JP2015060998A - Sensor module and three-dimentional wiring circuit board used in the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a sensor module which improves the flexibility of arrangement of photoelectric conversion elements, and to obtain a three-dimensional wiring circuit board used in the sensor module.SOLUTION: A sensor module 10 includes: a base part 20 having a three-dimensional shape surface 21 formed by an outer surface 22 and an inner surface 23 connected with the outer surface 22; and a three-dimensional shape wiring part 40 which is formed on the surface 21 of the base part 20 by MID technology. The sensor module 10 includes: a first photoelectric conversion element 50 mounted on the base part 20 and electrically connected with the wiring part 40; a second photoelectric conversion element 60 which is a type different from the first photoelectric conversion element 50, is mounted in a portion of the base part 20 that is different from a portion where the first photoelectric conversion element 50 is mounted, and is electrically connected with the wiring part 40. At least one of the first photoelectric conversion element 50 and the second photoelectric conversion element 60 is mounted on the inner surface 23.

Description

  The present invention relates to a sensor module and a three-dimensional wiring circuit board used for the sensor module.

  Conventionally, a structure in which a plurality of types of photoelectric conversion elements are integrally mounted on a single substrate has been proposed (see, for example, Patent Document 1).

  In Patent Document 1, a sensor module is formed by mounting a light emitting element, an illuminance sensor light receiving element, and a distance detecting light receiving element on one substrate.

JP 2011-060788 A

  By the way, generally, the photoelectric conversion element needs to have different sensor characteristics (thickness of the element and a thickness necessary for exhibiting a function as a sensor) according to the type and application. The thickness necessary for exhibiting the function as a sensor includes the focal length of a lens used for condensing light.

  Therefore, when different types of photoelectric conversion elements are mounted on the substrate surface as in the above prior art, all the photoelectric conversion elements are mounted on the same surface, and the arrangement positions of the photoelectric conversion elements are determined according to sensor characteristics. I couldn't make it different. That is, in the above prior art, the degree of freedom in arranging the photoelectric conversion elements cannot be improved.

  Then, an object of this invention is to obtain the sensor module which can improve the arrangement | positioning freedom degree of a photoelectric conversion element, and the three-dimensional wiring circuit board used for the said sensor module.

  According to a first aspect of the present invention, there is provided a sensor module having a base portion having a three-dimensional surface formed by an outer surface and an inner surface continuous to the outer surface, and a surface of the base portion by MID technology. The formed three-dimensional wiring part, the first photoelectric conversion element mounted on the base part and electrically connected to the wiring part, and the first photoelectric conversion element are different in type, A second photoelectric conversion element mounted on a portion different from the portion on which the first photoelectric conversion element is mounted in the base portion and electrically connected to the wiring portion, and the first photoelectric conversion The gist is that at least one of the element and the second photoelectric conversion element is mounted on the inner surface.

  A second feature of the present invention is a light emitting element in which the first photoelectric conversion element has a light emitting portion, and the second photoelectric conversion element is emitted from the light emitting element and reflected by an irradiated object. The gist of the invention is that it is a light receiving element having a light receiving portion for receiving light.

  The gist of a third feature of the present invention is that the base portion includes a recess defined by the inner surface, and the second photoelectric conversion element is disposed in the recess.

  A fourth feature of the present invention is summarized in that the base portion includes a through hole having the inner surface, and the second photoelectric conversion element is disposed so as to close the through hole.

  A fifth feature of the present invention is that the base portion includes a protrusion protruding inward from the inner surface of the through hole, and the second photoelectric conversion element is mounted on one surface of the protrusion. To do.

  According to a sixth aspect of the present invention, there is provided a lens that is placed on the base portion and focuses on the light receiving portion of the second photoelectric conversion element, and the lens is placed on the inner surface of the base portion. The gist.

  According to a seventh feature of the present invention, the inner surface has a lens mounting surface on which the lens is mounted, and the lens mounting surface has a concave surface on which the wiring portion is formed. Is the gist.

  The eighth feature of the present invention is summarized in that the lens is placed on the base portion in a positioned state.

  A ninth feature of the present invention is that the first photoelectric conversion element and the second photoelectric conversion element are different in type, and the first photoelectric conversion element and the second photoelectric conversion element in the base portion are The gist is to further include a third photoelectric conversion element that is mounted on a portion different from the mounted portion and electrically connected to the wiring portion.

  The tenth feature of the present invention is summarized in that the third photoelectric conversion element is a photometric sensor that receives light in the vicinity of the sensor.

  The eleventh feature of the present invention is summarized in that the third photoelectric conversion element is mounted between the first photoelectric conversion element and the second photoelectric conversion element in the base portion. .

  A twelfth feature of the present invention is summarized in that the base portion includes a second recess defined by the inner surface, and the third photoelectric conversion element is disposed in the second recess.

  A thirteenth feature of the present invention is summarized in that the base portion includes a second through hole having the inner surface, and the third photoelectric conversion element is disposed so as to close the second through hole. .

  In a fourteenth feature of the present invention, the base portion includes a second protrusion that protrudes inward from the inner surface of the second through hole, and the third photoelectric conversion element is mounted on one surface of the second protrusion. The gist is that

  According to a fifteenth feature of the present invention, there is provided a second lens that is placed on the base portion and focuses on the light receiving portion of the third photoelectric conversion element, and the second lens is placed on the inner surface of the base portion. The gist is that

  According to a sixteenth feature of the present invention, the inner surface has a second lens mounting surface on which the second lens is mounted, and the second lens mounting surface has a wiring portion formed thereon. The gist is that it has two concave surfaces.

  The gist of the seventeenth feature of the present invention is that the second lens is placed on the base portion in a positioned state.

  An eighteenth feature of the present invention is a three-dimensional wiring circuit board used for the sensor module, comprising the base portion and the wiring portion.

  ADVANTAGE OF THE INVENTION According to this invention, the three-dimensional wiring circuit board used for the sensor module which can improve the arrangement | positioning freedom degree of a photoelectric conversion element, and the said sensor module can be obtained.

1 is a perspective view schematically showing a sensor module according to a first embodiment of the present invention. It is sectional drawing which shows typically the sensor module concerning 1st Embodiment of this invention. It is a perspective view explaining the relationship between the light receiving element concerning 1st Embodiment of this invention, and a to-be-irradiated body. It is a perspective view which shows typically the sensor module concerning 2nd Embodiment of this invention. It is sectional drawing which shows typically the sensor module concerning 2nd Embodiment of this invention. It is a perspective view which shows typically the light receiving element of the photometry sensor concerning 3rd Embodiment of this invention. It is sectional drawing which shows typically the sensor module concerning 3rd Embodiment of this invention. It is a perspective view which shows typically the sensor module concerning 4th Embodiment of this invention. It is sectional drawing which shows typically the sensor module concerning 4th Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that similar components are included in the following embodiments. Therefore, in the following, common reference numerals are given to those similar components, and redundant description is omitted.

(First embodiment)
As shown in FIGS. 1 and 2, the sensor module 10 according to the present embodiment includes a base portion 20.

  The base portion 20 is formed using a material such as resin or ceramic, and has a three-dimensional surface 21 formed by an outer surface 22 and an inner surface 23 provided continuously to the outer surface 22. That is, the base portion 20 has a three-dimensional solid shape having a recess and a through hole.

  Specifically, the inner surface 23 is provided with an LED element arrangement inner surface 24 on which an LED element (first photoelectric conversion element) 50 described later is arranged, and a light receiving element (second photoelectric conversion element) 60 described later. And an inner surface 25 for arranging the light receiving elements.

  The inner surface 24 for LED element arrangement | positioning is formed in the bottom face 24a and the side surface 24b, and the recessed part 31 for LED element arrangement | positioning is defined by this bottom face 24a and the side surface 24b.

  On the other hand, the inner surface 25 for light receiving element arrangement includes a bottom surface 25a, a side surface 25b, a first step surface 25c connected to the bottom surface 25a through the side surface 25b, and a bottom surface 25a and a first step surface 25c through the side surface 25b. And a second step surface 25d that is provided continuously. The bottom surface 25a, the side surface 25b, the first step surface 25c, and the second step surface 25d define a light receiving element arrangement recess (recess) 32. A concave surface 25e is formed on the second step surface 25d.

  The LED element placement recess 31 is open at the top and has a substantially truncated cone shape whose diameter increases toward the top, and the light receiving element placement recess 32 is formed in a stepped shape with the top wide.

  Thus, in this embodiment, the base | substrate part 20 is carrying out the three-dimensional solid shape which has the recessed part 31 for LED element arrangement | positioning defined by the inner surface 23, and the recessed part 32 for light receiving element arrangement | positioning.

  A three-dimensional wiring portion 40 is formed on the surface 21 of the base portion 20, and the three-dimensional wiring circuit board 110 is formed by the wiring portion 40 and the base portion 20. The wiring portion 40 is directly formed on the surface 21 of the base portion 20 by MID (Molded Interconnect Devices) technology. Here, MID is a three-dimensional molded circuit component in which an electric circuit is integrally formed on the surface of a three-dimensional molded product such as an injection molded product. By using this MID technology, unlike a conventional two-dimensional circuit, Circuits can be added to inclined surfaces, vertical surfaces, curved surfaces, through holes in the molded body, and the like.

  As this MID, in particular, MIPTEC (registered trademark) disclosed in Japanese Patent Laid-Open No. 2008-159742 (paragraphs 0002 to 0003) and Japanese Patent Laid-Open No. 2011-134777 (paragraph 0003) is used. Can be used. According to MIPTEC (registered trademark), fine patterning and bare chip mounting are possible by using molding surface activation processing technology and laser patterning method for MID technology that forms an electric circuit on the surface of an injection molded product. A 3D-mounted device can be realized.

  The wiring part 40 includes an LED element wiring part 40a to which the LED element 50 is electrically connected and a light receiving element wiring part 40b to which the light receiving element 60 is electrically connected.

  The LED element wiring portion 40a has two LED element wiring portions 40a that are a positive pole and a negative pole, and one LED element wiring portion 40a covers the entire inner surface 24 of the LED element arrangement. It is formed to have a shape. And the part formed in the inner surface 24 for LED element arrangement | positioning of one LED element wiring part 40a is given the function of a reflector. Thus, by providing the LED element arrangement recess 31 in which the LED element 50 is arranged with a reflector function, light from the LED element 50 can be emitted in a wider range without using a lens or the like. ing. As described above, in the present embodiment, the side surface 24b of the inner surface 24 for arranging the LED elements has a shape corresponding to the side surface of the truncated cone, but the shape of the side surface 24b may be various shapes such as a paraboloid. Can do. It is preferable that the shape of the side surface 24b be a suitable shape according to a preset light emission range.

  On the other hand, a plurality of light receiving element wiring portions 40b are formed, each having a stepped shape (three-dimensional shape) along the stepped light receiving element disposing recess 32. At this time, all the portions formed on the second step surface 25d of the light receiving element wiring portion 40b are formed on the concave surface 25e. That is, the light receiving element wiring portion 40b is not formed in a portion of the second step surface 25d other than the concave surface 25e. The concave surface 25e is formed so as to be deeper than the thickness of the light receiving element wiring portion 40b, so that the light receiving element wiring portion 40b does not protrude above the second step surface 25d other than the concave surface 25e. It has become.

  The LED element wiring portion 40 a and the light receiving element wiring portion 40 b are formed so as to extend from the inner surface 23 to the outer surface 22 of the base body portion 20. Specifically, each wiring part 40 formed on the inner surface 23 extends from the upper surface of the base body 20 through the side surface to the lower surface (see FIGS. 1 and 2). Thus, by extending the wiring portion 40 from the inner surface 23 to the lower surface (outer surface 22) of the base portion 20, the base portion 20 is directly mounted on an electronic device such as a mobile phone (the photoelectric conversion element and the electronic device in the recess). It can be electrically connected to the board of the device).

  Furthermore, the sensor module 10 includes an LED element (first photoelectric conversion element) 50 that is mounted in the recess 31 of the base body 20 and is electrically connected to the wiring part 40 (LED element wiring part 40a). Yes.

  The LED element 50 is a light emitting element having a light emitting portion 51, and a known element can be used. For example, as the light emitting unit 51, an infrared LED (Light Emitting Diode) that emits infrared light upon receiving a current supplied from a sensor control unit (not shown) can be used.

  The LED element 50 is electrically connected to the LED element wiring portion 40 a by a bonding wire 90. Specifically, when the LED element 50 is mounted on one LED element wiring portion 40a and connected to the other LED element wiring portion 40a via a bonding wire 90, a positive electrode and a negative electrode are obtained. The two LED element wiring portions 40 a are electrically connected via the LED elements 50 and the bonding wires 90.

  Further, the sensor module 10 is mounted in the light receiving element disposition recess 32 of the base portion 20 (a portion different from the portion where the first photoelectric conversion element is mounted in the base portion 20), and the wiring portion 40 (for the light receiving element). A second photoelectric conversion element electrically connected to the wiring part 40b) is provided.

  In the present embodiment, a light receiving element 60 having light receiving portions 61A to 61D that receive light emitted from the light emitting element 50 and reflected by the irradiated object 100 is used as the second photoelectric conversion element. Thus, in the present embodiment, the second photoelectric conversion element 60 is different in type from the LED element (first photoelectric conversion element) 50.

  The light receiving units 61A to 61D receive infrared rays emitted from the light emitting unit 51 and reflected by the irradiated body 100 such as a user's hand, finger, and face, and current corresponding to the amount of light received by photoelectric conversion. Is generated. The generated current is output to an AD converter (not shown) or the like.

  As such a light receiving element 60, a known element can be used. For example, the light receiving element 60 can be formed using a semiconductor substrate. A photodiode formed by providing a pn junction region at a predetermined depth in the semiconductor substrate can be used as the light receiving portions 61A to 61D.

  The light receiving element 60 is electrically connected to each light receiving element wiring portion 40b by using a plurality of bonding wires 90 and connecting to each light receiving element wiring portion 40b. In the present embodiment, the bonding wire 90 is connected to a portion formed on the first step surface 25c of the light receiving element wiring portion 40b.

  Further, in the present embodiment, the lens 62 is disposed on the base unit 20, and the infrared rays reflected by the irradiated body 100 are condensed on the light receiving units 61 </ b> A to 61 </ b> D of the light receiving element 60.

  The lens 62 is disposed above the light receiving element 60 so as to face the light receiving element 60, and holds the lens 62 with a predetermined distance between the light receiving portions 61 </ b> A to 61 </ b> D of the light receiving element 60. By doing so, infrared light is imaged on the light receiving element 60.

  As this lens 62, for example, a lens base that controls the infrared condensing function is formed of Si having a high infrared transmittance, and a band formed of an optical multilayer film that selectively transmits infrared peripheral wavelengths on the surface of the lens base. What formed the pass filter can be used.

  Furthermore, in this embodiment, as shown in FIG. 2, the lens 62 is formed as a convex lens whose both surfaces are convex. The lens 62 may be formed as a convex lens in which one surface (upper surface) is a flat surface and the other surface (lower surface) is a convex surface, or one surface is a concave surface and the other surface is a convex surface having a larger curvature than the concave surface. May be. In other words, the lens 62 only needs to have a function of condensing on the light receiving element 60. Further, the convex surface or the concave surface may be a paraboloid.

  In this embodiment, the peripheral portion of the lens 62 is placed on the second step surface 25d so that the lens 62 is disposed on the inner surface 23 of the base body portion 20. That is, the second step surface 25d as the inner surface 23 is a lens mounting surface on which the lens 62 is mounted, and the wiring portion 40 (light receiving element wiring portion 40b) is formed on the second step surface 25d. A concave surface 25e is formed.

  In this way, when the lens 62 is placed on the second step surface 25d, the lens 62 can be prevented from being inclined and placed by the light receiving element wiring portion 40b. As a result, a predetermined distance between the light receiving element 60 and the lens 62 (a distance for forming an infrared image on the light receiving element 60) can be maintained with high accuracy.

  At this time, it is preferable that the lens 62 is placed on the base portion 20 in a positioned state.

  Such a sensor module 10 can be formed by the following method, for example.

  First, the base portion 20 having a desired three-dimensional shape is formed by injection molding or the like (first step).

  And the wiring part 40 used as the desired three-dimensional shape is formed in the surface 21 of the base | substrate part 20 using a MID technique (2nd process).

  Next, the LED element 50 and the light receiving element 60 are mounted on the inner surface 23 of the base portion 20 (third step). The order of mounting can be performed in any order. That is, any one of the photoelectric conversion elements may be mounted first or simultaneously.

  Thereafter, the LED element 50 or the light receiving element 60 and the wiring part 40 are electrically connected using the bonding wire 90 (fourth process).

  Thereafter, the lens 62 is placed on the second step surface (lens placement surface) 25d of the base portion 20 (fifth step).

  Thus, the sensor module 10 shown in FIGS. 1 and 2 is formed.

  The sensor module 10 having such a configuration can be mounted on an electronic device such as a mobile phone terminal.

  For example, when the sensor module 10 is incorporated into a touch panel type mobile phone terminal, the sensor module 10 is disposed in the vicinity of the liquid crystal display unit in the mobile phone terminal. As described above, when the sensor module 10 is incorporated into the mobile phone terminal, it is preferable that the light-transmitting window 81 formed in the cover 80 is disposed above the LED element 50 and the light receiving element 60.

  When such a cellular phone terminal is used, when the irradiated object 100 exists in the vicinity of the sensor module 10, the presence of the irradiated object 100 can be recognized. Specifically, when the irradiated object 100 exists in the vicinity of the sensor module 10, infrared light emitted from the light emitting unit 51 of the LED element 50 is transmitted through the window 81 on the LED element 50 side (left side in FIG. 2). Then, the light hits the irradiated object 100 and is reflected. The infrared light reflected by the irradiated object 100 passes through the window portion 81 on the light receiving element 60 side (right side in FIG. 2), and is collected by the lens 62, and the light receiving portions 61 </ b> A to 61 </ b> D of the light receiving element 60. Will be received. As described above, the infrared light emitted from the light emitting unit 51 is received by the light receiving units 61 </ b> A to 61 </ b> D, so that it can be recognized that the irradiated object 100 exists in the vicinity of the sensor module 10.

  The recognition function of the irradiated object 100 detects the face (irradiated object 100) when the face (irradiated object 100) is brought close to the vicinity of the liquid crystal display unit in order to make a call using a mobile phone terminal, for example. Used when As described above, when the sensor module 10 detects the face (the irradiated object 100) and recognizes that it is in a talking state, the touch panel operation using the liquid crystal display unit is turned off or the liquid crystal display unit is turned off. For example, it is possible to prevent malfunction during a call or to suppress battery power consumption.

  Further, in the present embodiment, four light receiving portions 61 </ b> A to 61 </ b> D are formed in the light receiving element 60. In the four light receiving portions 61A to 61D, the light receiving portions 61A and 61B are arranged in parallel in the short direction on one side in the longitudinal direction of the light receiving element 60, and the light receiving portions 61C and 61D in the short direction in the other side in the longitudinal direction. They are arranged side by side (see FIG. 3). By doing so, the moving direction (moving direction in the plane direction) of the irradiation object 100 located in the vicinity of the sensor module 10 can also be detected. For example, when the irradiated object 100 moves in the direction indicated by the arrow in FIG. 3, the infrared light reflected by the irradiated object 100 is first received by the light receiving parts 61C and 61D, and then received by the light receiving parts 61A and 61B. It will receive light. Therefore, by detecting the change in the amount of light received by the four light receiving portions 61A to 61D, the moving direction in the surface direction of the irradiated object 100 can be detected.

  The moving direction detection function of the irradiated object 100 can be used, for example, when the moving direction of the finger (irradiated object) is detected and the Web page displayed on the liquid crystal display unit is scrolled.

  Thus, the sensor module 10 according to the present embodiment has both a function as a proximity sensor and a function as a gesture sensor.

  As described above, in the present embodiment, the sensor module 10 includes the base portion 20 having the three-dimensional surface 21 formed by the outer surface 22 and the inner surface 23 connected to the outer surface 22, and the base by the MID technique. And a wiring portion 40 having a three-dimensional shape formed on the surface 21 of the portion 20. The sensor module 10 is different in type from the LED element (first photoelectric conversion element) 50 mounted on the base body 20 and electrically connected to the wiring part 40, and the LED element 50. And a light receiving element (second photoelectric conversion element) 60 that is mounted on a portion different from the portion on which the LED element 50 is mounted and is electrically connected to the wiring portion 40. In addition, at least one of the LED elements 50 and the light receiving elements 60 (both in the present embodiment) is mounted on the inner surface 23.

  That is, the photoelectric conversion element is mounted on the base portion 20 having a three-dimensional solid shape.

  By the way, in general, a photoelectric conversion element has a thickness necessary for exhibiting a function of the element and a sensor (focal length of a lens used for condensing, etc.) according to the type and application. It is necessary to make the sensor characteristics different.

  When different types of photoelectric conversion elements are mounted on the substrate surface as in the prior art, all the photoelectric conversion elements are mounted on the same surface, and the arrangement positions of the photoelectric conversion elements differ depending on the sensor characteristics. I couldn't make it.

  However, if the photoelectric conversion element (the LED element 50 or the light receiving element 60) is mounted on the base portion 20 having a three-dimensional solid shape as in the present embodiment, the shape of the base portion 20 is set to a desired shape. Therefore, the photoelectric conversion element can be disposed at a desired place. That is, the degree of freedom of arrangement of the photoelectric conversion element on the base portion 20 is improved.

  If the height of the mounting surface of the photoelectric conversion element (such as the bottom surface of the recess) is made different according to the sensor characteristics, the height of the upper end can be increased even when multiple types of photoelectric conversion elements are mounted. Can be aligned. For example, if the mounting surface of the photoelectric conversion element having a large focal length of the lens used for condensing is provided at a position lower than the mounting surface of the photoelectric conversion element having a small focal length, the lens of one photoelectric conversion element Can be prevented from protruding beyond the lens of the other photoelectric conversion element, and the upper ends of the photoelectric conversion elements can be aligned (see the second embodiment described later).

  Further, the thickness of the entire sensor module 10 can be suppressed by adjusting the height of the mounting surface of the photoelectric conversion element (setting the mounting surface of the photoelectric conversion element having a large required height at a low position). Become.

  In addition, the first photoelectric conversion element is an LED element (light emitting element) 50 having the light emitting unit 51, and the second photoelectric conversion element receives light emitted from the LED element 50 and reflected by the irradiated object 100. If the light receiving element 60 having the light receiving portion is used, the sensor module 10 can be provided with a function as a proximity sensor and a function as a gesture sensor.

  In the present embodiment, a lens 62 that is placed on the base body 20 and focuses on the light receiving portions 61 </ b> A to 61 </ b> D of the light receiving element 60 is provided. The lens 62 is placed on the inner surface 23 of the base portion 20. Specifically, the peripheral portion of the lens 62 is placed on the second step surface 25 d so as to be disposed on the inner surface 23 of the base body portion 20. Therefore, when the second photoelectric conversion element uses the lens 62, the lens 62 is prevented from protruding too much upward.

  Further, the second step surface 25d as the inner surface 23 is a lens mounting surface on which the lens 62 is mounted, and the wiring portion 40 (light receiving element wiring portion 40b) is formed on the second step surface 25d. A concave surface 25e is formed.

  In this way, when the lens 62 is placed on the second step surface 25d, the lens 62 can be prevented from being inclined and placed by the light receiving element wiring portion 40b. As a result, a predetermined distance between the light receiving element 60 and the lens 62 (a distance for forming an infrared image on the light receiving element 60) can be maintained with high accuracy.

  At this time, it is preferable that the lens 62 is placed on the base portion 20 in a positioned state. By doing so, it is not necessary to perform both positioning of the photoelectric conversion element on the substrate and positioning of the photoelectric conversion element and the lens as in the case of mounting the photoelectric conversion element on the substrate. That is, the positioning of the photoelectric conversion element (light receiving element 60) and the lens 62 is performed only by positioning the photoelectric conversion element (light receiving element 60) to the base portion 20. Therefore, it can suppress that the arrangement position of a photoelectric conversion element (light receiving element 60) and lens 62 shifts, and it can control that sensor accuracy falls. Furthermore, since the positional deviation is suppressed, there is an advantage that the assembling property of the sensor module 10 can be further improved.

(Second Embodiment)
The sensor module 10A according to the present embodiment has basically the same configuration as the sensor module 10 shown in the first embodiment. That is, as shown in FIGS. 4 and 5, the sensor module 10A includes a base portion 20 having a three-dimensional shape having recesses and through holes.

  The base portion 20 has a three-dimensional surface 21 formed by an outer surface 22 and an inner surface 23 provided continuously to the outer surface 22.

  Specifically, the inner surface 23 includes an LED element arrangement inner surface 24 in which an LED element (first photoelectric conversion element) 50 is arranged, and a light receiving element arrangement in which a light receiving element (second photoelectric conversion element) 60 is arranged. And an inner surface 25 for use.

  A three-dimensional wiring portion 40 formed using the MID technique is formed on the surface 21 of the base portion 20, and the three-dimensional wiring circuit board 110 is formed by the wiring portion 40 and the base portion 20. ing.

  The wiring part 40 includes an LED element wiring part 40a to which the LED element 50 is electrically connected and a light receiving element wiring part 40b to which the light receiving element 60 is electrically connected.

  Furthermore, the sensor module 10A includes an LED element (first photoelectric conversion element) 50 that is mounted in the recess 31 of the base body 20 and is electrically connected to the wiring part 40 (LED element wiring part 40a). Yes.

  The sensor module 10A is mounted in the light receiving element disposition recess 32 of the base portion 20 (a portion different from the portion where the first photoelectric conversion element is mounted in the base portion 20) and is connected to the wiring portion 40 (for the light receiving element). A second photoelectric conversion element electrically connected to the wiring part 40b) is provided.

  Also in the present embodiment, as the second photoelectric conversion element, the light receiving element 60 having the light receiving portions 61A to 61D that receive the light emitted from the light emitting element 50 and reflected by the irradiated body 100 (the type of the LED element 50 is a kind). Using different photoelectric conversion elements).

  Then, the lens 62 is disposed on the base portion 20, and the infrared rays reflected by the irradiated body 100 are condensed on the light receiving portions 61 </ b> A to 61 </ b> D of the light receiving element 60.

  Here, the sensor module 10 </ b> A according to the present embodiment is different in type from the LED element 50 and the light receiving element 60, and is mounted in a part different from the part in which the LED element 50 and the light receiving element 60 are mounted in the base portion 20. A third photoelectric conversion element electrically connected to the wiring unit 40 is further provided.

  In the present embodiment, a photometric sensor 70 that receives light in the vicinity of the sensor and detects the state of the surrounding light (brightness, color, etc.) is used as the third photoelectric conversion element. Examples of such a photometric sensor include a color sensor and an illuminance sensor.

  FIGS. 4 to 6 and FIGS. 7 to 9 in the third and fourth embodiments described later exemplify a color sensor (photometric sensor 70) having light receiving portions 71A to 71D that receive light in the vicinity.

  A known sensor can be used as such a color sensor (photometric sensor 70).

  In the present embodiment, a filter 73A that selectively transmits red light (wavelength 560 μm to 750 μm) is provided in the light receiving unit 71A, and a filter 73B that selectively transmits green light (wavelength 450 μm to 630 μm) in the light receiving unit 71B. And a filter 73A that selectively transmits blue light (wavelength 370 μm to 570 μm) is illustrated in the light receiving portion 71C. Further, the light receiving unit 71D is provided with a filter 73D that selectively transmits infrared light (wavelength 700 μm to 1000 μm).

  By using such a color sensor (photometric sensor 70), light transmitted through a second lens 72 described later is received by the light receiving portions 71A to 71D, and the amount of light received by each of the light receiving portions 71A to 71D. Based on the above, it is possible to detect the color and brightness (light state) of ambient light.

  The light receiving portion 71D receives infrared light, and can be detected by receiving light (infrared light) emitted from the LED element 50 and reflected by the irradiated body 100 by the light receiving portion 71D. It is like that. Then, according to the amount of light detected by the light receiving unit 71D, by correcting the amount of received red light, green light, and blue light received by the light receiving units 71A to 71C, as ambient light information (light state), More accurate information can be detected. That is, the influence of the irradiation object 100 is excluded (suppressing the detection of the ambient light state as an incorrect state), and more accurate ambient light information (light state) can be detected. .

  In addition, a well-known thing can be used also when using the illumination intensity sensor which detects the brightness of the sensor vicinity as a photometry sensor.

  For example, when the sensor module 10 </ b> A is incorporated into a mobile phone terminal, the sensor module 10 </ b> A is used for adjusting the luminance of the liquid crystal display unit according to the ambient light state (color or brightness) detected by the photometric sensor 70. be able to.

  Further, in the present embodiment, the photometric sensor 70 is mounted between the LED element 50 and the light receiving element 60 in the base portion 20.

  Specifically, a photometric sensor arrangement inner surface 26 (inner surface 23) in which a photometric sensor (third photoelectric conversion element) 70 is arranged is formed between the LED element arrangement inner surface 24 and the light receiving element arrangement inner surface 25. doing.

  The inner surface 26 for arranging the photometric sensor is connected to the bottom surface 26a, the side surface 26b, the first step surface 26c connected to the bottom surface 26a via the side surface 26b, and the bottom surface 26a and the first step surface 26c via the side surface 26b. And a second step surface 26d to be provided. The bottom surface 26a, the side surface 26b, the first step surface 26c, and the second step surface 26d define a photometric sensor placement recess (second recess) 33. A concave surface (second concave surface) 26e is formed on the second step surface 26d. The photometric sensor placement recess 33 is formed in a stepped shape with a wide upper portion.

  As described above, in the present embodiment, the base portion 20 has a three-dimensional solid shape having the LED element arrangement recess 31, the light receiving element arrangement recess 32, and the photometric sensor arrangement recess 33 defined by the inner surface 23. Yes.

  The wiring unit 40 includes a photometric sensor wiring unit 40c to which the photometric sensor 70 is electrically connected.

  A plurality of photometric sensor wiring portions 40c are formed, each having a stepped shape (three-dimensional shape) along the stepped photometric sensor placement concave portion 33. At this time, all portions formed on the second step surface 26d of the photometric sensor wiring portion 40c are formed on the concave surface 26e. That is, the photometric sensor wiring portion 40c is not formed in a portion of the second step surface 26d other than the concave surface 26e. The concave surface 26e is formed to have a depth equal to or greater than the thickness of the photometric sensor wiring portion 40c, so that the photometric sensor wiring portion 40c does not protrude above the second step surface 26d other than the concave surface 26e. It has become.

  The photometric sensor wiring portion 40 c is also formed so as to extend from the inner surface 23 to the outer surface 22 of the base portion 20.

  The photometric sensor 70 is electrically connected to each photometric sensor wiring section 40c by using a plurality of bonding wires 90 and connecting to each photometric sensor wiring section 40c. In the present embodiment, the bonding wire 90 is connected to a portion formed on the first step surface 26c of the photometric sensor wiring portion 40c.

  Furthermore, in the present embodiment, the second lens 72 is disposed on the base portion 20, and the light in the vicinity of the sensor is condensed on the light receiving portion 71 of the photometric sensor 70.

  The second lens 72 is disposed above the photometric sensor 70 so as to face the photometric sensor 70, and holds the second lens 72 at a predetermined distance from the light receiving portion 71 of the photometric sensor 70. .

  When the illuminance sensor is used as a photometric sensor, as the second lens 72, for example, a lens matrix that controls a condensing function is formed by Si or the like having good transmittance, and an infrared peripheral wavelength is selectively formed on the surface of the lens matrix. What formed the band pass filter which consists of an optical multilayer film to absorb is used preferably. By using such a lens, it is possible to suppress the light metering sensor 70 from receiving light (infrared light) emitted from the LED element 50 and reflected by the irradiated object 100, and the ambient brightness. Can be detected as erroneous brightness.

  Furthermore, in the present embodiment, as shown in FIG. 5, the second lens 72 is formed as a convex lens whose both surfaces are convex. The second lens 72 may also be formed as a convex lens having a flat surface on one side (upper surface) and a convex surface on the other surface (lower surface), or a convex surface having a concave surface on one side and a larger curvature than the concave surface on the other surface. May be formed. That is, the second lens 72 only needs to have a function of condensing the photometric sensor 70. Further, the convex surface or the concave surface may be a paraboloid.

  In the present embodiment, the peripheral portion of the second lens 72 is placed on the second step surface 26 d so as to be disposed on the inner surface 23 of the base body portion 20. That is, the second step surface 26d as the inner surface 23 is a second lens placement surface on which the second lens 72 is placed, and the wiring portion 40 (photometric sensor wiring portion 40c) is provided on the second step surface 26d. A concave surface 26e is formed.

  In this way, when the second lens 72 is placed on the second step surface 26d, it is possible to prevent the second lens 72 from being inclined and placed by the photometric sensor wiring portion 40c. As a result, a predetermined distance between the photometric sensor 70 and the second lens 72 (a distance for forming an image of light on the photometric sensor 70) can be maintained with high accuracy.

  At this time, it is preferable that the second lens 72 is also placed on the base portion 20 in a positioned state.

  In the present embodiment, the photometric sensor 70 is thicker than the light receiving element 60. That is, the sensor characteristics of the photometric sensor 70 (the element thickness and the focal length of the lens used for condensing) are different from the sensor characteristics of the light receiving element 60.

  Then, the photometric sensor 70 and the light receiving element 60 are mounted on the base body 20 so that the height positions of the lens 62 and the second lens 72 (the height positions of the respective vertices) are substantially the same, and the lens 62 is also mounted. The second lens 72 is mounted on the base body 20.

  Therefore, the photometric sensor placement recess 33 and the light receiving element placement recess 32 are formed so that the bottom surface 26a is positioned lower than the bottom surface 25a.

  Thus, by aligning the height positions of the apexes of the lens 62 and the second lens 72, it is possible to suppress the formation of a gap between any lens and the window portion 81, and diffuse reflection of light. Etc. can be suppressed. As a result, the sensor accuracy can be further improved.

  Also according to this embodiment described above, the same operations and effects as those of the first embodiment can be achieved.

  In addition, since the shape and location of the second lens 72 are substantially the same as those of the lens 62, the photometric sensor 70 can obtain substantially the same effects as the light receiving element 60.

  In the present embodiment, since the photometric sensor 70 is also mounted on the base portion 20 of the sensor module 10A, the multifunctional sensor module 10A can be downsized. Therefore, it is possible to reduce the mounting space required for mounting on an electronic device such as a mobile phone terminal.

  In the present embodiment, since the photometric sensor 70 is mounted between the LED element 50 and the light receiving element 60 in the base portion 20, the distance between the LED element 50 and the light receiving element 60 is increased. As a result, the detectable region of the irradiated object 100 by the light receiving element 60 can be made wider.

(Third embodiment)
The sensor module 10B according to the present embodiment has basically the same configuration as the sensor module 10A shown in the second embodiment. That is, the sensor module 10B also has the LED element 50, the light receiving element 60, and the photometric sensor 70 mounted on one base part (three-dimensional solid part) 20, as shown in FIG.

  Here, in the present embodiment, the light shielding wall 34 is provided between the adjacent photoelectric conversion elements in the upper portion of the base portion 20.

  In the present embodiment, the light shielding wall 34, which is a member different from the base body portion 20, is formed on the base body portion 20. However, the light shielding wall 34 may be formed integrally with the base body portion 20.

  Also according to this embodiment described above, the same operations and effects as those of the second embodiment can be achieved.

  Moreover, in this embodiment, since the light shielding wall 34 is provided between the adjacent photoelectric conversion elements, it is possible to suppress the occurrence of light interference between the photoelectric conversion elements, thereby further improving the sensor accuracy. Improvements can be made.

(Fourth embodiment)
The sensor module 10C according to the present embodiment has basically the same configuration as the sensor module 10A shown in the second embodiment. That is, as shown in FIGS. 8 and 9, the sensor module 10 </ b> C also has the LED element 50, the light receiving element 60, and the photometric sensor 70 mounted on one base part (three-dimensional solid part) 20. Also in the present embodiment, the photometric sensor 70 is mounted between the LED element 50 and the light receiving element 60 in the base portion 20.

  The base portion 20 has a three-dimensional surface 21 formed by an outer surface 22 and an inner surface 23 provided continuously to the outer surface 22.

  Specifically, the inner surface 23 is mounted such that the LED element arrangement inner surface 24 on which the LED element (first photoelectric conversion element) 50 is arranged and the light receiving element (second photoelectric conversion element) 60 cover one end. A photometric sensor through hole (second hole) in which the inner peripheral surface 25f formed in the through hole (through hole) 35 for the light receiving element and the photometric sensor (third photoelectric conversion element) 70 are mounted so as to cover one end. An inner peripheral surface 26 f formed in the through-hole) 37.

  A three-dimensional wiring portion 40 formed using the MID technique is formed on the surface 21 of the base portion 20, and the three-dimensional wiring circuit board 110 is formed by the wiring portion 40 and the base portion 20. ing.

  Here, in the sensor module 10 </ b> C according to the present embodiment, the light receiving element through hole 35 having the inner peripheral surface 25 f as the inner surface 23 is formed in the base portion 20, and the light receiving element (second photoelectric conversion element) 60 receives light. It arrange | positions so that the through-hole 35 for elements may be plugged up.

  Further, a photometric sensor through-hole 37 having an inner peripheral surface 26 f as the inner surface 23 is formed in the base portion 20, and the photometric sensor (third photoelectric conversion element) 70 is arranged to block the photometric sensor through-hole 37. It was to so.

  Specifically, a protrusion 36 that protrudes inward from the inner peripheral surface 25f (inner surface 23) of the light receiving element through hole 35 is provided in the base portion 20 so that a hole is formed in the center so that light can be transmitted. I have to. Then, the light receiving element (second photoelectric conversion element) 60 is mounted on the lower surface (one surface) 25 g of the protrusion 36. Specifically, the light receiving element (second photoelectric conversion element) 60 is flip-chip mounted on the lower surface (one surface) 25 g of the protrusion 36 using the bonding bump 91.

  On the other hand, the base 20 is provided with a protrusion (second protrusion) 38 protruding inward from the inner peripheral surface 26f (inner surface 23) of the photometric sensor through-hole 37 so that a hole is formed in the center. It can be transmitted. A photometric sensor (third photoelectric conversion element) 70 is mounted on the lower surface (one surface) 26 g of the protrusion 38. Specifically, the photometric sensor (third photoelectric conversion element) 70 is flip-chip mounted on the lower surface (one surface) 26 g of the protrusion 38 using the bonding bumps 91.

  Although not shown, the light receiving element (second photoelectric conversion element) 60 and the photometric sensor (third photoelectric conversion element) 70 are connected to the light receiving element wiring portion 40b and the photometric sensor wiring via the bonding bump 91. Each part 40c is electrically connected.

  Also in the present embodiment, the lens 62 and the second lens 72 are arranged on the base body 20 so that the infrared rays reflected by the irradiated body 100 are condensed on the light receiving parts 61A to 61D of the light receiving element 60. The light in the vicinity of the sensor is condensed on the light receiving portion 71 of the photometric sensor 70.

  Also in this embodiment, the base portion 20 is formed by placing the peripheral portion of the lens 62 on the second step surface 25d and placing the peripheral portion of the second lens 72 on the second step surface 26d. It is arranged on the inner surface 23 of the. At this time, it is preferable that the lens 62 and the second lens 72 are placed on the base portion 20 in a positioned state.

  Also in this embodiment, the photometric sensor 70 is thicker than the light receiving element 60.

  Then, the photometric sensor 70 and the light receiving element 60 are mounted on the base portion 20 so that the apex height positions of the lens 62 and the second lens 72 are substantially the same height, and the lens 62 and the second lens 72 are mounted on the base body. It is placed on the part 20.

  Therefore, the light receiving element through hole 35 and the photometric sensor through hole 37 are formed so that the lower surface (one surface) 25g is positioned lower than the lower surface (one surface) 26g.

  Thus, by aligning the height positions of the apexes of the lens 62 and the second lens 72, it is possible to suppress the formation of a gap between any lens and the window portion 81, and diffuse reflection of light. Etc. can be suppressed. As a result, the sensor accuracy can be further improved.

  Furthermore, in the present embodiment, the lower surface of the light receiving element 60 and the lower surface of the photometric sensor 70 are flush with the lower surface of the base portion 20.

  The light receiving element 60 and the lens 62 are disposed on the base 20 so that the protrusion 36 is interposed therebetween, and the photometric sensor 70 and the second lens 72 are disposed so that the protrusion 38 is interposed therebetween. 20 is arranged.

  Also according to this embodiment described above, the same operations and effects as those of the second embodiment can be achieved.

  In the present embodiment, the light receiving element 60 and the lens 62 are flip-chip mounted on the base 20 so that the protrusion 36 is interposed therebetween, and the photometric sensor 70 and the second lens 72 are interposed between the protrusion 38. The substrate 20 is flip-chip mounted so as to be interposed therebetween. Therefore, it is not necessary to provide a bottom surface (bottom wall) for mounting the light receiving element 60 and the photometric sensor 70, and the thickness of the entire sensor module 10C can be reduced accordingly.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above embodiments, and various modifications can be made.

  For example, a configuration obtained by appropriately combining the configurations shown in the above embodiments can be used.

  Moreover, in each said embodiment, although what all the multiple types of photoelectric conversion elements were mounted in the recessed part and through-hole which were formed in the base | substrate part was illustrated, at least 1 is mounted in the recessed part and through-hole. Just do it.

  In the first embodiment, the first photoelectric conversion element can be a photometric sensor.

  Further, the number and arrangement location of the light receiving portions of the light receiving element, the number and arrangement location of the light receiving portions of the photometric sensor, and the like can be arbitrarily set.

  Further, the specifications (shape, size, layout, etc.) of the base part, the wiring part and other details can be changed as appropriate.

10, 10A, 10B, 10C sensor module 20 base portion 21 surface 22 outer surface 23 inner surface 25d second step surface (lens mounting surface)
25e Concave surface 25f Inner peripheral surface (inner surface)
25g bottom surface (one side of protrusion)
26d Second step surface (second lens placement surface)
26e Concave surface (second concave surface)
26f Inner peripheral surface 26g Lower surface (one surface of the second protrusion)
32 Receiving element placement recess (recess)
33 Photometric sensor placement recess (second recess)
35 Light receiving element through hole (through hole)
36 Protrusion 37 Photometric sensor through hole (second through hole)
38 Projection (Second Projection)
40 Wiring part 50 LED element (light emitting element: 1st photoelectric conversion element)
51 Light Emitting Unit 60 Light Receiving Element (Second Photoelectric Conversion Element)
61A-61D Light-receiving part 70 Color sensor (3rd photoelectric conversion element: Photometry sensor)
71A-71D Light-receiving part 100 Subject to be irradiated 110 Three-dimensional wiring circuit board

Claims (18)

A base portion having a three-dimensional surface formed by an outer surface and an inner surface connected to the outer surface;
A three-dimensional wiring portion formed on the surface of the base portion by MID technology;
A first photoelectric conversion element mounted on the base portion and electrically connected to the wiring portion;
The second type is different from the first photoelectric conversion element, and is mounted in a portion different from the portion where the first photoelectric conversion element is mounted in the base portion and is electrically connected to the wiring portion. A photoelectric conversion element;
With
A sensor module, wherein at least one of the first photoelectric conversion element and the second photoelectric conversion element is mounted on the inner surface.   The first photoelectric conversion element is a light emitting element having a light emitting part, and the second photoelectric conversion element has a light receiving part for receiving light emitted from the light emitting element and reflected by an irradiated body. The sensor module according to claim 1, wherein: The base portion includes a recess defined by the inner surface,
The sensor module according to claim 1, wherein the second photoelectric conversion element is disposed in the recess. The base portion includes a through hole having the inner surface,
The sensor module according to claim 1, wherein the second photoelectric conversion element is disposed so as to close the through hole. The base portion includes a protrusion protruding inward from the inner surface of the through hole,
The sensor module according to claim 4, wherein the second photoelectric conversion element is mounted on one surface of the protrusion. A lens that is mounted on the base portion and focuses on a light receiving portion of the second photoelectric conversion element;
The sensor module according to claim 1, wherein the lens is placed on an inner surface of the base portion. The inner surface has a lens mounting surface for mounting the lens,
The sensor module according to claim 6, wherein the lens mounting surface has a concave surface on which the wiring portion is formed.   The sensor module according to claim 6, wherein the lens is placed on the base portion in a positioned state.   The first photoelectric conversion element and the second photoelectric conversion element are of a different type, and are different from the part where the first photoelectric conversion element and the second photoelectric conversion element are mounted in the base portion. The sensor module according to claim 1, further comprising a third photoelectric conversion element that is mounted and electrically connected to the wiring portion.   The sensor module according to claim 9, wherein the third photoelectric conversion element is a photometric sensor that receives light in the vicinity of the sensor.   The said 3rd photoelectric conversion element is mounted between the said 1st photoelectric conversion element in the said base | substrate part, and the said 2nd photoelectric conversion element, The Claim 9 or Claim 10 characterized by the above-mentioned. Sensor module. The base portion includes a second recess defined by the inner surface,
The sensor module according to claim 9, wherein the third photoelectric conversion element is disposed in the second recess. The base portion includes a second through hole having the inner surface,
The sensor module according to claim 9, wherein the third photoelectric conversion element is disposed so as to close the second through hole. The base portion includes a second protrusion protruding inward from the inner surface of the second through hole,
The sensor module according to claim 13, wherein the third photoelectric conversion element is mounted on one surface of the second protrusion. A second lens placed on the base portion and focused on the light receiving portion of the third photoelectric conversion element;
The sensor module according to claim 9, wherein the second lens is placed on an inner surface of the base portion. The inner surface has a second lens placement surface on which the second lens is placed;
The sensor module according to claim 15, wherein the second lens mounting surface has a second concave surface on which the wiring portion is formed.   The sensor module according to claim 15 or 16, wherein the second lens is placed on the base portion in a positioned state.   A three-dimensional wiring circuit board comprising the base portion and the wiring portion and used in the sensor module according to claim 1.

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