JPH11254476A - Method for manufacturing resin-encapsulated molded products of electric and electronic parts - Google Patents

Abstract

(57) [Problem] To provide a method for manufacturing a resin-encapsulated molded product of an electric / electronic component, using various thermoplastic resin materials as raw materials, eliminating the need for complicated steps, and being industrially advantageous. To provide a method of manufacturing. SOLUTION: An electric / electronic component is inserted and fixed into a primary molded product manufactured in advance in a divided shape by an injection molding method and integrated to form an insert component, and then the insert component is inserted into a coating molding die. It is characterized in that it is filled with a thermoplastic resin material and filled and molded, and at the same time, a resin molded article having a desired outer shell shape is obtained. [Effect] The above problem is solved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a resin-sealed molded product of an electric / electronic component. For more information,
Electrical and electronic components such as ICs, diodes, capacitors, etc. (hereinafter sometimes referred to as "components")
Are integrated by a resin primary molded product to produce an insert part, and then the insert part is fixed in an injection mold cavity, and the outer periphery of the insert part is covered with a thermoplastic resin to form an electric part. The present invention relates to a method for manufacturing a resin-sealed molded product of an electronic component.

[0002]

2. Description of the Related Art Conventionally, as a sealing technique for protecting electric and electronic parts such as ICs, diodes, capacitors and the like from a mechanical and electrical external environment, sealing with a resin which is inexpensive and excellent in mass productivity is known. Is being done. Methods of sealing with a resin include a casting method using a thermosetting resin, an immersion method, a transfer molding method, a fluid immersion method using a powder resin, and an injection molding method using a thermoplastic resin. .

[0003] In the method using a thermosetting resin, a case 67 having a lead frame 61, a connector 62 and the like in advance as shown in FIG. A hybrid IC having an IC 65 mounted on the surface of a ceramic 64 or the like is inserted, and a thermosetting resin 68 such as a silicone resin or an epoxy resin is cast to obtain a resin-sealed molded product 67. Reference numeral 63 denotes a mounting hole which is utilized when the case 67 is mounted at the place of use. The methods using this thermosetting resin include (1) long curing time, (2) deburring and mold cleaning are required, (3) material handling is difficult, (4) material yield is poor, etc. Therefore, the productivity is poor and it is industrially disadvantageous. Therefore, there is a demand for the development of a sealing molding technique using a thermoplastic resin.

As a method of sealing a resin by injection molding using a thermoplastic resin as a raw material, there is an example in which a diode or the like is sealed and molded. However, in a case of a component such as an IC which itself has poor heat resistance and pressure resistance, it is used. However, resin-encapsulated molded products have poor long-term reliability, and their practical use has been delayed. A sealed molded article made of a thermoplastic resin is usually at a temperature of 200 ° C. or higher and a pressure of 300 ° C.
Since the IC is manufactured under the condition of kg / cm ² or more, there are disadvantages such as breakage of the IC at a high pressure and breakage of the bonding wire. In addition, a complicated process of inserting components such as a hybrid IC into a case equipped with a connector, a mounting seat, and the like, and then casting a molten resin is required.

As a method for solving the above-mentioned disadvantages such as breakage and cutting during manufacturing, Japanese Patent Application Laid-Open Nos. 64-30238, 2-167362, and 6-198 have been disclosed.
No. 669 proposes various techniques. The present applicant has also proposed a new method in Japanese Patent Application No. 06-236047. The technique proposed in Japanese Patent Application Laid-Open No. 64-30238 relates to a method of sealing a semiconductor chip by insert injection molding using a modified poly-4-methyl-1-pentene of a thermoplastic resin. The other three cases relate to a method of sealing a part or the like with a resin by an injection molding method using a liquid crystal polymer.

The methods proposed in these publications are effective as a method of resin-sealing parts and the like by an injection molding method. However, the resins used in these methods are modified poly 4-methyl-1-pentene and liquid crystal polymers, which are poor in versatility, high in material cost, narrow in moldable conditions, and limited in conditions. There is a drawback that molding can be performed only by using the above method.

[0007]

The use and application range of electric and electronic parts is diversified, and the amount of use has been dramatically increased recently. Therefore, it is necessary to appropriately select the resin material of the raw material used for sealing these parts and the like according to the use of the parts and the like, and satisfy the required performance and perform the resin sealing with a less expensive resin material. It is longing.

An object of the present invention is to provide a method for producing a resin-encapsulated molded product of an electric / electronic component, which is not limited to a specific resin material such as modified poly-4-methyl-1-pentene, but to various thermoplastic resin materials. It is an object of the present invention to provide a method for industrially advantageous production without using a complex process as a raw material.

[0009]

In order to achieve the above object, according to the present invention, when manufacturing a resin-encapsulated molded product of an electric or electronic component, first, a primary molded product which has been previously produced in a divided shape by an injection molding method is used. The electric and electronic parts are inserted and fixed into the product, and integrated to form an insert part.Then, the insert part is inserted into the mold cavity for coating molding and fixed, and the molten thermoplastic resin is injected and filled to cover the product. A method of manufacturing a resin-sealed molded product of an electric / electronic component, which is characterized in that at the same time as molding, a resin-sealed molded product having a desired outer shell shape is provided.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.
In the present invention, electric / electronic parts (parts, etc.)
C, diode, capacitor, transistor, LE
D, bimetals, solenoids, antennas, and the like, which are used alone or in a hybridized form on a substrate made of ceramic, glass fiber reinforced epoxy resin, or the like. The size of these electric / electronic parts is not particularly limited, since the size of the concave portion of the primary molded article can be easily changed.

In the method of the present invention, a set of molded products which can be divided into two flat plates is manufactured in advance by an injection molding method, parts and the like are inserted and fixed into the primary molded product, and integrated to form an insert. Parts (see below, see FIG. 3). A primary molded product that can be divided into two flat plates has a shallow recess in which a component or the like can be fitted at the boundary surface when the two products are superposed on each other. By covering and protecting the parts and the like with this primary molded product, the parts composed of a plurality of parts are covered with a thermoplastic resin by the next step of covering molding to obtain a resin molded article having a desired outer shell shape. At this time, breakage due to pressure or cutting of the bonding wire can be excluded.

The primary molded product is made of a thermoplastic resin as a raw material,
It is manufactured in advance by an injection molding method. A gap is formed at the boundary between the two opposing surfaces.Electric and electronic components are inserted into the recesses of one primary molded product, and the other primary molded product is covered, and an adhesive is interposed between the contact surfaces of the two. Then, the parts for the insert are adjusted by bonding and integrating, for example, by welding using an ultrasonic welding machine. The primary molded article is preferably provided with a supporting projection for supporting and fixing itself in the mold cavity for coating molding on the outer surface.

In order to provide a support projection on the outer surface of the primary molded product, a concave portion is provided at a position corresponding to the support projection in a cavity of a mold for molding the primary molded product, thereby providing support for the primary molded product. The projection can be formed. At this time, undercutting may occur depending on the installation position of the supporting projection, so that care must be taken in designing the mold. In addition, as a method of providing the support protrusion, a method of bonding a support protrusion made of a resin of the same material as the primary molded product to the outer surface of the primary molded product via an adhesive may be used.

The thermoplastic resin for molding the primary molded article is not particularly limited as long as it is a resin to which the injection molding method can be applied, and various thermoplastic resins can be used. Therefore, those having excellent insulation properties and good moldability are advantageous. Specific examples of such a thermoplastic resin include olefin resins such as polyethylene and polypropylene, polystyrene, HIPS, AS resin, ABS
Resin, MBS resin, AES resin, AAS resin, styrene resin such as styrene-maleic anhydride copolymer, polyvinyl chloride resin such as polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polyethylene terephthalate, polybutylene terephthalate Engineering plastics such as polyester resins such as polyester resins, polycarbonate resins, polyamide resins, polyphenylene ether, polyoxymethylene, polymethyl methacrylate, polyetherimide, polyphenylene sulfide and polyester liquid crystal polymers, and blends thereof. Can be These resins may be blended with ordinary resin additives such as fillers such as glass fiber and talc, and various auxiliaries.

Next, in the method of the present invention, the insert part manufactured by the above method is inserted and fixed in the mold cavity for coating molding, and injected and filled with a thermoplastic resin to form the coating. Resin molded article. The method of fixing the insert part in the mold cavity for coating molding is as follows: (1) At least one of the fixed side or the movable side is provided with an insert part supporting member capable of moving back and forth into the mold cavity. Using a mold, this support member is advanced into the mold cavity for coating molding to fix the primary molded product in a predetermined position, (2) supported by the support projections provided on the outer surface of the insert part Method.

After fixing in the mold cavity for coating molding by the above method (1), a molten thermoplastic resin is injected and filled into the mold cavity for coating molding, and then, from the inside of the mold cavity for coating molding. The above-mentioned support member is retracted and additionally filled with a molten thermoplastic resin so that a space portion of the support member does not remain. In this case, it is necessary to incorporate the actuator into the mold, lay a communication signal wiring between the actuator and the molding machine, and special equipment is required. After fixing by the above method (2), a normal injection molding method may be used. In the case of the method (2), the boundary may remain as a line between the primary molded article and the coated molded part, or a slight difference may occur in the color tone.Therefore, it is necessary to select molding conditions such that these are inconspicuous. There is.

The resin for coating molding can be selected from the above-mentioned thermoplastic resins for molding primary molded articles. It is preferable that the resin for molding a primary molded article and the resin for molding a coating be combined with each other because of their excellent compatibility because the adhesion between them is improved. When performing coating molding, if molding is performed at a temperature sufficiently higher than the melting temperature of the resin of the primary molded product, the resin on the surface of the primary molded product is melted by the temperature of the molded resin, and when the resin is cured, the primary molded product and the coated molding portion are formed. At the interface portion, both resins are cured in a mixed state, and both are firmly integrated and adhered to each other, which is preferable. In addition, when the injection pressure is too high when performing the coating molding, the primary molded product may be deformed or damaged.Therefore, it is necessary to pay attention to the thickness and the shape of the primary molded product, and to perform molding with a low injection pressure. is necessary. In order to prevent such trouble during molding, analysis by CAE (computer-aided engineering) is an effective means.

Hereinafter, the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following description unless it exceeds the gist.

FIG. 1 is a perspective view of an example of a resin-sealed molded product of an electric / electronic part manufactured by the method of the present invention.
FIG. 3 is a cross-sectional view taken along the line AA in FIG. 1, and FIG. 3 is an exploded view showing a configuration of an example of an insert component. In these figures, 1 is a resin-sealed molded product, 2 is a connector,
3 is a mounting seat, 4 is an electric / electronic component, 5 is an IC, 6, 6 '.
Is a primary molded product, 7 is a lead wire, and 8 is a case with a connector. The primary molded product 6 is integrated with a hybrid IC inserted and fixed therein.

FIG. 4 is a cross-sectional view of a main part of an example of a mold used when manufacturing the resin-sealed molded product 1, and FIG. 5 is a cross-sectional view of a main part of another example. In these figures, 11
Is a fixed mold, 12 is a movable mold, 13 is a slide core, 14 is a primary molded article support member, 15 is a support projection, 1
6 is a sprue. FIG. 4 shows an example in which the primary molded products 6 and 6 ′ are fixed in the mold cavity by the primary molded product support members 14 which can be moved into and out of the fixed and movable mold cavities. In the example shown in FIG. 5, the supporting protrusions 15 provided on the surfaces of the primary molded products 6, 6 '
The example fixed in the mold cavity is shown.

[0021]

Next, the present invention will be described in more detail by way of examples. [Example 1] Injection molding machine (SG7, manufactured by Sumitomo Heavy Industries, Ltd.)
5-SYCAP-M3A), glass fiber reinforced polybutylene terephthalate resin (NOVADUR5710FG3, manufactured by Mitsubishi Engineering-Plastics Corporation)
0) was used as a raw material resin, and under the conditions of a cylinder temperature of 255 ° C. and a mold temperature of 80 ° C., primary molded products 6 and 6 ′ having a split shape shown in FIG. 3 were formed. The hybrid IC is inserted into the concave portion of the primary molded product 6, covered with the primary molded product 6 'so as to cover the same, and then welded and integrated with an ultrasonic welding machine (manufactured by Nippon Emerson Co., Ltd., model BRANSON 8700), and the insert component Was made.

Next, an outer shell-shaped sealing molded product (having the structure shown in FIG. 1) having an insert component support member which can be advanced and retracted on the fixed side and the movable side and provided with a connector, a mounting seat and the like is provided. The component support member for insert was fixed in the obtained mold cavity for coating molding shown in FIG. In the remaining space of the mold cavity for coating molding, glass fiber reinforced polybutylene terephthalate resin (manufactured by Mitsubishi Engineering-Plastics Co., Ltd., NOVADUR5010GN6-30) was used as a raw material resin by an injection molding machine (same as above), and the cylinder temperature was 275. ℃, mold temperature 80 ℃
Injection filling was performed under the following conditions. Then, the insert component support member is retracted from the mold cavity, the molten resin is additionally charged, the resin is cooled and solidified, and the mold is opened to form a resin-sealed molded product of an electric / electronic component. Released from the mold.

Example 2 A primary molded article was molded under the same conditions using the same molding apparatus and resin material as in the example described in Example 1, and an insert part was produced in the same manner. On the outer surface of the insert part, a supporting projection having a diameter of 3 mm and a thickness of 2.5 mm, which was previously cut from a flat plate molded of the same type of resin material as the primary molded product, was approximately 10 mm.
At two-mm intervals, two-component mixed epoxy resin-based adhesive (Cemedine EP-001, manufactured by Cemedine Co., Ltd.) was used. Thereafter, a mold having an outer shell-shaped cavity with an outer shell-shaped sealing molded product (having the structure shown in FIG. 1) having a connector, a mounting seat, and the like (no insert support member is provided) Example 1)
By using the same equipment as in, using the same type of resin material and under the same molding conditions, the insert part is covered and molded with a thickness of 2.5 mm to form an outer shell-shaped electric / electronic part with connectors, mounting seats, etc. A sealed molded article was obtained.

[Evaluation of Molded Article] The condition of the internal element of the molded article obtained in Example 1 and Example 2
Radiographic equipment (SOFTEX PRO, manufactured by Softex Corporation)
As a result of observation using (TEST100 type), no breakage of the element, cutting of the circuit, melting and peeling of the solder, etc. were observed. Further, a cooling / heating cycle test in which the obtained molded product was held in a low temperature constant temperature bath at −40 ° C. for 30 minutes and then held in a high temperature constant temperature bath at 125 ° C. for 30 minutes as one cycle was performed. We performed a test that repeated the cycle,
The internal components remained intact without damage. Further, the obtained molded article was subjected to a moisture resistance test in which the molded article was held in a thermo-hygrostat at a temperature of 80 ° C. and a relative humidity of 90% for 1,000 hours. The internal components were not damaged and the normal state was maintained. I was

[0025]

The present invention has been described in detail above, and has the following particularly advantageous effects, and its industrial utility value is extremely large. 1. According to the method of the present invention, the electric and
Since resin sealing of electronic components becomes possible, curing time is long, deburring and mold cleaning are required, material handling is difficult, material yield is high, as seen in the method using thermosetting resin Therefore, resin-molded molded products of electric and electronic parts having a connector, a mounting seat, etc. can be manufactured with good productivity and industrially advantageous without various problems such as poor quality. 2. According to the method of the present invention, since the electric / electronic parts are inserted into the primary molded article, bonded and integrated, and then the cover molding is performed, it is not necessary to use expensive specific resin as in the prior art, and the product is not required. By selecting the coated thermoplastic resin according to the purpose of use, etc., the cost can be reduced, which is more industrially advantageous. 3. According to the method of the present invention, further, a primary molded product having a divided shape is molded in advance by injection molding using a thermoplastic resin, and electric and electronic components are inserted thereinto and combined and integrated to form insert components. In addition, the primary molded product functions as a cushioning material, and no troubles such as breakage of the IC due to high pressure and breakage of the bonding wire occur during coating molding.

[Brief description of the drawings]

FIG. 1 is a perspective view of an example of a resin-sealed molded product of an electric / electronic component manufactured by a method according to the present invention.

FIG. 2 is a sectional view taken along the line AA in FIG.

FIG. 3 is an exploded view showing a configuration of an example of an insert part.

FIG. 4 is a cross-sectional view of a main part of an example of a mold used when manufacturing a resin-sealed molded product.

FIG. 5 is a cross-sectional view of a main part of another example of a mold used when manufacturing a resin-sealed molded product.

FIG. 6 shows a conventional electric device having a connector, a mounting seat, and the like.
Cross-section of resin-molded molded product of electronic parts

[Explanation of symbols]

 1: Molded resin molding 2: Connector 3: Mounting seat 4: Electric / electronic parts 5: IC 6, 6 ': Primary molded product 7: Lead wire 8: Case with connector 11: Fixed mold 12: Moving side Mold 13: Slide core 14: Insert component support member 15: Support projection 16: Sprue

Claims (3)

[Claims] When manufacturing a resin-encapsulated molded product of an electric / electronic component, first, an electric / electronic component is inserted and fixed into a primary molded product manufactured in advance in a divided shape by an injection molding method, and integrated. And then insert and fix this insert part into the mold cavity for coating molding, inject and fill the molten thermoplastic resin to form the coating, and at the same time, form a resin molded article with the desired outer shell shape. A method for producing a resin-encapsulated molded product of an electric / electronic component, characterized in that: 2. A coating molding die having an insert component support member which can be inserted into and retracted from at least one of a fixed side and a movable side into a cavity during coating molding. Into the mold cavity for coating molding to fix the insert part in a predetermined position, and then inject and fill a molten thermoplastic resin into the mold cavity for coating molding, and then into the mold cavity for coating molding. The above-mentioned insert component support member is retracted, and the molten thermoplastic resin is additionally charged. After the filled molten thermoplastic resin is cooled and solidified, the mold is opened to form a resin-sealed molded product of an electric / electronic component. 2. The method for producing a resin-sealed molded product of an electric / electronic component according to claim 1, wherein the mold is released from the coating molding die. 3. A plurality of supporting projections are provided on the outer surface of the insert part to abut the interior of the mold cavity for coating and fix the insert itself, and the inner wall of the mold cavity for coating is provided with a plurality of support projections. Inject the molten thermoplastic resin into the mold cavity with the support projections in contact with it,
The method for producing a resin-sealed molded product of an electric / electronic component according to claim 1, wherein a resin-sealed molded product having a desired outer shell shape is obtained.