JPH03167868A - Integrated circuit device provided with shielding function; apparatus and method for its manufacture - Google Patents

Abstract

PURPOSE:To eliminate a need for forming a shield after a mounting operation, to shorten a mounting g process and to make an apparatus small-sized and lightweight by a method wherein a shield layer is formed around a circuit board including a semiconductor element and a shield function is endowed by using each integrated circuit device as a unit. CONSTITUTION:The circumference of a circuit board 3 on which an active element 5 and a passive element 7 are mounted is sealed with an encapsulant resin part 10 formed by hardening, e.g. an epoxy resin; a shield layer 9 is formed on the surface of the resin part 10. The layer 9 is shaped by using a material having a function to shield a magnetic field such as a 42 alloy (composed of 42wt.% of Ni and Fe for a remaining part) sheet, an Ni-plated copper foil, a copper sheet, an aluminum sheet or the like; the material is soldered to a ground pin of an outer lead of a lead frame 1. Thereby, the elements 5, 7 are protected from peripheral magnetism by using the layer 9; each integrated circuit device is shielded as a unit. As a result, while a material for shielding use is reduced, a shield effect can be increased.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an integrated circuit device having a shielding function for protecting internal circuits from surrounding magnetism, an apparatus for manufacturing the same, and a method for manufacturing the same.

[Conventional technology] FIG. 4 is a sectional view showing a conventional integrated circuit device.

A circuit board 3 is fixed onto the lead frame l with an adhesive 2 interposed therebetween. Further, predetermined outer leads (not shown) are formed in the peripheral portion of the lead frame l. A pattern of wiring 4 is formed on the upper surface of the circuit board 3. The active element 5 is mounted on the wiring 4 approximately in the center of the circuit board 3 and is electrically connected to the wiring 4 by a thin metal wire 6. The passive element 7 is mounted across the patterns of the wiring 4 on the circuit board 3, and is electrically connected to the wiring 4 at each contact point. Also,
The wiring 4 and the outer lead of the lead frame l are connected by a thin metal wire 8.

These circuit board 3, active element 5, passive element 7, and thin metal wires 6, 8 are sealed with an exterior resin part 10 made of epoxy resin or the like.

Conventional integrated circuit devices configured in this way do not have a shield to protect the internal circuits from magnetism, so after the integrated circuit device is mounted on the equipment used, it cannot be mounted on a printed circuit board or A part of the printed circuit board is used as a shield unit, and is shielded with a shielding metal foil, metal plate, metal mesh, etc.

FIG. 5 is a sectional view showing a conventional integrated circuit device manufacturing apparatus and manufacturing method.

This manufacturing equipment consists of a mold forming die (
upper mold) 12b and a mold forming die 1 having a concave portion on the upper surface
4b (lower mold), and this mold forming die 12b, 1
It is configured such that resin can be injected into the resin forming cavity that is formed when the concave portions 4b are aligned.

Therefore, when manufacturing an integrated circuit device using this manufacturing apparatus, first, the molds 12b and 14b are assembled by stacking the molds 12b and 14b so that the circuit board 3 is placed in the center of the cavity, and then the molds 12b and 14b are assembled. , 14b, and fix the edge of the lead frame 1 between them. Next, this mold 12b, 1
Resin is injected and filled into the cavity formed by the recessed portion 4b. As a result, when the resin solidifies, an exterior resin part 10 (see FIG. 4) is formed around the circuit board 3, and when the molds 12b and 14b are separated from each other and removed, the exterior resin part 10 seals the circuit board. integrated circuit devices can be manufactured.

[Problems to be Solved by the Invention] However, when the above-described conventional integrated circuit device is mounted on a device in use, it is necessary to provide a shield for each printed circuit board or a portion thereof.

For this reason, the structural design of the shielding metal foil, metal plate, metal mesh, etc. is complicated, which increases the number of mounting steps and material costs, and also increases the size of the equipment used.

Furthermore, in conventional integrated circuit device manufacturing equipment, it is not possible to simultaneously form the exterior resin portion 10 and provide a shield layer around it, so there is a problem that a shield cannot be provided for each integrated circuit device. be.

The present invention has been made in view of such problems, and includes:
An integrated circuit device having a shielding function in which a shield layer is formed around the circuit board and a shield can be provided for each integrated circuit device, and a shielding function that allows a shield layer to be simultaneously and easily formed in a resin sealing process. An object of the present invention is to provide a manufacturing apparatus and a manufacturing method for an integrated circuit device having the following features.

[Means for Solving the Problems] An integrated circuit device having a shielding function according to the present invention includes a circuit board installed on a lead frame, and a semiconductor mounted on the circuit board and connected to the lead frame. The semiconductor device is characterized by having a resin part for sealing an element, the circuit board including the semiconductor element, and a shield layer provided inside or on the resin part to surround the circuit board and the semiconductor element.

Further, the manufacturing apparatus for an integrated circuit device having a shielding function according to the present invention includes a pair of molds that are combined to form a resin molding cavity therein, and a magnet member installed in each of the molds. It is characterized by having the following.

Furthermore, the method for manufacturing an integrated circuit device having a shielding function according to the present invention includes a step of arranging a shielding material fixed by the magnetic force of the magnet member in first and second molds provided with a magnet member; a step of assembling each of the molds by inserting a circuit board on which a semiconductor element is mounted into the cavities of the first and second molds; and a step of injecting resin into the cavity of the mold and solidifying it. It is characterized by having the following.

[Function] In the present invention, a shield layer is formed inside or on the surface of a resin part that seals a circuit board containing a semiconductor element. Therefore, this shield layer can protect the internal circuits of the integrated circuit device from the surrounding magnetism, so that a shield can be provided for each integrated circuit device. Therefore, if an integrated circuit device having this shielding function is mounted on a device to be used, there is no need to form a shield for the whole or part of the printed circuit board after mounting.

Therefore, the man-hours for designing and mounting the shield structure after mounting can be reduced, and the equipment used can be downsized.

Furthermore, since the minimum necessary shield layer can be formed for each integrated circuit device, the cost of materials for the shield layer can be reduced, and the integrated circuit device can be reliably protected from surrounding magnetism.

On the other hand, in the manufacturing apparatus for an integrated circuit device having a shielding function according to the present invention, the shielding material can be arranged and fixed at a predetermined position in the cavity by the magnetic force of the magnet member installed in each mold.

Therefore, in the method of the present invention using this device,
First, the shield material is fixed and placed inside the cavity as described above. Next, after a circuit board including a semiconductor element is inserted into a cavity surrounded by the shielding material and each of the molds is assembled, a molding resin is injected into the cavity and solidified. Then, since the shield material is fixed by the magnet member, it will not move due to the injection resin flow, and a sealing resin portion is formed around the circuit board including the semiconductor element, and this circuit board A shield material is placed on or inside the resin part so as to surround it.

As a result, an integrated circuit device having a shielding function can be easily manufactured.

[Example] Next, an example of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a sectional view showing an integrated circuit device having a shielding function according to an embodiment of the present invention. Components that are the same as those in FIGS. 4 and 5 are given the same reference numerals, and detailed explanations of those portions will be omitted.

As shown in FIG. 1, the periphery of the circuit board 3 on which the active element 5 and the passive element 7 are mounted is sealed with an exterior resin part 10 formed by solidifying epoxy resin, for example.
A shield layer 8 is formed on the surface of this exterior resin part 10. This shield layer 9 is formed of a material that has a function of shielding a magnetic field, such as a 42 alloy (42% by weight Nit, balance Fe) plate, nickel-plated copper foil, copper plate, aluminum foil, or aluminum plate. ing.

Further, the shield layer 8 is generally connected to the ground pin of the outer lead of the lead frame 1 by welding, pressure welding, soldering, or the like.

According to this embodiment, the exterior resin part 1 sealing the circuit board 3
A shield layer 9 is formed to cover the surface of 0. Therefore, the active element 5 and the passive element 7 can be protected from the surrounding magnetism by the shield layer 9, so that a shield can be provided for each integrated circuit device. Therefore, after this integrated circuit device is mounted on a printed circuit board, it is no longer necessary to provide a shield for each printed circuit board or a part thereof, eliminating the need to design a shield structure, reducing mounting man-hours, and saving shielding materials. becomes possible. Moreover, the equipment used can be downsized.

FIG. 2 is a sectional view showing a first embodiment of the manufacturing apparatus and method for manufacturing an integrated circuit device having a shielding function according to the present invention.

As shown in FIG. 2, the molding die (lower die) 14 has a concave portion formed on its upper surface. The magnet 13 is placed in the recess of the mold 14 so as to be inserted through the mold 14 from below. On the other hand, the mold forming die (
The upper mold 12 has a recess formed in its lower surface, and the magnet 11 is inserted into the recess of the mold 12 from above and placed therein. and,
A resin forming cavity is formed by aligning the concave portions of the pair of molds 12 and 14 and overlapping them. The molds 12 and 14 are configured so that resin can be injected into their cavities after they are assembled.

When carrying out the method of this embodiment using the apparatus configured as described above, first, the shield material (shield layer 9) is fixed to the inner surfaces of the molds 12 and 14 by the magnetic force of the magnets 1l and 13, respectively. do. Next, the lead frame 1 is placed on the overlapping surface of the mold 14 so that the circuit board 3 is placed in the center of the recess on the upper surface of the mold 14.

Next, the lower surface recess of the mold 12 is aligned with the upper surface recess of the mold 14, the molds 12 and 14 are overlapped, and the lead frame 1 is sandwiched between them. Then,
The exterior resin part 10 (see FIG. 1) is formed by filling the cavity with resin and solidifying it.

According to this embodiment, for example, during the molding process period (cure time) of about 30 to 150 seconds, the shielding material can be fixed in the cavity against the flow of the injected resin, so it has a shielding function. It is possible to easily manufacture integrated circuit devices.

FIG. 3 is a sectional view showing a second embodiment of the manufacturing apparatus and method for manufacturing an integrated circuit device having a shielding function according to the present invention.

As shown in FIG. 3, the mold 14a has a recessed portion for forming a cavity formed on its upper surface. and,
The magnet 13a is vertically inserted into the mold 14a from the lower surface thereof, and a portion thereof is disposed so as to protrude into the recessed portion of the mold 14a. On the other hand, the mold forming die 12
A is formed with a recess for forming a cavity on its lower surface. A magnet 11a is inserted into the recess of the mold 12a vertically from the top surface of the mold 12a.
is arranged with a part of it protruding.

Then, by aligning the concave portions of the pair of molding dies 12a, 14a and overlapping both dies 12a, 14a, a resin forming cavity is formed.

In the method of this embodiment using the apparatus configured as described above, first, a shielding material (shielding layer 9a) is magnetically fixed to the tips of magnets lla and 13a, and the shielding material (shielding layer 9a) is fixed to the bottom surfaces of the recesses of molds 12a and 14a. The shield material is placed near the inner surfaces of the molds 12a and 14a with a predetermined gap between the shield material and the shield material. Next, the circuit board 3 is placed on the recess on the mold 14a, the recess of the mold 12a is aligned with the recess of the mold 14a, the molds 1 2 at 1 4 a are overlapped, and there is a gap between them. Pinch the edges of lead frame 1. Next, by filling the cavity with resin and solidifying it, an exterior resin part is formed so as to embed the shield layer 9a. As a result, an integrated circuit device in which the shield layer is disposed within the resin portion is manufactured.

This embodiment also has the same effects as the first embodiment. In addition, in this embodiment, since the protruding length of the magnets }lla and 13a into the cavity can be changed, it can be placed at any position up to the thickness of the molded resin on one side (between the lead frame or element surface and the resin part surface). Shield layer 9
A can be formed. For example, when the resin thickness is 4 mm, the shield layer 9a can be placed at any position spaced apart within about 2 mm in the vertical direction of the lead frame 1.

[Effects of the Invention] As described above, according to the present invention, by forming a shield layer around a circuit board including a semiconductor element, a shielding function can be provided to each integrated circuit device. Therefore, if an integrated circuit device having this shielding function is mounted on various devices, there is no need to form a shield after mounting, so there is no need to design a shield structure after mounting, and the mounting process can be shortened. It is possible to reduce the size and weight of the mounted equipment.

In addition, since it is possible to form the minimum required shield layer on each integrated circuit device, it is possible to save shielding materials and further improve the shielding effect for each integrated circuit device compared to conventional shielding methods. can be done.

Furthermore, according to the manufacturing method and manufacturing method of an integrated circuit device having a shielding function according to the present invention, since the shielding material can be fixed in the resin forming cavity by the magnetic member, the shielding material does not move even when the resin is injected. By solidifying the resin portion, the shield layer can be easily placed around the circuit board.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an integrated circuit device having a shield function according to an embodiment of the present invention, and FIG.
3 is a sectional view showing a second embodiment of the manufacturing apparatus and method for manufacturing an integrated circuit device having a shielding function according to the present invention, and FIG. 4 is a sectional view showing a conventional integrated circuit device.
The sectional view shown in FIG. 5 is a sectional view showing a conventional integrated circuit device manufacturing apparatus and manufacturing method. 1; Lead frame, 2; Adhesive, 3; Circuit board, 4;
Wiring, 5; Active element, 8.8; Metal thin wire, 7; Passive element, L9a; Shield layer, 10; Exterior resin part, IL f
lat 13+ 13a; magnet, 12,
12a+ 12b+ 14+ 14a+ 14
b; Mold molding die

Claims (3)

[Claims] (1) a circuit board installed on a lead frame, a semiconductor element mounted on the circuit board and connected to the lead frame, and a resin part that seals the circuit board including the semiconductor element; An integrated circuit device having a shield function, comprising a shield layer provided inside or on the surface of the resin portion to surround the circuit board and the semiconductor element. (2) An integrated circuit device having a shielding function, comprising a pair of molds that are combined to form a resin molding cavity therein, and a magnet member installed in each of the molds. manufacturing equipment. (3) A step of fixing and arranging the shield material in the first and second molds provided with the magnet member by the magnetic force of the magnet member, and placing the circuit board on which the semiconductor element is mounted in the first and second molds. An integrated circuit device having a shielding function, characterized in that the integrated circuit device has the steps of: inserting the resin into the cavities of the molds and assembling the respective molds; and injecting resin into the cavities of the molds and solidifying the resin. Production method.