JP2012049429A - Substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To detect disconnection of a heater before a substrate is carried in a processing chamber, and to prevent a substrate processing process from being started when disconnection of a heater is detected.SOLUTION: The substrate processing apparatus comprises: a conveyance control unit which controls conveyance operation at each section of a substrate processing apparatus; a processing control unit which controls processing operation at each section of the substrate processing apparatus; and a main control unit which controls the conveyance control unit and the processing control unit, where the main control unit comprises an error processing unit performing prescribed error processing. Upon receiving an instruction, from the conveyance control unit, to cause transition of a recipe from stand-by state to executable state, the processing control unit performs disconnection detection processing. If a disconnection error is not received as a result of disconnection detection processing, the processing control unit shifts the recipe to the executable state. If a disconnection error is received after waiting an instruction to execute a recipe, the processing control unit does not shift the recipe to the executable state, but notifies disconnection error to the main control unit in order to perform error processing.

Description

  The present invention relates to a substrate processing apparatus for processing a substrate.

  2. Description of the Related Art Conventionally, a substrate processing process for processing a substrate based on a recipe in which processing conditions and processing procedures are defined is performed as one process of manufacturing a semiconductor device such as a DRAM (Dynamic Random Access Memory) or an IC (Integrated Circuit). I came. The operation of each part of the substrate processing apparatus that performs such a process is controlled by the control unit. In the substrate processing step performed by the control unit, for example, the substrate in the processing chamber is heated by a heater and the substrate is processed.

  However, in the conventional substrate processing apparatus, the disconnection of the heater is indirectly detected by detecting a temperature abnormality in the processing chamber during the substrate processing step. For this reason, if the heater is disconnected, an error due to the heater disconnection occurs after the substrate is carried into the processing chamber and the substrate processing process is started. In that case, the substrate left in the processing chamber until the substrate is recovered is affected by heat. For example, when the substrate is recovered, the surrounding oxygen and the processing surface of the substrate react to cause abnormal oxidation or the like on the processing surface of the substrate. It sometimes occurred.

  The present invention provides a substrate processing apparatus that detects a disconnection of a heater before a substrate is carried into the processing chamber, and prevents a substrate processing step from starting so that the substrate is not carried into the processing chamber when the heater is disconnected. The purpose is to do.

According to one aspect of the invention,
A substrate processing apparatus for performing predetermined processing on the substrate by executing a recipe in which processing conditions and processing procedures are defined while heating the substrate with a heater,
A transport control unit that controls the transport operation of each unit of the substrate processing apparatus;
A process control unit for controlling the processing operation of each unit of the substrate processing apparatus;
A main control unit that controls the transport control unit and the processing control unit,
The main control unit includes an error processing unit that performs predetermined error processing,
The processing control unit
When receiving an instruction for transition from the standby state to a state in which the recipe can be executed from the transfer control unit, a disconnection detection process is performed, and as a result of the disconnection detection process,
If a disconnection error is not received, the recipe is transferred to an executable state, and the recipe execution instruction is waited for.
When a disconnection error is received, a substrate processing apparatus is provided that notifies the disconnection error to the main control unit and performs the predetermined error processing without shifting to a state where the recipe can be executed.

  According to the substrate processing apparatus of the present invention, the disconnection of the heater is detected before the substrate is carried into the processing chamber, and the substrate processing process is started so that the substrate is not carried into the processing chamber when the disconnection of the heater is detected. Can be prevented.

1 is a perspective view of a substrate processing apparatus according to an embodiment of the present invention. It is side surface perspective drawing of the substrate processing apparatus which concerns on embodiment of this invention. It is a longitudinal cross-sectional view of the processing furnace of the substrate processing apparatus which concerns on embodiment of this invention. It is a block block diagram of the control apparatus with which the substrate processing apparatus which concerns on embodiment of this invention is provided, and its periphery. It is a block block diagram which shows operation | movement of the control apparatus with which the substrate processing apparatus which concerns on embodiment of this invention is provided. It is explanatory drawing which shows the message | telegram sequence of the main controller with which the substrate processing apparatus which concerns on embodiment of this invention is provided, a process system controller, and a display control part. It is a block block diagram of the main controller with which the substrate processing apparatus which concerns on embodiment of this invention is provided. It is a figure explaining the outline | summary of the state transition which concerns on embodiment of this invention. It is a block block diagram of the heater strand detection circuit with which the substrate processing apparatus which concerns on embodiment of this invention is provided. It is a schematic explanatory drawing of the detection process implemented when changing from the standby state in the substrate processing process which concerns on embodiment of this invention to an executable state. It is a schematic explanatory drawing of the detection process implemented when it changes to the completion | finish state from the executing state in the substrate processing process which concerns on embodiment of this invention.

<Embodiment of the present invention>
Hereinafter, embodiments of the present invention will be described.

(1) Configuration of Substrate Processing Apparatus The configuration of the substrate processing apparatus 100 according to the present embodiment will be described with reference to FIGS. FIG. 1 is a perspective view of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a side perspective view of the substrate processing apparatus according to the embodiment of the present invention. The substrate processing apparatus 100 according to the present embodiment is configured as a vertical apparatus that performs oxidation, diffusion processing, CVD processing, and the like on a substrate such as a wafer.

  As shown in FIGS. 1 and 2, the substrate processing apparatus 100 according to the present embodiment includes a housing 111 configured as a pressure vessel. A front maintenance port 103 serving as an opening provided for maintenance is provided in the front front portion of the front wall 111a of the casing 111. The front maintenance port 103 is provided with a pair of front maintenance doors 104 as an access mechanism for opening and closing the front maintenance port 103. A pod (substrate container) 110 containing a wafer (substrate) 200 such as silicon is used as a carrier for transporting the wafer 200 into and out of the housing 111. In the substrate processing apparatus 100 to which the present invention is applied, a FOUP (Front Opening Unified Pod) is used as the pod (substrate container) 110.

  A pod loading / unloading port (substrate container loading / unloading port) 112 is opened on the front wall 111 a of the housing 111 so as to communicate between the inside and the outside of the housing 111. The pod loading / unloading port 112 is opened and closed by a front shutter (substrate container loading / unloading port opening / closing mechanism) 113. On the front front side of the pod loading / unloading port 112, a load port (substrate container delivery table) 114 is installed as a mounting portion. The load port 114 is configured such that the pod 110 is placed on the load port 114 and the pod 110 is aligned. The pod 110 is configured to be transferred onto the load port 114 by an in-process transfer device (not shown) such as OHT (Overhead Hoist Transport).

  A rotary pod shelf (substrate container mounting shelf) 105 is installed at an upper portion of the housing 111 at a substantially central portion in the front-rear direction. A plurality of pods 110 are stored on the rotary pod shelf 105. The rotary pod shelf 105 includes a support column 116 that is erected vertically and is intermittently rotated in a horizontal plane, and a plurality of shelf plates (substrate containers) that are radially supported by the support column 116 at the upper, middle, and lower positions. Mounting stage) 117. The plurality of shelf plates 117 are configured to hold a plurality of pods 110 in a state where they are mounted.

  A pod transfer device (substrate container transfer device) 118 is installed between the load port 114 and the rotary pod shelf 105 in the housing 111. The pod transfer device 118 includes a pod elevator (substrate container lifting mechanism) 118a that can be moved up and down while holding the pod 110, and a pod transfer mechanism (substrate container transfer mechanism) 118b as a transfer mechanism. The pod transfer device 118 moves the pod 110 between the load port 114, the rotary pod shelf 105, and the pod opener (substrate container lid opening / closing mechanism) 121 by the continuous operation of the pod elevator 118a and the pod transfer mechanism 118b. It is comprised so that it may convey mutually.

  A sub-housing 119 is provided in the lower part of the housing 111 from the substantially central portion in the front-rear direction to the rear end in the housing 111. A pair of wafer loading / unloading ports (substrate loading / unloading ports) 120 that transfer the wafer 200 into and out of the sub-casing 119 are provided on the front wall 119a of the sub-casing 119 so as to be arranged vertically in two stages. Yes. Pod openers 121 are respectively installed at the upper and lower wafer loading / unloading ports 120.

  Each pod opener 121 includes a pair of mounting bases 122 on which the pod 110 is mounted, and a cap attaching / detaching mechanism (lid attaching / detaching mechanism) 123 that attaches / detaches a cap (cover) of the pod 110. The pod opener 121 is configured to open and close the wafer loading / unloading port of the pod 110 by attaching / detaching the cap of the pod 110 placed on the placing table 122 by the cap attaching / detaching mechanism 123.

  In the sub casing 119, a transfer chamber 124 that is fluidly isolated from a space in which the pod transfer device 118, the rotary pod shelf 105, and the like are installed is configured. A wafer transfer mechanism (substrate transfer mechanism) 125 is installed in the front region of the transfer chamber 124. The wafer transfer mechanism 125 includes a wafer transfer device (substrate transfer device) 125a capable of rotating or linearly moving the wafer 200 in the horizontal direction, and a wafer transfer device elevator (substrate transfer device) that moves the wafer transfer device 125a up and down. (Elevating mechanism) 125b. As shown in FIG. 1, the wafer transfer device elevator 125 b is installed between the right end of the front area of the transfer chamber 124 of the sub-housing 119 and the right end of the housing 111. The wafer transfer device 125 a includes a tweezer (substrate holding body) 125 c as a mounting portion for the wafer 200. The wafer 200 can be loaded (charged) and unloaded (discharged) with respect to the boat (substrate holder) 217 by the continuous operation of the wafer transfer device elevator 125b and the wafer transfer device 125a. ing.

  In the rear region of the transfer chamber 124, a standby unit 126 that houses and waits for the boat 217 is configured. A processing furnace 202 is provided above the standby unit 126. A furnace port 146 is configured to be opened and closed by a furnace port shutter (furnace port opening / closing mechanism) 147 at the lower end of the processing furnace 202.

As shown in FIG. 1, a boat elevator (substrate holder lifting mechanism) 115 that lifts and lowers the boat 217 is installed between the right end of the standby section 126 and the right end of the casing 111 of the sub casing 119. . An arm 128 as a connecting tool is connected to the elevator platform of the boat elevator 115. A seal cap 219 serving as a lid is horizontally installed on the arm 128. The seal cap 219 is configured to support the boat 217 vertically and to close the lower end portion of the processing furnace 202.

  This embodiment is mainly composed of a rotary pod shelf 105, a boat elevator 115, a pod transfer device (substrate container transfer device) 118, a wafer transfer mechanism (substrate transfer mechanism) 125, a boat 217, and a rotation mechanism 254 described later. The substrate transfer system according to the above is configured. The rotary pod shelf 105, the boat elevator 115, the pod transfer device (substrate container transfer device) 118, the wafer transfer mechanism (substrate transfer mechanism) 125, the boat 217, and the rotation mechanism 254 are connected to a control device 240 described later. Is electrically connected to a transport system controller 11 as a transport control unit.

  The boat 217 includes a plurality of holding members. The boat 217 is configured to hold a plurality of wafers 200 (for example, about 50 to 125 wafers) horizontally in a state where the centers are aligned in the vertical direction.

  As shown in FIG. 1, a clean unit 134 is installed at the left end of the transfer chamber 124 opposite to the wafer transfer device elevator 125b side and the boat elevator 115 side. The clean unit 134 includes a supply fan and a dustproof filter so as to supply a clean atmosphere or clean air 133 that is an inert gas. Between the wafer transfer device 125a and the clean unit 134, a notch alignment device (not shown) is installed as a substrate alignment device for aligning the circumferential position of the wafer.

  The clean air 133 blown out from the clean unit 134 flows around the boat 217 in the notch alignment device, wafer transfer device 125a, and standby unit 126 (not shown), and is then sucked in by a duct (not shown) to the outside of the casing 111. Or is circulated to the primary side (supply side) that is the suction side of the clean unit 134 and is blown out again into the transfer chamber 124 by the clean unit 134.

(2) Operation of Substrate Processing Apparatus Next, the operation of the substrate processing apparatus 100 according to the present embodiment will be described with reference to FIGS.

  As shown in FIGS. 1 and 2, when the pod 110 is supplied to the load port 114 by an in-process transfer device (not shown), the pod loading / unloading port 112 is opened by the front shutter 113. Then, the pod 110 on the load port 114 is carried into the housing 111 from the pod carry-in / out port 112 by the pod carrying device 118.

  The pod 110 carried into the housing 111 is automatically transferred onto the shelf plate 117 of the rotary pod shelf 105 by the pod transfer device 118 and temporarily stored. Thereafter, the pod 110 is transferred from the shelf 117 onto the mounting table 122 of one pod opener 121. Note that the pod 110 carried into the housing 111 may be directly transferred onto the mounting table 122 of the pod opener 121 by the pod transfer device 118. At this time, the wafer loading / unloading port 120 of the pod opener 121 is closed by the cap attaching / detaching mechanism 123, and clean air 133 is circulated and filled in the transfer chamber 124. For example, when the transfer chamber 124 is filled with nitrogen gas as clean air 133, the oxygen concentration in the transfer chamber 124 becomes, for example, 20 ppm or less, which is much lower than the oxygen concentration in the casing 111 that is an atmospheric atmosphere. It is set to be.

The pod 110 mounted on the mounting table 122 is pressed against the opening edge of the wafer loading / unloading port 120 in the front wall 119a of the sub-housing 119, and the cap is removed by the cap attaching / detaching mechanism 123. Then, the wafer loading / unloading port is opened. Thereafter, the wafer 200 is picked up from the pod 110 through the wafer loading / unloading port by the tweezer 125c of the wafer transfer device 125a, aligned in the notch alignment device, and then in the standby unit 126 at the rear of the transfer chamber 124. Are loaded into the boat 217 (charging). The wafer transfer device 125 a loaded with the wafer 200 in the boat 217 returns to the pod 110 and loads the next wafer 200 into the boat 217.

  During the loading operation of the wafer 200 to the boat 217 by the wafer transfer mechanism 125 in the one (upper or lower) pod opener 121, the other (lower or upper) pod opener 121 is placed on the mounting table 122. The pod 110 is transferred from the rotary pod shelf 105 by the pod transfer device 118 and transferred, and the opening operation of the pod 110 by the pod opener 121 is simultaneously performed.

  When a predetermined number of wafers 200 are loaded into the boat 217, the lower end portion of the processing furnace 202 closed by the furnace port shutter 147 is opened by the furnace port shutter 147. Subsequently, the boat 217 holding the wafer 200 group is loaded into the processing furnace 202 when the seal cap 219 is lifted by the boat elevator 115.

  After loading, arbitrary processing is performed on the wafer 200 in the processing furnace 202. After the processing, except for the wafer alignment process in the notch aligning apparatus, the boat 217 storing the processed wafers 200 is unloaded from the processing furnace 202 by a procedure almost opposite to the above procedure, and the processed wafers 200 are processed. Is carried out of the casing 111.

(3) Configuration of Processing Furnace Next, the configuration of the processing furnace 202 according to the present embodiment will be described with reference to FIG. FIG. 3 is a longitudinal sectional view of the processing furnace 202 of the substrate processing apparatus 100 according to the first embodiment of the present invention.

As shown in FIG. 3, the processing furnace 202 includes a process tube 203 as a reaction tube. The process tube 203 includes an inner tube 204 as an internal reaction tube and an outer tube 205 as an external reaction tube provided on the outside thereof. The inner tube 204 is made of a heat resistant material such as quartz (SiO ₂ ) or silicon carbide (SiC). The inner tube 204 is formed in a cylindrical shape with an upper end and a lower end opened. A processing chamber 201 for processing a wafer 200 as a substrate is formed in a hollow cylindrical portion in the inner tube 204. The processing chamber 201 is configured to accommodate a boat 217 described later. The outer tube 205 is provided concentrically with the inner tube 204. The outer tube 205 has an inner diameter larger than the outer diameter of the inner tube 204, is formed in a cylindrical shape with the upper end closed and the lower end opened. The outer tube 205 is made of a heat resistant material such as quartz or silicon carbide.

  A heater 206 as a heating mechanism is provided outside the process tube 203 so as to surround the side wall surface of the process tube 203. The heater 206 has a cylindrical shape. As will be described later, the heater 206 is divided into a plurality of regions, and is configured such that electric power is supplied to each heater element wire of the divided heater 206 to generate heat. The heater 206 is vertically installed by being supported by a heater base 251 as a holding plate.

A temperature sensor 263 as a temperature detector is installed in the process tube 203. The heater 206 and the temperature sensor 263 mainly constitute the heating mechanism according to this embodiment. The temperature controller 12 a is electrically connected to the heater 206 and the temperature sensor 263. The temperature controller 12a is connected to a control device 240 described later.

  A manifold 209 is disposed below the outer tube 205 so as to be concentric with the outer tube 205. The manifold 209 is made of, for example, stainless steel. The manifold 209 is formed in a cylindrical shape with an upper end and a lower end opened. The manifold 209 is engaged with the lower end portion of the inner tube 204 and the lower end portion of the outer tube 205, respectively. The manifold 209 is provided to support the lower end portion of the inner tube 204 and the lower end portion of the outer tube 205. An O-ring 220a as a seal member is provided between the manifold 209 and the outer tube 205. Although not shown, the manifold 209 is supported by the heater base 251 so that the process tube 203 is installed vertically. A reaction vessel is formed by the process tube 203 and the manifold 209.

  A processing gas nozzle 230 a and a purge gas nozzle 230 b as gas introduction portions are connected to a seal cap 219 described later so as to communicate with the inside of the processing chamber 201. A processing gas supply pipe 232a is connected to the processing gas nozzle 230a. On the upstream side of the processing gas supply pipe 232 (on the side opposite to the connection side with the processing gas nozzle 230a), a process (not shown) is performed via an MFC (mass flow controller) 241a as a gas flow rate controller and a valve (not shown) described later. A gas supply source or the like is connected. A purge gas supply pipe 232b is connected to the purge gas nozzle 230b. The upstream side of the purge gas supply pipe 232b (on the side opposite to the side connected to the purge gas nozzle 230b) is connected to an inert gas or the like via an MFC (mass flow controller) 241b as a gas flow rate controller and a valve (not shown) described later. A purge gas supply source (not shown) is connected.

  A processing gas supply system according to this embodiment is mainly configured by a processing gas supply source (not shown), an MFC 241a, a valve (not shown) described later, a processing gas supply pipe 232a, and a processing gas nozzle 230a. A purge gas supply system according to this embodiment is mainly configured by a purge gas supply source (not shown), an MFC 241b, a valve (not shown) described later, a purge gas supply pipe 232b, and a purge gas nozzle 230b. The gas supply system according to this embodiment is mainly constituted by the processing gas supply system and the purge gas supply system. The process system controller 12 is electrically connected to the MFCs 241a and 241b and a valve (not shown). Further, the MFC 241a and the MFC 241b may be collectively referred to as a gas flow rate controller 12c.

  The manifold 209 is provided with an exhaust pipe 231 that exhausts the atmosphere in the processing chamber 201. The exhaust pipe 231 is disposed at the lower end portion of the cylindrical space 250 formed by the gap between the inner tube 204 and the outer tube 205. The exhaust pipe 231 communicates with the cylindrical space 250. On the downstream side of the exhaust pipe 231 (on the side opposite to the connection side with the manifold 209), a pressure sensor 245 as a pressure detector, for example, an APC (Auto Pressure Controller) valve 242 as a pressure adjusting device, and a vacuum as a vacuum exhaust device. The pump 246 is connected in order from the upstream side. The gas exhaust mechanism according to this embodiment is mainly configured by the exhaust pipe 231, the pressure sensor 245, the APC valve 242, and the vacuum pump 246. A pressure controller 12b as an APC valve controller connected to a control device 240 described later is electrically connected to the pressure sensor 245, the APC valve 242 and the vacuum pump 246.

Below the manifold 209, a seal cap 219 is provided as a furnace port lid that can airtightly close the lower end opening of the manifold 209. The seal cap 219 is brought into contact with the lower end of the manifold 209 from the lower side in the vertical direction. The seal cap 219 is made of a metal such as stainless steel. The seal cap 219 is formed in a disc shape. On the upper surface of the seal cap 219, an O-ring 220b is provided as a seal member that comes into contact with the lower end of the manifold 209.

  A rotation mechanism 254 for rotating the boat 217 is installed near the center of the seal cap 219 and on the side opposite to the processing chamber 201. The rotation shaft 255 of the rotation mechanism 254 passes through the seal cap 219 and supports the boat 217 from below. The rotation mechanism 254 is configured to be able to rotate the wafer 200 by rotating the boat 217.

  The seal cap 219 is configured to be lifted and lowered in the vertical direction by a boat elevator 115 as a substrate holder lifting mechanism vertically installed outside the process tube 203. By moving the seal cap 219 up and down, the boat 217 can be transferred into and out of the processing chamber 201. As described above, the transport system controller 11 connected to the control device 240 described later is electrically connected to the rotation mechanism 254 and the boat elevator 115.

  As described above, the boat 217 as a substrate holder is configured to hold a plurality of wafers 200 in a multi-stage by aligning the wafers 200 in a horizontal posture and in a state where their centers are aligned with each other. The boat 217 is made of a heat-resistant material such as quartz or silicon carbide. In the lower part of the boat 217, a plurality of heat insulating plates 216 as heat insulating members are arranged in multiple stages in a horizontal posture. The heat insulating plate 216 is formed in a disc shape. The heat insulating plate 216 is made of a heat resistant material such as quartz or silicon carbide. The heat insulating plate 216 is configured to make it difficult to transfer heat from the heater 206 to the manifold 209 side.

  The substrate processing system according to this embodiment is mainly configured by the gas exhaust mechanism, the gas supply system, and the heating mechanism.

(4) Operation of Processing Furnace Subsequently, as a process of manufacturing the semiconductor device, a method of forming a thin film on the wafer 200 by the CVD method using the processing furnace 202 according to the above configuration will be described with reference to FIG. explain. In the following description, the operation of each part constituting the substrate processing apparatus 100 is controlled by the control device 240 in accordance with a recipe for substrate processing. Further, the operation of the processing furnace 202 described below corresponds to an operation in an executing state (RUN mode) described later.

  When a plurality of wafers 200 are loaded into the boat 217 (wafer charge), as shown in FIG. 3, the boat 217 holding the plurality of wafers 200 is lifted by the boat elevator 115 and loaded into the processing chamber 201. (Boat loading step) In this state, the seal cap 219 seals the lower end of the manifold 209 via the O-ring 220b.

The processing chamber 201 is evacuated by the evacuation device 246 so that a desired pressure (degree of vacuum) is obtained. Then, as will be described later, the processing gas is supplied to stabilize the gas flow rate of the processing gas, and on the basis of the pressure value measured by the pressure sensor 245, the pressure adjusting device 242 (the valve opening thereof) is feedback-controlled and processed. The pressure in 201 is made constant at a predetermined processing pressure. Further, the heater 206 is heated from the standby temperature so that the inside of the processing chamber 201 becomes a desired processing temperature (preparation step). At this time, the energization amount to the heater 206 is feedback controlled based on the temperature value detected by the temperature sensor 263. Subsequently, by the rotation mechanism 254,
The boat 217 and the wafer 200 are rotated.

  Next, the processing gas supplied from the processing gas supply source and controlled to have a desired flow rate by the MFC 241a flows through the gas supply pipe 232a and is introduced into the processing chamber 201 from the nozzle 230a. The introduced processing gas rises in the processing chamber 201, flows out from the upper end opening of the inner tube 204 into the cylindrical space 250, and is exhausted from the exhaust pipe 231. The processing gas comes into contact with the surface of the wafer 200 as it passes through the processing chamber 201, and at this time, a thin film is deposited on the surface of the wafer 200 by a thermal CVD reaction (processing step).

  When a preset processing time has elapsed, purge gas supplied from a purge gas supply source and controlled to have a desired flow rate by the MFC 241b is supplied into the processing chamber 201, and the processing chamber 201 is replaced with an inert gas. At the same time, the pressure in the processing chamber 201 is returned to normal pressure. Further, the temperature in the processing furnace 201 is decreased from the processing temperature to the standby temperature (temperature decreasing step).

  Thereafter, the seal cap 219 is lowered by the boat elevator 115 and the lower end of the manifold 209 is opened, and the boat 217 holding the processed wafer 200 is carried out of the process tube 203 from the lower end of the manifold 209 ( Boat unloading step). Thereafter, the processed wafer 200 is taken out from the boat 217 and stored in the pod 110 (wafer discharge).

(5) Configuration of Control Device Next, the configuration of the control device 240 centering on the main controller 14 as the main control unit will be described with reference to FIG. As shown in FIG. 4, the control device 240 includes a main controller 14, a switching hub 15 connected to the main controller 14, a display control unit 16 as an operation unit connected to the main controller 14, and the switching hub 15. A sub-display control unit 17 serving as a sub-operation unit connected to the main controller 14 via the main controller 14, a transport system controller 11 serving as a transport control unit, and a process system controller 12 serving as a process control unit. A transport system controller 11 and a process system controller 12 are electrically connected to the main controller 14 via a switching hub 15 by a LAN (Local Area Network) such as 100BASE-T. In addition, the disconnection detector 10 is serially connected to the main controller 14 via the switching hub 15. The detailed configuration of the disconnection detection unit 10 will be described later. The main controller 14 is connected to the buzzer 6 for notifying the occurrence of various errors including a heater disconnection error (also referred to as a heater disconnection detection error) via the switching hub 15. The buzzer 6 is activated and sounded under the control of an error processing unit described later.

  The main controller 14 is provided with a USB port 13 into which a USB memory, which is a recording medium as an external storage device, is inserted and removed. An OS corresponding to the USB port 13 is installed in the main controller 14. The main controller 14 is connected to an external host computer (not shown) via, for example, the communication network 40. For this reason, even when the substrate processing apparatus 100 is installed in a clean room, the host computer can be placed in an office or the like outside the clean room.

The display control unit 16 is connected to the display device 18 by, for example, a video cable 20. The display device 18 is a liquid crystal display panel, for example. An operation screen (also referred to as a process screen) for operating the substrate processing apparatus 100 can be displayed on the display device 18. The operation screen confirms the state of the substrate transport system 11A and the substrate processing system, and inputs operation instructions to the substrate transport system 11A and the substrate processing system (heating mechanism 12A, gas exhaust mechanism 12B, and gas supply system 12C). Various display fields and operation buttons (also referred to as system command buttons or PM command buttons). In addition, as a command of this embodiment, for example, RESET, IDLE
, STANDBY, START, END, ABORT, SKIP, JUMP, HOLD, RELEASE, and the like. Information generated in the substrate processing apparatus 100 can be displayed via the operation screen, and the displayed information can be output to a USB memory or the like inserted in the main controller 14. The display control unit 16 includes an input unit (not shown) that receives operator input data (input instructions) from the main operation screen displayed on the display device 18. The display control unit 16 receives input data (input instruction) from the input unit, and transmits the input data to the display device 18 or the main controller 14. In addition, the display control unit 16 receives an instruction (control instruction) for executing an arbitrary substrate processing recipe (also referred to as a process recipe) among a plurality of recipes stored in the RAM 1b described later. FIG. 6 is a display example of the operation screen. FIG. 6 shows an operation screen compliant with the related SEMI (Semiconductor Equipment and Materials International) standard, particularly E40 (control job management specification) and E94 (process management standard), but the operation screen display is limited to this. I can't. In addition, the display control part 16, the input part which is not shown in figure, and the display apparatus 18 may be comprised with the touch panel. The sub display control unit 17 and the sub display device 19 have the same configuration as the display control unit 16 and the display device 18. Here, the display control unit 16 and the sub display control unit 17 are described separately from the main controller 14, but may be included in the main controller 14.

  Note that a condition waiting factor temperature screen is displayed on the recipe progress screen, for example, as an operation screen displayed on the display device 18 and the sub display device 19. For example, a condition waiting factor for heater disconnection detection (also referred to as detection processing) can be added to the condition waiting factor temperature screen. When there is a condition wait factor, an icon indicating a wait for start (WAIT) (for example, a hand icon) is displayed and the heater break detection button is colored (colored). On the other hand, when there is no condition waiting factor, the heater disconnection detection button is hidden.

  The transfer system controller 11 mainly includes a rotary pod shelf 105, a boat elevator 115, a pod transfer device (substrate container transfer device) 118, a wafer transfer mechanism (substrate transfer mechanism) 125, a boat 217 and a rotation mechanism 254. Connected to the substrate transport system 11A. The transfer system controller 11 performs transfer operations of the rotary pod shelf 105, the boat elevator 115, the pod transfer device (substrate container transfer device) 118, the wafer transfer mechanism (substrate transfer mechanism) 125, the boat 217, and the rotation mechanism 254. Each is configured to control.

  The process system controller 12 includes a temperature controller 12a, a pressure controller 12b, a gas supply flow rate controller 12c, and an input / output controller 12d.

  A heating mechanism 12A mainly composed of a heater 206 and a temperature sensor 263 is connected to the temperature controller 12a. The temperature controller 12 a is configured to adjust the temperature in the processing furnace 202 by controlling the temperature of the heater 206 of the processing furnace 202. Note that the temperature controller 12a is configured to perform switching (on / off) control of the thyristor and control power supplied to the heater element wire, as will be described later.

  Connected to the pressure controller 12b is a gas exhaust mechanism 12B mainly composed of a pressure sensor 245, an APC valve 242 and a vacuum pump 246. Based on the pressure value detected by the pressure sensor 245, the pressure controller 12b controls the APC valve 242 and the vacuum pump 246 so that the pressure in the processing chamber 201 becomes a desired pressure at a desired timing. It is configured.

The gas flow rate controller 12c includes MFCs 241a and 241b. The input / output controller 12d is configured to control the supply and stop of gas from the processing gas supply pipe 232a and the purge gas supply pipe 232b by opening and closing the valve 12D.
The process system controller 12 also includes a gas flow rate controller 12c (MFCs 241a and 241b) and an input / output controller 12d (valve 12D) so that the flow rate of gas supplied into the processing chamber 201 becomes a desired flow rate at a desired timing. Is configured to control.

(6) General operation of control device (general operation of control device leading to detection process)
In the present embodiment, as will be described later, the control device 240 (process system controller 12) is configured to perform detection processing for detecting heater disconnection / non-disconnection of the heater 206. First, a schematic operation of the control device 240 (process system controller 12) leading to detection processing will be described with reference to FIG. For example, when the substrate processing apparatus 100 is in a later-described standby state (IDLE mode) in which an instruction to execute a substrate processing recipe can be received, for example, an operator inputs the recipe name and FOUP information (type, Number and the like) by operating an input unit (not shown). In response to this input, the main controller 14 controls the display control unit 16 to display the recipe name on the display device 18 by referring to the recipe name from the hard disk (HDD) 1 c as a storage unit included in the main controller 14. The main controller 14 reads the recipe name from the hard disk (HDD) 1c, writes it in the memory (RAM) 1b of the main controller 14 in association with the FOUP material information (type, number, etc.), and creates a recipe file. The main controller 14 refers to the recipe file and transmits a PM recipe instruction to the transport system controller 11 and the process system controller 12. The transfer system controller 11 and the process system controller 12 transmit a response to the PM recipe instruction received to the main controller 14. Then, the process system controller 12 requests a recipe instruction from the main controller 14. The main controller 14 transmits recipe data to the process system controller 12. The process system controller 12 writes the received recipe data in the memory 21 provided in the process system controller 12. When the pod 110 is placed on the load port 114 and an instruction to execute a substrate processing recipe is input from a not-shown input unit by pressing the STAER button, the transfer system controller 11 changes the state of the substrate processing apparatus 100. A PM mode instruction for making a transition from a standby state (IDLE mode) to an executing state (RUN mode) of a substrate processing recipe is transmitted to the process system controller 12 via an executable state (STANDBY mode) described later.

  As will be described later, in this embodiment, the state of the process controller 12 (PM mode) changes from the standby state (IDLE mode) to the executable state (STANDBY mode) and from the running state (RUN mode). At the time of transition to the end state (END mode), a detection process for detecting heater breakage / non-breakage of the heater 206 is performed. That is, the transport system controller 11 transmits a PM mode instruction when the state transitions from the standby state (IDLE mode) to the executable state (STANDBY mode). The process system controller 12 receives the PM mode instruction, transitions to a predetermined PM mode (GO STANDBY), and then executes a preset detection process. During the detection process, the process system controller 12 is configured to report the recipe progress report to the main controller 14 using the condition waiting information as PM report data.

(Schematic operation of control device in error processing)
Next, a schematic operation of the control device 240 centering on the main controller 14 in error processing will be described. The operation of the detection process will be described later. FIG. 6 is an explanatory diagram showing a message sequence of the main controller 14, the process system controller 12, and the display control unit 16.

If the disconnection error is detected as a result of the detection process, the main controller 14 automatically sets the substrate processing apparatus 100 to the maintenance work as an error process as shown in FIG.
The operator is prompted to perform the replacement work of 06. This error processing will be described.

  In response to the occurrence of a disconnection error alarm output from the disconnection detector 10, the process system controller 12 determines that maintenance work is in progress. The process system controller 12 sets the PM report data during maintenance work and transmits it to the main controller 14. At the same time, the main controller 14 reports the alarm occurrence as the schedule is suspended. When receiving the maintenance work in progress as PM report data, the main controller 14 adds the maintenance information status to the device management information in the shared area provided in the memory 1b, and sets that the maintenance work is in progress. Then, the main controller 14 prohibits addition of maintenance work unexecuted as a start condition to the maintenance information status of the device management information as PM report data. At the same time, the main controller 14 reports the occurrence of an alarm as the schedule is suspended. Then, the main controller 14 notifies the worker that the maintenance work is in progress. The maintenance information status of the apparatus management information prohibits maintenance work from being executed, and the state of the substrate processing apparatus 100 is in maintenance work. The main controller 14 sets the fact that maintenance work is in progress as a job execution prohibition factor in the start wait factor. Then, the display control unit 16 displays on the operation screen of the display device 18 an icon indicating start waiting (WAIT), which is a display indicating the palm, or a desired icon indicating that maintenance work is being performed.

  Then, in the substrate processing apparatus 100, an operator performs a maintenance operation such as heater replacement, and the operator confirms the end of the maintenance operation. When the heater replacement operation is completed and the disconnection error is recovered (all alarms in the heater areas 1 to 5 are manually recovered), the process controller 12 sets the PM report data to the normal operation of the device (maintenance operation is canceled), and that is the main controller. 14 to send. When the main controller 14 receives the normal apparatus operation as PM report data, the main controller 14 sets the maintenance work release wait state in the maintenance information status of the apparatus management information. The display control unit 16 blinks the Schedule Resume button displayed on the display device 18 to enable the button touch (note that the Schedule Resume button is also referred to as a maintenance work release waiting button or an error release button). Here, when the ABORT command or the STOP command is pressed, the command is executed and the wafer 200 is automatically collected.

  The operator depresses the blinking Schedule Resume button. If the maintenance has been completed by pressing the Schedule Resume button, the display control unit 16 transmits an initial completion report to the main controller 14. When the initial completion report is received, the main controller 14 changes the maintenance information status of the device management information from waiting for maintenance work release to maintenance work not being executed. At the same time, the main controller 14 reports alarm recovery. Then, the main controller 14 performs a start condition check. At this time, since the maintenance information status is “not performing maintenance work”, the start condition is satisfied, and the start waiting factor is cleared. Further, since the start wait factor has been cleared, the display control unit 16 hides the start wait (WAIT) on the operation screen displayed on the display device 18.

(7) Configuration of Main Controller Next, the block configuration of the main controller 14 will be described with reference to FIG. FIG. 7 is a block configuration diagram of the main controller 14 included in the substrate processing apparatus 100 according to the first embodiment of the present invention.

(Main controller)
The main controller 14 as a control unit includes a CPU (Central Processing Unit) 1a, a memory (RAM) 1b, a hard disk (HDD) 1c as a storage unit, a transmission / reception module 1d as a communication unit, and a clock function (not shown). Configured as a computer. The hard disk 1c includes a recipe file such as a substrate processing recipe as a recipe in which a state transition program, a heater disconnection detection program and an error processing program, detection processing parameters and error processing parameters, processing conditions and processing procedures are defined, Various screen files, various icon files, etc. (all not shown) are stored. In this embodiment, the detection process parameter and the error process parameter are also configured as configuration parameters that are read only once into the memory 1b when the main controller 14 is started, in association with the heater disconnection detection program and the error process program. Yes. In addition, the shared memory 5 is secured in the memory 1b together with the activation of the transition instruction program, the heater disconnection detection program, and the error processing program. A display control unit 16 and a switching hub 15 are connected to the transmission / reception module 1d of the main controller 14.

  In the present embodiment, whether detection processing and error processing are performed, the requirement parameters of detection processing and error processing can be individually set, and the heater element wire 206a is also configured to be able to perform disconnection check individually. Further, the detection processing and error processing parameters can be changed without turning off the main controller 14.

  As shown in FIG. 7, the main controller 14 of the present embodiment stores the detection processing parameters (whether detection processing is performed, output power, disconnection check time, heater region number, etc.) in the shared memory 5 provided in the memory 1b. Error processing parameters (whether or not error processing is performed, whether or not a buzzer is notified, and error holding) are written in a readable manner. As a result, the detection processing parameter and the error processing parameter can be set as function parameters, and the detection processing and error processing parameter values changed in real time can be reflected without turning on and off the power supply of the main controller 14 one by one. Can do. Examples of these function parameters are shown below.

PMC function / heater disconnection detection / heater disconnection detection function = none, available;
PMC function / heater disconnection detection / signal error number (heater zones 1-5) (0-64);
Error processing at PMC function / heater disconnection detection / STANDBY check = none, HOLD;
PMC function / heater disconnection detection / error processing at the time of checking immediately before END = none, BUZZER, HOLD (error holding);
PMC function / heater disconnection detection / power value = 0 to 100%;
PMC function / heater disconnection detection / monitoring time = 00 to 99 sec;
PMC function / heater disconnection detection / delay time = 00 to 99 sec
Note that PMC is an abbreviation for process module control, and is the process system controller 12 in this embodiment.

  The main controller 14 is configured to store the detection processing parameters and the error processing parameters in a shared memory 5a provided in the hard disk 1c in a readable manner. As a result, the detection processing parameters and error processing parameters stored as configuration parameters in the first embodiment can be stored as function parameters in the present embodiment.

For example, as shown in FIG. 8, the process system controller 12 is in an initial state (RESET mode), a standby state (IDLE mode), an executable state (STANDBY mode), a running state (RUN mode), and an end state (END mode). Are mainly configured to transition between five states. Examples of the state in the middle of transition between the states include GO RESET, GO STANDBY, and GO END. Transition to each state is performed by the main controller 14 or the transport system controller 11.

  In the present embodiment, as will be described later, when the state of the process controller 12 (PM mode) changes from the standby state (IDLE mode) to the executable state (STANDBY mode) and from the executing state (RUN mode). The disconnection detection unit 10 is configured to perform detection processing when transitioning to the end state (END mode).

  As shown in FIG. 8, when the power of the substrate processing apparatus 100 is turned on (POWER ON), the main controller 14 causes the state transition program to set the state of each part of the substrate processing apparatus 100 to the initial state (RESET mode). It is configured as follows.

  The initial state (RESET mode) is a state that transitions when the substrate processing apparatus 100 is turned on (POWER ON) or when the substrate processing apparatus 100 is reset when a trouble occurs in the substrate processing apparatus 100. is there. Specifically, for example, the rotary pod shelf 105, the boat elevator 115, the pod transfer device (substrate container transfer device) 118, the wafer transfer mechanism (substrate transfer mechanism) 125, the boat 217, and the like that constitute the substrate transfer system 11A. The rotation mechanisms 254 move to the origin positions and are stopped. Further, the substrate processing system, for example, the gas exhaust mechanism, the heating mechanism, and the gas supply system are stopped. In addition, an initial screen is displayed on the display device 18 and the sub display device 19.

  When the state of each part of the substrate processing apparatus 100 becomes an initial state (RESET mode), the state of each part of the substrate processing apparatus 100 is changed to a standby state (IDLE mode) in which an instruction to execute a substrate processing recipe can be accepted. It is configured.

  The standby state (IDLE mode) is a state in which a recipe execution instruction can be received. Specifically, the power supply to the substrate processing system, for example, the heater 206 of the heating mechanism is stopped (or the power is supplied so that the heater 206 is at room temperature (default)), or the substrate is transported. For example, the wafer transfer mechanism (substrate transfer mechanism) 125 constituting the system 11A is stopped (fixed) at the origin position and does not automatically operate.

  When the state of each part of the substrate processing apparatus 100 becomes a standby state (IDLE mode), for example, an operation screen for inputting recipes and various parameters is displayed on the display device 18, and a state in which a desired recipe and various parameters can be input is displayed. Become. Specifically, related data such as a substrate processing recipe is displayed on the display device 18, and the recipe and parameters can be input.

  Here, the substrate processing recipe is a recipe in which processing conditions and processing procedures for processing the wafer 200 are defined. In the recipe file, setting values (control values) to be transmitted to sub-controllers such as the transport system controller 11, the temperature controller 12a, the pressure controller 12b, and the gas supply controller 12c, transmission timing, and the like are set for each step of the substrate processing. Yes.

  While the state of each part of the substrate processing apparatus 100 is in the standby state (IDLE mode), the pod 110 is placed on the load port 114, and an instruction to execute a substrate processing recipe (depressing the START button) from an input unit (not shown). When the operation) is input, the main controller 14 causes the state of the substrate processing apparatus 100 or the process system controller 12 to transition to the substrate processing recipe execution state (RUN mode) via the executable state (STANDBY mode). It is configured as follows.

The executable state (STANDBY mode) is a state in which the recipe can be executed. Specifically, for example, power supply to the heater 206 of the heating mechanism is started, and the inside of the processing chamber 201 is in a preheated state. Further, for example, supply of purge gas by the purge gas supply system is started and the processing chamber 20
1 is purged by the purge gas. Further, for example, the wafer transfer mechanism (substrate transfer mechanism) 125 constituting the substrate transfer system 11A shifts to a substrate processing recipe execution state (RUN mode), such as being ready for driving at the standby position. However, it means a state where all the conditions are met.

  The main controller 14 is configured to transition the state of the substrate processing apparatus 100 or the process system controller 12 to the substrate processing recipe executing state (RUN mode) according to the state transition program.

  The in-execution state (RUN mode) is a state in which various recipes defined in the recipe file are being executed. In the running state (RUN mode), the boat 217 holding the wafers 200 is loaded into the processing furnace 202 (loading). In the running state (RUN mode), the main controller 14 determines the transfer system controller 11, the temperature controller 12a, the pressure controller 12b, and the sub-controller such as the gas supply controller 12c based on the description in the recipe file. A predetermined set value (control value) is transmitted at a predetermined timing.

  When the execution of the substrate processing recipe is completed (when the processing of the wafer 200 is completed), the main controller 14 changes the state (process system controller 12) of the substrate processing apparatus 100 from the executing state (RUN mode) to the end state (END mode). ).

  The end state (END mode) is a state where the execution of the recipe has ended. Note that the end state (END mode) includes two states: a normal end state where the recipe has ended normally and an abnormal end state where the recipe ended abnormally due to some trouble.

  In the executable state (STANDBY mode), for example, by pressing the IDLE button on the operation screen displayed on the display device 18, the executable state (STANDBY mode) is forcibly changed to the standby state (IDLE mode). It is possible to make a transition. In this case, for example, it is effective when the production line temporarily stops for some reason and waits for the pod 110 (wafer 200). Also, in any one of the standby state (IDLE mode), the executable state (STANDBY mode), the executing state (RUN mode), and the end state (END mode), for example, the RESET button on the operation screen is pressed. By operating, it is possible to forcibly shift to the initial state (RESET mode). Such a function is effective, for example, when an apparatus trouble occurs and the substrate processing apparatus 100 is returned to the initial state (RESET mode).

  In the present embodiment, the process system controller 12 receives a request (standby request) for transition from the standby state (IDLE mode) to the executable state (STANDBY mode) and from the running state (RUN mode) to the end state ( The presence or absence of the heater disconnection detection process can be selected at both times when a request for transition to (END mode) is received. In the present embodiment, when the detection process and the error process are performed, the process system controller 12 sets the detection process requirement parameter and the error process requirement parameter from the standby state (IDLE mode) to the executable state (STANDBY mode). ) To select the same setting both when receiving a transition request (standby request) to) and when receiving a transition request (end request) from the running state (RUN mode) to the end state (END mode) be able to. The detection process parameters include detection process execution / non-execution, output power value (also referred to as power value) supplied to a heater wire, which will be described later, monitoring time, delay time, disconnection check time, heater area number (signal error number) Also called). The error processing parameters include whether error processing is performed, whether buzzer notification is present, error holding (HOLD), and the like.

  In addition, when receiving a request for transition from the standby state (IDLE mode) to the executable state (STANDBY mode) (standby request), the process system controller 12 causes the disconnection detection unit 10 described later to perform detection processing, thereby causing a heater disconnection. If detected, it is configured not to make a transition to the executable state (STANDBY mode). In addition, when the heater disconnection detection unit 3 receives a request for transition from the running state (RUN mode) to the end state (END mode) (end request), the heater disconnection detection unit 3 is also executable in the next lot when the heater disconnection is detected. It is configured not to make a transition to (STANDBY mode). Thereby, the disconnection of the heater 206 can be detected before the wafer 200 is loaded into the processing chamber 201, and the substrate processing recipe can be prevented from starting when the disconnection of the heater 206 is detected. Therefore, it is possible to prevent the process LOT OUT (lot defect) and improve the device reliability.

(Disconnection detection unit)
For example, a disconnection detection unit (disconnection detection system) 10 that performs detection processing for detecting a heater disconnection is configured as shown in FIG. FIG. 9 is a block configuration diagram of the disconnection detection unit 10 that detects disconnection / non-disconnection of the heater element wire 206a of the heater 206 divided into a plurality of regions. The disconnection detection unit is mainly configured by the heater 206, the power supply unit 22, the temperature controller 12a, the current detector 10a, the disconnection alarm device 10c, the sequencer 12d, and the process system controller 12. The heater 206 is divided into, for example, five regions in order to improve the temperature characteristics in the processing chamber 201. In FIG. 9, one of the five divided areas is shown as a representative example. The disconnection detector 10 measures the current flowing through each of the heater strands 206a, for example, measures the voltage applied to each of the current detector 10a such as a current transformer and the heater strand 206a, and measures the voltage such as a step-down transformer. Device 10b, disconnection alarm device 10c for detecting disconnection / non-disconnection of heater wire 206a from the current measurement value from current detector 10a and the voltage measurement value from voltage measurement device 10b, and an interlock signal from disconnection alarm device 10c. And a sequencer 12d as a general-purpose controller that outputs heater area number information (also referred to as a heater disconnection result area) that can identify the area of the disconnected heater element wire 206a. Each of the heater wires 206a is connected to a power supply unit 22 as a power supply that supplies power from the heater power supply 21a such as an AC power supply. The sequencer 12d is serially connected to the process system controller 12 via Device Net or the like. The power supply unit 22 is switching (on / off) controlled by a thyristor 23 controlled by the temperature controller 12a. The temperature controller 12a is serially connected to the process system controller 12.

Operations of the power supply unit 22 and the disconnection detection unit 10 configured as described above will be described. The temperature controller 12a performs switching control of the thyristor 23, and supplies predetermined output power (0 to 100%) from the heater power source 21a to each heater wire 206a. And the disconnection detection part 10 measures the electric current which flows through each of the heater strand 206a with the current detector 10a, and measures the voltage concerning each of the heater strand 206a with the voltage measuring device 10b. The disconnection detector 10 receives the measurement results of the current detector 10a and the voltage measuring instrument 10b and detects disconnection / non-disconnection by the disconnection alarm device 10c. Here, when electric power is supplied to the heater element wire 206a, a predetermined voltage is applied to the heater element wire 206a. If a current flows through the heater element wire 206a with this voltage applied, the disconnection alarm device 10c determines that the heater element wire 206a is not disconnected. On the other hand, if no current flows through the heater element wire 206a in a state where voltage is applied, the disconnection alarm device 10c determines that the heater element wire 206a is disconnected. That is, the current detector 10a and the voltage measuring device 10b measure, the disconnection alarm device 10c determines the measurement result, and the disconnection alarm device 10c notifies the sequencer 12d of the determination result. The sequencer 12d outputs a disconnection error or no disconnection error and heater area number information to the process system controller 12. Then, the process system controller 12 is configured to receive the disconnection error and the heater region number information from the sequencer 12d of the disconnection detection unit 10 and identify the disconnection region of the heater wire 206a. Thereby, in this embodiment, it is possible to directly detect the disconnection of the heater 206 by providing the disconnection detection unit 10, and even if a temperature abnormality occurs in the processing furnace 202, it may be caused by the disconnection of the heater 206. It becomes easy to judge whether or not.

  Even if the detection process is set when transitioning from the running state (RUN mode) to the end state (END mode), the detection process may not be performed depending on the following conditions. The condition when the detection process is not performed is a case where JUMP / SKIP is performed from the currently executed recipe step to the end step in the running state (RUN mode). In addition, an alarm recipe is executed during execution of the final step of the recipe, and an end command is set in the final step of the alarm recipe. If a sub-recipe is set in the final step of the recipe and an END command is set in the final step of the sub-recipe, the detection process is performed.

  In addition, the process system controller 12 is configured to end the detection process according to detection process end conditions as described below, for example, four end conditions. First, the end condition of the first detection process is that after a predetermined time has elapsed since the detection process was started (monitoring time, delay time, disconnection check time), the heater disconnection error (the signal error number from the sequencer 12d is the entire region ( This is a case where OFF) does not occur in all five cases.

  The second detection process end condition is when an error other than the heater disconnection error occurs. For example, when a RESET / ABORT / END alarm occurs in the GO STANDBY mode, the detection process is interrupted and the mode is shifted to the GO RESET / GO ABORT / GO END mode and the detection process is not performed. If an alarm other than RESET / ABORT occurs, the detection process is continued. Also, during the detection process, if the HOLD process is reserved due to a heater disconnection error, the HOLD process is not performed. If there is no heater disconnection error, HOLD processing is accepted.

On the other hand, when the state of the process system controller 12 (PM mode) transitions from the running state (RUN mode) to the end state (END mode), that is, at the final step in the running state (RUN), for example, Alarm Recipe When an alarm of (alarm recipe) occurs, the detection process is interrupted, the normal Alarm Recipe process is executed, and the detection process is not performed. For example, when a MONITOR / BUZZER alarm occurs, the detection process is continued. Also, during the detection process, if the HOLD process is reserved due to a heater disconnection error, the HOLD process is not performed (HOLD (error holding) due to a heater disconnection error). When there is no heater disconnection error, HOLD processing is performed. Also, if a JUMP alarm occurs during the final step in the running state (RUN), the detection process is interrupted, the normal JUMP step process is executed, and the detection process is performed again when the final step is executed. To do. If the RESET / ABORT alarm occurs at the final step in the running state (RUN mode), the detection process is interrupted and the GO RESET / GO
The detection process is not performed by shifting to the ABORT mode. Further, when an END alarm is generated at the final step in the running state (RUN mode), the detection process is interrupted, the GO END mode is entered, and the detection process is not performed.

  The third condition for terminating the detection process is that the following parameters are omitted during the break check of the heater wire 206a. After the detection process is completed to the end and all the heater disconnection errors that have occurred are manually cleared and then the HOLD process is being performed, the HOLD release is performed, and the heater disconnection detection is disabled. That is, when the detection process is performed from the presence to the absence, the transition from the standby state (IDLE mode) to the executable state (STANDBY mode) and from the running state (RUN mode) to the end state (END mode) At the time of transition, both detection processes are not performed.

  The fourth detection process end condition is when a command is issued. For example, when a command such as RESET or ABORT is issued, the detection process is not performed. Table 1 below illustrates the validity / invalidity of each command during detection processing.

However,
○: The heater break detection is interrupted and the command is valid. Thereafter, disconnection detection is not performed.
×: Command invalid △: Disconnection detection is continued, and command is valid after disconnection detection is completed.
◇: The heater break detection is interrupted and the command is valid. After that, after executing the final step in the running state (RUN mode), disconnection detection is performed again.

  At the end of the detection process, the temperature setting value for the temperature controller 12a is returned to the setting before the detection process. Also, waiting for detection processing conditions is cleared.

(Error handling part)
As shown in FIG. 7, the error processing unit 4 is implemented in the main controller 14 by the CPU 1a executing an error processing program read from the hard disk (HDD) 1c. When receiving an execution instruction from the process system controller 12, the error processing unit 4 reads buzzer notification presence / absence, error retention, etc. as error processing parameters from the shared memory 5, and performs predetermined error processing according to these parameters. It is configured as follows.

  Specifically, when receiving an error processing execution instruction from the process system controller 12, the error processing unit 4 sounds the buzzer 6, for example, and notifies the disconnection of the heater 206. Thereby, the operator can know that the heater 206 is disconnected.

  Further, the error processing unit 4 is configured to write the fact that a heater disconnection error has occurred in a file in the shared memory 5 so as to be readable and writable, and hold that the heater disconnection error has occurred. When an error release instruction is received from the process system controller 12, the fact that a heater disconnection error written in the file has occurred is deleted. Thus, when the operator enters the substrate processing apparatus 100 and performs maintenance such as heater replacement work until the error is cleared, for example, other screen operations are blocked and the error processing state is continued. Can improve safety.

In addition, when the error processing unit 4 receives an error processing execution instruction from the process system controller 12, the error processing unit 4 instructs the display control unit 16 and the sub display control unit 17 to display that the maintenance work is in progress (start WAIT). The fact that the display device 18 and the sub display device 19 are under maintenance can be displayed on the operation screen. Thereby, it is possible to prompt the worker to perform maintenance work such as heater replacement work. When the error processing unit 4 receives an error processing execution instruction from the process system controller 12, the error processing unit 4 displays a display of an error cancel button for canceling the maintenance work and canceling the error processing on the display control unit 16 and the sub display control unit 17. By instructing, the display device 18 and the sub display device 19 can display an error release button on the operation screen. Then, the display control unit 16 receives an error cancel button operation signal from an input unit (not shown), instructs the error processing unit 4 to cancel the error, and ends the error processing. Thus, as soon as maintenance work such as heater replacement work is completed, the state of the process system controller 12 (PM mode) can be changed to the executable state (STANDBY mode).

  In addition, the error processing performed when the PM mode transitions from the standby state (IDLE mode) to the executable state (STANDBY mode), after manually recovering all the heater disconnection error alarms, shifts to the ABORT or RESET mode. Thus, the HOLD may be canceled. In addition, the error processing performed when transitioning from the running state (RUN mode) to the end state (END mode) is manually canceled after all the heater disconnection error alarms are released, and then the HOLD is canceled by the JUMP / SKIP / RELEASE command. , It may be configured to shift to GO END.

(8) Detection Processing and Error Processing Next, detection processing and error processing according to the present embodiment will be described with reference to FIGS. Such an operation is performed as one step of the manufacturing process of the semiconductor device. FIG. 10 is a schematic explanatory diagram of a detection process that is performed when a transition is made from the standby state (IDLE mode) to the executable state (STANDBY mode). FIG. 11 is a schematic explanatory diagram of a detection process that is performed when a transition is made from the running state (RUN mode) to the end state (END mode).

  As shown in FIG. 10, in response to a standby request from the transfer system controller 11, first, an instruction to set the power supply from the heater power supply 21a to output power (0 to 100%) is issued from the process system controller 12 to the temperature controller 12a. Is output. If the specified response = OK is not received from the temperature controller 12a within the monitoring time as a response indicating that this output power designation has been received (no designated response = NG), or if the designated response = NG is received, the process system controller 12 determines that the line of the power supply unit 22 is down, etc., stops the detection process, and transmits the entire area of the heater 206 to the main controller 14 as a heater disconnection error. At the same time, the process system controller 12 instructs the sequencer 12d to end the detection process. On the other hand, when the designated response = OK is received from the temperature controller 12a within the monitoring time, the process system controller 12 transmits to the main controller 14 that the designated response = OK. Then, the main controller 14 sets the state of the substrate processing apparatus 100 to the GO STANDBY mode, waits for the heater disconnection detection condition, and holds (HOLD) the wait for the heater disconnection detection condition until the detection process ends normally, ends abnormally, or is interrupted. In addition, when the sub recipe is set to the step of the executable state (STANDBY mode), the heater disconnection detection condition is waited at the head of the first step of the sub recipe. However, the step time is not measured, but the hold time is measured.

  As described above with reference to FIG. 9, the power supply unit 22 supplies power to each of the heater wires 206a of the heater 206 divided into a plurality of regions (for example, five). At this time, after the delay time until the heater power supply 21a supplies the output power to the heater wire 206a, the heater power supply 21a supplies the output voltage from 0 to 100%. The disconnection detection unit 10 measures the current and voltage flowing through each of the heater strands 206a, and detects disconnection / non-disconnection until the disconnection check time elapses (S202). The disconnection detector 10 outputs a heater disconnection error and heater area number information to the process system controller 12 if the heater wire 206a (heater 206) is disconnected, and if the heater 206 is not disconnected, there is no disconnection error. To the process system controller 12. During the detection process, the display device 18 and the sub display device 19 display a detection process screen that can display the status of the detection process (S106).

  If the disconnection check time has elapsed and the detection result of the disconnection detection unit 10 has been received and the heater 206 has not disconnected, the process system controller 12 transmits to the main controller 14 that there is no disconnection error. At the same time, the process system controller 12 instructs the sequencer 12d to end the detection process and instructs the temperature controller 12a to return the temperature setting value to the temperature setting value of the substrate processing recipe. When the process controller 12 receives no disconnection error from the disconnection detector 10, the process controller 12 changes the state (PM mode) of the process controller 12 to the executable state (STANDBY mode). Then, the process system controller 12 waits for a recipe start instruction (an instruction to make a transition from the STANDBY mode to the RUM mode). The state of the process system controller 12 is changed from the executable state (STANDBY mode) to the executing state (RUN mode) and the end state (END mode) as described later.

  If the disconnection check time has elapsed and the heater 206 is disconnected in response to the detection processing result of the disconnection detection unit 10, the process system controller 12 identifies the disconnection area of the heater 206, the heater disconnection error, and the heater area number information. Is transmitted to the main controller 14. At the same time, the disconnection detection unit 10 instructs the sequencer 12d to end the detection process and instructs the temperature controller 12a to return the temperature setting value to the temperature setting value of the substrate processing recipe.

(Error handling)
When receiving a disconnection error from the process system controller 12, the main controller 14 instructs the error processing unit 4 to perform error processing. In response to the heater disconnection error from the process system controller 12, the error processing unit 4 reads the error processing requirement parameters (whether buzzer notification is present, error holding) from the shared memory 5. Then, the error processing unit 4 performs error processing according to the requirement parameter. The error processing unit 4 sounds the buzzer 6 and notifies the disconnection of the heater 206. Further, the error processing unit 4 writes the fact that the heater disconnection error has occurred in a file in the shared memory 5 so as to be readable and writable, and indicates that the heater disconnection error has occurred until an error release instruction is received from the display control unit 16. Hold. Thus, when an operator enters the substrate processing apparatus 100 and performs maintenance such as a heater replacement operation until an error cancel instruction is issued, the error processing state can be continued, and safety is improved. Can be improved.

  When the error processing unit 4 receives an error processing execution instruction from the main controller 14, the error processing unit 4 instructs the display control unit 16 and the sub display control unit 17 to display that the maintenance work is in progress (start WAIT). Upon receiving an instruction from the error processing unit 4, the display control unit 16 and the sub display control unit 17 display on the operation screens of the display device 18 and the sub display device 19 that maintenance work is being performed. Thereby, it is possible to prompt the worker to perform maintenance work such as heater replacement work. In addition, the error processing unit 4 displays the identified disconnection area on the operation screens of the display device 18 and the sub display device 19. Upon receiving an instruction from the error processing unit 4, the display control unit 16 and the sub display control unit 17 display the heater disconnection area on the operation screens of the display device 18 and the sub display device 19.

Further, upon receiving an error processing execution instruction from the main controller 14, the error processing unit 4 instructs the display control unit 16 and the sub display control unit 17 to display an error release button. Upon receiving an instruction from the error processing unit 4, the display control unit 16 and the sub display control unit 17 display an error release button on the operation screens of the display device 18 and the sub display device 19. The operator knows that a heater disconnection error has occurred by looking at the display indicating that the maintenance work is being displayed on the display device 18 and the sub display device 19, and performs, for example, a heater replacement operation. Then, after the heater replacement operation is completed, the operator depresses the error release button. Then, the display control unit 16 and the sub display control unit 17 transmit an error cancel button operation signal to the main controller 14. The main controller 14 receives the operation signal of the error cancel button from the display control unit 16 and the sub display control unit 17 and instructs the error processing unit 4 to cancel the error. When receiving the error release instruction from the process system controller 12, the error processing unit 4 deletes the fact that the heater disconnection error written in the file has occurred, cancels the error, and ends the error processing. As a result, as soon as maintenance work such as heater replacement work is completed, the state of the process controller 12 can be changed to an executable state (STANDBY mode), and the heater 200 before the wafer 200 is loaded into the processing chamber 201. When the disconnection of the heater 206 is detected and the disconnection of the heater 206 is detected, the start of the substrate processing recipe can be prevented so that the wafer 200 is not carried into the processing chamber 201.

(Executable state (STANDBY mode))
The process system controller 12 receives the end of the error processing and, when a predetermined condition is satisfied, transitions the state of the process system controller 12 to an executable state (STANDBY state). Further, when the process controller 12 is in an executable state (STANDBY mode) and all the conditions are satisfied to shift to the executing state (RUN mode) of the substrate processing recipe as described above, the process controller 12 The controller 12 waits for an instruction to change the state of the controller 12 (PM mode) to the executing state (RUN mode).

(Running state (RUN mode))
In the running state (RUN mode), a predetermined set value is set at a predetermined timing to the sub-controller such as the transfer system controller 11, the temperature controller 12a, the pressure controller 12b, and the flow rate controller 12c based on the description in the recipe file. (Control value) is transmitted, and the substrate processing recipe is executed as described above. The display device 18 and the sub display device 19 display an operation screen such as a recipe execution screen for displaying the operations of the substrate transport system 11A, the heating mechanism 12A, the gas exhaust mechanism 12B, and the gas supply system 12C. Then, as shown in FIG. 11, when the final step of the execution (process) recipe in the running state (RUN mode) is completed, the process system controller 12 receives a recipe completion notification as a transition request (end request).

(Detection process)
The process system controller 12 receives the recipe completion notification and determines whether or not the detection process is performed. When the detection process is not performed, the state of the process controller 12 is changed to the end state (END mode). When the state of each part of the substrate processing apparatus 100 becomes the end mode (END mode), the main controller 14 changes the state of each part of the substrate processing apparatus 100 to the standby state (IDLE mode). Further, when the pod 110 is placed on the load port 114, the main controller 14 determines that there is a next lot, and thereafter repeats the above-described operation.

  On the other hand, when performing detection processing, the process system controller 12 causes the disconnection detection unit 10 to perform detection processing. At this time, as shown in FIG. 11, in response to the end request, first, an instruction to set the power supply from the heater power supply 21a to output power (0 to 100%) is output to the temperature controller 12a. If the specified response = OK is not received from the temperature controller 12a within the monitoring time as a response indicating that this output power designation has been received (no designated response = NG), or if the designated response = NG is received, the process system controller 12 determines that the line of the power supply unit 22 is down, etc., interrupts the detection process, and transmits the entire area of the heater 206 to the main controller 14 as a disconnection error. At the same time, the process system controller 12 instructs the sequencer 12d to end the detection process. On the other hand, when the designated response = OK is received from the temperature controller 12a within the monitoring time, the process system controller 12 transmits to the main controller 14 that the designated response = OK. Then, the process system controller 12 sets the PM mode to the GO END mode, waits for the heater disconnection detection condition, and holds (HOLD) the heater disconnection detection condition wait until the detection process ends normally, ends abnormally, or is interrupted.

  As described above, the power supply unit 22 supplies power to each heater wire 206a of the heater 206. At this time, after the delay time until the heater power supply 21a supplies the output power to the heater wire 206a, the heater power supply 21a supplies the output voltage from 0 to 100%. The disconnection detection unit 10 measures the current and voltage flowing through each of the heater strands 206a, and detects disconnection / non-disconnection until the disconnection check time elapses. Then, the disconnection detection unit 10 outputs a heater disconnection error and heater area number information to the process system controller 12 if the heater element wire 206a is disconnected, and if the heater 206 is not disconnected, indicates that there is no heater disconnection error. Output to the system controller 12. During the detection process, the display device 18 and the sub display device 19 display a detection process screen that can display the status of the detection process.

  If the disconnection check time has elapsed and the detection result of the disconnection detection unit 10 has passed and the heater 206 has not disconnected, the process system controller 12 transmits to the main controller 14 that there is no heater disconnection error. At the same time, when the process-related controller 12 receives that there is no heater disconnection error, the process controller 12 instructs the sequencer 12d to end the detection process and returns the temperature setting value to the temperature setting value of the substrate processing recipe. To instruct. If the process controller 12 receives no heater disconnection error from the disconnection detector 10, the process controller 12 changes the PM mode to the end state (END mode).

  If the disconnection check time has elapsed and the heater 206 is disconnected in response to the detection processing result of the disconnection detection unit 10, the process system controller 12 identifies the disconnection area of the heater 206, the heater disconnection error, and the heater area number information. Is transmitted to the transition instruction unit 2. At the same time, the process system controller 12 instructs the sequencer 12d to end the detection process.

(End status (END mode))
When the detection process is completed, the process system controller 12 changes the PM mode state to the end state (END mode). The display device 18 and the lucky display device 19 display an operation screen such as an end screen. Here, as a result of the detection process, when it is received that there is no heater disconnection error, the state of each part of the substrate processing apparatus 100 is changed from the end state (END mode) to the standby state (STANDBY mode) according to the requirements. Repeat the operation.

(Error handling)
On the other hand, when the heater disconnection error is received as a result of the detection processing, the main controller 14 instructs the error processing unit 4 to perform error processing, and the error processing unit 4 performs error processing. The display device 18 and the sub-display device 19 display a maintenance work in progress and an error release button on the operation screen, and display a heater disconnection area on the operation screen. After the heater replacement operation is completed, the display control unit 16 and the sub display control unit 17 transmit an operation signal of the pressed error release button to the main controller 14. The main controller 14 receives the error cancel button operation signal from the input unit, instructs the error processing unit 4 to cancel the error, and the error processing unit 4 ends the error processing. Thereby, as soon as maintenance work such as heater replacement work is completed, the state of the substrate processing apparatus 100 can be changed from the end state (END mode) to the standby state (IDLE mode) and the executable state (STANDBY mode). The substrate processing recipe for the next lot can be implemented. The main controller 14 changes the state of the substrate processing apparatus 100 from the end state (END mode) to the standby state (IDLE mode) and the executable state (STANDBY mode), and next from the display control unit 16 and the lucky display control unit 17 and the like. When the information indicating that there is a lot is input, the above operation is repeated thereafter.

(9) Effects According to the Present Embodiment According to the present embodiment, one or more effects described below are exhibited.

(A) According to the present embodiment, when the state of the process system controller 12 receives a request for transition from the standby state (IDLE mode) to the executable state (STANDBY mode), the disconnection detection unit 10 performs detection processing. If the heater disconnection error is not received, the state of the process controller 12 is changed to the executable state (STANDBY mode). If the heater disconnection error is received, the state of the substrate processing apparatus 100 (process controller 12) can be executed. The error processing unit 4 is caused to perform error processing without making a transition to the state (STANDBY mode). Thus, the disconnection of the heater 206 is detected before the wafer 200 is loaded into the processing chamber 201, and when the disconnection of the heater 206 is detected, the substrate processing recipe is started so that the wafer 200 is not loaded into the processing chamber 201. Can be prevented. As a result, the process LOT OUT (lot defect) can be prevented and the device reliability can be improved.

(B) According to the present embodiment, when the error processing unit 4 receives the fact that a disconnection error has occurred, the error processing unit 4 writes the fact that the disconnection error has occurred in the file in the memory 1b and holds that the disconnection error has occurred. When the error cancel instruction is received from the display control unit 16, the fact that the heater disconnection error written in the file has occurred is deleted. As a result, when an operator enters the substrate processing apparatus 100 and performs maintenance such as heater replacement work, other screen operations are blocked and the error processing state can be continued, improving safety. Can be made.

(C) According to the present embodiment, the display control unit 16 and the sub display control unit 17 can display on the operation screen that the maintenance work is in progress, and the error processing unit 4 receives error processing from the main controller 14. When the execution instruction is received, the display control unit 16 and the sub display control unit 17 are instructed to display that maintenance work is in progress. Thereby, it is possible to prompt the worker to perform maintenance work such as heater replacement work.

(D) According to the present embodiment, the display control unit 16 and the sub display control unit 17 can display the display of the error release button on the operation screen, and the error processing unit 4 issues an error processing execution instruction from the main controller 14. When received, the display control unit 16 and the sub display control unit 17 are instructed to display the error release button, and the transition instruction unit 2 receives the operation signal of the error release button from the display control unit 16 and the sub display control unit 17, The error processing unit 4 is instructed to cancel the error, and the error processing is terminated. Thereby, maintenance work, such as a heater exchange work, can be completed, while an operator confirms.

(E) According to the present embodiment, the power supply unit 22 that supplies power to each heater wire 206a of the heater 206 that is divided into a plurality of regions, and the power supply unit 22 that is connected to the heater wire 206a. A disconnection detection unit 10 that detects disconnection / non-disconnection, and the process system controller 12 controls the disconnection detection unit 10 to perform detection processing, and disconnects based on the detection result detected by the disconnection detection unit 10. The region of the heater wire 206a is specified. Thereby, since the area | region of the disconnected heater strand 206a is known, the efficiency of maintenance work can be achieved.

  Conventionally, temperature control in the processing chamber 201 is based on temperature information measured by a temperature sensor 263 or the like provided in the processing chamber 201, and PID (P: proportional control, I: integral control, D: differential control) control. Was. Then, it has been estimated that the heater 206 is disconnected due to the occurrence of overshoot or overhunting as compared with the normal state. Then, the disconnection / non-disconnection of the heater 206 was actually confirmed by maintenance work or the like. That is, conventionally, the heater disconnection can be detected only indirectly based on the temperature information measured by the temperature sensor 263 or the like.

  In the present embodiment, power is supplied to each heater wire 206a to measure the voltage and current, and therefore it is possible to directly detect disconnection / non-breakage of the heater wire 206a.

(F) According to the present embodiment, detection processing parameters (whether detection processing is performed, output power, disconnection check time, heater area number, etc.) and error processing parameters (error) are stored in the shared memory 5 provided in the memory 1b. The processing execution / non-execution, buzzer notification / error holding, and error holding) are written in a readable manner. As a result, the detection processing parameter and the error processing parameter can be configured as function parameters, and the changed detection processing and error processing parameter values can be reflected in real time without turning on and off the main controller 14B. .

(G) According to this embodiment, the detection processing parameter and the error processing parameter are stored as function parameters in a readable manner in the shared memory 5a provided in the hard disk 1c. As a result, even after the main controller 14 is turned off, the changed detection processing and error processing parameter values can be stored and held as function parameters. Processing can be performed.

(H) According to the present embodiment, it is possible to individually set whether or not to perform detection processing and error processing. That is, when the detection process and the error process transition from the standby state (IDLE mode) to the executable state (STANDBY mode), and when the transition from the running state (RUN mode) to the end state (END mode) It is also possible to carry out both of them, or just one of them. Needless to say, if a heater disconnection error is detected as a result of the detection process, the error process is performed following the detection process. In this case, it is possible to further select execution of detection processing and error processing. Therefore, the detection process and the error process can be performed only once, for example, to execute the substrate processing recipe, and the operability (ease of use) of the substrate processing apparatus 100 is improved by omitting unnecessary processes. Thus, productivity and safety can be improved.

(I) According to the present embodiment, it is possible to individually set error processing requirement parameters (whether or not buzzer is notified and error holding). That is, in error processing, for example, when a transition from the running state (RUN mode) to the end state (END mode) is made, a heater disconnection error occurs when only buzzer notification is set (no error held). In addition, the buzzer 6 can be sounded to notify the operator of the occurrence of the heater / heater disconnection error, and there is no need to wait for error processing to recover the wafer 200. Thereby, the processed wafer 200 can be quickly recovered.

(J) According to the present embodiment, the requirement parameters (output power, disconnection check time, heater region number, etc.) of the detection process can be individually set. That is, in the detection process, for example, by selecting only the heater wire 206a in a desired region from among a plurality of divided regions (for example, five) of the heater 206 and setting the output power, for example, the heater in the region just replaced The strand 206a can be removed from the detection process. Thereby, since the requirement parameters (output power, disconnection check time, heater area number, etc.) of the detection process can be individually set, a desired detection process can be performed.

<Other Embodiments of the Present Invention>
In this embodiment, the substrate processing apparatus is configured to perform a film forming process. However, the film forming process includes, for example, a process for forming a CVD, PVD, oxide film, and nitride film, and a film containing a metal. It may be a process to do. Further, the specific content of the substrate processing is not questioned, and it may be processing such as annealing processing, oxidation processing, nitriding processing, and diffusion processing as well as film forming processing. The present invention can also be applied to other substrate processing apparatuses such as an exposure apparatus, a lithography apparatus, a coating apparatus, and a CVD apparatus using plasma. Further, although a semiconductor manufacturing apparatus is shown as an example of a substrate processing apparatus, the apparatus is not limited to a semiconductor manufacturing apparatus, and may be an apparatus that processes a glass substrate such as an LCD device.

  As mentioned above, although embodiment of this invention was described concretely, this invention is not limited to the above-mentioned embodiment, It can change variously in the range which does not deviate from the summary.

<Preferred embodiment of the present invention>
Hereinafter, preferred embodiments of the present invention will be additionally described.

The first aspect of the present invention is:
A substrate processing apparatus for performing predetermined processing on the substrate by executing a recipe in which processing conditions and processing procedures are defined while heating the substrate with a heater,
A transport control unit that controls the transport operation of each unit of the substrate processing apparatus;
A process control unit for controlling the processing operation of each unit of the substrate processing apparatus;
A main control unit that controls the transport control unit and the processing control unit,
The main control unit includes an error processing unit that performs predetermined error processing,
The processing control unit
When receiving an instruction for transition from the standby state to a state in which the recipe can be executed from the transfer control unit, a disconnection detection process is performed, and as a result of the disconnection detection process,
If a disconnection error is not received, the recipe is transferred to an executable state, and the recipe execution instruction is waited for.
When the disconnection error is received, the substrate processing apparatus notifies the main control unit of the disconnection error and performs the predetermined error processing without shifting to a state where the recipe can be executed.

The second aspect of the present invention is:
When the state of the substrate processing apparatus receives a request for transition from the standby state to the executable state, the main control unit causes the disconnection detection unit to perform the detection process,
If the disconnection error is not received, the state of the substrate processing apparatus is transitioned to the executable state,
The substrate processing apparatus according to the first aspect, wherein when the disconnection error is received, the error processing unit performs the error processing without changing the state of the substrate processing apparatus to the executable state.

The third aspect of the present invention is:
A memory for readable reading to a file that the disconnection error notified from the disconnection detection unit has occurred,
When the error processing unit receives the fact that the disconnection error has occurred, the error processing unit writes the fact that the disconnection error has occurred in the file in the memory, holds the fact that the disconnection error has occurred, and cancels the error processing. When the error cancel instruction is received, the substrate processing apparatus according to the second aspect, wherein the fact that the disconnection error written in the file has occurred is deleted.

The fourth aspect of the present invention is:
A buzzer capable of reporting the disconnection error,
The said error processing part is a substrate processing apparatus as described in the 1st thru | or 3rd aspect which rings the said buzzer and alert | reports the disconnection of the said heater.

According to a fifth aspect of the present invention,
An operation unit having an operation screen (display unit) for receiving a predetermined operation (input, setting, editing...)
The operation unit can display on the operation screen that maintenance work is in progress,
The substrate processing apparatus according to any one of the first to fourth aspects, wherein a display indicating that the maintenance work is being performed is displayed in accordance with an instruction from the error processing unit that has received the error processing execution instruction.

The sixth aspect of the present invention is:
The operation unit can display an error release button display for canceling the error processing on the operation screen,
The substrate processing apparatus according to the fifth aspect, wherein the error cancel button is displayed in accordance with an instruction from the error processing unit that has received the error processing execution instruction.

The seventh aspect of the present invention is
The heater is divided into a plurality of regions each including a heater wire,
A power supply unit for supplying power to each of the heater wires;
A disconnection detecting unit connected to the power supply unit and detecting disconnection / non-disconnection of the heater element wire,
The disconnection detection unit, upon receiving the execution instruction of the detection process, causes at least one of the heater strands to supply power from the power supply unit, and causes the disconnection detection unit to perform the detection process, The substrate processing apparatus according to the second aspect, wherein a region of the disconnected heater element wire is specified based on a detection result detected by the disconnection detection unit.

The eighth aspect of the present invention is
The memory is readable and writable to write data indicating whether or not the detection process is performed and whether or not the error process is performed.
The main control unit determines whether or not to execute the detection process and whether or not to execute the error process based on data indicating whether or not the detection process is performed and whether or not the error process is performed, read from the memory. The substrate processing apparatus according to the third aspect.

The ninth aspect of the present invention provides
A heater divided into a plurality of regions;
A power supply for supplying predetermined power to the heater;
A temperature controller for controlling the power supply;
A current detector for detecting a current flowing through the heater;
Based on the voltage applied to the heater and the current detected by the current detector, a disconnection alarm device that supplies power to the heater to detect disconnection of the heater wire,
A sequencer that accepts an interlock signal that is output when the disconnection alarm detects disconnection of the heater wire; and
A controller for controlling the temperature controller and the sequencer;
Is a disconnection detection system.

The tenth aspect of the present invention provides
A substrate processing method of a substrate processing apparatus having a plurality of states (modes) including a running state for executing a substrate processing recipe to process a substrate,
A preparation step for preparing for executing the substrate processing recipe;
A boat loading step in which the substrate is held by a substrate holder and the substrate holder is put into a processing furnace, and a temperature in the processing furnace is raised from a standby temperature to a processing temperature by a heater, and the processing furnace enters the processing furnace. A preparatory step of stabilizing the gas supply at a predetermined gas flow rate and making the pressure in the processing furnace constant at a predetermined processing pressure, and a processing step for performing a predetermined processing on the substrate in the processing furnace; A substrate processing step comprised of a temperature lowering step for lowering the temperature in the processing furnace from the processing temperature to the standby temperature, and a boat unloading step for taking out the substrate holder from the processing furnace;
A heater disconnection detection step of detecting a disconnection of the heater before the start of the substrate processing recipe, and generating a heater disconnection detection error if the heater is disconnected,
Have
In the heater disconnection detection step, when a heater disconnection detection error occurs, the substrate processing method performs predetermined error processing set in advance without transitioning the state (mode) to an executable state.

4 Error processing section 11 Transport system controller (transport control section)
12 Process controller (Processing control unit)
14 Main controller (main control unit)
100 substrate processing apparatus 200 wafer (substrate)
206 Heater

Claims (1)

A substrate processing apparatus for performing predetermined processing on the substrate by executing a recipe in which processing conditions and processing procedures are defined while heating the substrate with a heater,
A transport control unit that controls the transport operation of each unit of the substrate processing apparatus;
A process control unit for controlling the processing operation of each unit of the substrate processing apparatus;
A main control unit that controls the transport control unit and the processing control unit,
The main control unit includes an error processing unit that performs predetermined error processing,
The processing control unit
When receiving an instruction for transition from the standby state to a state in which the recipe can be executed from the transfer control unit, a disconnection detection process is performed, and as a result of the disconnection detection process,
If a disconnection error is not received, the recipe is transferred to an executable state, and the recipe execution instruction is waited for.
When a disconnection error is received, the substrate processing apparatus is configured to notify the main control unit of a disconnection error and perform the predetermined error processing without shifting to a state where the recipe can be executed.

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