JP2010287749A - Luminescent body and lighting fixture - Google Patents

Abstract

Provided are a light emitter and a lighting fixture in which an LED bare chip can be easily mounted on a substrate and manufacturing costs can be reduced.
A light emitter 1 includes an LED bare chip 5, pads 6 and 7 electrically connected to electrodes 11 and 12 of the LED bare chip 5, and one surface 6a and 7a of the pads 6 and 7 on the lower surface 8a side. The LED package 2 having the LED bare chip 5 and the translucent resin 8 that hermetically seals the pads 6 and 7 so as to be exposed, and the one surfaces 6 a and 7 a of the pads 6 and 7 are soldered to the lands 22. The substrate 3 on which the LED package 2 is mounted and the filler 4 having a reflecting function filled between the one surface 3a side of the substrate 3 and the lower surface 8a side of the translucent resin 8 are provided.
[Selection] Figure 1

Description

The present invention relates to a light-emitting body using a plurality of LED (light-emitting diode) bare chips as a light source and a luminaire provided with the light-emitting body.

In this type of light emitter, a plurality of LED bare chips are electrically connected in series or series-parallel on a substrate. For example, a lighting device has been proposed in which LED bare chips and pads are alternately arranged adjacent to each other, and the electrodes of the LED bare chips are connected to the pads with bonding wires (see, for example, Patent Document 1). In this prior art lighting device, a substrate is formed of a metal base made of aluminum (Al), a light reflecting layer made of silver (Ag), and a coating layer, and the light reflecting layer covers the entire surface of the metal base. For example, they are laminated by plating.

Then, the sealing member is injected into the reflector and solidified, and each LED bare chip, each pad, bonding wire and the like are buried in the sealing member. The sealing member is made of a translucent material such as a transparent silicone resin, and is mixed with phosphor particles that absorb blue light emitted from the LED bare chip and emit yellow light. Some sealing members are mixed with light diffusing particles.

JP 2008-244165 A (page 4-6, FIG. 3-4)

In the prior art lighting device, since the sealing member is injected into the reflector surrounding each LED bare chip, each pad, bonding wire, and the like, the amount of the sealing member used is large. There is a drawback in that the amount of light diffusing particles used is also increased.

In addition, the LED bare chip is mounted on a substrate or a pad, and both electrodes thereof are respectively wire-bonded to the pad, so that the lighting device is not easily manufactured. As a result, there is a drawback that it is difficult to reduce the cost of the lighting device.

It is an object of the present invention to provide a light emitter capable of easily mounting an LED bare chip on a substrate and reducing the manufacturing cost, and a lighting fixture including the light emitter.

The invention of the light emitting device according to claim 1 is characterized in that the LED bare chip, the pad electrically connected to the electrode of the LED bare chip, and the LED bare chip and the pad so that one surface of the pad is exposed on the lower surface side. An LED package having a translucent resin hermetically sealed; an insulating and heat-dissipating wiring pattern formed on one surface side and a land electrically connected to the wiring pattern; A substrate having one surface soldered to the land and mounting the LED package; a filler having a reflective function filled between one surface side of the substrate and the lower surface side of the translucent resin; It is characterized by comprising;

In the present invention and each of the following inventions, each configuration is as follows unless otherwise specified.

The LED bare chip may be either one having both electrodes on the upper surface side or one having electrodes on the upper surface side and the lower surface side.

The “lower surface or side surface of the translucent resin” means that the direction in which gravity acts when the translucent resin is placed on the ground surface, for example, is the “lower surface” and the opposite is the upper surface. The side in between is the “side”.

The substrate can be formed of a metal such as aluminum (Al) or nickel (Ni). In the case of metal, an insulating layer having heat conductivity is formed on one surface of the substrate, and the LED package is mounted. Further, the substrate can be formed of a ceramic plate or the like having an insulating property.

The filler may be any material that has insulating properties, heat resistance, and intrusion, reflects light on the surface side, or contains light-reflective particles and reflects light, such as a white resin. Underfill or silicone sealant can be used.

According to the present invention, the electrodes of the LED bare chip are electrically connected to the wiring pattern of the substrate by soldering the pads of the LED package to the lands of the substrate, thereby forming a light emitter. Of the light emitted from the LED bare chip, the light emitted to the lower surface side of the LED package is reflected by the filler and emitted from the upper surface side and the side surface side of the LED package.

According to a second aspect of the present invention, there is provided the luminescent material according to the first aspect, wherein the filler extends outward from the lower surface side of the translucent resin, and the side surface of the translucent resin. It surrounds the lower surface side of this.

According to the present invention, since the filler surrounds the lower surface side of the side surface of the translucent resin, the thermal expansion of the translucent resin accompanying the heat generation of the LED bare chip is suppressed, and the warpage of the translucent resin is suppressed. At the same time, the light emitted to the lower surface side of the side surface of the translucent resin is reflected by the filler and emitted from the upper surface side of the LED package.

The invention of the light emitter according to claim 3 is the invention of the light emitter according to claim 1 or 2, wherein the pad has a total area of one surface of 50 to 50% of an area of the lower surface side of the translucent resin. The translucent resin is mainly composed of a silicone resin and has a hardness of Shore A40 to D60.

The “total area of one side of the pad” means the total area of one side of each pad when the LED package is provided with a plurality of pads. Means the area of one surface.

The LED package is formed by, for example, forming a pad on one surface of a base made of a nickel (Ni) plate by plating, mounting the LED bare chip on the pad, or mounting the LED bare chip on a substrate pasted on the base. The electrode and the pad are wire-bonded with a bonding wire (gold wire), and then the LED bare chip, the bonding wire and the pad are embedded on the substrate with a light-transmitting resin, and the light-transmitting resin is solidified, and then the substrate is fixed. It is formed by peeling off from a translucent resin, a pad, and a substrate.

When the total area of one surface of the pad is less than 50% of the area on the lower surface side of the translucent resin, the bonding area between the pad and the translucent resin is reduced, and the base is peeled off from the translucent resin. In addition, the pad may be peeled off from the translucent resin. Further, when the total area of one surface of the pads exceeds 90% of the area on the lower surface side of the translucent resin, it is difficult to secure an insulation distance between the pads.

Moreover, when the hardness of the translucent resin is softer than Shore A40, the base is difficult to peel from the translucent resin, and when the hardness of the translucent resin is greater than Shore D60, the translucent resin is translucent. The bonding wire is easily broken due to the stress caused by the solidification or thermal expansion of the conductive resin.

Moreover, the area which reflects the light radiate | emitted to the lower surface side of translucent resin as the total area of the one surface of a pad is 50 to 90% of the area of the lower surface side of translucent resin is from a filler. Since the pad becomes larger, the efficiency of extracting the light emitted from the LED bare chip is further improved by increasing the reflectance of the pad rather than the filler.

Silicone resins are relatively high in electrical insulation, heat resistance, penetration, and the like, and are available at a relatively low cost.

According to the present invention, since the total area of one surface of the pad and the hardness of the translucent resin are each in the predetermined range, the LED package can be easily manufactured, and the bonding wire caused by the stress of the translucent resin is used. Disconnection is prevented.

According to a fourth aspect of the present invention, there is provided a lighting fixture comprising: the light emitter according to any one of the first to third aspects; and a fixture main body on which the light emitter is disposed.

According to the present invention, there is provided a luminaire that can perform illumination by the light emitted from the light emitter according to any one of claims 1 to 3.

According to the first aspect of the present invention, the translucent resin may be used in the LED package, and the LED bare chip can be easily mounted on the one surface side of the substrate by soldering the pad of the LED package to the land of the substrate. Therefore, the manufacturing process of the light emitter is simplified, the manufacturing cost of the light emitter can be reduced, the light emitter can be made inexpensive, and the filler is emitted to the lower surface side of the LED package. Since the light is reflected on the upper surface side and the side surface side of the LED package to be emitted light from the LED package, the extraction efficiency of the light emitted from the LED bare chip can be improved.

According to invention of Claim 2, since the curvature by the thermal expansion of translucent resin is suppressed because a filler surrounds the lower surface side of the side surface of translucent resin, it prevents disconnection of a bonding wire. In addition, the light emitted to the lower surface side of the side surface of the translucent resin is reflected on the upper surface side of the LED package and emitted from the LED package, so that the efficiency of extracting the light emitted from the LED bare chip can be further improved. Can do.

According to the invention of claim 3, the total area of the one surface of the pad is 50 to 90% of the area of the lower surface side of the translucent resin, the translucent resin is mainly composed of silicone resin, and its hardness is Shore. By being A40-D60, it becomes easy to manufacture the LED package, and disconnection of the bonding wire is prevented, so that the light emitter can be manufactured at low cost and the quality of the light emitter can be improved.

According to the invention of claim 4, since the light emitting body that is manufactured at low cost and has improved light extraction efficiency is provided, it is possible to provide a lighting fixture that is inexpensive and can illuminate the irradiated surface side brightly. it can.

BRIEF DESCRIPTION OF THE DRAWINGS It is a light-emitting body which shows Example 1 of this invention, (a) is a schematic partial top view which saw through translucent resin, (b) is a schematic partial longitudinal cross-sectional view. Similarly, the schematic top view of a light-emitting body. Similarly, the schematic longitudinal cross-sectional view in manufacture of an LED package. FIG. 4 is a schematic partial top view of a light emitter showing Example 2 of the present invention. Similarly, a schematic partial longitudinal sectional view of the light emitter. Similarly, a schematic partial top view of another light emitter. The partial notch schematic side view of the lighting fixture which shows Example 3 of this invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

In the present invention, the LED bare chip is embedded in the LED package, and is mounted on the one surface side of the substrate by soldering the pad of the LED package to the land on the one surface side of the substrate. Then, a filler is filled between the one surface side of the substrate and the translucent resin of the LED package, and the light emitted from the LED bare chip to the lower surface side of the translucent resin is filled with the upper surface side of the translucent resin by the filler. And to be reflected to the side.

FIGS. 1 to 3 show Example 1 of the present invention, FIG. 1 is a light emitter, (a) is a schematic partial top view of a transparent resin, and (b) is a schematic partial longitudinal section. FIG. 2 is a schematic top view of a light emitter, and FIG. 3 is a schematic longitudinal sectional view in the manufacture of an LED package.

In FIG. 1, a light emitter 1 includes an LED package 2, a substrate 3, and a white resin 4 as a filler. The LED package 2 includes an LED bare chip 5, a plurality of pads 6 and 7, and a translucent resin 8.

The LED bare chip 5 is mounted at the center position of the other surface 6 b of the pad 6. The LED bare chip 5 has a light emitting layer 10 formed on the surface of a sapphire 9 formed in a rectangular shape, and electrodes 11 and 12 provided on the surface of the light emitting layer 10. The sapphire 9 is soldered to the other surface 6 b of the pad 6 with gold (Au) / tin (Sn) eutectic solder 13. The light emitting layer 10 is formed, for example, with a light emitting material that emits light in the ultraviolet to blue light region, for example, InGaN, and emits blue light when energized.

The pads 6 and 7 are each formed in a regular tetragon and are arranged in parallel while being insulated from each other. The pads 6 and 7 are made of, for example, a conductive material obtained by plating silver (Ag) on the surface of nickel (Ni), and the thickness thereof is, for example, 10 μm.

The LED bare chip 5 is mounted on the pad 6, one electrode 11 thereof is wire-bonded to the other surface 6 b of the pad 6, and the other electrode 12 is wire-bonded to the other surface 7 b of the pad 7. . That is, one electrode 11 is connected to the pad 6 on which the LED bare chip 5 is mounted by the bonding wire 14, and the other electrode 12 is connected to the pad 7 arranged in parallel to the pad 6 by the bonding wire 15. Has been.

The translucent resin 8 is made of, for example, a transparent silicone resin, and the LED bare chip 5, the pads 6, 7, and the bonding are formed such that one surface 6 a, 7 a of each of the pads 6, 7 is exposed on the lower surface 8 a side. The wires 14 and 15 are hermetically sealed and formed in a substantially rectangular parallelepiped. The upper surface 8b of the translucent resin 8 is flat. The translucent resin 8 is mixed with YAG phosphor particles 16 that convert blue light into predetermined light, for example, yellow light, and light diffusing particles 17 that diffusely reflect light.

As shown in FIG. 3, the LED package 2 is manufactured by, for example, plating the pads 6 and 7 by nickel (Ni) plating so as to have a predetermined insulation distance L1 on one surface 18a of a base 18 made of a nickel (Ni) plate. Is formed. Then, the LED bare chip 5 is soldered to the other surface 6 b of the pad 6 with gold (Au) / tin (Sn) eutectic solder 13. Thereby, the LED bare chip 5 is mounted on the pad 6. By using the gold (Au) / tin (Sn) eutectic solder 13, the heat generated in the LED bare chip 5 can be quickly transferred to the pad 6. The LED bare chip 5 may be fixed to the pad 6 using a conductive paste.

Then, one electrode 11 of the LED bare chip 5 and the other surface 6b of the pad 6 are wire-bonded and connected by a bonding wire 14, and the other electrode 12 and the other surface 7b of the pad 7 are wire-bonded and bonded to a bonding wire 15 Connect with. Thereafter, the rectangular tube body 19 with the flange portion 19 a is placed on the one surface 18 a of the base 18 so as to surround the LED bare chip 5 and the pads 6 and 7. The rectangular cylinder 19 is formed so as to be divided into two parts, and the inside thereof is formed in a rectangular parallelepiped shape.

A translucent resin 8 in which YAG phosphor particles 16 and light diffusing particles 17 are mixed is injected into the rectangular tube body 19 so that the LED bare chip 5, pads 6, 7 and bonding wires 14, 15 are buried. . After the translucent resin 8 is solidified, the rectangular tube body 19 is separated and removed from the one surface 18 a of the base 18.

Then, the base 18 is gradually peeled from the lower surface 8 a of the translucent resin 8 toward the other end 18 c so as to sandwich the translucent resin 8. Thus, the substantially rectangular parallelepiped LED package 2 is formed. Here, the total area of the one surfaces 6a and 7a of the pads 6 and 7 is 50 to 90% of the area of the lower surface 8a of the translucent resin 8 so that the pads 6 and 7 do not peel from the translucent resin 8. The bonding area between the pads 6 and 7 and the translucent resin 8 is increased, and the insulation distance L1 between the pads 6 and 7 is secured.

The translucent resin 8 is mainly composed of a silicone resin so that the base 18 can be easily peeled off, and has a hardness of Shore A40 or higher, and the translucent resin 8 is solidified. In order to prevent the bonding wires 14 and 15 from being disconnected due to the stress at the time of contraction, it is set so as to have a softness of Shore D60 or less.

In FIG. 1, a substrate 3 is made of, for example, an aluminum (Al) plate having a thickness of 1 mm, and an insulating layer 20 having a thickness of, for example, 80 μm is formed on one surface 3a thereof. The insulating layer 20 is made of, for example, an epoxy material and an inorganic filler material, and has high thermal conductivity. A wiring pattern 21 and a land 22 electrically connected to the wiring pattern 21 are formed on the surface of the insulating layer 20. The land 22 is provided in association with the pads 6 and 7 of the LED package 2. Each of the wiring pattern 21 and the land 22 is made of, for example, a copper (Cu) foil having a thickness of 10 μm. A resist (not shown) is applied to the surface of the insulating layer 20 excluding the lands 22 and the wiring pattern 21.

The lands 22, 22 are soldered with solder 23 on one surface 6 a, 7 a of the pad 6, 7 of the LED package 2. The LED package 2 is mounted on the substrate 3 by this soldering. A plurality of LED packages 2 are mounted on the substrate 3 as shown in FIG. The plurality of LED packages 2 are connected in series and parallel by the wiring pattern 21.

On the surface of the insulating layer 20 of the one end 3b of the substrate 3, power terminals 24, 24 to which a lead wire is connected and DC power is supplied are provided. The power supply terminals 24, 24 are connected to the wiring patterns 21, 21 and are electrically connected to the LED bare chips 5.

In FIG. 1, the white resin 4 is filled between the one surface 3 a side of the substrate 3 and the lower surface 8 a side of the translucent resin 8. That is, when the pads 6 and 7 of the LED package 2 are soldered to the lands 22 and 22 of the substrate 3, the gaps corresponding to the respective thicknesses of the lands 22 and 22 and the solders 23 and 23 become the insulating layer 20 and the substrate 3. A gap is formed between the lower surface 8a of the translucent resin 8 and the land 22 and 22 and the solders 23 and 23 are formed between the insulating layer 20 and the lower surface 8a of the translucent resin 8. This gap is filled with a white resin 4 as a filler.

The white resin 4 extends from the lower surface 8 a side of the translucent resin 8 to the outside of the translucent resin 8 and is provided so as to surround the lower surface side of the side surface 8 c of the translucent resin 8. Yes.

The white resin 4 is made of an underfill in which a filler is mixed in, for example, an epoxy resin having electrical insulating properties, heat resistance, and penetration properties, and has a reflecting function. The underfill is formed so that its surface reflectance is 50% or more, for example 55%.

Next, the operation of the first embodiment of the present invention will be described.

When direct-current power is supplied to the power terminals 24, 24 of the light emitter 1, the LED bare chip 5 generates heat and emits blue light from the light emitting layer 10. A part of the blue light passes through the translucent resin 8 and is emitted outward from the upper surface 8 b and the side surface 8 c of the translucent resin 8. Further, part of the blue light is wavelength-converted to yellow light by the YAG phosphor particles 16 mixed in the translucent resin 8, and is emitted outward from the upper surface 8b and the side surface 8c of the translucent resin 8. . Then, white light is obtained by mixing (mixing) blue light and yellow light emitted from the translucent resin 8. That is, white light is emitted from the light emitter 1.

Further, a part of the blue light and yellow light transmitted through the translucent resin 8 is such that the upper surface 8b and the side surface 8c of the translucent resin 8, the light diffusing particles 17 mixed in the translucent resin 8, and the like. Thus, the light is irregularly reflected on the lower surface 8a side of the translucent resin 8. The reflected light is reflected by the other surfaces 6b and 7b of the pads 6 and 7 and the surface of the white resin 4, and part of the reflected light is emitted outward from the upper surface 8b and the side surface 8c of the translucent resin 8. Further, the reflected light reflected by the lower surface side of the side surface 8c of the translucent resin 8 is reflected by the surface of the white resin 4 portion surrounding the lower surface side, and the upper surface 8b of the translucent resin 8 and The light is emitted outward from the upper surface side of the side surface 8c.

In this way, the white resin 4 is filled in the space on the one surface 3 a side of the substrate 3 and the lower surface 8 a side of the translucent resin 8, so that it is emitted from the LED bare chip 5, and the lower surface 8 a of the translucent resin 8. Since the light emitted (reflected) to the side is reflected to the upper surface 8b side and the side surface 8c side of the translucent resin 8 to be emitted light from the LED package 2, the extraction efficiency of the light emitted from the LED bare chip 5 is improved. Can be improved.

Further, since the white resin 8 surrounds the lower surface side of the side surface 8c of the translucent resin 8, light emitted (reflected) to the lower surface side of the side surface 8c of the translucent resin 8 is transmitted. 8 is reflected on the upper surface 8a side to be emitted light from the LED package 2, so that the extraction efficiency of the light emitted from the LED bare chip 5 can be further improved.

The pads 6 and 7 of the LED package 2 are formed such that the total area of the one surfaces 6a and 7a is 50 to 90% of the area on the lower surface 8a side of the translucent resin 8, and the other surface 6b. , 7b has a higher reflectance than that of the white resin 4 by silver (Ag) plating, for example, a reflectance of 95%, so that the light emitted to the lower surface 8a side of the translucent resin 8 is more transparent. The light can be reflected to the upper surface 8b side of the light-sensitive resin 8. Thus, the light emitter 1 with improved light extraction efficiency can be provided.

The white resin 8 extends outward from the lower surface 8 a side of the translucent resin 8 and surrounds the lower surface side of the side surface 8 c of the translucent resin 8. The thermal expansion of the photo-resin 8 is pressed down. Thereby, the curvature from the board | substrate 3 of the translucent resin 8 (LED package 2) is suppressed, and the disconnection etc. of the bonding wires 14 and 15 can be prevented.

In the manufacture of the LED package 2 in FIG. 3, the pads 6 and 7 are formed so that the total area of the one surfaces 6 a and 7 a is 50 to 90% of the area on the lower surface 8 a side of the translucent resin 8. The translucent resin 8 is mainly composed of a silicone resin and has a hardness of Shore A40 to D60, so that the pads 6 and 7 are easily peeled off from the base 18 without being peeled off from the translucent resin 8. At the same time, disconnection of the bonding wires 14 and 15 due to solidification of the translucent resin 8 and thermal expansion is prevented. Thereby, while being able to manufacture the LED package 2 and the light-emitting body 1 easily and cheaply, the quality of the light-emitting body 1 can be improved.

Furthermore, since the LED bare chip 2 can be easily mounted on the substrate 3 by soldering the pads 6 and 7 of the LED package 2 to the lands 22 and 22 of the substrate 3, the light emitting body 1 can simplify the manufacturing process. Is done. Further, the translucent resin 8, the YAG phosphor particles 16 and the light diffusing particles 17 mixed in the translucent resin 8 are not provided over the entire area of the substrate 3, but can be used in the LED package 2. . Therefore, the manufacturing cost of the light emitter 1 can be reduced, and the light emitter 1 can be made inexpensive.

The LED bare chip 5 used was one in which both electrodes 11 and 12 were provided on the surface side (upper surface side) of the sapphire 9, but one electrode 11 and the surface on the back side (lower surface side) of the sapphire 9 were used. The other electrode 12 may be provided on the side (upper surface side). In this case, one electrode 11 is not wire-bonded but is soldered to the pad 6 to be electrically connected.

4 to 6 show a second embodiment of the present invention, FIG. 4 is a schematic partial top view of a light emitter, FIG. 5 is a schematic partial longitudinal sectional view of the light emitter, and FIG. 6 is a schematic of another light emitter. It is a partial top view. The same parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.

The light emitter 25 shown in FIGS. 4 and 5 is the light emitter 1 shown in FIG. 1, and the LED package 2 </ b> A has a plurality of LED bare chips 5, 5 </ b> A provided in a translucent resin 8. The LED bare chip 5 has its electrodes 11 and 12 connected to pads 6 and 7 by bonding wires 14 and 15, respectively, and the LED bare chip 5A has its electrodes 11 and 12 connected to pads 7 and 6A by bonding wires 14A and 15A, respectively. Has been. That is, the LED bare chips 5 and 5A are connected in series. The LED bare chips 5, 5 </ b> A are connected to the wiring pattern 21 of the substrate 3 by soldering the pads 6, 6 </ b> A to the lands 22, 22 of the substrate 3.

Further, the light emitting body 26 shown in FIG. 6 is the light emitting body 1 shown in FIG. It is what. The plurality of LED bare chips 5 are mounted on the other surface 27b of the pad 27 so as to be juxtaposed. In each LED bare chip 5, one electrode 11 is connected to the other surface 27 b of the pad 27 by the bonding wire 14, and the other electrode 12 is connected to the other surface 28 b of the pad 28 by the bonding wire 15. That is, the plurality of LED bare chips 5 are connected in parallel. Each LED bare chip 5 has pads 27 and 28 connected to the wiring pattern 21 of the substrate 3.

In the light emitters 25 and 26, the LED packages 2 </ b> A and 2 </ b> B each have a plurality of LED bare chips 5, so that the LED bare chips 5 are mounted on the one surface 3 a side of the substrate 3 with high density. Thereby, the light quantity of the emitted light from the light emitters 25 and 26 is increased, and the irradiated surface side can be illuminated brightly.

4 and 5, the other electrode 12 of the LED bare chip 5 and the one electrode 11 of the LED bare chip 5A may be electrically connected by wire bonding without providing the pad 7.

FIG. 7 is a partially cutaway schematic side view of a lighting fixture showing Embodiment 3 of the present invention. The same parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.

  A lighting fixture 29 shown in FIG. 7 is a downlight embedded in a ceiling surface or the like, and a circular decorative frame 31 is provided on the lower end side of a substantially cylindrical fixture main body 30, and a transparent cover is provided on the decorative frame 31. 32 is disposed. And the instrument main body 30 is attaching the pair of attachment springs 33 and 33 for fixing the instrument main body 30 to a ceiling surface etc. on both right and left sides.

  Moreover, the instrument main body 30 arrange | positions the light-emitting body 1 shown in FIG. 1 inside a lower end side. A power supply unit 34 is disposed inside the instrument body 30. The power supply unit 34 houses a power supply circuit and the like. The power circuit converts AC power into DC power and supplies a constant current to the LED bare chip 5 of the light emitter 1. A terminal block 35 for connecting a power line (not shown) from the AC power supply is disposed on the upper surface side of the instrument body 30.

Since the luminaire 29 includes the light-emitting body 1 that is manufactured at low cost and has improved light extraction efficiency, it is inexpensive and can illuminate the irradiated surface side brightly.

INDUSTRIAL APPLICABILITY The present invention can be used for general or industrial lighting fixtures, bulb-type appliances mounted on bulb sockets, LED bulbs, and the like.

DESCRIPTION OF SYMBOLS 1,25,26 ... Light-emitting body, 2,2A, 2B ... LED package, 3 ... Board | substrate, 4 ... White resin as a filler, 5,5A ... LED bare chip, 6, 7, 27, 28 ... Pad, 8 ... translucent resin, 21 ... wiring pattern, 22 ... land, 29 ... lighting equipment, 30 ... equipment body

Claims (4)

An LED bare chip, a pad electrically connected to the electrode of the LED bare chip, and a translucent resin hermetically sealing the LED bare chip and the pad so that one surface of the pad is exposed on the lower surface side; An LED package having an insulating property and a heat dissipation property, a wiring pattern and a land electrically connected to the wiring pattern are formed on one surface side, and one surface of the pad is soldered to the land A light-emitting device comprising: a substrate on which an LED package is mounted; and a filler having a reflecting function filled between one surface side of the substrate and the lower surface side of the translucent resin. body. The light emitting body according to claim 1, wherein the filler extends outward from a lower surface side of the translucent resin and surrounds a lower surface side of a side surface of the translucent resin. The pad is formed such that the total area of one surface thereof is 50 to 90% of the area of the lower surface side of the translucent resin, and the translucent resin is mainly composed of a silicone resin and has a hardness of The light emitter according to claim 1, wherein the light emitter is Shore A40 to D60. An illumination fixture comprising: the light emitter according to any one of claims 1 to 3; and an appliance body on which the light emitter is disposed.

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