JP2016018070A - Exposure method and exposure apparatus - Google Patents

Abstract

Foreign matter on the surface of a photosensitive layer of a workpiece can be removed before adhering to the surface of a cylindrical photomask, and the latent image pattern formed on the photosensitive layer by the foreign matter adhering to the surface of the cylindrical photomask is defective. An exposure method and an exposure apparatus that are unlikely to occur are provided. A photosensitive layer is brought into contact with a photosensitive layer while moving a workpiece in a direction perpendicular to the axial direction of a first adhesive roll and a cylindrical photomask. The surface of the photosensitive layer 104 is cleaned by rotating the first adhesive roll 16 on the surface of the surface 104 to clean the surface of the photosensitive layer 104 and bringing the surface of the photosensitive layer 104 into contact with the cylindrical photomask 10. At the same time as rotating the cylindrical photomask 10, the photosensitive layer 104 is irradiated with radiation from the radiation irradiating means 12 disposed inside the cylindrical photomask 10. [Selection] Figure 1

Description

  In the present invention, a photosensitive layer of a workpiece having a photosensitive layer formed on the surface of a substrate is exposed through a cylindrical photomask in contact with the photosensitive layer, and a latent image pattern corresponding to the pattern of the cylindrical photomask is exposed. The present invention relates to an exposure method and an exposure apparatus for forming a layer.

  A cylindrical photomask that contacts the photosensitive layer is rotated on the surface of the photosensitive layer while moving the workpiece having the photosensitive layer formed on the surface of the substrate in a predetermined direction, and at the same time, the cylindrical photomask is arranged inside the cylindrical photomask. By irradiating the photosensitive layer with radiation from the radiation irradiation means, the photosensitive layer is exposed through a cylindrical photomask in contact with the photosensitive layer, and a latent image pattern corresponding to the pattern of the cylindrical photomask is formed on the photosensitive layer. An exposure method has been proposed (Patent Document 1).

  In order to accurately transfer the cylindrical photomask pattern to the photosensitive layer as a corresponding latent image pattern, the contact portion between the photosensitive layer and the cylindrical photomask is in a direction perpendicular to the axial direction of the cylindrical photomask. It is necessary to bring the photosensitive layer and the cylindrical photomask into contact with each other so that the width of the photosensitive layer and the cylindrical photomask are in close contact with each other with no gap. Therefore, the material of the surface of the cylindrical photomask is a flexible elastomer.

  However, when the material of the surface of the cylindrical photomask is an elastomer, when a workpiece having foreign matter attached to the surface of the photosensitive layer is carried in, the photosensitive layer is exposed to light when the photosensitive layer is brought into contact with the cylindrical photomask. Foreign matter on the surface of the layer moves to and adheres to the surface of the cylindrical photomask with high adhesion. If foreign matter adheres to the surface of the cylindrical photomask, the foreign matter blocks the radiation from the radiation irradiating means, and the shadow of the foreign matter is transferred to the photosensitive layer, resulting in a defect in the latent image pattern formed on the photosensitive layer. . Therefore, when the photosensitive layer on which the latent image pattern is formed is developed to obtain a product having a desired pattern, a defect occurs in the product pattern, resulting in a poor product yield.

  Therefore, every time foreign matter adheres to the surface of the cylindrical photomask, it is necessary to stop the operation of the exposure apparatus and clean the surface of the cylindrical photomask. However, if the operation of the exposure apparatus is frequently stopped, product productivity decreases.

Special table 2011-526069 gazette

  The present invention can remove foreign matters on the surface of the photosensitive layer of the workpiece before adhering to the surface of the cylindrical photomask, and stops the operation of the exposure apparatus in order to remove foreign matters adhering to the surface of the cylindrical photomask. There is provided an exposure method and an exposure apparatus which are not necessary and in which defects in a latent image pattern formed on a photosensitive layer due to foreign matters adhering to the surface of a cylindrical photomask are unlikely to occur.

The present invention has the following configuration.
[1] A photosensitive layer of a workpiece having a photosensitive layer formed on the surface of a substrate is exposed through a cylindrical photomask in contact with the photosensitive layer, and a latent image pattern corresponding to the cylindrical photomask pattern is exposed to the photosensitive layer. An exposure method to be formed
By bringing the photosensitive layer and the first adhesive roll into contact with each other while relatively moving the workpiece and the first adhesive roll in a direction perpendicular to the axial direction of the first adhesive roll and in opposite directions to each other, Rotating the first adhesive roll on the surface of the photosensitive layer to clean the surface of the photosensitive layer with the first adhesive roll;
The photosensitive layer whose surface has been cleaned and the cylindrical photomask are brought into contact with each other while relatively moving the workpiece and the cylindrical photomask in a direction perpendicular to the axial direction of the cylindrical photomask and in opposite directions to each other. An exposure method in which a cylindrical photomask is rotated on the surface of the photosensitive layer, and at the same time, the photosensitive layer is irradiated with radiation from radiation irradiating means disposed inside the cylindrical photomask.
[2] When the single-wafer workpiece does not exist below the cylindrical photomask, the cylindrical photomask is retracted to a position higher than the surface of the photosensitive layer,
The exposure method according to [1], wherein when the single-wafer workpiece is present below the cylindrical photomask, the cylindrical photomask is lowered and brought into contact with the surface of the photosensitive layer.
[3] When the single-wafer workpiece does not exist below the first adhesive roll, the first adhesive roll is retracted to a position higher than the surface of the photosensitive layer,
[2] The exposure method according to [2], wherein when the single-wafer workpiece is present below the first adhesive roll, the first adhesive roll is lowered and brought into contact with the surface of the photosensitive layer.
[4] The first dummy base material of the single wafer is arranged adjacent to the front of the side of the single wafer workpiece that first comes into contact with the cylindrical photomask,
The second dummy base material of the single wafer is arranged adjacent to the rear of the side of the single wafer workpiece that comes into contact with the cylindrical photomask last,
When the workpiece, the first dummy base material, and the second dummy base material are not present below the cylindrical photomask, the cylindrical photomask is retracted to a position higher than the surface of the photosensitive layer,
When the first dummy substrate is present below the cylindrical photomask, the cylindrical photomask is lowered to contact the surface of the first dummy substrate;
Subsequently, the photosensitive layer of the workpiece and the cylindrical photomask are brought into contact,
The exposure method according to [1], wherein when the second dummy base material exists below the cylindrical photomask, the cylindrical photomask is raised and separated from the surface of the second dummy base material.
[5] When the workpiece, the first dummy base material, and the second dummy base material do not exist below the first adhesive roll, the first adhesive roll is retracted to a position higher than the surface of the photosensitive layer,
When the first dummy base is present below the adhesive roll, the first adhesive roll is lowered to contact the surface of the first dummy base,
Subsequently, the photosensitive layer of the workpiece and the first adhesive roll are brought into contact with each other,
[4] The exposure method according to [4], wherein when the second dummy base is present below the first adhesive roll, the first adhesive roll is raised and separated from the surface of the second dummy base.
[6] The exposure method according to any one of [1] to [5], wherein the substrate is a glass plate.
[7] The exposure method according to any one of [1] to [6], wherein a ridge angle of a single-wafer workpiece is chamfered.
[8] The exposure method according to any one of [1] to [7], wherein the thickness of the base material in the single-wafer workpiece is 0.3 mm or more.
[9] A strong adhesive roll that contacts the surface of the first adhesive roll and rotates following the rotation of the first adhesive roll and has a higher adhesive strength than the first adhesive roll. The exposure method according to any one of [1] to [8], wherein the surface is cleaned.
[10] The exposure method according to any one of [1] to [9], wherein the surface of the photosensitive layer after contact with the first adhesive roll and before contact with the cylindrical photomask is neutralized.
[11] The surface of the cylindrical photomask is cleaned by a second adhesive roll that contacts the surface of the cylindrical photomask and rotates following the rotation of the cylindrical photomask. Either exposure method.

[12] The photosensitive layer of the workpiece having the photosensitive layer formed on the surface of the substrate is exposed through a cylindrical photomask in contact with the photosensitive layer, and a latent image pattern corresponding to the cylindrical photomask pattern is exposed to the photosensitive layer. An exposure apparatus for forming
A cylindrical photomask that is rotatable about a central axis as a rotation axis;
Radiation irradiating means arranged inside a cylindrical photomask;
A first adhesive roll which is disposed at a position where it can contact the surface of the photosensitive layer before the cylindrical photomask contacts, and is rotatable about the central axis;
The workpiece and the cylindrical photomask are moved relative to each other in a direction orthogonal to the axial direction of the cylindrical photomask and in opposite directions, and in a direction orthogonal to the axial direction of the first adhesive roll and in opposite directions to each other An exposure apparatus comprising: a moving means for relatively moving the work and the first adhesive roll.
[13] The exposure apparatus according to [12], wherein the cylindrical photomask and the first adhesive roll are free rolls.
[14] first elevating means for elevating and lowering the cylindrical photomask;
Control means for controlling the first lifting means,
The control means
When the single-wafer workpiece does not exist below the cylindrical photomask, the cylindrical photomask is retracted to a position higher than the surface of the photosensitive layer,
The exposure apparatus according to [12] or [13], wherein when the single-wafer workpiece exists below the cylindrical photomask, the cylindrical photomask is lowered and brought into contact with the surface of the photosensitive layer.
[15] The apparatus further comprises second elevating means for elevating and lowering the first adhesive roll,
When the control means controls the second elevating means, and the single-wafer workpiece is not present below the first adhesive roll, the first adhesive roll is placed at a position higher than the surface of the photosensitive layer. Evacuate,
[14] The exposure apparatus according to [14], wherein when the single-wafer workpiece exists below the first adhesive roll, the first adhesive roll is lowered to contact the surface of the photosensitive layer.
[16] first elevating means for elevating and lowering the cylindrical photomask;
Control means for controlling the first lifting means,
The first dummy base material of the single wafer is arranged adjacent to the front of the side of the single wafer workpiece that first comes into contact with the cylindrical photomask,
When the second dummy base material of the single wafer is disposed adjacent to the back of the side of the single wafer workpiece that comes into contact with the cylindrical photomask last,
The control means
When the workpiece, the first dummy base material, and the second dummy base material are not present below the cylindrical photomask, the cylindrical photomask is retracted to a position higher than the surface of the photosensitive layer,
When the first dummy substrate is present below the cylindrical photomask, the cylindrical photomask is lowered to contact the surface of the first dummy substrate;
Subsequently, the photosensitive layer of the workpiece and the cylindrical photomask are brought into contact,
The exposure apparatus according to [12] or [13], wherein when the second dummy base material exists below the cylindrical photomask, the cylindrical photomask is raised and separated from the surface of the second dummy base material.
[17] The apparatus further comprises second elevating means for elevating and lowering the first adhesive roll,
When the control means controls the second elevating means, and the work, the first dummy base material, and the second dummy base material are not present below the first adhesive roll, the first adhesive Retract the roll to a position higher than the surface of the photosensitive layer,
When the first dummy base is present below the first adhesive roll, the first adhesive roll is lowered to contact the surface of the first dummy base,
Subsequently, the photosensitive layer of the workpiece and the first adhesive roll are brought into contact with each other,
[16] The exposure apparatus according to [16], wherein when the second dummy base is present below the first adhesive roll, the first adhesive roll is raised and separated from the surface of the second dummy base.
[18] A strong adhesive roll that is disposed so as to be in contact with the surface of the first adhesive roll and is rotatable about the central axis and having a higher adhesive force than the first adhesive roll. 12] to [17].
[19] The exposure apparatus according to any one of [12] to [18], further comprising a static eliminating unit that neutralizes the surface of the photosensitive layer after contacting the first adhesive roll and before contacting the cylindrical photomask. .
[20] The exposure according to any one of [12] to [19], further comprising a second adhesive roll disposed so as to be in contact with the surface of the cylindrical photomask and rotatable about the central axis. apparatus.

  According to the exposure method and the exposure apparatus of the present invention, the foreign matter on the surface of the photosensitive layer of the workpiece can be removed before adhering to the surface of the cylindrical photomask, and the foreign matter adhering to the surface of the cylindrical photomask is removed. In addition, it is not necessary to stop the operation of the exposure apparatus, and defects in the latent image pattern formed on the photosensitive layer due to foreign matter adhering to the surface of the cylindrical photomask are unlikely to occur.

1 is a schematic cross-sectional view showing an exposure apparatus according to a first embodiment of the present invention. It is the schematic which shows the motion of the workpiece | work, cylindrical photomask, and each roll in the exposure apparatus which concerns on the 2nd Embodiment of this invention. It is the schematic which shows the motion of the workpiece | work, cylindrical photomask, and each roll in the exposure apparatus which concerns on the 2nd Embodiment of this invention. It is the schematic which shows the motion of the workpiece | work, cylindrical photomask, and each roll in the exposure apparatus which concerns on the 2nd Embodiment of this invention. It is the schematic which shows the motion of the workpiece | work, cylindrical photomask, and each roll in the exposure apparatus which concerns on the 2nd Embodiment of this invention. It is the schematic which shows the motion of the workpiece | work, cylindrical photomask, and each roll in the exposure apparatus which concerns on the 2nd Embodiment of this invention. It is the schematic which shows the motion of the workpiece | work, cylindrical photomask, and each roll in the exposure apparatus which concerns on the 3rd Embodiment of this invention. It is the schematic which shows the motion of the workpiece | work, cylindrical photomask, and each roll in the exposure apparatus which concerns on the 3rd Embodiment of this invention. It is the schematic which shows the motion of the workpiece | work, cylindrical photomask, and each roll in the exposure apparatus which concerns on the 3rd Embodiment of this invention. It is the schematic which shows the motion of the workpiece | work, cylindrical photomask, and each roll in the exposure apparatus which concerns on the 3rd Embodiment of this invention. It is the schematic which shows the motion of the workpiece | work, cylindrical photomask, and each roll in the exposure apparatus which concerns on the 3rd Embodiment of this invention. It is the schematic which shows the motion of the workpiece | work, cylindrical photomask, and each roll in the exposure apparatus which concerns on the 4th Embodiment of this invention. It is the schematic which shows the motion of the workpiece | work, cylindrical photomask, and each roll in the exposure apparatus which concerns on the 4th Embodiment of this invention. It is the schematic which shows the motion of the workpiece | work, cylindrical photomask, and each roll in the exposure apparatus which concerns on the 4th Embodiment of this invention. It is the schematic which shows the motion of the workpiece | work, cylindrical photomask, and each roll in the exposure apparatus which concerns on the 4th Embodiment of this invention. It is the schematic which shows the motion of the workpiece | work, cylindrical photomask, and each roll in the exposure apparatus which concerns on the 5th Embodiment of this invention. It is the schematic which shows the motion of the workpiece | work, cylindrical photomask, and each roll in the exposure apparatus which concerns on the 5th Embodiment of this invention. It is the schematic which shows the motion of the workpiece | work, cylindrical photomask, and each roll in the exposure apparatus which concerns on the 5th Embodiment of this invention. It is the schematic which shows the motion of the workpiece | work, cylindrical photomask, and each roll in the exposure apparatus which concerns on the 6th Embodiment of this invention. It is the schematic which shows the motion of the workpiece | work, cylindrical photomask, and each roll in the exposure apparatus which concerns on the 6th Embodiment of this invention. It is the schematic which shows the motion of the workpiece | work, cylindrical photomask, and each roll in the exposure apparatus which concerns on the 6th Embodiment of this invention. It is a cross-sectional schematic diagram which shows the exposure apparatus which concerns on other embodiment of this invention.

The following definitions of terms apply throughout this specification and the claims.
The “photomask” means a pattern original plate in photolithography, that is, one that can expose the photosensitive layer in a pattern when the photosensitive layer is irradiated with radiation.
“Work” means an object to be exposed in photolithography.
The “latent image pattern” is a pattern composed of an exposed portion and an unexposed portion in the photosensitive layer. A desired pattern is formed by removing one of the exposed portion and the unexposed portion by the development process.
“Radiation” and “light” are generic terms for ultraviolet rays, γ-rays, X-rays, electron beams, and the like.
“Free roll” means a roll that does not have a rotational drive source such as a motor that rotates following the movement of a workpiece, the rotation of another roll, and the like.
The “drive roll” means a roll that can be rotationally driven by a driving force from a rotational drive source such as a motor.
An object does not exist, exists, or reaches below the cylindrical photomask or each roll means that an object does not exist, exists, or reaches below the rotation axis of the cylindrical photomask or each roll. Means.
The distance between the cylindrical photomask and each roll or the distance between each roll means the distance between the rotation axes.

[First Embodiment]
<Exposure device>
FIG. 1 is a schematic sectional view showing an exposure apparatus according to the first embodiment of the present invention.
The exposure apparatus 1 exposes the photosensitive layer 104 of the workpiece 100 having the photosensitive layer 104 formed on the surface of the substrate 102 through the cylindrical photomask 10 in contact with the photosensitive layer 104, and the pattern of the cylindrical photomask 10. A latent image pattern corresponding to the above is formed on the photosensitive layer 104.

  The exposure apparatus 1 includes a cylindrical photomask 10 that is rotatable about a central axis as a rotational axis; and a rotational axis of the cylindrical photomask 10 that is rotatable so that the central axis of the cylindrical photomask 10 is in a horizontal direction. A first supporting means (not shown) for supporting; a radiation irradiating means 12 disposed inside the cylindrical photomask 10; and a photosensitive means disposed inside the cylindrical photomask 10 so as to cover the radiation irradiating means 12. A light shielding member 14 having a slit 14a formed so that radiation is emitted toward the contact portion between the layer 104 and the cylindrical photomask 10; and the surface of the photosensitive layer 104 before the cylindrical photomask 10 contacts. Is arranged such that the distance from the cylindrical photomask 10 is shorter than the length of the workpiece 100, and the center axis is rotatable. First adhesive roll 16; second support means (not shown) for rotatably supporting the rotation axis of the first adhesive roll 16 so that the central axis of the first adhesive roll 16 is in the horizontal direction; A first strong adhesive roll 18 disposed so as to be in contact with the surface of one adhesive roll 16 and rotatable about the central axis; and the central axis of the first strong adhesive roll 18 is the first adhesive roll Third support means (not shown) for rotatably supporting the rotation axis of the first strong adhesive roll 18 so as to be parallel to the central axis of the roll 16; the cylindrical photomask 10 and the first adhesive roll 16. A stage 20 (moving means) that moves the single-wafer workpiece 100 in a direction perpendicular to the axial direction of the photosensitive layer 104 after contacting the first adhesive roll 16 and before contacting the cylindrical photomask 10. Neutralizing means 22 for neutralizing the surface; Provided.

(Cylindrical photomask)
The cylindrical photomask 10 may be one in which a mask pattern is directly formed on the surface of a cylindrical substrate, and a film on which a mask pattern is formed is attached to the surface of a cylindrical substrate. Also good.

The cylindrical substrate is made of a light transmissive material. Examples of the material of the cylindrical substrate include transparent resin, glass, and synthetic quartz.
The cylindrical photomask 10 is preferably made of an elastomer at least on its surface. If the material of the surface of the cylindrical photomask 10 is an elastomer, (i) the contact portion between the photosensitive layer 104 and the cylindrical photomask 10 has a certain width in a direction perpendicular to the axial direction of the cylindrical photomask 10. (Ii) The photosensitive layer 104 and the cylindrical photomask 10 can be in close contact with each other without any gap. (Iii) The cylindrical photomask 10 does not slip on the surface of the photosensitive layer 104. Therefore, the pattern of the cylindrical photomask 10 can be accurately transferred to the photosensitive layer 104 as a corresponding latent image pattern.
Examples of elastomers include elastomers that transmit ultraviolet rays, such as silicone rubber (polydimethylsiloxane, etc.), fluorine-based transparent elastomers (Afras (registered trademark) manufactured by Asahi Glass Co., Ltd., Kalrez (registered trademark) # 8002 manufactured by DuPont), and the like. It is done.

  The type of the photomask may be any known photomask (for example, the photomask described in Patent Document 1), and is not particularly limited. The type of photomask is a two-tone binary mask consisting of a light-shielding part and a light-transmitting part; a photomask in which a part that changes the phase of light (phase shifter) is formed in a pattern, and passes through the phase shifter Phase shift mask that forms an interference pattern in the photosensitive layer by utilizing the interference phenomenon between the light whose phase has changed and the light that has not changed its phase without passing through the phase shifter; metal nano-particles that generate surface plasmon resonance Examples include a photomask made of a structure.

  The cylindrical photomask 10 may be a free roll or a drive roll. In the case of a driving roll, a rotational drive source such as a motor is separately required, and a speed adjusting means for synchronizing the moving speed of the workpiece 100 and the rotational speed of the cylindrical photomask 10 is additionally required. From the viewpoint of simplifying the configuration of the exposure apparatus 1, the cylindrical photomask 10 is preferably a free roll that rotates following the movement of the workpiece 100.

(Radiation irradiation means)
The radiation irradiation means 12 may be any known radiation irradiation means that can irradiate the photosensitive layer 104 with radiation (for example, a radiation source described in Patent Document 1), and is not particularly limited. For example, radiation supplied from an external radiation source can be emitted from the inside of the cylindrical photomask 10 to the outside by using a lens, a mirror, an optical waveguide, a diffraction grating, and a combination thereof. The radiation source may be disposed inside the cylindrical photomask 10.
The radiation irradiating means 12 is preferably a linear radiation irradiating means from the viewpoint that it can irradiate radiation in a direction (width direction) orthogonal to the moving direction of the workpiece 100.

(First adhesive roll)
The first adhesive roll 16 is a roll having adhesiveness on the surface, and removes foreign matters (dust, dust, etc.) adhering to the surface of the photosensitive layer 104 by contacting the surface of the photosensitive layer 104. .

  The first adhesive roll 16 only needs to have a surface adhesive strength higher than that of the photosensitive layer 104 surface. When the adhesive force of the first adhesive roll 16 is smaller than the adhesive force of the photosensitive layer 104, the foreign matter cannot be removed sufficiently. On the other hand, when the adhesive force of the first adhesive roll 16 is extremely high, the first adhesive roll 16 is strongly adhered to the surface of the photosensitive layer 104, so that the movement of the workpiece 100 is hindered or the photosensitive layer 104 is There is a risk of peeling. Further, the adhesive force of the first adhesive roll 16 is preferably higher than the adhesive force of the elastomer on the surface of the cylindrical photomask 10. The adhesive strength of the first adhesive roll 16 is preferably 30 to 90 hPa.

Examples of the first adhesive roll 16 include those in which at least the surface material is an elastomer. Examples of the elastomer include silicone rubber, butyl rubber, urethane rubber, nitrile rubber, chloroprene rubber, natural rubber, and ethylene-propylene rubber.
Commercially available products of the first adhesive roll 16 include TEKNEK's cleaners XCH, CM, SLn; Osada Corporation's FC film cleaner, SC sheet cleaner; Technoroll's clean dash E roll; Miyagawa Roller's The Mimosaroll series and so on.

  The axial length of the first adhesive roll 16 is preferably equal to or greater than the axial width of the first adhesive roll 16 in the area where the photosensitive layer 104 is formed on the surface of the workpiece 100. When the length of the first adhesive roll 16 in the axial direction is shorter than the width of the area of the photosensitive layer 104, the entire area cannot be cleaned, and the area that can be used as a product in the workpiece 100 becomes small.

  The first adhesive roll 16 may be a free roll or a drive roll. In the case of the drive roll, a rotational drive source such as a motor is separately required, and a speed adjusting means for synchronizing the moving speed of the workpiece 100 and the rotational speed of the first adhesive roll 16 is separately required. From the viewpoint that the configuration of the exposure apparatus 1 can be simplified, the first adhesive roll 16 is preferably a free roll that rotates following the movement of the workpiece 100.

(First strong adhesive roll)
The first strong adhesive roll 18 is a roll having adhesiveness on the surface, and foreign matter (dust, dust, etc.) attached to the surface of the first adhesive roll 16 by contacting the surface of the first adhesive roll 16. ). By having the first strong adhesive roll 18, the photosensitive layer 104 can be cleaned with the first adhesive roll 16 for a long time, so that the exposure apparatus 1 can be operated for a long time, and the productivity of the product is improved. .

  The first strong adhesive roll 18 only needs to have a surface adhesive force equal to or higher than the surface adhesive force of the first adhesive roll 16. When the adhesive strength of the first strong adhesive roll 18 is smaller than the adhesive strength of the first adhesive roll 16, the foreign matter cannot be removed sufficiently. On the other hand, when the adhesive strength of the first strong adhesive roll 18 is extremely high, the first strong adhesive roll 18 is strongly adhered to the surface of the first adhesive roll 16, so that the rotation of the first adhesive roll 16 is performed. May be hindered, or the surface of the first adhesive roll 16 may be peeled off. The adhesive strength of the first strong adhesive roll 18 is preferably 100 to 300 hPa when the material of the surface of the first adhesive roll 16 is polydimethylsiloxane.

  Examples of the first strong adhesive roll 18 include an adhesive film roll in which an adhesive film is wound around a core. When the adhesive force on the surface of the first strong adhesive roll 18 is reduced, the surface of the new adhesive film can be exposed by peeling off the adhesive film on the outermost surface.

  The axial length of the first strong adhesive roll 18 is preferably equal to or longer than the axial length of the first adhesive roll 16. When the axial length of the first strong adhesive roll 18 is shorter than the axial length of the first adhesive roll 16, the entire surface of the first adhesive roll 16 cannot be cleaned.

  The first strong adhesive roll 18 may be a free roll or a drive roll. In the case of a drive roll, a separate rotational drive source such as a motor is required, and a speed adjusting means for synchronizing the rotational speed of the first adhesive roll 16 and the rotational speed of the first strong adhesive roll 18 is separately provided. I need it. From the point that the configuration of the exposure apparatus 1 can be simplified, the first strong adhesive roll 18 is preferably a free roll that rotates following the rotation of the first adhesive roll 16.

In the exposure apparatus 1, when viewed from the axial direction of the first adhesive roll 16, the rotation axis of the first strong adhesive roll 18 is the center of the contact portion between the photosensitive layer 104 and the first adhesive roll 16, It is preferable that it exists on the extension line of the line | wire which connects with the rotating shaft of the 1 adhesive roll 16.
By arranging the first strong adhesive roll 18 in this way, the pressing force of the first strong adhesive roll 18 is also transmitted to the photosensitive layer 104 via the first adhesive roll 16, thereby the first adhesive roll 18. A pressure higher than the weight of the roll 16 can be applied to the photosensitive layer 104. As a result, a sufficient contact pressure between the photosensitive layer 104 and the first adhesive roll 16 can be secured.
On the other hand, when the rotation axis of the first strong adhesive roll 18 is deviated from the extension line, the component of the pressing force of the first strong adhesive roll 18 is orthogonal to the axial direction of the first adhesive roll 16. (Horizontal direction) is also applied, and the first adhesive roll 16 is likely to be displaced in a direction orthogonal to the axial direction.

(Static removal means)
The neutralizing means 22 is for removing charges charged on the surface of the photosensitive layer 104 that are generated when the first adhesive roll 16 and the photosensitive layer 104 that have been in close contact with each other are separated. When the surface of the photosensitive layer 104 is in a charged state, foreign matter tends to reattach to the surface of the photosensitive layer 104.
Examples of the static elimination means 22 include a corona static elimination device that blows ions generated by corona discharge onto the surface of the photosensitive layer 104, a light irradiation type static elimination device that uses soft X-rays or vacuum ultraviolet rays, and the like. In the corona static eliminator, it is preferable to efficiently transport the generated ions to a charged site by using a gas flow such as nitrogen or dry air.

<Exposure method>
In the exposure method using the exposure apparatus 1 according to the first embodiment of the present invention, the cylindrical photo that contacts the photosensitive layer 104 with the photosensitive layer 104 of the workpiece 100 having the photosensitive layer 104 formed on the surface of the substrate 102. In this method, exposure is performed through the mask 10 and a latent image pattern corresponding to the pattern of the cylindrical photomask 10 is formed on the photosensitive layer 104.

(work)
The workpiece 100 includes a single-wafer base material 102 and a photosensitive layer 104 on the surface of the base material 102.
The base material 102 may be appropriately selected according to the type of the target product, and is not particularly limited. Examples of the material of the base material 102 include glass, resin, metal, silicon, and semiconductor device.
The photosensitive layer 104 is not particularly limited as long as it can form a latent image pattern by irradiation with radiation in photolithography. Examples of the material for forming the photosensitive layer 104 include known radiation-sensitive materials such as a photoresist.
When the workpiece 100 collides with the cylindrical photomask 10 or the first adhesive roll 16, the ridge angle may be chamfered in order to suppress damage to the surface of the cylindrical photomask 10 or the first adhesive roll 16. preferable.

(cleaning)
While moving the stage 20 on which the workpiece 100 is placed in a direction orthogonal to the axial direction of the first adhesive roll 16, the photosensitive layer 104 and the first adhesive roll 16 are brought into contact with each other to move the workpiece 100. Following this, the first adhesive roll 16 is rotated on the surface of the photosensitive layer 104 to clean the surface of the photosensitive layer 104.
At this time, the surface of the first adhesive roll 16 is further rotated by following the rotation of the first adhesive roll 16 by bringing the first strong adhesive roll 18 into contact with the surface of the first adhesive roll 16. Clean it.

(Static elimination)
When the first adhesive roll 16 and the photosensitive layer 104, which are strongly adhered by the adhesive force, are separated from each other, electric charge is generated on the surface of the photosensitive layer 104 and is charged.
Therefore, by blowing a gas containing ions from the nozzle of the charge eliminating unit 22 onto the surface of the photosensitive layer 104 after contacting the first adhesive roll 16 and before contacting the cylindrical photomask 10, The surface is neutralized.

(exposure)
By moving the stage 20 on which the workpiece 100 is placed in a direction orthogonal to the axial direction of the cylindrical photomask 10, the photosensitive layer 104 whose surface has been cleaned and discharged is brought into contact with the cylindrical photomask 10, Following the movement of the workpiece 100, the cylindrical photomask 10 is rotated on the surface of the photosensitive layer 104.
At this time, radiation is emitted from the radiation irradiating means 12 disposed inside the cylindrical photomask 10. Most of the radiation emitted from the radiation irradiating means 12 is shielded by the light shielding member 14, and the radiation is directed only from the slit 14 a formed in the light shielding member 14 toward the contact portion between the photosensitive layer 104 and the cylindrical photomask 10. Emitted. The radiation emitted from the slit 14 a passes through the cylindrical photomask 10 and is irradiated onto the photosensitive layer 104.
In this way, the photosensitive layer 104 is exposed through the cylindrical photomask 10, and a latent image pattern corresponding to the pattern of the cylindrical photomask 10 is formed on the photosensitive layer 104.

<Action mechanism>
In the first embodiment of the present invention described above, the first adhesive is applied to the surface of the photosensitive layer 104 by bringing the photosensitive layer 104 and the first adhesive roll 16 into contact while moving the workpiece 100. Since the roll 16 is rotated and the surface of the photosensitive layer 104 is cleaned by the first adhesive roll 16, the adhesion of foreign matter to the surface of the cylindrical photomask 10 can be suppressed. For this reason, it is not necessary to stop the operation of the exposure apparatus 1 in order to remove foreign matter adhering to the surface of the cylindrical photomask 10. In addition, the latent image pattern formed on the photosensitive layer 104 is less likely to be defective due to foreign matter adhering to the surface of the cylindrical photomask 10.

  In the first embodiment of the present invention described above, the surface of the first adhesive roll 16 is moved by the first strong adhesive roll 18 that rotates in contact with the surface of the first adhesive roll 16. Since the cleaning is performed, the photosensitive layer 104 can be cleaned with the first adhesive roll 16 for a long time. Therefore, the exposure apparatus 1 can be operated for a long time, and the productivity of the product is improved.

  In the first embodiment of the present invention described above, the surface of the photosensitive layer 104 after contact with the first adhesive roll 16 and before contact with the cylindrical photomask 10 is removed by the charge eliminating means 22. Since the charge is removed, foreign matter is less likely to reattach to the surface of the photosensitive layer 104.

[Second Embodiment]
<Exposure device>
FIG. 2 is a schematic view showing an exposure apparatus according to the second embodiment of the present invention.
The exposure apparatus 2 exposes the photosensitive layer 104 of the workpiece 100 having the photosensitive layer 104 formed on the surface of the substrate 102 through the cylindrical photomask 10 in contact with the photosensitive layer 104, and the pattern of the cylindrical photomask 10. A latent image pattern corresponding to the above is formed on the photosensitive layer 104.

The exposure apparatus 2 includes a cylindrical photomask 10 that is rotatable about a central axis as a rotational axis; and a rotational axis of the cylindrical photomask 10 that is rotatable so that the central axis of the cylindrical photomask 10 is in a horizontal direction. First supporting means (not shown) for supporting; radiation irradiating means (not shown) arranged inside the cylindrical photomask 10; and arranged inside the cylindrical photomask 10 so as to cover the radiation irradiating means. A light shielding member (not shown) in which a slit is formed so that radiation is emitted toward the contact portion between the photosensitive layer 104 and the cylindrical photomask 10; and before the cylindrical photomask 10 contacts It is disposed at a position where it can come into contact with the surface of the layer 104, and the distance from the cylindrical photomask 10 is shorter than the length of the workpiece 100, and is rotatable around the central axis. A first adhesive roll 16; second support means (not shown) for rotatably supporting the rotation axis of the first adhesive roll 16 so that the central axis of the first adhesive roll 16 is in the horizontal direction; A first strong adhesive roll 18 arranged so as to be in contact with the surface of the first adhesive roll 16 and rotatable about the central axis; and the central axis of the first strong adhesive roll 18 is the first Third support means (not shown) for rotatably supporting the rotational axis of the first strong adhesive roll 18 so as to be parallel to the central axis of the adhesive roll 16; and first first for raising and lowering the cylindrical photomask 10 Elevating means (not shown); second elevating means (not shown) for elevating the first adhesive roll 16 and the first strong adhesive roll 18; and controlling the first elevating means and the second elevating means. Control means (not shown); cylindrical photomask 10 and Stage 20 for moving the direction two leaves of the workpiece 100 perpendicular to the axial direction of the first adhesive roll 16 and a (moving means).
Hereinafter, components having the same configuration as the exposure apparatus according to the first embodiment are denoted by the same reference numerals when illustrated. Detailed description of the same configuration as that of the exposure apparatus according to the first embodiment is omitted.

(Control means)
The control means controls the first lifting means and the second lifting means, and causes each lifting means to perform the following operation.
(Α) When the workpiece 100 does not exist below the first adhesive roll 16, the first adhesive roll 16 and the first strong adhesive roll 18 are raised to place the first adhesive roll 16 on the surface of the photosensitive layer 104. Retreat to a higher position.
(Β) When the workpiece 100 does not exist below the cylindrical photomask 10, the cylindrical photomask 10 is raised and the cylindrical photomask 10 is retracted to a position higher than the surface of the photosensitive layer 104.
(Γ) When the workpiece 100 is present below the first adhesive roll 16, the first adhesive roll 16 and the first strong adhesive roll 18 are lowered to place the first adhesive roll 16 on the surface of the photosensitive layer 104. Contact.
(Δ) When the workpiece 100 exists below the cylindrical photomask 10, the cylindrical photomask 10 is lowered to bring the cylindrical photomask 10 into contact with the surface of the photosensitive layer 104.

The control means includes a processing unit (not shown), an interface unit (not shown), and a storage unit (not shown).
The interface unit electrically connects the first elevating unit, the second elevating unit, the stage 20 and the like to the processing unit.
The processing unit controls each lifting means based on the settings (size, thickness, installation position, etc. of the workpiece 100) stored in the storage unit, the position of the stage 20, and the like.

The processing unit may be realized by dedicated hardware, and the processing unit is configured by a memory and a central processing unit (CPU), and a program for realizing the function of the processing unit is provided. The function may be realized by loading it into a memory and executing it.
In addition, an input device, a display device, and the like are connected to the control means as peripheral devices. Here, the input device refers to an input device such as a display touch panel, a switch panel, or a keyboard, and the display device refers to a CRT, a liquid crystal display device, or the like.

<Exposure method>
In the exposure method using the exposure apparatus 2 according to the second embodiment of the present invention, the cylindrical photo that contacts the photosensitive layer 104 with the photosensitive layer 104 of the workpiece 100 having the photosensitive layer 104 formed on the surface of the substrate 102 is used. In this method, exposure is performed through the mask 10 and a latent image pattern corresponding to the pattern of the cylindrical photomask 10 is formed on the photosensitive layer 104.
Hereinafter, detailed description of the same operation as the exposure method according to the first embodiment will be omitted.

(Cleaning, exposure)
The stage 20 on which the workpiece 100 is placed is moved in a direction orthogonal to the axial direction of the cylindrical photomask 10 and the first adhesive roll 16.
(Α) As shown in FIG. 2, when the workpiece 100 does not exist below the first adhesive roll 16, the first adhesive roll 16 and the first strong adhesive roll 18 are raised to form the first adhesive roll. 16 is retracted to a position higher than the surface of the photosensitive layer 104.
(Β) Also, as shown in FIG. 2, when the workpiece 100 does not exist below the cylindrical photomask 10, the cylindrical photomask 10 is raised so that the cylindrical photomask 10 is positioned above the surface of the photosensitive layer 104. Retreat to a higher position.

(Γ) As shown in FIG. 3, when the top of the workpiece 100 reaches the lower side of the first adhesive roll 16, the first adhesive roll 16 and the first strong adhesive roll 18 are moved down, and the first The adhesive roll 16 is brought into contact with the surface of the photosensitive layer 104.
While moving the workpiece 100, the surface of the photosensitive layer 104 and the first adhesive roll 16 are brought into contact with each other, whereby the first adhesive roll 16 is rotated on the surface of the photosensitive layer 104 and is exposed to the first adhesive roll 16. The surface of the layer 104 is cleaned.

(Δ) As shown in FIG. 4, when the top of the workpiece 100 reaches below the cylindrical photomask 10, the cylindrical photomask 10 is lowered to bring the cylindrical photomask 10 to the surface of the photosensitive layer 104. Make contact.
While moving the workpiece 100, the cylindrical photomask 10 is rotated on the surface of the photosensitive layer 104 at the same time as the photosensitive layer 104 whose surface has been cleaned and the cylindrical photomask 10 are brought into contact with each other. The photosensitive layer 104 is irradiated with radiation from the radiation irradiating means disposed inside.
In this manner, the photosensitive layer 104 whose surface has been cleaned is exposed through the cylindrical photomask 10, and a latent image pattern corresponding to the pattern of the cylindrical photomask 10 is formed on the photosensitive layer 104.

(Α) As shown in FIG. 5, when the rear end of the workpiece 100 reaches below the first adhesive roll 16, the first adhesive roll remains without changing the moving speed of the stage 20 on which the workpiece 100 is placed. 16 and the first strong adhesive roll 18 are raised to separate the first adhesive roll 16 from the surface of the photosensitive layer 104.
(Β) As shown in FIG. 6, when the rear end of the work 100 reaches the lower side of the cylindrical photomask 10, the cylindrical photomask 10 is lifted so that the cylindrical photomask 10 is placed on the surface of the photosensitive layer 104. Separate from.

<Action mechanism>
The second embodiment of the present invention described above has the same configuration as the first embodiment, and when the same operation as the first embodiment is performed, the same action as the first embodiment. Demonstrate the mechanism.
In the second embodiment of the present invention described above, when the single-wafer workpiece 100 does not exist below the cylindrical photomask 10, the cylindrical photomask 10 is higher than the surface of the photosensitive layer 104. When the single-wafer workpiece 100 exists below the cylindrical photomask 10, the top of the single-wafer workpiece 100 is cylindrical because the cylindrical photomask 10 is in contact with the surface of the photosensitive layer 104. There is no collision with the photomask 10 from the side. Therefore, the surface of the cylindrical photomask 10 is not damaged by the collision of the workpiece 100.

  In the second embodiment of the present invention described above, when the single-wafer workpiece 100 is not present below the first adhesive roll 16, the first adhesive roll 16 is moved from the surface of the photosensitive layer 104. When the single-wafer workpiece 100 exists below the first adhesive roll 16, the first adhesive roll 16 is in contact with the surface of the photosensitive layer 104. Does not collide with the first adhesive roll 16 from the side. Therefore, the surface of the first adhesive roll 16 is not damaged by the collision of the workpiece 100.

  In the second embodiment of the present invention described above, since the distance between the first adhesive roll 16 and the cylindrical photomask 10 is shorter than the length of the workpiece 100, the photosensitive layer. The cleaning and exposure 104 can be performed continuously at a short moving distance, and the exposure processing time can be shortened.

[Third Embodiment]
<Exposure device>
FIG. 7 is a schematic view showing an exposure apparatus according to the third embodiment of the present invention.
The exposure apparatus 3 exposes the photosensitive layer 104 of the workpiece 100 having the photosensitive layer 104 formed on the surface of the substrate 102 through the cylindrical photomask 10 in contact with the photosensitive layer 104, and the pattern of the cylindrical photomask 10. A latent image pattern corresponding to the above is formed on the photosensitive layer 104.

The exposure apparatus 3 is the same as the exposure apparatus according to the second embodiment except that the distance between the first adhesive roll 16 and the cylindrical photomask 10 is not less than the length of the workpiece 100.
Hereinafter, components having the same configuration as the exposure apparatus according to the first and second embodiments are denoted by the same reference numerals when illustrated. Detailed descriptions of the same configuration as the exposure apparatus according to the first and second embodiments are omitted.

<Exposure method>
In the exposure method using the exposure apparatus 3 according to the third embodiment of the present invention, the cylindrical photo that contacts the photosensitive layer 104 with the photosensitive layer 104 of the workpiece 100 having the photosensitive layer 104 formed on the surface of the substrate 102 is used. In this method, exposure is performed through the mask 10 and a latent image pattern corresponding to the pattern of the cylindrical photomask 10 is formed on the photosensitive layer 104.
Hereinafter, detailed description of the same operation as the exposure method according to the first embodiment will be omitted.

(Cleaning, exposure)
The stage 20 on which the workpiece 100 is placed is moved in a direction orthogonal to the axial direction of the first adhesive roll 16.
(Α) As shown in FIG. 7, when the workpiece 100 does not exist below the first adhesive roll 16, the first adhesive roll 16 and the first strong adhesive roll 18 are raised to form the first adhesive roll. 16 is retracted to a position higher than the surface of the photosensitive layer 104.
(Β) Also, as shown in FIG. 7, when the workpiece 100 does not exist below the cylindrical photomask 10, the cylindrical photomask 10 is raised so that the cylindrical photomask 10 is positioned above the surface of the photosensitive layer 104. Retreat to a higher position.

(Γ) As shown in FIG. 8, when the top of the work 100 reaches the lower side of the first adhesive roll 16, the first adhesive roll 16 and the first strong adhesive roll 18 are moved down to the first The adhesive roll 16 is brought into contact with the surface of the photosensitive layer 104.
While moving the workpiece 100, the surface of the photosensitive layer 104 and the first adhesive roll 16 are brought into contact with each other, whereby the first adhesive roll 16 is rotated on the surface of the photosensitive layer 104 and is exposed to the first adhesive roll 16. The surface of the layer 104 is cleaned.

  (Α) As shown in FIG. 9, when the end of the workpiece 100 reaches below the first adhesive roll 16, the first adhesive roll 16 and the first strong adhesive roll 18 are raised, One adhesive roll 16 is separated from the surface of the photosensitive layer 104.

Subsequently, the stage 20 on which the workpiece 100 is placed is moved in a direction orthogonal to the axial direction of the cylindrical photomask 10.
(Δ) As shown in FIG. 10, when the top of the workpiece 100 reaches below the cylindrical photomask 10, the cylindrical photomask 10 is lowered to bring the cylindrical photomask 10 to the surface of the photosensitive layer 104. Make contact.
While moving the workpiece 100, the cylindrical photomask 10 is rotated on the surface of the photosensitive layer 104 at the same time as the photosensitive layer 104 whose surface has been cleaned and the cylindrical photomask 10 are brought into contact with each other. The photosensitive layer 104 is irradiated with radiation from the radiation irradiating means disposed inside.
In this manner, the photosensitive layer 104 whose surface has been cleaned is exposed through the cylindrical photomask 10, and a latent image pattern corresponding to the pattern of the cylindrical photomask 10 is formed on the photosensitive layer 104.

  (Β) As shown in FIG. 11, when the rear end of the workpiece 100 reaches the lower side of the cylindrical photomask 10, the cylindrical photomask 10 is raised, and the cylindrical photomask 10 is moved to the surface of the photosensitive layer 104. Separate from.

<Action mechanism>
The third embodiment of the present invention described above has the same configuration as the first and second embodiments, and when the same operation as the first and second embodiments is performed, The same mechanism of action is exhibited.
In the third embodiment of the present invention described above, since the distance between the first adhesive roll 16 and the cylindrical photomask 10 is equal to or longer than the length of the workpiece 100, cleaning and exposure are performed. Can be done in stages in separate steps. Therefore, even when the movement of the workpiece 100 is temporarily stopped when the first adhesive roll 16 is raised or lowered or when the cylindrical photomask 10 is raised or lowered, the first adhesive roll 16 or the cylindrical photomask 10 remains on the surface of the photosensitive layer 104. There is no stopping while touching. Therefore, the entire surface of the photosensitive layer 104 can be uniformly cleaned and exposed.

[Fourth Embodiment]
<Exposure device>
FIG. 12 is a schematic view showing an exposure apparatus according to the fourth embodiment of the present invention.
The exposure apparatus 4 exposes the photosensitive layer 104 of the workpiece 100 having the photosensitive layer 104 formed on the surface of the substrate 102 through the cylindrical photomask 10 in contact with the photosensitive layer 104, and the pattern of the cylindrical photomask 10. A latent image pattern corresponding to the above is formed on the photosensitive layer 104.
In the exposure apparatus 4, a first dummy substrate 106 is disposed adjacent to the front side of the single-wafer workpiece 100 on the side that first comes into contact with the cylindrical photomask 10. The second dummy base material 108 of the single wafer is disposed adjacent to the rear of the side that comes into contact with the cylindrical photomask 10 last.

The exposure apparatus 4 is the same as the exposure apparatus according to the second embodiment except that the raising / lowering timing of the first adhesive roll 16 and the cylindrical photomask 10 is changed.
Hereinafter, components having the same configuration as the exposure apparatus according to the first and second embodiments are denoted by the same reference numerals when illustrated. Detailed descriptions of the same configuration as the exposure apparatus according to the first and second embodiments are omitted.

(Control means)
The control means controls the first lifting means and the second lifting means, and causes each lifting means to perform the following operation.
(I) When the workpiece 100, the first dummy base material 106, and the second dummy base material 108 do not exist below the cylindrical photomask 10, the cylindrical photomask 10, the first adhesive roll 16, and the first The strong adhesive roll 18 is raised, and the cylindrical photomask 10 and the first adhesive roll 16 are retracted to a position higher than the surface of the photosensitive layer 104.
(II) When the first dummy base material 106 exists below the cylindrical photomask 10, the cylindrical photomask 10, the first adhesive roll 16 and the first strong adhesive roll 18 are lowered, The cylindrical photomask 10 and the first adhesive roll 16 are brought into contact with the surface of the first dummy substrate 106.
(III) After bringing the cylindrical photomask 10 and the first adhesive roll 16 into contact with the surface of the first dummy base 106, the photosensitive layer 104 of the workpiece 100, the cylindrical photomask 10 and the first adhesive roll are subsequently continued. 16 is brought into contact.
(IV) When the second dummy base material 108 exists below the cylindrical photomask 10, the cylindrical photomask 10, and the first adhesive roll 16 and the first strong adhesive roll 18 are raised, The cylindrical photomask 10 and the first adhesive roll 16 are separated from the surface of the second dummy base material 108.

The control means includes a processing unit (not shown), an interface unit (not shown), and a storage unit (not shown).
The interface unit electrically connects the first elevating unit, the second elevating unit, the stage 20 and the like to the processing unit.
The processing unit controls each lifting means based on the settings (size, thickness, installation position, size of each dummy base material, etc.) of the work 100, the position of the stage 20, etc. stored in the storage unit. is there.
The configuration of the processing unit, peripheral devices, and the like are the same as in the second embodiment.

<Exposure method>
In the exposure method using the exposure apparatus 4 according to the fourth embodiment of the present invention, a cylindrical photo that contacts the photosensitive layer 104 with the photosensitive layer 104 of the workpiece 100 having the photosensitive layer 104 formed on the surface of the base material 102. In this method, exposure is performed through the mask 10 and a latent image pattern corresponding to the pattern of the cylindrical photomask 10 is formed on the photosensitive layer 104.
In the exposure method using the exposure apparatus 4, the first dummy substrate 106 of the single wafer is disposed adjacent to the front of the side of the single-piece workpiece 100 that first contacts the cylindrical photomask 10, A second dummy substrate 108 of a single wafer is disposed adjacently behind the side of the single-piece workpiece 100 that comes into contact with the cylindrical photomask 10 last.
Hereinafter, detailed description of the same operation as the exposure method according to the first and second embodiments is omitted.

(Dummy base material)
The thicknesses of the first dummy base material 106 and the second dummy base material 108 are the same as the thickness of the workpiece 100.
The material of the first dummy base material 106 and the second dummy base material 108 is preferably the same as that of the base material 102.

(Cleaning, exposure)
The stage 20 on which the workpiece 100, the first dummy base material 106, and the second dummy base material 108 are placed is moved in a direction orthogonal to the axial direction of the cylindrical photomask 10 and the first adhesive roll 16.
(I) As shown in FIG. 12, when the workpiece 100, the first dummy base material 106, and the second dummy base material 108 do not exist below the cylindrical photomask 10, the cylindrical photomask 10 and the first The adhesive roll 16 and the first strong adhesive roll 18 are raised, and the cylindrical photomask 10 and the first adhesive roll 16 are retracted to a position higher than the surface of the photosensitive layer 104.

(II) As shown in FIG. 13, when the top of the first dummy base material 106 reaches below the cylindrical photomask 10, the cylindrical photomask 10, the first adhesive roll 16, and the first adhesive roll 16 The strong adhesive roll 18 is lowered to bring the cylindrical photomask 10 and the first adhesive roll 16 into contact with the surface of the first dummy substrate 106.
While moving the workpiece 100, the first adhesive roll 16 is rotated on the surface of the first dummy base 106 by bringing the surface of the first dummy base 106 into contact with the first adhesive roll 16. The surface of the first dummy base 106 is cleaned with the first adhesive roll 16.

(III) As shown in FIG. 14, the first adhesive roll 16 on the surface of the photosensitive layer 104 is brought into contact with the surface of the photosensitive layer 104 by bringing the surface of the photosensitive layer 104 into contact with the first adhesive roll 16 while moving the workpiece 100. The surface of the photosensitive layer 104 is cleaned with the first adhesive roll 16.
Further, while moving the workpiece 100, the photosensitive layer 104 whose surface is cleaned and the cylindrical photomask 10 are brought into contact with each other, whereby the cylindrical photomask 10 is rotated on the surface of the photosensitive layer 104 and at the same time, the cylindrical photomask 10 is rotated. The photosensitive layer 104 is irradiated with radiation from radiation irradiating means disposed inside the mask 10.
In this manner, the photosensitive layer 104 whose surface has been cleaned is exposed through the cylindrical photomask 10, and a latent image pattern corresponding to the pattern of the cylindrical photomask 10 is formed on the photosensitive layer 104.

  (IV) As shown in FIG. 15, when the top of the second dummy base material 108 reaches below the cylindrical photomask 10, the cylindrical photomask 10, the first adhesive roll 16, and the first adhesive roll 16 The strong adhesive roll 18 is raised to separate the cylindrical photomask 10 and the first adhesive roll 16 from the surface of the second dummy base material 108.

<Action mechanism>
The fourth embodiment of the present invention described above has the same configuration as that of the first and second embodiments, and when the same operation as that of the first and second embodiments is performed, The same mechanism of action is exhibited.
Further, in the fourth embodiment of the present invention described above, the first dummy base material 106 of the single wafer is provided in front of the side of the single-piece workpiece 100 that first contacts the cylindrical photomask 10. Are disposed adjacent to each other, and the second dummy base material 108 is disposed adjacently behind the side of the sheet workpiece 100 that comes into contact with the cylindrical photomask 10 last. The first adhesive roll 16 can reliably contact the leading and trailing ends of 100. Therefore, the entire surface of the photosensitive layer 104 can be reliably cleaned. In addition, since the first dummy base material 106, the second dummy base material 108, and the workpiece 100 have the same thickness, the first adhesive roll 16 and the cylindrical photomask 10 are arranged at the front end and the rear side of the workpiece 100. When passing over the edge, it will not be damaged by climbing or falling off the step. Moreover, since the cylindrical photomask 10 and the first adhesive roll 16 are moved up and down on the first dummy base material 106 and the second dummy base material 108, the work 100 is stopped and the lifting operation is performed. Even in this case, the entire surface of the photosensitive layer 104 can be uniformly cleaned and exposed, and the control of the lifting operation can be simplified. Further, according to this method, the entire surface of the photosensitive layer 104 can be reliably cleaned and exposed even when there is a slight error in the size and installation position of the workpiece 100.

  In the fourth embodiment of the present invention described above, since the cylindrical photomask 10 and the first adhesive roll 16 are lifted and lowered simultaneously, the first lifting means and the second lifting means are provided. It can be combined into one lifting means. Therefore, the configuration of the exposure apparatus 4 can be simplified.

  In the fourth embodiment of the present invention, a part of the first dummy base material 106 comes into contact with the cylindrical photomask 10 without being cleaned by the first adhesive roll 16. Therefore, when the workpiece 100 is installed or removed, the degree of cleanness is locally increased by surrounding the uncleaned portion of the first dummy base material 106, so that foreign matter adheres to the first dummy base material 106 even when the operator approaches. The foreign matter is transferred from the first dummy base material 106 to the cylindrical photomask 10 by using the first dummy base material 106 having a surface having higher adhesiveness than the cylindrical photomask 10. Is preferably suppressed.

[Fifth Embodiment]
<Exposure device>
FIG. 16 is a schematic view showing an exposure apparatus according to the fifth embodiment of the present invention.
The exposure apparatus 5 exposes the photosensitive layer 104 of the workpiece 100 having the photosensitive layer 104 formed on the surface of the substrate 102 through the cylindrical photomask 10 in contact with the photosensitive layer 104, and the pattern of the cylindrical photomask 10. A latent image pattern corresponding to the above is formed on the photosensitive layer 104.

The exposure apparatus 5 changes the second lifting / lowering means to a spring mechanism 24 (a gas pressure mechanism, a hydraulic mechanism, or the like), and is always below the first adhesive roll 16 while contacting the stage 20 and the photosensitive layer 104. The exposure apparatus is the same as the exposure apparatus according to the second embodiment except that the stage 20 and the photosensitive layer 104 are cleaned by continuously applying pressure toward the surface.
Hereinafter, components having the same configuration as the exposure apparatus according to the first and second embodiments are denoted by the same reference numerals when illustrated. Detailed descriptions of the same configuration as the exposure apparatus according to the first and second embodiments are omitted.

(Control means)
The control means controls the first lifting / lowering means and causes the first lifting / lowering means to perform the following operation.
(Β) When the workpiece 100 does not exist below the cylindrical photomask 10, the cylindrical photomask 10 is raised and the cylindrical photomask 10 is retracted to a position higher than the surface of the photosensitive layer 104.
(Δ) When the workpiece 100 exists below the cylindrical photomask 10, the cylindrical photomask 10 is lowered to bring the cylindrical photomask 10 into contact with the surface of the photosensitive layer 104.

The control means includes a processing unit (not shown), an interface unit (not shown), and a storage unit (not shown).
The interface unit electrically connects the first lifting means, the stage 20 and the like to the processing unit.
The processing unit controls the first lifting / lowering means based on the settings (size, thickness, installation position, etc. of the workpiece 100) stored in the storage unit, the position of the stage 20, and the like.
The configuration of the processing unit, peripheral devices, and the like are the same as in the second embodiment.

<Exposure method>
In the exposure method using the exposure apparatus 5 according to the fifth embodiment of the present invention, a cylindrical photo that contacts the photosensitive layer 104 with the photosensitive layer 104 of the workpiece 100 having the photosensitive layer 104 formed on the surface of the substrate 102. In this method, exposure is performed through the mask 10 and a latent image pattern corresponding to the pattern of the cylindrical photomask 10 is formed on the photosensitive layer 104.
Hereinafter, detailed description of the same operation as the exposure method according to the first and second embodiments is omitted.

(Cleaning, exposure)
The stage 20 on which the workpiece 100 is placed is moved in a direction orthogonal to the axial direction of the cylindrical photomask 10 and the first adhesive roll 16.
(Β) As shown in FIG. 16, when the workpiece 100 does not exist below the cylindrical photomask 10, the cylindrical photomask 10 is raised so that the cylindrical photomask 10 is higher than the surface of the photosensitive layer 104. Evacuate.

  As shown in FIG. 16, when only the stage 20 exists below the first adhesive roll 16, the first adhesive roll 16 is pressed against the surface of the stage 20 by the spring mechanism 24. By moving the stage 20 and bringing the stage 20 and the first adhesive roll 16 into contact with each other, the first adhesive roll 16 is rotated on the surface of the stage 20, and the surface of the stage 20 is moved with the first adhesive roll 16. Clean it.

When the top of the workpiece 100 reaches the first adhesive roll 16, the first adhesive roll 16 rides on the workpiece 100 and is pressed against the surface of the photosensitive layer 104 by the spring mechanism 24.
While moving the workpiece 100, the surface of the photosensitive layer 104 and the first adhesive roll 16 are brought into contact with each other, whereby the first adhesive roll 16 is rotated on the surface of the photosensitive layer 104 and is exposed to the first adhesive roll 16. The surface of the layer 104 is cleaned.

(Δ) As shown in FIG. 17, when the top of the workpiece 100 reaches below the cylindrical photomask 10, the cylindrical photomask 10 is lowered to bring the cylindrical photomask 10 to the surface of the photosensitive layer 104. Make contact.
While moving the workpiece 100, the cylindrical photomask 10 is rotated on the surface of the photosensitive layer 104 at the same time as the photosensitive layer 104 whose surface has been cleaned and the cylindrical photomask 10 are brought into contact with each other. The photosensitive layer 104 is irradiated with radiation from the radiation irradiating means disposed inside.
In this manner, the photosensitive layer 104 whose surface has been cleaned is exposed through the cylindrical photomask 10, and a latent image pattern corresponding to the pattern of the cylindrical photomask 10 is formed on the photosensitive layer 104.

When the end of the workpiece 100 reaches below the first adhesive roll 16, the first adhesive roll 16 rolls down on the surface of the stage 20 and is pressed against the surface of the stage 20 by the spring mechanism 24. By moving the stage 20 and bringing the stage 20 and the first adhesive roll 16 into contact with each other, the first adhesive roll 16 is rotated on the surface of the stage 20, and the surface of the stage 20 is moved with the first adhesive roll 16. Clean it.
The first adhesive roll 16 is separated from the surface of the stage 20 by the last tail of the stage 20 passing through the first adhesive roll 16.

  (Β) As shown in FIG. 18, when the rear end of the workpiece 100 reaches the lower side of the cylindrical photomask 10, the cylindrical photomask 10 is raised, and the cylindrical photomask 10 is moved to the surface of the photosensitive layer 104. Separate from.

<Action mechanism>
The fifth embodiment of the present invention described above has the same configuration as that of the first and second embodiments. When the same operation as that of the first embodiment is performed, the first and second embodiments are used. Exhibits the same mechanism of action as the form.
Further, in the fifth embodiment of the present invention described above, since the first adhesive roll 16 is pressed against the surface of the photosensitive layer 104 and the like by the spring mechanism 24, it is necessary to provide the second lifting means. Absent. Therefore, the configuration of the exposure apparatus 5 can be simplified.

  Further, when the first adhesive roll 16 is raised and lowered by the second raising / lowering means, it is necessary to temporarily stop the movement of the workpiece 100 and stop the exposure, but in the fifth embodiment of the present invention. Since the second lifting means is not provided, the exposure can be continuously performed without stopping. As a result, the time for the exposure process can be shortened. Further, the entire surface of the photosensitive layer 104 can be exposed uniformly.

  In the fifth embodiment of the present invention, when the first adhesive roll 16 rides on the workpiece 100 or rolls down from the workpiece 100, the surface of the first adhesive roll 16 comes into contact with the ridge angle of the workpiece 100. May be damaged. Therefore, it is preferable that the ridge angle of the workpiece 100 is chamfered in advance.

[Sixth Embodiment]
<Exposure device>
FIG. 19 is a schematic view showing an exposure apparatus according to the sixth embodiment of the present invention.
The exposure apparatus 6 exposes the photosensitive layer 104 of the workpiece 100 having the photosensitive layer 104 formed on the surface of the substrate 102 through the cylindrical photomask 10 in contact with the photosensitive layer 104, and the pattern of the cylindrical photomask 10. A latent image pattern corresponding to the above is formed on the photosensitive layer 104.
In the exposure apparatus 6, the single-wafer first dummy base material 106 is disposed adjacent to the front of the single-wafer workpiece 100 on the side that first contacts the cylindrical photomask 10. The second dummy base material 108 of the single wafer is disposed adjacent to the rear of the side that comes into contact with the cylindrical photomask 10 last.

  The exposure apparatus 6 includes a working chamber 90 for placing the workpiece 100 on the stage 20 (moving means) and removing the workpiece 100 from the stage 20 (moving means); and the cylindrical photomask 10 for the photosensitive layer 104 of the workpiece 100. An exposure chamber 92 that exposes the work chamber 90; a partition plate 94 that partitions the work chamber 90 and the exposure chamber 92; a clean air supply device 96 that is attached to the air supply port of the exposure chamber 92; A work door 98 for carrying in and carrying out work from the work chamber 90; and in a direction orthogonal to the axial direction of the cylindrical photomask 10 and the first adhesive roll 16, and between the work chamber 90 and the exposure chamber 92 And a stage 20 (moving means) for moving the single-wafer workpiece 100.

The exposure chamber 92 of the exposure apparatus 6 includes a cylindrical photomask 10 that is rotatable about the central axis as a rotation axis; and the cylindrical photomask 10 is rotated so that the central axis of the cylindrical photomask 10 is in the horizontal direction. A first support means (not shown) for rotatably supporting the shaft; a radiation irradiation means (not shown) disposed inside the cylindrical photomask 10; and the cylindrical photomask 10 so as to cover the radiation irradiation means A light-shielding member (not shown) having a slit so that radiation is emitted toward the contact portion between the photosensitive layer 104 and the cylindrical photomask 10; and on the surface of the cylindrical photomask 10. A second adhesive roll 26 disposed so as to be in contact with and rotatable about the central axis as a rotation axis; the central axis of the second adhesive roll 26 being parallel to the central axis of the cylindrical photomask 10 A fourth support means (not shown) for rotatably supporting the rotation axis of the second adhesive roll 26; disposed so as to contact the surface of the second adhesive roll 26, and rotatable about the central axis as a rotation axis The second strong adhesive roll 28, and the rotational axis of the second strong adhesive roll 28 is rotated so that the central axis of the second strong adhesive roll 28 is parallel to the central axis of the second adhesive roll 26. A fifth support means (not shown) for supporting freely; a position where the surface can be in contact with the surface of the photosensitive layer 104 before the cylindrical photomask 10 contacts, and the distance from the cylindrical photomask 10 is the workpiece 100. A first adhesive roll 16 that is arranged to be shorter than the length of the first dummy base material 106 and that is shorter than the length of the first dummy base material 106 and is rotatable about the central axis; First so that the axis is horizontal Second support means (not shown) for rotatably supporting the rotating shaft of the landing roll 16; disposed so as to contact the surface of the first adhesive roll 16, and rotatable about the central axis as the rotating shaft The first strong adhesive roll 18; the rotational axis of the first strong adhesive roll 18 is rotatably supported so that the central axis of the first strong adhesive roll 18 is parallel to the central axis of the first adhesive roll 16. A third supporting means (not shown) for performing; a first elevating means (not shown) for raising and lowering the cylindrical photomask 10, the second adhesive roll 26 and the second strong adhesive roll 28; and a first adhesive Second elevating means (not shown) for elevating and lowering the roll 16 and the first strong adhesive roll 18; and control means (not shown) for controlling the first elevating means and the second elevating means.
Hereinafter, components having the same configuration as the exposure apparatus according to the first, second, and fourth embodiments are denoted by the same reference numerals when illustrated. Detailed descriptions of the same components as those of the exposure apparatus according to the first, second, and fourth embodiments are omitted.

(Work room, exposure room)
The exposure apparatus 6 is divided into a work chamber 90 and an exposure chamber 92 by a partition plate 94. Providing the partition plate 94 prevents foreign matter from adhering to the cylindrical photomask 10 when placing the workpiece 100 on the stage 20 and removing the workpiece 100 from the stage 20.
By attaching a clean air supply device 96 (hepa filter air cleaner or the like) to the air supply port of the exposure chamber 92, the exposure chamber 92 is made into a clean booth. Further, by setting the exposure chamber 92 to a positive pressure, it is difficult for air containing foreign matter to flow into the exposure chamber 92 from the work chamber 90.

(Second adhesive roll, second strong adhesive roll)
As the second adhesive roll 26, the same one as the first adhesive roll 16 may be used.
As the second strong adhesive roll 28, the same one as the first strong adhesive roll 18 may be used.

(Control means)
The control means controls the first lifting means and the second lifting means, and causes each lifting means to perform the following operation.
(I) When the workpiece 100, the first dummy base material 106, and the second dummy base material 108 do not exist below the cylindrical photomask 10, the cylindrical photomask 10, the second adhesive roll 26, and the second The strong adhesive roll 28, the first adhesive roll 16 and the first strong adhesive roll 18 are raised to retract the cylindrical photomask 10 and the first adhesive roll 16 to a position higher than the surface of the photosensitive layer 104. .
(II) When the first dummy base material 106 exists below the cylindrical photomask 10, the cylindrical photomask 10, the second adhesive roll 26, the second strong adhesive roll 28, and the first adhesive The roll 16 and the first strong adhesive roll 18 are lowered to bring the cylindrical photomask 10 and the first adhesive roll 16 into contact with the surface of the first dummy substrate 106.
(III) After bringing the cylindrical photomask 10 and the first adhesive roll 16 into contact with the surface of the first dummy base 106, the photosensitive layer 104 of the workpiece 100, the cylindrical photomask 10 and the first adhesive roll are subsequently continued. 16 is brought into contact.
(IV) When the second dummy base material 108 exists below the cylindrical photomask 10, the cylindrical photomask 10, the second adhesive roll 26, the second strong adhesive roll 28, and the first adhesive The roll 16 and the first strong adhesive roll 18 are raised to separate the cylindrical photomask 10 and the first adhesive roll 16 from the surface of the second dummy substrate 108.

The control means includes a processing unit (not shown), an interface unit (not shown), and a storage unit (not shown).
The interface unit electrically connects the first elevating unit, the second elevating unit, the stage 20 and the like to the processing unit.
The processing unit controls each lifting means based on the settings (size, thickness, installation position, size of each dummy base material, etc.) of the work 100, the position of the stage 20, etc. stored in the storage unit. is there.
The configuration of the processing unit, peripheral devices, and the like are the same as in the second embodiment.

<Exposure method>
In the exposure method using the exposure apparatus 6 according to the sixth embodiment of the present invention, a cylindrical photo that contacts the photosensitive layer 104 with the photosensitive layer 104 of the workpiece 100 having the photosensitive layer 104 formed on the surface of the substrate 102. In this method, exposure is performed through the mask 10 and a latent image pattern corresponding to the pattern of the cylindrical photomask 10 is formed on the photosensitive layer 104.
In the exposure method using the exposure apparatus 6, the first dummy substrate 106 of the single wafer is disposed adjacent to the front of the single-piece workpiece 100 on the side that first comes into contact with the cylindrical photomask 10. A second dummy substrate 108 of a single wafer is disposed adjacently behind the side of the single-piece workpiece 100 that comes into contact with the cylindrical photomask 10 last.
Hereinafter, detailed description of the same operation as the exposure method according to the first, second, and fourth embodiments is omitted.

(Cleaning, exposure)
The workpiece 100, the first dummy substrate 106, and the second dummy substrate in a direction orthogonal to the axial direction of the cylindrical photomask 10 and the first adhesive roll 16 and from the work chamber 90 toward the exposure chamber 92. The stage 20 on which 108 is placed is moved.
(I) As shown in FIG. 19, when the workpiece 100, the first dummy base material 106, and the second dummy base material 108 do not exist below the cylindrical photomask 10, the cylindrical photomask 10, The pressure-sensitive adhesive roll 26 and the second strong pressure-sensitive adhesive roll 28, and the first pressure-sensitive adhesive roll 16 and the first strong pressure-sensitive adhesive roll 18 are raised, and the cylindrical photomask 10 and the first pressure-sensitive adhesive roll 16 are moved to the surface of the photosensitive layer 104. Retreat to a higher position.

(II) As shown in FIG. 20, when the top of the first dummy base material 106 reaches below the cylindrical photomask 10, the cylindrical photomask 10, the second adhesive roll 26, and the second strength The adhesive roll 28 and the first adhesive roll 16 and the first strong adhesive roll 18 are lowered to bring the cylindrical photomask 10 and the first adhesive roll 16 into contact with the surface of the first dummy substrate 106.
While moving the workpiece 100, the first adhesive roll 16 is rotated on the surface of the first dummy base 106 by bringing the surface of the first dummy base 106 into contact with the first adhesive roll 16. The surface of the first dummy base 106 is cleaned with the first adhesive roll 16.

(III) Subsequently, the first adhesive roll 16 is rotated on the surface of the photosensitive layer 104 by bringing the surface of the photosensitive layer 104 into contact with the first adhesive roll 16 while moving the workpiece 100. The surface of the photosensitive layer 104 is cleaned with the adhesive roll 16.
Further, while moving the workpiece 100, the photosensitive layer 104 whose surface is cleaned and the cylindrical photomask 10 are brought into contact with each other, whereby the cylindrical photomask 10 is rotated on the surface of the photosensitive layer 104 and at the same time, the cylindrical photomask 10 is rotated. The photosensitive layer 104 is irradiated with radiation from radiation irradiating means disposed inside the mask 10.
In this manner, the photosensitive layer 104 whose surface has been cleaned is exposed through the cylindrical photomask 10, and a latent image pattern corresponding to the pattern of the cylindrical photomask 10 is formed on the photosensitive layer 104.

At least while the photosensitive layer 104 and the cylindrical photomask 10 are in contact with each other, the second adhesive roll 26 is brought into contact with the surface of the cylindrical photomask 10 to follow the rotation of the cylindrical photomask 10. Rotate to clean the surface of the cylindrical photomask 10.
At this time, the second strong adhesive roll 28 is brought into contact with the surface of the second adhesive roll 26 to rotate following the rotation of the second adhesive roll 26, and the surface of the second adhesive roll 26 is further moved. Clean it.

(IV) As shown in FIG. 21, when the top of the second dummy base material 108 reaches below the cylindrical photomask 10, the cylindrical photomask 10, the second adhesive roll 26, and the second strong The pressure-sensitive adhesive roll 28, the first pressure-sensitive adhesive roll 16 and the first strong pressure-sensitive adhesive roll 18 are raised to separate the cylindrical photomask 10 and the first pressure-sensitive adhesive roll 16 from the surface of the second dummy base material 108.
Thereafter, the stage 20 on which the workpiece 100 is placed is moved from the exposure chamber 92 toward the work chamber 90 in a direction orthogonal to the axial direction of the cylindrical photomask 10 and the first adhesive roll 16. At this time, the cylindrical photomask 10 and the first adhesive roll 16 are kept retracted to a position higher than the surface of the photosensitive layer 104.

<Action mechanism>
The sixth embodiment of the present invention described above has the same configuration as the first, second, and fourth embodiments, and performs the same operation as the first, second, and fourth embodiments. The same mechanism of action as in the first, second, and fourth embodiments is exhibited.

  Further, in the sixth embodiment of the present invention described above, the cylindrical photomask 104 is brought into contact with the photosensitive layer 104 and the cylindrical photomask 10 while the workpiece 100 is moved, so that a cylindrical photo is formed on the surface of the photosensitive layer 104. At the same time as the rotation of the mask 10, the second adhesive roll 26 that rotates while contacting the surface of the cylindrical photomask 10 while irradiating the photosensitive layer 104 with radiation from the radiation irradiating means 12 rotates the mask 10. The surface is being cleaned. Therefore, the foreign matter adhering to the surface of the cylindrical photomask 10 can be removed without stopping the operation of the exposure apparatus 1. Further, since the foreign matter attached to the surface of the cylindrical photomask 10 is always removed, the latent image pattern formed on the photosensitive layer 104 has a defect derived from the foreign matter attached to the surface of the cylindrical photomask 10. Is unlikely to occur.

  Further, in the sixth embodiment of the present invention described above, the surface of the second adhesive roll 26 is moved by the second strong adhesive roll 28 that rotates in contact with the surface of the second adhesive roll 26. Since the cleaning is performed, the cylindrical photomask 10 can be cleaned with the second adhesive roll 26 for a long time. Therefore, the exposure apparatus 1 can be operated for a long time, and the productivity of the product is improved.

[Other Embodiments]
The exposure method and the exposure apparatus according to the present invention may be an exposure method and an exposure apparatus in which the surface of the photosensitive layer is cleaned by the first adhesive roll that contacts the surface of the photosensitive layer of the workpiece and rotates following the movement of the workpiece. The present invention is not limited to the first to sixth embodiments.
For example, two or more embodiments may be combined among the first to sixth embodiments.
Further, the first strong adhesive roll, the static eliminating means, each lifting means, the second adhesive roll, and the second strong adhesive roll are not necessarily provided.
Further, the moving means is not limited to a movable stage as in the illustrated example. The moving means may be a moving means for moving the cylindrical photomask and the first adhesive roll when the work is not moved. Further, when the workpiece is a single wafer, a belt conveyor may be used.
Further, in place of the dummy base material in the fourth and sixth embodiments, as shown in FIG. 22, a recess 20a having a size corresponding to the workpiece 100 is provided on the stage 20, and the workpiece 100 is fitted therein. But you can. As a result, the same effects as those of the fourth and sixth embodiments can be obtained.

EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited to these examples.
Example 1 is an example and Example 2 is a comparative example.

(Example 1)
An exposure apparatus 1 shown in FIG. 1 was prepared.
As an apparatus main body excluding the cylindrical photomask 10, the first adhesive roll 16, the first strong adhesive roll 18, and the static elimination means 22, RUS-2 manufactured by SUSS Co., Ltd. was prepared.
As the cylindrical photomask 10, a film-like phase shift mask (material: polydimethylsiloxane) is a cylindrical substrate (material: synthetic quartz, length: 30 cm, outer diameter: 16 cm, inner diameter: 13 cm, weight: 8 kg). What was affixed on the surface was prepared.
As the first adhesive roll 16 and the first strong adhesive roll 18, a commercially available adhesive roll (manufactured by TEKNEK, SL300, adhesive force: 40 hPa) was prepared.
As the static elimination means 22, a corona static elimination device with an air nozzle (manufactured by Keyence, ultra-high speed sheath sensing ionizer SJ-H036, corona discharge method, pulse AC: 7000 V, air supply: 0.4 MPa) was prepared.
As the workpiece 100, a photoresist (AZ Electronics, AZ7904) is applied to the surface of a base material (material: soda lime glass, length: 30 cm, width: 30 cm, thickness: 2 mm), and dried to be a photosensitive layer. What formed 104 (thickness: 450 nm) was prepared.

While the workpiece 100 is placed on the stage 20 and moved at a moving speed of 9 cm / min, the surface of the photosensitive layer 104 is cleaned by the first adhesive roll 16 that contacts the surface of the photosensitive layer 104, and the photosensitive layer 104 is cleaned. The photosensitive layer 104 was irradiated with ultraviolet rays through a cylindrical photomask 10 in contact with the surface of the substrate, and an exposure process was performed. At this time, the photosensitive layer 104 was irradiated with ultraviolet rays emitted from the LED array light source inserted into the cylindrical photomask 10 through the slit 14a. In addition, the width | variety which the cylindrical photomask 10 and the photosensitive layer 104 closely_contact | adhere without a gap was confirmed beforehand, and the width | variety of the slit 14a was set so that it might become narrower than the width | variety. Then, the development process was performed and the resist pattern was formed in the surface of a base material.
When exposure processing and development processing were performed on 50 workpieces 100 and the presence or absence of defects in the resist pattern was confirmed, no defects were found in all the workpieces 100.

(Example 2)
Except for not providing the first adhesive roll 16, the first strong adhesive roll 18, and the static elimination means 22, exposure processing and development processing were performed on 50 workpieces 100 in the same manner as in Example 1. When the presence or absence of defects in the resist pattern was confirmed, defects were found in 35 workpieces 100.

  In the exposure method and the exposure apparatus of the present invention, a photosensitive layer of a workpiece having a photosensitive layer formed on the surface of a substrate is exposed through a photomask contacting the photosensitive layer, and a latent image pattern corresponding to the photomask pattern It is useful as an exposure method and exposure apparatus for forming a film on a photosensitive layer.

DESCRIPTION OF SYMBOLS 1-8 Exposure apparatus 10 Cylindrical photomask 12 Radiation irradiation means 14 Light-shielding member 14a Slit 16 1st adhesion roll 18 1st strong adhesion roll 20 Stage 20a Recessed part 22 Static elimination means 26 2nd adhesion roll 28 2nd strong Adhesive roll 90 Work chamber 92 Exposure chamber 94 Partition plate 96 Clean air supply device 98 Work door 100 Work 102 Base material 104 Photosensitive layer 106 First dummy base material 108 Second dummy base material

Claims (20)

The photosensitive layer of the workpiece having the photosensitive layer formed on the surface of the substrate is exposed through a cylindrical photomask in contact with the photosensitive layer, and a latent image pattern corresponding to the cylindrical photomask pattern is formed on the photosensitive layer. An exposure method comprising:
By bringing the photosensitive layer and the first adhesive roll into contact with each other while relatively moving the workpiece and the first adhesive roll in a direction perpendicular to the axial direction of the first adhesive roll and in opposite directions to each other, Rotating the first adhesive roll on the surface of the photosensitive layer to clean the surface of the photosensitive layer with the first adhesive roll;
The photosensitive layer whose surface has been cleaned and the cylindrical photomask are brought into contact with each other while relatively moving the workpiece and the cylindrical photomask in a direction perpendicular to the axial direction of the cylindrical photomask and in opposite directions to each other. An exposure method in which a cylindrical photomask is rotated on the surface of the photosensitive layer, and at the same time, the photosensitive layer is irradiated with radiation from radiation irradiating means disposed inside the cylindrical photomask. When the single-wafer workpiece does not exist below the cylindrical photomask, the cylindrical photomask is retracted to a position higher than the surface of the photosensitive layer,
2. The exposure method according to claim 1, wherein when the single-wafer workpiece is present below the cylindrical photomask, the cylindrical photomask is lowered and brought into contact with the surface of the photosensitive layer. When the sheet work is not present below the first adhesive roll, the first adhesive roll is retracted to a position higher than the surface of the photosensitive layer,
3. The exposure method according to claim 2, wherein when the single-wafer workpiece is present below the first adhesive roll, the first adhesive roll is lowered to contact the surface of the photosensitive layer. The first dummy base material of the single wafer is arranged adjacent to the front of the side of the single wafer workpiece that first comes into contact with the cylindrical photomask,
The second dummy base material of the single wafer is arranged adjacent to the rear of the side of the single wafer workpiece that comes into contact with the cylindrical photomask last,
When the workpiece, the first dummy base material, and the second dummy base material are not present below the cylindrical photomask, the cylindrical photomask is retracted to a position higher than the surface of the photosensitive layer,
When the first dummy substrate is present below the cylindrical photomask, the cylindrical photomask is lowered to contact the surface of the first dummy substrate;
Subsequently, the photosensitive layer of the workpiece and the cylindrical photomask are brought into contact,
The exposure method according to claim 1, wherein when the second dummy base material exists below the cylindrical photomask, the cylindrical photomask is raised and separated from the surface of the second dummy base material. When the workpiece, the first dummy base material, and the second dummy base material are not present below the first adhesive roll, the first adhesive roll is retracted to a position higher than the surface of the photosensitive layer,
When the first dummy base is present below the first adhesive roll, the first adhesive roll is lowered to contact the surface of the first dummy base,
Subsequently, the photosensitive layer of the workpiece and the first adhesive roll are brought into contact with each other,
The exposure method according to claim 4, wherein when the second dummy base is present below the first adhesive roll, the first adhesive roll is raised and separated from the surface of the second dummy base.   The exposure method according to claim 1, wherein the substrate is a glass plate.   The exposure method according to any one of claims 1 to 6, wherein a ridge angle of the single-wafer workpiece is chamfered.   The exposure method according to any one of claims 1 to 7, wherein the thickness of the substrate in the single-wafer workpiece is 0.3 mm or more.   The surface of the first adhesive roll is cleaned by a strong adhesive roll that contacts the surface of the first adhesive roll and rotates following the rotation of the first adhesive roll and has higher adhesive strength than the first adhesive roll. The exposure method according to any one of claims 1 to 8.   The exposure method according to any one of claims 1 to 9, wherein the surface of the photosensitive layer after contact with the first adhesive roll and before contact with the cylindrical photomask is neutralized.   The surface of the cylindrical photomask is cleaned by a second adhesive roll that contacts the surface of the cylindrical photomask and rotates following the rotation of the cylindrical photomask. The exposure method as described. The photosensitive layer of the workpiece having the photosensitive layer formed on the surface of the substrate is exposed through a cylindrical photomask in contact with the photosensitive layer, and a latent image pattern corresponding to the cylindrical photomask pattern is formed on the photosensitive layer. An exposure apparatus,
A cylindrical photomask that is rotatable about a central axis as a rotation axis;
Radiation irradiating means arranged inside a cylindrical photomask;
A first adhesive roll which is disposed at a position where it can contact the surface of the photosensitive layer before the cylindrical photomask contacts, and is rotatable about the central axis;
The workpiece and the cylindrical photomask are moved relative to each other in a direction orthogonal to the axial direction of the cylindrical photomask and in opposite directions, and in a direction orthogonal to the axial direction of the first adhesive roll and in opposite directions to each other An exposure apparatus comprising: a moving means for relatively moving the work and the first adhesive roll.   The exposure apparatus according to claim 12, wherein the cylindrical photomask and the first adhesive roll are free rolls. First elevating means for elevating and lowering the cylindrical photomask;
Control means for controlling the first lifting means,
The control means
When the single-wafer workpiece does not exist below the cylindrical photomask, the cylindrical photomask is retracted to a position higher than the surface of the photosensitive layer,
The exposure apparatus according to claim 12 or 13, wherein when the single-wafer workpiece is present below the cylindrical photomask, the cylindrical photomask is lowered and brought into contact with the surface of the photosensitive layer. A second elevating means for elevating and lowering the first adhesive roll;
When the control means controls the second elevating means, and the single-wafer workpiece is not present below the first adhesive roll, the first adhesive roll is placed at a position higher than the surface of the photosensitive layer. Evacuate,
The exposure apparatus according to claim 14, wherein when the single-wafer workpiece is present below the first adhesive roll, the first adhesive roll is lowered to contact the surface of the photosensitive layer. First elevating means for elevating and lowering the cylindrical photomask;
Control means for controlling the first lifting means,
The first dummy base material of the single wafer is arranged adjacent to the front of the side of the single wafer workpiece that first comes into contact with the cylindrical photomask,
When the second dummy base material of the single wafer is disposed adjacent to the back of the side of the single wafer workpiece that comes into contact with the cylindrical photomask last,
The control means
When the workpiece, the first dummy base material, and the second dummy base material are not present below the cylindrical photomask, the cylindrical photomask is retracted to a position higher than the surface of the photosensitive layer,
When the first dummy substrate is present below the cylindrical photomask, the cylindrical photomask is lowered to contact the surface of the first dummy substrate;
Subsequently, the photosensitive layer of the workpiece and the cylindrical photomask are brought into contact,
The exposure apparatus according to claim 12 or 13, wherein when the second dummy substrate is present below the cylindrical photomask, the cylindrical photomask is raised and separated from the surface of the second dummy substrate. A second elevating means for elevating and lowering the first adhesive roll;
When the control means controls the second elevating means, and the work, the first dummy base material, and the second dummy base material are not present below the first adhesive roll, the first adhesive Retract the roll to a position higher than the surface of the photosensitive layer,
When the first dummy base is present below the first adhesive roll, the first adhesive roll is lowered to contact the surface of the first dummy base,
Subsequently, the photosensitive layer of the workpiece and the first adhesive roll are brought into contact with each other,
The exposure apparatus according to claim 16, wherein when the second dummy base is present below the first adhesive roll, the first adhesive roll is raised and separated from the surface of the second dummy base.   The high pressure-sensitive adhesive roll that is disposed so as to be in contact with the surface of the first pressure-sensitive adhesive roll and is rotatable about the central axis as a rotation axis and that has higher adhesive strength than the first pressure-sensitive adhesive roll is further provided. The exposure apparatus according to any one of 17.   The exposure apparatus according to any one of claims 12 to 18, further comprising a static eliminating unit that neutralizes a surface of the photosensitive layer after contacting the first adhesive roll and before contacting the cylindrical photomask.   The exposure apparatus according to any one of claims 12 to 19, further comprising a second adhesive roll that is disposed so as to contact the surface of the cylindrical photomask and is rotatable about a central axis. .

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