TWI474983B - Scoring Method and Breaking Method of Mother Substrate - Google Patents

Description

Method for scribing mother substrate and breaking method

The present invention relates to a scribing method and a breaking method of a mother substrate composed of a brittle material such as a glass substrate.

More particularly, the present invention relates to a method of cutting a rectangular-shaped substrate from a scribe line formed on a large-area mother substrate, and dividing the unit product from the rectangular substrate, and the method of dividing the same The scribing method used. Here, the rectangular substrate refers to a substrate in which a plurality of unit substrates (unit products) are arranged in a row. In the rectangular substrate, the unit substrate array direction is the length direction.

When the rectangular substrate is cut from a mother substrate such as a glass substrate, it is known that the cutter wheels 20 and 21 arranged in the direction orthogonal to each other are pressed against the mother substrate W as shown in FIG. Thereby, a plurality of longitudinal and horizontal scribe lines Sa, Sb intersecting each other (only one is shown in FIG. 19) are formed, and then, the longitudinal scribe line Sb is drawn from the longitudinal direction by a break bar 22. A method in which the substrate W is broken to form a rectangular substrate Wa, and the rectangular substrate Wa is rotated by 90 degrees, and the cracked rod 23 is broken along the scribe line Sa to take out the unit product W1 (for example, Patent Document 1).

In the processing apparatus that performs the cutting method, a rotating mechanism that transports the substrate W in the linear direction and rotates the rectangular substrate Wa in a horizontal posture on the mounting plane by 90 degrees is used.

Moreover, in the breaking method of the above steps, when the cutter wheels 20, 21 are used When the mother substrate W cross-scribes the scribe lines Sa and Sb at the longitudinal and transverse crossings, there is a processing defect called "cut angle" or "cracking" at the intersection of the scribe lines Sa and Sb.

The "cut angle" refers to a substrate on the side where the pressure contact force of the cutter wheel 21 is loaded when the rotary cutter wheel 21 is crimped and the longitudinal scribe line is formed as shown in FIG. The substrate (the substrate on the left side of the figure) sinks as indicated by the arrow, and the chamfer angle (shown as α in the figure) generated when the substrate on the right side of the half-break state is climbed over the scribe line Sa is set.

In addition, the term "crushing" means that when the longitudinal scribe line is formed after the lateral scribe line Sa is formed as shown in FIG. 21, when the cutter wheel 21 passes over the scribed line Sa, the scribe line Sa is used. The crack K in the vertical direction extends in the oblique direction near the back surface of the substrate. The "cracking" is indicated by β in the figure.

This "cutting angle" or "cracking" will of course detract from the quality of the product after the break and become a major cause of the decline in manufacturing yield.

Therefore, in Patent Document 2, when the mother substrate is cross-cut, the pressing force is controlled to temporarily reduce the scoring pressure of the cutter wheel near the intersection of the score lines, thereby preventing the "cut angle" or "cracking". The method of production.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Laid-Open Patent Publication No. 2006-315901

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2009-132614

In the above-described conventional breaking method, it is necessary to rotate the rectangular substrate Wa by a 90-degree rotation mechanism in a state in which the horizontal posture is maintained on the placement plane. Therefore, it is necessary to provide a turntable and a device or space to be provided. Further, when the rectangular substrate Wa is rotated, it is necessary to perform a fine adjustment operation with respect to the angular position of the rotation, and there is a disadvantage that the manufacturing equipment cost increases and the production line becomes long.

Since the cross-cutting is performed in the conventional breaking method, there is a possibility of causing a "cut angle" or "cracking" to prevent the phenomenon. Although it is described in Patent Document 2, it is used for scribing. The method of pressing the pressure is temporarily controlled in the vicinity of the intersection of the line to temporarily reduce the sizing pressure of the cutter wheel. However, it is necessary to have a dedicated control program or mechanical action system that makes the pressing force complicated, which takes time and cost. Further, since the composition of the substrate or the material having the thickness is small, the scoring pressure cannot be reduced, and thus the "cut angle" or "cracking" cannot be completely prevented.

Further, if the scoring pressure of the cutter wheel is reduced near the intersection of the score line, there is a problem that a phenomenon called "intersection jump" is caused. This phenomenon refers to the fact that when the first scribe line formed by the cutter wheel is formed and the second scribe line intersecting therewith, the scribe line to be formed later is not formed near the intersection. The reason for this is considered to be that stress is left on both sides of the groove on which the first scribe line is formed, and when the cutter wheel crosses the portion where the stress remains, the pressing force of the cutter wheel is weakened. If such a "crossing point jump" occurs, it is of course impossible to obtain a beautiful cross section when the substrate is separated by a score line, and it is impossible to produce a high quality product.

Therefore, a first object of the present invention is to provide a method for suppressing the use of spin The scribing method and the breaking method of the mother substrate caused by the cross-cutting, such as "cut angle", "cracking", and "crossing point jump" when the rotating mechanism breaks the rectangular substrate.

Further, a second object of the present invention is to provide a rotating mechanism for rotating a rectangular substrate from a mother substrate without using a rotating mechanism for rotating a rectangular substrate, and to carry out the cutting by maintaining the longitudinal direction of the rectangular substrate in one direction. The method of breaking the mother substrate of the process.

In order to achieve the above object, the following technical means are employed in the method of the present invention. That is, the scribing method of the mother substrate of the present invention is a scribing method of the mother substrate by the cutter wheel, which is characterized by the following steps: (a) by the first transverse scribe along the mother substrate The predetermined line is scored to form a step of dividing the first scribe line in the lateral direction of the lower side of the rectangular substrate cut therefrom; (b) second, the longitudinal direction is the same as the number of unit products in the rectangular substrate The second scribe line in the vertical direction is formed by the second scribe line in the vertical direction, which is formed in parallel with the first scribe line and is set at a position on the upper side of the rectangular substrate. The scribe lines respectively form substantially the right side of the unit product, and are longitudinally scribed in the same amount as the number of unit products in the rectangular substrate, thereby forming a longitudinal third scribe line, the longitudinal third scribe line Forming a substantially left side of the unit product, respectively; and (c) forming a fourth scribe line dividing the lateral direction of the upper side of the rectangular substrate by scribing along the second transverse scribe line The steps.

According to the scribing method of the present invention, the longitudinal scribe line (the second scribe line and the third scribe line) for dividing each unit product is formed on the rectangular substrate in the lateral scribe line (the first scribe line, the fourth line) Between the scribe lines, there is no intersection formed by crossing the transverse scribe lines, thereby significantly reducing the occurrence of "cut angle" or "cracking" at the intersection, and eliminating " A high-quality rectangular substrate with a beautiful cross-section can be obtained by the phenomenon of crossing points.

Here, the second scribe line in the longitudinal direction and the third scribe line in the longitudinal direction may be the same number of cutter wheels as the number of unit products in the rectangular substrate, and the second scribe line is simultaneously scribed. The third line is lined with each other.

Since the longitudinal scribe lines of the unit products of the rectangular substrate formed by the division are performed using the same number of cutter wheels as the number of unit products of the rectangular substrate, there is an effect that the scribe operation can be efficiently performed in a short time.

Further, in the step of forming the first scribe line in the lateral direction and the step of forming the fourth scribe line, the processing may be performed by fixing the mother substrate and moving the cutter wheel laterally; and forming the second scribe in the longitudinal direction. In the step of the line and the third scribe line, the processing is performed by fixing the cutter wheel and moving the mother substrate.

Thereby, the longitudinal and lateral scribe lines can be effectively formed without rotating the substrate by 90 degrees.

Further, the breaking method of the present invention which is completed according to another point of view may be a breaking method in which the cutting wheel is formed by scribing the cutter wheel along the first horizontal scribed line of the mother substrate. a first scribe line in the lateral direction of the end material region of the lower portion of the mother substrate; secondly, the end material region is separated from the first scribe line by the first rupture portion to destruct the end material region; its Then, using a number of cutter wheels of the same number as the unit product in the rectangular substrate to be formed, longitudinally scribing is performed from the lower side of the mother substrate to the second horizontal scribed line parallel thereto, thereby Forming a second scribe line and a third scribe line in the longitudinal direction, the second scribe line forming a substantially right side of the unit product, the third scribe line forming a left side; and second, by causing the cutter wheel to follow the above 2 scribes the horizontal line to perform the scribe to process the fourth scribe line in the lateral direction; then, the mother substrate is separated from the fourth scribe line by the first rupture portion, and the cutting is divided by the longitudinal scribe line a plurality of unit products are arranged in a row of rectangular substrates along the longitudinal direction; and the rectangular substrate that has been cut is conveyed to the second split portion along the longitudinal direction of the substrate while being held by the transport portion from the longitudinal direction The score lines are sequentially cut, thereby cutting the unit product.

According to this method, since the rectangular substrate cut from the mother substrate is transported to the cracked portion along the longitudinal direction of the substrate while maintaining the posture thereof, the rectangular substrate is divided into unit products, so that the rectangular substrate can be omitted as is conventional. By rotating the mechanism by 90 degrees, the labor saving of the device and the cost reduction can be achieved, and the production line can be simplified.

In addition, since the longitudinal scribe lines dividing the respective unit products are formed between the lateral scribe lines, there is no intersection formed by crossing the transverse scribe lines, whereby the "cut angle" of the intersection point can be remarkably reduced or The "cracking" is produced, and the phenomenon of "crossing point jump" can be eliminated, and a high-quality rectangular substrate with a beautiful cross-section can be obtained. Further, since the longitudinal scribe lines of the unit products of the rectangular substrate formed by the division are performed using the same number of cutter wheels as the number of unit products of the rectangular substrate, the scribe operation can be efficiently performed in a short time. effect.

Further, in the above aspect of the invention, before the processing of cutting the rectangular substrate by the first rupture portion, the processing may be performed in a direction orthogonal to the longitudinal direction of the rectangular substrate; The rectangular substrate is processed by the second fracture portion from the rectangular substrate into a unit product, and is processed to be conveyed in the same direction as the longitudinal direction of the rectangular substrate.

Hereinafter, the details of the scribing method and the breaking method of the present invention will be described in detail with reference to Figs. 1 to 18 . Fig. 1 is a plan view schematically showing an example of a breaking device 1 used in carrying out the breaking method of the present invention. The breaking device 1 is composed of a scribing portion A for processing a score line on a mother substrate W, and a first split portion B for dividing a mother substrate W into a rectangle from a score line; The split portion C divides the divided rectangular substrate Wa (see FIG. 11) into a unit product W1; and the transport portion D receives the rectangular substrate Wa divided by the first split portion B and along the substrate The longitudinal direction is transported to the second split portion C.

The scribing portion A (see FIG. 2) includes a pair of left and right pillars 2, 2, and a cross member (also referred to as a beam) 3 that is cross-linked to the pillars 2 and 2, and the beam 3 is along the X direction. Configuration. A plurality of, in this embodiment, four scribe heads 4 are provided in the beam 3 so as to be movable in the X direction along the guide member 5. The number of the scribe heads 4 is set in accordance with the number of unit products W1 formed on the rectangular substrate Wa described below. A cutter wheel 6 for processing the vertical and horizontal scribe lines on the mother substrate W is attached to the lower end of the scribe head 4. The cutter wheel 6 is rotated by a switching mechanism (not shown) provided in the scribing head 4 It is mounted so as to switch to the X direction and the Y direction orthogonal to the X direction on the plane.

A platform 7 is disposed below the scribing head 4, and the platform 7 supports the mother substrate W placed thereon, and a Y-direction conveying roller that transports the substrate W placed in the Y direction from the platform 7 is attached. Further, in order to accurately perform linear transport, a chuck mechanism (not shown) may be provided on one side of the stage 7 (opposite to the side of the first split portion B of the substrate), and the chuck mechanism is held. The upper side of the mother substrate W is moved in conjunction with the conveyance movement of the Y-direction conveyance roller of the stage 7, and the mother substrate W is conveyed in the Y direction. The mother substrate W can be moved back and forth in the Y direction by the transfer mechanism.

The first fracture portion B and the second fracture portion C (see FIG. 3) are general fracture mechanisms that break the substrate by bending the substrate by applying an external force along the score line. Although the detailed mechanism description is omitted, a plate shape extending long along the scribe line S is provided below the opposite surface (the lower surface in the present embodiment) of the surface of the substrate W on which the scribe line S is provided. The split rod 10 is provided with a pair of pressing levers or rollers 11 on the left and right side portions of the score line S on the upper surface side of the substrate W. Further, the cracking rod 10 is raised to slightly bend the substrate W in an inverted V shape, whereby the scribe line (crack) is formed to penetrate and divide in the depth direction.

The splitting bar of the first splitting portion B extends in the X direction so as to be able to divide the mother substrate W from the following lateral direction (X direction), and is provided in the scribing portion A and the transport portion D. between.

The split rod of the second split portion C is extended in the Y direction in such a manner that the divided rectangular substrate Wa can be broken from the longitudinal direction (Y direction). The extension is provided on the carry-out side of the transport unit D.

The transport unit D is constituted by a platform including a Y-direction transport roller (not shown), and the rectangular substrate Wa divided by the first split portion B is in the Y direction (orthogonal to the longitudinal direction of the rectangular substrate) In the X direction transport roller (not shown), the rectangular substrate Wa divided by the first split portion B moves in the X direction (the same direction as the longitudinal direction of the rectangular substrate); first, the Y direction is made When the conveyance roller is actuated to receive the rectangular substrate Wa that has been separated by the first fracture portion B, the X-direction conveyance roller is moved to the second fracture portion C side after the stop at the fixed position.

Therefore, as shown in FIG. 1, the scribed portion A, the first rupture portion B, and the portion of the transport portion D that receives the rectangular substrate Wa are arranged in the Y direction so as to transport the substrates in this order. The transport unit D and the second split portion C are arranged in the X direction so as to transport the substrates in this order.

Further, the transport mechanism is not limited to the transport roller, and the substrate may be moved by, for example, an adsorbable robot arm or the like.

Further, in order to avoid complication of the drawing, the first breaking portion B and the stage 7 are omitted in FIGS. 4 to 18.

Next, the scribing method of the present invention using the above-described breaking device 1 and the subsequent breaking method will be described.

As shown in FIGS. 1 and 2, the mother substrate W is placed on the stage 7 of the scribing portion A in advance. The step before the loading on the stage 7 is not particularly limited. For example, the driving mechanism for moving in the X direction and the Y direction may be provided in advance on the platform 7 (the ball screw 9, the rail 8, etc. of FIG. 2). Moving the platform 7 in the X or Y direction, thereby moving the mother substrate to start The origin position of the scribing or breaking process of the present invention.

In FIG. 1, an imaginary line drawn on a mother substrate W by a two-dot chain line shows a rectangular substrate to be cut therefrom and a planned line of a unit product included in the rectangular substrate, and the W1 system displays the final scribe. The area where the unit line is taken out by the predetermined line.

As shown in FIG. 4, the mother substrate W is moved to the lower side of the scribing head 4, and extends in the lateral direction (X direction) along the lower side of the mother substrate W (the side of the front side of the mother substrate W in FIG. 2). On the first scribe line L1 (see FIG. 1), the cutter wheel of one scribe head 4 located at the right end is pressed and rotated to perform scribing. Thereby, the first scribe line S1 in the lateral direction of the end material region 13 of the lower portion of the mother substrate W is processed.

Thereafter, as shown in FIG. 5, the end portion region 13 is separated from the first scribe line S1 by the first rupture portion B (refer to FIG. 1 due to omitting FIG. 5), and the end material region 13 is cut. Discarded from the outside. At this time, it may be discarded by a robot arm or the like, or may be removed by blowing air by blowing.

Next, after switching the rotation direction of all the cutter heads of the scribe head 4 to the Y direction, as shown in FIGS. 6 and 7, all the four scribe heads 4 are used, and the edge from the mother substrate W is broken. The longitudinal direction (Y direction) is simultaneously scribed, and after the division, the horizontal second scribed line L2 along one side (upper side) in the longitudinal direction of the rectangular substrate Wa is formed. At this time, the cutter wheel 4 is stopped, and the mother substrate W is moved in the Y direction by the Y-direction conveyance roller of the stage 7, thereby performing the scribing. Thereby, the second scribe line S2 in the longitudinal direction of the substantially right side of the unit product is processed.

Then, as shown in FIG. 8 and FIG. 9, in the same way, in 4 moments The scribe head 4 is longitudinally scribed from the lower side of the mother substrate W to the second horizontal scribed line L2, whereby the third scribe line S3 in the longitudinal direction of the substantially left side of the unit product is processed. Further, the second scribe line S2 and the third scribe line S3 may be processed in the reverse step.

Next, as shown in FIG. 10, along the second horizontal scribed line L2 (see FIG. 9), the cutter wheel located at the right end of the scribe head 4 is scribed in the X direction to form a lateral direction. The fourth score line S4.

Then, as shown in FIG. 11, the Y-direction conveying roller of the table 7 and the Y-direction conveying roller of the conveying unit D move the mother substrate W in the Y direction, and the first breaking portion B (see FIG. 1) The back side of the fourth scribe line S4 is divided in the X direction by the mother substrate W, whereby the first rectangular substrate Wa is completely divided and cut.

The cut rectangular substrate Wa has a rectangular shape in which four unit products W1 divided by longitudinal (Y-direction) scribe lines S2 and S3 are arranged in a row in the longitudinal direction so that the longitudinal direction thereof faces the X direction. The posture is cut.

The rectangular substrate Wa that has been cut is transported to the transport direction in the direction orthogonal to the longitudinal direction of the substrate (-Y direction) by the Y-direction transport roller of the transport unit D in a state in which the longitudinal direction thereof is oriented in the X direction. Part D is fixed at a fixed position. The rectangular substrate Wa that has been transferred to the fixed position of the transport unit D is transported in the X direction while maintaining the longitudinal direction thereof in the X direction, and is sequentially transported to the second scribed portion C as a unit product. W1.

Moreover, after cutting the first rectangular substrate Wa, the steps are as follows In the same step, the next rectangular substrate Wa is divided from the mother substrate W. That is, after the first rectangular substrate Wa is cut, as shown in FIG. 11, the cutter wheel at the right end of the scribe head 4 is scored along the third horizontal scribe line L3 (see FIG. 1). The fifth scribe line S5 in the transverse direction is processed. Thereafter, as shown in FIG. 12, the end material region 14 is separated from the fifth scribe line S5 and discarded to the outside.

Further, the end material region 14 may not be provided by matching the third horizontal scribed line L3 with the second horizontal scribed line L2 of the one rectangular substrate Wa before processing. In this case, the fifth scribe line S5 has been formed.

Next, as shown in FIG. 13 and FIG. 14, all of the four scribe heads 4 are used to form a longitudinal scribe from the broken side of the mother substrate W to the fourth horizontal scribe line L4, thereby forming The sixth scribe line S6 in the longitudinal direction, the sixth scribe line S6 in the longitudinal direction forms the substantially right side of the unit product W1.

Then, as shown in FIG. 15 and FIG. 16, the four scribed heads 4 are longitudinally scribed from the broken side of the mother substrate W to the fourth horizontal scribed line L4, thereby forming a unit product. The seventh scribe line S7 on the left side of the essence.

In this case, the sixth scribe line S6 and the seventh scribe line S7 may be formed in the reverse steps.

Thereafter, as shown in FIG. 17, the cutter wheel at the right end of the scribe head 4 is scribed along the fourth transverse scribe line L4 (refer to FIG. 1) to form an eighth reticle S8 in the lateral direction. .

Next, as shown in FIG. 18, the mother substrate W is separated from the eighth scribe line by the first rupture portion B (see FIG. 1), thereby completely dividing and cutting the next rectangular substrate Wa.

In the rectangular substrate Wa obtained through the above steps, the second and third scribe lines S2 and S3 (or the sixth and seventh scribe lines S6 and S7) which divide the longitudinal direction of each unit product W1 are formed in the horizontal direction. 1 and the 4th scribe line S1, S4 (or the 5th, 8th scribe lines S5, S8), there is no intersection formed by the crossing of the transverse scribe lines. Thereby, the occurrence of "cutting angle" or "cracking" at the intersection point can be remarkably suppressed, and the phenomenon of "crossing point jump" can also be eliminated.

Further, since the direction of the rectangular substrate Wa cut from the mother substrate W is not changed, the state is maintained in the -Y direction while maintaining the posture, and then the transport portion D is transported in the X direction toward the second split portion C. The unit product W1 is separated, so only the linear motion is carried. The rotating mechanism (rotary disk) for rotating the rectangular substrate by 90 degrees as conventionally can be omitted, whereby the reduction in equipment cost can be achieved, and the simplification of the production line can be achieved. Further, it is not necessary to perform a fine adjustment operation with an angle of rotation of the rectangular substrate.

In the above embodiment, the mother substrate W is moved in the Y direction to process the longitudinal scribe line, but it is also possible to scribe the beam 3 or the struts 2 which are movable to support the scribe head 4. Further, the transverse scribe line is processed by one of the cutter wheels at the right end, but other cutter wheels can be used for processing.

In the above embodiment, the dicing head 4 is prepared in the same number as the unit product W1 in the rectangular substrate Wa. However, if the production speed is not problematic, the scribe head may be set to one, and the longitudinal scribes may be formed one by one. line.

Further, in the breaking method of the embodiment, the plurality of unit products divided by the scribe line are cut out from the mother substrate by the first rupture portion, and the rectangular substrate is arranged in a row along the length direction without changing. The rectangular base of the crop The direction of the plate is conveyed to the second rupture portion by the transport portion along the longitudinal direction of the substrate while maintaining the posture thereof, and the scribe lines are sequentially cut off to cut the unit product.

In this way, since the rectangular substrate cut from the mother substrate is separated into the cracked portion without being rotated in the longitudinal direction of the substrate while being maintained in the posture thereof, the rectangular substrate can be omitted as a unit product. It is known that the rectangular substrate is rotated by 90 degrees, whereby the cost of the apparatus can be reduced, and the production line can be simplified.

The representative embodiments of the present invention have been described above, but the present invention is not necessarily limited to the above embodiments. In the other aspects of the invention, modifications and changes may be made as appropriate without departing from the scope of the invention.

[Industrial availability]

The breaking method of the present invention is applied to a rectangular substrate formed of a mother substrate made of a brittle material such as a glass substrate, and is further divided into a breaking method of a unit product.

1‧‧‧ Breaking device

4‧‧‧Scratch

6‧‧‧Cutter wheel

7‧‧‧ platform

13, 14‧‧‧End material area

A‧‧‧Description Department

B‧‧‧1st split

C‧‧‧2nd Broken

D‧‧‧Transport Department

L1‧‧‧1st horizontal marking line

L2‧‧‧2nd horizontal scribe line

L3‧‧‧3rd horizontal marking line

L4‧‧‧4th horizontal marking line

S1‧‧‧1st line

S2‧‧‧2nd line

S3‧‧‧3rd scribe

S4‧‧‧4th scribe

W‧‧‧ mother substrate

Wa‧‧‧Rectangle substrate

W1‧‧‧ unit products

Fig. 1 is a plan view schematically showing an example of a breaking device used in carrying out the breaking method of the present invention.

Fig. 2 is a front view schematically showing a scribing portion in the breaking device of the present invention.

Fig. 3 is a schematic view showing a fracture portion in the breaking device of the present invention.

Figure 4 is a view showing the first step of the breaking device of the present invention in comparison with Figure 1 The same diagram.

Fig. 5 is an explanatory view showing a second step of the breaking device of the present invention.

Fig. 6 is an explanatory view showing a third step of the breaking device of the present invention.

Fig. 7 is an explanatory view showing a fourth step of the breaking device of the present invention.

Fig. 8 is an explanatory view showing a fifth step of the breaking device of the present invention.

Fig. 9 is an explanatory view showing a sixth step of the breaking device of the present invention.

Figure 10 is an explanatory view showing a seventh step of the breaking device of the present invention.

Figure 11 is an explanatory view showing an eighth step of the breaking device of the present invention.

Figure 12 is an explanatory view showing a ninth step of the breaking device of the present invention.

Figure 13 is an explanatory view showing a tenth step of the breaking device of the present invention.

Figure 14 is an explanatory view showing the eleventh step of the breaking device of the present invention.

Figure 15 is an explanatory view showing a twelfth step of the breaking device of the present invention.

Figure 16 is an explanatory view showing a thirteenth step of the breaking device of the present invention.

Figure 17 is an explanatory view showing the 14th step of the breaking device of the present invention.

Figure 18 is an explanatory view showing a fifteenth step of the breaking device of the present invention.

Fig. 19 is an explanatory view showing a cutting method of a conventional rectangular substrate.

Fig. 20 is a view for explaining a "cut angle" phenomenon which occurs when a conventional cross scribe is performed.

Fig. 21 is a view showing the phenomenon of "cracking" which occurs when the conventional cross scribing.

1‧‧‧ Breaking device

3‧‧‧ beams

4‧‧‧Scratch

7‧‧‧ platform

A‧‧‧Description Department

B‧‧‧1st split

C‧‧‧2nd Broken

D‧‧‧Transport Department

L1‧‧‧1st horizontal marking line

L2‧‧‧2nd horizontal scribe line

L3‧‧‧3rd horizontal marking line

L4‧‧‧4th horizontal marking line

W‧‧‧ mother substrate

W1‧‧‧ unit products

X, Y‧‧ direction

Claims (5)

A method for scribing a mother substrate is a method of scribing a mother substrate by a cutter wheel, characterized in that it is formed by scribing along a first transverse scribe line along a mother substrate, Forming a step of dividing a first scribe line in a lateral direction of a lower side of the rectangular substrate cut therefrom; secondly, performing longitudinal scribe to the first scribe line in an amount equal to the number of unit products in the rectangular substrate Parallelly set to a second horizontal scribed line at a position on the upper side of the rectangular substrate, thereby forming a second scribe line in the longitudinal direction, and the second scribe line in the vertical direction forms the substantial portion of the unit product On the right side, and longitudinally scribed in the same amount as the number of unit products in the rectangular substrate, thereby forming a third scribe line in the longitudinal direction, and the third scribe line in the vertical direction forms the essence of the unit product The step of the upper left side; then, the step of dividing the fourth scribe line in the lateral direction of the upper side of the rectangular substrate is formed by scribing along the second horizontal scribed line. The method for scribing a mother substrate according to claim 1, wherein the second indentation in the longitudinal direction and the third indentation in the longitudinal direction are the same as the number of unit products in the rectangular substrate. The cutter wheel simultaneously scribes the second scribe line and the third scribe line. The method of scribing a mother substrate according to claim 1 or 2, wherein the step of forming the first scribe line in the lateral direction and the step of forming the fourth scribe line are performed by fixing the mother substrate The above cutter wheel is moved laterally The processing is performed in the step of forming the second scribe line and the third scribe line in the vertical direction, and the processing is performed by fixing the cutter wheel and moving the mother substrate. A method for dividing a mother substrate, wherein the cutter wheel is scribed along a first transverse scribe line of the mother substrate to form a lateral direction of the end material region dividing the lower portion of the mother substrate 1 scribe line; secondly, the end material region is separated from the first scribe line by the first rupture portion to discard the end material region; secondly, the unit product in the rectangular substrate to be formed is used The number of the cutter wheels of the same number is longitudinally scribed from the lower side of the mother substrate to the second horizontal scribed line parallel thereto, thereby forming the second scribe line and the third scribe line in the longitudinal direction. a line, the second scribe line forming a substantially right side of the unit product, the third scribe line forming a left side; and secondly, forming a lateral direction by scribing the cutter wheel along the second transverse scribe line a fourth scribe line; then, by dividing the mother substrate from the fourth scribe line by the first rupture portion, cutting a plurality of unit products divided by a longitudinal scribe line along a length direction a rectangular substrate arranged in a row; the rectangular base after cutting by the conveying portion The plate is conveyed to the second split portion along the longitudinal direction of the substrate while maintaining the posture thereof, and is sequentially cut from the longitudinal scribe line, thereby cutting the unit product. The method for dividing a mother substrate according to claim 4, wherein the processing of the rectangular substrate is performed by the first fracture portion, Processing the rectangular substrate in a direction perpendicular to the longitudinal direction of the rectangular substrate; and cutting the rectangular substrate that has been cut from the rectangular substrate into the unit product by the second cracking portion The rectangular substrate is processed in such a manner that the longitudinal direction thereof is transported in the same direction.