JP2013012531A - Member for mounting electronic component and electronic apparatus - Google Patents

Abstract

The present invention provides an electronic component mounting member and an electronic device that improve the heat dissipation of an electronic component while improving the reliability of electrical connection of the electronic component.
An electronic component mounting member (1) is provided on an insulating substrate (11), a mounting conductor layer (12) on which an electronic component (2) is mounted, and an upper surface of the insulating substrate (11). And a connecting conductor layer 13 that is electrically connected to the electronic component 2 by a cage bonding wire 3. The mounting conductor layer 12 is thicker than the connection conductor layer 13.
[Selection] Figure 1

Description

  The present invention relates to an electronic component mounting member and an electronic device for mounting an electronic component such as a light emitting element.

  2. Description of the Related Art Conventionally, an electronic component mounting member for mounting an electronic component such as a light emitting element or a solid-state imaging element includes an insulating base, a mounting conductor layer provided on the upper surface of the insulating base, and a region around the mounting conductor layer And a connecting conductor layer provided on the substrate. The electronic component is joined to the mounting conductor layer by a joining member and is electrically connected to the connecting conductor layer by a connecting member such as a bonding wire.

JP 2011-009401 A

  However, with the recent increase in output of electronic devices, the amount of heat generated by electronic components has increased. For example, when a light-emitting element is used as an electronic component, the amount of heat generated by the light-emitting element is increased with the increase in luminance of the light-emitting device. Furthermore, with the miniaturization of electronic devices, the insulating base of electronic component mounting members has become smaller, making it difficult to radiate electronic components.

  The present invention has been devised in view of the above-mentioned problems of the prior art, and the object thereof is an electronic component mounting member that improves the heat dissipation of the electronic component while improving the reliability of the electrical connection of the electronic component. And providing an electronic device.

  An electronic component mounting member according to one aspect of the present invention includes an insulating base, a mounting conductor layer provided on the upper surface of the insulating base, and an electronic component mounted thereon, and a bonding wire provided on the upper surface of the insulating base. And a connection conductor layer electrically connected to the electronic component. The mounting conductor layer is thicker than the connection conductor layer.

  An electronic device according to another aspect of the present invention includes the electronic component mounting member and an electronic component that is mounted on the mounting conductor layer of the electronic component mounting member and is electrically connected to the connecting conductor layer by a bonding wire. And.

  In the electronic component mounting member according to one aspect of the present invention, the connecting conductor layer provided on the upper surface of the insulating base is thicker than the connecting conductor layer provided on the upper surface of the insulating base, thereby The amount of heat conduction in the mounting conductor layer can be increased while maintaining the desired hardness required for wire bonding, and the heat dissipation of the electronic component has been improved while improving the reliability of the electrical connection of the electronic component. An electronic component mounting member can be realized.

  An electronic device according to another aspect of the present invention includes the electronic component mounting member and an electronic component that is mounted on the mounting conductor layer of the electronic component mounting member and is electrically connected to the connecting conductor layer by a bonding wire. , The reliability of the electrical connection of the electronic component is improved and the heat dissipation of the electronic component is improved.

(A) is a top view which shows the electronic device in the 1st Embodiment of this invention, (b) is a longitudinal cross-sectional view in AA of the electronic device shown by (a). FIG. 2 is an enlarged view of a portion indicated by a symbol B in the electronic device shown in FIG. 3 shows a modification of the electronic device shown in FIG. (A) is a top view which shows the electronic device in the 2nd Embodiment of this invention, (b) is a longitudinal cross-sectional view in AA of the electronic device shown by (a). FIG. 5 is an enlarged view of a portion indicated by a symbol B in the electronic device shown in FIG. It is a longitudinal cross-sectional view which shows the structure of the mounting conductor layer in the electronic device of the 3rd Embodiment of this invention. It is a top view which shows the electronic device of the 3rd Embodiment of this invention.

  Hereinafter, some exemplary embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
As shown in FIGS. 1A and 1B, the electronic device according to the first embodiment of the present invention includes an electronic component mounting member 1 and an electronic component mounted on the electronic component mounting member 1. 2 and an enclosing member 4 provided on the electronic component mounting member 1. The electronic component 2 is electrically connected to the electronic component mounting member 1 by a plurality of bonding wires 3. Hereinafter, a light-emitting element will be described as an example of the electronic component 2.

  The electronic component mounting member 1 includes an insulating substrate 11, a mounting conductor layer 12 and a plurality of connecting conductor layers 13 provided on the upper surface of the insulating substrate 11, and a plurality of terminal conductors provided on the lower surface of the insulating substrate 11. The layer 14 and the light reflecting layer 15 provided on the inclined surface of the insulating base 11 are included.

  The insulating base 11 includes a lower base 11a and an upper base 11b provided on the lower base 11a. The lower base 11a has a flat plate shape, and the upper base 11b has a frame shape. The insulating base 11 has a cavity. The insulating substrate 11 is made of a ceramic such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body. The lower base 11a and the upper base 11b are integrally formed by firing.

As shown in FIG. 2, the mounting conductor layer 12 includes a metallized layer 12a and a plating layer 12b. The metallized layer 12a is made of, for example, a metal such as tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper (Cu), and is integrally formed with the insulating substrate 11 by firing. The metallized layer 12a has a thickness included in a range of 5 to 15 μm, for example. The plating layer 12b is formed on the surface of the metallized layer 12a by electroplating or electroless plating. The plating layer 12b is formed on the metallized layer 12a mainly composed of tungsten or molybdenum, for example, and has a nickel layer having a thickness within a range of 1 to 10 μm, and is formed on the nickel layer and has a thickness of 20 to 80 μm. A copper layer having a thickness included in the range of 1, a nickel layer formed on the copper layer and having a thickness included in the range of 1 to 10 μm, and formed on the nickel layer and included in the range of 0.1 to 3 μm And a gold layer having a thickness. The mounting conductor layer 12 has a higher thermal conductivity than the insulating substrate 11. As another example of the mounting conductor layer 12, the mounting conductor layer 12 may be electrically connected to the electronic component 2.

  The connection conductor layer 13 includes a metallized layer 13a and a plating layer 13b. The metallized layer 13a is made of, for example, a metal such as tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper (Cu), and is integrally formed with the insulating substrate 11 by firing. The metallized layer 13a has a thickness included in the range of 5 to 15 μm, for example. The plating layer 13b is formed on the surface of the metallized layer 12a by electroplating or electroless plating. The plating layer 13b is formed on, for example, a metallized layer 13a mainly composed of tungsten or molybdenum, and has a nickel layer having a thickness included in the range of 1 to 10 μm, and is formed on the nickel layer and has a thickness of 5 to 20 μm. A copper layer having a thickness included in the range of 1, a nickel layer formed on the copper layer and having a thickness included in the range of 1 to 10 μm, and formed on the nickel layer and included in the range of 0.1 to 3 μm And a gold layer having a thickness.

  The thickness 12H of the mounting conductor layer 12 is larger than the thickness 13H of the connecting conductor layer 13. In the example of the mounting conductor layer 12 and the connection conductor layer 13 described above, the thickness 12H of the mounting conductor layer 12 is 20 to 80 μm of the copper layer included in the plating layer 12b of the mounting conductor layer 12 and the connection conductor. The thickness of the connecting conductor layer 13 is larger than the thickness 13H by the difference between the thickness of the copper layer contained in the plating layer 13b of the layer 13 and 5 to 20 μm.

  Referring to FIG. 1 again, the plurality of terminal conductor layers 14 are electrically connected to the plurality of connection conductor layers 13 via via conductors provided in the lower base 11a, for example. For example, a power supply voltage and a ground voltage are applied to the plurality of terminal conductor layers 14. The plurality of terminal conductor layers 14 include, for example, a metallized layer such as tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), or copper (Cu), and a nickel layer formed on the metallized layer. And a plating layer including a gold layer formed on the nickel layer.

  The light reflecting layer 15 is provided on the inner peripheral surface of the frame-shaped upper base 11b. The light reflecting layer 15 includes a metallized layer such as tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), or copper (Cu), and a plating layer formed on the metallized layer. . The plating layer includes a nickel layer formed on the metallized layer, a gold layer formed on the nickel layer, and a silver layer formed on the gold layer. When the electronic component 2 is a light emitting element, the light reflecting layer 15 reflects light emitted from the electronic component upward.

  The electronic component 2 is a light emitting element, for example. An example of the light emitting element is a light emitting diode (LED) made of a semiconductor material. The electronic component 2 is provided on the mounting conductor layer 12 and is electrically connected to the plurality of connection conductor layers 13 by a plurality of bonding wires. The electronic component 2 is joined to the mounting conductor layer 12 by a joining member.

  The enclosing member 4 is provided inside the upper base body 11 b and covers the electronic component 2. When the electronic component 2 is a light emitting element, the enclosing member 4 includes a translucent resin member such as silicone and a fluorescent member contained in the resin member. The fluorescent member emits secondary light according to the primary light emitted from the electronic component 2.

  The electronic component mounting member 1 in the present embodiment is provided on the upper surface of the insulating base 11, the mounting conductor layer 12 on which the electronic component 2 is mounted, and the upper surface of the insulating base 11. And a connecting conductor layer 13 that is electrically connected to the electronic component 2, and the mounting conductor layer 12 is thicker than the connecting conductor layer 13, so that it is necessary for wire bonding in the connecting conductor layer 13. It is possible to increase the heat conduction amount in the mounting conductor layer 12 while maintaining the hardness of the electronic component 2 and to improve the heat dissipation of the electronic component 2 while improving the reliability of the electrical connection of the electronic component 2 The member 1 can be realized.

When the insulating substrate 1 is made of an aluminum oxide sintered body, a metallized layer made of copper (Cu) or copper tungsten (CuW) or the like is used as the metallized layer 12a of the mounting conductor layer 12, or the mounting conductor By interposing a plating layer made of a copper layer or the like inside the plating layer 12b of the layer 12, the amount of heat conduction in the mounting conductor layer 12 can be further improved.

  The electronic device according to this embodiment includes the above-described electronic component mounting member 1 and the electronic component 2 mounted on the mounting conductor layer 12 and electrically connected to the connecting conductor layer 13 by the bonding wire 3. As a result, the reliability of the electrical connection of the electronic component 2 is improved and the heat dissipation of the electronic component 2 is improved.

  As shown in FIG. 3, in order to make the thickness 12H of the mounting conductor layer 12 larger than the thickness 13H of the connecting conductor layer 13, the metallized layer 12a of the mounting conductor layer 12 is connected to the connecting conductor. The layer 13 may have a structure thicker than the metallized layer 13a.

(Second Embodiment)
A second embodiment of the present invention will be described with reference to FIGS. 4 (a), 4 (b) and FIG. In the electronic device according to the second embodiment, a configuration different from that of the electronic device according to the first embodiment is that a heat radiating member 16 is further included. Other configurations are the same as those of the electronic device according to the first embodiment.

  The heat dissipating member 16 is provided immediately below the mounting conductor layer 12 inside the insulating base 11, and has an upper end portion having a larger area than the mounting conductor layer 12 in a plan view. In FIG. 4A, the heat radiating member 16 is indicated by a broken line in a state where the insulating base 11 and the like are seen through. The heat dissipating member 16 is made of a material having a higher thermal conductivity than the insulating base 11 such as copper tungsten (CuW).

  The electronic component mounting member 1 of the present embodiment further includes a heat radiating member 16 provided immediately below the mounting conductor layer 12 inside the insulating base 11, and the heat radiating member 16 is seen through the mounting conductor layer 12 in plan view. Since the upper end of the heat radiating member 16 spreads below the mounting conductor layer 12, the heat conduction efficiency from the mounting conductor layer 12 to the heat radiating member 16 is improved. In addition, since the edge of the upper end portion of the heat radiation member 16 is located outside the region where the mounting conductor layer 12 is formed, for example, for mounting due to a difference in thermal expansion coefficient or thermal contraction rate between the insulating base 11 and the heat radiation member 16 The deformation of the conductor layer 12 is reduced. Therefore, the electronic component mounting member 1 of the present embodiment is improved in terms of heat dissipation of the electronic component 2 mounted on the mounting conductor layer 12, and the mounting reliability of the electronic component 2 on the mounting conductor layer 12 is improved. Has been improved.

  The electronic device according to the present embodiment includes the above-described electronic component mounting member 1 and the electronic component 2 mounted on the mounting conductor layer 12, thereby improving the heat dissipation of the electronic component 2. The mounting reliability of the electronic component 2 is improved.

(Third embodiment)
A third embodiment of the present invention will be described with reference to FIG. In the electronic device of the third embodiment, a configuration different from the electronic device of the first embodiment is the structure of the mounting conductor layer 12. Other configurations are the same as those of the electronic device according to the first embodiment.

The mounting conductor layer 12 includes a lower conductor layer provided on the insulating base 11, and an upper conductor layer provided on the lower conductor layer and having a size smaller than that of the lower conductor layer. In the example shown in FIG. 6, the lower conductor layer is lower metallization layer 12a _1, the upper conductor layer as an upper metallization layer 12a _2. As shown in Figure 7, the upper metallization layer 12a is smaller than the lower metallization layer 12a _1, it means that the upper metallization layer 12a overlaps the lower metallization layer 12a ₁ in a plan perspective.

  In the electronic element mounting member 1 of the present embodiment, the mounting conductor layer 12 includes a lower conductor layer provided on the insulating base 11, and an upper portion provided on the lower conductor layer and having a smaller dimension than the lower conductor layer. By including the conductor layer, for example, compared to a structure in which the mounting conductor layer 12 is composed of a single layer, it is possible to reduce the concentration of thermal stress on a specific portion. Even when the electronic component 2 having a large calorific value is mounted, the deformation of the mounting conductor layer 12 due to concentration of thermal stress is reduced, and the electronic component mounting member 1 with high mounting reliability of the electronic component 2 is provided. be able to.

  The electronic device according to the present embodiment includes the above-described electronic component mounting member 1 and the electronic component 2 mounted on the mounting conductor layer 12, so that the mounting conductor layer 12 is generated by heat generation of the electronic component 2. The deformation is reduced, and the mounting reliability of the electronic component 2 is improved.

  In addition, this invention is not limited to the above-mentioned example, A various change is possible. For example, a castoration conductor formed on the side surface of the insulating substrate 11 may be used as the terminal conductor layer 14, or the terminal conductor layer 14 may be formed on the outer peripheral portion on the upper surface of the insulating substrate 11.

  In the example shown in FIGS. 1 and 4, one electronic component 2 is mounted on one mounting conductor layer 12, but a plurality of electronic components 2 are mounted on one mounting conductor layer 12. Alternatively, a plurality of mounting conductor layers 12 may be provided in accordance with the number of the plurality of electronic components 2.

1 Electronic component mounting material
11 Insulating substrate
12 Conductive layer for mounting
13 Conductor layer for connection
14 Terminal conductor layer
15 Light reflecting layer
16 Heat dissipation member 2 Electronic component 3 Bonding wire 4 Encapsulating member

Claims (4)

An insulating substrate;
A mounting conductor layer provided on an upper surface of the insulating substrate, on which an electronic component is mounted;
Provided on the upper surface of the insulating base, and provided with a connecting conductor layer electrically connected to the electronic component by a bonding wire;
The electronic component mounting member, wherein the mounting conductor layer is thicker than the connection conductor layer. It further includes a heat dissipating member provided immediately below the mounting conductor layer inside the insulating base,
2. The electronic component mounting member according to claim 1, wherein the heat dissipating member has a larger upper end than the mounting conductor layer in a plan view.   The mounting conductor layer includes a lower conductor layer provided on the insulating base, and an upper conductor layer provided on the lower conductor layer and having a size smaller than that of the lower conductor layer. The electronic component mounting member according to claim 1. An electronic component mounting member according to any one of claims 1 to 3,
An electronic device comprising: an electronic component mounted on the mounting conductor layer of the electronic component mounting member and electrically connected to the connecting conductor layer by a bonding wire.

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