JP2016224328A - Break system - Google Patents

Abstract

To provide a break system capable of omitting an inspection work by an operator and improving work efficiency after the break. Breaking devices 18 and 21 break a substrate G2 on which a first substrate and a second substrate are bonded to generate a substrate unit G3. When generating the substrate unit G3, the break devices 18 and 21 perform a step of breaking the end portion of the first substrate facing the terminal in order to expose the terminal formed on the second substrate. The end portion broken by the break devices 18 and 21 is separated from the substrate unit G3 in the process of transporting the substrate unit G3. The inspection units 25 and 29 inspect that the terminal is exposed by separating the end from the substrate unit G3, and remove the substrate unit G3 from which the terminal is not exposed from the transport path. [Selection] Figure 1

Description

  The present invention relates to a break system used when breaking a substrate.

  Generally, the manufacturing process of a liquid crystal panel includes a breaking process of cutting out a substrate unit that is a prototype of a liquid crystal panel from a so-called bonded substrate obtained by bonding a first substrate and a second substrate. For example, a color filter is formed on the first substrate, and a thin film transistor (TFT) for driving liquid crystal and a terminal for external connection are formed on the second substrate. Since the terminal of the second substrate is a part connected to an external device, it needs to be exposed. For this reason, in the breaking process, the first substrate and the second substrate are each broken along the scribe line to generate the outer shape of the substrate unit, and further, the terminals formed on the second substrate are exposed. The step of breaking the end portion of the first substrate facing the terminal along the scribe line is included.

  Patent Document 1 below describes a method for cutting a liquid crystal panel in which a thin film transistor array substrate and a color filter substrate are bonded to face each other to expose terminals by cutting and removing the end portions. Yes.

JP 2003-241173 A

  Thereafter, the substrate unit generated as described above is further subjected to post-processing steps such as polishing and cleaning. In order to make the post-processing process proceed smoothly, it is necessary that the end of the first substrate is reliably removed and the terminals of the substrate unit are exposed in the breaking process. Therefore, it is necessary for the operator to inspect whether or not the terminal is properly exposed for each substrate unit, and to distribute the substrate units to be subjected to the post-processing process based on the inspection result.

  In view of this problem, an object of the present invention is to provide a break system that can omit an inspection work by an operator and can improve work efficiency after the break.

  A break system according to a main aspect of the present invention includes a break device that breaks a substrate on which a first substrate and a second substrate are bonded to generate a substrate unit, and the substrate unit generated by the break device to a subsequent apparatus. A transport unit for transporting, and an inspection unit for inspecting the substrate unit generated by the break device. The breaking device performs a step of breaking an end portion of the first substrate facing the terminal in order to expose a terminal formed on the second substrate when generating the substrate unit, The transport unit includes separation means for separating the end portion broken by the break device from the substrate unit in the transport process of the substrate unit, and the inspection unit transports the substrate unit in the transport unit. The substrate is disposed on the downstream side of the separating means and inspects that the terminal is exposed when the end is separated from the substrate unit by the separating means, and the terminal is not exposed. The unit is removed from the transport path.

  According to the break system according to this aspect, in the transport process of transporting the substrate unit generated by the break device to the subsequent device, the end of the substrate unit is separated and the inspection is performed, and the terminals are properly exposed. Only the substrate unit is automatically transferred to the subsequent apparatus. Therefore, it is not necessary for the operator to separately inspect whether or not the terminal is properly exposed for each substrate unit, and to distribute the substrate units to be passed to the subsequent apparatus based on the inspection result. Therefore, according to the break system which concerns on this aspect, it becomes possible to raise the work efficiency after a break to each step | level.

  In the break system according to this aspect, the break device breaks an end portion of the first substrate in a state where the first substrate is directed downward, and the separation unit is configured to break the end portion. The substrate unit may be lifted so that the lower surface of the substrate unit is separated from the conveyance path. If it carries out like this, when a board | substrate unit is lifted, since an edge part leaves | separates from a board | substrate unit by dead weight, an edge part can be removed automatically.

  In this case, the conveyance unit may be configured to convey the substrate unit lifted by the separation unit upside down and convey the substrate unit to the inspection unit. If it carries out like this, since a board | substrate unit is conveyed to a test | inspection part in the state in which the terminal was faced up, the test | inspection part can test | inspect that the terminal is exposed from the upper direction of a board | substrate unit. Therefore, for example, when the substrate unit is placed on the belt conveyor and transported, the inspection unit can be easily arranged with a simple configuration in the empty space above the belt conveyor.

  In this case, the transport unit includes a first transport unit that lifts the substrate unit and then reverses and transports the substrate unit, and a second transport unit that receives the transported substrate unit and transports the substrate unit to the inspection unit. , May be configured. If it carries out like this, front-and-back inversion of a substrate unit and delivery to an inspection part can be advanced smoothly.

  In this case, each of the first transfer unit and the second transfer unit is configured to rotate while holding the substrate unit by the holding unit, and a part of the turning path of the holding unit of the first transfer unit. And part of the swivel path of the holding part of the second transfer part are arranged so as to overlap each other in plan view, and the substrate unit is moved from the first transfer part to the position where the two swivel paths overlap each other. Delivered to the second transfer unit. Thus, the substrate unit can be smoothly transferred from the first transfer unit to the second transfer unit while the arrangement space of the first transfer unit and the second transfer unit is gathered in a compact manner.

  In the break system according to this aspect, the inspection unit inspects that the terminal is properly exposed by detecting the presence or absence of a notch formed by removing the end portion using an optical displacement sensor. It can be set as the structure to do. In this way, it can be inspected that the terminal is exposed without contacting the substrate unit.

  In this case, the inspection unit inspects that the notch is formed in the substrate unit by moving the optical displacement sensor relative to the substrate unit in a direction crossing the notch. It can be set as the structure to do. In this case, it can be efficiently inspected that the notch is formed, as compared with the case where the entire surface of the substrate unit is inspected.

  In this case, the transport unit includes a conveyor that transports the substrate unit to the downstream side of the transport path, and the transport direction of the conveyor is set in a direction across the notch. The substrate unit conveyed by the conveyor is irradiated with light to detect the presence or absence of the notch. In this case, it is not necessary to separately provide a means for moving the optical displacement sensor relative to the substrate unit for inspection, so that the configuration can be simplified.

  As described above, according to the present invention, it is possible to provide a break system capable of omitting the inspection work by the worker and improving the work efficiency after the break.

  The effects and significance of the present invention will become more apparent from the following description of embodiments. However, the embodiment described below is merely an example when the present invention is implemented, and the present invention is not limited to what is described in the following embodiment.

Drawing 1 is a mimetic diagram showing the composition of the break system concerning an embodiment. FIG. 2 is a diagram illustrating a procedure of breaking the substrate according to the embodiment. FIG. 3A is a side view showing the configuration of the break device according to the embodiment, and FIGS. 3B and 3C are views where the first substrate and the second substrate according to the embodiment are broken, respectively. It is a side view which shows the state of time. FIG. 4A and FIG. 4B are cross-sectional views showing the configuration on the substrate side from the holding member of the break unit according to the embodiment. FIG. 5 is a cross-sectional view showing the configuration of the break unit according to the embodiment. FIGS. 6A and 6B are diagrams showing in detail that the substrate according to the embodiment is broken. FIGS. 7A and 7B are schematic views showing the configurations of the upstream and downstream break units according to the embodiment, respectively. FIG. 8 is a diagram illustrating a configuration for inspecting that a notch is formed in the substrate according to the embodiment. 9A to 9D are diagrams illustrating a detailed configuration of the inspection unit according to the embodiment. FIGS. 10A to 10D are side views illustrating the configuration of the inspection unit according to the embodiment. FIG. 11 is a flowchart illustrating processing by the break system according to the embodiment. FIG. 12 is a diagram showing a configuration for inspecting that a notch is formed in the substrate according to the modification.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each figure, XYZ axes orthogonal to each other are added for convenience. The XY plane is parallel to the horizontal plane, and the positive Z-axis direction is a vertically upward direction.

  FIG. 1 is a schematic diagram showing the configuration of the break system 1.

  On the upstream side (X-axis negative side) of the break system 1, a scribing device (not shown) for providing a scribing line for the substrate G1 is installed. The break system 1 receives the substrate G1 conveyed from the scribe device, generates the substrate G2 by breaking the substrate G1 along the scribe line, and breaks the substrate G2 along the scribe line. A substrate unit G3 to be a prototype is generated.

  The substrate G1 is a mother substrate from which the substrate unit G3 is cut out, and is configured by a so-called bonded substrate in which the first substrate and the second substrate are bonded to each other. A color filter is formed on the first substrate, and a thin film transistor (TFT) for driving the liquid crystal and a terminal for external connection are formed on the second substrate. The first substrate and the second substrate are bonded to each other through a sealing material, and liquid crystal is injected into a region formed by the first substrate, the second substrate, and the sealing material. The scribe line is formed on the outer surface of the first substrate and the outer surface of the second substrate along the sealing material. The substrate G1 is transferred from the scribing device to the break system 1 so that the first substrate is located on the lower surface side (Z-axis negative side).

  Break system 1 includes conveyors 11, 13, 17, 19, 20, 22, 26, 30, 34, break devices 12, 18, 21, transfer units 14, 15, 31, 32, guides 16, 33 , Rotary transfer units 23, 24, 27, 28 and inspection units 25, 29.

  The conveyor 11 conveys the board | substrate G1 conveyed from the upstream scribing apparatus in the X-axis positive direction. The break device 12 includes break units 12a respectively disposed on the first substrate side and the second substrate side of the substrate G1. The two break units 12a are located between the conveyor 11 and the conveyor 13 when viewed in the Z-axis direction. The break device 12 breaks the substrate G1 and generates the substrate G2 by the two break units 12a. The conveyor 13 conveys the generated substrate G2 in the positive direction of the X axis and positions it at a holding position by the transfer units 14 and 15.

  The transfer units 14 and 15 are configured to be movable in the Y-axis direction along guides 16 extending in the Y-axis direction. The transfer units 14 and 15 pull up the substrate G2 positioned at the holding position on the conveyor 13 by suction from above. The transfer unit 14 moves the pulled substrate G2 in the positive direction of the Y axis, rotates it 90 degrees, and places it on the conveyor 17. The transfer unit 15 moves the pulled substrate G2 in the negative Y-axis direction, rotates it 90 degrees, and places it on the conveyor 20. The substrate G2 generated from the substrate G1 is alternately transferred to the conveyors 17 and 20 by the transfer units 14 and 15.

  The conveyor 17 conveys the substrate G2 in the X axis positive direction. The break device 18 includes break units 18a disposed on the first substrate side and the second substrate side of the substrate G2. The two break units 18a are located between the conveyor 17 and the conveyor 19 when viewed in the Z-axis direction. The break device 18 breaks the substrate G2 by two break units 18a to generate a substrate unit G3. The conveyor 19 conveys the generated substrate unit G3 in the X-axis positive direction, and positions it at the end of the conveyor 19 on the X-axis positive side.

  Similarly, the conveyor 20 conveys the board | substrate G2 to a X-axis positive direction. The break device 21 includes break units 21a arranged on the first substrate side and the second substrate side of the substrate G2, respectively. The two break units 21a are located between the conveyor 20 and the conveyor 22 when viewed in the Z-axis direction. The break device 21 breaks the substrate G2 by two break units 21a to generate a substrate unit G3. The conveyor 22 conveys the generated substrate unit G3 in the X-axis positive direction and positions it at the end of the conveyor 22 on the X-axis positive side.

  The rotation transfer unit 23 pulls up the substrate unit G3 positioned at the end of the conveyor 19 on the positive side of the X axis, and reverses the pulled up substrate unit G3 and passes it to the rotation transfer unit 24. The rotation transfer unit 24 passes the substrate unit G3 received from the rotation transfer unit 24 to the inspection unit 25. The inspection unit 25 inspects that the break by the break device 18 is properly performed on the substrate unit G3. The rotary transfer unit 24 places the substrate unit G3 determined to be appropriate by the inspection on the end of the conveyor 26 on the X axis negative side. The conveyor 26 conveys the substrate unit G3 in the positive direction of the X axis and is positioned at the end of the conveyor 26 on the positive side of the X axis.

  Similarly, the rotation transfer unit 27 pulls up the substrate unit G3 positioned at the end on the positive side of the X axis of the conveyor 22, reverses the pulled up substrate unit G3, and passes it to the rotation transfer unit 28. The rotation transfer unit 28 passes the substrate unit G3 received from the rotation transfer unit 27 to the inspection unit 29. The inspection unit 29 inspects that the break by the break device 21 is properly performed on the substrate unit G3. The rotary transfer unit 28 places the substrate unit G3, which is determined to be appropriate by inspection, on the end of the conveyor 30 on the X axis negative side. The conveyor 30 conveys the substrate unit G3 in the positive direction of the X axis and is positioned at the end of the conveyor 30 on the positive side of the X axis.

  The transfer units 31 and 32 are configured to be movable in the Y-axis direction along a guide 33 extending in the Y-axis direction. The transfer units 31 and 32 pull up the substrate unit G3 positioned at the end on the X-axis positive side of the conveyors 26 and 30 by adsorbing them from above. The transfer units 31 and 32 respectively move the lifted substrate unit G3 in the Y-axis negative direction and the Y-axis positive direction, and place them on the end of the conveyor 34 on the X-axis negative side. The conveyor 34 conveys the substrate unit G3 in the positive direction of the X axis and carries it out to an apparatus (not shown) that performs subsequent polishing and cleaning. Thus, the process by the break system 1 is completed.

  FIG. 2 is a diagram showing a procedure for generating the substrate G2 and the substrate unit G3 from the substrate G1. FIG. 2 is a view of the substrates G1 and G2 and the substrate unit G3 conveyed through the break system 1 as viewed from above. For the substrate G2 and the substrate unit G3, corresponding side views are also shown.

  The substrate G1 transported to the break system 1 has scribe lines L1 to L5 formed by an upstream scribe device. The scribe line L1 is formed along the Y-axis direction on the lower surface of the first substrate of the substrate G1. The scribe line L2 is formed along the Y-axis direction on the upper surface of the second substrate of the substrate G1. The positions of the scribe lines L1 and L2 are the same when viewed in the Z-axis direction. The scribe lines L3 and L5 are formed along the X-axis direction on the lower surface of the first substrate of the substrate G1. The scribe line L4 is formed along the X-axis direction on the upper surface of the second substrate of the substrate G1. As viewed in the Z-axis direction, the positions of the scribe lines L3 and L4 are the same, and the positions of the scribe lines L3 and L4 are different from the positions of the scribe line L5.

  When the scribe lines L1 and L2 of the substrate G1 are transported to the break position by the break device 12, the break device 12 breaks the first substrate and the second substrate along the scribe lines L1 and L2, respectively. Thereby, the substrate G2 is generated. The generated substrate G2 is transported in the Y-axis positive direction and the Y-axis negative direction by the transfer units 14 and 15 shown in FIG. 1, and then rotated 90 degrees clockwise as viewed in the Z-axis direction. , 20.

  Next, when the scribe line L5 of the substrate G1 is transferred to a break position by the break device 18, the break device 18 breaks the first substrate along the scribe line L5. When the scribe lines L3 and L4 of the substrate G2 are transferred to the break position by the break device 18, the break device 18 breaks the first substrate along the scribe line L3 and the second substrate along the scribe line L4. Break. Thereby, the substrate unit G3 is generated.

  At this time, since the end portion G2a (shaded portion) of the first substrate corresponding to the scribe lines L3 and L5 is separated, a cutout portion G3a extending in the Y-axis direction is formed in the generated substrate unit G3. The When the end G2a is thus separated and the cutout G3a is formed, the terminals formed on the second substrate are exposed.

  Similarly, when the scribe lines L3, L4, and L5 of the substrate G2 are transferred to the break position by the break device 21, the break device 21 breaks the first substrate along the scribe lines L3 and L5, and the second substrate is Break along scribe line L4. Thereby, the board | substrate unit G3 is produced | generated and the notch part G3a is formed in the produced | generated board | substrate unit G3.

  FIG. 3A is a side view of the breaking device 12 when viewed in the negative Y-axis direction.

  The break device 12 includes the two break units 12a as described above. The two break units 12a are arranged to face each other via the substrate G1 conveyed on the conveyor 11, and have a configuration that is symmetrical to each other with the substrate G1 as a symmetry plane. Hereinafter, the configuration of the upper break unit 12a will be described with reference to FIG.

  The break unit 12 a includes a holding member 101, a guide 102, a cylinder 103, a sliding member 104, a holding member 105, a housing portion 106, and a break bar 107.

  The holding member 101 is fixedly installed in the break system 1 and holds a cylinder 103 having a guide 102 and a rod 103a extending in the Z-axis direction. The sliding member 104 is configured to be slidable along the guide 102 in the Z-axis direction. The lower end of the rod 103 a of the cylinder 103 is installed on the upper surface of the sliding member 104. When the rod 103a of the cylinder 103 moves in the Z-axis direction, the sliding member 104 moves along the guide 102 in the Z-axis direction. The holding member 105 is installed on the lower surface of the sliding member 104, and the accommodating portion 106 is installed on the lower surface of the holding member 105.

  A break bar 107 extending in the Y-axis direction along the scribe lines L1 and L2 of the substrate G1 is disposed in the housing portion 106. At the lower end of the break bar 107, an end 107a extending in the Y-axis direction is formed. The break bar 107 is supported inside the housing portion 106 so as to be movable in the Z-axis direction by a mechanism described later. Two receiving portions 106 a extending in the Y-axis direction are formed at the lower end of the accommodating portion 106, and the two receiving portions 106 a are positioned so as to sandwich the break bar 107. The storage unit 106, the break bar 107, and the internal mechanisms of the storage unit 106 will be described later with reference to FIGS.

  FIG. 3B is a side view showing a state when the first substrate below the substrate G1 is broken, and FIG. 3C is a diagram when the second substrate above the substrate G1 is broken. It is a side view which shows the state.

  When the substrate G1 is transported in the X-axis positive direction and the scribe lines L1 and L2 are aligned with the position of the end portion 107a of the break bar 107 as shown in FIG. 3A, as shown in FIG. In addition, the break device 12 is driven. Specifically, when the upper break bar 107 is driven downward, the end 107a of the upper break bar 107 is pressed against the second substrate. Further, when the lower rod 103a is driven upward, the receiving portion 106a of the lower accommodating portion 106 is pressed against the first substrate.

  In this way, the end portion 107a is pressed against the scribe line L2 of the second substrate, and the receiving portion 106a is located at a position shifted from the scribe line L1 of the first substrate by a predetermined width in the X axis positive direction and the X axis negative direction. Pressed. Thereby, the first substrate is broken along the scribe line L1. The break of the first substrate will be described in detail later with reference to FIG.

  When the first substrate is broken, the position of the substrate G1 is not moved, and then the breaking device 12 is driven as shown in FIG. Specifically, when the upper break bar 107 is driven upward and the upper rod 103a is driven downward, the receiving portion 106a of the upper accommodating portion 106 is pressed against the second substrate. Further, when the lower rod 103a is driven downward and the lower break bar 107 is driven upward, the end 107a of the lower break bar 107 is pressed against the first substrate.

  In this way, the end portion 107a is pressed against the scribe line L1 of the first substrate, and the receiving portion 106a is located at a position shifted from the scribe line L2 of the second substrate by a predetermined width in the X axis positive direction and the X axis negative direction. Pressed. Thereby, the second substrate is broken along the scribe line L2. The break of the second substrate will be described in detail later with reference to FIG.

  FIGS. 4A, 4B and 5 are cross-sectional views showing the structure below the holding member 105 of the upper break unit 12a. 4A is a cross-sectional view taken along the line A1-A2 shown in FIG. 4B, FIG. 4B is a cross-sectional view taken along the line B1-B2 shown in FIG. 4A, and FIG. It is C1-C2 sectional drawing shown to (a), (b). The A1-A2 cross section is a cross section parallel to the XZ plane, the B1-B2 cross section is a cross section parallel to the YZ plane, and the C1-C2 cross section is a cross section parallel to the XY plane.

  As shown in FIGS. 4 (a), 4 (b) and FIG. 5, the accommodating portion 106 includes two wall portions 106b parallel to the YZ plane and two wall portions 106c parallel to the XZ plane. As shown in FIGS. 4A and 4B, the receiving portion 106a is formed at the lower ends of the two wall portions 106b. Since the outer surface of the receiving portion 106a is inclined inward of the accommodating portion 106, the width in the X-axis direction of the receiving portion 106a (the width in the direction crossing the scribe lines L1 and L2 in the horizontal direction) is the same as the substrate G1. It gets narrower as you get closer. The lower ends of the two wall portions 106c are positioned above the lower end of the receiving portion 106a.

  A motor 201, a ball screw 202, support members 203 and 204, and a break bar 107 are accommodated in a space surrounded by the walls 106b and 106c. The motor 201 is installed on the lower surface of the holding member 105. The ball screw 202 is fixed to the rotating shaft of the motor 201. The support member 203 is fixed to the nut of the ball screw 202. The upper end of the support member 204 is fixed to the lower surface of the support member 203. The lower end of the support member 204 is divided into two. The two lower ends of the support member 204 are at positions separated in the Y-axis direction, and the break bar 107 is fixed to the lower ends. Since the side surface of the end portion 107a of the break bar 107 is inclined, the width of the end portion 107a in the X-axis direction becomes narrower as it approaches the substrate G1. That is, the end 107a of the break bar 107 is formed in a V shape.

  As shown in FIGS. 4 (a), 4 (b) and FIG. 5, a recess 106d is formed on the inner surface of the wall 106c. The Y-axis positive side and Y-axis negative side ends of the break bar 107 are accommodated in the concave portions 106d of the Y-axis positive side and Y-axis negative side wall portions 106c, respectively.

  As shown in FIG. 5, the width of the substrate G1 in the Y-axis direction is W1, the distance between the inner side surface of the Y-axis positive side wall portion 106c and the inner side surface of the Y-axis negative side wall portion 106c is W2, and the Y-axis positive side. The distance between the Y-axis positive side surface of the side recess 106d and the Y-axis negative side surface of the Y-axis negative side recess 106d is W3, and the outer surface of the Y-axis positive side wall portion 106c and the Y-axis negative side wall portion 106c When the distance from the side surface is W4, the relationship between W1 and W4 is W1 <W2 <W3 <W4. When the width in the X-axis direction of the break bar 107 is W5 and the width in the X-axis direction of the recess 106d is W6, the relationship between W5 and W6 is W5 <W6.

  Referring to FIGS. 4A and 4B, when break bar 107 is moved downward, motor 201 is driven so that the nut of ball screw 202 moves downward. As a result, the support members 203 and 204 that support the break bar 107 are moved downward, and the break bar 107 is moved downward. On the other hand, when the break bar 107 is moved upward, the motor 201 is driven so that the nut of the ball screw 202 moves upward. As a result, the support members 203 and 204 that support the break bar 107 are moved upward, and the break bar 107 is moved upward. At this time, the break bar 107 is reliably moved only in the vertical direction by being guided by the recess 106d.

  FIGS. 6A and 6B are views showing in detail that the substrate G1 is broken by the receiving portion 106a of the accommodating portion 106 and the end portion 107a of the break bar 107. FIG. 6A and 6B are A1-A2 cross-sectional views similar to FIG. 4A.

  As shown in FIG. 6A, when the first substrate is broken, the end 107a of the upper break bar 107 is pressed against the second substrate, and the receiving portion 106a of the lower accommodating portion 106 is the first substrate. It is pressed against the lower surface of the. At this time, the substrate G1 is bent downward, so that the first substrate is broken. As shown in FIG. 6B, when the second substrate is broken, the receiving portion 106a of the upper accommodating portion 106 is pressed against the second substrate, and the end portion 107a of the lower break bar 107 is moved to the first substrate. Pressed against. At this time, the substrate G1 is bent upward, so that the second substrate is broken.

  The configuration of the break device 12 and the operation of the break device 12 breaking the substrate G1 have been described with reference to FIGS. 3A to 6B. However, the configuration of the break device 18 and the break device 18 are described. The operation of breaking the substrate G2 is substantially the same, and the configuration of the breaking device 21 and the operation of the breaking device 21 breaking the substrate G2 are also substantially the same.

  FIG. 7A is a schematic diagram showing the upper break unit 12a of the break device 12, and FIG. 7B is a schematic diagram showing the upper break units 18a, 21a of the break devices 18, 21. As shown in FIG. The break devices 18 and 21 have the same configuration.

  As shown in FIGS. 7A and 7B, the break units 18a and 21a have a shorter length in the Y-axis direction of the holding member 105, the accommodating portion 106, and the break bar 107 than the break unit 12a. It is different in point. The other configuration of the break units 18a and 21a is the same as that of the break unit 12a.

  Also in the break units 18a and 21a, the relationship between the lengths W1 to W4 shown in FIG. 5 is set similarly. That is, in FIG. 5, if W1 is the width of the substrate G2 in the Y-axis direction and W2 to W4 are the corresponding lengths of the break units 18a and 21a, the relationship between W1 and W4 is the same as that of the break unit 12a. , W1 <W2 <W3 <W4.

  Further, the two break units 18a of the break device 18 are disposed to face each other via the substrate G2, and have a configuration that is symmetrical to each other with the substrate G2 as a symmetry plane. Similarly, the two break units 21a of the break device 21 are disposed to face each other via the substrate G2, and have a configuration that is symmetrical to each other with the substrate G2 as a symmetry plane. Therefore, the break devices 18 and 21 can break the substrate G2 in the same manner as the break device 12.

  Next, a configuration and processing for inspecting that the notch G3a is formed in the substrate unit G3 will be described. Here, the conveyors 19 and 26, the rotation transfer units 23 and 24, and the inspection unit 25, and the conveyors 22 and 30, the rotation transfer units 27 and 28, and the inspection unit 29 are symmetrical with respect to the XZ plane. It has become. Therefore, hereinafter, the case of inspecting the substrate unit G3 generated by the break device 18 will be described, and the description of the case of inspecting the substrate unit G3 generated by the break device 21 will be omitted.

  FIG. 8 is a view of a peripheral configuration including the conveyors 19 and 26, the rotation transfer units 23 and 24, and the inspection unit 25 as viewed from above. In FIG. 8, for the sake of convenience, the illustration of the break device 18 is omitted.

  The rotation transfer unit 23 includes a shaft 310 extending in the Z-axis direction, a rotating body 320 that rotates about the shaft 310, and four driving units 330 that are installed on the side surfaces of the rotating body 320. The driving unit 330 includes a support unit 331, a shaft 332 supported by the support unit 331, a suction pad support unit 333 installed at the tip of the shaft 332, a suction pad 334 supported by the suction pad support unit 333, Is provided. The driving unit 330 moves up and down with respect to the rotating body 320, rotates the shaft 332 around the shaft 332, and draws air in and out of the suction pad 334. When the driving unit 330 is driven, the substrate unit G3 is moved up and down and rotated front and back via the suction pad 334.

  The rotation transfer unit 24 includes a shaft 410 that extends in the Z-axis direction, a rotating body 420 that rotates about the shaft 410, and four driving units 430 that are installed on the lower surface of the rotating body 320. The drive unit 430 includes a suction pad 431. The drive unit 430 moves the suction pad 431 up and down with respect to the rotating body 420 to allow the air in the suction pad 431 to be taken in and out. By driving the drive unit 430, the substrate unit G3 is raised and lowered via the suction pad 431. The inspection unit 25 includes a conveyor 510, two rails 520, a gate 530, a sensor 540, and a transfer unit 550.

  The board unit G3 generated by the break device 18 is conveyed in the X-axis positive direction by the conveyor 19 and positioned at the position P1 on the X-axis positive side of the conveyor 19. The substrate unit G3 at the position P1 is sucked by the suction pad 334 and pulled up from the conveyance path of the conveyor 19.

  Here, the edge part G2a of the separated first substrate is also conveyed in the X-axis positive direction together with the substrate unit G3 by the conveyor 19. When the substrate unit G3 is lifted by the suction pad 334 of the driving unit 330 and the lower surface of the substrate unit G3 is separated from the transport path of the conveyor 19, the end G2a is separated from the substrate unit G3 by its own weight. That is, the drive unit 330 separates the end G2a from the substrate unit G3. The end portion G2a that is separated from the substrate unit G3 and is left on the conveyor 19 is further recovered by being transported in the X-axis positive direction and falling to the X-axis positive side of the conveyor 19.

  Note that the end G2a may be separated from the substrate unit G3 by means other than the above after the break of the break device 18 and before being transferred to the inspection unit 25. For example, the end G2a may be separated by dropping downward from between the conveyors 17 and 19, or may be separated by blowing air from the conveyor 19 and absorbed by another suction pad. May be removed.

  Subsequently, the rotating body 320 is rotated 90 degrees counterclockwise as viewed from above, and the substrate unit G3 pulled up at the position P1 is positioned at the position P2. Then, the shaft 332 is rotated around the shaft 332, and the substrate unit G3 at the position P2 is turned upside down. Thereby, the notch part G3a of the board | substrate unit G3 is orient | assigned to the upper surface side. Subsequently, the rotating body 320 is rotated 90 degrees counterclockwise as viewed from above, and the substrate unit G3 at the position P2 is positioned at the position P3.

  Subsequently, the substrate unit G3 at the position P3 is moved from the state supported by the suction pad 334 of the rotation transfer unit 23 to the state of being sucked by the suction pad 431 of the rotation transfer unit 24. Then, the rotating body 420 is rotated 90 degrees clockwise as viewed from above, and the substrate unit G3 is placed at the position P4 on the X axis positive side of the conveyor 510. When the substrate unit G3 is placed at the position P4, the rotating body 420 is rotated 45 degrees, and the drive unit 430 is retracted to a position that does not hinder the inspection by the inspection unit 25.

  Subsequently, the gate 530 is transferred on the rail 520 in the positive direction of the X-axis, and is positioned directly above the substrate unit G3 at the position P4. Then, the sensor 540 is transferred by the transfer unit 550 in the negative Y-axis direction. Based on the detection signal of the sensor 540, it is inspected that the notch G3a is formed in the substrate unit G3 at the position P4. The detailed configuration of the inspection unit 25 will be described later with reference to FIGS.

  If it is determined that the notch G3a is not formed, the substrate unit G3 at the position P4 is conveyed in the negative X-axis direction by the conveyor 510 and dropped to the negative X-axis side of the conveyor 510. A recovery unit (not shown) is installed on the negative X-axis side of the conveyor 510, and the substrate unit G3 on which the notch G3a is not formed is recovered by the recovery unit. On the other hand, if it is determined that the notch G3a is formed, the substrate unit G3 at the position P4 is again pulled up by the suction pad 431 of the rotation transfer unit 24. Then, the rotating body 420 is rotated 90 degrees clockwise as viewed from above, and the substrate unit G3 pulled up at the position P4 is placed at the position P5 on the X axis negative side of the conveyor 26. The board unit G3 at the position P5 is conveyed in the positive direction of the X axis by the conveyor 26 and is positioned at a position P6 on the positive side of the X axis of the conveyor 26.

  The substrate unit G3 at the position P6 is pulled up by the suction pad 31a of the transfer unit 31. Then, the transfer unit 31 moves along the guide 33 in the negative Y-axis direction, and the substrate unit G3 is placed on the conveyor 34. The substrate unit G3 placed on the conveyor 34 is transported in the positive direction of the X axis by the conveyor 34 and is transported to a subsequent apparatus.

  9A to 9D are diagrams illustrating the configuration of the inspection unit 25. 9A and 9C are perspective views of the inspection unit 25, and FIGS. 9B and 9D are views of FIGS. 9A and 9C as viewed from above, respectively. . 9A to 9D show the substrate unit G3 at the position P4.

  The two rails 520 are positioned on the Y axis positive side and the Y axis negative side of the conveyor 510, and are fixed in the break system 1. The gate 530 is configured to be slidable on the two rails 520 in the X-axis direction. The sensor 540 is supported by the transfer unit 550 on the lower surface side of a member extending in the Y-axis direction of the gate 530. The sensor 540 can be moved in the Y-axis direction by the transfer unit 550. The sensor 540 is an optical displacement sensor including a laser light source and a light receiving element (not shown). The sensor 540 emits laser light in the negative Z-axis direction from the laser light source, and receives the laser light reflected by the object by the light receiving element. The sensor 540 outputs the light receiving position on the light receiving element as a detection signal. Based on the detection signal of the sensor 540, the distance from the sensor 540 to the object is acquired by the triangulation method.

  As shown in FIGS. 9A and 9B, when the substrate unit G3 is placed at the position P4 of the conveyor 510, the gate 530 is transferred along the two rails 520 in the X-axis positive direction. As shown in (c) and (d), the sensor 540 is positioned immediately above the substrate unit G3 at the position P4. When the sensor 540 is positioned directly above the substrate unit G3, laser light is emitted from the sensor 540, and the sensor 540 is transferred in the negative Y-axis direction.

  10A to 10D are side views of the inspection unit 25 as viewed in the negative X-axis direction.

  When the sensor 540 is positioned immediately above the substrate unit G3 at the position P4 and the laser light is emitted from the laser light source of the sensor 540, the laser light reflected by the substrate unit G3 is reflected as shown in FIG. Light is received by the light receiving element of sensor 540. Then, from the state shown in FIG. 10A, the sensor 540 is transferred in the negative Y-axis direction.

  When the notch G3a is properly formed, when the sensor 540 is moved from the state shown in FIG. 10A by a predetermined distance in the Y-axis negative direction, as shown in FIG. 10B, the sensor 540 The distance to the object in the negative Z-axis direction is increased by the width of the notch G3a in the Z-axis direction. In this way, when the sensor 540 is moved by a predetermined distance in the negative Y-axis direction, the distance from the sensor 540 to the object in the negative Z-axis direction is increased by the width of the notch G3a in the Z-axis direction. It is determined that the notch G3a is formed in the unit G3.

  On the other hand, when the notch G3a is not properly formed, even if the sensor 540 is transported by a predetermined distance in the Y-axis negative direction from the state shown in FIG. 10A, as shown in FIG. The distance from 540 to the object in the negative Z-axis direction is almost unchanged. Thus, when the sensor 540 is moved by a predetermined distance in the negative Y-axis direction, if the distance from the sensor 540 to the object in the negative Z-axis direction is not substantially changed, a notch G3a is formed in the substrate unit G3. It is determined that it is not.

  As shown in FIG. 10D, the sensor 540 may be further transferred in the negative Y-axis direction. In this way, when the distance from the sensor 540 to the object changes in two steps, it can be determined that the notch G3a is formed. On the other hand, when the distance from the sensor 540 to the object changes only in one step, it can be determined that the notch G3a is not formed.

  FIG. 11 is a flowchart showing processing by the break system 1.

  When the substrate G1 is broken by the break device 12, a substrate G2 is generated (S11). The generated substrate G2 is transported to the break devices 18 and 21 (S12). When the substrate G2 is broken by the break devices 18 and 21, a substrate unit G3 is generated (S13). The substrate unit G3 generated by the break device 18 is conveyed to the inspection unit 25 by the conveyor 19 and the rotation transfer units 23 and 24, and the substrate unit G3 generated by the break device 21 includes the conveyor 22 and the rotation transfer unit 27, 28 to the inspection unit 29 (S14).

  The inspection units 25 and 29 inspect that the notch G3a is formed in the substrate unit G3 (S15). When the notch G3a is not formed (S16: NO), the substrate unit G3 is separated from the conveyance path by being conveyed in the negative direction of the X-axis by the conveyor 510, and is collected by the collection unit (S17). When the notch G3a is formed (S16: YES), the substrate unit G3 is carried out to the subsequent apparatus (S18). Specifically, the substrate unit G3 in the inspection unit 25 is carried out to a subsequent apparatus by the rotation transfer unit 24, the conveyor 26, the transfer unit 31, and the conveyor 34. The substrate unit G3 in the inspection unit 29 is carried out to a subsequent apparatus by the rotation transfer unit 28, the conveyor 30, the transfer unit 32, and the conveyor 34.

<Effect of embodiment>
According to this embodiment, the following effects are produced.

  In the transporting process of transporting the substrate unit G3 generated by the break devices 18 and 21 to the subsequent device, the end G2a is separated from the substrate unit G3, the inspection is performed, and only the substrate unit G3 whose terminals are properly exposed. Are automatically transferred to the subsequent apparatus. Accordingly, it is unnecessary to separately perform an operation for an operator to check whether or not the terminal is properly exposed for each substrate unit G3 and to distribute the substrate units G3 to be passed to the subsequent apparatus based on the inspection result. Therefore, according to the break system 1 of the present embodiment, the work efficiency after the break can be improved to each stage.

  The break devices 18 and 21 break the end G2a of the first substrate in a state where the first substrate is directed to the lower surface side, and the driving unit 330 transfers the substrate unit G3 having the broken end G2a to the conveyor 19, The bottom surface of the substrate unit G3 is separated from the conveyance path of the conveyors 19 and 22 by lifting the substrate unit G3. Thereby, when the substrate unit G3 is lifted, the end G2a is separated from the substrate unit G3 by its own weight, and therefore the end G2a can be automatically removed.

  The rotary transfer units 23 and 27 invert the substrate unit G3 lifted from the conveyors 19 and 22, respectively, and convey them to the inspection units 25 and 29. Thereby, since the substrate unit G3 is transported to the inspection units 25 and 29 with the terminals facing upward, the inspection units 25 and 29 can inspect that the terminals are exposed from above the substrate unit G3. . Therefore, as in the present embodiment, the sensor 540 used for the inspection can be easily arranged with a simple configuration in the space above the conveyor 510 on which the substrate unit G3 is placed.

  The rotary transfer units 23 and 27 invert the lifted substrate unit G3, and the rotary transfer units 24 and 28 receive the substrate unit G3 from the rotary transfer units 23 and 27, respectively, and transport them to the inspection units 25 and 29. . Thereby, the front-and-back inversion of the board unit G3 and the delivery to the inspection units 25 and 29 can be smoothly advanced.

  Each of the rotary transfer units 23 and 24 is configured to rotate while holding the substrate unit G3 with a suction pad. Further, a part of the turning path of the suction pad 334 of the rotation transfer unit 23 and a part of the turning path of the suction pad 431 of the rotation transfer part 24 are arranged so as to overlap each other in plan view, and the two turning paths overlap each other. At the position, the substrate unit G3 is transferred from the rotary transfer unit 23 to the rotary transfer unit 24. Accordingly, the substrate unit G3 can be smoothly transferred from the rotation transfer unit 23 to the rotation transfer unit 24 while the arrangement space of the rotation transfer units 23 and 24 is compactly integrated. Similarly, the substrate unit G3 can be smoothly transferred from the rotation transfer unit 27 to the rotation transfer unit 28 while the arrangement space of the rotation transfer units 27 and 28 is gathered in a compact manner.

  The inspection parts 25 and 29 inspect that the terminal is properly exposed by detecting the presence or absence of the notch part G3a formed by removing the end part G2a by the sensor 540 including an optical displacement sensor. Thereby, it can test | inspect that the terminal is exposed, without contacting the board | substrate unit G3.

  The inspection units 25 and 29 move the sensor 540 in the negative Y-axis direction with respect to the substrate unit G3 at the position P4, and inspect that the notch G3a is formed in the substrate unit G3. Thereby, compared with the case where the whole surface of the board | substrate unit G3 is test | inspected, it can test | inspect efficiently that the notch part G3a is formed.

  When breaking the first substrate of the substrates G1 and G2, the two receiving portions 106a of the break units 12a, 18a, and 21a disposed on the first substrate side support the first substrate and are disposed on the second substrate side. The break bar 107 of the broken break units 12a, 18a, 21a is pressed against the second substrate. On the other hand, when the second substrate of the substrates G1 and G2 is to be broken, the first substrate side with the two receiving portions 106a of the break units 12a, 18a, and 21a arranged on the second substrate side supporting the second substrate The break bars 107 of the break units 12a, 18a, 21a arranged on the first substrate are pressed against the first substrate. As described above, according to the break devices 12, 18, and 21 according to the present embodiment, the two break units are arranged so as to face the first substrate side and the second substrate side, so that the first substrate and the second substrate are arranged. The substrate can be broken at the same location. Therefore, it becomes possible to break the substrates G1 and G2 with a simple configuration.

<Example of change>
Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made to the embodiment of the present invention other than the above.

  For example, in the above embodiment, the break is performed in a state where the first substrate is directed downward and the second substrate is directed upward, but the first substrate is directed upward and the second substrate is directed downward. A break may be performed in the state where In this case, the scribe line L5 is provided on the upper surface side, and when the substrate unit G3 is generated by the break devices 18 and 21, the notch G3a faces upward. Thus, when the notch G3a is directed upward immediately after the break, the substrate unit G3 does not need to be reversed upside down by the rotary transfer units 23 and 27.

  However, in this case, the separated end G2a remains on the substrate unit G3. Therefore, before the substrate unit G3 is conveyed to the inspection units 25 and 29, the end G2a riding on the substrate unit G3 is removed by blowing air or the like.

  Moreover, in the said embodiment, although the board | substrate unit G3 broken by the breaking apparatuses 18 and 21 was each reversed by the rotation transfer parts 23 and 27, respectively, it is not restricted to this and does not need to be reversed. In this case, since the notch part G3a faces the lower surface side in the inspection parts 25 and 29, the inspection parts 25 and 29 inspect that the notch part G3a is formed from the lower side of the substrate unit G3. . In this case, for example, the inspection units 25 and 29 detect the presence / absence of the notch G3a from below the inspection table that transmits the laser beam or from below through the gap of the table on which the substrate unit G3 is placed. It is configured as follows. However, in this case, the configuration of the inspection units 25 and 29 becomes complicated as compared with the above embodiment. Therefore, as in the above-described embodiment, it is desirable that the inspection units 25 and 29 inspect that the cutout portion G3a is formed from above with the cutout portion G3a facing upward.

  Moreover, in the said embodiment, the board | substrate unit G3 determined that the notch part G3a was not formed was collect | recovered by the collection | recovery part in the X-axis negative side of the conveyor 510. FIG. However, the present invention is not limited thereto, and the substrate unit G3 that is determined not to have the notch G3a may be transferred to the conveyor 17 or the conveyor 20 again after being reversed. In this case, the first substrate is again broken along the scribe line L5 by the break device 18 or the break device 21.

  Moreover, in the said embodiment, although the test | inspection parts 25 and 29 were provided with the conveyor 510 for conveying the board | substrate unit G3 to an X-axis direction, the conveyors 26 and 30 are each used as a conveyor for conveying the board | substrate unit G3. May be used.

  FIG. 12 is a diagram illustrating a configuration of the inspection unit 25 in this case. In this case, the conveyor 510, the rail 520, and the transfer unit 550 are omitted from the inspection unit 25. The gate 530 is fixed in the break system 1 so as to straddle the vicinity of the intermediate position of the conveyor 26, and the sensor 540 is fixed to the lower surface of a member extending in the Y-axis direction of the gate 530.

  Referring to FIG. 12, when the rotation transfer unit 24 receives the substrate unit G3 from the rotation transfer unit 23, the rotation transfer unit 24 places the received substrate unit G3 at a position P5 on the conveyor 26. The substrate unit G3 at the position P5 is transported in the positive direction of the X axis by the conveyor. At this time, the distance to the upper surface is detected by the sensor 540 with respect to the substrate unit G3 traveling in the positive direction of the X axis, and it is inspected that the notch G3a is formed as in the above embodiment. If the notch G3a is not formed, the board unit G3 is dropped to the X axis positive side of the conveyor 26 and is collected by a collection unit (not shown). When the notch G3a is formed, the substrate unit G3 is positioned at the position P6. And the board | substrate unit G3 in which the notch part G3a is formed is carried out to the apparatus of a back | latter stage like the said embodiment.

  As shown in FIG. 12, when the inspection unit 25 uses another conveyor, the inspection unit 25 may be installed near the end on the negative side of the X axis of the conveyor 26, near the intermediate position of the conveyor 19. May be installed. The inspection units 25 and 29 may use the conveyor 34 as a conveyor for conveying the substrate unit G3.

  Moreover, in the said embodiment, after test | inspection by the test | inspection part 25, the board | substrate unit G3 is conveyed to the conveyor 26 by the rotation transfer part 24, and after test | inspection by the test | inspection part 29, board | substrate unit G3 is It was conveyed to the conveyor 30 by the rotary transfer unit 28. However, the present invention is not limited to this, and the conveyors 26 and 30, the transfer units 31 and 32, and the guide 33 are omitted, and after the inspection units 25 and 29 perform the inspection, 28 may be conveyed to the conveyor 34.

  The substrate unit G3 on the conveyor 19 is transferred to the inspection unit 25 and the conveyor 26 while turning by the rotation transfer units 23 and 24, and the substrate unit G3 on the conveyor 22 is turned by the rotation transfer units 27 and 28. However, it was transferred to the inspection unit 29 and the conveyor 30. However, instead of the rotation transfer units 23, 24, 27, and 28, a transfer unit that linearly transfers the substrate unit G3 may be provided. However, in this case, the installation space for the transfer unit becomes larger than in the above embodiment. Therefore, it is desirable that the substrate unit G3 is transferred by the rotation transfer units 23, 24, 27, and 28 as in the above embodiment.

  In the above embodiment, in the break device 12, the two break units 12a have the same configuration, in the break device 18, the two break units 18a have the same configuration, and in the break device 21, the two break units 21a had the same configuration. However, the present invention is not limited to this, and the two break units do not necessarily have the same configuration.

  In the above embodiment, the motor 201 and the ball screw 202 support the break bar 107 at two locations by the support member 204. However, the present invention is not limited to this, and the support member 204 supports the break bar 107 at three or more locations. Also good. In this case, the support member 204 is fixed to the break bar 107 at three or more portions separated in the Y-axis direction. In the break devices 18 and 21, since the break bar 107 has a short length in the Y-axis direction, the motor 201 and the ball screw 202 may support the break bar 107 at one place by the support member 204.

  Moreover, in the said embodiment, as shown to Fig.4 (a), (b), the edge part by the side of the board | substrate of the wall part 106c is a position away from the board | substrate rather than the edge part by the side of the board | substrate of the receiving part 106a. It was done. However, the present invention is not limited to this, and the end of the wall 106c on the substrate side in the Z-axis direction may be at the same position as the end of the receiving portion 106a on the substrate.

  Moreover, in the said embodiment, although the receiving part 106a was made into the shape shown to Fig.4 (a), not only this but another shape may be sufficient. For example, the inner surface of the receiving portion 106a is also inclined toward the outer side of the accommodating portion 106, so that the receiving portion 106a may be formed in a V shape when viewed in the Y-axis direction. Further, when viewed in the Y-axis direction, the outer surface and the inner surface of the receiving portion 106a may be formed in an arc shape. Further, when viewed in the Y-axis direction, the receiving portion 106a may be formed in a rectangular shape.

  In the above embodiment, the receiving portion 106a is continuously formed at the substrate-side end of the accommodating portion 106. However, the present invention is not limited to this, and the receiving portion 106a may be partially formed. The direction in which the receiving portion 106a is formed is parallel to the scribe line, but may not be parallel to the scribe line. Moreover, although the receiving part 106a was formed in linear form, you may meander.

  The embodiment of the present invention can be appropriately modified in various ways within the scope of the technical idea shown in the claims.

1 Break system 18, 21 Break device 19, 22, 26, 30, 34 Conveyor (conveyance unit)
23, 27 Rotation transfer part (conveyance part, first transfer part)
24, 28 Rotation transfer part (conveyance part, second transfer part)
25, 29 Inspection part 31, 32 Transfer part (conveyance part)
330 Drive unit (separation means)
334, 431 Suction pad (holding part)
540 sensor (optical displacement sensor)
G2 board G2a end G3 board unit G3a notch

Claims (8)

A breaking device that breaks the substrate on which the first substrate and the second substrate are bonded together to generate a substrate unit;
A transport unit for transporting the substrate unit generated by the break device to a subsequent device;
An inspection unit for inspecting the substrate unit generated by the break device,
The breaking device performs a step of breaking an end portion of the first substrate facing the terminal in order to expose a terminal formed on the second substrate when generating the substrate unit;
The transport unit includes separation means for separating the end portion broken by the break device from the substrate unit in the transport process of the substrate unit,
The inspection unit is disposed downstream of the separation unit on the conveyance path of the substrate unit in the conveyance unit, and the terminal is exposed by the separation of the end from the substrate unit by the separation unit. Inspecting and removing the substrate unit from which the terminal is not exposed from the transport path,
Break system characterized by that. The break system according to claim 1,
The break device breaks an end of the first substrate in a state where the first substrate is directed downward,
The separating means lifts the substrate unit having the end portion broken to separate the lower surface of the substrate unit from the conveyance path.
Break system characterized by that. The break system according to claim 2,
The transport unit transports the substrate unit lifted by the separating unit upside down and transports it to the inspection unit.
Break system characterized by that. In the break system according to claim 3,
The transport unit includes a first transport unit that lifts the substrate unit and then reverses and transports the substrate unit, and a second transport unit that receives the transported substrate unit and transports the substrate unit to the inspection unit.
Break system characterized by that. The break system according to claim 4,
The first transfer unit and the second transfer unit are configured to rotate while holding the substrate unit by a holding unit, respectively, and a part of the turning path of the holding unit of the first transfer unit and the second transfer unit. Arranged so that a part of the turning path of the holding part of the transfer part overlap each other in plan view,
The substrate unit is transferred from the first transfer unit to the second transfer unit at a position where the two swivel paths overlap each other.
Break system characterized by that. In the break system according to any one of claims 1 to 5,
The inspection unit inspects that the terminal is properly exposed by detecting the presence or absence of a notch formed by removing the end by an optical displacement sensor.
Break system characterized by that. The break system according to claim 6,
The inspection unit inspects that the notch is formed in the substrate unit by moving the optical displacement sensor relative to the substrate unit in a direction across the notch.
Break system characterized by that. The break system according to claim 7,
The transport unit includes a conveyor that transports the substrate unit to the downstream of the transport path, and the transport direction of the conveyor is set in a direction crossing the notch,
The inspection unit detects the presence or absence of the notch by irradiating the substrate unit conveyed by the conveyor with light.
Break system characterized by that.

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