TWI505332B - Heat treatment method and heat treatment device - Google Patents

Description

Heat treatment method and heat treatment device

The present invention relates to a heat treatment method and a heat treatment apparatus for heating a target object by irradiating light to a target object containing a resin as a substrate or an adhesive.

In the manufacturing process of a semiconductor device, impurity introduction is a necessary step for forming a pn junction in a semiconductor wafer. At present, the introduction of impurities is generally completed by an ion implantation method and an annealing method thereafter. The ion implantation method ionizes elements such as boron (B), arsenic (As), and phosphorus (P), and impinges on the semiconductor wafer at a high acceleration voltage, thereby physically performing impurities. Injection technology. The implanted impurities are activated by annealing treatment.

In recent years, with the further development of the miniaturization of semiconductor elements, a shallower bonding has been demanded, and attempts have been made to heat the impurities in a very short time by flash lamp annealing (FLA) to suppress diffusion and activate them. . However, in the flash lamp annealing, since the irradiation time is extremely short and the irradiation intensity is strong, there is a problem that the wafer is broken or it is difficult to obtain a uniform temperature distribution.

Therefore, Patent Documents 1 and 2 disclose a technique of providing a plate-like member whose transmittance is adjusted between a flash lamp and a wafer, and dimming a part or all of the flash from the flash.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-123807

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2009-260061

On the other hand, in recent years, thinner and softer electronic devices typified by electronic paper and the like have attracted attention. In the manufacturing process of such a flexible electronic device, annealing treatment of a target object having a functional layer such as an electrode on a surface layer of a substrate such as a resin is also required.

Previously, the annealing treatment of the object to be treated with the resin as a substrate was generally carried out in an oven at a lower temperature for several hours. Since the heat resistance of the resin is remarkably lower than that of the substrate of ruthenium or glass, it is necessary to set the temperature of the oven to a lower temperature.

However, depending on the type of soft electronic equipment that has been rapidly developed in recent years, it is sometimes necessary to heat the functional layer to the limit of the heat-resistant temperature of the resin. Further, depending on the type of the functional layer, if the annealing time is not set to be shorter than the heat treatment of the semiconductor wafer, the desired characteristics may not be obtained. Further, if the annealing time takes several hours, there is also a problem that productivity is inevitably lowered.

In order to solve such problems, it is considered that the flash lamp annealing is also applied to a target object using a resin as a substrate. If flash annealing is applied, the annealing time is extremely short, and it is also possible to selectively heat only the functional layer of the surface layer of the object to be treated.

However, in general, a resin material has a property of being easily deteriorated by irradiation of ultraviolet rays. Further, the emission spectrum of the xenon flash lamp is shifted from the ultraviolet region to the near-infrared region toward the short wavelength side from a halogen lamp or the like. Therefore, a new problem that the resin substrate is damaged by the light irradiation of the flash lamp is generated.

The present invention has been made in view of the above-described problems, and an object of the invention is to provide a heat treatment method and a heat treatment apparatus capable of performing light irradiation and heating on a target object without damaging the resin contained in the object to be processed.

In order to solve the problem, the invention of claim 1 is a heat treatment method for heating a target object by irradiating light to a target object including a resin, wherein the object to be processed is irradiated with light emitted from a light source. The light that cuts off the wavelength region of the above resin is cut off.

Further, the invention of claim 2 is the heat treatment method according to the invention of claim 1, wherein the ultraviolet light having a wavelength of 400 nm or less is cut off from the light emitted from the light source.

Further, the invention of claim 3 is the heat treatment method according to the invention of claim 2, wherein the ultraviolet light having a wavelength of 400 nm or less is cut by passing the light emitted from the light source through the filter.

The invention is the heat treatment method according to any one of the first to third aspects, wherein the object to be processed comprises a resin substrate.

In the heat treatment method according to any one of the first to third aspects of the invention, the object to be processed includes a structure in which a substrate is attached with a resin adhesive.

Further, the invention of claim 6 is a heat treatment apparatus for heating the object to be processed by irradiating light to the object to be processed containing the resin, characterized by comprising: a holding mechanism that holds the object to be processed; and a light source that is held by the object The object to be processed on the holding means irradiates light; and the filter is disposed between the holding means and the light source, and is cut off to damage the wavelength region of the resin.

Further, the invention of claim 7 is the heat treatment apparatus according to the invention of claim 6, wherein the filter cuts ultraviolet light having a wavelength of 400 nm or less.

The invention of claim 8 is the heat treatment apparatus according to the invention of claim 6, wherein the filter comprises a plate-like member in which colored water is sealed.

Further, the invention of claim 9 is the heat treatment apparatus of the invention of claim 6, wherein the light source comprises a flash lamp that illuminates the flash.

The heat treatment device according to any one of claims 6 to 9, wherein the object to be processed comprises a resin substrate.

The invention according to any one of claims 6 to 9, wherein the object to be processed comprises a structure in which a substrate is attached with a resin adhesive.

According to the inventions of the first aspect of the invention, since the light emitted from the light source is cut off from the light emitted from the light source, the light in the wavelength region of the resin is damaged, so that the light in the wavelength region can be suppressed from being absorbed by the resin, and the light can be prevented from being damaged. In the case of treating the resin contained in the body, the object to be processed is subjected to light irradiation and heating.

According to the inventions of the sixth aspect of the invention, since the filter which cuts the wavelength region of the resin is cut between the holding mechanism and the light source, the light having the wavelength region cut off is irradiated to the object to be processed, and the object can be damaged without being damaged. In the case of treating the resin contained in the body, the object to be processed is subjected to light irradiation and heating.

1‧‧‧ Heat treatment unit

8‧‧‧Processed body

9‧‧‧Control Department

10‧‧‧ chamber

11‧‧‧Cell wall

12‧‧‧Bottom of the chamber

15‧‧‧ Heat treatment space

18‧‧‧Case window

20‧‧‧ Keep board

21‧‧‧ heater

30‧‧‧heating light source

32‧‧‧ reflector

40‧‧‧ gas supply mechanism

41‧‧‧Processing gas supply

42‧‧‧Supply piping

43‧‧‧Supply valve

50‧‧‧Exhaust mechanism

51‧‧‧Exhaust device

52‧‧‧Exhaust piping

53‧‧‧Exhaust valve

60‧‧‧Optical filter

61‧‧‧ components

62‧‧‧ water

81‧‧‧Substrate

82‧‧‧ functional layer

83‧‧‧ glass substrate

84‧‧‧Adhesive

FL‧‧‧Flash

Fig. 1 is a view showing the configuration of a main part of a heat treatment apparatus of the present invention.

Fig. 2 is a flow chart showing the processing procedure of the object to be processed in the heat treatment apparatus of Fig. 1.

Fig. 3 is a cross-sectional view showing the structure of the object to be processed.

Fig. 4 is a view showing changes in temperature of a functional layer of a target object.

Fig. 5 is a view showing the radiation splitting distribution of a xenon flash lamp.

Fig. 6 is a view showing another example of the structure of the object to be processed.

Fig. 7 is a view showing the configuration of an optical filter using water.

Fig. 8 is a view showing another example of the arrangement of the flash lamps.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

Fig. 1 is a view showing the configuration of a main part of a heat treatment apparatus 1 of the present invention. In the heat treatment apparatus 1, the object to be processed 8 is heated by irradiating light to the object 8 to be processed with the resin as a base material. As a main component, the heat treatment apparatus 1 includes a chamber 10 that houses The object to be processed 8; a holding plate 20 that holds the object to be processed 8; a heating source 30 that illuminates the object to be processed 8; and an optical filter 60. Further, the heat treatment apparatus 1 includes a control unit 9 that controls and processes various operation mechanisms provided in the apparatus. Furthermore, in the drawings of Fig. 1 and subsequent figures, the size and number of each part are exaggerated or simplified as needed for easy understanding.

The chamber 10 is disposed below the heating source 30 and includes a chamber sidewall 11 and a chamber bottom 12. The chamber bottom 12 covers the lower portion of the chamber sidewall 11. The space surrounded by the chamber side wall 11 and the chamber bottom portion 12 is defined as the heat treatment space 15. Further, a chamber window 18 is attached to the upper portion of the chamber 10 to be closed.

The chamber window 18 constituting the ceiling portion of the chamber 10 is a plate-like member formed of quartz, and functions as a quartz window that transmits light irradiated from the heating source 30 through the heat treatment space 15. The chamber side wall 11 and the chamber bottom portion 12 constituting the body of the chamber 10 are formed of, for example, a metal material excellent in strength and heat resistance such as stainless steel.

Further, in order to maintain the airtightness of the heat treatment space 15, the chamber window 18 and the chamber side wall 11 are sealed by an O-ring (not shown). That is, an O-ring is interposed between the peripheral portion of the lower surface of the chamber window 18 and the chamber side wall 11 to prevent gas from flowing in and out from the gaps.

A retaining plate 20 is disposed inside the chamber 10. The holding plate 20 is a flat plate-shaped member made of metal (for example, made of aluminum). The holding plate 20 is placed in the chamber 10 to be placed on the object to be processed 8 and maintained in a horizontal state. Further, a heater 21 is built in the holding plate 20. The heater 21 is composed of a resistance heating wire such as a nichrome wire, and receives heat from a power supply source outside the drawing to generate heat, thereby heating the holding plate 20. Further, in the holding plate 20, in addition to the heater 21, a cooling mechanism such as a water-cooling tube may be provided.

The holding plate 20 is provided with a temperature sensor which is omitted from the illustration using a thermocouple. The temperature sensor measures the temperature in the vicinity of the upper surface of the holding plate 20, and transmits the measurement result to the control portion 9. The control unit 9 controls the output of the heater 21 based on the measurement result of the temperature sensor, and sets the holding plate 20 to a specific temperature. Retained on the retaining plate 20 The object to be processed 8 is heated to a specific temperature by the holding plate 20.

Further, the heat treatment apparatus 1 includes a gas supply mechanism 40 that supplies a processing gas to the heat treatment space 15 in the chamber 10, and an exhaust mechanism 50 that exhausts the environment from the heat treatment space 15. The gas supply mechanism 40 includes a processing gas supply source 41, a supply pipe 42, and a supply valve 43. The front end side of the supply pipe 42 is connected in communication with the heat treatment space 15 in the chamber 10, and the base end side is connected to the processing gas supply source 41. The supply valve 43 is provided in the middle of the path of the supply pipe 42. By opening the supply valve 43, the processing gas can be supplied from the processing gas supply source 41 to the heat treatment space 15. The processing gas supply source 41 can supply an appropriate processing gas in accordance with the type of the object to be processed 8 and the purpose of processing, and in the present embodiment, nitrogen gas (N ₂ ) is supplied.

The exhaust mechanism 50 includes an exhaust device 51, an exhaust pipe 52, and an exhaust valve 53. The front end side of the exhaust pipe is connected in communication with the heat treatment space 15 in the chamber 10, and the base end side is connected to the exhaust device 51. An exhaust valve 53 is provided in the middle of the path of the exhaust pipe 52. As the exhaust device 51, an exhaust body of a factory provided with a vacuum pump and a heat treatment device 1 can be used. By operating the exhaust device 51 and opening the exhaust valve 53, the environment of the heat treatment space 15 can be discharged to the outside of the device. The environment of the heat treatment space 15 can be adjusted by the gas supply mechanism 40 and the exhaust mechanism 50.

The heating light source 30 is disposed above the chamber 10. The heating light source 30 includes a plurality of (11, but not limited to, FIG. 1 for convenience of illustration) flash lamps FL and a reflector 32 provided to cover the entire upper portion. The heating light source 30 illuminates the object to be processed 8 held in the holding plate 20 in the chamber 10 from the flash lamp FL via the optical filter 60 and the quartz chamber window 18 described below.

The plurality of flash lamps FL each have a long cylindrical rod-shaped lamp, and are arranged in a planar shape so that their respective longitudinal directions are parallel to each other in the horizontal direction. In the present embodiment, a xenon flash lamp is used as the flash lamp FL. The xenon flash lamp FL includes: a rod-shaped glass tube (discharge tube) having a helium gas sealed therein, and an anode and a cathode connected to the capacitor at both ends thereof; and a trigger electrode attached to the outer circumference of the glass tube On the surface. Since helium is electrically an insulator, even if a charge is accumulated in the capacitor, there is no current flowing in the glass tube in the normal state. However, when a high voltage is applied to the trigger electrode to break the insulation, the electric charge accumulated in the capacitor instantaneously flows in the glass tube by the discharge between the electrodes at both ends, by the excitation of the atom or molecule at that time. Emitting light. In such a xenon flash lamp FL, since the electrostatic energy accumulated in the capacitor in advance is converted into an extremely short light pulse of 0.1 millisecond to 100 milliseconds, it is characterized in that it can illuminate extremely strong light as compared with a continuously lit lamp.

Further, the reflector 32 is provided so as to cover the entirety of the plurality of flashers FL. The basic function of the reflector 32 is to reflect the flash emitted from the plurality of flashes FL to the side of the heat treatment space 15.

An optical filter 60 is disposed between the chamber window 18 of the chamber 10 and the heating source 30. The optical filter 60 of the present embodiment is a plate-shaped optical member formed by dissolving a metal such as barium (Ba), arsenic (As), antimony (Sb) or cadmium (Cd) in quartz glass. More specifically, at least one metal selected from the group consisting of ruthenium, arsenic, antimony, and cadmium is dissolved and contained in quartz glass. By including a metal component in the quartz glass, light in a specific wavelength region of the light transmitted through the optical filter 60 can be reflected or absorbed to be cut off (shielded). The wavelength region that is truncated depends on the type of metal dissolved in the quartz glass. The optical filter 60 of the present embodiment cuts ultraviolet light having a wavelength of 400 nm or less.

By providing the optical filter 60 between the chamber 10 and the heating light source 30, the ultraviolet light having a wavelength of 400 nm or less can be cut off when the flash emitted from the flash lamp FL is transmitted through the optical filter 60. Further, the remaining flash having a component having a wavelength region of a wavelength of 400 nm or more passes through the optical filter 60 and is irradiated onto the object 8 to be processed held on the holding plate 20.

The control unit 9 controls the above various operation mechanisms provided on the heat treatment apparatus 1. The hardware of the control unit 9 is the same as that of a general computer. In other words, the control unit 9 includes a CPU (Central Processing Unit) that performs various arithmetic processing and a ROM (Read-Only Memory). Body), which is a memory dedicated to reading the basic program of memory; RAM (Random Access Memory), which is a freely readable memory for storing various information; and a disk with memory control Use software or materials. The processing in the heat treatment apparatus 1 is performed by the CPU of the control unit 9 executing a specific processing program.

In addition to the above configuration, various constituent elements may be appropriately provided in the heat treatment apparatus 1. For example, a transport opening for loading and unloading the workpiece 8 is provided on the chamber side wall 11. Further, in order to prevent an excessive temperature rise caused by the light irradiation from the flash lamp FL, a water-cooling tube may be provided on the chamber side wall 11. Further, in order to prevent heating of the optical filter 60 caused by the absorption of the flash, a mechanism for blowing the cooling gas may be provided on the optical filter 60.

Next, a processing procedure of the object 8 to be processed in the heat treatment apparatus 1 having the above configuration will be described. FIG. 2 is a flow chart showing a processing procedure of the object to be processed 8 in the heat treatment apparatus 1. The processing procedure of the heat treatment apparatus 1 described below is performed by the control unit 9 controlling each of the operation mechanisms of the heat treatment apparatus 1.

First, the object to be processed 8 is carried into the chamber 10 (step S1). The loading of the object to be processed 8 can be performed by a transfer robot outside the heat treatment apparatus 1, or can be performed manually. 3 is a cross-sectional view showing the structure of the object to be processed 8. The object to be processed 8 of the present embodiment is configured by the surface layer layer functional layer 82 on the resin substrate 81. As the resin of the substrate 81, PEN (polyethylene naphthalate), PET (polyethylene terephthalate) or the like can be used. Further, the functional layer 82 is a nano ink layer of silver (Ag) for electrode formation.

The object to be processed 8 that has been carried into the chamber 10 is placed on the upper surface of the holding plate 20 and held (step S2). The object to be processed 8 holds the surface on which the functional layer 82 is formed toward the upper surface side and is held by the holding plate 20. The upper surface of the holding plate 20 is preheated to a specific temperature by a built-in heater 21. The temperature of the upper surface of the holding plate 20 is controlled by the control portion 9. The object to be processed 8 is placed on the holding plate 20, thereby being heated by heat conduction.

Further, the object to be processed 8 is carried into the chamber 10, and the heat treatment space 15 is sealed. After the space, the environment adjustment in the chamber 10 is performed (step S3). In the present embodiment, nitrogen gas is supplied from the gas supply mechanism 40 to the heat treatment space 15 in the chamber 10, and is exhausted by the exhaust mechanism 50. Thereby, a gas stream of nitrogen gas is formed in the chamber 10, and the heat treatment space 15 is replaced with a nitrogen atmosphere.

FIG. 4 is a view showing changes in temperature of the functional layer 82 of the object to be processed 8. At time t1, the object to be processed 8 is carried into the chamber 10, and the object to be processed 8 is held on the holding plate 20 at time t2. Thereby, the object to be processed 8 is preheated (auxiliary heating) by the holding plate 20 at time t2, and the temperature of the object to be processed 8 is brought to a specific preheating temperature T1 at time t3. When the object to be processed 8 is heated by the holding plate 20, the entire object to be processed 8 including the resin base material 81 and the functional layer 82 is heated substantially uniformly. Therefore, in the preheating stage, both the base material 81 and the functional layer 82 are similarly heated to the preheating temperature T1. The preheating temperature T1 is appropriately set within a range that does not cause thermal damage to the resin substrate 81 (about 120 ° C or less for PEN or PET).

Then, after the temperature of the object to be processed 8 reaches the preheating temperature T1, the plurality of flash lamps FL of the heating light source 30 are collectively lit at time t4 by the control of the control unit 9 (step S4). The flash emitted from the flash lamp FL (including the flash reflected by the reflector 32) is directed to the object 8 to be processed held on the holding plate 20 in the heat treatment space 15.

At this time, the flash emitted from the flash lamp FL is incident on the heat treatment space 15 after passing through the optical filter 60. In the present embodiment, since the optical filter 60 that cuts ultraviolet light having a wavelength of 400 nm or less is disposed between the heating light source 30 and the chamber window 18, when the flash passes through the optical filter 60, the ultraviolet region of a wavelength region of 400 nm or less is ultraviolet. The light is cut off. As a result, the flash light after the ultraviolet light having a wavelength of 400 nm or less is cut off is incident into the heat treatment space 15 in the chamber 10. Further, the flash after the ultraviolet light is cut off is irradiated onto the surface of the object to be processed 8 held on the holding plate 20, whereby the functional layer 82 formed on the surface is heated.

The flash fired from the flash lamp FL converts the pre-accumulated electrostatic energy into a very short light pulse, and the irradiation time is substantially 0.1 milliseconds or more and a very short flash of 100 milliseconds or less. Light. The temperature of the functional layer 82, which is irradiated with the flash of the flash lamp FL, instantaneously rises to the processing temperature T2, and then rapidly drops to the preheating temperature T1. The functional layer 82 can be subjected to the desired heat treatment by such flash heating. If the functional layer 82 is a silver nano ink, the processing temperature T2 is about 180 °C.

Here, since the irradiation time of the flash lamp FL is substantially 0.1 milliseconds or more and 100 milliseconds or less, the functional layer 82 located on the surface side of the object to be processed 8 is heated up to the processing temperature T2, and the substrate 81 is almost The temperature was not raised from the preheating temperature T1. Although the treatment temperature T2 (180 ° C) in the present embodiment is a temperature exceeding the heat resistance temperature of the substrate 81 of PEN or PET, since the temperature of the functional layer 82 is raised only to the treatment temperature T2, the substrate 81 is hardly heated, so that the substrate 81 can be hardly heated. Prevents thermal damage to the substrate 81 lacking heat resistance. On the other hand, since the functional layer 82 is heated up to the required processing temperature T2, the required heat treatment can be surely performed. In other words, when the object to be processed 8 is heated by the flash irradiation in the embodiment, even if the substrate 81 lacks heat resistance, the functional layer 82 can be heated without excessive heating of the substrate 81. A precise heat treatment is performed up to a target treatment temperature T2 exceeding the heat-resistant temperature of the substrate 81.

Further, the resin material constituting the substrate 81 not only lacks heat resistance but also is easily deteriorated by ultraviolet light. For example, in the case of PEN, it is deteriorated by light in a wavelength region of 200 nm to 400 nm, and in the case of PET, it is deteriorated by light in a wavelength region of 200 nm to 380 nm.

On the other hand, Fig. 5 is a view showing the radiation splitting distribution of the xenon flash lamp FL. As shown in the figure, the flash emitted from the xenon flash lamp FL also contains a large amount of ultraviolet light components having a wavelength of 400 nm or less. Therefore, when the flash from the flash lamp FL is directly irradiated to the object to be processed 8, the substrate 81 is absorbed by the ultraviolet light component and damaged.

Therefore, in the present embodiment, the optical filter 60 that cuts ultraviolet light having a wavelength of 400 nm or less is provided between the heating light source 30 and the chamber window 18, and the wavelength of the laser beam irradiated onto the surface of the object 8 is cut off by 400 nm or less. Ultraviolet light. Thereby preventing the flash The ultraviolet light component contained therein damages the substrate 81 of the object 8 to be processed. On the other hand, since the flash light that has been irradiated onto the surface of the object to be processed 8 always contains light having a stronger intensity than the wavelength of 400 nm and is located on the long wavelength side, the heat treatment required for the functional layer 82 can be surely performed.

After the flash heat treatment of the object 8 by the flash irradiation is completed and a predetermined time elapses, the processed object 8 is carried out from the chamber 10 (step S5). Thereby, a series of heat treatments in the heat treatment apparatus 1 are completed. Further, the inside of the chamber 10 may be replaced with an atmospheric environment before the object to be processed 8 is carried out.

In the present embodiment, an optical filter 60 that cuts off ultraviolet light having a wavelength of 400 nm or less is provided between the holding plate 20 in the chamber 10 and the flash lamp FL of the heating light source 30 to perform flash irradiation. Therefore, when the flash emitted from the flash lamp FL passes through the optical filter 60, the ultraviolet light in the wavelength region of 400 nm or less is cut off. Therefore, the ultraviolet light having a wavelength of 400 nm or less is cut off from the flash of the surface irradiated onto the object to be processed 8, and the damage of the resin substrate 81 caused by the ultraviolet light can be prevented.

On the other hand, since the flash applied to the surface of the object to be processed 8 always contains light having a stronger intensity than the wavelength of 400 nm and located on the long wavelength side, the functional layer 82 of the object 8 to be processed can be heated by the flash irradiation. To the required processing temperature T2. Further, since the irradiation time of the flash lamp FL is substantially 0.1 milliseconds or more and 100 milliseconds or less, it is possible to heat only the functional layer 82 to the required treatment without excessively heating the substrate 81 lacking heat resistance. Temperature T2.

As described above, in the present embodiment, by irradiating the object 8 with light having a wavelength of 400 nm or less from the flash having a very short irradiation time emitted from the flash lamp FL, the resin can be prevented from being ultraviolet light. In the case where the substrate 81 causes damage and thermal damage, only the functional layer 82 is heated to the required processing temperature T2, and the desired heat treatment is performed.

The embodiments of the present invention have been described above, but the present invention can be variously modified without departing from the spirit and scope of the invention. For example, in the above embodiment, the functional layer of the nano ink having a surface layer of silver on the surface of the substrate 81 of PEN or PET is used. The 82 is the object to be processed 8, but the object to be processed 8 is not limited thereto, and various changes can be made.

For example, in the above embodiment, the base material 81 of the object to be processed 8 is made of PEN or PET, but other resin materials such as polycarbonate or acrylic resin may be used instead. These resin materials are also deteriorated by ultraviolet light, and both the polycarbonate and the acrylic resin are deteriorated by light in a wavelength region of 200 nm to 300 nm. When polycarbonate or an acrylic resin is used as the substrate 81, the cutoff wavelength region of the optical filter 60 is set to 300 nm or less. The adjustment of the cutoff wavelength region of the optical filter 60 can be performed by changing the kind of metal dissolved in the quartz glass. By providing the optical filter 60 that cuts ultraviolet light having a wavelength of 300 nm or less, the functional layer 82 can be heated to a desired processing temperature T2 and heat-treated without damaging the resin substrate 81 as in the above embodiment. .

Further, the functional layer 82 laminated on the substrate 81 is not limited to the silver nano ink, and may be a nano ink (or a nanowire) of another metal such as copper. When the functional layer 82 is copper, the processing temperature T2 in the above embodiment is approximately 400 °C. Further, the functional layer 82 may be amorphous germanium, doped polysilicon, ITO (Indium Tin Oxide), gravure ink, or the like. In the case where the functional layer 82 is ITO, the processing temperature T2 becomes approximately 220 °C. Moreover, when the functional layer 82 is 矽, the processing temperature T2 becomes 900 ° C or more.

Further, the structure of the object to be processed 8 may be as shown in Fig. 6. In the object to be processed 8 of Fig. 6, a glass substrate 81 is bonded to the upper surface of the glass substrate 83 by using an adhesive 84, and a surface layer functional layer 82 is formed on the substrate 81. As the adhesive 84, for example, an epoxy-based adhesive containing an epoxy resin as a main component can be used. The heat resistant temperature of the epoxy-based adhesive is about 160 °C. By using the glass substrate 83 having a high rigidity, the treatment of the object to be processed 8 becomes easier than the above embodiment in which the functional layer 82 is laminated on the resin substrate 81. Further, after the necessary treatment is completed, the substrate 81 is peeled off from the glass substrate 83, and the substrate 81 on which the functional layer 82 is laminated is used as a device.

Similarly to the above-described embodiment, the object to be processed 8 having the structure shown in Fig. 6 is also subjected to flash heating by the heat treatment apparatus 1. The glass substrate 83 and the glass substrate 81 are highly resistant to heat and are not deteriorated by ultraviolet light. However, the resin adhesive 84 is similar to the substrate 81 of the above-described embodiment in that it lacks heat resistance and is deteriorated by ultraviolet light. Therefore, similarly to the above-described embodiment, by using the optical filter 60, ultraviolet light having a wavelength of 400 nm or less is cut off from the flash of light irradiated onto the surface of the object to be processed 8, and the resin can be prevented from being adhered to by the ultraviolet light. In the event of damage and thermal damage to 84, only the functional layer 82 is warmed to the desired processing temperature and the desired heat treatment is performed.

In summary, according to the heat treatment technique of the present invention, the object to be processed 8 to be treated may be a resin-containing body. In the example of FIG. 3, the object to be processed 8 includes the resin base material 81. In the example of FIG. 6, the object to be processed 8 has a structure in which the base material 81 is attached to the resin adhesive 84. By heat-treating the object to be processed 8 by the heat treatment technique of the present invention, the object to be processed 8 can be heated by light irradiation without damaging the resin contained in the object to be processed 8.

In the above embodiment, the optical filter 60 is used as the optical filter 60 in the quartz glass. However, the present invention is not limited thereto, and may be a member that can cut off light in a specific wavelength region from the flash. For example, FIG. 7 is a view showing a configuration of an optical filter 60 using water. The optical filter 60 of Fig. 7 is constructed by enclosing water 62 in the interior of the hollow glass plate member 61. Coloring is carried out by mixing ink of a specific color or the like in the water 62. Thereby, the optical filter 60 can intercept light of a specific wavelength region from the transmitted flash. Compared with the case where the metal is dissolved and contained in the quartz glass, the coloring of the water is relatively easy, and the cutoff wavelength region of the optical filter 60 can be simply adjusted by merely replacing the internal water 62.

Further, the optical filter 60 may be formed by forming a thin film of a metal or a metal oxide on the surface of the quartz glass. However, such a film has a tendency to be peeled off due to rapid temperature rise during flash irradiation, and therefore it is preferred to dissolve the metal in the quartz glass.

Furthermore, it is also possible to cut off a specific wavelength region by changing the composition of the flash FL itself. The light of the field. Specifically, when the gas pressure of the helium gas enclosed in the glass tube of the flash lamp FL is lowered, the radiation spectral distribution of FIG. 5 moves to the long wavelength side. As a result, the ultraviolet light on the short-wavelength side can be cut off from the flash emitted from the flash lamp FL. On the other hand, when the infrared light on the long wavelength side is cut off from the flash, the pressure of the enclosed helium gas can be increased. However, if the gas pressure of the helium gas is changed, the intensity of the flash light is lowered or the flash lamp FL is damaged. Therefore, it is preferable to cut off the light of the specific wavelength region by the optical filter 60 as in the above embodiment.

In addition, the wavelength region in which the optical filter 60 is cut off is not limited to 400 nm or less, and may be an appropriate wavelength region corresponding to the characteristics of the resin contained in the object to be processed 8. For example, as described above, when the resin contained in the object to be processed 8 is polycarbonate or acrylic resin, the wavelength region cut by the optical filter 60 may be 300 nm or less. In addition, when the resin contained in the object to be processed 8 is PEN, it is deteriorated by light in a wavelength region of 200 nm to 400 nm. Therefore, an optical filter 60 that cuts only light in a wavelength region of 200 nm to 400 nm can be applied. . Further, when the resin contained in the object to be processed 8 has a property of being deteriorated by infrared light of a long wavelength, an optical filter 60 that cuts off infrared light may be used. That is, the wavelength region cut by the optical filter 60 may be a wavelength region that damages the resin contained in the object to be processed 8.

Further, in the above embodiment, the holding plate 20 includes the heater 21, and the object to be processed 8 is preheated before the flash irradiation, and when the processing temperature T2 is a lower temperature, the flash can be used only by the flash. Since the functional layer 82 is heated to the treatment temperature T2 by irradiation, preheating by the heater 21 is not an essential element. However, by performing the flash irradiation after stably heating the object 8 to the preheating temperature T1 by the holding plate 20, the temperature history between the plurality of different processed bodies 8 can be made uniform.

Further, a cooling mechanism may be provided in the holding plate 20 to forcibly cool the object to be processed 8 after the flash heat treatment.

Moreover, in the above embodiment, the reflection is set above the plurality of flash lamps FL. Instead of the device 32, a plurality of flash lamps FL may be respectively provided as lamps with a reflective film. That is, a reflective film is attached to the upper half of the glass tube of each of the flash lamps FL, whereby the flash is reflected to the side of the heat treatment space 15. When such a flash lamp FL with a reflective film is used, as shown in FIG. 8, the flasher FL located at both ends of the lamp array may be disposed further below the other flasher FL (near the side of the object to be processed 8). Thereby, the illuminance of the peripheral portion of the object to be processed 8 is improved. In this case, two or more flash lamps FL may be placed close to the object to be processed 8 at both ends of the lamp array.

Further, when the object to be processed 8 has a structure in which the functional layer 82 is formed on the surface of the resin substrate 81, since the object to be processed 8 has flexibility as a whole, the object to be processed 8 can be rolled from the roll. It is conveyed by a roll-to-roll method in which a roll is wound. In this case, even if the flash lamp FL is set to continuously light the xenon lamp or the like, the object to be processed 8 is continuously conveyed and subjected to the same short-time irradiation as the flash irradiation at each position of the object 8 to be processed. The same processing results as in the above embodiment can be obtained. Further, even in this case, the wavelength region of the damaged resin can be cut off from the light emitted from the xenon lamp.

Further, in the above embodiment, the heating light source 30 includes the xenon flash lamp FL, but a flash lamp of another rare gas such as xenon may be used instead.

[Industrial availability]

The heat treatment method and the heat treatment apparatus of the present invention can be applied to various objects to be processed including a resin, and in particular, can be preferably used for soft devices, flexible displays, flat panel displays (FPD, Flat Panel Display) used in electronic paper or the like. In electronic equipment, solar cells, fuel cells, semiconductor components, etc.

1‧‧‧ Heat treatment unit

8‧‧‧Processed body

9‧‧‧Control Department

10‧‧‧ chamber

11‧‧‧Cell wall

12‧‧‧Bottom of the chamber

15‧‧‧ Heat treatment space

18‧‧‧Case window

20‧‧‧ Keep board

21‧‧‧ heater

30‧‧‧heating light source

32‧‧‧ reflector

40‧‧‧ gas supply mechanism

41‧‧‧Processing gas supply

42‧‧‧Supply piping

43‧‧‧Supply valve

50‧‧‧Exhaust mechanism

51‧‧‧Exhaust device

52‧‧‧Exhaust piping

53‧‧‧Exhaust valve

60‧‧‧Optical filter

FL‧‧‧Flash

Claims (8)

A heat treatment method for heat-treating the object to be processed by irradiating light onto a surface of a substrate including a resin and a functional layer formed on the substrate, the heat treatment method The flash of the ultraviolet light emitted from the light source from the light source containing the flash is cut off from the flash of the object to be processed. A heat treatment method of heat-treating the object to be processed by irradiating light onto a surface of a body to be processed having a functional layer formed on a substrate with a resin adhesive attached thereto, In the heat treatment method, the object to be processed is irradiated with the flash light which is damaging the ultraviolet light of the resin from the flash emitted from the light source including the flash lamp. The heat treatment method according to claim 1 or 2, wherein the ultraviolet light having a wavelength of 400 nm or less is cut off from the light emitted from the light source. The heat treatment method according to claim 3, wherein the ultraviolet light having a wavelength of 400 nm or less is cut off by passing the light emitted from the light source through the filter. A heat treatment apparatus which heats a surface of a target object including a resin substrate and a functional layer formed on the substrate, and heats the object to be processed, and includes: a holding mechanism that holds the object to be processed, a light source that includes a flash lamp that illuminates the object to be processed held by the holding mechanism, and a filter that is disposed between the holding mechanism and the light source and that is cut off It will damage the ultraviolet light of the above resin. A heat treatment apparatus characterized by irradiating light onto a surface of a target body on which a functional layer is formed on a substrate with a resin adhesive attached thereto a heat treatment device for heating the object to be processed, comprising: a holding mechanism that holds the object to be processed; a light source that includes a flash lamp that illuminates the object to be processed held on the holding mechanism; and a filter, which is disposed The ultraviolet light between the holding mechanism and the light source is cut off to damage the resin. The heat treatment apparatus according to claim 5 or 6, wherein the filter cuts off ultraviolet light having a wavelength of 400 nm or less. The heat treatment apparatus of claim 5 or 6, wherein the filter comprises a plate-like member enclosing the colored water.