JP2014120664A - Peeling assist method and peeling assist device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a peeling assist method and a peeling assist device capable of assisting the peeling of a peeled layer cleanly, while suppressing damage on the peeled layer.SOLUTION: A device 83 is formed on a polyimide film 82 stuck to a glass substrate 81 transmitting the flash light. The boundary surface of the glass substrate 81 and polyimide film 82 having different linear expansion coefficients is irradiated with flash light and heated, and a shear stress is generated in a direction parallel with the boundary surface, by utilizing the fact that the degree of thermal expansion is different. Binding power of the boundary surface of the glass substrate 81 and polyimide film 82 decreases due to action of the shear stress, and thereby the peeled layer, i.e., the polyimide film 82, can be peeled easily from the glass substrate 81 with a small stress. Consequently, the polyimide film 82 can be peeled cleanly while physical damage on the polyimide film 82 and the device 83 formed thereon is minimized.

Description

  The present invention relates to a peeling assistance method and a peeling assistance apparatus for assisting the peeling of a layer to be peeled attached on a substrate that transmits flash light.

  In recent years, with the practical application of electronic paper, attempts have been made to form semiconductor devices such as TFT elements on flexible resin films such as polyimide. Since a flexible resin film is difficult to handle as it is, for example, a resin film is formed on a glass substrate, and a device is formed on the resin film. Use of a glass substrate as a base material is advantageous because existing process technology and equipment such as FPD (Flat Panel Display) manufacturing applications can be used. And after the process for device formation is complete | finished, the resin film is peeled from the glass substrate.

  As such a peeling technique, a process technology called EPLaR (Electronics on Plastic by Laser Release) has been developed that peels the resin film by ablation that occurs when laser light is scanned and irradiated to the interface between the glass substrate and the resin film. (For example, refer to Patent Document 1). After the laser light irradiation, only the resin film is conveyed by a Bernoulli chuck or the like. In addition, the resin film is mechanically peeled from the glass substrate by gripping the end of the resin film.

JP 2003-163338 A

  However, when the laser beam is scanned and irradiated when the resin film is peeled from the glass substrate, the laser beam is repeatedly irradiated, and thus unevenness is likely to occur. In addition, there is a problem of dust caused by ablation that occurs when laser light is irradiated. Furthermore, when the resin film is mechanically peeled from the glass substrate, there is a possibility of damaging a device formed on the resin film. In particular, depending on the type of the resin film, the adhesion between the glass substrate and the resin film is considerably high, so that the resin film itself may be damaged if the resin film is forcibly peeled off.

  The present invention has been made in view of the above problems, and provides a peeling assist method and a peeling assist device that can assist in cleanly peeling the peeled layer while suppressing damage to the peeled layer. With the goal.

  In order to solve the above-mentioned problems, the invention of claim 1 is directed to a peeling assisting method for assisting in peeling of a layer to be peeled that is attached to a substrate that transmits flash light. Unlike the linear expansion coefficient, the bonding force of the interface is obtained by irradiating flash light from the substrate side and applying a shear stress in a direction parallel to the interface to the interface between the substrate and the layer to be peeled. It is characterized by lowering.

  According to a second aspect of the present invention, in the peeling assist method according to the first aspect of the present invention, only the edge portions of the substrate and the layer to be peeled are irradiated with flash light.

  According to a third aspect of the present invention, in the peeling assist method according to the first aspect of the present invention, a light absorption layer having a flash light absorption rate of a predetermined value or more is provided at an edge of the substrate and / or the layer to be peeled. It is characterized by that.

  According to a fourth aspect of the present invention, in the peeling assist method according to any one of the first to third aspects of the present invention, the atmosphere around the substrate to which the layer to be peeled is affixed is reduced to the interface. It is characterized by expanding the existing bubbles.

  The invention according to claim 5 is the peeling assist method according to any one of claims 1 to 4, wherein the substrate is a glass substrate and the layer to be peeled is a resin layer. .

  According to a sixth aspect of the present invention, there is provided a peeling assisting device for assisting in peeling of a layer to be peeled that is attached to a substrate that transmits flash light, and a linear expansion coefficient of the substrate and a linear expansion coefficient of the peeled layer Are different from each other, a chamber that houses the substrate and the layer to be peeled, a holding unit that holds the substrate to which the layer to be peeled is attached, and the substrate that is held by the holding unit. A flash lamp that irradiates flash light to the layer to be peeled from the side of the substrate, and a part of the flash light emitted from the flash lamp is shielded to only the edge of the substrate and the layer to be peeled. A light shielding member for guiding flash light.

  According to a seventh aspect of the present invention, in the peeling auxiliary device according to the sixth aspect of the present invention, the flash lamp is disposed only at a position facing the edge of the substrate and the layer to be peeled.

  The invention according to claim 8 is the peeling assisting device according to claim 6 or claim 7, further comprising a decompression means for decompressing the atmosphere in the chamber.

  The invention according to claim 9 is the peeling assist device according to any one of claims 6 to 8, wherein the substrate is a glass substrate and the layer to be peeled is a resin layer. .

  According to the invention of claim 1 to claim 5, unlike the linear expansion coefficient of the substrate and the linear expansion coefficient of the layer to be peeled, the flash light is irradiated from the substrate side to the interface between the substrate and the layer to be peeled. In order to reduce the bonding force at the interface by applying a shear stress in a direction parallel to the interface, the adhesion between the substrate and the layer to be peeled is weakened and the damage given to the layer to be peeled is suppressed, and the film is peeled cleanly. Delamination can be assisted.

  In particular, according to the second aspect of the present invention, only the edge of the substrate and the layer to be peeled is irradiated with flash light, so that the device formed in the region inside the edge is thermally damaged. Can be prevented.

  In particular, according to the invention of claim 4, the atmosphere around the substrate to which the layer to be peeled is attached is reduced in pressure, and bubbles existing at the interface are expanded, so that the adhesion between the substrate and the layer to be peeled is further weakened. be able to.

  According to the invention of claim 6 to claim 9, a flash lamp that irradiates flash light from the substrate side to the substrate and the layer to be peeled held by the holding portion, and flash light emitted from the flash lamp. A light shielding member that shields a part of the substrate and guides flash light only to the edge of the substrate and the layer to be peeled, and in a direction parallel to the interface at the edge of the interface between the substrate and the layer to be peeled It is possible to cleanly assist the peeling of the layer to be peeled while reducing the bonding force at the interface by applying the shear stress of the above and suppressing damage to the layer to be peeled. Further, it is possible to prevent thermal damage to the device formed in the region inside the edge portion.

  In particular, according to the eighth aspect of the present invention, since the pressure reducing means for depressurizing the atmosphere in the chamber is further provided, the bubbles existing at the interface between the substrate and the layer to be peeled are expanded to adhere the substrate and the layer to be peeled. Can be further weakened.

It is a figure which shows the principal part structure of the peeling assistance apparatus which concerns on this invention. It is a flowchart which shows the process sequence in a peeling assistance apparatus. It is sectional drawing which shows the structure of a to-be-processed object. It is a figure which shows the state by which flash light was irradiated to the to-be-processed object. It is a figure which shows an example of a mode that the polyimide film | membrane which is a layer to be peeled is peeled from a glass substrate. It is a figure which shows the principal part structure of the peeling auxiliary | assistance apparatus of 2nd Embodiment. It is the top view which looked at the light-shielding plate from upper direction. It is a top view of the to-be-processed object in which the light absorption layer was formed. It is a figure which shows the state by which flash light was irradiated to the to-be-processed object in 3rd Embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<First Embodiment>
FIG. 1 is a diagram showing a main configuration of a peeling assist device 1 according to the present invention. The peeling assisting device 1 is a device that assists the peeling of the resin film by irradiating flash light onto the object 8 having a resin film stuck on the glass substrate. The peeling assisting apparatus 1 includes, as main elements, a chamber 10 that houses the object 8 to be processed, a holding plate 20 that holds the object 8 to be processed, and a flash light source 70 that irradiates the object 8 with flash light. . Moreover, the peeling assistance apparatus 1 is provided with the control part 3 which advances the process by controlling various operation mechanisms provided in the apparatus. In FIG. 1 and the subsequent drawings, the size and number of each part are exaggerated or simplified as necessary for easy understanding.

  The chamber 10 is provided below the flash light source 70, and includes a chamber side wall 11 and a chamber bottom 12. The chamber bottom 12 covers the lower part of the chamber side wall 11. A space surrounded by the chamber side wall 11 and the chamber bottom 12 is defined as a processing space 15. A chamber window 18 is attached to the upper opening of the chamber 10 to close it.

  The chamber window 18 constituting the ceiling portion of the chamber 10 is a plate-like member formed of quartz, and functions as a quartz window that transmits the light emitted from the flash light source 70 to the processing space 15. The chamber side wall 11 and the chamber bottom 12 constituting the main body of the chamber 10 are formed of a metal material having excellent strength and heat resistance such as stainless steel, for example.

  Further, in order to maintain the airtightness of the processing space 15, the chamber window 18 and the chamber side wall 11 are sealed by an O-ring (not shown). That is, an O-ring is sandwiched between the peripheral edge of the lower surface of the chamber window 18 and the chamber side wall 11 to prevent gas from flowing in and out from these gaps.

  A holding plate 20 is provided inside the chamber 10. The holding plate 20 is a flat plate member made of metal (for example, aluminum). A plurality of support pins 22 are provided on the upper surface of the holding plate 20. The holding plate 20 supports the object 8 to be processed by a plurality of support pins 22 in the chamber 10 and holds it in a substantially horizontal posture. The support pin 22 may be movable up and down by a lift drive mechanism (not shown) (for example, an air cylinder).

  In addition, the holding plate 20 includes a heater 21. The heater 21 is configured by a resistance heating wire such as a nichrome wire, and generates heat when receiving power supply from a power supply source (not shown) to heat the holding plate 20. In addition to the heater 21, the holding plate 20 may be provided with a cooling mechanism such as a water cooling tube.

  The holding plate 20 is provided with a temperature sensor (not shown) configured using a thermocouple. The temperature sensor measures the temperature near the upper surface of the holding plate 20, and the measurement result is transmitted to the control unit 3. The control unit 3 controls the output of the heater 21 based on the measurement result by the temperature sensor, and sets the holding plate 20 to a predetermined temperature. The object to be processed 8 held on the holding plate 20 is heated to a predetermined temperature by the heater 21 of the holding plate 20.

Further, the peeling assist device 1 includes a gas supply mechanism 40 that supplies a processing gas to the processing space 15 in the chamber 10 and an exhaust mechanism 50 that exhausts the atmosphere from the processing space 15. The gas supply mechanism 40 includes a processing gas supply source 41, a supply pipe 42 and a supply valve 43. The distal end side of the supply pipe 42 is connected to the processing space 15 in the chamber 10, and the proximal end side is connected to the processing gas supply source 41. A supply valve 43 is provided in the course of the supply pipe 42. By opening the supply valve 43, the processing gas is supplied from the processing gas supply source 41 to the processing space 15. The processing gas supply source 41 can supply an appropriate processing gas according to the type of the object to be processed 8 and the processing purpose. In the present embodiment, the processing gas supply source 41 supplies nitrogen gas (N ₂ ).

  The exhaust mechanism 50 includes an exhaust device 51, an exhaust pipe 52, and an exhaust valve 53. The distal end side of the exhaust pipe 52 is connected to the processing space 15 in the chamber 10, and the proximal end side is connected to the exhaust device 51. An exhaust valve 53 is provided in the course of the exhaust pipe 52. The exhaust device 51 includes, for example, a dry pump and a throttle valve. By opening the exhaust valve 53 while operating the exhaust device 51, the atmosphere of the processing space 15 can be exhausted outside the device. The atmosphere of the processing space 15 can be adjusted by the gas supply mechanism 40 and the exhaust mechanism 50. In addition, since the processing space 15 is a sealed space, if the atmosphere is exhausted by the exhaust mechanism 50 without supplying the processing gas from the gas supply mechanism 40, the atmosphere in the processing space 15 is reduced to below atmospheric pressure. Can do.

  The flash light source 70 is provided above the chamber 10. The flash light source 70 includes a plurality of flash lamps FL (11 for convenience of illustration in FIG. 1, but is not limited thereto), a reflector 72 provided so as to cover the entire upper part, It is configured with. The flash light source 70 emits flash light from the flash lamp FL through the quartz chamber window 18 to the object 8 held by the holding plate 20 in the chamber 10.

  The plurality of flash lamps FL are rod-shaped lamps each having a long cylindrical shape, and are arranged in a plane so that their longitudinal directions are parallel to each other along the horizontal direction. In the present embodiment, a xenon flash lamp is used as the flash lamp FL. The xenon flash lamp FL has a rod-shaped glass tube (discharge tube) in which xenon gas is sealed and an anode and a cathode connected to a capacitor at both ends thereof, and an outer peripheral surface of the glass tube. A trigger electrode. Since xenon gas is an electrical insulator, electricity does not flow into the glass tube under normal conditions even if electric charges are accumulated in the capacitor. However, when the insulation is broken by applying a high voltage to the trigger electrode, the electricity stored in the capacitor instantaneously flows into the glass tube due to the discharge between the electrodes at both ends, and the excitation of the xenon atoms or molecules at that time Light is emitted. In such a xenon flash lamp FL, the electrostatic energy stored in the condenser in advance is converted into an extremely short light pulse of 0.1 to 100 milliseconds, which is extremely in comparison with a continuously lit lamp. It has the feature that it can irradiate strong light.

  Further, the reflector 72 is provided above the plurality of flash lamps FL so as to cover all of them. The basic function of the reflector 72 is to reflect flash light emitted from a plurality of flash lamps FL toward the processing space 15.

  The control unit 3 controls the various operation mechanisms provided in the peeling assist device 1. The configuration of the control unit 3 as hardware is the same as that of a general computer. That is, the control unit 3 stores a CPU that performs various arithmetic processes, a ROM that is a read-only memory that stores basic programs, a RAM that is a readable and writable memory that stores various information, control software, data, and the like. It is configured with a magnetic disk. When the CPU of the control unit 3 executes a predetermined processing program, the processing in the peeling assisting device 1 proceeds.

  In addition to the above configuration, the peeling assisting device 1 is appropriately provided with various components. For example, the chamber side wall 11 is formed with a transfer opening for loading and unloading the workpiece 8. Further, in order to prevent an excessive temperature rise due to light irradiation from the flash lamp FL, a water cooling tube may be provided on the chamber side wall 11. Further, the peeling assist device 1 is provided with a pressure gauge for measuring the atmospheric pressure in the chamber 10.

  Next, a processing procedure in the peeling assisting apparatus 1 having the above configuration will be described. FIG. 2 is a flowchart showing a processing procedure in the peeling assisting apparatus 1. The processing procedure of the peeling assisting device 1 described below proceeds by the control unit 3 controlling each operation mechanism of the peeling assisting device 1.

  First, the workpiece 8 is carried into the chamber 10 (step S1). The workpiece 8 may be carried in by a transfer robot outside the peeling assisting device 1 or manually. FIG. 3 is a cross-sectional view showing the structure of the workpiece 8. The object to be processed 8 of the present embodiment is configured by bonding a polyimide film 82 on the upper surface of a glass substrate 81. As a material of the glass substrate 81, for example, quartz glass can be used. The quartz glass substrate 81 transmits the flash light emitted from the flash lamp FL over almost the entire wavelength range. A polyimide film 82 is formed on the glass substrate 81 by applying a polyimide solution (strictly, a solution of polyamic acid) to the upper surface of the glass substrate 81, drying it, and imidizing it by heat treatment at a predetermined temperature. Although it depends on the type of polyimide, the adhesion between the polyimide film 82 formed by such a coating method and the glass substrate 81 is generally good.

  A device 83 is formed on the upper surface of the polyimide film 82. The coating formation of the polyimide film 82 and the formation of the device 83 are performed by equipment different from that of the peeling assisting apparatus 1. Since the polyimide film 82 is pasted on the glass substrate 81 which is a rigid substrate and the device 83 is formed on the polyimide film 82, the device can be formed using a lot of existing equipment. Then, after the device 83 is formed, the object 8 as shown in FIG. 3 is carried into the chamber 10.

  The workpiece 8 carried into the chamber 10 is placed and held on the holding plate 20 via the support pins 22 (step S2). Here, the workpiece 8 is held by the holding plate 20 with the surface on which the device 83 is formed facing downward, that is, with the glass substrate 81 facing upward. Further, the object 8 is supported by the plurality of support pins 22 by point contact and is held by the holding plate 20. The plurality of support pins 22 preferably support the edge portion of the glass substrate 81 where the device 83 is not formed.

  The holding plate 20 is preheated to a predetermined temperature by a built-in heater 21. The temperature of the holding plate 20 is controlled by the control unit 3. The object to be processed 8 including the polyimide film 82 on which the device 83 is formed is supported by the supporting plate 22 in proximity to the holding plate 20 by the object 8 having the polyimide film 82 attached to the glass substrate 81. The whole is heated. The temperature at which the workpiece 8 is heated is appropriately set within a range in which the device 83 is not thermally damaged. In order to increase the heating efficiency at this time, the height position of the workpiece 8 supported by the plurality of support pins 22 is preferably closer to the upper surface of the holding plate 20.

  Further, after the workpiece 8 is carried into the chamber 10 and the processing space 15 is closed, the inside of the chamber 10 is depressurized (step S3). That is, by exhausting by the exhaust mechanism 50 without supplying gas from the gas supply mechanism 40, the atmosphere of the processing space 15 in the chamber 10 is reduced to less than atmospheric pressure. At this time, if it is necessary to further reduce the oxygen partial pressure in the chamber 10, the inside of the chamber 10 is decompressed after supplying the nitrogen gas from the gas supply mechanism 40 to replace the processing space 15 with a nitrogen atmosphere. May be.

  After the workpiece 8 held on the holding plate 20 is heated to reach a predetermined temperature and the inside of the chamber 10 is reduced to below atmospheric pressure, a plurality of flashes of the flash light source 70 are controlled by the control unit 3. The lamps FL are turned on all at once (step S4). Flash light (including flash light reflected by the reflector 72) emitted from the flash lamp FL passes through the chamber window 18 and travels toward the object 8 to be processed held by the holding plate 20 in the processing space 15. The flash light emitted from the flash lamp FL is a very short and strong flash light whose irradiation time is about 0.1 milliseconds or more and 100 milliseconds or less, in which electrostatic energy stored in advance is converted into an extremely short light pulse. .

  FIG. 4 is a view showing a state in which flash light is irradiated on the object 8 to be processed. In the chamber 10, the workpiece 8 is held on the holding plate 20 with the glass substrate 81 facing upward. Flash light emitted from a flash lamp FL provided above the chamber 10 is irradiated from above the object 8 to be processed, that is, from the glass substrate 81 side. The glass substrate 81 transmits the flash light emitted from the flash lamp FL. As a result, the flash light passes through the upper glass substrate 81 and is irradiated onto the interface between the glass substrate 81 and the polyimide film 82. In the first embodiment, the flash light is irradiated to the entire surface of the object 8 to be processed.

  The interface between the glass substrate 81 and the polyimide film 82 absorbs flash light, rapidly increases in temperature, and then rapidly decreases in temperature. At this time, the temperature in the vicinity of the interface between both the glass substrate 81 and the polyimide film 82 rises. If the irradiation time is an extremely short flash light irradiation of about 0.1 milliseconds to 100 milliseconds, only the vicinity of the interface between the glass substrate 81 and the polyimide film 82 can be selectively heated. For this reason, the device 83 formed on the polyimide film 82 by flash light irradiation is prevented from being heated more than necessary and causing thermal damage.

  When the vicinity of the interface between the glass substrate 81 and the polyimide film 82 is rapidly heated by flash light irradiation, the vicinity of the interface between the glass substrate 81 and the polyimide film 82 is heated and thermally expanded. At this time, since the linear expansion coefficient is different between the glass substrate 81 and the polyimide film 82, the degree of expansion is different even if the temperature is increased to the same temperature. Although depending on the types of the glass substrate 81 and the polyimide film 82, in general, the linear expansion coefficient of the polyimide film 82 is significantly larger than that of the glass substrate 81 (several times or more).

  In addition, the polyimide film 82 in the vicinity of the interface is directly heated by the flash light irradiation (the glass substrate 81 transmits the flash light), and the glass substrate 81 is heated by the heat conduction from the heated polyimide film 82. Is done. Therefore, the ultimate temperature itself at the time of flash light irradiation is usually higher in the polyimide film 82 than in the glass substrate 81. For this reason, when the vicinity of the interface between the glass substrate 81 and the polyimide film 82 is heated by the flash light irradiation, the polyimide film 82 is more thermally expanded than the glass substrate 81. As a result, as indicated by an arrow AR4 in FIG. 4, the polyimide film 82 tends to extend larger than the glass substrate 81 along the direction parallel to the interface at the interface between the glass substrate 81 and the polyimide film 82. Shear stress acts.

  When such a shearing stress along the interface between the glass substrate 81 and the polyimide film 82 acts, the bonding force between the glass substrate 81 and the polyimide film 82 at the interface decreases. Thereby, peeling of the polyimide film 82 in the peeling process of step S7 described later becomes extremely easy. That is, the process in the peeling assist device 1 according to the present invention assists the peeling of the polyimide film 82 attached on the glass substrate 81.

  After the flash light irradiation on the workpiece 8 is completed, the exhaust by the exhaust mechanism 50 is stopped, and nitrogen gas is supplied from the gas supply mechanism 40 to the processing space 15 to return the pressure inside the chamber 10 to atmospheric pressure. (Step S5). Thereafter, the processed object 8 is unloaded from the chamber 10 (step S6). Thereby, a series of peeling assistance processing in the peeling assistance apparatus 1 is completed.

  The object 8 to be processed carried out from the chamber 10 is subjected to a peeling process of the polyimide film 82 (step S7). FIG. 5 is a diagram showing an example of a state in which the polyimide film 82 that is the layer to be peeled is peeled from the glass substrate 81. The end portion of the polyimide film 82 is peeled off and mechanically held by a holding member (not shown), and the holding member moves as shown by an arrow in FIG. The The shearing stress acting on the interface between the glass substrate 81 and the polyimide film 82 during flash light irradiation reduces the bonding force at the interface, and the adhesion between the glass substrate 81 and the polyimide film 82 is fragile. The polyimide film 82 can be easily peeled from the glass substrate 81. Instead of the gripping member, the polyimide film 82 may be peeled from the glass substrate 81 by winding the end of the polyimide film 82 around a drum and rotating the drum. Or you may make it peel from the glass substrate 81, attracting | sucking the polyimide film 82 with a Bernoulli chuck.

  In the first embodiment, the interface between the glass substrate 81 and the polyimide film 82 having different linear expansion coefficients is heated by irradiating flash light, and the degree of thermal expansion is different, so that the interface is parallel to the interface. Shear stress is generated along the direction. Due to the action of the shear stress, the bonding force at the interface between the glass substrate 81 and the polyimide film 82 is reduced, and the adhesion thereof is weakened. For this reason, at the peeling process of step S7, the polyimide film 82 which is a layer to be peeled can be easily peeled from the glass substrate 81 with a small stress. Therefore, the polyimide film 82 can be peeled while minimizing physical damage to the polyimide film 82 and the device 83 formed thereon.

  In the first embodiment, since the flash light is collectively irradiated to the entire surface of the interface between the glass substrate 81 and the polyimide film 82, the bonding force of the entire interface is lowered uniformly to weaken the adhesion. be able to. If flash light with an irradiation time of about 0.1 milliseconds to 100 milliseconds is collectively irradiated, the processing time can be significantly shortened as compared with the conventional laser light irradiation.

  In the first embodiment, since the bonding force at the interface is reduced by utilizing the difference in thermal expansion between the glass substrate 81 and the polyimide film 82 due to flash light irradiation, the conventional ablation by laser light irradiation, etc. In comparison, the generation of dust can be reduced. That is, by irradiating flash light onto the interface between the glass substrate 81 and the polyimide film 82 having different linear expansion coefficients, the damage to the polyimide film 82 as the layer to be peeled is suppressed and the layer to be peeled off is uniformly and cleanly. Can help.

  Further, peeling assistance by flash light irradiation is performed in an atmosphere of less than atmospheric pressure. When the interface between the glass substrate 81 and the polyimide film 82 is irradiated with flash light and heated, a trace amount of gas is generated from the interface. When a slight amount of gas is generated by irradiating the interface with flash light in a state where the atmosphere around the glass substrate 81 to which the polyimide film 82 as the layer to be peeled is attached is reduced in pressure, the surroundings are in a reduced pressure state. Gas bubbles will expand. As a result, the adhesion between the glass substrate 81 and the polyimide film 82 is further weakened, and the polyimide film 82 as the layer to be peeled can be peeled off from the glass substrate 81 more easily.

  Furthermore, in the first embodiment, the object to be processed 8 is heated to a temperature at which the device 83 is not thermally damaged by the heater 21 built in the holding plate 20 before the flash light irradiation. As a result, the bonding force at the interface between the glass substrate 81 and the polyimide film 82 decreases with the aid of thermal energy during flash light irradiation, and the adhesion between the glass substrate 81 and the polyimide film 82 can be further weakened. .

Second Embodiment
Next, a second embodiment of the present invention will be described. FIG. 6 is a diagram illustrating a main configuration of the peeling assist device 1a according to the second embodiment. In FIG. 6, the same elements as those in the first embodiment are denoted by the same reference numerals.

  The peeling assist device 1 a of the second embodiment includes a light shielding plate 60 in the chamber 10. FIG. 7 is a plan view of the light shielding plate 60 as viewed from above. The light shielding plate 60 is a plate member having a rectangular shape in plan view, and is fixedly installed in the chamber 10 by a support member (not shown). The light shielding plate 60 is formed of a material that does not transmit the flash light of the flash lamp FL (for example, a metal material such as aluminum having excellent resistance to the flash light). The light shielding plate 60 is installed above the holding plate 20 in the chamber 10 and is provided so as to cover most of the object 8 to be processed held by the holding plate 20.

  In the second embodiment, as shown in FIG. 7, a light shielding plate 60 is provided so that only one side of the edge of the rectangular object 8 held by the holding plate 20 is exposed to the upper flash light source 70. It has been. Here, the edge part of the to-be-processed object 8 is an area | region outside the area | region in which the device 83 is formed. That is, the device 83 is not formed over the entire surface of the polyimide film 82 adhered on the glass substrate 81, and is not formed in a region having a predetermined width from the end of the polyimide film 82 to the inside. Such an unnecessary region where the device 83 on the periphery of the polyimide film 82 is not formed is an edge portion, and the width thereof is 5 mm to 10 mm. In addition, the area | region of the glass substrate 81 corresponding to the edge part of the polyimide film 82 in which the device 83 is not formed is called the edge part of the glass substrate 81, and the area | region of the to-be-processed object 8 is the edge part of the to-be-processed object 8. Called.

  In the second embodiment, as shown in FIG. 6, the flash light source 70 includes one flash lamp FL. A reflector 72 is provided above the flash lamp FL. The flash lamp FL of the second embodiment is installed immediately above the edge of the workpiece 8 that is not covered by the light shielding plate 60. That is, the flash lamp FL is disposed only at a position facing the end edge of the object 8 exposed from the light shielding plate 60. For this reason, the flash light emitted from the flash lamp FL is applied only to the edge portion of the workpiece 8 that is not covered by the light shielding plate 60.

  The remaining configuration of the peeling assist device 1a excluding the light shielding plate 60 and the flash light source 70 is the same as that of the peeling assist device 1 of the first embodiment. Moreover, the processing procedure in the peeling assisting apparatus 1a of the second embodiment is substantially the same as that of the first embodiment (see FIG. 2).

  In the second embodiment, a part of the flash light emitted from the flash lamp FL is shielded by the light shielding plate 60 during the flash light irradiation in step S <b> 4, and the light shielding plate among the objects 8 to be processed held by the holding plate 20. The flash light is guided and irradiated only to the edge portion not covered with 60. Therefore, the flash light is applied only to the edge portion of the interface between the glass substrate 81 and the polyimide film 82, and only the edge portion is heated. Since the device 83 is not formed on the edge portion, in the second embodiment, flash light strong enough to heat the edge surface of the polyimide film 82 to a considerably high temperature may be irradiated.

  Since the glass substrate 81 and the polyimide film 82 have different linear expansion coefficients, if the edge of the interface between the glass substrate 81 and the polyimide film 82 is heated by being irradiated with flash light, it is caused by the difference in thermal expansion between them. The shear stress applied acts on the interface. By acting on this shear stress, the bonding force at the interface edge between the glass substrate 81 and the polyimide film 82 is lowered, and the edge of the polyimide film 82 is peeled off from the glass substrate 81. Also in the second embodiment, since flash light irradiation is performed in a reduced-pressure atmosphere less than atmospheric pressure, a small amount of gas bubbles generated at the interface edge due to heating expand, and the glass substrate 81 and the polyimide film The adhesiveness with 82 is further weakened, and the edge portion of the polyimide film 82 is surely peeled off.

  Thereafter, in the peeling step of step S7, the edge portion of the polyimide film 82 peeled off by flash light irradiation is mechanically held by the holding member, and the entire polyimide film 82 is removed from the glass substrate 81 in the same manner as in the first embodiment. Peel off.

  In the second embodiment, a part of the flash light is shielded by the light shielding plate 60, so that the flash light is irradiated only to the edge portion of the object 8 to be processed, and the edge of the interface between the glass substrate 81 and the polyimide film 82 is irradiated. Only the edge is heated. In general, the adhesion between the polyimide film 82 formed by the coating method and the glass substrate 81 tends to be stronger at the edge than in the vicinity of the center. Therefore, as in the second embodiment, only the edge portion of the interface between the glass substrate 81 and the polyimide film 82 is heated by flash light irradiation to reduce the bonding force, and the edge portion of the polyimide film 82 is changed to the glass substrate 81. If it is made to peel from, the polyimide film 82 which is a layer to be peeled can be easily peeled off from the glass substrate 81 in the peeling step of step S7.

  Further, as in the first embodiment, since the bonding force at the interface is reduced by utilizing the difference in thermal expansion between the glass substrate 81 and the polyimide film 82 caused by flash light irradiation, conventional ablation by laser light irradiation, etc. The generation of dust can be reduced compared to the above. Therefore, even in the second embodiment, it is possible to assist the peeling of the peeled layer cleanly while suppressing damage to the polyimide film 82 that is the peeled layer.

  In particular, in the second embodiment, only the edge portion of the object 8 to be processed, which is an unnecessary area where the device 83 is not formed, is heated by irradiating flash light, and thus the device 83 is thermally damaged. This can be surely prevented. Further, since it is not necessary to consider the thermal damage given to the device 83, the light emission intensity of the flash lamp FL can be considerably increased, and the edge portion of the polyimide film 82 is surely removed from the glass substrate 81 by the flash light irradiation. Can be peeled off.

<Third Embodiment>
Next, a third embodiment of the present invention will be described. The configuration of the peeling assist device of the third embodiment is exactly the same as that of the peeling assist device 1 of the first embodiment. The processing procedure in the third embodiment is also substantially the same as that in the first embodiment (see FIG. 2).

  In the third embodiment, the black light absorption layer 85 is formed on the edge of the glass substrate 81 before the object 8 is carried into the chamber 10. FIG. 8 is a plan view of the object 8 on which the light absorption layer 85 is formed as viewed from the glass substrate 81 side. A black light absorption layer 85 is formed on the surface of the glass substrate 81 at the edge of the rectangular object 8. Specifically, for example, the light absorbing layer 85 may be formed by applying a black paint to the surface edge of the glass substrate 81. In addition, the edge part of the to-be-processed object 8 is an area | region outside the area | region in which the device 83 is formed similarly to 2nd Embodiment. In the third embodiment, the light absorption layer 85 is formed on the end edges of all four sides of the rectangular object 8.

  The workpiece 8 having the light absorption layer 85 formed on the end edge is carried into the chamber 10 and held by the holding plate 20. The workpiece 8 is held by the holding plate 20 with the glass substrate 81 facing upward. Therefore, the light absorption layer 85 formed on the edge of the object 8 also faces upward.

  In the third embodiment, at the time of flash light irradiation in step S4, the entire surface of the workpiece 8 is irradiated with flash light as in the first embodiment. FIG. 9 is a diagram illustrating a state in which flash light is irradiated on the object 8 to be processed according to the third embodiment. Flash light emitted from a flash lamp FL provided above the chamber 10 is irradiated from above the object 8 to be processed, that is, from the glass substrate 81 side. Since the light absorption layer 85 is black, the received flash light is absorbed over the entire wavelength range. For this reason, at the edge of the object 8 to be processed, the temperature of the light absorption layer 85 is remarkably increased by flash light irradiation, and the edge of the interface between the glass substrate 81 and the polyimide film 82 due to heat conduction from the light absorption layer 85. The edges are heated intensively. In the region inside the edge of the object 8 to be processed, the interface between the glass substrate 81 and the polyimide film 82 is heated by the flash light transmitted through the glass substrate 81 as in the first embodiment. The interface edge portion provided with the black light absorption layer 85 is heated more strongly than the inner region.

  Since the linear expansion coefficient is different between the glass substrate 81 and the polyimide film 82, when the flash light is irradiated to the interface between the glass substrate 81 and the polyimide film 82 and heated, the shear stress due to the difference in thermal expansion between them is Acts on the interface. In the third embodiment, in particular, since the edge portion of the interface between the glass substrate 81 and the polyimide film 82 is intensively heated, a strong shear stress acts on the edge portion of the interface. Due to the action of this strong shear stress, the bonding force at the interface edge between the glass substrate 81 and the polyimide film 82 is reduced, and the edge of the polyimide film 82 is peeled off from the glass substrate 81. Also in the third embodiment, since flash light irradiation is performed in a reduced-pressure atmosphere less than atmospheric pressure, a small amount of gas bubbles generated at the interface edge due to heating expand and the glass substrate 81 and the polyimide film The adhesiveness with 82 is further weakened, and the edge portion of the polyimide film 82 is surely peeled off.

  Thereafter, in the peeling step of step S7, the edge portion of the polyimide film 82 peeled off by flash light irradiation is mechanically held by the holding member, and the entire polyimide film 82 is removed from the glass substrate 81 in the same manner as in the first embodiment. Peel off.

  In the third embodiment, a black light absorption layer 85 is formed on the edge of the glass substrate 81 of the object 8 to be processed, and the flash light is irradiated from the flash lamp FL to the object 8 to be processed. The black light absorption layer 85 having a high light absorption rate is remarkably heated by flash light irradiation, and the edge of the interface between the glass substrate 81 and the polyimide film 82 is intensively heated by heat conduction from the light absorption layer 85. Is done. As described above, the adhesion between the polyimide film 82 formed by the coating method and the glass substrate 81 tends to be stronger at the edge than in the vicinity of the center. Therefore, as in the third embodiment, the edge of the interface between the glass substrate 81 and the polyimide film 82 is intensively heated by flash light irradiation to reduce the bonding force, and the edge of the polyimide film 82 is made of glass. If it is made to peel from the board | substrate 81, the polyimide film 82 which is a to-be-separated layer can be easily peeled from the glass substrate 81 at the peeling process of step S7.

  Further, as in the first embodiment, since the bonding force at the interface is reduced by utilizing the difference in thermal expansion between the glass substrate 81 and the polyimide film 82 caused by flash light irradiation, conventional ablation by laser light irradiation, etc. The generation of dust can be reduced compared to the above. Therefore, even if it is like 3rd Embodiment, peeling of a to-be-separated layer can be assisted cleanly, suppressing the damage given to the polyimide film 82 which is to-be-separated layer.

<Modification>
While the embodiments of the present invention have been described above, the present invention can be modified in various ways other than those described above without departing from the spirit of the present invention. For example, in each of the above-described embodiments, the object 8 is formed by forming the device 83 on the polyimide film 82 attached to the glass substrate 81. However, the object 8 is not limited to this. Various variations are possible.

  For example, instead of the polyimide film 82, a material to which the other substrate material such as PEN (polyethylene naphthalate) or PET (polyethylene terephthalate) is attached is used as the object 8 to be processed, and the peeling assist device 1 according to the present invention. , 1a may assist the peeling of the resin layer. Even in this case, the interface between the glass substrate 81 and the resin layer having different linear expansion coefficients by flash light irradiation is heated, and the degree of their thermal expansion is utilized to make a difference along the direction parallel to the interface. This generates shear stress and reduces the bond strength at the interface.

  An intervening layer may be sandwiched between the glass substrate 81 and the resin layer such as the polyimide film 82. Examples of such intervening layers include functional layers such as adhesives and amorphous silicon. Even when an intervening layer is sandwiched between the glass substrate 81 and the resin layer, the interface between the intervening layer and the resin layer having different linear expansion coefficients is heated by flash light irradiation, and the degree of their thermal expansion By utilizing the fact that the two are different from each other and applying a shear stress to the interface to reduce the bonding force, it is possible to assist the peeling of the resin layer as the layer to be peeled.

  In the second embodiment, only one side of the edge of the rectangular object 8 is exposed to the flash light source 70 above, but two or more sides of the edge are exposed to the flash light source 70. A light shielding plate 60 may be provided so as to be exposed to the light. Even in this case, only the edge part of the interface between the glass substrate 81 and the polyimide film 82 is heated by flash light irradiation to reduce the bonding force, and the polyimide film 82 as the peeled layer can be easily peeled off from the glass substrate 81. can do.

  In the case where the light shielding plate 60 is provided so that two or more sides of the edge of the workpiece 8 are exposed, the flash lamp FL may be arranged according to the shape of the exposed edge. For example, when the light shielding plate 60 is provided so that the end edges of all four sides of the rectangular object 8 are exposed, four flash lamps FL are arranged in a square shape in the flash light source 70. That is, the flash lamp FL is disposed at a position facing the edge of the workpiece 8 exposed from the light shielding plate 60.

  In the second embodiment, a light shielding plate 60 is provided so that the edge of the object 8 is exposed, and a flash light source 70 in which a plurality of flash lamps FL similar to those in the first embodiment are arranged in parallel is provided. You may make it provide. Alternatively, the flash lamp FL may be disposed only at a position facing the edge of the object 8 without providing the light shielding plate 60.

  Further, in the third embodiment, the light absorption layer 85 is formed on the edge portions of all four sides of the rectangular object 8, but the light absorption layer 85 may be formed on one side or more of the edge portions. . Even in this case, the temperature of the light absorption layer 85 is remarkably increased by the flash light irradiation, and the edge of the interface between the glass substrate 81 and the polyimide film 82 is intensively heated by the heat conduction from the light absorption layer 85. As a result, the bonding force is reduced, and the polyimide film 82 as the layer to be peeled can be easily peeled from the glass substrate 81.

  In the third embodiment, the light absorption layer 85 is formed on the edge portion of the glass substrate 81. Instead, the black light absorption layer 85 is formed on the edge portion of the polyimide film 82. You may make it form. Alternatively, the black light absorption layer 85 may be formed on both edge portions of the glass substrate 81 and the polyimide film 82.

  Further, in the third embodiment, the light absorption layer 85 is not limited to black, and it is sufficient that the light absorption layer 85 is colored in a color having a flash light absorption rate equal to or greater than a predetermined value.

  Further, by making the arrangement area of the plurality of flash lamps FL provided in the flash light source 70 sufficiently larger than that of the object 8 to be processed, the illuminance of the flash light at the end edge of the object 8 to be processed is inside the edge. It may be made larger than this area. That is, if the arrangement area of the plurality of flash lamps FL is sufficiently larger than the object 8 to be processed, the number of flash lamps FL affecting the edge of the object 8 to be processed increases, and the flash light at the edge is increased. Illuminance will increase relatively. In this way, as in the third embodiment, the edge of the interface between the glass substrate 81 and the polyimide film 82 is intensively heated by the flash light irradiation, and the bonding force at the interface is reduced. Thus, the polyimide film 82 as the layer to be peeled can be easily peeled from the glass substrate 81. In order to obtain such an illuminance increasing effect at the edge of the object 8 to be processed, it is necessary that the arrangement area of the plurality of flash lamps FL be 1.2 times or more the area of the object 8 to be processed.

  Further, the second embodiment and the third embodiment may be combined. That is, the black light absorption layer 85 of the third embodiment may be formed on the edge of the object 8 exposed from the light shielding plate 60 of the second embodiment.

  In the above embodiment, the object to be processed 8 is heated by the heater 21 built in the holding plate 20 before the flash light irradiation, but the object to be processed 8 is heated by a halogen lamp instead of the heater 21. You may make it do. Heating with a halogen lamp is preferable when the distance between the workpiece 8 supported by the plurality of support pins 22 and the upper surface of the holding plate 20 is large, and heating with the heater 21 when the resin layer is transparent. preferable. Further, when the bonding force at the interface can be sufficiently reduced only by flash light irradiation, heating before flash light irradiation is not essential.

  In the above embodiment, the flash light source 70 is provided with the xenon flash lamp FL, but another rare gas flash lamp such as krypton may be used instead.

  The peeling assistance method and the peeling assistance apparatus according to the present invention can be applied to various objects to be peeled on a substrate, and in particular, flexible devices, flexible displays, and flat panels used for electronic paper and the like. It can be suitably used for displays (FPD), electronic devices, solar cells, fuel cells, semiconductor devices, and the like.

DESCRIPTION OF SYMBOLS 1,1a Peeling auxiliary | assistance apparatus 3 Control part 8 To-be-processed object 10 Chamber 15 Processing space 18 Chamber window 20 Holding plate 21 Heater 22 Support pin 40 Gas supply mechanism 50 Exhaust mechanism 60 Light-shielding plate 70 Flash light source 72 Reflector 81 Glass substrate 82 Polyimide film 83 Device 85 Light absorption layer FL Flash lamp

Claims (9)

A peeling assist method for assisting in peeling of a layer to be peeled attached on a substrate that transmits flash light,
Unlike the linear expansion coefficient of the substrate and the linear expansion coefficient of the layer to be peeled,
The bonding force of the interface is reduced by irradiating flash light from the substrate side and applying a shear stress in a direction parallel to the interface to the interface between the substrate and the layer to be peeled. Peeling assist method. In the peeling assistance method of Claim 1,
A peeling assist method, wherein flash light is irradiated only on an edge portion of the substrate and the layer to be peeled. In the peeling assistance method of Claim 1,
A peeling assisting method comprising providing a light absorption layer having a flash light absorption rate of a predetermined value or more at an edge of the substrate and / or the layer to be peeled. In the peeling auxiliary | assistance method in any one of Claims 1-3,
An exfoliation assisting method, comprising: depressurizing an atmosphere around the substrate to which the layer to be peeled is attached and expanding bubbles present at the interface. In the peeling assistance method in any one of Claims 1-4,
The substrate is a glass substrate;
The peeling assist method, wherein the layer to be peeled is a resin layer. A peeling auxiliary device for assisting in peeling of a layer to be peeled that is attached on a substrate that transmits flash light,
Unlike the linear expansion coefficient of the substrate and the linear expansion coefficient of the layer to be peeled,
A chamber for housing the substrate and the layer to be peeled;
In the chamber, a holding unit for holding the substrate to which the layer to be peeled is attached,
A flash lamp that irradiates flash light from the substrate side to the substrate and the layer to be peeled held by the holding unit;
A light shielding member that shields a part of the flash light emitted from the flash lamp and guides the flash light only to an edge portion of the substrate and the peeled layer;
A peeling assisting device comprising: The peeling auxiliary device according to claim 6,
A peeling assisting device, wherein a flash lamp is disposed only at a position facing the edge of the substrate and the layer to be peeled. In the peeling auxiliary | assistance apparatus of Claim 6 or Claim 7,
An exfoliation assisting device, further comprising decompression means for decompressing the atmosphere in the chamber. In the peeling auxiliary device according to any one of claims 6 to 8,
The substrate is a glass substrate;
The peeling assisting device, wherein the peelable layer is a resin layer.

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