JP2017019054A - Chuck table and manufacturing method of chuck table - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chuck table which can hold a workpiece without causing the instability of a holding state, and can suppress a rise of cost, and a manufacturing method of the chuck table.SOLUTION: A chuck table 10 sucks and holds a workpiece W at a holding face 11a. The chuck table 10 is constituted of a porous ceramic holding plate 11 constituting the holding face 11a, and a support base 15 for supporting the holding plate 11 by exposing the holding face 11a, and has a suction path 16 communicating with the holding plate 11. The holding face 11a is formed of a corresponding region 12a which corresponds to the workpiece W to be held, and a non-corresponding region 12b which surrounds the corresponding region 12a. The corresponding region 12a and the non-corresponding region 12b are flush with each other, and the non-corresponding region 12b is impregnated with water glass LG, and sealed.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a chuck table and a method for manufacturing the chuck table.

  A chuck table used in a processing device such as a cutting device, a laser processing device, or a grinding device sucks and holds a workpiece such as a semiconductor wafer, an optical device wafer made of sapphire, SiC, a resin package substrate, or ceramics on a holding surface. While processing.

  In particular, the processing apparatus may process a workpiece alone or a workpiece to which a protective member (tape or hard substrate) having a size equivalent to that of the workpiece is attached. In that case, the processing apparatus uses a chuck table in which the holding surface of the chuck table is formed to have the same size as the workpiece, and the outer periphery thereof is surrounded by a metal frame (see, for example, Patent Document 1).

  In the chuck table, the holding surface is sealed by the workpiece placed on the holding surface, and the workpiece is sucked and held without leaking, but the plate made of porous ceramics constituting the holding surface is slightly from the frame body. May float (has a step). In this case, the chuck table sucks gas from between the frame and the holding surface, and the negative pressure for sucking and holding the workpiece during processing (including cleaning) decreases, and the holding state tends to become unstable. There is a problem.

  In order to solve these problems, non-breathable ceramics are placed on the outer circumference of the porous ceramic plate that constitutes the holding surface, and the porous ceramic plate that constitutes the holding surface and the non-breathable ceramic material are ground flush. Thus, a chuck table that prevents leakage due to the occurrence of a step has been proposed (see, for example, Patent Document 2).

JP 2000-323440 A Japanese Patent No. 3666315

  The chuck table disclosed in Patent Document 2 has a problem of high cost because ceramics are expensive.

  An object of the present invention is to provide a chuck table and a method for manufacturing the chuck table that can solve the above-described problems, can hold the workpiece without causing the holding state to become unstable, and can suppress an increase in cost. is there.

  In order to solve the above-described problems and achieve the object, a chuck table according to the present invention is a chuck table for sucking and holding a workpiece by a holding surface, which is made of porous ceramics and includes a holding plate constituting the holding surface. And a support base that exposes the holding surface to support the holding plate and includes a suction path communicating with the holding plate, the holding surface corresponding to a workpiece to be held And the non-corresponding region surrounding the corresponding region, the corresponding region and the non-corresponding region are flush with each other, and the non-corresponding region is impregnated with water glass and sealed.

  The manufacturing method of the chuck table of the present invention is a manufacturing method of the chuck table, wherein a covering step for covering the corresponding area of the holding surface with a protective member, and after performing the covering step, An impregnation step for impregnating water glass, a separation step for separating the protective member from the holding surface after the impregnation step, and polishing the holding surface after performing the peeling step, And a polishing step that makes the non-corresponding region flush with each other.

  Therefore, the present invention has an effect that the workpiece can be held without the holding state becoming unstable, and the increase in cost can be suppressed.

FIG. 1 is an external perspective view showing a configuration of a cutting apparatus provided with a chuck table according to the first embodiment. FIG. 2 is a perspective view illustrating a configuration of the chuck table according to the first embodiment. FIG. 3 is an exploded perspective view showing the chuck table according to the first embodiment. FIG. 4 is a perspective view of the holding plate of the chuck table according to the first embodiment as viewed from below. FIG. 5 is a cross-sectional view taken along line VV in FIG. FIG. 6 is a cross-sectional view illustrating a covering step of the chuck table manufacturing method according to the first embodiment. FIG. 7 is a cross-sectional view illustrating the impregnation step of the chuck table manufacturing method according to the first embodiment. FIG. 8 is a cross-sectional view illustrating a peeling step of the chuck table manufacturing method according to the first embodiment. FIG. 9 is a cross-sectional view illustrating a polishing step of the method for manufacturing the chuck table according to the first embodiment. FIG. 10 is a cross-sectional view illustrating a support base fixing step of the method for manufacturing the chuck table according to the first embodiment. FIG. 11 is a flowchart of the manufacturing method of the chuck table according to the first embodiment. FIG. 12 is a perspective view illustrating a configuration of a chuck table according to the second embodiment. FIG. 13 is an exploded perspective view of the chuck table according to the second embodiment. 14 is a cross-sectional view taken along line XIV-XIV in FIG. FIG. 15 is a perspective view illustrating a configuration of a chuck table according to the third embodiment.

  A mode for carrying out the present invention (Embodiment 1) will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the first embodiment below. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment 1
A chuck table according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view showing a configuration of a cutting apparatus provided with a chuck table according to Embodiment 1, FIG. 2 is a perspective view showing a configuration of a chuck table according to Embodiment 1, and FIG. FIG. 4 is an exploded perspective view showing the chuck table according to the first embodiment, FIG. 4 is a perspective view of the chuck plate according to the first embodiment as seen from below, and FIG. It is sectional drawing which follows a V line.

  The chuck table 10 shown in FIG. 2 according to the first embodiment is provided in the cutting apparatus 1 shown in FIG. A cutting apparatus 1 shown in FIG. 1 is an apparatus that cuts a workpiece W and divides the workpiece W into individual devices D. In the first embodiment, the workpiece W divided by the cutting device 1 into the individual devices D uses silicon, sapphire, gallium or the like as a base material, and is a disk-shaped semiconductor wafer, optical device wafer, or circle. A package wafer in which a device is mounted on a plate-like substrate and sealed. As shown in FIG. 1, the workpiece W is formed with devices D in each region partitioned by the division lines L formed in a lattice shape on the upper surface Wa. The workpiece W is cut along the planned division line L by the cutting device 1 and divided into individual devices D. Further, the workpiece W may be formed of a rectangular parallelepiped electronic component material. Here, the electronic component materials are bismuth tellurium, cadmium telluride used for Peltier elements, etc., lead zirconate titanate (PZT), which is a piezoelectric element (piezoelectric ceramics) used for ultrasonic vibrators, etc. Lead, barium titanate, bismuth titanate, and a package substrate in which a device chip is mounted on a resin substrate and sealed.

  As shown in FIG. 1, the cutting apparatus 1 includes a chuck table 10 that sucks and holds a workpiece W with a holding surface 11a, and a cutting means 20 that cuts the workpiece W held on the chuck table 10 in the X-axis direction. And an X-axis moving means (not shown) that feeds the chuck table 10 in the horizontal direction and the X-axis direction parallel to the lateral direction of the apparatus main body 2, and the cutting means 20 parallel to the horizontal direction and orthogonal to the X-axis direction. Y-axis moving means 40 for indexing and feeding in the Y-axis direction, Z-axis moving means 50 for cutting and feeding the cutting means 20 in the Z-axis direction parallel to the vertical direction perpendicular to both the X-axis direction and the Y-axis direction, And at least control means that does not. As shown in FIG. 1, the cutting device 1 includes two cutting means 20, that is, a two-spindle dicer, a so-called facing dual type cutting device.

  The cutting means 20 includes a spindle (not shown) on which a cutting blade 21 for cutting the workpiece W held on the chuck table 10 is mounted. The cutting means 20 is provided so as to be movable in the Y-axis direction by the Y-axis moving means 40 with respect to the workpiece W held on the chuck table 10, and in the Z-axis direction by the Z-axis moving means 50. It is provided movably.

  As shown in FIG. 1, one cutting means 20 is provided on one column portion 3 a erected from the apparatus main body 2 via a Y-axis moving means 40, a Z-axis moving means 50, and the like. As shown in FIG. 1, the other cutting means 20 is provided on the other column portion 3 b erected from the apparatus main body 2 via the Y-axis moving means 40, the Z-axis moving means 50, and the like. Note that the upper ends of the column portions 3a and 3b are connected by a horizontal beam 3c.

  The cutting means 20 can position the cutting blade 21 at an arbitrary position on the holding surface 11 a of the chuck table 10 by the Y-axis moving means 40 and the Z-axis moving means 50. Further, one cutting means 20 is fixed so that an image pickup means 30 for picking up an image of the upper surface Wa of the workpiece W moves integrally. The imaging means 30 includes a CCD camera that captures an area to be divided of the workpiece W before being divided and held by the chuck table 10. The CCD camera images the workpiece W held on the chuck table 10 to obtain an image for performing alignment for aligning the workpiece W and the cutting blade 21, and controls the obtained image as a control means. Output to.

  The cutting blade 21 is an extremely thin cutting grindstone having a substantially ring shape. The spindle cuts the workpiece W by rotating the cutting blade 21. The spindle is accommodated in the spindle housing 23, and the spindle housing 23 is supported by the Z-axis moving means 50. The spindle of the cutting means 20 and the axis of the cutting blade 21 are set parallel to the Y-axis direction.

  The X-axis moving unit is a processing feeding unit that moves the chuck table 10 in the X-axis direction by moving the chuck table 10 in the X-axis direction. The Y-axis moving unit 40 is an index feeding unit that indexes and feeds the cutting unit 20 by moving the cutting unit 20 in the Y-axis direction. The Z-axis moving unit 50 cuts and feeds the cutting unit 20 by moving the cutting unit 20 in the Z-axis direction. The X-axis moving unit, the Y-axis moving unit 40, and the Z-axis moving unit 50 are a well-known ball screw and a well-known pulse motor that rotates the ball screw around the axis, and the chuck table 10 provided to be rotatable around the axis. Alternatively, a known guide rail that supports the cutting means 20 so as to be movable in the X-axis direction, the Y-axis direction, or the Z-axis direction is provided.

  Further, the cutting apparatus 1 includes a cassette elevator 70 on which a cassette 60 that accommodates the workpiece W before and after cutting is placed and moves the cassette 60 in the Z-axis direction, and a cleaning unit that cleans the workpiece W after cutting. 80, a conveying means (not shown) for conveying the workpiece W between the cassette 60, the chuck table 10 and the cleaning means 80. The cleaning means 80 includes a chuck table 10 that sucks and holds the workpiece W by the holding surface 11a, and a rotation drive source that includes a motor (not shown) that rotates the chuck table 10 around a central axis parallel to the Z-axis direction. A cleaning water supply unit that injects cleaning water onto the workpiece W held on the chuck table 10, and a housing 81 that houses the chuck table 10, a rotation drive source, and a cleaning water supply unit.

  The control means controls the above-described components to cause the cutting device 1 to perform a machining operation on the workpiece W. The control means includes a computer system. The control means includes an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input / output interface device. Have The arithmetic processing device of the control means performs arithmetic processing according to the computer program stored in the storage device, and sends a control signal for controlling the cutting device 1 to the above-described cutting device 1 via the input / output interface device. Output to the component. Further, the control means is connected to a display means (not shown) constituted by a liquid crystal display device or the like for displaying a processing operation state or an image, or an input means used when an operator registers processing content information. The input means includes at least one of a touch panel provided on the display means, a keyboard, and the like.

  The chuck table 10 is provided in the cutting apparatus 1, holds the workpiece W to be cut by the cutting means 20 with the holding surface 11 a, or is installed in the cleaning means 80 and cleaned by the cleaning means 80. The object W is sucked and held by the holding surface 11a. As shown in FIGS. 2 and 3, the chuck table 10 includes a holding plate 11 made of porous ceramics and constituting a holding surface 11 a, and a support base 15 that supports the holding plate 11 by exposing the holding surface 11 a. Is done.

  The holding plate 11 is formed in a disk shape. In the holding plate 11, a holding surface 11a which is one circular surface and a back surface 11b which is the other circular surface are formed in parallel, and the thickness is constant throughout. The holding surface 11a includes a corresponding area 12a corresponding to the workpiece W to be held and a non-corresponding area 12b surrounding the corresponding area 12a. In the corresponding region 12a, porous ceramics constituting the holding plate 11 are exposed. The planar shape of the corresponding region 12a is a circle. The non-corresponding region 12b is flush with the corresponding region 12a. The non-corresponding region 12b is impregnated with water glass LG, and the water glass LG is baked and fine holes are sealed with the water glass LG.

  Further, as shown in FIG. 4, the rear surface 11b of the holding plate 11 surrounds the central suction path corresponding region 13a provided in the center and corresponding to the central suction path 16a of the support base 15, and the central suction path corresponding region 13a. And a non-corresponding region 13b. In the central suction path corresponding region 13a, porous ceramics constituting the holding plate 11 are exposed. The planar shape of the central suction path corresponding region 13a is circular. The central suction path corresponding region 13a is disposed at a position that is coaxial with the corresponding region 12a. The outer diameter of the central suction path corresponding region 13a is smaller than the outer diameter of the corresponding region 12a. The non-corresponding region 13b is flush with the central suction path corresponding region 13a. The non-corresponding region 13b is impregnated with water glass LG, and the water glass LG is baked and fine holes are sealed with the water glass LG. Yes.

  Further, an outer edge sealing region 14 is provided on the outer peripheral surface of the holding plate 11. The outer edge sealing region 14 is impregnated with water glass LG, fired water glass LG, and fine holes are sealed with water glass LG. In the holding plate 11, in the non-corresponding regions 12 b and 13 b and the outer edge sealing region 14, the water glass LG enters the porous surface layer, and fine holes are sealed with the water glass LG.

  The support base 15 supports the holding plate 11. The support base 15 is formed in a disk shape having the same shape as the holding plate 11, is supported by the X-axis moving means and is moved in the X-axis direction with respect to the apparatus main body 2, and a rotational drive source (not shown). ) To be rotatable about a central axis (parallel to the Z axis). Further, in the cleaning means 80, the support base 15 is provided so as to be rotatable about a central axis (parallel to the Z axis) by a rotational drive source (not shown).

  The support base 15 includes a suction path 16 that communicates with a fine hole in the holding plate 11. The suction path 16 opens to the upper surface 15a of the support base 15 and is connected to the vacuum suction source 17 shown in FIG. In the first embodiment, a central suction path 16a that opens to the center of the upper surface 15a of the support base 15 as the suction path 16 and passes through the support base 15 and is connected to the vacuum suction source 17, and the central suction path 16a. Also, a plurality of outer peripheral suction paths 16b provided on the outer periphery, and a connection suction path 16c that connects the central suction path 16a and the plurality of outer peripheral suction paths 16b are provided. The central suction path 16 a is arranged at a position that overlaps the central suction path corresponding region 13 a of the holding plate 11 when the holding plate 11 is overlapped on the upper surface 15 a of the support base 15.

  The outer peripheral suction path 16b and the connection suction path 16c are concave grooves from the upper surface 15a of the support base 15. The outer peripheral suction path 16 b and the connection suction path 16 c are arranged at positions that overlap the non-corresponding region 13 b of the holding plate 11 when the holding plate 11 is overlapped on the upper surface 15 a of the support base 15. The outer peripheral suction path 16b is formed in a ring shape in plan view. The plurality of outer peripheral suction paths 16b are arranged at positions that are coaxial with the central suction path 16a. In the first embodiment, three outer peripheral suction paths 16b having different outer diameters are provided, but the present invention is not limited to this. The connection suction path 16 c is formed in a straight line parallel to the radial direction of the upper surface 15 a of the support base 15. Although the four connection suction paths 16c are provided in the upper surface 15a of the support base 15 at equal intervals in the circumferential direction, it is not limited to this.

  As shown in FIG. 5, the support base 15 has the holding plate 11 placed on the upper surface 15 a, and the central suction path 16 a is sucked from the vacuum suction source 17, thereby applying a negative pressure in the suction paths 16 b and 16 c. The holding plate 11 is sucked and held, and the workpiece W placed on the holding surface 11a of the holding plate 11 is sucked and held through the central suction path corresponding region 13a and the corresponding region 12a. In Embodiment 1, the holding plate 11 placed on the upper surface 15a of the support base 15 is fixed to the upper surface 15a with an adhesive or the like, but is not limited thereto. When the holding plate 11 is bonded to the support base 15, the holding plate 11 is bonded to the holding surface 11a by applying an adhesive to the portion of the upper surface 15a where the outer peripheral suction path 16b and the connection suction path 16c are provided. In order to transmit the negative pressure to the corresponding region 12a, the central suction path 16a functions as a suction path.

  Next, a method for manufacturing a chuck table according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 6 is a cross-sectional view illustrating a covering step of the chuck table manufacturing method according to the first embodiment, and FIG. 7 is a cross-sectional view illustrating an impregnation step of the chuck table manufacturing method according to the first embodiment. FIG. 9 is a cross-sectional view showing a peeling step of the chuck table manufacturing method according to the first embodiment, FIG. 9 is a cross-sectional view showing a polishing step of the chuck table manufacturing method according to the first embodiment, and FIG. FIG. 11 is a cross-sectional view illustrating a support base fixing step of the chuck table manufacturing method according to the first embodiment, and FIG. 11 is a flowchart of the chuck table manufacturing method according to the first embodiment.

  The manufacturing method of the chuck table is a method of manufacturing the chuck table 10 and, as shown in FIG. 11, a protective member coating step ST1, an impregnation step ST2, a peeling step ST3, a polishing step ST4, and a support base. And a fixing step ST5.

  The covering step ST1 is a step of covering the corresponding region 12a of the holding surface 11a with the protective member G. In the covering step ST1, a disk-shaped disk member C having the same shape as the holding plate 11 is manufactured from porous ceramics. As shown in FIG. 6, the surfaces Ca and Cb corresponding to the holding surface 11a and the back surface 11b of the disk member C are formed. The protective member G is covered on the portions corresponding to the corresponding region 12a and the central suction path corresponding region 13a. The surfaces Ca and Cb of the disk member C are flat. The protective member G is one in which the water glass LG does not enter the inside. The protection member G is formed in a circular shape that is equal to the planar shape of the corresponding region 12a and the central suction path corresponding region 13a. In the first embodiment, the protective member G includes a synthetic resin and an adhesive layer that is formed on the surface of the synthetic resin and is cured when an external stimulus such as irradiation with ultraviolet rays or heating is applied. However, it is not limited to this. Then, the process proceeds to the impregnation step ST2.

  The impregnation step ST2 is a step of impregnating the holding surface 11a with water glass LG after performing the covering step ST1. In the impregnation step ST2, as shown in FIG. 7, the disk member C is inserted into the impregnation tank S which is a container storing the water glass LG, and the entire disk member C is impregnated in the water glass LG. When a predetermined time elapses, the water glass LG enters a fine hole in a portion corresponding to the non-corresponding regions 12b and 13b of the surfaces Ca and Cb of the disk member C, and the water glass LG corresponds to the non-corresponding regions 12b and 13b. Seal the fine holes. Thereafter, in the impregnation step ST2, the disk member C is taken out of the impregnation tank S, the disk member C is baked together with the water glass LG, and the water glass LG is cured, and then the process proceeds to the peeling step ST3. Moreover, this invention may implement peeling step ST3 before baking the disk member C for every water glass LG, and may burn the disk member C for every water glass LG after that.

  In the peeling step ST3, after the impregnation step ST2 is carried out, the protective member G is removed from the portions corresponding to the corresponding area 12a of the front surfaces Ca and Cb and the central suction path corresponding area 13a corresponding to the holding surface 11a and the back surface 11b of the disk member C. This is the step of peeling. In the peeling step ST3, the protection member G is peeled from the disk member C and removed from the disk member C as shown in FIG. Then, the process proceeds to polishing step ST4.

  The polishing step ST4 is a step in which the protective member G is polished on the surfaces Ca and Cb corresponding to the holding surface 11a and the back surface 11b of the disk member C after performing the peeling step ST3. In the polishing step ST4, as shown in FIG. 9, after the protective tape TG is mounted on the surface Cb corresponding to the back surface 11b of the disk member C, the surface Cb is placed on the chuck table CT of the polishing apparatus GR, and the chuck table CT Then, the polishing pad GP is pressed against the surface Ca to be the holding surface 11a of the disk member C while rotating around the central axis. Then, the polishing apparatus GR polishes the surface Ca so that the corresponding region 12a and the non-corresponding region 12b are flush with each other. Thus, in the polishing step ST4, the corresponding area 12a and the non-corresponding area 12b of the chuck table 10 form a holding surface 11a that is flush with each other.

  In the polishing step ST4, after the protective tape TG is peeled off, the protective tape TG is attached to the holding surface 11a, and the holding surface 11a is placed on the chuck table CT of the polishing apparatus GR. After sucking and holding the chuck table CT, the polishing pad GP is pressed against the surface Cb to be the back surface 11b of the disk member C while rotating around the central axis. Then, the polishing apparatus GR polishes the surface Cb so that the central suction path corresponding region 13a and the non-corresponding region 13b are flush with each other. In this way, in the polishing step ST4, the central suction path corresponding region 13a and the non-corresponding region 13b of the chuck table 10 form a back surface 11b that is flush with each other. In this way, the polishing step ST4 forms the holding surface 11a and the back surface 11b, and manufactures the holding plate 11. Then, the process proceeds to the support base fixing step ST5. In the present invention, when polishing the surface Ca corresponding to the holding surface 11a in the polishing step ST4, a protective tape may be adhered to the surface Cb.

  The support base fixing step ST5 is a step of fixing the holding plate 11 to the support base 15 after performing the polishing step ST4. In the support base fixing step ST5, as shown in FIG. 10, the support base 15 and the holding plate 11 are positioned at a position where the central suction path 16a and the central suction path corresponding area 13a overlap, and the support base is fixed with an adhesive. The holding plate 11 is fixed to the upper surface 15 a of 15.

  As described above, in the chuck table 10 and the chuck table manufacturing method according to the first embodiment, the portions corresponding to the non-corresponding regions 12b and 13b of the disk member C made of porous ceramics are impregnated with the water glass LG and sealed. Thus, the corresponding region 12a can be easily formed in a desired region of the holding surface 11a. Further, the chuck table 10 and the manufacturing method of the chuck table polish the non-corresponding regions 12b and 13b impregnated with the water glass LG with the polishing pad GP for each of the corresponding region 12a and the central suction path corresponding region 13a. Furthermore, the surfaces Ca and Cb of the disk member C are flat. For this reason, the chuck table 10 and the manufacturing method of the chuck table polish the water glass LG that is easier to polish than metals such as aluminum alloy and stainless steel, and therefore easily correspond to the corresponding region 12a without increasing the cost. The region 12b can be flush with the corresponding region 12a, and when the corresponding region 12a is covered with the workpiece W and sucked and held, even if the workpiece W is about the same size as the corresponding region 12a, the workpiece There is also an effect that W can be stably held. Therefore, the chuck table 10 and the method for manufacturing the chuck table can hold the workpiece W without the holding state becoming unstable, and can suppress an increase in the cost of the chuck table 10.

  Moreover, since the chuck | zipper table 10 which concerns on Embodiment 1 can make the corresponding | compatible area | region 12a and the non-corresponding | compatible area | region 12b flush, even if it uses as the chuck table 10 of the washing | cleaning means 80, the workpiece W is stabilized. And can be sucked and held. Therefore, the chuck table 10 and the manufacturing method of the chuck table according to the first embodiment are suitable as the chuck table 10 of the cleaning unit 80.

[Embodiment 2]
A chuck table and a method for manufacturing the chuck table according to Embodiment 2 of the present invention will be described with reference to the drawings. 12 is a perspective view showing a configuration of the chuck table according to the second embodiment, FIG. 13 is an exploded perspective view showing the chuck table according to the second embodiment, and FIG. 14 is an XIV in FIG. It is sectional drawing which follows the -XIV line. 12 to 14, the same parts as those of the first embodiment are denoted by the same reference numerals and the description thereof is omitted.

  The chuck table 10-2 according to the second embodiment is provided in the cutting apparatus 1 and sucks and holds the workpiece W to be cut by the cutting unit 20, or is installed in the cleaning unit 80 and cleaned by the cleaning unit 80. The workpiece W to be held is sucked and held.

  As shown in FIGS. 12, 13, and 14, the chuck table 10-2 includes a holding plate 11 and a support base 15 as in the first embodiment. In the chuck table 10-2, the central suction path corresponding area 13a of the holding plate 11 is formed in the same size as the corresponding area 12a, and the entire non-corresponding areas 12b and 13b are impregnated with water glass LG. Fine holes are sealed with water glass LG after firing. Further, the chuck table 10-2 is formed so that the outer diameter of the support base 15 is larger than the outer diameter of the holding plate 11, and the flange portion 18 that covers the outer peripheral surface of the holding plate 11 is formed on the outer edge of the support base 15. Provided integrally. The other configuration of the chuck table 10-2 is the same as that of the chuck table 10 of the first embodiment.

  As described above, the manufacturing method of the chuck table 10-2 and the chuck table according to the second embodiment can make the corresponding region 12a and the non-corresponding region 12b flush with each other, and the holding state does not become unstable. Since the workpiece W can be held and portions corresponding to the non-corresponding regions 12b and 13b of the disk member C made of porous ceramics can be impregnated and sealed with water glass LG, the cost of the chuck table 10-2 increases. Can be suppressed.

[Embodiment 3]
A chuck table and a method for manufacturing the chuck table according to Embodiment 3 of the present invention will be described with reference to the drawings. FIG. 15 is a perspective view illustrating a configuration of a chuck table according to the third embodiment.

  The chuck table 10-3 according to the third embodiment is provided in the cutting apparatus 1, holds the workpiece W- 3 to be cut by the cutting means 20, or is installed in the cleaning means 80 and is attached to the cleaning means 80. The workpiece W-3 to be cleaned is sucked and held. Further, the workpiece W-3 sucked and held by the chuck table 10-3 according to the third embodiment is formed in a rectangular parallelepiped shape.

  As shown in FIG. 15, the chuck table 10-3 includes a holding plate 11 and a support base 15 as in the first and second embodiments. The chuck table 10-3 is formed in a rectangular shape in which the planar shape of the corresponding region 12a of the holding plate 11 is slightly smaller than the planar shape of the workpiece W-3. The other configuration of the chuck table 10-3 is the same as that of the chuck table 10-2 of the second embodiment.

  As described above, the manufacturing method of the chuck table 10-3 and the chuck table according to the third embodiment can make the corresponding region 12a and the non-corresponding region 12b flush with each other, and the holding state does not become unstable. Since the workpiece W-3 can be held and the portions corresponding to the non-corresponding regions 12b and 13b of the disk member C made of porous ceramics can be impregnated with water glass LG and sealed, the cost of the chuck table 10-3 Can be suppressed. The chuck table 10-3 and the manufacturing method of the chuck table according to the third embodiment can flexibly correspond to the shape of the corresponding region 12a by changing the planar shape of the protection member G in various ways, and have various shapes. The workpiece W can be held without the holding state becoming unstable, and an increase in cost can be suppressed.

  Further, the inventors of the present invention confirmed the effect of the chuck table 10 of the first embodiment. The results are shown in Table 1.

  In Table 1, the product of the present invention is the chuck table 10 of the first embodiment. Comparative Example 1 is configured by fitting a holding portion made of porous ceramics inside a frame made of an aluminum alloy, and Comparative Example 2 is made by polishing the upper surface of Comparative Example 1 to obtain a frame and a holding surface. Is the same. In Comparative Example 3, a thermoplastic resin is used instead of the water glass LG of the first embodiment.

  According to Table 1, although the comparative example 1 can suppress an increase in cost, a step is generated between the frame and the holding part, and the vacuum suction source sucks outside air between the frame and the holding part. It became clear that the workpiece W could not be held stably. The comparative example 2 can stably hold the workpiece W with the frame body and the holding portion being flush with each other, but the upper surface of the comparative example 1 is polished to make the frame body and the holding surface flush with each other. It became clear that soaring. In Comparative Example 3, since the thermoplastic resin is used, the cost increase can be suppressed and the surface of the porous ceramic can be sealed. However, since the thermoplastic resin is not impregnated inside the porous ceramic, the surface Ca It was revealed that the workpiece W could not be stably held because the thermoplastic resin was peeled off when the material was polished. On the other hand, since the corresponding region 12a and the non-corresponding region 12b are formed on the same surface by polishing the water glass LG, the product of the present invention is formed without being unstable in the holding state. It has been clarified that W can be held and an increase in the cost of the chuck table 10 can be suppressed.

  The present invention is not limited to the first to third embodiments. That is, various modifications can be made without departing from the scope of the present invention. In short, the present invention is not limited to the cutting device 1 and may be applied to chuck tables of various processing devices.

DESCRIPTION OF SYMBOLS 10 Chuck table 11 Holding plate 11a Holding surface 12a Corresponding area | region 12b Non-corresponding area | region 15 Support base 16 Suction path W, W-3 Workpiece ST1 Covering step ST2 Impregnation step ST3 Peeling step ST4 Polishing step

Claims (2)

A chuck table for sucking and holding a workpiece on a holding surface,
A holding plate made of porous ceramics and constituting a holding surface;
A support base that exposes the holding surface to support the holding plate and includes a suction path that communicates with the holding plate;
The holding surface is
A corresponding area corresponding to the workpiece to be held and a non-corresponding area surrounding the corresponding area;
The corresponding area and the non-corresponding area are flush with each other, and the non-corresponding area is impregnated with water glass and sealed. A method for manufacturing a chuck table according to claim 1,
A covering step for covering the corresponding area of the holding surface with a protective member;
An impregnation step of impregnating the holding glass with the water glass after performing the coating step;
A peeling step of peeling the protective member from the holding surface after the impregnation step;
A method of manufacturing a chuck table, comprising: polishing the holding surface after performing the peeling step so that the corresponding region and the non-corresponding region are flush with each other.

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