unit and the head unit is provided, and the static elimination means is arranged on the inner wall surface of the housing. Just fine. This makes it possible to specifically specify the disposition portion of the static elimination means, and to make the disposition not surely restricting the operation of the head unit and the like. Further, as an arrangement of the static elimination means with respect to the housing, the housing includes an opening / closing cover,
The static elimination means may be provided on the inner wall surface of the open cover. With this configuration, since the opening / closing cover is attached to the housing so as to be openable and closable,
It is sufficient to dispose the static elimination means on the opening / closing cover which is separate from the main body of the housing, so that the disposition and adjustment of the static elimination means can be easily performed.

Further, by disposing the static elimination means so that electric charges are discharged to both the component mounting position of the substrate and the component supply section, the component supply section can pick up components by the head unit, At the time of transfer by the head unit to the mounting work position of the picked up parts,
Static electricity can be removed at all times when the component is mounted on the board at the mounting work position, and surface mounting processing on the board can be reliably performed.

[0011]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view schematically showing an embodiment of a surface mounter according to the present invention with a housing 21 described later being omitted. In FIG. 1, a substrate transport conveyor 2 is arranged on a base 1, and a printed circuit board 3 as a substrate is transported from the right side to the left side in FIG. It stops at the position (indicated by the two-dot chain line).

A component supply section 4 is arranged on the side of the conveyor 2. The component supply section 4 includes, for example, a plurality of rows of tape feeders 4a, and can sequentially supply a large number of components stored on the tape.

A head unit 5 for mounting components is mounted above the base 1 so that the head unit 5 can pick up (adsorb) components from the component supply unit 4 and mount them on the printed circuit board 3. In addition, it is driven so as to be movable in an X-axis direction (a direction in which the conveyor 2 extends) and a Y-axis direction (a direction orthogonal to the X-axis on a horizontal plane).

More specifically, a pair of guide rails 6 extending in the Y-axis direction are provided on the base 1, and a head unit support member 7 extending on the guide rails 6 in the X-axis direction.
Has been erected. This head unit support member 7
A ball screw shaft 9 in the Y-axis direction is screwed through a nut portion 8, and the ball screw shaft 9 is connected to a Y-axis servo motor 10.
Connected to the rotating shaft.

The head unit supporting member 7 includes a guide member extending in the X-axis direction and the ball screw shaft 1 in the X-axis direction.
The head unit 5 is movably supported by the guide member, and a nut 12 provided on the head unit 5 is screwed to the ball screw shaft 11. The ball screw shaft 11 is supported by a proximal bearing member 16 provided at the right end of FIG. 1 and a distal bearing member 17 provided at the left end of FIG.
X-axis servo motor 1
The drive 3 rotates around the axis.

Thus, the head unit supporting member 7 is driven in the Y-axis direction via the ball screw shaft 9 by the Y-axis servo motor 10, and the head unit 5 is driven by the X-axis servo motor 13 via the ball screw shaft 11. Driving in the X-axis direction is performed.

The head unit 5 is mounted with one or more (three in FIG. 1) mounting heads 15 for picking up components and mounting them on a substrate. The head 15 is driven in a vertical direction (Z-axis direction) by an elevating mechanism using a Z-axis servo motor (not shown) as a drive source, and similarly, by a rotary drive mechanism using an R-axis servo motor (not shown) as a drive source. It is designed to be driven in the rotation direction (R-axis direction). Each of the heads 15 has a suction nozzle as a component suction section detachably mounted at the tip thereof, and suctions a component by a negative pressure supplied to each nozzle, and suctions a component by a positive pressure supply. Parts that had been removed. In FIG. 1, reference numeral 18 denotes a camera for component recognition.

FIG. 2 is a partially omitted cross-sectional explanatory view taken along line AA of FIG. 1. In FIG. 2, reference numeral 21 denotes a housing of the surface mounter.

The housing 21 includes the base 1 described above,
The conveyor 2, the component supply unit 4, the head unit 5, and the like provided on the base 1 are accommodated therein. One end in the X-axis direction (a direction orthogonal to the plane of FIG. 2) is used as an upstream device. Connected, and the other end is connected to a downstream device.
Then, the substrate 3 sent from the upstream device is conveyed by the conveyor 2 and stopped at the mounting work position, where the components picked up from the component supply unit 4 by the head 15 of the head unit 5 are mounted at the mounting work position. After the mounting process, the substrate 3 is sent out to the downstream device from the outlet at the other end in the X-axis direction.

One or two or more opening / closing covers 22 are attached to the housing 21 at an upper position of the component supply section 4 so as to be openable and closable. An ionizer (charge emitter) 30 is provided as a means. 2 and 3 illustrate the case where the open / close cover 22 is disposed at both sides in the Y-axis direction, respectively, and 221 in FIG. 3 denotes a handle for opening / closing the open / close cover 22.

The ionizer 30 includes one or more (two in the illustrated example) pipe-shaped electrode casings 31, 31.
And an amplifier 32 for supplying a high voltage current, and a power supply line 3 from the amplifier 32 to each electrode needle 34 described later.
3 is provided. And the ionizer 30
Emits positive and negative ions toward the internal space 23 of the housing 21 to neutralize the charged static electricity.

More specifically, both ends of the electrode casing 31 are closed and the ion emission ports 3 are provided at predetermined intervals in the longitudinal direction.
11 (see FIGS. 4 and 5) are formed to penetrate so as to open in a predetermined direction, and an electrode needle 34 for discharge is disposed in the ion emission port 311. The above-mentioned ion discharge port 311
Are opened obliquely to both the component supply part 4 and the substrate 3 at the mounting position so as to release ions through the ion discharge port 311 so as to face both the electrodes 4 and 3. A needle 34 is supported. Accordingly, when static electricity is charged on the component supply unit 4 and the substrate 3, etc., even if it is minute, the static electricity is applied to the electrode needle 3
4 is neutralized and removed by the ions discharged through the ion discharge port 311. For example, if the charged static electricity is positive (+) charge, it is neutralized by negative (−) charge ions.

In addition, air may be supplied into the electrode casing 31 in order to promote the release of the ions, and the air may be released together with the ions from the respective ion storage / release ports 311.

As described above, since ions are emitted from the ionizers 30 on both sides toward the component supply unit 4 and the board 3 at the mounting work position, not only the component supply unit 4 and the board 3 but also the component supply unit 4 Housing 2 which is a moving space of head unit 5 which moves between substrate 3 and mounting.
The whole of the internal space 23 is filled with ions. For this reason, the component supply unit 4, the substrate 3, and the head 1
Even if static electricity is generated in 5 etc., the static electricity is neutralized by the ions and is reliably removed.

Therefore, it is possible to reliably prevent a component mounting error of the component mounting head 15 of the head unit 5 and a mounting error of the substrate 3 from occurring. In addition, since static electricity can be removed by the ionizer 30 in a non-contact state, the ionizer 30 is particularly suitable for any of the movement of the head 15 and the head unit 5, the component supply operation by the component supply unit 4, and the substrate transport operation by the conveyor 2. No hindrance. In addition, since such an ionizer 30 is arranged on the opening / closing cover 22 of the housing 21, the arrangement can be performed extremely easily, and also the existing surface mounter can be installed. It can be attached very easily.

FIGS. 6 and 7 show another type of ionizer 30a which is different from the above-described ionizer 30 as the charge removing means.
Is shown, and the same operation and effect as when the above-described ionizer 30 is used can be obtained also in the case of this embodiment.

The ionizer 30a includes a gun-type electrode casing 31a, an amplifier 32 similar to the ionizer 30, and a power supply line (not shown). The electrode casing 31a is provided with a discharge electrode needle (not shown) which is disposed forward and is disposed on the inner wall surface of the opening / closing cover 22 via a bracket 35 as shown in FIG. It is attached to each position at predetermined intervals. The electrode casing 31a is disposed in such a direction as to release ions toward both the component supply unit 4 and the board 3 at the mounting position, similarly to the ionizer 30, by the bracket 35. .

The present invention is not limited to the above embodiment, but includes various other embodiments. That is, in the above-described embodiment, the case where the static eliminator is disposed on the open / close cover 22 is shown. However, the present invention is not limited to this, and the static eliminator may be disposed on the housing 21 other than the open / close cover 22. Further, it may be supported on the base 1 side so as to be disposed at a position outside the movement range of the head unit 5 as well as the housing 21, or may be suspended from the housing 21.

In addition, the static elimination means can be arranged in another device of the mounting line in addition to the surface mounter. In this case, the static elimination means can be arranged at any position in the range from the loader to the unloader of the mounting line. Good.

[0031]

As described above, according to the surface mounter of the present invention, static electricity charged on at least one of the substrate, the component supply unit and the head unit can be reliably removed by the static elimination means. Surface mounting processing for mounting components on a substrate can be reliably performed. In addition, since static electricity is eliminated by the static elimination means in a non-contact state, restrictions are imposed on the pick-up operation and mounting operation of the components by the head unit, and there is an obstacle to the degree of freedom of layout of the head unit and the component supply unit. Can be avoided.

In the present invention, if the static elimination means is disposed facing a space where at least one of the substrate, the component supply section and the head unit is present, static electricity elimination in a non-contact state can be specifically and reliably realized. it can. Further, if the static elimination means is arranged on the inner wall surface of the housing of the surface mounter, it is possible to ensure that the operation of the head unit or the like is not restricted. Furthermore, if the static elimination means is arranged on the inner wall surface of the cover, the static elimination means can be easily arranged and adjusted.

Further, if the static elimination means discharges electric charges toward both the component mounting position of the substrate and the component supply section, when the head unit picks up the component at the component supply section, the pick-up is performed. The effect of static electricity in all operations during the transfer of the component to the mounting position and the mounting of the component on the substrate at the mounting position can be reliably eliminated, and the surface mounting process on the substrate can be further improved. It can be performed reliably.

[Brief description of the drawings]

FIG. 1 is a partially omitted plan view schematically showing an embodiment of the present invention.

FIG. 2 is an explanatory cross-sectional view taken along a line AA of FIG. 1;

FIG. 3 is a partially omitted side view of FIG. 2;

FIG. 4 is a partially enlarged view of FIG. 2;

FIG. 5 is a partially enlarged explanatory view taken along line BB of FIG. 4;

FIG. 6 is a diagram corresponding to FIG. 2, showing another embodiment.

FIG. 7 is a partially omitted side view of FIG. 6;

[Description of Signs] 2 Conveyor (conveying means) 3 Printed circuit board (board) 4 Component supply unit 15 Head 21 Housing 22 Opening / closing cover 23 Internal space (Space) 30, 30a Ionizer (Static electricity removing means)

Claims (5)

[Claims] 1. A conveying means for conveying a substrate to a mounting position, a component supply unit for supplying components to be mounted on the substrate, a component picked up from the component supply unit, and a substrate at the mounting position. A surface mounter comprising: a head unit to be mounted on the device; and a static eliminator for removing static electricity charged on at least one of the substrate, the component supply unit, and the head unit in a non-contact state. 2. The method according to claim 1, wherein the static elimination unit neutralizes static electricity by discharging electric charges, and is disposed facing a space where at least one of the substrate, the component supply unit, and the head unit exists. The surface mounter according to claim 1. 3. The surface mounting machine according to claim 2, further comprising a housing for covering the mounting operation position, the component supply section, and the head unit, wherein the static elimination means is disposed on an inner wall surface of the housing. 4. The surface mounter according to claim 3, wherein the housing has an opening / closing cover, and the static elimination means is disposed on an inner wall surface of the opening / closing cover. 5. The device according to claim 2, wherein the charge removing means is arranged so as to discharge electric charges to both the component mounting position of the substrate and the component supply unit. Surface mounter.