TWI684577B - Rupture system - Google Patents

Abstract

The invention provides a breaking system which can omit the inspection work of the operator and can improve the working efficiency after breaking.

The breaking devices 18 and 21 break the substrate G2 formed by bonding the first substrate and the second substrate to generate the substrate unit G3. When generating the substrate unit G3, the cleaving devices 18 and 21 perform a step of cleaving the end of the first substrate facing the terminal in order to expose the terminal formed on the second substrate. The ends of the splitting devices 18 and 21 are separated from the substrate unit G3 during the transfer of the substrate unit G3. The inspection units 25 and 29 inspect the terminal unit by separating the end portion from the substrate unit G3 to expose the terminal, thereby detaching the substrate unit G3 without the terminal from the conveyance path.

Description

Rupture system

The present invention relates to a breaking system used when breaking a substrate.

In general, the manufacturing process of a liquid crystal panel includes a cleaving step of cutting out a substrate unit that is a prototype of a liquid crystal panel from a so-called bonded substrate formed by bonding a first substrate and a second substrate. For example, a color filter is formed on the first substrate, and a thin film transistor (TFT) for driving liquid crystal and terminals for external connection are formed on the second substrate. The terminals of the second board must be exposed because they are connected to external equipment. Therefore, in the splitting step, in addition to the step of splitting the first substrate and the second substrate along the scribe line to form a substrate unit, further, in order to expose the terminals formed on the second substrate, It includes the step of breaking the end of the first substrate facing the terminal along the scribe line.

Patent Document 1 below describes that in a liquid crystal substrate in which a thin-film transistor array substrate and a color filter substrate are opposed to each other, the terminal is exposed by cutting and removing the ends The cutting method of the LCD panel.

Patent Document 1: Japanese Patent Laid-Open No. 2003-241173

The substrate unit generated by the above method is then further supplied to post-processing steps such as grinding or washing. In order to smoothly perform the post-processing step, it is necessary to surely remove the end of the first substrate and expose the terminals of the substrate unit in the breaking step. Therefore, for the operator, must It is necessary to check whether the terminals are properly and correctly exposed for each substrate unit, and to distinguish the substrate units that should be supplied to the post-processing step according to the inspection results.

In view of this problem, an object of the present invention is to provide a breaking system that can omit the inspection work of the operator and can improve the work efficiency after breaking.

The splitting system of the main aspect of the present invention includes a splitting device for splitting a substrate formed by bonding a first substrate and a second substrate to generate a substrate unit, and a substrate for generating the substrate by the splitting device A transfer unit for transferring the unit to the rear stage device, and an inspection unit for inspecting the substrate unit generated by the cleaving device. The cleaving device, when generating the substrate unit, performs a step of cleaving the end of the first substrate facing the terminal in order to expose the terminal formed on the second substrate; A separating means for separating the end portion broken by the breaking device from the substrate unit during the transportation of the substrate unit; the inspection portion is arranged on the transportation path of the substrate unit in the transportation portion On the downstream side of the separation means, it is checked that the end is separated from the substrate unit by the separation means and the terminal is exposed, so that the substrate unit that does not expose the terminal is detached from the conveyance path.

According to the splitting system of this aspect, during the transfer of the substrate unit generated by the splitting device to the subsequent device, the end is separated from the substrate unit and its inspection is performed, and only the terminals are properly and correctly exposed The substrate unit is automatically transferred to the rear device. Therefore, it is not necessary for the operator to separately check whether the terminals are properly and correctly exposed for each substrate unit, and to distinguish the operations of the substrate units to be supplied to the subsequent device according to the inspection result. Thus, according to the splitting system of this aspect, it is possible to improve the operating efficiency after splitting in each section.

The fracturing system of this aspect may be constituted as follows: the fracturing device, in the state where the first substrate is facing down, fractures the end of the first substrate; the separating means, picks up the The substrate unit at the end is broken, and the lower surface of the substrate unit is separated from the conveyance path. According to this, since the end portion is separated from the substrate unit by its own weight when the substrate unit is picked up, the end portion can be automatically removed.

In this case, the following configuration may be adopted: The conveying section inverts the front and back surfaces of the substrate unit picked up by the separating means and conveys the inspection section. According to this, since the substrate unit is transported to the inspection section with the terminal facing upward, the inspection section can be exposed from the inspection terminal above the substrate unit. According to this, for example, when the substrate unit is placed on a conveyor belt for conveyance, it is possible to easily arrange the inspection section with a simplified structure in the empty space above the conveyor belt.

In this case, it may be configured as follows: the conveying section includes a first transfer section that reverses the front and back sides of the substrate unit after picking up and transfers the same, and receives the substrate unit that has been reversed from the front and back sides The second transfer unit transported by the inspection unit. According to this, the front and back of the substrate unit and the transfer to the inspection section can be smoothly performed.

In this case, the following configuration may be adopted: the first transfer part and the second transfer part respectively hold the substrate unit and rotate by the holding part, and a part of the rotation path of the holding part of the first transfer part and the A part of the turning path of the holding portion of the second transfer portion is arranged to overlap each other in a plan view, and at a position where the two turning paths overlap each other, the substrate unit is transferred from the first transfer portion to the second transfer portion . According to this, the arrangement space of the first transfer section and the second transfer section can be simplified, and the substrate unit can be smoothly transferred from the first transfer section to the second transfer section.

In the splitting system of this aspect, the following configuration may be adopted: the inspection section detects the presence or absence of the notch formed by removing the end by an optical displacement sensor, thereby inspecting the end The child is exposed properly and correctly. According to this, the exposed terminal can be inspected without contacting the substrate unit.

In this case, the configuration may be as follows: the inspection portion moves the optical displacement sensor relative to the substrate unit in a direction transverse to the notch portion to inspect the notch portion formed on the substrate unit. According to this, compared with the case of inspecting the entire surface of the substrate unit, it is possible to inspect the formation of the notch more efficiently.

In this case, the conveying section is provided with a conveying device that conveys the substrate unit downstream of the conveying path. The conveying direction of the conveying device is set to be transverse to the notch. The inspection section is equipped with the conveying device. The conveyed substrate unit irradiates light to detect the presence or absence of the notch. According to this, since it is not necessary to separately provide a means for relatively moving the optical displacement sensor relative to the substrate unit for inspection, it is possible to achieve a simplified structure.

As described above, according to the present invention, it is possible to provide a breaking system that can omit the inspection work performed by the operator and can improve the work efficiency after breaking.

The effect and meaning of the present invention will be more clear from the description of the embodiments shown below. However, the embodiments shown below are only an example when implementing the present invention, and the present invention is not limited to the contents described in the following embodiments.

1‧‧‧Fracture system

18.21‧‧‧Breaking device

19, 22, 26, 30, 34 ‧‧‧ Conveyor (Transport Department)

23, 27‧‧‧Rotary transfer section (transfer section, first transfer section)

24, 28‧‧‧Rotary transfer section (transfer section, second transfer section)

25, 29‧‧‧ Inspection Department

31, 32‧‧‧ Transfer Department (Transport Department)

330‧‧‧Drive unit (separation means)

334,431‧‧‧Adsorption pad (holding part)

540‧‧‧sensor (optical displacement sensor)

G2‧‧‧ substrate

G2a‧‧‧End

G3‧‧‧ substrate unit

G3a‧‧‧Notch

FIG. 1 is a schematic diagram showing the structure of the cleavage system of the embodiment.

Fig. 2 is a diagram showing the sequence of breaking the substrate in the embodiment.

Fig. 3(a) is a side view showing the configuration of the breaking device of the embodiment; Figs. 3(b) and (c) are side views showing the state when the first substrate and the second substrate of the embodiment are broken, respectively .

4(a) and (b) show the structure of the breaking unit of the embodiment from the holding member to the substrate side Section view.

Fig. 5 is a cross-sectional view showing the structure of the split unit according to the embodiment.

6(a) and (b) are diagrams showing the cracking of the substrate in the embodiment in detail.

7(a) and (b) are schematic diagrams showing the structure of the upstream and downstream cleavage units of the embodiment, respectively.

FIG. 8 is a diagram showing a configuration in which a notch is formed on a substrate in the inspection of the embodiment.

9(a) to (d) are diagrams showing the detailed structure of the inspection section of the embodiment.

10(a) to (d) are side views showing the structure of the inspection section of the embodiment.

Fig. 11 is a flowchart showing the processing performed by the cleavage system of the embodiment.

FIG. 12 is a diagram showing the configuration of the inspection to form a notch on the substrate in the modification.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each figure, XYZ axes orthogonal to each other are marked for convenience of explanation. The X-Y plane system is parallel to the horizontal plane, and the positive direction of the Z axis is perpendicular to the upward direction.

FIG. 1 is a schematic diagram showing the structure of the fracturing system 1.

On the upstream side (negative X-axis side) of the cleavage system 1, a scribing device (not shown) for providing a scribing line to the substrate G1 is provided. The cleavage system 1 receives the substrate G1 transferred from the scoring device, generates the substrate G2 by cleaving the substrate G1 along the scribe line, and generates the liquid crystal by cleaving the substrate G2 along the scribe line The base unit G3 of the prototype of the panel.

The substrate G1 is a mother substrate from which the substrate unit G3 is cut out, and is composed of a so-called bonded substrate formed by bonding the first substrate and the second substrate to each other. On the first substrate, a color filter is formed, and on the second substrate, a thin film transistor (TFT) for driving liquid crystal and external connection are formed 之的terminal. The first substrate and the second substrate are bonded via a sealing material, and liquid crystal is injected into a region formed by the first substrate, the second substrate, and the sealing material. A scribe line is formed along the sealing material on the outer surface of the first substrate and the outer surface of the second substrate. The substrate G1 is transferred from the scribing device to the cleavage system 1 so that the first substrate is located on the lower surface side (Z axis negative side).

Breaking system 1, equipped with conveying devices 11, 13, 17, 19, 20, 22, 26, 30, 34, breaking devices 12, 18, 21, transfer parts 14, 15, 31, 32, guides 16, 33 , Rotational transfer sections 23, 24, 27, 28, and inspection sections 25, 29.

The transport device 11 transports the substrate G1 transferred from the upstream scoring device in the positive X-axis direction. The fracturing device 12 includes a fracturing unit 12a arranged on the first substrate side and the second substrate side of the substrate G1, respectively. The two breaking units 12a are located between the conveying device 11 and the conveying device 13 when viewed in the Z-axis direction. The splitting device 12 splits the substrate G1 by the two splitting units 12a to generate the substrate G2. The transport device 13 transports the generated substrate G2 in the positive direction of the X axis, and is positioned at a holding position where the transport units 14 and 15 hold it.

The transfer sections 14 and 15 are configured to be movable in the Y-axis direction along the guide 16 extending in the Y-axis direction. The transfer sections 14 and 15 suck the substrate G2 positioned at the holding position on the transfer device 13 from the upper side and suck it up. The transfer unit 14 moves the sucked substrate G2 in the positive direction of the Y axis, rotates it by 90 degrees, and places it on the transfer device 17. The transfer unit 15 moves the sucked substrate G2 in the negative direction of the Y axis, rotates it by 90 degrees, and places it on the conveyor 20. The substrate G2 generated from the substrate G1 is alternately conveyed to the conveying devices 17 and 20 by the transfer sections 14 and 15.

The conveying device 17 conveys the substrate G2 in the positive direction of the X axis. The cleaving device 18 includes a cleaving unit 18a arranged on the first substrate side and the second substrate side of the substrate G2, respectively. The two breaking units 18a are located between the conveying device 17 and the conveying device 19 when viewed in the Z-axis direction. The splitting device 18 splits the substrate G2 by the two splitting units 18a to generate the substrate unit G3. The conveying device 19 conveys the generated substrate unit G3 in the positive direction of the X axis, and is positioned at the end of the positive side of the conveying device 19 on the X axis.

Similarly, the transport device 20 transports the substrate G2 in the positive X-axis direction. The cleaving device 21 includes a cleaving unit 21a arranged on the first substrate side and the second substrate side of the substrate G2, respectively. The two breaking units 21a are located between the conveying device 20 and the conveying device 22 when viewed in the Z-axis direction. The splitting device 21 splits the substrate G2 by two splitting units 21a to generate a substrate unit G3. The transport device 22 transports the generated substrate unit G3 in the positive direction of the X axis, and is positioned at the end of the transport device 22 on the positive side of the X axis.

The rotary transfer unit 23 sucks up the substrate unit G3 positioned at the end of the positive side of the X axis of the conveying device 19, reverses the front and back surfaces of the suctioned substrate unit G3, and transfers it to the rotary transfer unit 24. The rotary transfer unit 24 transfers the substrate unit G3 received from the rotary transfer unit 23 to the inspection unit 25. The inspection unit 25 checks the substrate unit G3 that the cleaving by the cleaving device 18 has been properly and correctly performed. The rotary transfer unit 24 places the substrate unit G3 that has been determined to be appropriate and correct by inspection toward the end of the negative side of the X axis of the conveyor 26. The transport device 26 transports the substrate unit G3 in the positive X-axis direction, and is positioned at the end of the transport device 26 on the positive X-axis side.

Similarly, the rotary transfer unit 27 sucks the substrate unit G3 positioned at the end of the positive side of the X axis of the conveying device 22, reverses the front and back surfaces of the sucked substrate unit G3 and transfers it to the rotary transfer unit 28. The rotary transfer unit 28 transfers the substrate unit G3 received from the rotary transfer unit 27 to the inspection unit 29. The inspection unit 29 checks the substrate unit G3 that the cleaving by the cleaving device 21 has been properly and correctly performed. The rotary transfer unit 28 places the substrate unit G3 that has been determined to be appropriate and correct by inspection toward the end of the transport device 30 on the negative side of the X axis. Conveyor 30. The substrate unit G3 is transported in the positive direction of the X axis, and is positioned at the end of the positive side of the transport device 30 on the X axis.

The transfer sections 31 and 32 are configured to be movable in the Y-axis direction along the guide 33 extending in the Y-axis direction. The transfer units 31 and 32 suck the substrate unit G3 positioned at the end of the positive side of the X-axis of the transport devices 26 and 30 by suction from the upper side. The transfer sections 31 and 32 move the sucked substrate unit G3 in the negative Y-axis direction and the positive Y-axis direction, respectively, and are placed on the end of the conveyor device 34 on the negative X-axis side. The conveying device 34 conveys the substrate unit G3 in the positive direction of the X axis, and carries it out to a device (not shown) that performs polishing and washing in the subsequent stage. Accordingly, the processing of the breaking system 1 is ended.

FIG. 2 is a diagram showing the sequence of generating the substrate G2 and the substrate unit G3 from the substrate G1. 2 is a diagram of the substrates G1 and G2 and the substrate unit G3 transported in the cleavage system 1 as viewed from above. In addition, the substrate G2 and the substrate unit G3 are also shown together in corresponding side views.

The substrate G1 transferred to the cleavage system 1 is formed with scoring lines L1 to L5 by an upstream scoring device. The scribe line L1 is formed along the Y-axis direction under the first substrate of the substrate G1. The scribe line L2 is formed along the Y-axis direction on the upper surface of the second substrate of the substrate G1. When viewed in the Z-axis direction, the positions of the scribe lines L1 and L2 are the same. The scribe lines L3 and L5 are formed along the X-axis direction under the first substrate of the substrate G1. The scribe line L4 is formed along the X-axis direction on the upper surface of the second substrate of the substrate G1. When viewed in the Z-axis direction, the positions of the scribe lines L3 and L4 are the same, and the positions of the scribe lines L3 and L4 are different from the positions of the scribe lines L5.

When the scribe lines L1 and L2 of the substrate G1 are transferred to the breaking position of the breaking device 12, the breaking device 12 breaks the first substrate and the second substrate along the scribe lines L1 and L2, respectively. With this, the substrate G2 is generated. The generated substrate G2 is passed through the transfer section 14 shown in FIG. 1, 15. After being transported to the positive direction of the Y axis and the negative direction of the Y axis, rotate 90 degrees clockwise as viewed in the Z axis direction, and place them on the conveying devices 17, 20.

Next, when the scribe line L5 of the substrate G2 is transferred to the breaking position of the cleaving device 18, the first substrate is cleaved along the scribe line L5 by the cleaving device 18. In addition, when the scribe lines L3 and L4 of the substrate G2 are transferred to the breaking position of the cleaving device 18, the cleaving device 18 cleaves the first substrate along the scribe line L3, and the second substrate The score line L4 is broken. With this, the substrate unit G3 is generated.

At this time, since the end portion G2a (diagonal portion) of the first substrate corresponding to the scribe lines L3 and L5 is separated, a notch portion G3a extending in the Y-axis direction is formed in the generated substrate unit G3. As described above, when the end portion G2a is separated to form the notch portion G3a, the terminal formed on the second substrate is exposed.

Similarly, when the scribe lines L3, L4, and L5 of the substrate G2 are transported to the cleavage position of the cleavage device 21, the cleavage device 21 cleaves the first substrate along the scribe lines L3, L5. The second substrate is broken along the scribe line L4. With this, the substrate unit G3 is generated, and the notched portion G3a is formed in the generated substrate unit G3.

FIG. 3(a) is a side view when the cleaving device 12 is viewed from the negative direction of the Y axis.

As described above, the breaking device 12 includes two breaking units 12a. The two cleavage units 12a are arranged so as to face each other across the substrate G1 being transported on the conveying device 11, and have a configuration symmetrical to each other with the substrate G1 as a plane of symmetry. The structure of the upper split unit 12a will be described below with reference to FIG. 3(a).

The breaking unit 12a includes a holding member 101, a guide 102, a cylinder 103, a sliding member 104, a holding member 105, a receiving portion 106, and a breaking bar 107.

The holding member 101 is fixedly installed in the fracturing system 1, and holds the guide 102 extending in the Z-axis direction and the cylinder 103 having the rod 103a. The sliding member 104 is configured to be slidable along the guide 102 in the Z-axis direction. The lower end of the rod 103a of the cylinder 103 is provided above the sliding member 104. As the rod 103a of the cylinder 103 moves in the Z-axis direction, the sliding member 104 moves along the guide 102 in the Z-axis direction. The holding member 105 is provided under the sliding member 104, and the accommodating portion 106 is provided under the holding member 105.

In the housing portion 106, a breaking bar 107 is arranged, and the breaking bar 107 extends in the Y-axis direction along the scribe lines L1, L2 of the substrate G1. At the lower end of the splitting bar 107, an end 107a extending in the Y-axis direction is formed. The breaking rod 107 is supported in the housing 106 by the following mechanism so as to be movable in the Z-axis direction. At the lower end of the accommodating portion 106, two receiving portions 106a extending in the Y-axis direction are formed, and the two receiving portions 106a are located at a position sandwiching the breaking bar 107. In addition, the mechanism inside the accommodating portion 106, the breaking bar 107, and the accommodating portion 106 will be described below with reference to FIGS. 4(a) to 5.

FIG. 3(b) is a side view showing the state when the first substrate under the substrate G1 is broken, and FIG. 3(c) is showing the state when the second substrate under the substrate G1 is broken. Side view of the state.

When the substrate G1 is transported in the positive direction of the X axis, as shown in FIG. 3(a), when the scribe lines L1, L2 are positioned at the end 107a of the breaking bar 107, as shown in FIG. 3(b), Drive the breaking device 12. Specifically, by driving the upper breaking bar 107 downward, the end 107a of the upper breaking bar 107 is pressed against the second substrate. In addition, by driving the lower rod 103a upward, the receiving portion 106a of the lower receiving portion 106 is pressed against the first substrate.

As described above, pressing the end 107a against the scribe line L2 of the second substrate The receiving portion 106a is pressed against a position on the first substrate that is offset from the scribe line L1 by a predetermined width in the positive X-axis direction and the negative X-axis direction. As a result, the first substrate is broken along the scribe line L1. The cracking of the first substrate will be described in detail below with reference to FIG. 6(a).

When the first substrate is broken, the position of the substrate G1 does not move, and then, as shown in FIG. 3(c), the breaking device 12 is driven. Specifically, the upper breaking rod 107 is driven upward, and the upper rod 103a is driven downward, whereby the receiving portion 106a of the upper receiving portion 106 is pressed against the second substrate. In addition, the lower rod 103a is driven downward, and the lower breaking rod 107 is driven upward, whereby the end 107a of the lower breaking rod 107 is pressed against the first substrate.

As described above, the end portion 107a is pressed against the scribe line L1 of the first substrate, and the receiving portion 106a is pressed against the position of the second substrate offset from the scribe line L2 by a predetermined width in the positive X-axis direction and the negative X-axis direction . As a result, the second substrate is broken along the scribe line L2. The breakage of the second substrate will be described in detail below with reference to FIG. 6(b).

FIGS. 4(a), (b) and FIG. 5 are cross-sectional views showing the configuration below from the holding member 105 of the upper breaking unit 12a. 4(a) is a cross-sectional view of A1-A2 shown in FIG. 4(b), FIG. 4(b) is a cross-sectional view of B1-B2 shown in FIG. 4(a), and FIG. 5 is a view of FIG. 4(a), ( b) The C1-C2 cross-sectional view shown. The A1-A2 section is a section parallel to the XZ plane, the B1-B2 section is a section parallel to the YZ plane, and the C1-C2 section is a section parallel to the XY plane.

As shown in FIGS. 4( a ), (b) and FIG. 5, the accommodating portion 106 is composed of two wall portions 106 b parallel to the YZ plane and two wall portions 106 c parallel to the XZ plane. As shown in FIGS. 4(a) and (b), the receiving portion 106a is formed at the lower end of the two wall portions 106b. The outer surface of the receiving portion 106a is inclined toward the inner side of the receiving portion 106, whereby the width of the receiving portion 106a in the X-axis direction (in the horizontal direction) The width in the direction transverse to the scribe lines L1, L2) becomes narrower as it approaches the substrate G1. The lower ends of the two wall portions 106c are positioned above the lower ends of the receiving portions 106a.

In the space surrounded by the wall portions 106b, 106c, the motor 201, the ball screw 202, the support members 203, 204, and the breaking bar 107 are housed. The motor 201 is provided below the holding member 105. The ball screw 202 is fixed to the rotating shaft of the motor 201. The support member 203 is fixed to the nut of the ball screw 202. The upper end of the support member 204 is fixed below the support member 203. The lower end of the support member 204 is divided into two. The two lower ends of the support member 204 are located at positions separated in the Y-axis direction, and the breakage bar 107 is fixed to the lower end. The side surface of the end portion 107a of the breaking bar 107 is inclined, whereby the width of the end portion 107a in the X-axis direction becomes narrower as it approaches the substrate G1. That is, the end 107a of the breaking bar 107 is formed in a V-shape.

As shown in FIGS. 4(a), (b) and FIG. 5, a concave portion 106d is formed on the inner surface of the wall portion 106c. The recesses 106d of the wall portion 106c on the positive side of the Y axis and the negative side of the Y axis respectively accommodate the ends of the positive side of the breaking bar 107 on the positive side and the negative side of the Y axis.

As shown in FIG. 5, when the width of the substrate G1 in the Y-axis direction is W1, the distance between the inner surface of the wall portion 106c on the positive side of the Y-axis and the inner surface of the wall portion 106c on the negative side of the Y-axis is W2, The interval between the positive Y-axis side surface of the concave portion 106d on the positive Y-axis side and the negative Y-axis side surface of the concave portion 106d on the negative Y-axis side is W3, and the outer side surface of the wall portion 106c on the positive Y-axis side and the negative side of the Y-axis side When the interval between the outer surfaces of the wall portion 106c is W4, the relationship of W1 to W4 is W1<W2<W3<W4. When the width of the breaking bar 107 in the X-axis direction is W5 and the width of the recess 106d in the X-axis direction is W6, the relationship between W5 and W6 is W5<W6.

4(a) and (b), when the splitting bar 107 is moved downward, the motor 201 is driven so that the nut of the ball screw 202 moves downward. This is used to support The support members 203 and 204 of the breaking bar 107 move downward, and the breaking bar 107 moves downward. On the other hand, when the splitting bar 107 is moved upward, the motor 201 is driven so that the nut of the ball screw 202 moves upward. As a result, the support members 203 and 204 for supporting the splitting bar 107 move upward, and the splitting bar 107 moves upward. At this time, the splitting bar 107 is guided to the concave portion 106d, and it is surely moved only in the vertical direction.

6(a) and (b) are diagrams showing in detail that the substrate G1 is broken by the receiving portion 106a of the receiving portion 106 and the end portion 107a of the breaking bar 107. Figures 6(a) and (b) are the same A1-A2 cross-sectional views as in Figure 4(a).

As shown in FIG. 6(a), when the first substrate is broken, the end 107a of the upper breaking bar 107 is pressed against the second substrate, and the receiving portion 106a of the lower receiving portion 106 is pressed against Below the first substrate. At this time, the first substrate is broken by bending the substrate G1 downward. As shown in FIG. 6(b), when the second substrate is broken, the receiving portion 106a of the upper receiving portion 106 is pressed against the second substrate, and the end 107a of the lower breaking bar 107 is pressed against Below the first substrate. At this time, the second substrate is broken by the upward bending of the substrate G1.

Although the structure of the breaking device 12 and the operation of breaking the substrate G1 with the breaking device 12 have been described above with reference to FIGS. 3(a) to 6(b), the structure of the breaking device 18 and the breaking The operation of the breaking device 18 to break the substrate G2 is also substantially the same, and the structure of the breaking device 21 is also substantially the same as the operation of the breaking device 21 to break the substrate G2.

FIG. 7(a) is a schematic diagram showing the fracturing unit 12a above the fracturing device 12, and FIG. 7(b) is a schematic diagram showing the fracturing unit 18a, 21a above the fracturing device 18. In addition, the breaking devices 18 and 21 have the same configuration.

As shown in FIGS. 7(a) and (b), the breaking units 18a and 21a are opposite to the breaking unit 12a. In comparison, the length of the holding member 105, the accommodating portion 106, and the breaking bar 107 in the Y-axis direction is shorter. The other structures of the breaking units 18a and 21a are the same as those of the breaking unit 12a.

In addition, in the breaking units 18a and 21a, the relationship of the lengths of W1 to W4 shown in FIG. 5 is set to be the same. That is, in FIG. 5, if W1 is the width of the substrate G2 in the Y-axis direction and W2 to W4 are the corresponding lengths of the split units 18a and 21a, then the relationship between W1 to W4 and the split unit 12a Same as W1<W2<W3<W4.

In addition, the two breaking units 18a of the breaking device 18 are arranged so as to face each other across the substrate G2, and have a configuration symmetrical to each other with the substrate G2 as a plane of symmetry. Similarly, the two cleaving units 21a of the cleaving device 21 are arranged so as to face each other across the substrate G2, and have a configuration symmetrical to each other with the substrate G2 as a plane of symmetry. Therefore, the cleaving devices 18 and 21 can cleave the substrate G2 similarly to the cleaving device 12.

Next, the configuration and processing for inspecting the notch G3a formed on the substrate unit G3 will be described. Here, the conveying devices 19, 26, the rotary transfer parts 23, 24, and the inspection part 25, and the conveying devices 22, 30, the rotary transfer parts 27, 28, and the inspection part 29 are respectively symmetrical about the XZ plane. Symmetrical composition. Therefore, in the following, the case of inspecting the substrate unit G3 generated by the cleaving device 18 will be described, and the description of the case of inspecting the substrate unit G3 generated by the cleaving device 21 will be omitted.

FIG. 8 is a diagram of the configuration including the periphery of the conveying devices 19 and 26, the rotary transfer units 23 and 24, and the inspection unit 25 when viewed from above. In FIG. 8, for ease of explanation, the illustration of the breaking device 18 is omitted.

The rotary transfer unit 23 includes a shaft 310 extending in the Z-axis direction, and the shaft 310 is used as The rotating body 320 that rotates in the center, and the four driving parts 330 provided on the side surfaces of the rotating body 320. The driving unit 330 includes a support portion 331, a shaft 332 supported by the support portion 331, a suction pad support portion 333 provided at the front end of the shaft 332, and a suction pad 334 supported by the suction pad support portion 333. The driving unit 330 moves up and down relative to the rotating body 320, rotates the shaft 332 about the shaft 332, and allows the air in the suction pad 334 to enter and exit. By driving the driving unit 330, the substrate unit G3 moves up and down through the suction pad 334 and rotates the front and back surfaces.

The rotation transfer unit 24 includes an axis 410 extending in the Z-axis direction, a rotating body 420 rotating around the axis 410, and four driving units 430 provided below the rotating body 420. The driving unit 430 includes an adsorption pad 431. The driving unit 430 raises and lowers the suction pad 431 relative to the rotating body 420, and allows the air in the suction pad 431 to enter and exit. By driving the driving unit 430, the substrate unit G3 moves up and down through the suction pad 431. The inspection unit 25 includes a transport device 510, two rails 520, a gantry 530, a sensor 540, and a transfer unit 550.

The substrate unit G3 generated by the cleaving device 18 is conveyed by the conveying device 19 in the positive X-axis direction, and is positioned at the position P1 on the positive side of the conveying device 19 on the X-axis. The substrate unit G3 at the position P1 is sucked by the suction pad 334 and sucked up from the conveying path of the conveying device 19.

Here, the end G2a of the separated first substrate is also conveyed by the conveying device 19 together with the substrate unit G3 in the positive X-axis direction. Then, the substrate unit G3 is picked up by the suction pad 334 of the driving unit 330, and when the lower surface of the substrate unit G3 is separated from the conveyance path of the conveying device 19, the end portion G2a is separated from the substrate unit G3 due to its own weight. That is, the driving unit 330 separates the end G2a from the substrate unit G3. The end G2a separated from the substrate unit G3 and remaining on the conveyor 19 is further transported in the positive X-axis direction and dropped on the positive X-axis side of the conveyor 19 for recovery.

In addition, the end portion G2a may be separated from the substrate unit G3 by means other than the above after being broken by the breaking device 18 and transferred to the inspection portion 25. For example, the end G2a can also be separated by falling from between the conveying devices 17, 19, or can be separated by blowing air to fall from the conveying device 19, or can be adsorbed by other adsorption pads And remove.

Then, the rotating body 320 is rotated 90 degrees counterclockwise as viewed from the upper side, and the substrate unit G3 sucked up at the position P1 is positioned at the position P2. Then, the shaft 332 rotates around the shaft 332 to reverse the front and back surfaces of the substrate unit G3 at the position P2. Thereby, the notch portion G3a of the substrate unit G3 faces the upper surface side. Then, the rotating body 320 is rotated 90 degrees counterclockwise as viewed from the upper side, and the substrate unit G3 at the position P2 is positioned at the position P3.

Then, the substrate unit G3 at the position P3 is moved from the state supported by the suction pad 334 of the rotary transfer part 23 to the state suctioned by the suction pad 431 of the rotary transfer part 24. Then, the rotating body 420 is rotated 90 degrees clockwise as viewed from the upper side, and the substrate unit G3 is placed at the position P4 on the positive side of the X axis of the conveying device 510. In addition, when the substrate unit G3 is placed at the position P4, the rotating body 430 is rotated by 45 degrees, and the drive unit 430 is retracted to a position that does not interfere with the inspection of the inspection unit 25.

Then, the gantry 530 moves on the rail 520 in the positive direction of the X axis and is positioned directly above the substrate unit G3 at the position P4. Then, the sensor 540 is transferred by the transfer unit 550 in the negative direction of the Y axis. According to the detection signal of the sensor 540, the substrate unit G3 at the position P4 is inspected to form a notch G3a. The detailed configuration of the inspection unit 25 will be described below with reference to FIGS. 9(a) to (d).

When it is determined that the notch G3a is not formed, the substrate unit G3 at the position P4 is transported in the negative X-axis direction by the transport device 510, and falls on the negative X-axis side of the transport device 510. in On the negative side of the X axis of the conveying device 510, a recovery section (not shown) is provided, and the substrate unit G3 on which the notch G3a is not formed is recovered by the recovery section. On the other hand, when it is determined that the notch G3a is formed, the substrate unit G3 at the position P4 is sucked up again by the suction pad 431 of the rotary transfer part 24. Then, the rotating body 420 is rotated 90 degrees clockwise as viewed from the upper side, and the substrate unit G3 sucked up at the position P4 is placed at the position P5 on the negative side of the X axis of the conveyor 26. The substrate unit G3 at the position P5 is conveyed by the conveying device 26 in the positive X-axis direction, and is positioned at the position P6 on the positive side of the X-axis of the conveying device 26.

The substrate unit G3 at the position P6 is sucked up by the suction pad 31a of the transfer section 31. Then, the transfer unit 31 moves along the guide 33 in the negative direction of the Y axis, and places the substrate unit G3 on the transfer device 34. The substrate unit G3 placed on the conveying device 34 is conveyed by the conveying device 34 in the positive direction of the X axis, and is conveyed to the device at the subsequent stage.

9(a) to (d) are diagrams showing the configuration of the inspection section 25. 9(a) and (c) are perspective views of the inspection section 25, and FIGS. 9(b) and (d) are views of FIG. 9(a) and (c) viewed from above, respectively. In FIGS. 9(a) to (d), the substrate unit G3 at the position P4 is shown.

The two rails 520 are provided on the positive side of the Y axis and the negative side of the Y axis of the conveying device 510, and are fixed in the fracturing system 1. The gantry 530 is configured to slide on the two rails 520 in the X-axis direction. The sensor 540 is supported by the transfer portion 550 on the lower surface side of the member extending in the Y-axis direction of the gantry 530. The sensor 540 can be moved in the Y-axis direction by the transfer unit 550. The sensor 540 is an optical displacement sensor provided with a laser light source and a light receiving element (not shown). The sensor 540 emits laser light from the laser light source in the negative direction of the Z axis, and receives the laser light reflected by the object through the light receiving element. The sensor 540 outputs the light-receiving position on the light-receiving element as a detection signal. According to the detection signal of the sensor 540, the distance from the sensor 540 to the object is obtained by triangulation.

As shown in FIGS. 9(a) and (b), when the substrate unit G3 is placed at the position P4 of the conveying device 510, the gantry 530 is moved along the two rails 520 in the positive direction of the X axis, as shown in FIG. 9(c) As shown in (d), the sensor 540 is positioned directly above the substrate unit G3 at the position P4. When the sensor 540 is positioned directly above the substrate unit G3, laser light is emitted from the sensor 540, and the sensor 540 is transferred in the negative direction of the Y axis.

10(a) to (d) are side views of the inspection section 25 viewed in the negative direction of the X axis.

When the sensor 540 is positioned directly above the substrate unit G3 at the position P4 and the laser light is emitted from the laser light source of the sensor 540, as shown in FIG. 10(a), the laser light reflected through the substrate unit G3 is borrowed Received by the light receiving element of the sensor 540. Then, from the state shown in FIG. 10(a), the sensor 540 is transferred in the negative direction of the Y axis.

When the notch G3a is formed properly and correctly, when the sensor 540 is moved by a predetermined distance in the negative direction of the Y axis from the state shown in FIG. 10(a), as shown in FIG. 10(b), The distance from the sensor 540 to the object in the negative Z-axis direction is increased by the width of the notch G3a in the Z-axis direction. As described above, when the sensor 540 has been moved by a predetermined distance in the negative direction of the Y axis, the distance from the sensor 540 to the object in the negative direction of the Z axis becomes longer by the width of the notch G3a in the Z axis direction In this case, it is determined that a notch G3a is formed in the substrate unit G3.

On the other hand, if the cutout G3a is not formed properly and correctly, even if the sensor 540 is moved a predetermined distance in the negative direction of the Y axis from the state shown in FIG. 10(a), as shown in FIG. 10(c ), the distance from the sensor 540 to the object in the negative direction of the Z axis is also substantially unchanged. As described above, when the sensor 540 has been moved by a predetermined distance in the negative direction of the Y axis, and the distance from the sensor 540 to the object in the negative direction of the Z axis is substantially unchanged, it is determined that the substrate unit G3 does not have a notch G3a.

In addition, as shown in FIG. 10(d), the sensor 540 may be further moved in the negative direction of the Y axis. According to this, when the distance from the sensor 540 to the object changes in two stages, it can be determined that the notch G3a is formed. On the other hand, when the distance from the sensor 540 to the object changes only in one step, it can be determined that the notch G3a is not formed.

FIG. 11 is a flowchart showing the processing performed by the fracturing system 1.

When the substrate G1 is broken by the breaking device 12, the substrate G2 is generated (S11). The generated substrate G2 is transferred to the cleaving devices 18 and 21 (S12). When the substrate G2 is broken by the breaking devices 18 and 21, the substrate unit G3 is generated (S13). The substrate unit G3 generated by the cleaving device 18 is transferred to the inspection unit 25 by the conveying device 19 and the rotary transfer sections 23 and 24, and the substrate unit G3 generated by the cleaving device 21 is transferred by the conveying device 22 and The rotation transfer parts 27 and 28 transfer to the inspection part 29 (S14).

The inspection sections 25 and 29 inspect the substrate unit G3 to form a cutout G3a (S15). When the notch G3a is not formed (S16: NO), the substrate unit G3 is conveyed by the conveying device 510 in the negative direction of the X axis, whereby it is separated from the conveyance path and recovered by the recovery part (S17). When the notch G3a is formed (S16: YES), the substrate unit G3 is carried out to the device at the subsequent stage (S18). Specifically, the substrate unit G3 located in the inspection unit 25 is carried out by the rotary transfer unit 24, the transfer device 26, the transfer unit 31, and the transfer device 34 to the device in the subsequent stage. The substrate unit G3 located in the inspection section 29 is carried out by the rotation transfer section 28, the transfer device 30, the transfer section 32, and the transfer device 34 to the subsequent stage of the device.

<Effect of the embodiment>

According to this embodiment, the following effects can be exhibited.

During the transfer process of the substrate unit G3 generated by the cleaving devices 18 and 21 to the subsequent device, the end G2a is separated from the substrate unit G3 and inspected, and only the terminals that have been properly and correctly exposed The substrate unit G3 is automatically transferred to the rear stage device. Therefore, there is no need to separately perform the following operations, that is, the operator checks whether the terminals are properly and correctly exposed for each substrate unit G3, and distinguishes the substrate unit G3 to be moved to the subsequent device according to the inspection result. Thus, according to the splitting system 1 of the present embodiment, it is possible to improve the work efficiency after splitting in each stage.

The splitting devices 18 and 21 split the end G2a of the first substrate with the first substrate facing the lower side, and the driving unit 330 removes the substrate unit G3 from which the end G2a has been split from the conveying devices 19 and 22 Pick up and move the lower surface of the substrate unit G3 away from the conveying path of the conveying devices 19 and 22. Thereby, when the substrate unit G3 is picked up, the end portion G2a is separated from the substrate unit G3 due to its own weight, so the end portion G2a can be automatically removed.

The rotary transfer units 23 and 27 invert the front and back surfaces of the substrate unit G3 picked up from the transport devices 19 and 22, respectively, and transport them to the inspection units 25 and 29. By this, since the substrate unit G3 is transported to the inspection sections 25 and 29 with the terminal facing upward, the inspection sections 25 and 29 can be exposed from the inspection terminal above the substrate unit G3. Thus, as in the present embodiment, the sensor 540 for inspection can be easily arranged with a simplified structure in the space above the conveyance device 510 on which the substrate unit G3 is placed.

The rotary transfer sections 23 and 27 reverse the front and back surfaces of the picked-up substrate unit G3, and the rotary transfer sections 24 and 28 receive the substrate unit G3 from the rotary transfer sections 23 and 27 and transfer them to the inspection sections 25 and 29, respectively. With this, the front and back of the substrate unit G3 can be smoothly reversed and transferred to the inspection sections 25 and 29.

The rotary transfer parts 23 and 24 are respectively configured to hold the substrate unit G3 with an adsorption pad And go round. In addition, a part of the swirling path of the suction pad 334 of the rotary transfer part 23 and a part of the swirling path of the suction pad 431 of the rotary transfer part 24 are arranged to overlap each other in a plan view, and the two swirling paths overlap each other Position, the substrate unit G3 is transferred from the rotary transfer unit 23 to the rotary transfer unit 24. As a result, the arrangement space of the rotary transfer units 23 and 24 can be simplified and the substrate unit G3 can be smoothly transferred from the rotary transfer unit 23 to the rotary transfer unit 24. In the same manner, the arrangement space of the rotary transfer parts 27 and 28 can be simplified and the substrate unit G3 can be smoothly transferred from the rotary transfer part 27 to the rotary transfer part 28.

The inspection portions 25 and 29 detect the presence or absence of the notch portion G3a formed by removing the end portion G2a by the sensor 540 composed of an optical displacement sensor, thereby checking that the terminal is properly and correctly exposed. With this, the exposed terminal can be inspected without contacting the substrate unit G3.

The inspection sections 25 and 29 move the sensor 540 in the negative direction of the Y axis relative to the substrate unit G3 at the position P4 to inspect the notch G3a formed on the substrate unit G3. Thereby, compared with the case where the entire surface of the substrate unit G3 is inspected, the notch G3a can be inspected and formed more efficiently.

When splitting the first substrate of the substrates G1 and G2, the two receiving portions 106a of the splitting units 12a, 18a, and 21a arranged on the side of the first substrate support the first substrate The breaking bars 107 of the breaking units 12a, 18a, and 21a on the second substrate side are pressed against the second substrate. On the other hand, when the second substrates of the substrates G1 and G2 are broken, the two receiving portions 106a of the breaking units 12a, 18a, and 21a disposed on the second substrate side support the second substrate And press the breaking rod 107 of the breaking units 12a, 18a, and 21a on the side of the first substrate against the first substrate. Thus, according to the splitting devices 12, 18, and 21 of the present embodiment, by disposing the two splitting units so as to face the first substrate side and the second substrate side, the first position can be split at the same position 1 substrate and second substrate. According to this, the substrates G1 and G2 can be reduced in a simplified structure Cracked.

<Modification>

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-mentioned embodiments. In addition, the embodiments of the present invention may be variously modified in addition to the above.

For example, in the above embodiment, the first substrate is oriented downward and the second substrate is oriented upward. However, the first substrate is oriented upward and the second substrate is oriented downward. Break. In this case, the score line L5 is provided on the upper surface side, and when the substrate unit G3 is generated by the cleaving devices 18 and 21, the notch portion G3a faces upward. Therefore, when the notch portion G3a faces upward after the breaking, there is no need to reverse the front and back surfaces of the substrate unit G3 by the rotary transfer portions 23 and 27.

However, in this case, the separated end G2a remains on the substrate unit G3. Therefore, before the substrate unit G3 is transported to the inspection sections 25 and 29, the end G2a remaining in the substrate unit G3 can be removed by blowing air or the like.

In addition, in the above embodiment, the substrate unit G3 split by the splitting devices 18 and 21 is reversed by the rotation transfer sections 23 and 27, but it is not limited to this, and it may not be reversed . In this case, in the inspection sections 25 and 29, the notch G3a faces the lower side, so the inspection sections 25 and 29 are inspected from the lower side of the substrate unit G3 to form the notch G3a. In this case, for example, the inspection units 25 and 29 are configured to detect the presence or absence of the notch G3a from below from below the inspection table through which laser light passes or through the gap through the table on which the substrate unit G3 is placed. However, if the above method is adopted, the configuration of the inspection sections 25 and 29 is changed compared to the above-mentioned embodiment miscellaneous. Therefore, as in the above embodiment, it is preferable that the inspection portions 25 and 29 inspect and form the notch portion G3a from above with the notch portion G3a facing upward.

In addition, in the above-described embodiment, the substrate unit G3 determined not to have the notch G3a is recovered by the recovery unit located on the negative side of the X axis of the transport device 510. However, the present invention is not limited to this, and the substrate unit G3 determined to have not formed the notch G3a may be transported to the transport device 17 or the transport device 20 again after the front and back surfaces thereof are inverted. In this case, the first substrate is broken again along the scribe line L5 by the breaking device 18 or the breaking device 21.

In addition, in the above-described embodiment, the inspection sections 25 and 29 are provided with the conveying device 510 for conveying the substrate unit G3 in the X-axis direction, but as the conveying device for conveying the substrate unit G3, the conveying device 26 may be used separately , 30.

FIG. 12 is a diagram showing the configuration of the inspection section 25 in this case. From the inspection unit 25 in this case, the conveying device 510, the rail 520, and the transfer unit 550 are omitted. The gantry 530 is fixed in the fracturing system 1 so as to straddle the middle position of the conveying device 26, and the sensor 540 is fixed under the member extending in the Y-axis direction of the gantry 530.

Referring to FIG. 12, when the rotary transfer unit 24 receives the substrate unit G3 from the rotary transfer unit 23, the received substrate unit G3 is placed at a position P5 on the conveyor 26. The substrate unit G3 at the position P5 is conveyed by the conveying device in the positive direction of the X axis. At this time, the sensor 540 detects the distance to the upper surface of the substrate unit G3 that is moving in the positive direction of the X axis, and examines the formation of the notch G3a in the same manner as in the above embodiment. When the notch G3a is not formed, the substrate unit G3 falls toward the positive side of the X axis of the conveying device 26, and is recovered by a recovery unit (not shown). When the notch G3a is formed, the substrate unit G3 is positioned at the position P6. Then, the substrate unit G3 in which the notch portion G3a is formed is transported to the device in the subsequent stage in the same manner as in the above embodiment.

In addition, as shown in FIG. 12, when the inspection section 25 uses another conveying device, the inspection section 25 may be provided near the end of the negative side of the X axis of the conveying device 26, or may be provided in the middle of the conveying device 19 nearby. In addition, the inspection units 25 and 29 may use the transport device 34 as a transport device for transporting the substrate unit G3.

In the above-described embodiment, after the inspection by the inspection unit 25, the substrate unit G3 is transferred to the conveying device 26 by the rotary transfer unit 24, and after the inspection by the inspection unit 29, the substrate unit G3 is transferred by the rotation The unit 28 is transported to the conveying device 30. However, it is not limited to this, and after omitting the conveying devices 26, 30, the transfer sections 31, 32, and the guide 33, and performing inspection by the inspection sections 25, 29, the substrate unit G3 may be rotated by the transfer section 24, respectively , 28 is transferred to the conveying device 34.

The substrate unit G3 on the transport device 19 is transferred to the inspection unit 25 and the transport device 26 by rotating the transfer units 23 and 24, and the substrate unit G3 on the transport device 22 is rotated by the transfer units 27 and 28 while rotating. While rotating, it is transferred to the inspection unit 29 and the transport device 30. However, instead of the rotary transfer units 23, 24, 27, and 28, a transfer unit that linearly transfers the substrate unit G3 may be provided. However, in this case, the installation space of the transfer unit becomes larger compared to the above-mentioned embodiment. Therefore, as in the above-described embodiment, it is preferable that the substrate unit G3 is transferred by the rotary transfer sections 23, 24, 27, and 28.

In addition, in the above embodiment, in the breaking device 12, the two breaking units 12a have the same structure as each other, and in the breaking device 18, the two breaking units 18a have the same structure as each other. In the breaking device 21, the two breaking units 21a have the same structure. However, it is not limited to this, and the two splitting units need not have the same configuration.

In addition, in the above embodiment, the motor 201 and the ball screw 202 are The support member 204 supports the splitting bar 107 at two places, but it is not limited to this, and the splitting bar 107 may be supported by the support member 204 at three or more places. In this case, the support member 204 is fixed to the splitting bar 107 at three or more locations separated in the Y-axis direction. In addition, in the breaking devices 18 and 21, since the length of the breaking bar 107 in the Y-axis direction is short, the motor 201 and the ball screw 202 can also support the breaking bar 107 at one place by the support member 204.

In addition, in the above embodiment, as shown in FIGS. 4(a) and (b), the end of the wall portion 106c on the substrate side is located further away from the substrate than the end of the receiving portion 106a on the substrate side. However, it is not limited to this, and the end portion of the wall portion 106c on the substrate side may be the same position as the end portion of the receiving portion 106a on the substrate side in the Z-axis direction.

In addition, in the above-described embodiment, the receiving portion 106a has the shape shown in FIG. 4(a), but it is not limited to this, and may have other shapes. For example, the inner surface of the receiving portion 106a may be inclined toward the outer side of the housing portion 106, and the receiving portion 106a may be formed in a V-shape when viewed from the Y-axis direction. In addition, when viewed from the Y-axis direction, the outer side surface and the inner side surface of the receiving portion 106a may be formed in an arc shape. In addition, when viewed from the Y-axis direction, the receiving portion 106a may be formed in a rectangular shape.

In addition, in the above-described embodiment, the receiving portion 106a is continuously formed at the end of the housing portion 106 on the substrate side, but it is not limited to this, and the receiving portion 106a may be partially formed. In addition, the formation direction of the receiving portion 106a is parallel to the scribe line, but it may not be parallel to the scribe line. In addition, the receiving portion 106a is formed in a linear shape, but it may be in a meandering shape.

The embodiments of the present invention can be appropriately modified in various ways within the scope of the technical idea disclosed in the patent application scope.

1‧‧‧Fracture system

12, 18, 21‧‧‧rupture device

12a, 18a, 21a‧‧‧rupture unit

11, 13, 17, 19, 20, 22, 26, 30, 34

23, 27‧‧‧Rotary transfer section (transfer section, first transfer section)

24, 28‧‧‧Rotary transfer section (transfer section, second transfer section)

25, 29‧‧‧ Inspection Department

14, 15, 31, 32 ‧‧‧ Transfer Department (Transport Department)

16, 33‧‧‧Guide

G1, G2‧‧‧ substrate

G3‧‧‧ substrate unit

Claims (7)

A fracturing system, characterized in that it is provided with a fracturing device for fusing a substrate formed by bonding a first substrate and a second substrate to generate a substrate unit, and for transferring the substrate unit generated by the fracturing device to The transfer section for the rear-end device transfer, and the inspection section for inspecting the substrate unit generated by the cleaving device; the cleaving device, when generating the substrate unit, in order to expose the terminals formed on the second substrate, and The step of breaking the end of the first substrate opposed to the terminal is carried out; the conveying part is provided with the end for breaking by the breaking device during the conveyance of the substrate unit from the Separation means for substrate unit separation; the inspection section, which is disposed on the downstream side of the separation means on the conveyance path of the substrate unit in the conveyance section, inspects the terminal and terminal separated from the substrate unit by the separation means Exposed, so that the substrate unit that does not expose the terminal is detached from the conveying path; the cleaving device, with the first substrate facing downward, cleaves the end of the first substrate; the separating means picks up the The substrate unit at the end is broken, and the lower surface of the substrate unit is separated from the conveyance path. A split system as claimed in item 1 of the patent scope, wherein the conveying part reverses the front and back surfaces of the substrate unit picked up by the separating means and conveys it to the inspection part. The breaking system as claimed in item 2 of the patent scope, wherein the conveying section includes a first conveying section that reverses the front and back surfaces of the substrate unit after picking up and transfers the substrate unit, and receives the reversed substrate The unit transfers to the second transfer section of the inspection section. For example, in the rupture system of claim 3, wherein the first transfer section and the second transfer section respectively hold the substrate unit with the holding section and make a turn, and the turning path of the holding section of the first transfer section A portion and a portion of the turning path of the holding portion of the second transfer portion are arranged to overlap each other in a plan view; at a position where the two turning paths overlap each other, the substrate unit is transferred from the first transfer portion to the first 2 Transfer by the transfer department. The fracturing system according to any one of the items 1 to 4 of the patent application scope, wherein the inspection section detects the presence or absence of the notch formed by removing the end by an optical displacement sensor, thereby inspecting the The terminals are exposed properly and correctly. A fracture system as claimed in item 5 of the patent application, wherein the inspection part moves the optical displacement sensor relative to the substrate unit in a direction transverse to the notch to inspect the notch formed in the substrate unit unit. For example, the fracturing system according to item 6 of the patent application scope, wherein the conveying part is provided with a conveying device for conveying the substrate unit downstream of the conveying path, and the conveying direction of the conveying device is set to be transverse to the notch; The inspection section irradiates the substrate unit conveyed by the conveying device with light to detect the presence or absence of the notch.

Images