JP2013010650A - Scribing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a scribing apparatus which favorably forms a scribe line even when a brittle material substrate is repeatedly scribed.SOLUTION: An adjustment part 70 lowers the temperature of a scribing wheel 50. The adjustment part 70 includes mainly a proximity plate 71, nozzles 72, and a cooling section 78. The proximity plate 71 is disposed above the scribing wheel 50 held by a holder 35. When a scribe line SL is formed by the scribing wheel 50, the proximity plate 71 comes close to a brittle material substrate 4. The plurality of nozzles 72 eject nitrogen gas into an adjustment space 70a between the brittle material substrate 4 held by a holding unit 10 and the proximity plate 71. The cooling section 78 cools, in a common pipe 75, nitrogen gas to be supplied to the nozzles 72, whereby the atmosphere in the adjustment space 70a is cooled by nitrogen gas, so that the scribing wheel is sufficiently cooled during scribing.

Description

  The present invention relates to a scribing apparatus for forming a scribe line on a brittle material substrate.

  Conventionally, a technique for engraving a scribe line on the surface of a glass substrate with a cutter wheel chip is known. Moreover, the technique of blowing away the swarf produced at the time of scribing with compressed air is also known (all are patent documents 1).

JP 2000-247667 A

  Here, in the technique of Patent Document 1, when a scribe line is formed on a glass substrate, the cutter wheel chip is pressed against the glass substrate with a predetermined pressure. As a result, when the scribe line is formed, heat is generated due to friction between the cutter wheel chip and the glass substrate.

  For this reason, the cutter wheel tip is oxidized due to this heat generation, so that the cutter wheel tip may be deteriorated or the scribing performance may be lowered depending on circumstances. As a result, there is a problem that the tool life is shortened in some cases.

  Accordingly, an object of the present invention is to provide a scribing apparatus that can form a scribe line satisfactorily even when a brittle material substrate is scribed repeatedly.

  In order to solve the above-mentioned problem, the invention of claim 1 is a scribing device for forming a scribe line on a brittle material substrate, wherein the scribing wheel, a holder for holding the scribing wheel, and a substrate are moved while being held. A holding unit, an adjustment unit that lowers the temperature of the scribing wheel, and a control unit that cools the scribing wheel when the scribing line is formed by the scribing wheel.

  The invention according to claim 2 is the scribing device according to claim 1, wherein the adjusting portion is provided above the scribing wheel held by the holder, and a scribing line is formed by the scribing wheel. A proximity plate that is close to the brittle material substrate, and a first nozzle that discharges a cooling gas into an adjustment space between the substrate and the proximity plate held by the holding unit, The control unit discharges the cooling gas into the adjustment space by the first nozzle when a scribe line is formed by the scribing wheel.

  The invention of claim 3 is the scribing device according to claim 1, wherein the adjustment unit has a second nozzle that discharges cooling gas toward the scribing wheel held by the holder, The control unit discharges the cooling gas toward the scribing wheel by the second nozzle when a scribing line is formed by the scribing wheel.

  According to the first to third aspects of the invention, the scribing wheel can be cooled when the scribe line is formed on the brittle material substrate. Thereby, it can prevent that a scribing wheel is oxidized by the influence of the heat_generation | fever at the time of scribing, and can extend the lifetime of a scribing wheel.

  In particular, according to the second aspect of the invention, when the scribe line is formed, the atmosphere of the adjustment space is cooled by the cooling gas. Thereby, at the time of a scribe, a scribing wheel is fully cooled and the life of a scribing wheel can be further extended.

It is a front view which shows an example of the whole structure of the scribing apparatus in the 1st and 2nd embodiment of this invention. It is a side view which shows an example of the whole structure of the scribing apparatus in the 1st and 2nd embodiment of this invention. It is a front view which shows an example of a structure of the adjustment part in 1st Embodiment. It is a bottom view which shows an example of a structure of a scribing wheel. It is a bottom view for demonstrating a caster effect. It is a front view which shows an example of a structure of the adjustment part in 2nd Embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<1. First Embodiment>
<1.1. Configuration of scribing device>
FIGS. 1 and 2 are a front view and a side view, respectively, showing an example of the overall configuration of the scribe device 1. FIG. 3 is a front view illustrating an example of the configuration of the adjustment unit 70. FIG. 4 is a bottom view showing an example of the configuration of the scribing wheel 50. FIG. 5 is a bottom view for explaining the caster effect.

  The scribe device 1 includes a scribe line (cutting line: vertical crack) on the surface of a substrate 4 (hereinafter, also simply referred to as “brittle material substrate”) formed of a brittle material such as a glass substrate or a ceramic substrate. It is a device that puts in.

  As shown in FIGS. 1 and 2, the scribing apparatus 1 mainly includes a holding unit 10, a scribing unit 20, an imaging unit 60, an adjustment unit 70, and a control unit 90. 1 and the subsequent drawings have an XYZ orthogonal coordinate system in which the Z-axis direction is a vertical direction and the XY plane is a horizontal plane, as necessary, in order to clarify the directional relationship. .

Here, in this embodiment,
(1) A scribe line SL is formed on the surface of the brittle material substrate 4 by the scribe device 1 to generate a vertical crack K (see FIG. 3 and the like) (scribe process),
(2) Next, the vertical crack K is further extended by applying stress, and the brittle material substrate 4 is cut (break process).
The technique is called “cleaving”.

  On the other hand, only by the scribe process (that is, without executing the break process), the vertical crack K is extended from the main surface on the side where the scribe line SL of the brittle material substrate 4 is formed to the main surface on the opposite side, so that the brittle material A method of cutting the substrate 4 is referred to as “dividing”.

  Examples of the material of the brittle material substrate 4 that can be cleaved or divided by the scribing method of the present embodiment include glass, ceramic, silicon, sapphire, and the like. In particular, in recent years, the transition from HTCC (High Temperature Co-fired Ceramics) to LTCC (Low Temperature Co-fired Ceramics), which is relatively easy to process, is accelerating as a substrate used in high-frequency modules related to communication equipment. Therefore, the scribing method of the present embodiment is used more and more effectively.

  The holding unit 10 moves the brittle material substrate 4 relative to the scribe unit 20 by moving while holding the brittle material substrate 4. As shown in FIG. 1, the holding unit 10 is provided on a base 10 a and mainly includes a table 11, a ball screw mechanism 12, and a motor 13.

  Here, the base 10a is formed of, for example, a substantially rectangular parallelepiped stone surface plate, and the upper surface (the surface facing the holding unit 10) is flattened. Thereby, the thermal expansion of the base 10a can be reduced, and the brittle material substrate 4 held by the holding unit 10 can be favorably moved.

  The table 11 sucks and holds the brittle material substrate 4 placed thereon. In addition, the table 11 advances and retracts the held brittle material substrate 4 in the direction of the arrow AR1 (X-axis plus or minus direction: hereinafter also simply referred to as “advance / retreat direction”), and in the direction of the arrow R1 (around the Z-axis). Direction). As shown in FIGS. 1 and 2, the table 11 mainly includes a suction unit 11 a, a turntable 11 b, and a moving table 11 c.

  The adsorption part 11a is provided on the upper side of the turntable 11b. As shown in FIGS. 1 and 2, a brittle material substrate 4 can be placed on the upper surface of the suction portion 11 a. A plurality of suction grooves (not shown) are arranged in a lattice pattern on the upper surface of the suction portion 11a. Therefore, the brittle material substrate 4 is adsorbed to the adsorbing portion 11a by exhausting (suctioning) the atmosphere in each adsorption groove while the brittle material substrate 4 is placed.

  The turntable 11b is provided on the lower side of the suction portion 11a, and rotates the suction portion 11a around a rotation shaft 11d substantially parallel to the Z axis. The moving table 11c is provided below the rotating table 11b, and moves the suction unit 11a and the rotating table 11b along the advancing / retreating direction.

  Therefore, the brittle material substrate 4 sucked and held by the table 11 is moved forward and backward in the direction of the arrow AR1, and is rotated around the rotating shaft 11d that moves as the suction portion 11a moves back and forth.

  The ball screw mechanism 12 is disposed below the table 11 and moves the table 11 back and forth in the direction of the arrow AR1. As shown in FIGS. 1 and 2, the ball screw mechanism 12 mainly has a feed screw 12a and a nut 12b.

  The feed screw 12 a is a rod that extends along the advancing / retreating direction of the table 11. A spiral groove (not shown) is provided on the outer peripheral surface of the feed screw 12a. One end of the feed screw 12a is rotatably supported by the support portion 14a, and the other end of the feed screw 12a is rotatably supported by the support portion 14b. Further, the feed screw 12a is linked to the motor 13, and when the motor 13 rotates, the feed screw 12a rotates in the rotation direction.

  As the feed screw 12a rotates, the nut 12b advances and retreats in the direction of the arrow AR1 due to a rolling motion of a ball (not shown). As shown in FIGS. 1 and 2, the nut 12b is fixed to the lower part of the movable table 11c.

  Therefore, when the motor 13 is driven and the rotational force of the motor 13 is transmitted to the feed screw 12a, the nut 12b advances and retreats in the direction of the arrow AR1. As a result, the table 11 to which the nut 12b is fixed advances and retreats in the direction of the arrow AR1 similarly to the nut 12b.

  The pair of guide rails 15 and 16 regulate the movement of the table 11 in the traveling direction. As shown in FIG. 2, the pair of guide rails 15 and 16 are fixed on the base portion 10a with a predetermined distance in the direction of the arrow AR2.

  A plurality of (two in the present embodiment) sliding portions 17 (17a, 17b) are slidable along the guide rail 15 in the direction of the arrow AR1. As shown in FIGS. 1 and 2, the sliding portions 17 (17a, 17b) are fixed at a predetermined distance in the direction of the arrow AR1 at the lower portion of the movable table 11c.

  A plurality of (two in the present embodiment: for convenience of illustration, only the sliding portion 18a is described) sliding portions 18 are slidable along the guide rail 16 in the direction of the arrow AR1. As shown in FIG. 1 and FIG. 2, each sliding portion 18 is fixed at a predetermined distance in the direction of the arrow AR1 at the lower portion of the movable table 11c, similarly to the sliding portion 17 (17a, 17b). .

  As described above, when the rotational force of the motor 13 is applied to the ball screw mechanism 12, the table 11 moves along the pair of guide rails 15 and 16. Thereby, the rectilinearity of the table 11 in the advance / retreat direction can be ensured.

  The scribe unit 20 forms a scribe line SL on the surface of the brittle material substrate 4 by pressing and rolling the scribing wheel 50 (see FIG. 3) against the brittle material substrate 4 held by the holding unit 10. As shown in FIGS. 1 and 2, the scribe unit 20 mainly has a head unit 30 that holds a scribing wheel 50 and a drive unit 40.

  The head unit 30 applies a pressing force (hereinafter, also simply referred to as “scribe load”) to the surface of the brittle material substrate 4 from the held scribing wheel 50 by a lifting / pressing mechanism (not shown). As shown in FIG. 3, the head unit 30 has a holder 35.

  The holder 35 is an element that holds the scribing wheel 50 rotatably. As shown in FIG. 3, the holder 35 mainly includes a pin 36, a support frame body 37, and a turning portion 38.

  The pin 36 is a rod that is fixed to the scribing wheel 50 in a state of being inserted into a through hole 50 a that penetrates the scribing wheel 50. Here, as shown in FIGS. 3 and 4, the through hole 50a extends along a rotation axis 50b substantially parallel to the X axis.

  As shown in FIG. 3, the support frame body 37 is a structure arranged so as to cover both openings (both ends) of the through hole 50 a. The pins 36 protruding from both ends of the through hole 50 a are rotatably installed with respect to the support frame 37. Therefore, the scribing wheel 50 fixed to the pin 36 is rotatable with respect to the support frame 37.

  As shown in FIG. 3, the swivel unit 38 is provided on the upper portion of the support frame 37 and rotates the support frame 37 around a rotation axis 38 a substantially parallel to the Z axis. As shown in FIG. 4, the position of the rotation shaft 38 a of the swivel unit 38 viewed from the lower surface and the installation position 50 c of the holding unit 10 on the brittle material substrate 4 are misaligned in the XY plane.

  Therefore, as shown in FIG. 5, when the traveling direction of the scribing wheel 50 changes from the arrow AR3 (two-dot chain line) direction to the arrow AR4 (solid line) direction, the scribing wheel 50 is moved around the rotation axis 38a by the caster effect. Torque works. As a result, the scribing wheel 50 rotates in the direction of the arrow R2, and the position of the scribing wheel 50 changes from the two-dot chain line position to the solid line position.

  Thus, even when the traveling direction of the scribing wheel 50 is changed and the attitude of the scribing wheel 50 is shifted by the angle θ1 with respect to the traveling direction, torque in the direction of the arrow R2 acts on the scribing wheel 50. As a result, the scribing wheel 50 turns so that the posture of the scribing wheel 50 and the traveling direction of the scribing wheel 50 are substantially parallel.

  The drive unit 40 reciprocates the head unit 30 provided with the scribing wheel 50 in the direction of arrow AR2 in FIG. 2 (Y-axis plus or minus direction: hereinafter also simply referred to as “reciprocating direction”). As shown in FIG. 2, the drive unit 40 mainly includes a plurality (two in the present embodiment) of columns 41 (41a, 41b), a plurality (two in the present embodiment) of guide rails 42, And a motor 43.

  The support columns 41 (41a, 41b) extend in the vertical direction (Z-axis direction) from the base portion 10a. As shown in FIG. 2, the guide rail 42 is fixed to the columns 41 a and 41 b while being sandwiched between the columns 41 a and 41 b.

  The guide rail 42 regulates the movement of the head unit 30 in the reciprocating direction. As shown in FIG. 2, the guide rail 42 is fixed at a predetermined distance in the vertical direction.

  The motor 43 is interlocked and connected to a feed mechanism (not shown) (for example, a ball screw mechanism). Accordingly, when the motor 43 rotates, the head unit 30 reciprocates in the direction of the arrow AR2 along the plurality of guide rails 42.

  The scribing wheel 50 is formed by molding a diamond-containing material. Here, examples of the diamond-containing material include sintered diamond, polycrystalline diamond, natural single crystal diamond, and synthetic single crystal diamond.

  The imaging unit 60 images the brittle material substrate 4 held by the holding unit 10. As shown in FIG. 2, the imaging unit 60 has a plurality of (two in this embodiment) cameras 65 (65a, 65b).

  The camera 65 (65a, 65b) is disposed above the holding unit 10 as shown in FIGS. The camera 65 (65a, 65b) captures an image of a characteristic portion (for example, an alignment mark (not shown)) formed on the brittle material substrate 4. And the position and attitude | position of the brittle material board | substrate 4 are calculated | required based on the image imaged with the camera 65 (65a, 65b).

  Here, the “position” of the brittle material substrate 4 refers to an arbitrary position on the brittle material substrate 4 in the absolute coordinate system. The “posture” of the brittle material substrate 4 is the inclination of the reference line of the brittle material substrate 4 with respect to the reciprocating direction of the head portion 30 (for example, one of the four sides when the brittle material substrate 4 is square). Say it.

  When the square brittle material substrate 4 is cleaved or divided, alignment marks are formed at two adjacent corners among the four corners of the brittle material substrate 4. Each alignment mark is imaged by the corresponding camera 65a, 65b, and the position of each alignment mark in the absolute coordinate system is obtained based on these captured images. Based on the positions of these alignment marks, the position and posture of the brittle material substrate 4 are calculated.

  The adjusting unit 70 reduces the temperature of the scribing wheel 50 held by the holder 35 and / or adjusts the atmosphere of the adjusting space 70a described later (more specifically, the atmosphere of the adjusting space 70a is in a low oxygen state. ). The detailed configuration of the adjustment unit 70 will be described later.

  The control unit 90 realizes operation control of each element of the scribe device 1 and data calculation. As shown in FIGS. 1 and 2, the control unit 90 mainly has a ROM 91, a RAM 92, and a CPU 93.

  A ROM (Read Only Memory) 91 is a so-called nonvolatile storage unit, and stores, for example, a program 91a. As the ROM 91, a flash memory that is a readable / writable nonvolatile memory may be used. A RAM (Random Access Memory) 92 is configured by, for example, a volatile storage unit, and can store data used in the calculation of the CPU 93.

  A CPU (Central Processing Unit) 93 performs control in accordance with the program 91a of the ROM 91 (control of forward / backward / revolving operation of the holding unit 10, opening / closing operation of a valve 77 described later, cooling operation of a cooling unit 78 described later, etc.). Run.

<1.2. Configuration of adjustment unit>
Here, the configuration of the adjusting unit 70 will be described with reference to FIG. As shown in FIG. 3, the adjustment unit 70 mainly includes a proximity plate 71, a plurality (two in this embodiment) of nozzles (first nozzles) 72 (72 a and 72 b), and a nitrogen gas supply source 73. ,have.

  The proximity plate 71 is a rectangular (square or rectangular) plate. The proximity plate 71 is provided above the scribing wheel 50 held by the holder 35. As shown in FIG. 3, the turning portion 38 of the holder 35 is inserted into the through hole 71 a of the proximity plate 71.

  When the scribe line SL is formed by the scribing wheel 50, the proximity plate 71 descends together with the scribing wheel 50. As a result, the proximity plate 71 is close to the brittle material substrate 4 as shown in FIG.

  The nozzles 72 (72a, 72b) are spaces between the brittle material substrate 4 held by the holding unit 10 and the proximity plate 71, and in an adjustment space 70a where the scribing wheel 50 held by the holder 35 is located. Nitrogen gas is discharged. As shown in FIG. 3, the nozzles 72 (72a, 72b) are attached to the end of the proximity plate 71 in the X-axis direction, for example.

  As shown in FIG. 3, the nozzle 72 a is connected to a nitrogen gas supply source 73 through a branch pipe 74 a and a common pipe 75. On the other hand, the nozzle 72 b is connected to the nitrogen gas supply source 73 through the branch pipe 74 b and the common pipe 75. Therefore, when the valve 77 provided in the common pipe 75 is opened, nitrogen gas is discharged into the adjustment space 70a.

  The cooling unit 78 is a cooling element provided so as to cover a part of the common pipe 75. The cooling unit 78 cools the nitrogen gas supplied to the nozzles 72 (72 a, 72 b) in the common pipe 75. Accordingly, when the cooling unit 78 is driven in a state where the valve 77 is opened, the cooled nitrogen gas is discharged into the adjustment space 70a.

<1.3. Scribing method>
Here, a method of forming the scribe line SL on the brittle material substrate 4 by the scribe device 1 of the present embodiment will be described.

  In this method, the scribing wheel 50 of the head unit 30 is pressed against the brittle material substrate 4 by a lifting / pressurizing mechanism (not shown). Further, the motor 13 of the holding unit 10 and / or the motor 43 of the driving unit 40 is driven, and the head unit 30 is relatively relative to the brittle material substrate 4 held by the holding unit 10 in the horizontal plane. Moved.

  Thereby, a desired scribe line SL is formed on the brittle material substrate 4 by the scribing wheel 50, and a vertical crack K is generated immediately below the scribe line SL.

  However, in the scribing apparatus 1 according to the present embodiment, when the scribe line SL is formed by the scribing wheel 50 in this manner, the control space 90a is opened from the nozzle 72 by opening the valve 77 by the action of the control unit 90. Nitrogen gas is discharged.

  Thereby, oxygen existing in the regulation space 70a is replaced with nitrogen gas, and the regulation space 70a is filled with nitrogen gas. That is, in the scribing apparatus 1 according to the present embodiment, the scribe line SL of the brittle material substrate 4 is formed under a low oxygen state.

  At this time, when the cooling unit 78 is further driven, cooled nitrogen gas is discharged into the adjustment space 70a. In this case, the atmosphere of the adjustment space 70a is cooled while being in a low oxygen state. Therefore, the scribe line SL is formed in a low oxygen state and in a state where the scribing wheel 50 is sufficiently cooled.

  The scribe load is preferably in the range of 3 (N) to 30 (N) (more preferably 5 (N) to 20 (N)). The moving speed of the scribing wheel 50 relative to the brittle material substrate 4 is usually in the range of 50 (mm / sec) to 1200 (mm / sec), preferably 50 (mm / sec) to 300 (mm / sec). is there. Note that specific values of the scribe load and the moving speed are appropriately set based on the material and / or thickness of the brittle material substrate 4.

  In the case of cleaving, the main surface of the brittle material substrate 4 (1) the main surface on which the scribe line SL is formed (hereinafter also simply referred to as “formation surface”) by a break device (not shown). (2) Stress is applied to the formation surface and the main surface on the opposite side. Therefore, the vertical crack K generated in the brittle material substrate 4 in the scribing process grows to the surface opposite to the formation surface, and the brittle material substrate 4 is cut (break process).

  On the other hand, in the case of division, deep vertical cracks K are formed by a scribe process. Therefore, a break device (not shown) is not required, and the brittle material substrate 4 is cut only by a scribe process.

<1.4. Advantages of scribing wheel in the first embodiment>
As described above, when the scribing device 1 of the present embodiment forms the scribe line SL on the brittle material substrate 4 by the scribing wheel 50, the nitrogen gas is supplied from the nozzle 72 to the adjustment space 70 a where the scribing wheel 50 exists. By discharging the scribe line SL, the scribe line SL can be formed in a low oxygen state. As a result, the scribing wheel 50 can be prevented from being oxidized due to the influence of oxygen in the vicinity of the scribing wheel 50, and the life of the scribing wheel 50 can be extended.

  In addition, the scribing apparatus 1 of the present embodiment can discharge the cooled nitrogen gas to the adjustment space 70a by driving the cooling unit 78 when discharging the nitrogen gas from the nozzle 72. When the cooled nitrogen gas is discharged, the atmosphere of the adjustment space 70a is cooled. As a result, the scribing wheel 50 used for scribing is sufficiently cooled. Accordingly, the scribing wheel 50 can be prevented from being oxidized due to the influence of heat generated during scribing and oxygen in the vicinity of the scribing wheel 50, and the life of the scribing wheel 50 can be further extended.

<2. Second Embodiment>
Next, a second embodiment of the present invention will be described. The scribing apparatus 100 of the second embodiment is the same as the scribing apparatus 1 of the first embodiment, except that the hardware configuration of the adjustment unit 170 (see FIG. 6) is different. Therefore, in the following, this difference will be mainly described.

  In the scribing apparatus 100, the same components as those of the scribing apparatus 1 are denoted by the same reference numerals, and these constituent elements have been described in the first embodiment. Therefore, the description is omitted in this embodiment.

<2.1. Configuration of adjustment unit>
FIG. 6 is a front view illustrating an example of the configuration of the adjustment unit 170. The adjustment unit 170 is a temperature adjustment unit of the scribing wheel 50 and reduces the temperature of the scribing wheel 50 held by the holder 35. As shown in FIG. 6, the adjustment unit 170 mainly includes a mounting plate 171, a plurality (two in this embodiment) of nozzles (second nozzles) 172 (72 a and 72 b), and a nitrogen gas supply source 73. ,have.

  The mounting plate 171 is a plate provided above the scribing wheel 50 held by the holder 35. As shown in FIG. 6, the holder 35 is inserted into the turning portion 38 and the through hole 171 a of the mounting plate 171.

  The nozzles 172 (172a and 172b) discharge the cooled nitrogen gas directly to the scribing wheel 50 held by the holder 35. As shown in FIG. 6, the nozzles 172 (172a, 172b) are attached to the end of the attachment plate 171 in the X-axis direction, for example.

  Further, as shown in FIG. 6, the nozzle 172a is connected to the nitrogen gas supply source 73 through the branch pipe 174a and the common pipe 75. On the other hand, the nozzle 172b is connected to the nitrogen gas supply source 73 through the branch pipe 174b and the common pipe 75. However, in the scribing apparatus 100 according to the present embodiment, the valve 77 is always opened while the cooling unit 78 is driven. Thereby, the cooled nitrogen gas is sprayed on the scribing wheel 50.

<2.2. Scribing method>
Even when the scribe line SL is formed on the brittle material substrate 4 by the scribe device 100 of the present embodiment, the scribing wheel 50 is made of a brittle material by an unillustrated elevating / pressing mechanism as in the first embodiment. The head unit 30 is moved relative to the brittle material substrate 4 held by the holding unit 10 in a horizontal plane while being pressed against the substrate 4.

  However, in the scribing apparatus 100 according to the present embodiment, when the scribing line SL is formed by the scribing wheel 50, the nozzle 77 is opened by opening the valve 77 while the cooling unit 78 is driven by the action of the control unit 90. The cooled nitrogen gas is discharged from 72 to the scribing wheel 50. That is, in the case of the present embodiment, the scribe line SL is formed on the brittle material substrate 4 by the scribing wheel 50 while the scribing wheel 50 is cooled.

<2.3. Advantages of scribing wheel in the second embodiment>
As described above, the scribing apparatus 100 according to the present embodiment can form the scribe line SL while cooling the scribing wheel 50. As a result, the scribing wheel 50 can be prevented from being oxidized due to the influence of heat generated during scribing, and the life of the scribing wheel 50 can be extended.

<3. Modification>
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made.

  (1) In the first embodiment, the number of the plurality of nozzles 72 is assumed to be two, and in the second embodiment, the number of the plurality of nozzles 172 is assumed to be two. Although described, the number of nozzles 72 and 172 is not limited to these. For example, three or more may be used.

  Further, when forming a scribe line SL, when a sufficient amount of nitrogen gas can be supplied to the adjustment space 70a, or when the scribing wheel 50 can be sufficiently cooled, the number of nozzles 72 and 172 is 1 respectively. It may be a book.

  (2) In the first and second embodiments, the nozzles 72 and 172 have been described as ejecting nitrogen gas, but the type of gas ejected is not limited to this. A rare gas (for example, helium, argon, etc.) with low reactivity may be discharged from the nozzles 72 and 172 in the same manner as the nitrogen gas. In the present application, nitrogen gas and noble gas are also collectively referred to as “inert gas”.

  However, in the first and second embodiments, inexpensive nitrogen gas is used. Thereby, the lifetime improvement of the scribing wheel 50 is realizable, without increasing a processing cost.

  (3) In the first and second embodiments, it has been described that the cooled nitrogen gas can be discharged from the nozzles 72 and 172. However, the present invention is not limited to this. When oxidation during scribing can be sufficiently prevented, a gas other than nitrogen gas (for example, air) cooled may be discharged from the nozzles 72 and 172. In this application, what cooled nitrogen gas and other gas other than nitrogen gas is named generically, and it is also called "cooling gas."

  Also in this case, the scribing wheel 50 can be cooled, and the scribing wheel 50 can be prevented from being oxidized due to the influence of heat generated during scribing. Thereby, the lifetime of the scribing wheel can be further extended.

  (4) In the first and second embodiments, the nozzles 72 and 172 are attached to the end portions of the proximity plates 71 and 171 in the X-axis direction (side direction of the scribing wheel 50). You may attach to the edge part of a direction (front of the ridgeline side of the scribing wheel 50, or back).

DESCRIPTION OF SYMBOLS 1,100 Scribing device 4 Brittle material substrate 10 Holding unit 20 Scribe unit 30 Head part 35 Holder 50 Scribing wheel 60 Imaging part unit 70, 170 Adjustment part 70a Adjustment space 71 Proximity plate 72 (72a, 72b) Nozzle 73 Nitrogen gas supply source 77 Valve 78 Cooling unit 90 Control unit 171 Mounting plate 172 (172a, 172b) Nozzle SL Scribe line

Claims (3)

A scribing device for forming a scribe line on a brittle material substrate,
(a) a scribing wheel;
(b) a holder for holding the scribing wheel;
(c) a holding unit that moves while holding the substrate;
(d) an adjustment unit that reduces the temperature of the scribing wheel;
(e) when a scribe line is formed by the scribing wheel, a control unit that causes the adjusting unit to cool the scribing wheel;
A scribing device comprising: The scribing device according to claim 1,
The adjusting unit is
(d-1) is provided above the scribing wheel held by the holder, and when a scribe line is formed by the scribing wheel, a proximity plate close to the brittle material substrate;
(d-2) a first nozzle that discharges cooling gas into an adjustment space between the substrate and the proximity plate held by the holding unit;
Have
The control unit causes the cooling gas to be discharged into the adjustment space by the first nozzle when a scribe line is formed by the scribing wheel. The scribing device according to claim 1,
The adjusting unit is
(d-1) a second nozzle that discharges a cooling gas toward the scribing wheel held by the holder;
Have
The scribing apparatus, wherein the control unit discharges the cooling gas toward the scribing wheel by the second nozzle when a scribing line is formed by the scribing wheel.

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