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JP2018181880A - 半導体パッケージ及び半導体デバイス - Google Patents

半導体パッケージ及び半導体デバイス Download PDF

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Publication number
JP2018181880A
JP2018181880A JP2017073737A JP2017073737A JP2018181880A JP 2018181880 A JP2018181880 A JP 2018181880A JP 2017073737 A JP2017073737 A JP 2017073737A JP 2017073737 A JP2017073737 A JP 2017073737A JP 2018181880 A JP2018181880 A JP 2018181880A
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JP
Japan
Prior art keywords
semiconductor element
sealing material
side wall
material layer
semiconductor
Prior art date
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Pending
Application number
JP2017073737A
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English (en)
Japanese (ja)
Inventor
将行 廣瀬
Masayuki Hirose
将行 廣瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Glass Co Ltd
Original Assignee
Nippon Electric Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Glass Co Ltd filed Critical Nippon Electric Glass Co Ltd
Priority to JP2017073737A priority Critical patent/JP2018181880A/ja
Priority to PCT/JP2018/001707 priority patent/WO2018185997A1/ja
Priority to TW107102818A priority patent/TW201903976A/zh
Publication of JP2018181880A publication Critical patent/JP2018181880A/ja
Pending legal-status Critical Current

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  • Solid State Image Pick-Up Elements (AREA)
JP2017073737A 2017-04-03 2017-04-03 半導体パッケージ及び半導体デバイス Pending JP2018181880A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017073737A JP2018181880A (ja) 2017-04-03 2017-04-03 半導体パッケージ及び半導体デバイス
PCT/JP2018/001707 WO2018185997A1 (ja) 2017-04-03 2018-01-22 半導体パッケージ及び半導体デバイス
TW107102818A TW201903976A (zh) 2017-04-03 2018-01-26 半導體封裝及半導體裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017073737A JP2018181880A (ja) 2017-04-03 2017-04-03 半導体パッケージ及び半導体デバイス

Publications (1)

Publication Number Publication Date
JP2018181880A true JP2018181880A (ja) 2018-11-15

Family

ID=63713113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017073737A Pending JP2018181880A (ja) 2017-04-03 2017-04-03 半導体パッケージ及び半導体デバイス

Country Status (3)

Country Link
JP (1) JP2018181880A (zh)
TW (1) TW201903976A (zh)
WO (1) WO2018185997A1 (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599153U (zh) * 1978-12-28 1980-07-10
JPS5739439U (zh) * 1980-08-18 1982-03-03
JP2016027610A (ja) * 2014-06-27 2016-02-18 旭硝子株式会社 パッケージ基板、パッケージ、および電子デバイス

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013185214A (ja) * 2012-03-08 2013-09-19 Jx Nippon Mining & Metals Corp α線量が少ないビスマス又はビスマス合金及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599153U (zh) * 1978-12-28 1980-07-10
JPS5739439U (zh) * 1980-08-18 1982-03-03
JP2016027610A (ja) * 2014-06-27 2016-02-18 旭硝子株式会社 パッケージ基板、パッケージ、および電子デバイス

Also Published As

Publication number Publication date
TW201903976A (zh) 2019-01-16
WO2018185997A1 (ja) 2018-10-11

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