JP2009021384A - Electronic component and light emitting device - Google Patents

Abstract

An electronic component capable of improving heat dissipation characteristics while suppressing an increase in cost is provided.
A circuit board on which a wiring electrode connected to a circuit element such as an LED element is formed; a heat dissipating portion provided on the back surface of the circuit board and thermally connected to the circuit element; In the electronic component 1 provided with the heat radiating plate 20 fixed to the back surface of the portion 12 by the fixing material 19, a spacer portion 18 made of a good thermal conductor that forms a gap between the heat radiating portion 12 and the heat radiating plate 20 is provided and fixed. The material 19 was filled in the gap, and the heat radiating portion 12 and the heat radiating plate 20 were fixed.
[Selection] Figure 2

Description

  The present invention relates to an electronic component having a circuit element accompanied by heat generation such as an LED element. Moreover, this invention relates to the light-emitting device provided with surface mount type LED.

  A conventional electronic component is disclosed in Patent Document 1. 17 and 18 are a front sectional view and a side sectional view showing the electronic component. The electronic component 1 constitutes a surface-mounted LED having a circuit element 7 made of an LED element. In the electronic component 1, a heat radiating plate 2 made of metal is fixed to the back surface of the circuit board 3 on which the wiring electrode 4 made of a conductor pattern is formed with an adhesive or the like.

  A substantially circular opening 3 a is formed in the circuit board 3, and first and second protrusions 3 b and 3 c that have wiring electrodes 4 and protrude in two directions and face each other are provided in the opening 3 a. The circuit element 7 is disposed between the first and second protrusions 3b and 3c, and is fixed to the heat radiating plate 2 with an adhesive having a high thermal conductivity.

  A cylindrical frame 6 fixed to the heat radiating plate 2 with an adhesive having a high thermal conductivity or the like is disposed in the opening 3a. The frame 6 made of metal has an inner surface 6b formed of a conical surface. The frame 6 is formed with a clearance groove 6a that straddles the first and second protrusions 3b and 3c and avoids interference with the first and second protrusions 3b and 3c. An insulating layer 5 is formed on the surface of the wiring electrode 4 on the first and second projecting portions 3b and 3c facing the relief groove 6a. Thereby, the short circuit with the wiring electrode 4 and the frame 6 is prevented.

  The wiring electrode 4 is formed with an external connection terminal (not shown) arranged outside the frame body 6 and an element connection terminal (not shown) arranged inside. The circuit element 7 is connected to the element connection terminals on the first and second protrusions 3b and 3c by lead wires 8. The inside of the frame 6 is filled with a translucent resin 9, and the circuit element 7 and the lead wire 8 are sealed. The external connection terminal is connected to an external substrate or the like and supplies power to the circuit element 7.

  In the electronic component 1 having the above configuration, when electric power is supplied from the outside via the external connection terminal, the circuit element 7 emits light and emits light. The light emitted from the circuit element 7 is reflected and collected by the inner surface 6b of the frame 6 to obtain the electronic component 1 having high luminous efficiency. The heat generated by the circuit element 7 is transmitted to the heat radiating plate 2 and radiated from the heat radiating plate 2, and is also transmitted to the frame body 6 through the radiating plate 2 and radiated from the frame body 6. Thereby, the electronic component 1 having a large heat radiation area and high heat radiation efficiency can be obtained.

Japanese Patent Laying-Open No. 2005-50838 (pages 6 to 10, FIG. 4)

  When the drive current is increased in order to obtain high brightness, the LED element increases in power loss and becomes high temperature. In addition, since the LED element has a higher photoelectric conversion efficiency as the temperature is lower, the luminance is lowered at a higher temperature. In addition, the lifetime of the LED element is shortened at a high temperature, and the reliability is lowered. For this reason, there is a need for an electronic component 1 with higher heat dissipation efficiency that can further dissipate the heat generated by the high-luminance circuit element 7. For this reason, if the heat sink 2 is formed thick, the heat capacity increases, and the heat generated by the circuit element 7 can be efficiently radiated.

  However, if the heat sink 2 is formed thick, the processing load when the electronic component 1 is separated into pieces by cutting becomes large. For this reason, there is a problem that the cutting blade is easily damaged, and the cost of the electronic component 1 is increased. Moreover, a big burr | flash generate | occur | produces on the lower surface of the heat sink 2 by the increase in a process load. As a result, there is a problem in that the yield decreases due to poor appearance and the workability when the electronic component 1 is incorporated into a device such as a light emitting device is lowered, resulting in an increase in the manufacturing cost of the device. In addition, it is not restricted to an LED element, There exists the same problem in the electronic component which has a circuit element with a heat_generation | fever.

  An object of this invention is to provide the electronic component and light-emitting device which can suppress the increase in cost and can improve a thermal radiation characteristic.

  To achieve the above object, the present invention provides a circuit board on which a wiring electrode connected to a circuit element is formed, a heat dissipating part provided on the back surface of the circuit board and thermally connected to the circuit element, and the heat dissipation In an electronic component comprising a heat sink fixed to the back surface of a part by a fixing material, a spacer portion made of a good thermal conductor that forms a gap between the heat dissipation portion and the heat dissipation plate is provided, and the fixing material is the gap It is characterized by being filled in.

  According to this configuration, electric power is supplied to the circuit element via the wiring electrode. The circuit element is in thermal contact with the heat radiating portion in contact with the heat radiating portion or through a conductor or the like. A heat radiating plate is fixed to the heat radiating portion by a fixing material. A spacer portion is provided between the heat radiating portion and the heat radiating plate, and the fixing material is filled in a gap formed by the spacer portion. When the spacer portion is formed of a member separate from the heat radiating portion and the heat radiating plate, both surfaces of the spacer portion are in close contact with the heat radiating portion and the heat radiating plate. When the spacer portion is formed integrally with one of the heat radiating portion and the heat radiating plate, the spacer portion is in close contact with the other. The heat generation of the circuit element due to the power supply is transmitted from the heat radiating portion to the heat radiating plate through the spacer, and is radiated from the heat radiating portion and the heat radiating plate.

  According to the present invention, in the electronic component configured as described above, a peripheral surface of the heat radiating portion is formed of a cut surface, and the spacer portion is disposed apart from a peripheral edge of the heat radiating portion. According to this configuration, the heat radiating part is separated into pieces by cutting. When the spacer portion is formed integrally with the heat radiating portion, the spacer portion is not cut when the heat radiating portion is separated. Further, when the spacer portion is not formed integrally with the heat radiating portion, the burr generated at the periphery when the heat radiating portion is separated into pieces and the spacer portion do not face each other.

  According to the present invention, in the electronic component configured as described above, the spacer portion is disposed to face the circuit element. According to this configuration, the spacer portion is disposed directly below the circuit element.

  According to the present invention, in the electronic component configured as described above, the spacer portion includes a protrusion formed integrally with the heat dissipation portion or the heat dissipation plate.

  According to the present invention, in the electronic component configured as described above, the heat radiating plate has a groove portion that is recessed to face the heat radiating portion. According to this configuration, the upper heat radiating portion and the lower heat radiating plate are cooled by the airflow flowing through the groove.

  According to the present invention, in the electronic component having the above-described configuration, a plurality of the circuit elements are periodically arranged on the circuit board, and the groove portion is formed to extend in the periodic direction of the circuit elements. According to this configuration, the electronic component is configured in an array in which circuit elements are arranged one-dimensionally or two-dimensionally, and an airflow flows along each circuit element.

  According to the present invention, in the electronic component configured as described above, the heat radiating portion is formed of a conductor pattern formed on the circuit board.

  According to the present invention, in the electronic component having the above-described configuration, the heat radiating portion is formed of a plate-like heat good conductor fixed to the circuit board.

  According to another aspect of the invention, there is provided an electronic component comprising: a circuit board on which wiring electrodes connected to the circuit element are formed; and a heat radiating portion provided on the back surface of the circuit board and thermally connected to the circuit element. It is characterized in that a spacer portion made of a protrusion is integrally provided on the back surface of the portion.

  According to the present invention, in the electronic component configured as described above, the circuit element includes an LED element.

  The present invention also provides a surface mounting comprising a circuit board on which wiring electrodes connected to a circuit element made of LED elements are formed, and a heat radiating plate provided on the back surface of the circuit board and thermally connected to the circuit element. In a light-emitting device in which a type LED is fixed to a housing made of a good thermal conductor by a fixing material, a spacer portion made of a good thermal conductor is formed to form a gap between the heat radiating portion and the housing, and the fixing material is the gap It is characterized by being filled in.

  According to this configuration, electric power is supplied to the circuit element composed of the LED element via the wiring electrode. The circuit element is thermally connected to the heat dissipating part closely or via a conductor or the like. The casing of the light emitting device is fixed to the heat radiating portion with a fixing material. A spacer portion is provided between the heat radiating portion and the housing, and the fixing material is filled in a gap formed by the spacer portion. When the spacer portion is formed of a member separate from the heat dissipation portion and the housing, both surfaces of the spacer portion are in close contact with the heat dissipation portion and the housing. When the spacer portion is formed integrally with one of the heat radiating portion and the housing, the spacer portion is in close contact with the other. The heat generated by the circuit element due to the power supply is transmitted from the heat radiating portion to the housing via the spacer, and is radiated from the heat radiating portion and the housing.

  According to the present invention, in the light emitting device configured as described above, a peripheral surface of the heat radiating portion is formed by a cut surface, and the spacer portion is disposed excluding a peripheral edge of the heat radiating portion.

  According to the present invention, in the light emitting device having the above-described configuration, the spacer portion is disposed to face the circuit element.

  According to the present invention, in the light emitting device having the above-described configuration, the spacer portion includes a protrusion formed integrally with the heat radiating portion or the housing.

  According to the present invention, in the light emitting device configured as described above, the heat radiating portion is formed of a conductor pattern formed on the circuit board.

  According to the present invention, in the light emitting device having the above-described configuration, the heat dissipating part is formed of a plate-like heat good conductor fixed to the circuit board.

  According to the electronic component of the present invention, the spacer portion is provided between the heat radiating portion and the heat radiating plate arranged on the back surface of the circuit board, and the heat radiating portion and the heat radiating plate are fixed by the fixing material filled in the gap by the spacer portion. The heat radiating portion and the heat radiating plate are in close contact with the spacer portion without the adhesive layer interposed therebetween. Accordingly, the heat generated by the circuit element can be transmitted to the heat sink with little heat loss, and the heat dissipation efficiency of the electronic component can be improved.

  Moreover, since there is little heat loss and a heat radiating part and a heat radiating plate can be fixed, the same high heat radiating characteristic as the case where a heat radiating part and a heat radiating plate are formed with the same member with a thick metal etc. can be acquired. Thus, after the thin heat radiating part is cut into individual pieces, the heat radiating part and the heat radiating plate are fixed, and it is possible to reduce burrs during cutting and damage to the blade. Therefore, the cost of the electronic component can be reduced.

  Further, according to the present invention, the peripheral surface of the heat radiating portion is formed by a cut surface, and the spacer portion is arranged away from the peripheral edge of the heat radiating portion, so when the spacer portion is integrated with the heat radiating portion, The spacer is not cut. For this reason, a burr | flash is not generated in a spacer part, but formation of the contact bonding layer by a clearance gap producing between a spacer part and a heat sink or a housing | casing by a burr | flash is avoided. In addition, when the spacer part is not integrated with the heat radiating part, an adhesive layer is formed by a gap generated between the spacer part and the heat radiating part due to the burr generated at the periphery of the heat radiating part when the heat radiating part is separated. Avoided. Therefore, the heat dissipation efficiency of the electronic component and the light emitting device can be reliably improved.

  Further, according to the present invention, since the spacer portion is arranged to face the circuit element, the heat generated by the circuit element is easily transmitted to the spacer portion. Therefore, the heat dissipation efficiency of the electronic component and the light emitting device can be further improved.

  Further, according to the present invention, since the spacer portion is composed of a protrusion integrally formed on one of the heat radiating portion and the heat radiating plate or one of the heat radiating portion and the housing, the spacer portion can be easily formed and the number of parts can be increased. Can be prevented.

  According to the electronic component of the present invention, since the heat sink has a groove portion that is recessed to face the heat dissipation portion, the airflow can flow through the groove portion and the heat dissipation efficiency of the electronic component can be further improved.

  In addition, according to the electronic component of the present invention, the plurality of circuit elements are periodically arranged on the circuit board and the grooves are formed so as to extend in the period direction of the circuit elements. be able to.

  Further, according to the present invention, since the heat radiating portion is made of a conductor pattern formed on the circuit board, the heat radiating portion can be formed thin to easily reduce the occurrence of burrs and breakage of the blades when singulated.

  In addition, according to the present invention, since the heat radiating portion is made of a plate-like heat good conductor fixed to the circuit board, the heat radiating portion can be formed thin to easily reduce the occurrence of burrs and breakage of the blades when singulated. it can.

  According to the electronic component of the present invention, since the spacer portion made of the protrusion is integrally provided on the back surface of the heat radiating portion, a gap is formed by the spacer portion between the housing and the like to which the electronic component is attached. By filling the gap with the fixing material, the spacer portion and the housing are brought into close contact with each other without using the adhesive layer. Therefore, the heat generated by the circuit element can be transmitted to the housing with little heat loss, and the heat dissipation efficiency of the electronic component can be improved.

  Further, according to the electronic component of the present invention, since the circuit element is composed of the LED element, it is possible to obtain the electronic component having the LED element with high luminance and high reliability while suppressing the heat generation.

  Further, according to the light emitting device of the present invention, the spacer portion is provided between the heat radiation portion disposed on the back surface of the circuit board and the housing made of the good thermal conductor, and the heat radiation portion and the housing are bonded to each other by the fixing material filled in the gap between the spacer portions. Since the heat sink is fixed, the heat radiating portion and the housing are in close contact with the spacer portion without the adhesive layer interposed therebetween. Therefore, heat generated by the circuit element can be transmitted to the housing with little heat loss, and the heat dissipation efficiency of the light-emitting device having the surface-mounted LED can be improved.

  Moreover, since there is little heat loss and the heat radiating part and the housing can be fixed, heat can be sufficiently radiated even if the heat radiating part is thinned. As a result, the thin heat dissipating part can be cut into individual pieces, and then the heat dissipating part and the housing are fixed together, thereby reducing burr at the time of cutting and reducing blade breakage. Therefore, the cost of the light emitting device can be reduced.

  Embodiments of the present invention will be described below with reference to the drawings. For convenience of explanation, the same parts as those in the conventional example shown in FIGS. 17 and 18 are given the same reference numerals. FIG. 1 is a perspective view showing the electronic component of the first embodiment. In the electronic component 1, a first heat radiating portion 11 made of a conductor pattern is formed on a circuit board 3 having a base material 3f made of an insulator.

  A cylindrical frame 6 made of a metal such as aluminum die casting is installed on the first heat radiating portion 11. The inner surface 6b of the frame 6 is a conical surface. External connection terminals 4b are provided at the four corners of the circuit board 3, and relief portions 6e for exposing the external connection terminals 4b are formed at the four corners of the frame 6.

  A second heat dissipating part 12 (heat dissipating part) made of a plate-like heat good conductor such as a metal plate is fixed to the back surface of the circuit board 3. The frame 6, the circuit board 3, and the second heat radiating portion 12 are separated into pieces simultaneously by cutting with a blade or the like from a state in which a large number are integrally arranged. Thereby, the frame 6, the circuit board 3, and the 2nd thermal radiation part 12 form the surrounding surface which consists of the same surface.

  A heat radiating plate 20 made of a plate-like heat good conductor such as a metal plate is fixed to the back surface of the second heat radiating portion 12. As will be described in detail later, the second heat radiating portion 12 and the heat radiating plate 20 are in close contact with each other via a spacer portion 18 (see FIG. 2). The heat radiating plate 20 is fixed to the second heat radiating portion 12 after the frame body 6, the circuit board 3 and the second heat radiating portion 12 are integrally separated. Since the heat radiating plate 20 is not separated into one piece with the frame 6, the circuit board 3, and the second heat radiating portion 12, there is no need to consider burrs or blade damage during cutting, and the thick heat radiating plate 20 can be used.

  An opening 16 penetrating the circuit board 3 is formed inside the frame body 6. A circuit element 7 made of an LED element is installed in the opening 16. Therefore, the electronic component 1 constitutes a surface-mounted LED having a circuit element 7 made of an LED element. One circuit element 7 or a plurality of circuit elements 7 may be installed in the opening 16. Light emitted from the circuit element 7 is reflected by the inner surface 6b of the frame body 6 and collected.

  Around the opening 16, a plurality of element connection terminals 4 a formed on the circuit board 3 apart from the first heat radiating part 11 are provided. Each terminal of the circuit element 7 is connected to each element connection terminal 4 a by a lead wire 8. The inside of the frame body 6 is filled with a translucent resin (not shown), and the circuit element 7 and the lead wire 8 are sealed.

  FIG. 2 is a perspective view of the cross section of FIG. FIG. 3 shows a cross-sectional view of FIG. 1 cut along AA. FIG. 4 is a perspective view of the cross section of FIG. FIG. 5 shows a cross-sectional view of FIG. 1 cut along BB.

  A wiring electrode 4 made of a conductor pattern is formed inside the base material 3f of the circuit board 3. The wiring electrode 4 is electrically connected to the element connection terminal 4a and the external connection terminal 4b through the through hole 4c. A plurality of external connection terminals 4b are provided corresponding to each element connection terminal 4a, and power is supplied to the circuit element 7 via the external connection terminal 4b.

  The outer periphery of the frame body 6 is formed to be larger than the outer diameter of the first heat radiating portion 11, and a fixing material 17 such as an adhesive is filled in the gap between the peripheral portion of the frame body 6 and the circuit board 3. Thereby, the frame 6 and the 1st thermal radiation part 11 contact | adhere without interposing an adhesive layer. Accordingly, it is possible to prevent a decrease in the amount of heat transfer between the first heat radiation part 11 and the frame body 6 due to the adhesive layer.

  The first heat radiating portion 11 is bent along the opening 16 of the circuit board 3 and extends on the second heat radiating portion 12. The circuit element 7 is fixed on the first heat radiating portion 11 in the opening 16, and heat generated by the circuit element 7 is transmitted to the first heat radiating portion 11 and the frame body 6. Further, the circuit element 7 is thermally connected to the second heat radiating part 12 via the first heat radiating part 11, and the heat generated by the circuit element 7 is transmitted to the second heat radiating part 12.

  You may install the circuit element 7 on the 1st thermal radiation part 11 which excluded the opening part 16 and was formed on the base material 3b. At this time, the circuit element 7 can be thermally connected to the second heat radiating portion 12 by providing a through hole in the base material 3b for conducting the first and second heat radiating portions 11 and 12.

  Between the second heat radiating portion 12 and the heat radiating plate 20, a spacer portion 18 made of a heat good conductor such as copper, silver, ceramic, graphite or the like is disposed. A fixing member 19 such as an adhesive is filled in a gap formed between the second heat radiating part 12 and the heat radiating plate 20 by the spacer part 18. Thereby, the 2nd thermal radiation part 12 and the spacer part 18 contact | adhere without interposing an adhesive layer. Moreover, the heat sink 20 and the spacer part 18 adhere | attach without interposing an adhesive layer. Therefore, it is possible to prevent a decrease in the amount of heat transfer between the second heat radiating portion 12 and the heat radiating plate 20 due to the adhesive layer. It is more desirable to use a resin, metal paste, solder or the like having high thermal conductivity as the fixing material 19.

  A plurality of spacer portions 18 are provided concentrically. A substantially circular spacer 18 provided in the center is opposed to the circuit element 7 and is disposed directly below the circuit element 7. As a result, the heat generated by the circuit element 7 can be easily transmitted to the spacer portion 18.

  Further, the spacer portion 18 is disposed away from the peripheral edge of the second heat radiating portion 12. When the frame body 6, the circuit board 3, and the second heat radiating portion 12 are separated into pieces by cutting, the burrs may be generated at the periphery of the second heat radiating portion 12. When the spacer portion 18 is disposed on the peripheral edge of the second heat radiating portion 12, the spacer portion 18 comes into contact with the burr and a gap is generated between the second heat radiating portion 12 and the spacer portion 18. Thereby, an adhesive layer is formed between the second heat radiation part 12 and the spacer part 18. By disposing the spacer portion 18 away from the periphery of the second heat radiating portion 12, formation of an adhesive layer due to burrs can be avoided.

  In addition, although the spacer part 18 consists of the 2nd heat radiating part 12 and the heat sink 20 and another member, you may form integrally with any one. At this time, the spacer portion 18 may be formed by being stacked on the second heat radiating portion 12 or the heat radiating plate 20 by plating or the like. Further, the periphery may be removed by leaving the spacer portion 18 in a protruding shape on the second heat radiating portion 12 or the heat radiating plate 20 by etching or cutting.

  Even when the spacer portion 18 is formed integrally with the second heat radiating portion 12, the spacer portion 18 may be disposed away from the periphery of the second heat radiating portion 12 in the same manner as described above. Thereby, when the frame body 6, the circuit board 3, and the 2nd thermal radiation part 12 are separated into pieces by cutting, the spacer part 18 is not cut | disconnected. For this reason, the burr | flash of the spacer part 18 can be prevented. When a burr | flash generate | occur | produces in the spacer part 18, a clearance gap will arise between the spacer part 18 and the heat sink 20, and an adhesive layer will be formed. Therefore, by disposing the spacer portion 18 away from the periphery of the second heat radiating portion 12, formation of an adhesive layer due to burrs can be avoided.

  In the electronic component 1 configured as described above, when electric power is supplied from the outside via the external connection terminal 4b, the circuit element 7 emits light and emits light. The light emitted from the circuit element 7 is reflected and collected by the inner surface 6b of the frame 6 to obtain the electronic component 1 having high luminous efficiency.

  The heat generated by the circuit element 7 is transmitted to the frame body 6 through the first heat radiating portion 11 and is radiated from the first heat radiating portion 11 and the frame body 6. The heat generated by the circuit element 7 is transmitted to the second heat radiating portion 12 and also transmitted to the heat radiating plate 20 through the spacer portion 18. Thereby, heat is radiated from the second heat radiating portion 12 and the heat radiating plate 20.

  According to the present embodiment, the spacer portion 18 is provided between the second heat radiating portion 12 (heat radiating portion) disposed on the back surface of the circuit board 3 and the heat radiating plate 20, and the fixing material 19 filled in the gap between the spacer portions 18 is used. Since the second heat radiating portion 12 and the heat radiating plate 20 are fixed, the second heat radiating portion 12 and the heat radiating plate 20 are in close contact with the spacer portion 18 without an adhesive layer interposed therebetween. Therefore, the heat generated by the circuit element 7 can be transmitted to the heat sink 20 with little heat loss, and the heat dissipation efficiency of the electronic component 1 can be improved.

  Further, since the second heat radiating portion 12 and the heat radiating plate 20 can be fixed with little heat loss, the second heat radiating portion 12 and the heat radiating plate 20 are made of a thick metal as shown in the conventional examples of FIGS. The same high heat dissipation characteristic as that formed by the same member can be obtained. As a result, the second heat dissipating part 12 and the heat dissipating plate 20 can be fixed after the thin second heat dissipating part 12 is cut into pieces, thereby reducing burrs during cutting and reducing blade damage. . Therefore, the cost of the electronic component 1 can be reduced.

  Next, FIG. 6 is an exploded perspective view showing the electronic component of the second embodiment. 7 and 8 show a cross-sectional view and a perspective view of FIG. 6 cut along CC. FIG. 9 shows a perspective view of FIG. 6 cut along DD. For convenience of explanation, the same parts as those in the first embodiment shown in FIGS.

  The electronic component 31 of this embodiment has a large number of circuit elements 7, and is formed in an array in which electronic components 1 'similar to those of the first embodiment are arranged in a matrix. Further, the heat sink 20 is formed with a groove portion 21 that passes below each electronic component 1 ′.

  Similar to the first embodiment, a first heat radiating portion 11 made of a conductor pattern is formed on the circuit board 3. A frame 6 made of metal such as aluminum die casting is installed on the first heat radiating portion 11. The frame 6 is provided with an opening having an inner surface 6 b formed of a conical surface corresponding to each circuit element 7. The outer periphery of the frame body 6 is formed to be larger than the outer diameter of the first heat radiating portion 11, and a fixing material 17 such as an adhesive is filled in the gap between the peripheral portion of the frame body 6 and the circuit board 3. Thereby, the frame 6 and the 1st thermal radiation part 11 contact | adhere without interposing an adhesive layer.

  A second heat dissipating part 12 (heat dissipating part) made of a plate-like heat good conductor such as a metal plate is fixed to the back surface of the circuit board 3. The frame body 6, the circuit board 3, and the second heat radiating portion 12 are separated into an array by cutting with a blade or the like from a state in which a large number of the frame body 6, the circuit board 3, and the second heat radiating portion 12 are integrally arranged. Thereby, the frame 6, the circuit board 3, and the 2nd thermal radiation part 12 form the surrounding surface which consists of the same surface.

  An opening 16 is formed in the circuit board 3, and the circuit element 7 is installed in the opening 16. The first heat radiating portion 11 is bent along the opening 16 of the circuit board 3 and extends on the second heat radiating portion 12. The circuit element 7 is fixed on the first heat radiating portion 11 in the opening 16, and heat generated by the circuit element 7 is transmitted to the first heat radiating portion 11 and the frame body 6. Further, the circuit element 7 is thermally connected to the second heat radiating part 12 via the first heat radiating part 11, and the heat generated by the circuit element 7 is transmitted to the second heat radiating part 12.

  Around the opening 16, a plurality of element connection terminals 4 a formed on the circuit board 3 apart from the first heat radiating part 11 are provided. Each terminal of the circuit element 7 is connected to each element connection terminal 4 a by a lead wire 8. The inside of the frame body 6 is filled with a translucent resin (not shown), and the circuit element 7 and the lead wire 8 are sealed.

  A heat radiating plate 20 made of a plate-like heat good conductor such as a metal plate is fixed to the back surface of the second heat radiating portion 12. Between the second heat radiating portion 12 and the heat radiating plate 20, a spacer portion 18 made of a heat good conductor such as copper, silver, ceramic, graphite or the like is disposed. A fixing member 19 such as an adhesive is filled in a gap formed between the second heat radiating part 12 and the heat radiating plate 20 by the spacer part 18. The spacer portion 18 is disposed to face the circuit element 7.

  Thereby, the 2nd thermal radiation part 12 and the spacer part 18 contact | adhere without interposing an adhesive layer. Moreover, the heat sink 20 and the spacer part 18 adhere | attach without interposing an adhesive layer. Therefore, it is possible to prevent a decrease in the amount of heat transfer between the second heat radiating portion 12 and the heat radiating plate 20 due to the adhesive layer. The spacer portion 18 may be formed integrally with the second heat radiating portion 12 or the heat radiating plate 20. It is more desirable to use a resin, metal paste, solder or the like having high thermal conductivity as the fixing material 19.

  A groove portion 21 is provided in the heat radiating plate 20 so as to face the second heat radiating portion 12. The groove portion 21 extends in the direction in which the circuit elements 7 are periodically arranged, meanders, and both end portions open to the peripheral surface of the heat sink 20. As a result, an airflow flows through the groove portion 21 along each circuit element 7, and the second heat radiating portion 12 and the heat radiating plate 20 are cooled.

  According to the present embodiment, as in the first embodiment, the spacer portion 18 is provided between the second heat radiating portion 12 (heat radiating portion) and the heat radiating plate 20 arranged on the back surface of the circuit board 3, and the spacer portion 18 Since the second heat radiating portion 12 and the heat radiating plate 20 are fixed by the fixing material 19 filled in the gap, the second heat radiating portion 12 and the heat radiating plate 20 are in close contact with the spacer portion 18 without using an adhesive layer. Therefore, heat generated by the circuit element 7 can be transmitted to the heat sink 20 with little heat loss, and the heat dissipation efficiency of the electronic component 31 can be improved.

  Moreover, since there is little heat loss and the 2nd heat radiating part 12 and the heat sink 20 can be fixed, the 2nd heat radiating part 12 and the heat radiating plate 20 are fixed after cutting the thin second heat radiating part 12 into pieces. It is possible to reduce burrs during cutting and damage to the blade.

  Further, since the heat radiating plate 20 has the groove portion 21 that is recessed so as to face the second heat radiating portion 12, the air flow can flow through the groove portion 21 and the heat radiation efficiency of the electronic component 31 can be further improved. In addition, you may provide the same groove part 21 in the electronic component 1 of 1st Embodiment.

  Next, FIG. 10 is a perspective view showing the electronic component of the third embodiment. For convenience of explanation, the same parts as those in the first embodiment shown in FIGS. In the electronic component 41, the first heat radiating portion 11 made of a conductor pattern is formed on the circuit board 3. A cylindrical frame 6 made of a metal such as aluminum die casting is installed on the first heat radiating portion 11. The inner surface 6b of the frame 6 is an inclined surface having an elliptical cross section.

  A circuit element 7 made of an LED element is disposed on the first heat radiation part 11 in the opening of the frame body 6. On the circuit board 3, an element connection terminal 4 a is formed apart from the first heat radiating portion 11. The circuit element 7 is connected to the element connection terminal 4 a by a lead wire 8. A heat sink 20 is disposed on the back surface of the circuit board 3.

  FIG. 11 shows an exploded perspective view of the electronic component 41 as seen from the back. A wiring electrode 4 made of a conductor pattern is formed on the back surface of the circuit board 3. The wiring electrode 4 is electrically connected to the element connection terminal 4a (see FIG. 10) through a through hole (not shown). An external connection terminal 4 b connected to the outside is formed at the end of the wiring electrode 4.

  Further, a second heat radiating portion 12 (heat radiating portion) made of a conductor pattern is formed on the back surface of the circuit board 3 apart from the wiring electrode 4. The second heat radiating portion 12 is electrically connected to the first heat radiating portion 1 (see FIG. 10) through a through hole (not shown). Thereby, the circuit element 7 is thermally connected to the second heat radiating portion 12.

  On the second heat radiating portion 12, a spacer portion 18 made of a good thermal conductor is formed by film formation, plating, or the like. Thereby, the spacer part 18 protrudes with respect to the surface of the second heat radiating part 12. A resist 22 made of an insulator is disposed on the wiring electrode 4 and the second heat radiation part 12. The resist 22 is provided avoiding the external connection terminals 4 a and the spacer portions 18. The resist 22 prevents a short circuit between the wiring electrode 4 and the heat sink 20.

  FIG. 12 is a rear perspective view showing a state in which the resist 22 is formed. The resist 22 is formed thinner than the spacer portion 18, and the spacer portion 18 protrudes from the resist 22. As shown in the figure, the electronic component 41 is divided into pieces with the resist 22 applied on the circuit board 3, and then the heat sink 20 is fixed.

  In FIG. 11, a heat radiating plate 20 made of a plate-like good heat conductor such as a metal plate is in close contact with the spacer portion 18. Since the spacer portion 18 protrudes from the resist 22, the gap between the resist portion 22 and the heat radiating plate 20 is filled with an adhesive 19 made of an adhesive. That is, the resist 22 and the fixing material 19 are disposed in the gap between the second heat radiating portion 12 and the heat radiating plate 20. Thereby, the heat sink 20 and the spacer part 18 adhere | attach without interposing an adhesive layer, and the heat sink 20 adheres to the circuit board 3. The heat sink 20 is formed with a relief portion 20a that exposes the external connection terminal 4a.

  The heat generated by the circuit element 7 is radiated through the first heat radiating portion 11 and the frame body 6. The heat generated by the circuit element 7 transmitted from the first heat radiating portion 11 to the second heat radiating portion 12 through the through hole is radiated from the heat radiating plate 20 via the spacer portion 18.

  According to the present embodiment, the spacer portion 18 is provided between the second heat radiating portion 12 (heat radiating portion) disposed on the back surface of the circuit board 3 and the heat radiating plate 20, and the fixing material 19 filled in the gap between the spacer portions 18 is used. Since the second heat radiating portion 12 and the heat radiating plate 20 are fixed, the second heat radiating portion 12 and the heat radiating plate 20 are in close contact with the spacer portion 18 without an adhesive layer interposed therebetween. Therefore, the heat generated by the circuit element 7 can be transmitted to the heat sink 20 with little heat loss, and the heat dissipation efficiency of the electronic component 41 can be improved.

  Moreover, since there is little heat loss and the 2nd heat radiating part 12 and the heat radiating plate 20 can be fixed, after the circuit board 3 in which the 2nd heat radiating part 12 which consists of a conductor pattern was formed into pieces by cutting | disconnecting, a thick heat radiating plate 20 can be fixed to reduce burrs during cutting and damage to the blade.

  Further, by increasing the thickness of the heat sink 20, the electronic component 41 can be easily erected so that the surface of the circuit board 3 is arranged vertically. Thereby, when the electronic component 41 is used for a side-emitting type light emitting device, the assembly workability of the light emitting device can be improved. The electronic components 1 and 31 may be erected by forming the heat sink 20 of the electronic components 1 and 31 of the first and second embodiments thickly.

  The spacer portion 18 may be formed of a member separate from the second heat radiating portion 12 or may be formed integrally with the heat radiating plate 20. Moreover, you may provide the heat sink 20 in the groove part 21 (refer FIG. 6) similar to 2nd Embodiment. The second heat radiating portion 12 is formed up to the upper and lower peripheral edges of the circuit board 3, and the spacer portion 18 is formed on the peripheral edge of the second heat radiating portion 12. It is more desirable to form the spacer portion 18 away from the peripheral edge of the second heat radiating portion 12 because burrs of the spacer portion 18 at the time of the individual piece can be prevented.

  In the first to third embodiments, the circuit element 7 is made of an LED element, but may be another element that generates heat.

  Next, FIG. 13 is a side sectional view showing a light emitting device according to a fourth embodiment of the present invention. The light emitting device 50 constitutes a lighting device and includes a housing 25 made of a good heat conductor such as a metal plate. On the housing 25, a plurality of electronic components 51 made of surface-mounted LEDs similar to those of the first embodiment are arranged. The upper part of the electronic component 51 is covered with a cover 26 made of a transparent resin. Illumination light is emitted from the cover 26 by the light emission of the electronic component 51.

  FIG. 14 is a perspective view of the electronic component 51. 15 and 16 show a cross-sectional view and a perspective view of FIG. 14 taken along line EE. In these figures, for convenience of explanation, the same parts as those in the first embodiment shown in FIGS. In the electronic component 51, the heat sink 20 is omitted from the electronic component 1 of the first embodiment. Other parts are the same as those in the first embodiment.

  Between the second heat radiating part 12 and the housing 25 arranged on the back surface of the circuit board 3, a spacer part 18 made of a good thermal conductor such as copper, silver, ceramic, graphite or the like is arranged. A fixing material 19 such as an adhesive is filled in a gap formed between the second heat radiation unit 12 and the housing 25 by the spacer unit 18. A plurality of spacer portions 18 are provided, and the substantially circular spacer portion 18 provided in the central portion is arranged to face the circuit element 7.

  Thereby, the 2nd thermal radiation part 12 and the spacer part 18 contact | adhere without interposing an adhesive layer. Moreover, the housing | casing 25 and the spacer part 18 contact | adhere without interposing an adhesive layer. Accordingly, it is possible to prevent a decrease in the amount of heat transfer between the second heat radiation part 12 and the housing 25 due to the adhesive layer. It is more desirable to use a resin, metal paste, solder or the like having high thermal conductivity as the fixing material 19.

  Further, the spacer portion 18 is disposed away from the peripheral edge of the second heat radiating portion 12. In the periphery of the second heat radiating portion 12, burrs may occur when the frame 6, the circuit board 3, and the second heat radiating portion 12 are separated into pieces by cutting. When the spacer portion 18 is disposed on the peripheral edge of the second heat radiating portion 12, the spacer portion 18 comes into contact with the burr and a gap is generated between the second heat radiating portion 12 and the spacer portion 18. Thereby, an adhesive layer is formed between the second heat radiation part 12 and the spacer part 18. By disposing the spacer portion 18 away from the periphery of the second heat radiating portion 12, formation of an adhesive layer due to burrs can be avoided.

  The spacer portion 18 is formed of a separate member from the second heat radiating portion 12 and the housing 25, but may be formed integrally with any one of them. At this time, the spacer portion 18 may be formed by being stacked on the second heat radiating portion 12 or the casing 25 by plating or the like. Further, the periphery may be removed by leaving the spacer portion 18 in a protruding shape on the second heat radiating portion 12 or the housing 25 by etching or cutting. Also in this case, the spacer portion 18 may be disposed away from the peripheral edge of the second heat radiating portion 12.

  According to the present embodiment, the spacer portion 18 is provided between the second heat radiating portion 12 disposed on the back surface of the circuit board 3 and the housing 25 made of a good thermal conductor, and the fixing material 19 filled in the gap by the spacer portion 18 is used. Since the second heat radiating portion 12 and the housing 25 are fixed, the second heat radiating portion 12 and the housing 25 are in close contact with the spacer portion 18 without an adhesive layer. Therefore, the heat generated by the circuit element 7 can be transmitted to the housing 25 with little heat loss, and the heat dissipation efficiency of the light emitting device 50 having the surface-mounted LED can be improved.

  Moreover, since there is little heat loss and the 2nd thermal radiation part 12 and the housing | casing 25 can be fixed, even if it makes the 2nd thermal radiation part 12 thin, it can radiate enough. As a result, after the thin second heat radiating portion 12 is cut into pieces, the second heat radiating portion 12 and the housing 25 are fixed, and it is possible to reduce burr at the time of cutting and damage to the blade. .

  In the present embodiment, the second heat radiating portion 12 is formed in a plate shape, but may be formed by a conductor pattern formed on the back surface of the circuit board 3.

  In addition, electronic components similar to those in the second and third embodiments in which the heat radiating plate 20 is omitted may be fixed to the housing 25 via the spacer portion 18.

  The light emitting device 50 includes an illumination device that emits light from the cover 26, but may be an illumination device such as in-switch illumination, a backlight light source of a display device, an optical printer head, or a camera flash. Further, it may be a light emitting device such as an LED display or an illumination device used for amusement.

  The present invention can be used for an electronic component having a circuit element that generates heat. Moreover, this invention can be used for light-emitting devices, such as in-switch illumination, a backlight light source, an optical printer head, a camera flash, an LED display, and an illumination device.

The perspective view which shows the electronic component of 1st Embodiment of this invention. The perspective view which cut | disconnected FIG. 1 by AA 1 is a cross-sectional view taken along line AA. The perspective view which cut | disconnected FIG. 1 by BB Sectional drawing which cut | disconnected FIG. 1 by BB The disassembled perspective view which shows the electronic component of 2nd Embodiment of this invention. The perspective view which cut | disconnected FIG. 6 by CC Sectional drawing which cuts FIG. 6 by CC The perspective view which cut | disconnected FIG. 6 by DD The perspective view which shows the electronic component of 3rd Embodiment of this invention. The disassembled perspective view which shows the electronic component of 3rd Embodiment of this invention. The perspective view which shows the state which apply | coated the resist of the electronic component of 3rd Embodiment of this invention. Side surface sectional drawing which shows the light-emitting device of 4th Embodiment of this invention. The perspective view which shows the electronic component of the light-emitting device of 4th Embodiment of this invention. The perspective view which cut | disconnected FIG. 14 by EE Sectional drawing which cut | disconnected FIG. 14 by EE Front sectional view showing a conventional electronic component Side sectional view showing a conventional electronic component

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 31, 41, 51 Electronic component 2, 20 Heat sink 3 Circuit board 4 Wiring electrode 4a Element connection terminal 4b External connection terminal 4c Through hole 6 Frame body 6b Inner surface 6e Escape part 7 Circuit element 8 Lead wire 9 Translucent resin DESCRIPTION OF SYMBOLS 11 1st thermal radiation part 12 2nd thermal radiation part 16 Opening part 17, 19 Adhering material 18 Spacer part 21 Groove part 25 Cover 50 Light-emitting device

Claims (16)

  A circuit board on which wiring electrodes connected to the circuit element are formed; a heat dissipating part provided on the back surface of the circuit board and thermally connected to the circuit element; and heat dissipation fixed to the back surface of the heat dissipating part by a fixing material An electronic component comprising a plate, wherein a spacer portion made of a good thermal conductor forming a gap is provided between the heat radiating portion and the heat radiating plate, and the fixing material is filled in the gap. .   2. The electronic component according to claim 1, wherein a peripheral surface of the heat radiating portion is formed of a cut surface, and the spacer portion is disposed away from a peripheral edge of the heat radiating portion.   The electronic component according to claim 1, wherein the spacer portion is disposed to face the circuit element.   4. The electronic component according to claim 1, wherein the spacer portion is a protrusion formed integrally with the heat radiating portion or the heat radiating plate. 5.   The electronic component according to any one of claims 1 to 4, wherein the heat radiating plate has a groove portion that is recessed to face the second heat radiating portion.   The electronic component according to claim 5, wherein a plurality of the circuit elements are periodically arranged on the circuit board, and the groove portion is formed to extend in a periodic direction of the circuit elements.   The electronic component according to claim 1, wherein the heat radiating portion is formed of a conductor pattern formed on the circuit board.   7. The electronic component according to claim 1, wherein the heat radiating portion is made of a plate-like heat good conductor fixed to the circuit board.   In an electronic component comprising a circuit board on which wiring electrodes to be connected to a circuit element are formed, and a heat dissipating part provided on the back surface of the circuit board and thermally connected to the circuit element, a protrusion on the back surface of the heat dissipating part An electronic component characterized in that a spacer portion is integrally provided.   The electronic component according to claim 1, wherein the circuit element is an LED element.   A surface mount type LED comprising a circuit board on which wiring electrodes connected to a circuit element composed of LED elements are formed, and a heat radiating plate provided on the back surface of the circuit board and thermally connected to the circuit element is an adhesive. In the light emitting device fixed to the casing made of a good thermal conductor, a spacer portion made of a good thermal conductor forming a gap is provided between the heat radiating portion and the casing, and the fixing material is filled in the gap. A light emitting device characterized by the above.   The light emitting device according to claim 11, wherein a peripheral surface of the heat radiating portion is formed by a cut surface, and the spacer portion is disposed away from a peripheral edge of the heat radiating portion.   The light-emitting device according to claim 11, wherein the spacer portion is disposed to face the circuit element.   The light emitting device according to any one of claims 11 to 13, wherein the spacer portion includes a protrusion formed integrally with the heat dissipation portion or the housing.   The light-emitting device according to claim 11, wherein the heat radiating portion is formed of a conductor pattern formed on the circuit board.   The light emitting device according to any one of claims 11 to 14, wherein the heat radiating portion is made of a plate-like heat good conductor fixed to the circuit board.

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