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JP2018029895A - Package for measurement sensor and measurement sensor - Google Patents

Package for measurement sensor and measurement sensor Download PDF

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JP2018029895A
JP2018029895A JP2016165888A JP2016165888A JP2018029895A JP 2018029895 A JP2018029895 A JP 2018029895A JP 2016165888 A JP2016165888 A JP 2016165888A JP 2016165888 A JP2016165888 A JP 2016165888A JP 2018029895 A JP2018029895 A JP 2018029895A
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light receiving
receiving element
recess
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JP6753731B2 (en
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泰 大出
Yasushi Oide
泰 大出
林　拓也
Takuya Hayashi
拓也 林
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Kyocera Corp
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Abstract

【課題】生体内の深い位置にある血管の血流を高精度で測定することができる計測センサ用パッケージおよび計測センサを提供する。【解決手段】計測センサ用パッケージ１は、基体２と、基体の１つの面２１を覆う蓋体とを備え、基体の１つの面には、発光素子を収容する発光素子収容凹部２０ａ、第１受光素子を収容する第１受光素子収容凹部２０ｂおよび第２受光素子を収容する第２受光素子収容凹部２０ｃが設けられ、発光素子収容凹部からの距離が、第２受光素子収容凹部の方が、第１受光素子収容凹部よりも遠く、基体の１つの面からの深さが、第２受光素子収容凹部の方が、第１受光素子収容凹部よりも浅い。【選択図】図１PROBLEM TO BE SOLVED: To provide a package for a measurement sensor and a measurement sensor capable of measuring the blood flow of a blood vessel at a deep position in a living body with high accuracy. SOLUTION: A package 1 for a measurement sensor includes a base 2 and a lid covering one surface 21 of the base, and one surface of the base has a light emitting element accommodating recess 20a for accommodating a light emitting element. The first light receiving element accommodating recess 20b for accommodating the light receiving element and the second light receiving element accommodating recess 20c accommodating the second light receiving element are provided, and the distance from the light emitting element accommodating recess is larger in the second light receiving element accommodating recess. It is farther than the first light receiving element accommodating recess, and the depth from one surface of the substrate is shallower in the second light receiving element accommodating recess than in the first light receiving element accommodating recess. [Selection diagram] Fig. 1

Description

本発明は、計測センサ用パッケージおよび計測センサに関する。   The present invention relates to a measurement sensor package and a measurement sensor.

血流等の生体情報を簡単に、かつ高速に測定できる計測センサが求められている。例えば血流は、光のドップラー効果を利用して計測することができる。血液に光を照射すると、赤血球等の血球細胞で光が散乱される。照射光の周波数と散乱光の周波数とから血球細胞の移動速度が算出される。   There is a need for a measurement sensor that can easily and rapidly measure biological information such as blood flow. For example, blood flow can be measured using the Doppler effect of light. When light is irradiated to blood, light is scattered by blood cells such as red blood cells. The moving speed of the blood cell is calculated from the frequency of the irradiation light and the frequency of the scattered light.

血流を計測する計測センサは、例えば、特許文献１に生体情報計測装置として記載されており、少なくとも１個の発光素子と、２個以上の受光素子とを備え、体動ノイズが少なくなるように計測値を処理する手段を有している。   A measurement sensor that measures blood flow is described as a biological information measurement device in Patent Document 1, for example, and includes at least one light emitting element and two or more light receiving elements so that body movement noise is reduced. Means for processing the measured values.

特開２００６−１０２１５９号公報JP 2006-102159 A

生体内の血流には、静脈の血流および動脈の血流など複数種類あり、取得すべき情報に応じた測定が可能な計測センサが求められる。例えば、動脈の血流を測定することにより、脳梗塞、心筋梗塞などの疾患の予防または治療を効果的に行うことができる。動脈は、皮膚表面からは比較的深い位置にあるので、計測センサと動脈との間に存在する生体組織、例えば静脈の影響により、動脈の血流を高精度で測定することが難しいという問題があった。   There are a plurality of types of blood flow in the living body, such as venous blood flow and arterial blood flow, and a measurement sensor capable of measuring according to information to be acquired is required. For example, measurement of arterial blood flow can effectively prevent or treat diseases such as cerebral infarction and myocardial infarction. Since the arteries are relatively deep from the skin surface, there is a problem that it is difficult to measure the blood flow of the arteries with high accuracy due to the influence of biological tissues such as veins existing between the measurement sensor and the artery. there were.

本発明の一つの態様の計測センサ用パッケージは、
複数の誘電体層が積層されて成る、板状の基体と、
前記基体の１つの面を覆う、光透過性を有する板状の蓋体と、を含み、
前記基体の前記１つの面には、発光素子を収容する発光素子収容凹部、第１受光素子を収容する第１受光素子収容凹部および第２受光素子を収容する第２受光素子収容凹部が設けられ、
前記発光素子収容凹部からの距離が、前記第２受光素子収容凹部の方が、前記第１受光素子収容凹部よりも遠く、
前記基体の前記１つの面からの深さが、前記第２受光素子収容凹部の方が、前記第１受光素子収容凹部よりも浅いことを特徴とする。 The package for a measurement sensor according to one aspect of the present invention is:
A plate-like substrate formed by laminating a plurality of dielectric layers;
A plate-shaped lid body that covers one surface of the substrate and has light transmissivity,
The one surface of the base is provided with a light emitting element accommodating recess for accommodating a light emitting element, a first light receiving element accommodating recess for accommodating a first light receiving element, and a second light receiving element accommodating recess for accommodating a second light receiving element. ,
The distance from the light emitting element housing recess is such that the second light receiving element housing recess is farther than the first light receiving element housing recess,
The depth of the base from the one surface is characterized in that the second light receiving element receiving recess is shallower than the first light receiving element receiving recess.

また、本発明の一つの態様の計測センサは、上記の計測センサ用パッケージと、
前記発光素子収容凹部に収容される発光素子と、
前記第１受光素子収容凹部に収容される第１受光素子と、
前記第２受光素子収容凹部に収容される第２受光素子と、を含むことを特徴とする。 Further, a measurement sensor according to one aspect of the present invention includes the measurement sensor package described above,
A light emitting element accommodated in the light emitting element accommodating recess;
A first light receiving element housed in the first light receiving element housing recess;
And a second light receiving element housed in the second light receiving element housing recess.

本発明の一つの態様の計測センサ用パッケージによれば、動脈の血流による散乱光を効率的に受光することができ、これにより、動脈の血流を高精度で測定することができる。   According to the measurement sensor package of one aspect of the present invention, it is possible to efficiently receive the scattered light due to the blood flow of the artery, thereby measuring the blood flow of the artery with high accuracy.

また、本発明の一つの態様の計測センサによれば、上記の計測センサ用パッケージを備えることにより、動脈の血流を高精度で測定することができる計測センサを提供することができる。   In addition, according to the measurement sensor of one aspect of the present invention, it is possible to provide a measurement sensor that can measure the blood flow of the artery with high accuracy by including the above-described measurement sensor package.

本発明の第１実施形態に係る計測センサ用パッケージ１を示す平面図である。1 is a plan view showing a measurement sensor package 1 according to a first embodiment of the present invention. 図１の切断面線Ａ−Ａで切断した断面図である。It is sectional drawing cut | disconnected by the cutting plane line AA of FIG. 図１の切断面線Ｂ−Ｂで切断した断面図である。It is sectional drawing cut | disconnected by the cut surface line BB of FIG. 本発明の第２実施形態に係る計測センサ用パッケージ１Ａを示す平面図である。It is a top view which shows package 1A for measurement sensors which concerns on 2nd Embodiment of this invention. 本発明の第３実施形態に係る計測センサ用パッケージ１Ｂを示す概略平面図である。It is a schematic plan view which shows the package 1B for measurement sensors which concerns on 3rd Embodiment of this invention. 本発明の第３実施形態に係る計測センサ用パッケージ１Ｃを示す概略平面図である。It is a schematic plan view showing a measurement sensor package 1C according to a third embodiment of the present invention. 計測センサ１００の構成を示す断面図である。2 is a cross-sectional view illustrating a configuration of a measurement sensor 100. FIG.

図１は、本発明の第１実施形態に係る計測センサ用パッケージ１を示す平面図であり、図２は、図１の切断面線Ａ−Ａで切断した断面図であり、図３は、図１の切断面線Ｂ−Ｂで切断した断面図である。なお、図１の平面図では、蓋体３を省略して図示している。   FIG. 1 is a plan view showing a measurement sensor package 1 according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along a cutting plane line AA in FIG. 1, and FIG. It is sectional drawing cut | disconnected by the cut surface line BB of FIG. In the plan view of FIG. 1, the lid 3 is omitted.

計測センサ用パッケージ１は、基体２および蓋体３を含み、さらに表層接地導体層４、金属薄層５および導電性接合材６を含む。基体２は、発光素子および複数の受光素子を収容するものであり、基体本体２０に、信号配線導体２３と、外部接地端子２４と、接地ビア導体２６とが配設されている。   The measurement sensor package 1 includes a base 2 and a lid 3, and further includes a surface ground conductor layer 4, a thin metal layer 5, and a conductive bonding material 6. The base 2 accommodates a light emitting element and a plurality of light receiving elements, and a signal wiring conductor 23, an external ground terminal 24, and a ground via conductor 26 are disposed on the base body 20.

本実施形態の基体本体２０は、矩形板状であって、複数の誘電体層が積層されて形成されている。また、この基体本体２０には、少なくとも３つの凹部が、基体本体２０の１つの面（基体２の第１面）２１に開口するように設けられている。３つの凹部のうちの１つは、発光素子を収容する発光素子収容凹部２０ａであり、３つの凹部のうちの１つは、第１受光素子を収容する第１受光素子収容凹部２０ｂであり、３つの凹部のうちの１つは、第２受光素子を収容する第２受光素子収容凹部２０ｃである。   The base body 20 of the present embodiment has a rectangular plate shape and is formed by laminating a plurality of dielectric layers. The base body 20 is provided with at least three recesses so as to open to one surface (first surface of the base body 2) 21 of the base body 20. One of the three recesses is a light emitting element housing recess 20a that houses a light emitting element, and one of the three recesses is a first light receiving element housing recess 20b that houses a first light receiving element, One of the three recesses is a second light receiving element housing recess 20c that houses the second light receiving element.

本実施形態の計測センサ用パッケージ１は、発光素子収容凹部２０ａ、第１受光素子収容凹部２０ｂおよび第２受光素子収容凹部２０ｃが基体２の第１面２１に設けられている。また、本実施形態の計測センサ用パッケージ１では、発光素子収容凹部２０ａからの距離が、第２受光素子収容凹部２０ｃの方が、第１受光素子収容凹部２０ｂよりも大きくされている。   In the measurement sensor package 1 of the present embodiment, a light emitting element receiving recess 20 a, a first light receiving element receiving recess 20 b, and a second light receiving element receiving recess 20 c are provided on the first surface 21 of the base 2. Further, in the measurement sensor package 1 of the present embodiment, the distance from the light emitting element accommodating recess 20a is greater in the second light receiving element accommodating recess 20c than in the first light receiving element accommodating recess 20b.

さらに、本実施形態の計測センサ用パッケージ１では、基体２の第１面２１からの深さが、第２受光素子収容凹部２０ｃの方が、第１受光素子収容凹部２０ｂよりも浅くされている。すなわち、図３に示すように、第１受光素子収容凹部２０ｂの第１底面２０３と基体２の第２面（基体２の、第１面２１とは反対側の主面）２２との距離が、第２受光素子収容凹部２０ｃの第２底面２０６と基体２の第２面２２との距離よりも小さくされている。   Furthermore, in the measurement sensor package 1 of the present embodiment, the depth of the base 2 from the first surface 21 is shallower in the second light receiving element receiving recess 20c than in the first light receiving element receiving recess 20b. . That is, as shown in FIG. 3, the distance between the first bottom surface 203 of the first light receiving element receiving recess 20b and the second surface of the base 2 (the main surface of the base 2 opposite to the first surface 21) 22 is The distance between the second bottom surface 206 of the second light receiving element accommodating recess 20c and the second surface 22 of the base 2 is set smaller.

本実施形態の計測センサ用パッケージ１は、光のドップラー効果を利用して、血流等の流体の流れを計測する計測センサに好適に用いられる。特に、血流を計測する場合には、例えば手指等の身体の一部に外部から光を照射し、皮膚下の血管を流れる血液に含まれる血球細胞によって散乱された光を受光して、周波数の変化から血流を測定する。   The measurement sensor package 1 of the present embodiment is suitably used as a measurement sensor that measures the flow of a fluid such as a blood flow by utilizing the Doppler effect of light. In particular, when measuring blood flow, for example, a part of the body such as a finger is irradiated with light from the outside, and light scattered by blood cells contained in blood flowing through the blood vessels under the skin is received, and the frequency Measure blood flow from changes.

また、本実施形態の計測センサ用パッケージ１は、血管の中でも特に動脈の血流測定に好適に用いられる。動脈は、皮膚表面からの距離がより深い位置にあり、皮膚と動脈との間には他の生体組織、例えば動脈よりも皮膚に近い、浅い位置にある静脈が存在する。動脈の血流を測定しようとした場合、動脈の血流による散乱光が受光素子に向かう光路上に静脈が存在していると、受光素子によって受光されるべき散乱光が静脈によって吸収され、受光素子によって受光されるべき、動脈の血流による散乱光が減少してしまい、動脈の血流を測定することが難しくなる恐れがある。   In addition, the measurement sensor package 1 of the present embodiment is preferably used for blood flow measurement of arteries among blood vessels. The artery is located at a greater distance from the skin surface, and there is a vein in a shallow position that is closer to the skin than other biological tissues, for example, the artery, between the skin and the artery. When trying to measure the blood flow of an artery, if a vein is present on the optical path where scattered light from the blood flow of the artery is directed to the light receiving element, the scattered light to be received by the light receiving element is absorbed by the vein and received. Scattered light due to arterial blood flow that should be received by the element is reduced, which may make it difficult to measure arterial blood flow.

本実施形態では、発光素子収容凹部２０ａ、第１受光素子収容凹部２０ｂおよび第２受光素子収容凹部２０ｃは、発光素子収容凹部２０ａと第２受光素子収容凹部２０ｃとの距離が、発光素子収容凹部２０ａと第１受光素子収容凹部２０ｂとの距離よりも大きくされている。計測センサ用パッケージ１を備える計測センサは、動脈の血流による散乱光を広い範囲で受光することが可能になるので、静脈の影響、例えば静脈による散乱光の吸収を受けにくくなる。すなわち、計測センサ用パッケージ１を備える計測センサは、複数の受光素子を発光素子からの距離が異なる位置にそれぞれ配置することにより受光範囲を拡げ、それによって、複数の受光素子のいずれか１つは、動脈の血流による散乱光を受光できるように構成されている。   In the present embodiment, the light emitting element accommodating recess 20a, the first light receiving element accommodating recess 20b, and the second light receiving element accommodating recess 20c have a distance between the light emitting element accommodating recess 20a and the second light receiving element accommodating recess 20c. It is made larger than the distance of 20a and the 1st light receiving element accommodation recessed part 20b. The measurement sensor including the measurement sensor package 1 can receive scattered light due to the blood flow of the artery in a wide range, so that it is difficult to receive the influence of veins, for example, the absorption of scattered light by veins. That is, the measurement sensor including the measurement sensor package 1 expands the light receiving range by disposing the plurality of light receiving elements at different positions from the light emitting elements, and thus any one of the plurality of light receiving elements is In addition, it is configured to receive light scattered by the blood flow of the artery.

また、本実施形態では、第２受光素子収容凹部２０ｃの深さが、第１受光素子収容凹部２０ｂの深さよりも浅くされている。第２受光素子収容凹部２０ｃは、発光素子収容凹部２０ａからの距離が比較的遠いので、動脈の血流による散乱光は、第２受光素子収容凹部２０ｃの内部に比較的大きな入射角度で入射してもよい。ここで、入射角度は、基体２の第１面２１の法線方向と散乱光の進行方向との間の角度である。本実施形態では、第２受光素子収容凹部２０ｃに収容される第２受光素子の受光部が、基体２の第１面２１に近接して位置することになり、それによって、第２受光素子は、第２受光素子収容凹部２０ｃの内部に大きな入射角度で入射する、動脈の血流による散乱光を効率的に受光することができる。   In the present embodiment, the depth of the second light receiving element receiving recess 20c is shallower than the depth of the first light receiving element receiving recess 20b. Since the second light receiving element accommodating recess 20c is relatively far from the light emitting element accommodating recess 20a, the scattered light due to the blood flow of the artery enters the second light receiving element accommodating recess 20c at a relatively large incident angle. May be. Here, the incident angle is an angle between the normal direction of the first surface 21 of the base 2 and the traveling direction of the scattered light. In the present embodiment, the light receiving portion of the second light receiving element housed in the second light receiving element housing recess 20c is positioned close to the first surface 21 of the base 2, whereby the second light receiving element is In addition, it is possible to efficiently receive the scattered light caused by the blood flow of the artery that enters the second light receiving element housing recess 20c at a large incident angle.

本実施形態の計測センサ用パッケージ１によれば、第１受光素子収容凹部２０ｂに収容される第１受光素子、および第２受光素子収容凹部２０ｃに収容される第２受光素子のいずれか一方は、動脈の血流による散乱光を効率良く受光することができる。本実施形態によれば、動脈の血流を精度良く計測できる計測センサを提供することができる。   According to the measurement sensor package 1 of the present embodiment, one of the first light receiving element housed in the first light receiving element housing recess 20b and the second light receiving element housed in the second light receiving element housing recess 20c is It is possible to efficiently receive the scattered light due to the blood flow of the artery. According to the present embodiment, it is possible to provide a measurement sensor that can accurately measure the blood flow of an artery.

発光素子収容凹部２０ａの大きさ、第１受光素子収容凹部２０ｂの大きさ、第２受光素子収容凹部２０ｃの大きさは、収容しようとする発光素子および受光素子の大きさに応じて適宜設定すればよい。例えば、発光素子として、垂直共振器面発光レーザ素子（ＶＣＳＥＬ）を用いる場合、発光素子収容凹部２０ａの開口は、その形状が、例えば矩形であっても正方形であってもよく、その大きさは、例えば、縦方向長さが０．３ｍｍ〜２．０ｍｍ、横方向長さが０．３ｍｍ〜２．０ｍｍであり、深さは、０．３ｍｍ〜１．０ｍｍである。また、第１受光素子および第２受光素子として、面入射フォトダイオードを用いる場合、第１受光素子収容凹部２０ｂおよび第２受光素子収容凹部２０ｃの開口は、その形状が、例えば矩形であっても正方形であってもよく、その大きさは、例えば、縦方向長さが０．３ｍｍ〜２．０ｍｍ、横方向長さが０．３ｍｍ〜２．０ｍｍである。第１受光素子収容凹部２０ｂの深さは、例えば０．６ｍｍ〜１．５ｍｍであり、第２受光素子収容凹部２０ｃの深さは、例えば０．４ｍｍ〜１．３ｍｍである。また、平面視において、発光素子収容凹部２０ａの中心と第１受光素子収容凹部２０ｂとの距離は、例えば１ｍｍ〜３ｍｍであり、発光素子収容凹部２０ａの中心と第２受光素子収容凹部２０ｃとの距離は、例えば２ｍｍ〜６ｍｍである。   The size of the light emitting element accommodating recess 20a, the size of the first light receiving element accommodating recess 20b, and the size of the second light receiving element accommodating recess 20c are appropriately set according to the size of the light emitting element and the light receiving element to be accommodated. That's fine. For example, when a vertical cavity surface emitting laser element (VCSEL) is used as the light emitting element, the shape of the opening of the light emitting element accommodating recess 20a may be rectangular or square, for example, For example, the longitudinal length is 0.3 mm to 2.0 mm, the lateral length is 0.3 mm to 2.0 mm, and the depth is 0.3 mm to 1.0 mm. Further, when a surface incident photodiode is used as the first light receiving element and the second light receiving element, the openings of the first light receiving element receiving recess 20b and the second light receiving element receiving recess 20c may be rectangular, for example. A square may be sufficient and the magnitude | size is 0.3 mm-2.0 mm of vertical direction length, and 0.3 mm-2.0 mm of horizontal direction length, for example. The depth of the 1st light receiving element accommodation recessed part 20b is 0.6 mm-1.5 mm, for example, and the depth of the 2nd light receiving element accommodation recessed part 20c is 0.4 mm-1.3 mm, for example. Further, in plan view, the distance between the center of the light emitting element receiving recess 20a and the first light receiving element receiving recess 20b is, for example, 1 mm to 3 mm, and the center of the light emitting element receiving recess 20a and the second light receiving element receiving recess 20c. The distance is, for example, 2 mm to 6 mm.

第１受光素子収容凹部２０ｂと第２受光素子収容凹部２０ｃとは、発光素子収容凹部２０ａと第２受光素子収容凹部２０ｃとの距離が、発光素子収容凹部２０ａと第１受光素子収容凹部２０ｂとの距離よりも大きくされていれば、平面視したときの配置位置は、特に限定されないが、例えば、本実施形態のように、発光素子収容凹部２０ａ、第１受光素子収容凹部２０ｂおよび第２受光素子収容凹部２０ｃは、平面視において、発光素子収容凹部２０ａの中心ｃ０、第１受光素子収容凹部２０ｂの中心ｃ１および第２受光素子収容凹部２０ｃの中心ｃ２が、１つの直線上に並ぶように設けられていてもよい。このような配置とすることで、該１つの直線と交差する方向における計測センサ用パッケージ１の寸法を低減することが可能になり、これにより、計測センサ用パッケージ１を小型化することができる。   The distance between the light receiving element receiving recess 20a and the second light receiving element receiving recess 20c is such that the distance between the light receiving element receiving recess 20a and the second light receiving element receiving recess 20c is the same as the distance between the light receiving element receiving recess 20a and the first light receiving element receiving recess 20b. If the distance is larger than the distance, the arrangement position in plan view is not particularly limited. For example, as in the present embodiment, the light emitting element accommodating recess 20a, the first light receiving element accommodating recess 20b, and the second light receiving In the plan view, the element receiving recess 20c has a center c0 of the light emitting element receiving recess 20a, a center c1 of the first light receiving element receiving recess 20b, and a center c2 of the second light receiving element receiving recess 20c aligned on one straight line. It may be provided. With such an arrangement, it is possible to reduce the size of the measurement sensor package 1 in a direction intersecting with the one straight line, and thus the measurement sensor package 1 can be reduced in size.

発光素子収容凹部２０ａ、第１受光素子収容凹部２０ｂおよび第２受光素子収容凹部２０ｃは、基体本体２０の第１面２１に平行な断面の断面形状が深さ方向に一様な形状であってもよいが、図３の断面図に示すように、所定の深さまでは、断面形状が開口形状と同じで一様であり、所定の深さ以降は、断面形状が小さくなって底部まで一様であるような、段差付きの凹部であってもよい。   The light emitting element accommodating recess 20a, the first light receiving element accommodating recess 20b, and the second light receiving element accommodating recess 20c have a uniform cross-sectional shape in the depth direction in a cross section parallel to the first surface 21 of the base body 20. However, as shown in the cross-sectional view of FIG. 3, at a predetermined depth, the cross-sectional shape is the same as the opening shape and uniform, and after the predetermined depth, the cross-sectional shape becomes smaller and uniform to the bottom. It may be a recessed part with a level difference like this.

発光素子収容凹部２０ａは、発光素子が載置される底面２００を有し、発光素子収容凹部２０ａの内側面には、発光素子と電気的に接続される電極パッド２３ａが配設される段差面２０２を有する段差部２０１が設けられている。第１受光素子収容凹部２０ｂは、第１受光素子が載置される第１底面２０３を有し、第１受光素子収容凹部２０ｂの内側面には、第１受光素子と電気的に接続される電極パッド２３ａが配設される第１段差面２０５を有する第１段差部２０４が設けられている。また、第２受光素子収容凹部２０ｃは、第２受光素子が載置される第２底面２０６を有し、第２受光素子収容凹部２０ｃの内側面には、第２受光素子と電気的に接続される電極パッド２３ａが配設される第２段差面２０８を有する第２段差部２０７が設けられている。   The light emitting element accommodating recess 20a has a bottom surface 200 on which the light emitting element is placed, and a stepped surface on which an electrode pad 23a electrically connected to the light emitting element is disposed on the inner surface of the light emitting element accommodating recess 20a. A stepped portion 201 having 202 is provided. The first light receiving element receiving recess 20b has a first bottom surface 203 on which the first light receiving element is placed, and the inner side surface of the first light receiving element receiving recess 20b is electrically connected to the first light receiving element. A first step portion 204 having a first step surface 205 on which the electrode pad 23a is disposed is provided. The second light receiving element receiving recess 20c has a second bottom surface 206 on which the second light receiving element is placed, and the inner surface of the second light receiving element receiving recess 20c is electrically connected to the second light receiving element. A second stepped portion 207 having a second stepped surface 208 on which the electrode pad 23a is disposed is provided.

発光素子収容凹部２０ａと第１受光素子収容凹部２０ｂとは、基体２の第１面２１からの深さが、同一であってもよく、異なっていてもよい。本実施形態の計測センサ用パッケージ１は、図３に示すように、発光素子収容凹部２０ａの底面２００と第１受光素子収容凹部２０ｂの第１底面２０３とは、基体２の第２面２２から等距離にある。すなわち、発光素子収容凹部２０ａおよび第１受光素子収容凹部２０ｂの深さが同じである。さらに、本実施形態では、段差面２０２および第１段差面２０５が、基体２の第２面２２から等距離にある。すなわち、段差部２０１および第１段差部２０４の基体２の第１面２１からの深さが同じである。ここで、２つの距離が等しいとは、２つの距離が一致するだけではなく、２つの距離の差が±１０％以内であることも含む。   The depth from the first surface 21 of the base 2 may be the same or different between the light emitting element receiving recess 20a and the first light receiving element receiving recess 20b. In the measurement sensor package 1 of the present embodiment, as shown in FIG. 3, the bottom surface 200 of the light emitting element housing recess 20 a and the first bottom surface 203 of the first light receiving element housing recess 20 b are formed from the second surface 22 of the base 2. Is equidistant. That is, the depths of the light emitting element receiving recess 20a and the first light receiving element receiving recess 20b are the same. Furthermore, in this embodiment, the step surface 202 and the first step surface 205 are equidistant from the second surface 22 of the base 2. That is, the depths of the stepped portion 201 and the first stepped portion 204 from the first surface 21 of the base 2 are the same. Here, the two distances being equal includes not only the two distances matching but also that the difference between the two distances is within ± 10%.

第１受光素子収容凹部２０ｂと第２受光素子収容凹部２０ｃとは、発光素子収容凹部２０ａからの距離が異なっていれば、段差部の配置位置は、特に限定されないが、本実施形態のように、平面視において、第１段差部２０４は、第１受光素子収容凹部２０ｂの中心ｃ１を基準として第２受光素子収容凹部２０ｃの側に設けられており、第２段差部２０７は、第２受光素子収容凹部２０ｃの中心ｃ２を基準として第１受光素子収容凹部２０ｂの側に設けられていてもよい。すなわち、平面視において、第１段差部２０４が、第１受光素子収容凹部２０ｂの発光素子収容凹部２０ａから遠い側に設けられており、第２段差部２０７が、第２受光素子収容凹部２０ｃの発光素子収容凹部２０ａに近い側に設けられていてもよい。   As long as the distance between the first light receiving element receiving recess 20b and the second light receiving element receiving recess 20c is different from the light emitting element receiving recess 20a, the arrangement position of the stepped portion is not particularly limited, but as in this embodiment In plan view, the first step 204 is provided on the second light receiving element receiving recess 20c side with respect to the center c1 of the first light receiving element receiving recess 20b, and the second step 207 is the second light receiving element 207. It may be provided on the first light receiving element accommodating recess 20b side with reference to the center c2 of the element accommodating recess 20c. That is, in plan view, the first step 204 is provided on the side of the first light receiving element receiving recess 20b far from the light emitting element receiving recess 20a, and the second step 207 is formed on the second light receiving element receiving recess 20c. You may be provided in the side near the light emitting element accommodation recessed part 20a.

平面視において、第１段差部２０４が、発光素子収容凹部２０ａから遠い側に設けられていると、第１受光素子は、発光素子収容凹部２０ａに近い側に配置されることになり、第２段差部２０７が、発光素子収容凹部２０ａに近い側に設けられていると、第２受光素子は、発光素子収容凹部２０ａから遠い側に配置されることになる。これにより、第１受光素子は、より発光素子に近く、第２受光素子は、より発光素子から遠くに配置されることになるので、第１受光素子および第２受光素子による受光範囲を拡げることができる。これにより、動脈の血流による散乱光が静脈によって吸収されることを抑制することができ、動脈の血流を高精度に計測することが可能になる。   When the first step portion 204 is provided on the side far from the light emitting element accommodating recess 20a in plan view, the first light receiving element is disposed on the side closer to the light emitting element accommodating recess 20a. When the step portion 207 is provided on the side close to the light emitting element housing recess 20a, the second light receiving element is disposed on the side far from the light emitting element housing recess 20a. As a result, the first light receiving element is arranged closer to the light emitting element and the second light receiving element is arranged farther from the light emitting element, so that the light receiving range by the first light receiving element and the second light receiving element is expanded. Can do. Thereby, it is possible to suppress the scattered light due to the blood flow of the artery from being absorbed by the vein, and to measure the blood flow of the artery with high accuracy.

信号配線導体２３は、発光素子、第１受光素子または第２受光素子と電気的に接続され、発光素子に入力される電気信号が伝送され、受光素子から出力される電気信号が伝送される。本実施形態における信号配線導体２３は、発光素子、第１受光素子または第２受光素子と接続する接続部材であるボンディングワイヤと、ボンディングワイヤが接続される電極パッド２３ａと、電極パッド２３ａに電気的に接続して電極パッド２３ａの直下から基体本体２０を貫通し、基体２の第２面２２にまで延びる信号ビア導体２３ｂと、第２面２２に配設され、信号ビア導体２３ｂに電気的に接続する外部接続端子２３ｃとから成る。外部接続端子２３ｃは、基体２の第２面２２に設けられており、計測センサ用パッケージ１を備える計測センサが実装される外部実装基板の信号用接続端子とはんだ等の端子接続材料によって電気的に接続される。   The signal wiring conductor 23 is electrically connected to the light emitting element, the first light receiving element, or the second light receiving element, and an electric signal input to the light emitting element is transmitted, and an electric signal output from the light receiving element is transmitted. In the present embodiment, the signal wiring conductor 23 is electrically connected to the light emitting element, the bonding wire that is a connecting member connected to the first light receiving element or the second light receiving element, the electrode pad 23a to which the bonding wire is connected, and the electrode pad 23a. And a signal via conductor 23b extending through the base body 20 from directly below the electrode pad 23a and extending to the second surface 22 of the base body 2, and disposed on the second surface 22, and electrically connected to the signal via conductor 23b. And an external connection terminal 23c to be connected. The external connection terminal 23c is provided on the second surface 22 of the base 2, and is electrically connected to the signal connection terminal of the external mounting board on which the measurement sensor including the measurement sensor package 1 is mounted and a terminal connection material such as solder. Connected to.

外部接続端子２３ｃおよび外部接地端子２４は、はんだ等の接合材との濡れ性を向上させ、耐食性を向上させるために、例えば、厚さが０．５μｍ〜１０μｍのニッケル層と厚さが０．５μｍ〜５μｍの金層とをめっき法によって順次被着させてもよい。   The external connection terminal 23c and the external ground terminal 24 are, for example, a nickel layer having a thickness of 0.5 μm to 10 μm and a thickness of 0.1 mm in order to improve wettability with a bonding material such as solder and improve corrosion resistance. A gold layer of 5 μm to 5 μm may be sequentially deposited by a plating method.

基体２は、発光素子および受光素子を収容可能であり、信号配線導体２３等の導体を備えるものであれば、基体本体２０の誘電体層がセラミック絶縁材料からなり、信号配線導体２３等が導体材料からなるセラミック配線基板であってもよく、誘電体層が樹脂絶縁材料からなる有機配線基板であってもよい。   If the base body 2 can accommodate a light emitting element and a light receiving element and includes a conductor such as the signal wiring conductor 23, the dielectric layer of the base body 20 is made of a ceramic insulating material, and the signal wiring conductor 23 is a conductor. It may be a ceramic wiring board made of a material, or an organic wiring board whose dielectric layer is made of a resin insulating material.

基体２が、セラミック配線基板の場合、セラミック材料から成る誘電体層に各導体が形成される。セラミック配線基板は、複数のセラミック誘電体層から構成される。   When the substrate 2 is a ceramic wiring substrate, each conductor is formed on a dielectric layer made of a ceramic material. The ceramic wiring board is composed of a plurality of ceramic dielectric layers.

セラミック配線基板で用いられるセラミック材料としては、例えば、酸化アルミニウム質焼結体、ムライト質焼結体、炭化珪素質焼結体、窒化アルミニウム質焼結体、窒化珪素質焼結体またはガラスセラミックス焼結体等が挙げられる。   Examples of the ceramic material used in the ceramic wiring board include an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a glass ceramic sintered body. A ligature etc. are mentioned.

また、基体２が、有機配線基板の場合、有機材料から成る絶縁層に配線導体が形成される。有機配線基板は、複数の有機誘電体層から形成される。   When the base 2 is an organic wiring substrate, a wiring conductor is formed on an insulating layer made of an organic material. The organic wiring board is formed from a plurality of organic dielectric layers.

有機配線基板は、例えば、プリント配線基板、ビルドアップ配線基板またはフレキシブル配線基板等の誘電体層が有機材料から成るものであればよい。有機配線基板で用いられる有機材料としては、例えば、エポキシ樹脂、ポリイミド樹脂、ポリエステル樹脂、アクリル樹脂、フェノール樹脂またはフッ素系樹脂等が挙げられる。   The organic wiring substrate may be any material in which a dielectric layer such as a printed wiring substrate, a build-up wiring substrate, or a flexible wiring substrate is made of an organic material. Examples of the organic material used in the organic wiring board include an epoxy resin, a polyimide resin, a polyester resin, an acrylic resin, a phenol resin, and a fluorine resin.

蓋体３は、基体本体２０の１つの面（基体２の第１面）２１を覆い、導電性接合材６によって基体２の第１面２１に接合される。蓋体３によって、発光素子、第１受光素子および第２受光素子が収容された発光素子収容凹部２０ａ、第１受光素子収容凹部２０ｂおよび第２受光素子収容凹部２０ｃが塞がれて封止される。蓋体３は、絶縁材料からなる板状部材であり、発光素子収容凹部２０ａに収容される発光素子から出射される光が透過し、第１受光素子収容凹部２０ｂに収容される第１受光素子および第２受光素子収容凹部２０ｃに収容される第２受光素子が受光する光が透過するような光透過性を有する材料で構成されていればよい。   The lid 3 covers one surface (first surface of the substrate 2) 21 of the substrate body 20 and is bonded to the first surface 21 of the substrate 2 by the conductive bonding material 6. The lid 3 closes and seals the light emitting element, the light receiving element accommodating recess 20a in which the first light receiving element and the second light receiving element are accommodated, the first light receiving element accommodating recess 20b, and the second light receiving element accommodating recess 20c. The The lid 3 is a plate-like member made of an insulating material, and transmits light emitted from the light emitting element accommodated in the light emitting element accommodating recess 20a. The first light receiving element is accommodated in the first light receiving element accommodating recess 20b. The second light receiving element accommodated in the second light receiving element accommodating recess 20c may be made of a light-transmitting material that transmits light received by the second light receiving element.

本実施形態の計測センサ用パッケージ１を備える計測センサでは、蓋体３の表面に、例えば被計測物である手指を当てた状態で発光素子から出射した光を手指に照射する。蓋体３が導電性を有する材料で構成されていると、蓋体３に手指を接触させたときに、手指に溜まった不要な電荷が手指から放出され、蓋体３を通して基体２に電荷が流れ込み、ノイズが発生する。蓋体３を絶縁材料で構成することにより、蓋体３を通して不要な電荷が流れ込むことを抑制することができる。   In the measurement sensor including the measurement sensor package 1 of the present embodiment, the finger is irradiated with light emitted from the light emitting element in a state where, for example, a finger as a measurement object is applied to the surface of the lid 3. When the lid 3 is made of a conductive material, when the finger is brought into contact with the lid 3, unnecessary charges accumulated in the finger are released from the fingers, and the charge is transferred to the base 2 through the lid 3. Inflow and noise are generated. By configuring the lid 3 with an insulating material, it is possible to prevent unnecessary charges from flowing through the lid 3.

また、蓋体３は、被計測物への照射光および散乱光を透過する必要がある。照射光および散乱光の特性は、搭載する発光素子によって決まるので、少なくとも搭載する発光素子が出射する光が透過するように構成されていればよい。発光素子から出射される光の波長に対して、当該波長の光の透過率が７０％以上であればよく、９０％以上の透過率を有する絶縁材料で蓋体３を構成してもよい。   Further, the lid 3 needs to transmit the irradiation light and scattered light to the object to be measured. Since the characteristics of the irradiation light and the scattered light are determined by the light emitting element to be mounted, it is sufficient that at least the light emitted from the light emitting element to be mounted is transmitted. The light transmittance of the light emitted from the light emitting element only needs to be 70% or more, and the lid 3 may be made of an insulating material having a transmittance of 90% or more.

蓋体３を構成する絶縁材料としては、例えばサファイア等の透明セラミック材料、ガラス材料または樹脂材料等を用いることができる。ガラス材料としては、ホウケイ酸ガラス、結晶化ガラス、石英、ソーダガラス等を用いることができる。樹脂材料としては、ポリカーボネート樹脂、不飽和ポリエステル樹脂、エポキシ樹脂等を用いることができる。   As an insulating material constituting the lid 3, for example, a transparent ceramic material such as sapphire, a glass material, a resin material, or the like can be used. As the glass material, borosilicate glass, crystallized glass, quartz, soda glass, or the like can be used. As the resin material, polycarbonate resin, unsaturated polyester resin, epoxy resin, or the like can be used.

蓋体３は、手指等の被計測物が直接接触するため、所定の強度を要する。蓋体３の強度は、構成する材料の強度、板厚みによる。上記のように透明セラミック材料やガラス材料であれば、所定の厚み以上とすることで十分な強度が得られる。蓋体３の構成材料としてガラス材料を用いる場合は、例えば厚みを０．０５ｍｍ〜５ｍｍとすればよい。   The lid 3 requires a predetermined strength because an object to be measured such as a finger is in direct contact with the lid 3. The strength of the lid 3 depends on the strength and thickness of the constituent material. If it is a transparent ceramic material and a glass material as mentioned above, sufficient intensity | strength will be obtained by setting it as predetermined thickness or more. When a glass material is used as the constituent material of the lid 3, for example, the thickness may be 0.05 mm to 5 mm.

表層接地導体層４は、基体本体２０の１つの面２１に配設されるメタライズ層であって、第１受光素子および第２受光素子が収容される第１受光素子収容凹部２０ｂの開口および第２受光素子収容凹部２０ｃの開口を取り囲むように設けられる。表層接地導体層４は、例えば、外形が、基体本体２０の１つの面２１の外形に沿うように矩形状であってもよく、それ以外の円形状、多角形状などであってもよい。本実施形態では、表層接地導体層４の外形状を矩形状としている。また、表層接地導体層４は、第１受光素子収容凹部２０ｂの開口および第２受光素子収容凹部２０ｃの開口を取り囲んでいるから、少なくとも２つの開口に外接するか、または２つの開口よりも大きな１つの貫通孔が設けられたメタライズ層である。   The surface ground conductor layer 4 is a metallized layer disposed on one surface 21 of the base body 20, and includes an opening in the first light receiving element receiving recess 20 b and the first light receiving element receiving recess 20 b. The two light receiving element receiving recesses 20c are provided so as to surround the opening. For example, the outer surface of the ground conductor layer 4 may have a rectangular shape so as to follow the outer shape of the one surface 21 of the base body 20, or may have a circular shape, a polygonal shape, or the like. In the present embodiment, the outer shape of the surface ground conductor layer 4 is rectangular. Further, since the surface ground conductor layer 4 surrounds the opening of the first light receiving element receiving recess 20b and the opening of the second light receiving element receiving recess 20c, it circumscribes at least two openings or is larger than the two openings. It is a metallized layer provided with one through hole.

表層接地導体層４は、例えば、基体２に設けられた、接地ビア導体２６または後述の導電性接合材６などと接続することで、接地電位が付与される。基体本体２０の１つの面２１に、表層接地導体層４を設けることで、基体２の表面に設置した表層接地導体層４は、下記の金属薄層５と導電性接合材６により電気的に接続される。その結果、金属薄層５にも接地電位を付与することができ、金属薄層５が外部帯電体（特に手指等の測定物）からの電気的シールドとして作用し、第１受光素子および第２受光素子へのノイズ混入を抑制できる。   The surface ground conductor layer 4 is connected to, for example, a ground via conductor 26 or a conductive bonding material 6 (described later) provided on the base body 2 so that a ground potential is applied. By providing the surface ground conductor layer 4 on one surface 21 of the base body 20, the surface ground conductor layer 4 installed on the surface of the base body 2 is electrically connected by the following metal thin layer 5 and the conductive bonding material 6. Connected. As a result, a ground potential can also be applied to the thin metal layer 5, and the thin metal layer 5 acts as an electrical shield from an externally charged body (particularly, a measured object such as a finger), and the first light receiving element and the second light receiving element. Noise mixing into the light receiving element can be suppressed.

金属薄層５は、蓋体３の、基体本体２０の１つの面２１に対向する主面である対向面３ａ、すなわち手指が接触する側の主面とは反対側の主面に配設される金属材料からなる薄層である。金属薄層５には、第１受光素子が受光する光が通過する開口であって、光の通過を規制する開口である第１絞り孔５ａおよび第２受光素子が受光する光が通過する開口であって、光の通過を規制する開口である第２絞り孔５ｂが設けられている。金属薄層５は、第１絞り孔５ａおよび第２絞り孔５ｂの大きさ、形状、第１絞り孔５ａおよび第２絞り孔５ｂを設ける位置を適宜調整することによって、計測に必要な受光量を確保しつつ、外部から第１受光素子収容凹部２０ｂおよび第２受光素子収容凹部２０ｃへの不要な光の進入を低減することができる。外光など外部から進入する不要な光を第１受光素子および第２受光素子が受光してしまうと、第１受光素子および第２受光素子から出力される電気信号には、被計測物からの反射光による受光量に、不要光の受光量が加わることになり、光学的なノイズが発生してしまう。第１絞り孔５ａおよび第２絞り孔５ｂによって、このような光学的ノイズを低減することができる。   The thin metal layer 5 is disposed on the opposite surface 3a of the lid 3 which is the principal surface opposed to one surface 21 of the base body 20, that is, the principal surface opposite to the principal surface on the side where the fingers come into contact. It is a thin layer made of a metallic material. The thin metal layer 5 is an opening through which light received by the first light receiving element passes, and an opening through which the light received by the second light receiving element passes and the first aperture hole 5a that is an opening that restricts the passage of light. And the 2nd aperture hole 5b which is an opening which controls passage of light is provided. The metal thin layer 5 has a light receiving amount necessary for measurement by appropriately adjusting the size and shape of the first throttle hole 5a and the second throttle hole 5b, and the positions where the first throttle hole 5a and the second throttle hole 5b are provided. In addition, it is possible to reduce unnecessary light from entering the first light receiving element receiving recess 20b and the second light receiving element receiving recess 20c from the outside. If the first light receiving element and the second light receiving element receive unnecessary light that enters from the outside, such as external light, the electrical signals output from the first light receiving element and the second light receiving element are transmitted from the object to be measured. The amount of received unnecessary light is added to the amount of light received by the reflected light, and optical noise is generated. Such optical noise can be reduced by the first diaphragm hole 5a and the second diaphragm hole 5b.

第１絞り孔５ａは、平面視で、第１受光素子収容凹部２０ｂの第１底面２０３の中心に対応する位置、すなわち収容される第１受光素子の中心に対応する位置に設けられてもよく、第２絞り孔５ｂは、平面視で、第２受光素子収容凹部２０ｃの第２底面２０６の中心に対応する位置、すなわち収容される第２受光素子の中心に対応する位置に設けられてもよい。   The first aperture 5a may be provided at a position corresponding to the center of the first bottom surface 203 of the first light receiving element receiving recess 20b, that is, a position corresponding to the center of the first light receiving element to be stored, in plan view. The second aperture 5b may be provided at a position corresponding to the center of the second bottom surface 206 of the second light receiving element receiving recess 20c, that is, a position corresponding to the center of the second light receiving element to be stored in plan view. Good.

本実施形態では、平面視において、第１絞り孔５ａは、第１受光素子収容凹部２０ｂの中心ｃ２を基準として第２受光素子収容凹部２０ｃとは反対側に設けられており、第２絞り孔５ｂは、第２受光素子収容凹部２０ｃの中心ｃ２を基準として第１受光素子収容凹部２０ｂとは反対の側に設けられている。すなわち、図１に示すように、平面視において、第１絞り孔５ａは、第１受光素子収容凹部２０ｂの発光素子収容凹部２０ａに近い側に設けられており、第２絞り孔５ｂは、第２受光素子収容凹部２０ｃの発光素子収容凹部２０ａから遠い側に設けられている。このような第１絞り孔５ａおよび第２絞り孔５ｂを設けることにより、第１受光素子は、発光素子にさらに近い側の散乱光を受光し、第２受光素子は、発光素子からさらに遠い側の散乱光を受光することができるので、第１受光素子および第２受光素子による受光範囲をさらに拡げることができる。本実施形態の第１絞り孔５ａおよび第２絞り孔５ｂによれば、動脈の血流による散乱光を効率よく受光することができ、動脈の血流を高精度に計測することが可能になる。   In the present embodiment, in plan view, the first aperture hole 5a is provided on the opposite side of the second light receiving element accommodating recess 20c with respect to the center c2 of the first light receiving element accommodating recess 20b. 5b is provided on the side opposite to the first light receiving element receiving recess 20b with the center c2 of the second light receiving element receiving recess 20c as a reference. That is, as shown in FIG. 1, in a plan view, the first aperture hole 5a is provided on the side of the first light receiving element accommodating recess 20b near the light emitting element accommodating recess 20a, and the second aperture hole 5b is The two light receiving element accommodating recesses 20c are provided on the side far from the light emitting element accommodating recess 20a. By providing the first aperture hole 5a and the second aperture hole 5b as described above, the first light receiving element receives scattered light closer to the light emitting element, and the second light receiving element is further away from the light emitting element. Therefore, the light receiving range by the first light receiving element and the second light receiving element can be further expanded. According to the first throttle hole 5a and the second throttle hole 5b of this embodiment, scattered light due to the blood flow of the artery can be efficiently received, and the blood flow of the artery can be measured with high accuracy. .

金属薄層５は、外部から到来する電磁波が第１受光素子収容凹部２０ｂおよび第２受光素子収容凹部２０ｃに進入することを抑制するための電磁シールドとしても機能する。電磁波が第１受光素子収容凹部２０ｂおよび第２受光素子収容凹部２０ｃに進入すると、信号配線導体２３、特にボンディングワイヤがアンテナとなって、進入した電磁波を受信してしまい電磁的ノイズの発生原因となる。蓋体３の対向面３ａに、第１絞り孔５ａおよび第２絞り孔５ｂを除いて金属材料からなる薄層を設けることで、外部からの電磁波の進入を抑制し、電磁的ノイズの発生を低減することができる。   The thin metal layer 5 also functions as an electromagnetic shield for suppressing electromagnetic waves coming from the outside from entering the first light receiving element receiving recess 20b and the second light receiving element receiving recess 20c. When the electromagnetic wave enters the first light receiving element receiving recess 20b and the second light receiving element receiving recess 20c, the signal wiring conductor 23, particularly the bonding wire, becomes an antenna, and the incoming electromagnetic wave is received to cause generation of electromagnetic noise. Become. By providing a thin layer made of a metal material on the facing surface 3a of the lid 3 except for the first throttle hole 5a and the second throttle hole 5b, the entry of electromagnetic waves from the outside is suppressed, and electromagnetic noise is generated. Can be reduced.

このように、金属薄層５を設けることで、光学的および電気的ノイズによる影響を抑制し、計測精度を向上させることができる。なお、金属薄層５は、表層接地導体層４と電気的に接続され、接地電位が付与されてもよい。また、本実施形態では、金属薄層５の外形と表層接地導体層４との外形は同じ大きさであるが、異なっていてもよい。   Thus, by providing the metal thin layer 5, the influence by optical and electrical noise can be suppressed and measurement accuracy can be improved. The thin metal layer 5 may be electrically connected to the surface ground conductor layer 4 and applied with a ground potential. Moreover, in this embodiment, although the external shape of the thin metal layer 5 and the external shape of the surface ground conductor layer 4 are the same magnitude | sizes, you may differ.

金属薄層５は、透明セラミック材料またはガラス材料からなる蓋体３の表面に、例えば、Ｃｒ、Ｔｉ、Ａｌ、Ｃｕ、Ｃｏ、Ａｇ、Ａｕ、Ｐｄ、Ｐｔ、Ｒｕ、Ｓｎ、Ｔａ、Ｆｅ、Ｉｎ、Ｎｉ、Ｗなどの金属及びこれらの合金等の金属材料を蒸着、スパッタ、焼付け等によって形成することができる。金属薄層５の層厚みは、例えば、５００Å〜４０００Åである。   The thin metal layer 5 is formed on the surface of the lid 3 made of a transparent ceramic material or a glass material, for example, Cr, Ti, Al, Cu, Co, Ag, Au, Pd, Pt, Ru, Sn, Ta, Fe, In, Metal materials such as metals such as Ni, W, and alloys thereof can be formed by vapor deposition, sputtering, baking, or the like. The layer thickness of the metal thin layer 5 is, for example, 500 to 4000 mm.

導電性接合材６は、基体２と蓋体３とを接合する。より詳細には、基体本体２０の１つの面（基体２の第１面）２１と蓋体３の対向面３ａとを、外周部分で接合する。導電性接合材６は、矩形状の基体２の第１面２１の四辺に沿って環状に設けられており、基体２の発光素子収容凹部２０ａ、第１受光素子収容凹部２０ｂおよび第２受光素子収容凹部２０ｃ内の気密性および水密性を確保するためのシール材である。   The conductive bonding material 6 bonds the base 2 and the lid 3 together. More specifically, one surface 21 of the base body 20 (first surface of the base body 2) 21 and the facing surface 3a of the lid 3 are joined at the outer peripheral portion. The conductive bonding material 6 is provided in an annular shape along the four sides of the first surface 21 of the rectangular base 2, and the light emitting element receiving recess 20 a, the first light receiving element receiving recess 20 b, and the second light receiving element of the base 2. It is a sealing material for ensuring airtightness and watertightness in the housing recess 20c.

発光素子収容凹部２０ａ、第１受光素子収容凹部２０ｂおよび第２受光素子収容凹部２０ｃに収容される発光素子、第１受光素子および第２受光素子は、いずれも水分等に弱く、外部からの水分の浸入を防止するために、導電性接合材６は、途切れの無い環状に設けられる。   The light emitting element, the first light receiving element, and the second light receiving element accommodated in the light emitting element accommodating recess 20a, the first light receiving element accommodating recess 20b, and the second light receiving element accommodating recess 20c are all vulnerable to moisture and the like. In order to prevent the penetration of the conductive bonding material 6, the conductive bonding material 6 is provided in an annular shape without interruption.

さらに、導電性接合材６は遮光性を有していてもよい。導電性接合材６が遮光性を有することで、外部からの光が、基体２と蓋体３との間を通って、発光素子収容凹部２０ａ、第１受光素子収容凹部２０ｂおよび第２受光素子収容凹部２０ｃ内に進入することを防止できる。   Furthermore, the conductive bonding material 6 may have a light shielding property. Since the conductive bonding material 6 has a light-shielding property, light from the outside passes between the base 2 and the lid 3, and the light-emitting element accommodating recess 20 a, the first light-receiving element accommodating recess 20 b, and the second light-receiving element. It can prevent entering into the accommodation recessed part 20c.

導電性接合材６が有する遮光性は、光の吸収による遮光性であってもよい。外部からの光の進入を防ぐ観点からは、反射による遮光性であってもよいが、計測センサの内部で発生した迷光が、導電性接合材６で反射してさらに第１受光素子、第２受光素子に受光されてしまうおそれがある。導電性接合材６が光を吸収するものであれば、外部からの光を吸収して進入を防ぐとともに、内部で発生した迷光も吸収することができる。   The light shielding property of the conductive bonding material 6 may be a light shielding property due to light absorption. From the viewpoint of preventing the entry of light from the outside, it may be light-shielding by reflection. However, stray light generated inside the measurement sensor is reflected by the conductive bonding material 6 and further the first light receiving element and the second light receiving element. There is a risk of being received by the light receiving element. If the conductive bonding material 6 absorbs light, the light from the outside can be absorbed to prevent entry, and stray light generated inside can be absorbed.

導電性接合材６は、このような光の吸収による遮光性を有する材料を含んで構成される。導電性接合材６は、例えば、基体２と蓋体３との接合性を有するエポキシ樹脂、導電性シリコン樹脂等の樹脂系接着剤に、光吸収性材料を分散させて得られる。光吸収材料としては、例えば、無機顔料を用いることができる。無機顔料としては、例えば、カーボンブラックなどの炭素系顔料、チタンブラックなどの窒化物系顔料、Ｃｒ−Ｆｅ−Ｃｏ系、Ｃｕ−Ｃｏ−Ｍｎ系、Ｆｅ−Ｃｏ−Ｍｎ系、Ｆｅ−Ｃｏ−Ｎｉ−Ｃｒ系などの金属酸化物系顔料等を用いることができる。   The conductive bonding material 6 includes a material having a light shielding property due to such light absorption. The conductive bonding material 6 is obtained, for example, by dispersing a light-absorbing material in a resin-based adhesive such as an epoxy resin or a conductive silicon resin that has bonding properties between the base 2 and the lid 3. As the light absorbing material, for example, an inorganic pigment can be used. Examples of inorganic pigments include carbon pigments such as carbon black, nitride pigments such as titanium black, Cr—Fe—Co, Cu—Co—Mn, Fe—Co—Mn, and Fe—Co—Ni. Metal oxide pigments such as -Cr can be used.

本実施形態では、表層接地導体層４と金属薄層５とは、平面透視において、環状に設けられた導電性接合材６の外縁よりも内側の領域にそれぞれ配設される。すなわち、基体本体２０の１つの面２１と蓋体３の対向面３ａとの間には、表層接地導体層４および金属薄層５の一部が介在されている。そして、導電性接合材６によって、蓋体３と基体２とが全周にわたり直接接合されている。なお、導電性接合材６は、表層接地導体層４や金属薄層５と一部が重なるように配設されていてもよい。   In the present embodiment, the surface ground conductor layer 4 and the metal thin layer 5 are respectively disposed in regions inside the outer edge of the conductive bonding material 6 provided in an annular shape in a plan view. That is, a part of the surface ground conductor layer 4 and the metal thin layer 5 are interposed between one surface 21 of the base body 20 and the facing surface 3 a of the lid 3. And the cover body 3 and the base | substrate 2 are directly joined by the electroconductive joining material 6 over the perimeter. The conductive bonding material 6 may be disposed so as to partially overlap the surface ground conductor layer 4 and the metal thin layer 5.

基体２と蓋体３との接合において、表層接地導体層４および金属薄層５が介在しない箇所では、基体２と蓋体３との接合強度を高くすることができ、蓋体３の剥離等を防止することができる。   In the joining of the base body 2 and the lid body 3, the bonding strength between the base body 2 and the lid body 3 can be increased at a location where the surface ground conductor layer 4 and the metal thin layer 5 are not interposed, and the lid body 3 is peeled off. Can be prevented.

次に、本発明の他の実施形態について説明する。図４は、本発明の第２実施形態に係る計測センサ用パッケージ１Ａを示す平面図である。   Next, another embodiment of the present invention will be described. FIG. 4 is a plan view showing a measurement sensor package 1A according to the second embodiment of the present invention.

第２実施形態の計測センサ用パッケージ１Ａは、第１実施形態の計測センサ用パッケージ１に対して、第１受光素子収容凹部２０ｂおよび第２受光素子収容凹部２０ｃの配置位置の点で相違し、その他については、同様の構成であるので、同様の構成には計測センサ用パッケージ１と同じ参照符号を付して詳細な説明は省略する。なお、図４では、蓋体３を省略して図示している。   The measurement sensor package 1A according to the second embodiment is different from the measurement sensor package 1 according to the first embodiment in the arrangement positions of the first light receiving element receiving recess 20b and the second light receiving element receiving recess 20c. Since other configurations are the same, the same configurations are denoted by the same reference numerals as those of the measurement sensor package 1, and detailed description thereof is omitted. In FIG. 4, the lid 3 is omitted.

第２実施形態の計測センサ用パッケージ１Ａでは、平面視において、第１受光素子収容凹部２０ｂが、発光素子収容凹部２０ａと第２受光素子収容凹部２０ｃとの間に設けられ、第１受光素子収容凹部２０ｂの中心ｃ１が、発光素子収容凹部２０ａの中心ｃ０と第２受光素子収容凹部２０ｃの中心ｃ２とを結ぶ直線から離れるように設けられている。   In the measurement sensor package 1A of the second embodiment, the first light receiving element accommodating recess 20b is provided between the light emitting element accommodating recess 20a and the second light receiving element accommodating recess 20c in plan view, and the first light receiving element accommodated. The center c1 of the recess 20b is provided so as to be separated from the straight line connecting the center c0 of the light emitting element receiving recess 20a and the center c2 of the second light receiving element receiving recess 20c.

第２実施形態の計測センサ用パッケージ１Ａによれば、第１受光素子および第２受光素子による受光範囲を、互いに交差する２つの方向、すなわち発光素子収容凹部２０ａの中心ｃ０と第１受光素子収容凹部２０ｂの中心ｃ１とを結ぶ方向、および発光素子収容凹部２０ａの中心ｃ０と第２受光素子収容凹部２０ｃの中心ｃ２とを結ぶ方向の両方向において拡げることができる。これにより、第１受光素子および第２受光素子は、動脈の血流による散乱光をより受光しやすくなるので、計測センサ用パッケージ１Ａによれば、動脈の血流を高精度に計測することが可能になる。   According to the measurement sensor package 1A of the second embodiment, the light receiving range by the first light receiving element and the second light receiving element is divided into two directions intersecting each other, that is, the center c0 of the light emitting element receiving recess 20a and the first light receiving element received. It can be expanded in both the direction connecting the center c1 of the recess 20b and the direction connecting the center c0 of the light emitting element receiving recess 20a and the center c2 of the second light receiving element receiving recess 20c. As a result, the first light receiving element and the second light receiving element can more easily receive the scattered light due to the blood flow of the artery. Therefore, according to the measurement sensor package 1A, the blood flow of the artery can be measured with high accuracy. It becomes possible.

なお、図４においては、計測センサ用パッケージ１Ａを基体本体２０の長さ方向（図４における左右方向）に側面透視した場合に、第１受光素子収容凹部２０ｂと第２受光素子収容凹部２０ｃが重なっている例を示しているが、第１受光素子収容凹部２０ｂと第２受光素子収容凹部２０ｃとは、計測センサ用パッケージを基体本体２０の長さ方向に側面透視した場合に、重なっていなくてもよい。   In FIG. 4, when the measurement sensor package 1 </ b> A is viewed from the side in the length direction of the base body 20 (left and right direction in FIG. 4), the first light receiving element receiving recess 20 b and the second light receiving element receiving recess 20 c are formed. Although the example which overlaps is shown, the 1st light receiving element accommodation recessed part 20b and the 2nd light receiving element accommodation recessed part 20c are not overlapped when the side view of the measurement sensor package is seen in the length direction of the base body 20 May be.

図５は、本発明の第３実施形態に係る計測センサ用パッケージ１Ｂを示す概略平面図である。なお、図５においては、蓋体３および金属薄層５を省略して図示している。   FIG. 5 is a schematic plan view showing a measurement sensor package 1B according to a third embodiment of the present invention. In FIG. 5, the lid 3 and the metal thin layer 5 are omitted.

第３実施形態の計測センサ用パッケージ１Ｂは、第１実施形態の計測センサ用パッケージ１に対して、第３受光素子収容凹部２０ｄと第４受光素子収容凹部２０ｅとをさらに含み、発光素子収容凹部２０ａ内における底面２００および段差部２０１の配置位置が異なる点で相違し、その他については、同様の構成であるので、同様の構成には計測センサ用パッケージ１と同じ参照符号を付して詳細な説明は省略する。   The measurement sensor package 1B according to the third embodiment further includes a third light receiving element accommodating recess 20d and a fourth light receiving element accommodating recess 20e with respect to the measurement sensor package 1 according to the first embodiment, and the light emitting element accommodating recess. 20a is different in the arrangement position of the bottom surface 200 and the stepped portion 201, and the other configurations are the same, and the same configurations are denoted by the same reference numerals as those of the measurement sensor package 1 and detailed. Description is omitted.

計測センサ用パッケージ１Ｂは、発光素子を収容する発光素子収容凹部２０ａ、第１受光素子を収容する第１受光素子収容凹部２０ｂ、第２受光素子を収容する第２受光素子収容凹部２０ｃ、第３受光素子を収容する第３受光素子収容凹部２０ｄおよび第４受光素子を収容する第４受光素子収容凹部２０ｅが、基体２の第１面２１に設けられている。   The measurement sensor package 1B includes a light emitting element accommodating recess 20a that accommodates a light emitting element, a first light receiving element accommodating recess 20b that accommodates a first light receiving element, a second light receiving element accommodating recess 20c that accommodates a second light receiving element, and a third. A third light receiving element receiving recess 20 d for receiving the light receiving element and a fourth light receiving element receiving recess 20 e for receiving the fourth light receiving element are provided on the first surface 21 of the base 2.

第３受光素子収容凹部２０ｄの形状および寸法、ならびに第４受光素子収容凹部２０ｅの形状および寸法は、特に限定されないが、例えば、第３受光素子収容凹部２０ｄの形状および寸法は、第１受光素子収容凹部２０ｂと同様に構成されてもよく、第４受光素子収容凹部２０ｅの形状および寸法は、第２受光素子収容凹部２０ｃと同様に構成されてもよい。   The shape and size of the third light receiving element receiving recess 20d and the shape and size of the fourth light receiving element receiving recess 20e are not particularly limited. For example, the shape and size of the third light receiving element receiving recess 20d are the same as those of the first light receiving element. The receiving recess 20b may be configured similarly, and the shape and size of the fourth light receiving element receiving recess 20e may be configured in the same manner as the second receiving element receiving recess 20c.

計測センサ用パッケージ１Ｂは、平面視において、第４受光素子収容凹部２０ｅの中心ｃ４、第３受光素子収容凹部２０ｄの中心ｃ３、発光素子収容凹部２０ａの中心ｃ０、第１受光素子収容凹部２０ｂの中心ｃ１および第２受光素子収容凹部２０ｃの中心ｃ２が一直線上に並ぶように構成されている。計測センサ用パッケージ１Ｂによれば、基体本体２０の長さ方向（図５における左右方向）において、基体２の第１面２１のうちの一方側に受光範囲を拡げるだけでなく、他方側にも受光範囲を拡げることができ、これにより、動脈の血流による散乱光を効率的に受光し、動脈の血流を高精度に計測することが可能になる。   The measurement sensor package 1B has a center c4 of the fourth light receiving element receiving recess 20e, a center c3 of the third light receiving element receiving recess 20d, a center c0 of the light emitting element receiving recess 20a, and the first light receiving element receiving recess 20b in plan view. The center c1 and the center c2 of the second light receiving element accommodating recess 20c are arranged in a straight line. According to the measurement sensor package 1B, in the length direction of the base body 20 (left-right direction in FIG. 5), not only the light receiving range is expanded on one side of the first surface 21 of the base body 2, but also on the other side. The light receiving range can be expanded, whereby scattered light due to arterial blood flow can be efficiently received, and the arterial blood flow can be measured with high accuracy.

図６は、本発明の第４実施形態に係る計測センサ用パッケージ１Ｃを示す概略平面図である。なお、図６においては、蓋体３および金属薄層５を省略して図示している。   FIG. 6 is a schematic plan view showing a measurement sensor package 1C according to a fourth embodiment of the present invention. In FIG. 6, the lid 3 and the metal thin layer 5 are omitted.

第４実施形態の計測センサ用パッケージ１Ｃは、第３実施形態の計測センサ用パッケージ１Ｂに対して、第１受光素子収容凹部２０ｂ、第２受光素子収容凹部２０ｃ、第３受光素子収容凹部２０ｄおよび第４受光素子収容凹部２０ｅの配置が異なっており、その他については、同様の構成であるので、同様の構成には計測センサ用パッケージ１Ｂと同じ参照符号を付して詳細な説明は省略する。   The measurement sensor package 1C of the fourth embodiment is different from the measurement sensor package 1B of the third embodiment in that the first light receiving element receiving recess 20b, the second light receiving element receiving recess 20c, the third light receiving element receiving recess 20d, and Since the arrangement of the fourth light receiving element accommodating recess 20e is different and the other components are the same, the same components are denoted by the same reference numerals as those of the measurement sensor package 1B, and detailed description thereof is omitted.

計測センサ用パッケージ１Ｃは、第１受光素子収容凹部２０ｂが、発光素子収容凹部２０ａと第２受光素子収容凹部２０ｃとの間に位置し、第１受光素子収容凹部２０ｂの中心ｃ１が、発光素子収容凹部２０ａの中心ｃ０と第２受光素子収容凹部２０ｃの中心ｃ２とを結ぶ直線から離れるように構成されている。さらに、計測センサ用パッケージ１Ｃは、平面視して、第３受光素子収容凹部２０ｄが、発光素子収容凹部２０ａと第４受光素子収容凹部２０ｅとの間に位置し、第３受光素子収容凹部２０ｄの中心ｃ３が、発光素子収容凹部２０ａの中心ｃ０と第４受光素子収容凹部２０ｅの中心ｃ４とを結ぶ直線から離れるように構成されている。   In the measurement sensor package 1C, the first light receiving element accommodating recess 20b is positioned between the light emitting element accommodating recess 20a and the second light receiving element accommodating recess 20c, and the center c1 of the first light receiving element accommodating recess 20b is the light emitting element. It is configured to be away from a straight line connecting the center c0 of the housing recess 20a and the center c2 of the second light receiving element housing recess 20c. Further, in the measurement sensor package 1C, the third light receiving element receiving recess 20d is located between the light emitting element receiving recess 20a and the fourth light receiving element receiving recess 20e in plan view, and the third light receiving element receiving recess 20d. The center c3 is configured to be away from a straight line connecting the center c0 of the light emitting element receiving recess 20a and the center c4 of the fourth light receiving element receiving recess 20e.

計測センサ用パッケージ１Ｃによれば、基体本体２０の長さ方向（図６における左右方向）において、基体２の第１面２１のうちの一方側および他方側に受光範囲を拡げることができるとともに、第１〜第４受光素子による受光範囲を、互いに交差する少なくとも２つの方向において拡げることができ、これにより、動脈の血流による散乱光を効率的に受光し、動脈の血流を高精度に計測することが可能になる。   According to the measurement sensor package 1C, the light receiving range can be expanded on one side and the other side of the first surface 21 of the base body 2 in the length direction of the base body 20 (left and right direction in FIG. 6). The light receiving range by the first to fourth light receiving elements can be expanded in at least two directions intersecting each other, thereby efficiently receiving scattered light due to the blood flow of the artery, and the blood flow of the artery with high accuracy. It becomes possible to measure.

次に、計測センサ用パッケージ１，１Ａ，１Ｂ，１Ｃの製造方法について説明する。まず、基体２を公知の多層配線基板の製造方法と同様にして作製する。基体２が、セラミック配線基板であり、セラミック材料がアルミナである場合は、まずアルミナ（Ａｌ２Ｏ３）やシリカ（ＳｉＯ２）、カルシア（ＣａＯ）、マグネシア（ＭｇＯ）等の原料粉末に適当な有機溶剤、溶媒を添加混合して泥漿状とし、これを周知のドクターブレード法やカレンダーロール法等によってシート状に成形してセラミックグリーンシート（以下、グリーンシートともいう）を得る。その後、グリーンシートを所定の外形状および凹部の形成のために打ち抜き加工するとともに、タングステン（Ｗ）とガラス材料等の原料粉末に有機溶剤、溶媒を添加混合して金属ペーストとし、電極パッド２３ａ等の導体層は、金属ペーストをグリーンシート表面にスクリーン印刷等の印刷法でパターン印刷する。また、信号ビア導体２３ｂおよび接地ビア導体２６等の貫通導体は、グリーンシートに貫通孔を設け、スクリーン印刷等によって金属ペーストを貫通孔に充填させる。また、表層接地導体層４となるメタライズ層は、金属ペーストによって最表面に形成される。こうして得られたグリーンシートを複数枚積層し、これを約１６００℃の温度で同時焼成することによって基体２が作製される。 Next, a method for manufacturing the measurement sensor packages 1, 1A, 1B, 1C will be described. First, the base body 2 is produced in the same manner as a known multilayer wiring board manufacturing method. When the substrate 2 is a ceramic wiring board and the ceramic material is alumina, it is suitable for a raw material powder such as alumina (Al 2 O 3 ), silica (SiO 2 ), calcia (CaO), magnesia (MgO), etc. An organic solvent and a solvent are added and mixed to form a slurry, which is formed into a sheet by a known doctor blade method, calendar roll method, or the like to obtain a ceramic green sheet (hereinafter also referred to as a green sheet). Thereafter, the green sheet is punched to form a predetermined outer shape and recess, and an organic solvent and a solvent are added to and mixed with raw material powder such as tungsten (W) and a glass material to form a metal paste, and electrode pads 23a and the like. The conductive layer is subjected to pattern printing on the surface of the green sheet by a printing method such as screen printing. In addition, the through conductors such as the signal via conductor 23b and the ground via conductor 26 are provided with through holes in the green sheet and filled with metal paste by screen printing or the like. Further, the metallized layer to be the surface ground conductor layer 4 is formed on the outermost surface with a metal paste. A plurality of the green sheets obtained in this way are stacked, and these are co-fired at a temperature of about 1600 ° C., thereby producing the substrate 2.

一方、ガラス材料を、切削、切断等により所定の形状に切り出した蓋体３を準備し、対向面３ａ上に、蒸着、スパッタ、焼付け等によって金属薄層５を形成する。このとき、フォトリソ（ウェットエッチング）法、ドライエッチング法等によって金属薄層にパターン加工することにより、第１絞り孔５ａ、第２絞り孔５ｂ等を形成することができる。   On the other hand, a lid 3 obtained by cutting a glass material into a predetermined shape by cutting, cutting or the like is prepared, and a thin metal layer 5 is formed on the facing surface 3a by vapor deposition, sputtering, baking, or the like. At this time, the first aperture hole 5a, the second aperture hole 5b, and the like can be formed by patterning the metal thin layer by a photolithography (wet etching) method, a dry etching method, or the like.

次に、本発明の第５実施形態である計測センサ１００について説明する。図７は、計測センサ１００の構成を示す断面図である。なお、図７においては、第１実施形態の計測センサ用パッケージ１に発光素子、第１受光素子、および第２受光素子を搭載した例を図示しているが、計測センサ１００は、計測センサ用パッケージ１Ａ、計測センサ用パッケージ１Ｂ、または計測センサ用パッケージ１Ｃに発光素子、および複数の受光素子を搭載したものであってもよい。   Next, the measurement sensor 100 which is 5th Embodiment of this invention is demonstrated. FIG. 7 is a cross-sectional view showing the configuration of the measurement sensor 100. 7 shows an example in which the light emitting element, the first light receiving element, and the second light receiving element are mounted on the measurement sensor package 1 of the first embodiment. However, the measurement sensor 100 is used for the measurement sensor. A light emitting element and a plurality of light receiving elements may be mounted on the package 1A, the measurement sensor package 1B, or the measurement sensor package 1C.

計測センサ１００は、計測センサ用パッケージ１と、発光素子収容凹部２０ａに収容される発光素子３０と、第１受光素子収容凹部２０ｂに収容される第１受光素子３１と、第２受光素子収容凹部２０ｃに収容される第２受光素子３２と、を含む。   The measurement sensor 100 includes a measurement sensor package 1, a light emitting element 30 accommodated in the light emitting element accommodating recess 20a, a first light receiving element 31 accommodated in the first light receiving element accommodating recess 20b, and a second light receiving element accommodating recess. 2nd light receiving element 32 stored in 20c.

計測センサ１００は、計測センサ用パッケージ１の発光素子３０と、第１受光素子３１と、第２受光素子３２とを実装し、ボンディングワイヤ３３で各素子と電極パッド２３ａと接続した後、蓋体３を導電性接合材６によって基体本体２０に接合して得られる。   The measurement sensor 100 is formed by mounting the light emitting element 30, the first light receiving element 31, and the second light receiving element 32 of the measurement sensor package 1 and connecting each element to the electrode pad 23a with a bonding wire 33, and then covering the lid. 3 is bonded to the base body 20 by the conductive bonding material 6.

発光素子３０は、ＶＣＳＥＬ等の半導体レーザ素子を用いることができ、第１受光素子３１および第２受光素子３２は、シリコンフォトダイオード、ＧａＡｓフォトダイオード、ＩｎＧａＡｓフォトダイオード、ゲルマニウムフォトダイオード等の各種フォトダイオードを用いることができる。発光素子３０および第１受光素子３１および第２受光素子３２は、被計測物の種類、計測するパラメータの種類等により適宜選択すればよく、第１受光素子３１および第２受光素子３２は、同一種類のフォトダイオードを用いてもよく、異なる種類のフォトダイオードを用いてもよい。   The light emitting element 30 can be a semiconductor laser element such as a VCSEL, and the first light receiving element 31 and the second light receiving element 32 are various photodiodes such as a silicon photodiode, a GaAs photodiode, an InGaAs photodiode, and a germanium photodiode. Can be used. The light emitting element 30, the first light receiving element 31, and the second light receiving element 32 may be appropriately selected depending on the type of the object to be measured, the type of parameter to be measured, and the like. The first light receiving element 31 and the second light receiving element 32 are the same. Different types of photodiodes may be used, and different types of photodiodes may be used.

血流を測定する場合は、例えば、光のドップラー効果を利用して測定するために、発光素子３０であるＶＣＳＥＬとして波長が８５０ｎｍのレーザ光を出射可能なものであればよい。その他の測定を行う場合は、測定目的に応じた波長のレーザ光を出射する発光素子３０を選択すればよい。第１受光素子３１および第２受光素子３２は、受光する光が発光素子３０から出射されるレーザ光から波長の変化が無い場合、発光素子３０の出射光を受光できるものであればよく、波長の変化が有る場合、変化後の波長の光を受光できるものであればよい。   When measuring blood flow, for example, in order to measure using the Doppler effect of light, the VCSEL that is the light emitting element 30 may emit laser light having a wavelength of 850 nm. When performing other measurements, the light emitting element 30 that emits laser light having a wavelength according to the measurement purpose may be selected. The first light receiving element 31 and the second light receiving element 32 only need to be capable of receiving the light emitted from the light emitting element 30 when the received light has no change in wavelength from the laser light emitted from the light emitting element 30. If there is a change, it is sufficient that the light having the wavelength after the change can be received.

発光素子３０、第１受光素子３１および第２受光素子３２と電極パッド２３ａとは、本実施形態では、例えば、ボンディングワイヤ３３によって電気的に接続されるが、フリップチップ接続、バンプ接続、異方性導電フィルムを用いた接続等他の接続方法であってもよい。   In the present embodiment, the light emitting element 30, the first light receiving element 31, the second light receiving element 32 and the electrode pad 23a are electrically connected by, for example, the bonding wire 33, but flip chip connection, bump connection, anisotropic Other connection methods such as connection using a conductive film may be used.

計測センサ１００は、外部実装基板に実装されて使用される。外部実装基板には、例えば、発光素子３０の発光を制御する制御素子、第１受光素子３１および第２受光素子３２の出力信号から血流速度等を算出する演算素子等も実装される。   The measurement sensor 100 is used by being mounted on an external mounting board. On the external mounting board, for example, a control element that controls light emission of the light emitting element 30, an arithmetic element that calculates a blood flow velocity and the like from output signals of the first light receiving element 31 and the second light receiving element 32 are mounted.

測定する場合には、使用者の手首を蓋体３の表面に接触させた状態で、外部実装基板から外部接続端子２３ｃを介して発光素子制御電流が計測センサ１００に入力され、信号ビア導体２３ｂ、電極パッド２３ａを通って発光素子３０に入力されて発光素子３０から計測用の光が出射される。出射された光が、蓋体３を透過して手首に照射されると、橈骨動脈を流れる血液中の血球細胞で光が散乱される。蓋体３を透過し、第１絞り孔５ａを通過した散乱光が、第１受光素子３１で受光され、第２絞り孔５ｂを通過した散乱光が、第２受光素子で受光されると、受光量に応じた電気信号が第１受光素子３１および第２受光素子３２から出力される。出力された信号は、電極パッド２３ａ、信号ビア導体２３ｂを通り、外部接続端子２３ｃを介して計測センサ１００から外部実装基板へと出力される。   In measurement, the light emitting element control current is input to the measurement sensor 100 from the external mounting substrate through the external connection terminal 23c with the user's wrist in contact with the surface of the lid 3, and the signal via conductor 23b. Then, the light is input to the light emitting element 30 through the electrode pad 23a, and the light for measurement is emitted from the light emitting element 30. When the emitted light passes through the lid 3 and is applied to the wrist, the light is scattered by blood cells in the blood flowing through the radial artery. When the scattered light that has passed through the lid 3 and passed through the first aperture 5a is received by the first light receiving element 31, and the scattered light that has passed through the second aperture 5b is received by the second light receiving element, An electrical signal corresponding to the amount of received light is output from the first light receiving element 31 and the second light receiving element 32. The output signal passes through the electrode pad 23a and the signal via conductor 23b, and is output from the measurement sensor 100 to the external mounting board via the external connection terminal 23c.

外部実装基板では、計測センサ１００から出力された信号が、演算素子に入力され、例えば、発光素子３０から出射された光である照射光の周波数と、第２受光素子３２が受光した光である散乱光の周波数とに基づき、さらに第１受光素子３１が受光した散乱光の周波数によって補正を行い、橈骨動脈の血流速度を算出することができる。   In the external mounting substrate, the signal output from the measurement sensor 100 is input to the arithmetic element, and is, for example, the frequency of irradiation light that is light emitted from the light emitting element 30 and the light received by the second light receiving element 32. Based on the frequency of the scattered light, the blood flow velocity of the radial artery can be calculated by further correcting the frequency of the scattered light received by the first light receiving element 31.

計測センサ１００は、計測センサ用パッケージ１を備えることにより、動脈の血流を高精度に測定することができる。計測センサ１００が、計測センサ用パッケージ１Ａ、計測センサ用パッケージ１Ｂ、または計測センサ用パッケージ１Ｃを備える場合であっても、動脈の血流を高精度に測定することが可能である。   By providing the measurement sensor package 1, the measurement sensor 100 can measure the blood flow of the artery with high accuracy. Even when the measurement sensor 100 includes the measurement sensor package 1A, the measurement sensor package 1B, or the measurement sensor package 1C, the blood flow of the artery can be measured with high accuracy.

なお、上記の各実施形態では、信号ビア導体２３ｂは、基体本体２０内で厚み方向に一直線状に配設される構成としているが、電極パッド２３ａの直下から基体２の第２面２２の外部接続端子２３ｃまで電気的に接続されていれば、一直線状でなく、基体本体２０内で、内層配線や内部接地導体層等によってずれて形成されていてもよい。   In each of the embodiments described above, the signal via conductors 23b are arranged in a straight line in the thickness direction in the base body 20, but the outside of the second surface 22 of the base body 2 directly below the electrode pads 23a. As long as it is electrically connected to the connection terminal 23c, it may be formed not in a straight line but in the base body 20 by being shifted by an inner layer wiring, an inner ground conductor layer, or the like.

１，１Ａ，１Ｂ，１Ｃ 計測センサ用パッケージ
２ 基体
３ 蓋体
３ａ 対向面
４ 表層接地導体層
５ 金属薄層
５ａ 第１絞り孔
５ｂ 第２絞り孔
６ 導電性接合材
２０ 基体本体
２０ａ 発光素子収容凹部
２０ｂ 第１受光素子収容凹部
２０ｃ 第２受光素子収容凹部
２０ｄ 第３受光素子収容凹部
２０ｅ 第４受光素子収容凹部
２１ 第１面
２１ 面
２２ 第２面
２３ 信号配線導体
２３ａ 電極パッド
２３ｂ 信号ビア導体
２３ｃ 外部接続端子
２４ 外部接地端子
２６ 接地ビア導体
３０ 発光素子
３１ 第１受光素子
３２ 第２受光素子
３３ ボンディングワイヤ
１００ 計測センサ
２００ 底面
２０１ 段差部
２０２ 段差面
２０３ 第１底面
２０４ 第１段差部
２０５ 第１段差面
２０６ 第２底面
２０７ 第２段差部
２０８ 第２段差面 1, 1A, 1B, 1C Measurement sensor package 2 Base 3 Lid 3a Opposing surface 4 Surface ground conductor layer 5 Metal thin layer 5a First throttle hole 5b Second throttle hole 6 Conductive bonding material 20 Base body 20a Light emitting element accommodation Recess 20b First light receiving element receiving recess 20c Second light receiving element receiving recess 20d Third light receiving element receiving recess 20e Fourth light receiving element receiving recess 21 First surface 21 Surface 22 Second surface 23 Signal wiring conductor 23a Electrode pad 23b Signal via conductor 23c external connection terminal 24 external ground terminal 26 ground via conductor 30 light emitting element 31 first light receiving element 32 second light receiving element 33 bonding wire 100 measuring sensor 200 bottom surface 201 stepped portion 202 stepped surface 203 first bottom surface 204 first stepped portion 205 first 1 step surface 206 second bottom surface 207 second step portion 208 second step surface

Claims (6)

複数の誘電体層が積層されて成る、板状の基体と、
前記基体の１つの面を覆う、光透過性を有する板状の蓋体と、を含み、
前記基体の前記１つの面には、発光素子を収容する発光素子収容凹部、第１受光素子を収容する第１受光素子収容凹部および第２受光素子を収容する第２受光素子収容凹部が設けられ、
前記発光素子収容凹部からの距離が、前記第２受光素子収容凹部の方が、前記第１受光素子収容凹部よりも遠く、
前記基体の前記１つの面からの深さが、前記第２受光素子収容凹部の方が、前記第１受光素子収容凹部よりも浅いことを特徴とする計測センサ用パッケージ。 A plate-like substrate formed by laminating a plurality of dielectric layers;
A plate-shaped lid body that covers one surface of the substrate and has light transmissivity,
The one surface of the base is provided with a light emitting element accommodating recess for accommodating a light emitting element, a first light receiving element accommodating recess for accommodating a first light receiving element, and a second light receiving element accommodating recess for accommodating a second light receiving element. ,
The distance from the light emitting element housing recess is such that the second light receiving element housing recess is farther than the first light receiving element housing recess,
The measurement sensor package characterized in that the depth of the base from the one surface is shallower in the second light receiving element receiving recess than in the first light receiving element receiving recess. 前記発光素子収容凹部、前記第１受光素子収容凹部および前記第２受光素子収容凹部は、平面視において、前記発光素子収容凹部の中心、前記第１受光素子収容凹部の中心および前記第２受光素子収容凹部の中心が、一直線上に並ぶように設けられていることを特徴とする請求項１記載の計測センサ用パッケージ。   The light receiving element accommodating recess, the first light receiving element accommodating recess, and the second light receiving element accommodating recess are, in plan view, the center of the light emitting element accommodating recess, the center of the first light receiving element accommodating recess, and the second light receiving element. The measurement sensor package according to claim 1, wherein the centers of the housing recesses are arranged in a straight line. 前記発光素子収容凹部、前記第１受光素子収容凹部および前記第２受光素子収容凹部は、平面視において、前記第１受光素子収容凹部が、前記発光素子収容凹部と前記第２受光素子収容凹部との間に位置しているとともに、前記第１受光素子収容凹部の中心が、前記発光素子収容凹部の中心と前記第２受光素子収容凹部の中心とを結ぶ直線から離れるように設けられていることを特徴とする請求項１記載の計測センサ用パッケージ。   The light receiving element accommodating recess, the first light receiving element accommodating recess, and the second light receiving element accommodating recess are, when seen in plan view, the first light receiving element accommodating recess, the light emitting element accommodating recess, and the second light receiving element accommodating recess. And the center of the first light receiving element receiving recess is provided away from a straight line connecting the center of the light receiving element receiving recess and the center of the second light receiving element receiving recess. The measurement sensor package according to claim 1. 前記蓋体の、前記基体の前記１つの面に対向する面に設けられる金属薄層であって、前記第１受光素子によって受光される光を規制する第１絞り孔および前記第２受光素子によって受光される光を規制する第２絞り孔が設けられている金属薄層をさらに含み、
平面視において、前記第１絞り孔は、前記第１受光素子収容凹部の前記中心を基準として前記第２受光素子収容凹部とは反対側に設けられており、前記第２絞り孔は、前記第２受光素子収容凹部の前記中心を基準として前記第１受光素子収容凹部とは反対の側に設けられていることを特徴とする請求項１〜３のいずれか１項に記載の計測センサ用パッケージ。 A thin metal layer provided on a surface of the lid that faces the one surface of the base body, and includes a first aperture hole that restricts light received by the first light receiving element and a second light receiving element. It further includes a thin metal layer provided with a second aperture hole for restricting received light,
In a plan view, the first aperture hole is provided on the opposite side of the second light receiving element accommodating recess with respect to the center of the first light receiving element accommodating recess, and the second aperture hole is the first aperture hole. The measurement sensor package according to any one of claims 1 to 3, wherein the package is provided on a side opposite to the first light receiving element receiving recess with reference to the center of the two light receiving element receiving recesses. . 前記第１受光素子収容凹部の内側面には、前記第１受光素子と電気的に接続される電極パッドが配設される第１段差面を有する第１段差部が設けられており、
前記第２受光素子収容凹部の内側面には、前記第２受光素子と電気的に接続される電極パッドが配設される第２段差面を有する第２段差部が設けられており、
平面視において、前記第１段差部は、前記第１受光素子収容凹部の前記中心を基準として前記第２受光素子収容凹部の側に設けられており、前記第２段差部は、前記第２受光素子収容凹部の前記中心を基準として前記第１受光素子収容凹部の側に設けられていることを特徴とする請求項１〜４のいずれか１項に記載の計測センサ用パッケージ。 A first step portion having a first step surface on which an electrode pad electrically connected to the first light receiving element is provided is provided on the inner side surface of the first light receiving element housing recess,
A second step portion having a second step surface on which an electrode pad electrically connected to the second light receiving element is provided is provided on the inner side surface of the second light receiving element housing recess,
In plan view, the first step portion is provided on the second light receiving element receiving recess side with respect to the center of the first light receiving element receiving recess, and the second step portion is the second light receiving portion. 5. The measurement sensor package according to claim 1, wherein the measurement sensor package is provided on a side of the first light receiving element receiving recess with respect to the center of the element receiving recess. 請求項１〜５のいずれか１つに記載の計測センサ用パッケージと、
前記発光素子収容凹部に収容される発光素子と、
前記第１受光素子収容凹部に収容される第１受光素子と、
前記第２受光素子収容凹部に収容される第２受光素子と、を含むことを特徴とする計測センサ。 The measurement sensor package according to any one of claims 1 to 5,
A light emitting element accommodated in the light emitting element accommodating recess;
A first light receiving element housed in the first light receiving element housing recess;
A second light receiving element housed in the second light receiving element housing recess.
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