JP2018166136A - Die bonding device and manufacturing method for semiconductor device - Google Patents

Abstract

A die bonding apparatus capable of determining a pre-maintenance time without complicating the apparatus configuration of the die bonding apparatus. A die bonding apparatus includes a bonding unit that bonds a die supplied from a die supply unit to a substrate supplied from a substrate supply unit, and a control unit that controls the bonding unit. The control unit (a) images the substrate with an imaging device to recognize the position of the substrate, and (b) images the substrate and a die bonded to the substrate with the imaging device, and the substrate and the substrate Recognizing the position of the die bonded to the substrate and inspecting the relative position of the substrate and the die, (c) the position of the substrate recognized in (a) and the position of the substrate recognized in (b) Based on the above, the fixed state of the substrate is diagnosed. [Selection] Figure 5

Description

  The present disclosure relates to a die bonding apparatus, and is applicable to, for example, a die bonding apparatus having a self-diagnosis function.

  As part of the manufacturing process of a semiconductor device, there is a process of assembling a package by mounting a semiconductor chip (hereinafter simply referred to as a die) on a wiring board, a lead frame or the like (hereinafter simply referred to as a substrate). In part, there are a step of dicing a die from a semiconductor wafer (hereinafter simply referred to as a wafer) (dicing step) and a bonding step of mounting the divided die on a substrate. A semiconductor manufacturing apparatus used in the bonding process is a die bonding apparatus such as a die bonder.

Japanese Patent Application Laid-Open No. 7-141021

  In the conventional die bonder, the malfunction of the apparatus was not known until a defective product was generated. Therefore, in order to prevent a bonding failure due to a malfunction of the apparatus, pre-maintenance of the die bonder has been performed regularly or according to the number of production. However, with this method, it is necessary to increase the safety margin in order to completely prevent defects, so that the number of maintenance increases and the throughput decreases.

An object of the present disclosure is to provide a die bonding apparatus capable of determining the pre-maintenance time without complicating the apparatus configuration of the die bonding apparatus.
Other problems and novel features will become apparent from the description of the specification and the accompanying drawings.

An outline of typical ones of the present disclosure will be briefly described as follows.
In other words, the die bonding apparatus bonds a die supply unit, a substrate supply unit, and a die supplied from the die supply unit on a substrate supplied from the substrate supply unit or a die already bonded to the substrate. And a control unit that controls the die supply unit, the substrate supply unit, and the bonding unit. The bonding unit includes a bonding head including a collet that adsorbs the die, and a first imaging device capable of imaging the substrate and the die bonded to the substrate. The control unit (a) images the substrate with the first imaging device to recognize the position of the substrate, and (b) images the substrate and the die bonded to the substrate with the first imaging device. The position of the substrate and the die bonded to the substrate are recognized, the relative position of the substrate and the die is inspected, and (c) the position of the substrate recognized in (a) and the recognition in (b) The fixed state of the substrate is diagnosed based on the substrate position.

  According to the die bonding apparatus, the pre-maintenance time can be determined without complicating the apparatus configuration of the die bonding apparatus.

Schematic top view showing a die bonder according to an embodiment Schematic side view for explaining the movement of the bonding head and the like as seen from the direction of arrow A shown in FIG. The figure which shows the external appearance perspective view of a die supply part Schematic sectional view showing the main part of the die supply unit The flowchart which shows the bonding operation | movement of FIG. The figure which shows the result of substrate recognition before and after bonding The flowchart which shows the bonding operation | movement which concerns on the modification 1. The flowchart which shows the bonding operation | movement which concerns on the modification 2. Diagram showing the results of die recognition before and after bonding Schematic overall top view showing a die bonder according to modification 3 Schematic side view for explaining the movement of the pick-up head, bonding head, etc. as seen from the direction of arrow A shown in FIG.

  As a result of examining the method for accurately determining the pre-maintenance time, the inventors determined the time by diagnosing the mechanism that affects bonding accuracy using the recognition result during continuous operation (during production). I learned that I can do it. The present invention was born based on this new knowledge.

  For example, when the substrate is not normally fixed, the bonding accuracy is not stable. Whether or not the substrate fixing is normal can be determined by two or more recognitions. Also, bad processes are limited by comparing the die position and stability before bonding with the die appearance results after bonding.

  Specifically, for example, substrate recognition is normally performed before bonding and after bonding (appearance inspection), but before and after comparison, the substrate fixing state is diagnosed, and the die position on the back surface of the die is monitored before bonding. Diagnose the pickup status and bonding status.

  As a result, it is possible to find a malfunction of the mechanism that affects the bonding accuracy without adding a new mechanism. In addition, it is possible to accurately determine the pre-maintenance time, and it is possible to improve the throughput without deteriorating the quality.

  Hereinafter, examples and modifications will be described with reference to the drawings. However, in the following description, the same components may be denoted by the same reference numerals and repeated description may be omitted. In order to clarify the description, the drawings may be schematically represented with respect to the width, thickness, shape, etc. of each part as compared to the actual embodiment, but are merely examples, and the interpretation of the present invention is not limited to them. It is not limited.

  FIG. 1 is a schematic top view of a die bonder according to an embodiment. FIG. 2 is a schematic side view for explaining a schematic configuration and operation of the bonding head and its peripheral portion as seen from the arrow A in FIG.

  The die bonder 10 is a die bonder having a single transport lane and a single bonding head. The die bonder 10 is roughly divided to supply a die D to be mounted on a printed circuit board 9 on which a product area (hereinafter referred to as a package area P) (15 locations in FIG. 1) to be one or a plurality of final packages including wirings is printed. Die supply unit 1 for picking up, bonding unit 4 for picking up die D from die supply unit 1 and bonding it onto substrate 9 or already bonded die D, transport unit 5 for transporting substrate 9 to the mounting position, transport unit 5, a substrate supply unit 6 that supplies the substrate 9 to the substrate 5, a substrate carry-out unit 7 that receives the mounted substrate 9, and a control unit 8 that monitors and controls the operation of each unit.

  First, the die supply unit 1 includes a wafer holding table 12 that holds a wafer 11 having a plurality of grades of die D, and a push-up unit 13 indicated by a dotted line that pushes up the die D from the wafer 11. In the die supply unit 1, the wafer holder 12 is moved in the X and Y directions by a driving unit (not shown) disposed below the die supply unit 1, and when a die D is picked up from the wafer 11, a predetermined die is planar with the push-up unit 13. It is moved so that it is in the overlapping position.

  The bonding unit 4 includes a collet 42 that sucks and holds the die D pushed up by the push-up unit 13 at the tip, and a bonding head 41 that picks up the die D and bonds it to the package area P of the substrate 9 that has been conveyed. The Y drive unit 43 that moves the bonding head 41 in the Y direction and the position recognition mark (not shown) of the package area P of the substrate 9 that has been conveyed are imaged to recognize the bonding position of the die D to be bonded. A substrate recognition camera (first imaging device) 44 and a die recognition camera (second imaging device) 45 that images the back surface of the picked up die D and recognizes the position of the die. The pickup is performed based on a classification map indicating the grade of the die that the wafer 11 has. The classification map is stored in the control unit 8 in advance. The bonding head 41 has driving units (not shown) that move the collet 42 up and down and move in the X direction, and is movable up and down and left and right as indicated by arrows in FIG.

  With such a configuration, the bonding head 41 corrects the pickup position / orientation based on the imaging data of the die recognition camera 45, picks up the die D, and then packages the substrate 9 based on the imaging data of the substrate recognition camera 44. The die D is bonded to the area P.

  The transport unit 5 includes two transport chutes that transport the substrate 9. For example, the substrate 9 is moved by a conveyance belt (not shown) provided on the two conveyance chutes.

  With such a configuration, the substrate 9 is placed on the transfer lane 51 by the substrate supply unit 6, moves to the bonding position along the transfer chute, and moves to the post-bonding substrate unloading unit 7. It is also possible to bond the die to another package area of the substrate 9 or further bond the die onto the die by moving from the substrate carry-out unit 7 to the substrate supply unit 6 thereafter. It is also possible to reciprocate a plurality of times between the substrate supply unit 6 and the substrate carry-out unit 7 to bond the dies in multiple layers.

  Next, the configuration of the die supply unit 1 will be described with reference to FIGS. 3 and 4. FIG. 3 is an external perspective view of the die supply unit. FIG. 4 is a schematic cross-sectional view showing the main part of the die supply unit.

  The die supply unit 1 includes a wafer holding table 12 that moves in the horizontal direction (XY direction) and a push-up unit 13 that moves in the vertical direction. The wafer holder 12 includes an expand ring 15 that holds the wafer ring 14 and a support ring 17 that horizontally positions the dicing tape 16 that is held by the wafer ring 14 and to which a plurality of dies D are bonded. The push-up unit 13 is disposed inside the support ring 17.

  The die supply unit 1 lowers the expand ring 15 holding the wafer ring 14 when the die D is pushed up. As a result, the dicing tape 16 held on the wafer ring 14 is stretched to widen the distance between the dies D, and the die D is pushed up from below the die D by the push-up unit 13 to improve the pick-up property of the die D. A film-like adhesive material called a die attach film (DAF) 18 is attached between the wafer 11 and the dicing tape 16. In the wafer 11 having the die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Therefore, in the peeling process, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16.

  The control unit 8 includes a memory that stores a program (software) that monitors and controls the operation of each unit of the die bonder 10, and a central processing unit (CPU) that executes the program stored in the memory. For example, the control unit 8 takes in various information such as the substrate recognition camera 44 and image information from the substrate recognition camera 44 and the position of the bonding head 41 and controls each operation of each component such as the bonding operation of the bonding head 41.

  As described above, the die bonder 10 includes the wafer recognition camera 24 that recognizes the posture of the die D on the wafer 11, the die recognition camera 45 that recognizes the position of the die by imaging the back surface of the picked up die D, and the bonding stage. And a substrate recognition camera 44 for recognizing the mounting position on the BS. It is the wafer recognition camera 24 and the die recognition camera 45 that are involved in the pickup by the bonding head 41 and the substrate recognition camera 44 that is involved in the bonding to the mounting position by the bonding head 41 that needs to correct the posture deviation between the recognition cameras. is there. In this embodiment, the wafer recognition camera 24 is used to position the die D, and the substrate recognition camera 44 is used to position the package area P and to check the relative position of the die bonded to the package area P and the package area P. .

FIG. 5 is a flowchart for explaining a die bonding process in the die bonding apparatus according to the embodiment.
In the die bonding process of the embodiment, first, the control unit 8 takes out the wafer ring 14 holding the wafer 11 from the wafer cassette and places it on the wafer holding table 12, and the wafer holding table 12 is picked up by the die D. Transfer to a reference position to be performed (wafer loading). Next, the control unit 8 performs fine adjustment from the image acquired by the wafer recognition camera 24 so that the arrangement position of the wafer 11 exactly matches the reference position.

  Next, the control unit 8 moves the wafer holding table 12 on which the wafer 11 is placed at a predetermined pitch and holds it horizontally to place the die D to be picked up first at the pickup position (die transfer). ). The wafer 11 is inspected in advance for each die by an inspection device such as a prober, and map data indicating good and defective for each die is generated and stored in the storage device of the control unit 8. Whether the die D to be picked up is a non-defective product or a defective product is determined based on the map data. When the die D is defective, the control unit 8 moves the wafer holding table 12 on which the wafer 11 is placed at a predetermined pitch, and arranges the die D to be picked up next at the pickup position. Die D is skipped.

  The control unit 8 images the main surface (upper surface) of the die D to be picked up by the wafer recognition camera 24, and calculates the amount of positional deviation from the pickup position of the die D to be picked up from the acquired image. The control unit 8 moves the wafer holding table 12 on which the wafer 11 is placed based on the positional deviation amount, and accurately places the die D to be picked up at the pick-up position (die check (step S1)).

  The control unit 8 places the substrate 9 on the transport lane 51 by the substrate supply unit 6 (substrate loading). The controller 8 moves the substrate 9 to the bonding position (substrate transport).

  The controller 8 images the substrate with the substrate recognition camera 44 before bonding and recognizes the position of the package area P of the substrate 9 for bonding (substrate recognition (step S4)).

  The controller 8 accurately arranges the die D to be picked up at the pick-up position, then picks up the die D from the dicing tape 16 by the bonding head 41 including the collet 42 (step S2), and based on the substrate recognition result in step S4. Then, die bonding is performed on the package area P of the substrate 9 or a die already bonded to the package area P of the substrate 9 (step S5). The back surface of the picked up die D may be imaged by the die recognition camera 45, and the position of the die D may be inspected (step S3). This step is optional.

  After the die D is bonded, the control unit 8 inspects whether the bonding position is made accurately. In order to inspect the bonding mounting result, the control unit 8 captures the package area P of the substrate 9 again with the substrate recognition camera 44 and recognizes the position of the package area P of the substrate 9 (step S6). The control unit 8 images the die D with the substrate recognition camera 44, recognizes the position of the die D (step S7), and inspects the position of the bonded die D from the substrate recognition and the die recognition result. The control unit 8 performs numerical output and inspection / determination in comparison with bonding positions registered in advance.

  The controller 8 performs a self-diagnosis described later (step S9), and if there is no abnormality, performs the next bonding (step S8).

  Thereafter, the die D is bonded to the package area P of the substrate 9 one by one according to the same procedure. When the bonding of one substrate is completed, the substrate 9 is moved to the substrate unloading unit 7 (substrate transfer), and the substrate 9 is transferred to the substrate unloading unit 7 (substrate unloading).

  Further, the dies D are peeled from the dicing tape 16 one by one according to the same procedure. When the pickup of all the dies D excluding defective products is completed, the dicing tape 16 and the wafer ring 14 that hold the dies D in the outer shape of the wafer 11 are unloaded to the wafer cassette.

  Next, the self-diagnosis (step S9) will be described with reference to FIG. 6A and 6B are diagrams showing a substrate recognition result and an appearance inspection result. FIG. 6A shows a case where the substrate is not sufficiently fixed, and FIG. 6B shows a case where the substrate is fixed normally. The horizontal axis in FIG. 6 indicates the number of bondings (starting times), and the vertical axis indicates the position (μm) of the substrate with respect to the reference. The number of bondings in FIG. 6B is 1 to 304, and the number of bondings in FIG. 6A is 870 to 1000.

  The controller 8 compares the substrate recognition results before and after bonding to calculate the amount of movement of the substrate, and if the amount of movement of the substrate is greater than or equal to a predetermined amount, determines that the substrate is insufficiently fixed and gives a warning.

Specifically, the control unit 8 compares the position (P _S4 ) of the package area P in the substrate recognition in step _S4 with the position (P _S6 ) of the package area P in the substrate recognition in step S6, and the difference Calculate (the amount of movement of the substrate position). In FIG. 6A where the number of starts is large, fluctuations in P _S4 and P _S6 are large, and the amount of movement of the substrate is also large. In FIG. 6B where the number of starts is small, the fluctuations of P _S4 and P _S6 are smaller than those in FIG. 6A and 6B do not show the amount of movement of the substrate, but the amount of movement of the substrate is a difference in the position of the substrate before and after bonding, and can be easily grasped from the drawings. . As shown in FIG. 6A, the control unit 8 determines that the substrate is not sufficiently fixed when the substrate position movement amount is large, and the substrate position movement amount is small as shown in FIG. 6B. Then, it is determined that the substrate is fixed normally.

  For example, the control unit 8 determines that the substrate is sufficiently fixed (normal) when the position movement amount of the substrate is 1 to 5 μm (normal), the normal variation range when it is 5 to 10 μm, and the substrate fixing is insufficient when it is 10 μm or more. If it is determined that the substrate is not fixed enough, for example, insufficient mechanical clamping, insufficient fixation due to suction, or insufficient camera / lens fixation may be considered. If the mechanical clamp is insufficient, review the height and fix by suction. If there is not enough, review leaks and broken pipes, and if the camera and lens are not sufficiently fixed, loosen and peel off.

  According to the above-described embodiments, it is possible to provide a die bonder and a bonding method capable of determining the pre-maintenance time without complicating the device configuration of the die bonder. Thereby, a highly accurate die bonder can be provided and high accuracy can be maintained.

<Modification>
Hereinafter, some typical modifications will be exemplified. In the following description of the modified examples, the same reference numerals as those in the above-described embodiments can be used for portions having the same configurations and functions as those described in the above-described embodiments. And about description of this part, the description in the above-mentioned Example shall be used suitably in the range which is not technically consistent. In addition, a part of the above-described embodiments and all or a part of the plurality of modified examples can be appropriately combined in a range not technically inconsistent.

(Modification 1)
In the embodiment, Step S3 is an option, but in Modification 1, Step S3 is performed. Modification 1 is the same as the embodiment except for self-diagnosis. A self-diagnosis (step SA) according to the first modification will be described with reference to FIG. FIG. 7 is a flowchart showing a bonding operation according to the first modification.

  The control unit 8 performs a position inspection on the back surface of the die before bonding (position correction may or may not be performed based on the position inspection result). The position of the die D in the die back surface position inspection in step S3 is compared with the registered die position, and the difference (the amount of movement of the die position) is calculated.

  For example, the control unit 8 determines that the die recognition / pickup is normal when the die position movement amount is 1 to 5 μm, the normal variation range is 5 μm, and the pickup position is abnormal when it is 10 μm or more. If it is determined that the pickup position is abnormal, for example, there may be a die recognition failure or a pickup shift, and if it is a die recognition failure, review the resolution, registration pattern, etc. To do.

(Modification 2)
In the embodiment, step S3 is an option, but in the second modification, step S3 is performed as in the first modification. Modification 2 is the same as the embodiment except for self-diagnosis. The self-diagnosis (steps S9 and SB) according to the modified example 2 will be described with reference to FIGS.

  FIG. 8 is a flowchart showing a bonding operation according to the second modification. FIG. 9 is a diagram showing the die back surface position inspection result and the appearance inspection result when the pickup is abnormal and the bonding is normal. The horizontal axis in FIG. 9 indicates the number of bondings (starting times), and the vertical axis indicates the die position (μm) with respect to the reference. The number of times of bonding in FIG.

  The control unit 8 compares the die recognition results before and after bonding to calculate the die position movement amount. If the die back surface position before bonding and the appearance inspection result are greatly different, it is determined that there is a defect in the substrate fixing state or the bonding process. Warning.

Specifically, the control unit 8 compares the position of the die D (P _S3 ) in the die back surface position inspection in step S3 with the position of the die (P _S7 ) in the die position recognition in step S7, and the difference (die Position movement amount) is calculated. In FIG. 9, the fluctuation directions of P _S3 and P _S7 have the same tendency, and the position movement amount is relatively small.

  For example, the control unit 8 determines that the substrate is sufficiently fixed (normal) and the bonding is normal and the bonding is normal, 5 to 10 μm when the amount of movement of the die is 1 to 5 μm (when the positional deviation with respect to the die reference is the same before and after bonding). In the case of (when the positional deviation with respect to the reference of the die has the same tendency before and after bonding), it is determined that the substrate is insufficiently fixed or the bonding is abnormal when the variation range is 10 μm or more. When the controller 8 determines that the substrate is not sufficiently fixed or the bonding is abnormal, the control unit 8 compares the substrate recognition results before and after the bonding and calculates the amount of movement of the substrate. If the amount of movement of the substrate is equal to or larger than the predetermined amount, the substrate is fixed. Judge as insufficient. When it is determined that the substrate fixing is normal, the control unit 8 determines that the bonding is abnormal. If it is determined that the bonding is abnormal, it may be a bonding head or collet abnormality or a bonding press failure. If the bonding head or collet is abnormal, check the mechanical backlash. If the bonding pressure is poor, review the height and temperature.

(Modification 3)
In the embodiment, the die D is picked up from the wafer by the bonding head 41. However, in the third modification, in order to shorten the moving distance of the bonding head 41 and shorten the processing time, the die supply unit 1 and the bonding unit 4 An intermediate stage 31 is provided between them.

  A die bonder according to Modification 3 will be described with reference to FIGS. FIG. 10 is a schematic top view of a die bonder according to Modification 3. FIG. 11 is a schematic side view for explaining a schematic configuration and operation of the pickup head, the bonding head, and the peripheral portion thereof viewed from the arrow A in FIG.

  A die bonder 10A according to the modification is a die bonder having a single transport lane and a single bonding head. The die bonder 10A is roughly divided into a die supply unit 1 for supplying a die D to be mounted on the package area P of the substrate 9, a pickup unit 2 for picking up a die from the die supply unit 1, and the picked up die D in the middle. Alignment unit 3 once mounted, bonding unit 4 that picks up die D of the alignment unit and bonds it onto package area P of substrate 9 or die D that has already been bonded, and transport unit that transports substrate 9 to the mounting position 5. A substrate supply unit 6 that supplies the substrate 9 to the transfer unit 5, a substrate carry-out unit 7 that receives the mounted substrate 9, and a control unit 8 that monitors and controls the operation of each unit.

  The pickup unit 2 has a collet 22 that sucks and holds the die D pushed up by the push-up unit 13 at the tip, picks up the die D, and places the pickup head 21 on the alignment unit 3 and the pickup head 21 as Y And a Y drive unit 23 of the pickup head that is moved in the direction. The pickup is performed based on a classification map indicating the grade of the die that the wafer 11 has. The classification map is stored in the control unit 8 in advance. The pickup head 21 has driving units (not shown) that move the collet 22 up and down and move in the X direction, and is movable up and down and left and right as indicated by arrows in FIG.

  The alignment unit 3 includes an intermediate stage 31 on which the die D is temporarily placed, and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31.

  The bonding unit 4 has the same structure as the pickup head 21, picks up the die D from the intermediate stage 31, and bonds it to the package area P of the substrate 9 that has been transported, and is attached to the tip of the bonding head 41. Then, the collet 42 that sucks and holds the die D, the Y drive unit 43 that moves the bonding head 41 in the Y direction, and the position recognition mark (not shown) of the package area P of the substrate 9 that has been conveyed are imaged and bonded. A substrate recognition camera 44 for recognizing the bonding position of the die D to be obtained. BS indicates a bonding area. The bonding head 41 has driving units (not shown) that move the collet 42 up and down and move in the X direction, and is movable up and down and left and right as indicated by arrows in FIG.

  With such a configuration, the bonding head 41 corrects the pickup position / orientation based on the imaging data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, and the substrate based on the imaging data of the substrate recognition camera 44. The die D is bonded to the 9 package area P.

  Next, a die bonding process in the die bonder according to Modification 3 will be described with reference to FIG. The die-bonding process of the modification 3 is the same as that of an Example except the pick-up of step S2.

  The controller 8 places the die D to be picked up accurately at the pick-up position, then picks up the die D from the dicing tape 16 by the pickup head 21 including the collet 22 and places it on the intermediate stage 31 (die handling). The control unit 8 detects the posture deviation (rotational deviation) of the die placed on the intermediate stage 31 by imaging with the stage recognition camera 32. When there is a posture deviation, the control unit 8 rotates the intermediate stage 31 on a plane parallel to the mounting surface having the mounting position by a turning drive device (not shown) provided in the intermediate stage 31 to correct the posture deviation.

  The control unit 8 picks up the die D from the intermediate stage 31 by the bonding head 41 including the collet 42 (step S2), and performs die bonding to the package area P of the substrate 9 or the die already bonded to the package area P of the substrate 9. (Step S5). The back surface of the picked up die D may be imaged by the die recognition camera 45 and the die back surface position may be inspected (step S3).

  The die bonder according to the modified example 3 can perform the same self-diagnosis as in the example and modified examples 1 and 2. Since the die bonder 10A includes the stage recognition camera 32, the stage recognition camera 32 may be used in place of the die recognition camera 45 to perform the self-diagnosis of the first and second modifications. Instead of or together with the die recognition camera 45, a recognition camera 25 that images the back surface of the die picked up by the pickup head may be used.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiments, examples, and modifications. However, the present invention is not limited to the above-described embodiments, examples, and modifications, and various modifications can be made. It goes without saying that it is possible.

  In Modifications 1 and 2, the die recognition camera that images the back side of the die is used for position recognition of the die before bonding, but a wafer recognition camera may be used.

  Further, it may be a flip chip bonder provided with a drive unit for rotating the collet and having a flip head capable of inverting the picked up die. The die bonder may include a plurality of mounting units including a pickup unit, an alignment unit, and a bonding unit, and a plurality of conveyance lanes. Alternatively, the mounting unit including the pickup unit, the alignment unit, and the bonding unit may be transported in a single set. A die bonder including a lane may be used.

DESCRIPTION OF SYMBOLS 1 ... Die supply part, 11 ... Wafer, 12 ... Wafer holding stand, 13 ... Push-up unit, 2 ... Pick-up part, 21 ... Pick-up head, 22 ... Collet, 23 ... Y drive part of pick-up, 3 ... Alignment part, 31 ... Intermediate stage, 32 ... Stage recognition camera, 4 ... Bonding part, 41 ... Bonding head, 42 ... Collet, 43 ... Y drive part of bonding head, 44 ... Substrate recognition camera, 5 ... Transport part, 51 ... Transport lane, 6 DESCRIPTION OF SYMBOLS ... Substrate supply part, 7 ... Substrate carry-out part, 8 ... Control part, 9 ... Substrate, 10 ... Die bonder, BS ... Bonding area, D ... Die, P ... Package area.

Claims (16)

A die supply unit;
A substrate supply unit;
A bonding unit for bonding a die supplied from the die supply unit onto a substrate supplied from the substrate supply unit or a die already bonded to the substrate;
A control unit for controlling the die supply unit, the substrate supply unit, and the bonding unit;
With
The bonding part is
A bonding head provided with a collet for adsorbing the die;
A first imaging device capable of imaging the substrate and a die bonded to the substrate;
With
The controller is
(A) recognizing the position of the substrate by imaging the substrate with the first imaging device;
(B) Imaging the substrate and the die bonded to the substrate with the first imaging device, recognizing the position of the substrate and the die bonded to the substrate, and inspecting the relative position of the substrate and the die And
(C) A die bonding apparatus that diagnoses the fixed state of the substrate based on the position of the substrate recognized in (a) and the position of the substrate recognized in (b). In claim 1,
The control unit calculates a substrate position movement amount that is a difference between the substrate position recognized in (a) and the substrate position recognized in (b), and the substrate position movement amount is equal to or larger than a predetermined amount. A die bonding apparatus that determines that the substrate is not sufficiently fixed. A die supply unit;
A substrate supply unit;
A bonding unit for bonding a die supplied from the die supply unit onto a substrate supplied from the substrate supply unit or a die already bonded to the substrate;
A control unit for controlling the die supply unit, the substrate supply unit, and the bonding unit;
With
The bonding part is
A bonding head provided with a collet for adsorbing the die;
A second imaging device capable of imaging the back surface of the die picked up by the bonding head;
With
The controller is
(A) recognizing the position of the die by imaging the die with the second imaging device;
(B) A die bonding apparatus for diagnosing die pickup deviation or die recognition state based on the die position recognized in (a) and the previously registered die position. In claim 3,
The control unit calculates a die position movement amount that is a difference between a die position recognized in (a) and a pre-registered die position, and when the die position movement amount is a predetermined amount or more, Die bonding apparatus that determines that there is a pickup deviation or die recognition failure. A die supply unit;
A substrate supply unit;
A bonding unit for bonding a die supplied from the die supply unit onto a substrate supplied from the substrate supply unit or a die already bonded to the substrate;
A control unit for controlling the die supply unit, the substrate supply unit, and the bonding unit;
With
The bonding part is
A bonding head provided with a collet for adsorbing the die;
A first imaging device capable of imaging the substrate and a die bonded to the substrate;
A second imaging device capable of imaging the back surface of the die picked up by the bonding head;
With
The controller is
(A) recognizing the position of the substrate by imaging the substrate with the first imaging device;
(B) imaging the die with the second imaging device to recognize the position of the die;
(C) The first imaging device images the substrate and the die bonded to the substrate, recognizes the position of the substrate and the die bonded to the substrate, and inspects the relative position of the substrate and the die. And
(D) A die bonding apparatus that diagnoses a substrate fixing state and a bonding state based on the die position recognized in (b) and the die position recognized in (c). In claim 5,
The control unit calculates a die position movement amount that is a difference between the die position recognized in (b) and the die position recognized in (c), and the die position movement amount is equal to or larger than a predetermined amount. A die bonding apparatus that determines that the substrate is not sufficiently fixed or that bonding is abnormal. In claim 6,
When the control unit determines that the substrate is insufficiently fixed or a bonding abnormality,
A substrate position movement amount that is a difference between the position of the substrate recognized in (a) and the position of the substrate recognized in (c) is calculated, and the substrate is fixed when the substrate position movement amount is a predetermined amount or more. Judge that it is insufficient,
The die bonding apparatus which determines that it is bonding abnormality when the said board | substrate position movement amount is less than predetermined amount. In any one of Claims 1 thru | or 7,
The die supply unit holds a wafer ring that holds a dicing tape to which the die is attached,
The bonding head is a die bonding apparatus that picks up the die from the dicing tape. In any one of Claims 1 thru | or 7,
Furthermore, it has a pickup part and an alignment part between the die supply part and the bonding part,
The pickup unit has a pickup head provided with a collet that adsorbs the die,
The alignment unit has an intermediate stage on which a die picked up by the pickup head is placed.
The bonding head is a die bonding apparatus that picks up the die from the intermediate stage. (A) imaging the substrate and recognizing the position of the substrate;
(B) bonding the die onto the substrate or a die already bonded to the substrate;
(C) imaging the substrate and the die bonded to the substrate, recognizing the position of the substrate and the die bonded to the substrate, and inspecting the relative position of the substrate and the die;
(D) diagnosing the fixed state of the substrate based on the position of the substrate recognized in the step (a) and the position of the substrate recognized in the step (c);
A method for manufacturing a semiconductor device comprising: In claim 10,
The step (d) calculates a substrate position movement amount that is a difference between the substrate position recognized in the step (a) and the substrate position recognized in the step (c), and the substrate position movement amount is a predetermined amount. When it is above, The manufacturing method of the semiconductor device which determines with the said board | substrate being inadequate fixation. (A) recognizing the position of the die by imaging the back surface of the die picked up by the bonding head;
(B) bonding the die onto the substrate or a die already bonded to the substrate;
(C) diagnosing die pickup deviation or die recognition state based on the die position recognized in (a) and the previously registered die position;
A method for manufacturing a semiconductor device comprising: In claim 12,
The step (c) calculates a die position movement amount that is a difference between a die position recognized in the step (a) and a pre-registered die position, and when the die position movement amount is a predetermined amount or more, A method of manufacturing a semiconductor device, which is determined to be a pick-up deviation of the die or a die recognition defect. (A) imaging the substrate and recognizing the position of the substrate;
(B) recognizing the position of the die by imaging the back surface of the die picked up by the bonding head;
(C) bonding the die onto the substrate or a die already bonded to the substrate;
(D) imaging the substrate and the die bonded to the substrate to recognize the position of the substrate and the die bonded to the substrate, and inspecting the relative position of the substrate and the die;
(E) A method of manufacturing a semiconductor device for diagnosing substrate recognition and a bonding state based on a die position recognized in the step (b) and a die position recognized in the step (d). In claim 14,
The step (e) calculates a die position movement amount that is a difference between the die position recognized in the step (b) and the die position recognized in the step (d), and the die position movement amount is a predetermined amount or more. In some cases, the method of manufacturing a semiconductor device determines that the substrate is insufficiently fixed or that bonding is abnormal. In claim 15,
When it is determined that the step (e) is insufficient fixing of the substrate or a bonding abnormality,
When the substrate position movement amount, which is the difference between the position of the substrate recognized in the step (a) and the position of the substrate recognized in the step (d), is calculated, and the substrate position movement amount is a predetermined amount or more, the substrate Is determined to be insufficiently fixed,
A method of manufacturing a semiconductor device, wherein when the substrate position movement amount is less than a predetermined amount, a bonding abnormality is determined.

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