JP2013103360A - Method for sealing matter such as solid, pouched liquid or gas and the like in resin molded product, and resin molded product manufactured thereby - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method capable of perfectly sealing the whole of parts to be sealed and capable of appropriately setting the position of the parts to be sealed in a resin molded product.SOLUTION: Protective surrounding frames 1a and 1b having a dimensions corresponding to the thickness, shape and size of an element or another part 2 having the post-scribed electronic data and another ID function are provided to a pair of resin molded product forming plates 1A and 1B at a required position comprising the same resin, made the same in shape, size and thickness and set in a direction parallel to a surface. The element or another part 2 having electronic data and another ID function are hermetically sealed in those protective surrounding frames 1a and 1b and held in a mold 3 composed of a cavity side 3A and a core side 3B in this state and the same resin 4 as a pair of the molten resin molded product forming plates 1A and 1B is injected from a resin injection port 3C to fill the resin 4 in the outer peripheries of the protective surrounding frames 1a and 1b between a pair of the resin molded product forming plates 1A and 1B. Thereafter, the resin 4 is cooled and solidified.

Description

  The present invention relates to a method for encapsulating a solid, bagged liquid, or gas object inside a resin molded product, and a resin molded product produced by the method.

  The present inventor previously formed a certificate, a security, an ID card, etc. itself from a resin, and encloses therein electronic information such as a hologram, a circuit including an IC chip, and other elements having an ID function. A method for preventing counterfeiting of certificates has been proposed (Japanese Patent Laid-Open No. 2009-217767).

  In the method, a resin molded product such as a certificate is in a form in which an element having an ID function such as a hologram, electronic information, or the like is enclosed therein, thereby forgery by replacing the element having the ID function with another one. It is to prevent.

  Further, a method of encapsulating electronic information such as a hologram and a circuit including an IC chip and other elements having an ID function in a resin molded product such as a certificate is as shown in FIGS. In the figure, 100 is a resin molded product which is a certificate, securities, ID card, etc. itself, and 101 is a hologram, an electronic information such as a circuit including an IC chip, and other IDs integrally enclosed in the resin molded product 100. An element 102 having a function is a mold including a cavity side 102A and a core side 102B.

  Then, as shown in FIG. 8, in the process, an element 101 having electronic functions and other ID functions is held in a mold 102, and a resin injection port 102C formed at the joint of the cavity side 102A and the core side 102B. The molten resin 103 is poured from and cooled and solidified.

  In such a case, a resin molded product 100 such as a certificate is formed by the resin 103 injected in a molten state and cooled and solidified. As shown in FIG. The resin molded product 100 is integrally sealed.

  However, in the case of such a process, as shown in FIG. 8, when the element 101 having the electronic information or other ID function is held in the mold 102, a part 101 a of the element 101 a is formed on the cavity side 102 </ b> A of the mold 102 and the core. Since it protrudes from the resin injection space S between the side 102B, the protruding portion 101a must be cut when it is taken out from the mold 102 and completed as a product. FIG. 9 shows this cut state. Thereby, a part (cut surface) of the element 101 having electronic functions and other ID functions is exposed from the resin molded product 100. In this case, anxiety is caused in terms of security and it is not preferable from the viewpoint of appearance.

  Further, as described above, since it is always held at a fixed position in the mold 102, the position of the enclosed electronic information or other element 101 having the ID function in the resin molded product 100, that is, the resin molded product 100 is used. The position in the thick direction and the position in the direction parallel to the surface are always constant, and these cannot be set appropriately.

  Further, the temperature of the molten resin 103 to be injected is as high as 200 to 350 ° C. However, when it directly contacts with the element 101 having electronic functions and other ID functions, depending on itself, it may be damaged beyond the heat resistance temperature. Things can happen.

  Furthermore, the pressure in the mold 102 is as high as 50 to 70 MPa. However, if this pressure is applied to the element 101 having electronic functions and other ID functions, it may be damaged depending on the pressure itself. .

JP 2009-217767 A

  The present invention has been made in view of the above points, and a part of the electronic information or other solid-state object such as an element having an ID function, or a bag-like liquid or gas is exposed to the outside. Can be completely enclosed, and the position in the resin molded product, that is, the position in the thickness direction of the resin molded product and the position in the direction parallel to the surface can be appropriately set. An object such as a solid, a liquid in a bag, or a gas is placed inside the resin molded product so that the object sealed in the resin molded product can be protected from the heat and pressure of the resin in the mold in the injection process. It is an object of the present invention to provide a sealing method and a resin molded product manufactured by the method.

  Thus, the gist of the present invention is that they are made of the same resin, have the same shape and the same size, and each has a required thickness, and each opposing surface has a required position in a direction parallel to the surface. In addition, a pair of resin molded products forming a resin molded product itself, in which a protective enclosure frame having dimensions corresponding to the thickness, shape, and size of the object described later is formed, is formed. Together with the forming plates, the protective enclosure frame in them is sealed with a solid, bagged liquid or gas object, and in this state is held in a mold consisting of the cavity side and the core side and melted. The same resin as the pair of resin molded product forming plates is injected from a resin injection port, and the resin is filled into the outer periphery of the protective enclosure between the pair of resin molded product forming plates, and then cooled and solidified. Solid resin molded product, liquid or gas in a bag, etc. In a method of encapsulating an object in the resin molded article, characterized by encapsulating integrally objects.

  In the above method, the resin injected into the pair of resin molded product forming plates and the mold is either general-purpose or super engineering plastic resin, but super engineering plastic resin is preferred. Moreover, you may make it shape | mold an extended part integrally in the outer edge part of either one or both of a pair of resin molded product formation board.

  Furthermore, they are made of the same resin, have the same shape and the same size, and each has the required thickness, and the thickness, shape and size of the object described later are placed at the required positions in the direction parallel to the surfaces of the respective opposing surfaces. Forming a pair of resin molded product forming plates to be a resin molded product with a protective enclosure frame of a size corresponding to the height, and combining the pair of resin molded product forming plates together, An object such as a solid, a bag-like liquid or gas is sealed in the surrounding frame, and in this state, held in a mold composed of a cavity side and a core side, the same as the pair of molten resin molded product forming plates Resin is injected from a resin injection port, and the resin is filled into the outer periphery of the protective enclosure frame between the pair of resin molded product forming plates, and this is cooled and solidified. Or a resin composition that integrally encloses an object such as gas. Also the goods is to its gist.

  And in the structure of the said resin molded product, although resin injected into a pair of resin molded product formation board and metal mold | die is either a general purpose or super engineering plastic resin, super engineering plastic resin is more preferable. Moreover, you may make it shape | mold an extended part integrally in the outer edge part of either one or both of a pair of resin molded product formation board.

  Since the present invention is configured as described above, all of solid objects such as electronic information and other elements having an ID function, and objects such as liquids or gases in a bag are completely exposed without exposing part of them to the outside. In addition, the position in the resin molded product, that is, the position in the thickness direction of the resin molded product and the position in the direction parallel to the surface can be set as appropriate. The object enclosed in the resin molded product can be protected from the heat and pressure of the resin in the mold. Moreover, when the resin injected into the pair of resin molded product forming plates and the mold is a super engineering plastic resin, it is excellent in corrosion resistance, strong against strong acids such as sulfuric acid, and withstands harsh environments. It is something that can be done.

It is a perspective view of the resin molded product of the state which enclosed the object inside by embodiment of this invention. It is the same top view. It is the sectional view on the AA line in FIG. FIG. 3 is a sectional view taken along line B-B in FIG. 2. It is process explanatory drawing in embodiment of this invention, and shows the state which match | combines a shape | molded pair of resin molded product formation board. It is the same process explanatory drawing, and shows the state which put together a pair of resin molded product formation board, and sealed the object enclosed in the resin molded product in the protective surrounding frame in them. It is the same process explanatory drawing, and shows the state which inject | poured molten resin hold | maintaining a pair of resin molded product formation board in a metal mold | die. It is explanatory drawing of the means to enclose an object in the inside of the resin molded product in the method which this inventor proposed previously. It is a longitudinal cross-sectional view of the resin molded product of the state which enclosed the object by the means shown in FIG.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

  First, as shown in FIG. 5, the same resin, the same length L and width W, each having a required thickness H, each of the opposing surfaces in the direction parallel to the surface is required. The protective enclosure frames 1a and 1b having dimensions corresponding to the thickness, length, and width of the electronic information or other elements having other ID functions or other parts are provided at the position of the resin molded product itself. A pair of resin molded product forming plates 1A and 1B is molded. And the element or other components 2 which have ID functions other than electronic information are fitted in the protective surrounding frame 1a of a pair of resin molded product formation board 1A. Moreover, in this embodiment, although super engineering plastic resin is used as resin injected into a pair of resin molded product formation board 1A, 1B and a postscript metal mold | die, you may use general purpose resin.

  Next, the pair of resin molded product forming plates 1A and 1B are combined, and as shown in FIG. 6, in the protective surrounding frames 1a and 1b, there are electronic information and other elements or other components 2 having an ID function. To seal.

  Next, in this state, the resin 4 which is held in the mold 3 composed of the cavity side 3A and the core side 3B and melted as the pair of resin molded product forming plates 1A and 1B is injected from the resin injection port 3C. The resin 4 is filled into the outer periphery of the protective surrounding frames 1a and 1b between the pair of resin molded product forming plates 1A and 1B, and then cooled and solidified. The resin molded product 1 in which an object is enclosed in the interior shown in FIGS. 1 to 4 is completed through the above steps.

  According to the present embodiment, when the component 2 encapsulated in the resin molded product 1 is held in the mold 3, both surfaces are covered with the pair of resin molded product forming plates 1A and 1B, and Since the same resin 4 as the pair of resin molded product forming plates 1A and 1B is injected into the outer periphery of the protective surrounding frames 1a and 1b between the pair of resin molded product forming plates 1A and 1B. The pair of resin molded product forming plates 1A and 1B are integrated through the resin 4, and the resin 4 fills the outer peripheries of the protective surrounding frames 1a and 1b between the pair of resin molded product forming plates 1A and 1B. It will be done. Therefore, the entire part 2 can be completely encapsulated without exposing part of the part 2 encapsulated in the resin molded product 1 when completed.

  Further, the position of the component 2 in the resin molded product 1 can be freely set. That is, when the position in the thickness direction Z of the resin molded product 1 in FIG. 1 is set to an appropriate position, the thickness H of one or both of the pair of resin molded product forming plates 1A and 1B is adjusted in FIG. When the position in the length direction X of the resin molded product 1 in FIG. 1 is set to an appropriate position in FIG. 1, the protective surrounding frame 1a of the pair of resin molded product forming plates 1A and 1B in FIG. When the position 1b is adjusted in the length direction (L direction), and the position in the width direction Y of the resin molded product 1 in FIG. 1 is set to an appropriate position, a pair of resins in FIG. This is performed by adjusting the positions of the protective surrounding frames 1a and 1b of the molded product forming plates 1A and 1B in the width direction (W direction).

  Further, when the component 2 to be encapsulated in the resin molded product 1 is held in the mold 3, both surfaces are covered with a pair of resin molded product forming plates 1A and 1B and the peripheral side surfaces are protective surrounding frames 1a and 1b. The component 2 encapsulated in the resin molded product 1 can be protected from heat and pressure when the molten resin 4 is injected into the mold 3. . Further, as in this embodiment, if a super engineering plastic resin is used as the pair of resin molded product forming plates 1A and 1B and the injection resin 4 into the mold, it has excellent corrosion resistance and is resistant to strong acids such as sulfuric acid. It is strong and can withstand harsh environments.

  Moreover, although the case where the resin molded product 1 was square in the planar shape was shown in the above embodiment, it can be made into other appropriate shapes such as a circle. Moreover, although not shown in figure, you may make it shape | mold an extended part integrally in the outer edge part of either one or both of a pair of resin molded product formation board 1A, 1B. Thereby, the same information as the information recorded in the object enclosed inside can be handwritten on the extended portion as desired.

  Moreover, in the said embodiment, although the element or other components which have electronic information and other ID functions, or a solid state as an enclosed object was shown, although it is not shown in figure, it may be a liquid or gas in a bag. Is. As a result, when the object is destroyed, the bag is torn and the liquid or gas enclosed inside is scattered, and the damaged state can be recognized at a glance, and this is disguised as if it was not destroyed. Can be prevented.

DESCRIPTION OF SYMBOLS 1A, 1B A pair of resin molded product formation board 1a, 1b Protective enclosure 2 Enclosed parts 3 Mold 3A Mold cavity side 3B Mold core 4

Claims (6)

  It is made of the same resin, has the same shape and size, and each has the required thickness, and the thickness, shape and size of the object described later are set at the required positions in the direction parallel to the surface of the respective opposing surfaces A pair of resin molded product forming plates to be a resin molded product itself having a corresponding size of the protective surrounding frame projecting is formed, and the pair of resin molded product forming plates are combined to form the protective enclosure frame in them. A solid, bag-like liquid or gas object is sealed inside, and in this state, held in a mold consisting of a cavity side and a core side, the same resin as the pair of molten resin molded product forming plates The resin is injected from the resin injection port, and the resin is filled in the outer periphery of the protective enclosure frame between the pair of resin molded product forming plates, and then cooled and solidified, so that the resin molded product is solid, liquid or gas in a bag, etc. It is characterized by enclosing the object of Method of encapsulating an object inside the that the resin molded article.   The method for encapsulating an object in a resin molded product according to claim 1, wherein the resin molded product forming plate and the resin injected into the mold are general-purpose or super engineering plastic resins.   3. The method of enclosing an object in a resin molded product according to claim 1 or 2, wherein an extended portion is integrally formed on one or both outer edge portions of the pair of resin molded product forming plates.   It is made of the same resin, has the same shape and size, and each has the required thickness, and the thickness, shape and size of the object described later are set at the required positions in the direction parallel to the surface of the respective opposing surfaces. A pair of resin molded product forming plates to be a resin molded product itself having a corresponding size of the protective surrounding frame projecting is formed, and the pair of resin molded product forming plates are combined to form the protective enclosure frame in them. A solid, bag-like liquid or gas object is sealed inside, and in this state, held in a mold consisting of a cavity side and a core side, the same resin as the pair of molten resin molded product forming plates By injecting from the resin injection port and filling the outer periphery of the protective enclosure frame between the pair of resin molded product forming plates, cooling and solidifying, the resin molded product has a solid, bag-filled liquid or The fact that an object such as gas is enclosed Resin molded article and butterflies.   The resin molded product according to claim 4, wherein the resin injected into the pair of resin molded product forming plates and the mold is a general-purpose or super engineering plastic resin. The resin molded product according to claim 4 or 5, wherein an extended portion is integrally formed on one or both outer edge portions of the pair of resin molded product forming plates.

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