JP2011069615A - Probe card and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe card which enables to use probe pins in the shape of a horizontal type cantilever on the occasion of performing continuity inspection of an integrated circuit having a plurality of electrodes arranged in grid disposition, and a method for manufacturing the same. <P>SOLUTION: In this probe card 1, a plurality of probe pins 3 contacting respectively with the electrodes 11 arranged in the grid disposition on the integrated circuit 10 are provided on a wiring board 2. The probe pins 3 in a plurality are formed respectively in the shape of the horizontal type cantilever and disposed aslant to both of two-dimensional directions (direction X and direction Y) in the grid disposition of the electrodes 11. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a probe card and a method for manufacturing the same, and more particularly to a ball-type electrode of a BGA (ball grid array) type IC (integrated circuit) or a land-type electrode of an LGA (land grid array) type IC. The present invention relates to a probe card that can be suitably used when a plurality of probe pins are brought into contact with a plurality of electrodes arranged in a grid on an integrated circuit to conduct a continuity test, and a method of manufacturing the same.

  In the conventional probe card 101, as an example, a horizontal cantilever-shaped probe pin 103 is arranged on a wiring board 102 as shown in FIGS. Since the horizontal cantilever-shaped probe pin 103 can be set to have a large displacement and elastic stress by increasing its length in the extending direction 103LD, an integrated circuit in which a plurality of electrodes 111 are arranged in a peripheral manner. It was suitable for 110 continuity tests.

JP 2000-512437 A

  However, as shown in FIGS. 18 and 19, when a plurality of electrodes 111 are arranged in a grid, the pitch distance between the electrodes 111 is set to an extremely small value of 50 μm to 150 μm. Therefore, even if the probe pins 103 are to be brought into contact with the grid-arranged electrodes 111, the length of the probe pins 103 in the extending direction 103LD cannot be set longer than the distance between the pitches of the electrodes 111. The amount of displacement and the elastic stress could not be freely set to desired values. For this reason, there is a problem in that the horizontal cantilever-shaped probe pin 103 cannot be used for the probe card 101 when conducting the continuity test on the integrated circuit 110 in which the plurality of electrodes 111 are arranged in a grid.

  Accordingly, the present invention has been made in view of these points, and a probe card capable of using a horizontal cantilever-shaped probe pin when conducting an continuity test on an integrated circuit in which a plurality of electrodes are arranged in a grid, and a probe card thereof It is an object of the present invention to provide a manufacturing method.

  In order to achieve the above-described object, a probe card according to the present invention has, as a first aspect thereof, a plurality of probe pins that respectively contact a plurality of electrodes arranged in a grid on an integrated circuit, and a wiring board on which the plurality of probe pins are arranged. The plurality of probe pins are each formed in a horizontal cantilever shape in which one end is a free end that is a contact end with the electrode and the other end is a fixed end that is fixed to the wiring board. In addition, the probe pins are arranged to be inclined with respect to both directions in the two-dimensional direction in the grid arrangement of the plurality of electrodes.

  According to the probe card of the first aspect of the present invention, the length of the probe pin in the extending direction can be set longer than the case where the probe pin is arranged without being inclined. The amount of displacement and the elastic stress can be freely set to desired values.

  The probe card according to the second aspect of the present invention is the probe card according to the first aspect, wherein the plurality of probe pins are arranged in parallel in the two-dimensional direction in the grid arrangement of the plurality of electrodes. The first arrangement pattern is arranged on the wiring board.

  According to the probe card of the second aspect of the present invention, the probe pins can be arranged while being inclined while keeping the arrangement interval between the probe pins constant, so that the probe pins can be kept from contacting each other while being kept in contact with each other. The length in the extending direction can be set longer.

  A probe card according to a third aspect of the present invention is the probe card according to the first aspect, wherein the plurality of probe pins are mirror surfaces in any one of the two-dimensional directions in the grid arrangement of the plurality of electrodes. It is characterized in that it is arranged on the wiring board with a second arrangement pattern in which a plurality of probe pins are arranged in parallel in the other direction while being symmetrically arranged alternately.

  According to the probe card of the third aspect of the present invention, the probe pins can be arranged while being inclined while keeping the arrangement interval of each probe pin constant, so that the probe pins can be kept from contacting each other while being kept in contact with each other. The length in the extending direction can be set longer.

  The probe card according to a fourth aspect of the present invention is the probe card according to the first aspect, wherein the plurality of probe pins are extended in any one of the two-dimensional directions in the grid arrangement of the plurality of electrodes. It is characterized in that it is arranged on the wiring board with a third arrangement pattern in which a plurality of probe pins are arranged in mirror symmetry or in parallel in the other directions while being arranged in parallel with the existing directions facing each other.

  According to the probe card of the fourth aspect of the present invention, the probe pins can be arranged while being inclined while keeping the arrangement interval of the probe pins constant, so that the probe pins can be kept from contacting each other while being kept in contact with each other. The length in the extending direction can be set longer.

  In order to achieve the above-described object, the probe card manufacturing method according to the present invention includes, as a first aspect thereof, a plurality of probe pins that respectively contact a plurality of electrodes arranged in a grid on an integrated circuit. In addition, the plurality of probe pins is a method of manufacturing a probe card that is a horizontal cantilever whose one end is a free end that is a contact end with an electrode and the other end is a fixed end that is fixed to a wiring board. The plurality of probe pins include a step A of forming a columnar resist mold that lies parallel to one direction in a two-dimensional direction in a grid arrangement of a plurality of electrodes on the wiring board in accordance with the arrangement in one direction; Step B in which a probe pin extending in a direction inclined with respect to the extending direction is formed into a thin film on the surface of the columnar resist mold, and the columnar resist mold is removed after Step B is completed. It is characterized in that it is formed through a step C of. Here, thin film formation refers to formation using plating, sputtering, or other thin film technology.

  According to the probe card manufacturing method of the first aspect of the present invention, the probe pin of the present invention is formed using the conventional thin film generation technique by laying the columnar resist mold in a predetermined position and direction. can do. Moreover, if the probe pins are formed by sputtering, it contributes to miniaturization of the probe pins and the probe card.

  The probe card manufacturing method of the second aspect of the present invention is the probe card manufacturing method of the first aspect, wherein the plurality of probe pins are a plurality of probe pins in both two-dimensional directions in a grid arrangement of a plurality of electrodes. Are arranged on the wiring board with a second arrangement pattern arranged in parallel with each other.

  According to the probe card manufacturing method of the second aspect of the present invention, the probe pins can be arranged while being inclined while keeping the arrangement interval of each probe pin constant, so that contact between the probe pins is avoided. The length in the extending direction can be set long.

  The probe card manufacturing method according to the third aspect of the present invention is the probe card manufacturing method according to the first aspect, wherein the plurality of probe pins are in any one of the two-dimensional directions in the grid arrangement of the plurality of electrodes. A plurality of probe pins are arranged alternately with mirror symmetry, and are arranged on the wiring board with a first arrangement pattern in which a plurality of probe pins are arranged in parallel in the other direction.

  According to the probe card manufacturing method of the third aspect of the present invention, the probe pins can be arranged while being inclined while keeping the arrangement intervals of the probe pins constant, so that contact between the probe pins is avoided. The length in the extending direction can be set long.

  A probe card manufacturing method according to a fourth aspect of the present invention is the probe card manufacturing method according to the first aspect, wherein the plurality of probe pins are in any one of the two-dimensional directions in the grid arrangement of the plurality of electrodes. It is arranged on the wiring board with a third arrangement pattern in which the plurality of probe pins are arranged in parallel with the extending directions facing each other, and in the other directions, the plurality of probe pins are arranged in mirror symmetry or in parallel. It is a feature.

  According to the probe card manufacturing method of the fourth aspect of the present invention, the probe pins can be arranged while being inclined while keeping the arrangement interval of each probe pin constant, so that contact between the probe pins is avoided. The length in the extending direction can be set long.

  The probe card manufacturing method according to the fifth aspect of the present invention is the probe card manufacturing method according to any one of the first to fourth aspects, wherein the longitudinal section perpendicular to the extending direction of the columnar resist mold has a kamaboko shape. It is characterized by being. Here, the kamaboko shape means a semicircular shape, a semi-elliptical shape, or a shape obtained by cutting other closed curves in half.

  According to the probe card manufacturing method of the fifth aspect of the present invention, the columnar resist mold can be formed more easily than making the longitudinal section rectangular. In addition, since the shape of the probe pin is a horizontal L shape in which the orthogonal portion is curved, it is possible to suppress the probe pin from being broken due to stress concentration.

  According to the probe card and the manufacturing method thereof of the present invention, the displacement amount and elastic stress of the probe pin can be set large, so that a horizontal cantilever-shaped probe is used for continuity inspection of an integrated circuit in which a plurality of electrodes are arranged in a grid. There is an effect that a pin can be used.

  Hereinafter, the probe card of the present invention will be described with reference to its three embodiments.

  First, the probe card 1A of the first embodiment will be described.

  1 to 3 show a probe card 1A of the first embodiment. A probe card 1A according to the first embodiment includes a wiring board 2 and a plurality of probe pins 3 as shown in FIG. The wiring board 2 is a general one used for the probe card 1A, and a wiring 2b such as a via and a connection electrode that is electrically connected to the probe pin 3 is provided for each probe pin 3 on the surface 2a.

  The plurality of probe pins 3 are respectively in contact with a plurality of electrodes 11 arranged in a grid on the integrated circuit 10 such as a ball type electrode of a BGA type IC or a land type electrode of an LGA type IC. Specifically, as shown in FIG. 2, the plurality of probe pins 3 is a free end 3 f whose one end is a contact end with the electrode 11 and the other end is a fixed end 3 r fixed to the wiring board 2. Each is formed in a certain horizontal cantilever shape.

  The probe pin 3 has a width and thickness of 30 μm, and its extending direction 3LD has a length of about 700 μm. In the first embodiment, since the distance between the pitches of the electrodes 11 is set to about 150 μm, the distance between the pitches of these probe pins 3 is also set to about 150 μm. The probe pin 3 is preferably made of a metal material having excellent elasticity and conductivity, such as a Ni-P alloy, a Cu alloy, and a W (tungsten) alloy.

  The details of the probe pin 3 shown in FIG. 1 will be described in detail. As shown in FIGS. 2 and 3, the transverse L-shaped orthogonal portion of the probe pin 3 is formed by a curved surface 3p. The curved surface 3p is formed to be inclined in the Y direction without being orthogonal to the extending direction 3LD of the probe pin 3.

  In general, the curved surface 3p is orthogonal to the extending direction 3LD of the probe pin 3, so that when the general probe pin 3 is pressed by the electrode 11 of the integrated circuit 10, the probe pin 3 does not twist. Curved downward as it is. However, since the probe pin 3 of the first embodiment is characterized by its manufacturing method to be described later, the curved surface 3p is inclined. Therefore, when the probe pin 3 of the first embodiment is pushed down by the electrode 11 of the integrated circuit 10, the probe pin 3 is bent downward while slightly twisting with the extending direction 3LD as the rotation axis. However, since this twist is slight, the probe pin 3 does not reach the electrode 11 so that no particular inconvenience occurs.

  Further, as shown in FIG. 1, the plurality of probe pins 3 are arranged such that the probe pins 3 are inclined with respect to both two-dimensional directions (X direction and Y direction) in the grid arrangement of the plurality of electrodes 11. . The inclination angle of the probe pin 3 may or may not be aligned as shown in FIG. If the tilt angles of the probe pins 3 are aligned with a certain pattern, the alignment of the aligned probe pins 3 can be a feature.

  As a feature of the first embodiment, a plurality of probe pins 3 are arranged on the wiring board 2 in parallel with each other in both two-dimensional directions (X direction and Y direction) in the grid arrangement of the plurality of electrodes 11. . For convenience of explanation, such an arrangement is referred to as a first arrangement pattern. In the first arrangement pattern shown in FIG. 1, the plurality of probe pins 3 are inclined about 60 degrees clockwise from the X direction. Are arranged parallel to each other.

  Next, a method for manufacturing the probe card 1A of the first embodiment will be described. The probe pins 3 arranged on the wiring board 2 of the probe card 1A of the first embodiment are mainly composed of three processes A (columnar resist mold forming process), process B (probe pin forming process) and process C (columnar resist). It is manufactured through a mold removal step.

  In step A, as shown in FIG. 4, a highly viscous but fluid resist solution is applied in one direction (Y direction) in the two-dimensional direction (X direction and Y direction) in the grid arrangement of the plurality of electrodes 11. Apply and cure continuously. Thereby, the columnar resist molds 20 that lie parallel to the one direction (Y direction) on the surface 2a of the wiring board 2 are formed in the same manner as the arrangement of the electrodes 11 in one direction (array in the Y direction). The shape of the longitudinal section perpendicular to the extending direction 20LD in the columnar resist mold 20 is a kamaboko shape (a kamaboko shape is a semicircular shape, a semielliptical shape, or a shape obtained by cutting other closed curves in half). A triangle, a rectangle, etc. can be selected. The vertical cross section of the columnar resist mold 20 of the first embodiment adopts a kamaboko shape as shown in FIG. Since the probe pin 3 is connected to the wiring 2b of the wiring board 2, at the time of forming the columnar resist mold 20, at least a part of the wiring 2b of the wiring board 2 is exposed.

  In step B, as shown in FIG. 6, the probe pin 3 inclined with respect to the extending direction (Y direction) 20 LD of the columnar resist mold 20 is formed as a thin film on the surface 20 a of the columnar resist mold 20. As described above, the probe pin 3 is preferably made of a metal material having excellent elasticity and conductivity, such as a Ni-P alloy, a Cu alloy, and a W (tungsten) alloy. Various methods such as sputtering and plating can be selected as a method for forming the thin film of the probe pin 3.

  For example, when the sputtering method is selected, as shown in FIG. 6, patterning of the shape of the probe pin 3 that is inclined starting from the wiring 2 b of the wiring board 2 is performed on the surface 20 a of the columnar resist mold 20. When the plating method is selected, as shown in FIGS. 7 and 8, a Cu-based alloy seed film 23 is formed on the surface 2a of the wiring board 2 and the surface 20a of the columnar resist mold 20 by sputtering. After the resist film 21 is formed on the surface, a resist pattern 22 corresponding to the shape of the probe pin 3 inclined with the wiring 2b of the wiring board 2 as a starting point is patterned on the resist film 21. Then, as shown in FIG. 9, the probe pin 3 is formed into a thin film by plating the surface of the seed film 23 exposed from the resist pattern 22 with a Ni—P alloy or a Cu alloy. When the probe pin 3 is formed by plating, the resist film 21 is chemically removed and the seed film 23 is physically removed by ion milling before the process C is started.

  In step C, the columnar resist mold 20 is chemically removed using a resist remover after completion of step B (probe pin forming step). As shown in FIGS. 3 and 6, the probe pin 3 is inclined with respect to the removed columnar resist mold 20. Therefore, the probe pin 3 has a shape formed by bending an orthogonal portion of the horizontal L shape, and the curved surface 3p is formed to be inclined in the Y direction without being orthogonal to the extending direction 3LD of the probe pin 3. The The probe pin 3 of the probe card 1A is formed through the above three steps.

  Next, the operation of the probe card 1A of the first embodiment will be described.

  In the probe card 1A of the first embodiment, as shown in FIGS. 1 to 3, the probe pin 3 is formed in a horizontal cantilever shape, and is inclined with respect to both the X direction and the Y direction. Has been. Therefore, the length of the probe pin 3 in the extending direction 3LD can be set longer than in the case where the probe pin 103 as shown in FIGS. It is easy to freely set the amount of displacement and the elastic stress to desired values.

  As a specific example, the length of the extending direction 3LD of the probe pin 3 of the first embodiment is about 700 μm, and the distance between the pitches is set to about 150 μm. Therefore, the probe of the first embodiment When a load of about 0.05 N (about 5 gf) is applied to the free end 3 f of the pin 3, the amount of displacement becomes about 380 μm, and a stress of 7.5 GPa is generated. In the conventional example, the maximum displacement of the probe pin 103 having a length of 150 μm or less, which is the maximum setting value, under the same load is about 5 μm, and the generated stress is 1.75 GPa. From this specific example, it can be seen that the displacement amount and elastic stress of the probe pin 3 of the first embodiment can be easily set.

  Moreover, the probe pin 3 of 1st Embodiment is arrange | positioned at the wiring board 2 with a 1st arrangement pattern, as shown in FIG. The first arrangement pattern is a pattern in which a plurality of probe pins 3 are arranged in parallel with each other in both two-dimensional directions in the grid arrangement of the electrodes 11, that is, in the X direction and the Y direction. By adopting this first arrangement pattern, the probe pins 3 can be arranged while being inclined while keeping the arrangement intervals of the probe pins 3 constant, so that the probe pins 3 can be avoided from contacting each other. The length in the extending direction 3LD can be set long.

  Next, the operation of the method for manufacturing the probe card 1A of the first embodiment will be described.

  In the method of manufacturing the probe card 1A of the first embodiment, the columnar resist mold 20 in which the probe pins 3 are laid in accordance with the arrangement of the electrodes 11 in the Y direction (that is, in a predetermined position and direction) is formed on the wiring board 2. The probe pin 3 is formed as a thin film on the surface 20 a of the columnar resist mold 20 while being inclined with respect to the extending direction 20 LD of the columnar resist mold 20. Thereby, the probe pin 3 of 1st Embodiment can be formed using the conventional thin film production | generation technique. Further, if the probe pins 3 are formed by sputtering, the probe pins 3 and the probe card 1 can be reduced in size.

  Further, the shape of the longitudinal section of the columnar resist mold 20 is formed in a kamaboko shape. If the viscosity of the resist solution is used, it is easier to make a kamaboko shape than a rectangular cross section. That is, the formability of the columnar resist mold 20 can be improved by making the shape of the vertical cross section of the columnar resist mold 20 a kamaboko shape. Further, since the orthogonal L portion of the horizontal L-shaped probe pin 3 can be formed by the curved curved surface 3p without forming the orthogonal portion by the orthogonal surface, the probe pin 3 is prevented from being broken due to stress concentration. Can do.

  Next, a probe card 1B of the second embodiment will be described.

  The probe card 1B of the second embodiment includes the probe pins 3 and the wiring board 2 similar to those of the first embodiment, and as shown in FIG. 10, the two-dimensional direction in the grid arrangement of the plurality of electrodes 11 is provided. A plurality of probe pins 3 are arranged to be inclined with respect to both directions (X direction and Y direction). The difference from the first embodiment is that the arrangement pattern of the probe pins 3 is not the first arrangement pattern but the second arrangement pattern.

  As shown in FIG. 10, in the second arrangement pattern, the plurality of probe pins 3 are mirror-finished in any one direction (Y direction) of the two-dimensional direction (X direction and Y direction) in the grid arrangement of the plurality of electrodes 11. This is a pattern in which they are arranged alternately with respect to the electrodes 11 in one direction (Y direction) after being symmetric. The second arrangement pattern is a pattern in which a plurality of probe pins 3 are arranged in parallel to each other in the other direction (X direction) of the two-dimensional direction (X direction and Y direction).

  The manufacturing method of the probe card 1B of the second embodiment is as follows. Similar to the first embodiment, the probe card 1B according to the second embodiment mainly includes three processes A (columnar resist mold forming process), process B (probe pin forming process), and process C (columnar resist mold removing process). ) Is manufactured through. The difference from the first embodiment is that in step B, the patterning for forming a thin film applied to the surface 20a of the columnar resist mold 20 is different.

  That is, as shown in FIG. 11, in step A, the columnar resist mold 20 is formed to extend in the Y direction. In the process B, patterning for forming a thin film is performed on the same surface 20a of the columnar resist mold 20 extending in the Y direction so that a plurality of probe pins 3 are arranged mirror-symmetrically and alternately. Further, in the plurality of columnar resist dies 20 arranged in parallel, patterning for forming a thin film is performed in which a plurality of probe pins 3 are arranged in parallel with each other in the X direction. Thereafter, in step C, the columnar resist mold 20 is chemically removed to form the probe pins 3 of the probe card 1B.

  In step A, it is preferable that the vertical cross section of the columnar resist mold 20 is formed in a kamaboko shape as in the first embodiment (see FIG. 5).

  Next, the operation of the probe card 1B of the second embodiment will be described.

  In the probe card 1B of the second embodiment, as in the first embodiment, as shown in FIG. 10, the probe pin 3 is formed in a horizontal cantilever shape, and in both the X direction and the Y direction. It is inclined and arranged. Therefore, since the length of the probe pin 3 in the extending direction 3LD can be set long, it is easy to freely set the displacement amount and the elastic stress of the probe pin 3 to desired values.

  Also, in the probe card 1B of the second embodiment, unlike the first embodiment, as shown in FIG. 10, a plurality of probe pins 3 are arranged on the wiring board 2 with a second arrangement pattern. . For this reason, the probe pins 3 can be arranged while being inclined while keeping the arrangement interval between the probe pins 3 constant, so that the length of the probe pins 3 in the extending direction 3LD is increased while avoiding mutual contact of the probe pins 3. Can be set.

  Referring only to FIG. 10, it can be seen that the free end 3 f that is the tip of one probe pin 3 is close to the fixed end 3 r that is the root of the adjacent probe pin 3. Since they are different from each other, they are separated in the Z direction, which is the orthogonal direction of the two-dimensional direction (X direction and Y direction), and there is no possibility of contact.

  About the effect | action of the manufacturing method of the probe card 1B of 2nd Embodiment, it is the same as that of the manufacturing method in 1st Embodiment mentioned above. The same effect is obtained by making the shape of the vertical cross section of the columnar resist mold 20 a kamaboko shape.

  Next, a probe card 1C according to the third embodiment will be described.

  The probe card 1C of the third embodiment includes probe pins 3 and a wiring board 2 similar to those of the first or second embodiment. As shown in FIG. 12 or FIG. 13, a grid of a plurality of electrodes 11 is provided. A plurality of probe pins 3 are arranged so as to be inclined with respect to both two-dimensional directions (X direction and Y direction) in the arrangement. The difference from the first or second embodiment is that the arrangement pattern of the probe pins 3 is not the first or second arrangement pattern but the third arrangement pattern.

  As shown in FIG. 12 or FIG. 13, the third arrangement pattern includes a plurality of probe pins in one direction (Y direction) of the two-dimensional direction (X direction and Y direction) in the grid arrangement of the plurality of electrodes 11. 3 extending directions 3LD are opposed (that is, the direction from the fixed end 3r of the probe pin 3 toward the free end 3f is opposed) and arranged in parallel. In other words, a plurality of probe pins 3 are all inclined at the same inclination angle, and a part (about half) of the probe pins 3 are made to face each other probe pin 3 and then the probe pins 3 made to face each other are arranged. It is an arrangement pattern that is translated in the Y direction. The third arrangement pattern is such that the probe pins 3 are parallel (see FIG. 12) or mirror-symmetrical (see FIG. 13) in the other direction (X direction) in the two-dimensional direction (X direction and Y direction). This is a pattern to be arranged.

  The manufacturing method of the probe card 1C of the third embodiment is as follows. Similar to the first or second embodiment, the probe card 1C of the third embodiment mainly includes three processes A (columnar resist mold forming process), process B (probe pin forming process), and process C (columnar resist). It is manufactured through a mold removal step. The difference from the first or second embodiment is that in step B, the patterning in forming a thin film of the probe pin 3 applied to the surface 20a of the columnar resist mold 20 is different.

  That is, as shown in FIG. 14 or FIG. 15, in step A, the columnar resist mold 20 is formed to extend in the Y direction. In step B, the extending direction 3LD of the plurality of probe pins 3 is made to face each other on the same surface 20a of the columnar resist mold 20 extending in the Y direction (that is, from the fixed end 3r of the probe pin 3 to its free end 3f). The thin film formation patterning is performed in such a manner that the facing directions are opposed to each other and arranged in parallel. Further, in the plurality of columnar resist dies 20 arranged in parallel, patterning for forming a thin film in which the plurality of probe pins 3 are arranged in parallel (see FIG. 14) or mirror-symmetric (see FIG. 15) in the X direction. To do. Thereafter, in step C, the columnar resist mold 20 is chemically removed to form the probe pin 3 of the probe card 1C.

  In step A, it is preferable that the vertical cross section of the columnar resist mold 20 is formed in a semi-cylindrical shape as in the first or second embodiment (see FIG. 5).

  Next, the operation of the probe card 1C of the third embodiment will be described.

  In the probe card 1C of the third embodiment, as in the first or second embodiment, as shown in FIG. 12 or FIG. 13, the probe pin 3 is formed in a horizontal cantilever shape, It is arranged to be inclined with respect to both directions in the Y direction. Therefore, the length of the probe pin 3 in the extending direction 3LD can be set long, and the displacement amount and the elastic stress of the probe pin 3 can be easily set to desired values.

  Also, in the probe card 1C of the third embodiment, unlike the first or second embodiment, as shown in FIG. 12 or FIG. 13, a plurality of probe pins 3 have a third arrangement pattern and a wiring board. 2 is arranged. For this reason, the probe pins 3 can be arranged while being inclined while keeping the arrangement interval between the probe pins 3 constant, so that the length of the probe pins 3 in the extending direction 3LD is increased while avoiding mutual contact of the probe pins 3. Can be set.

  Similarly to the second embodiment, referring only to FIG. 12 or FIG. 13, the free end 3 f that is the tip of one probe pin 3 is close to the fixed end 3 r that is the root of the adjacent probe pin 3. However, since they are different in height, they are separated in the Z direction, which is the orthogonal direction of the two-dimensional direction (X direction and Y direction), and there is no possibility of contact.

  The operation of the method for manufacturing the probe card 1C of the third embodiment is the same as the operation of the manufacturing method in the first or second embodiment described above. The same effect is obtained by making the shape of the vertical cross section of the columnar resist mold 20 a kamaboko shape.

  That is, according to the probe cards 1A to 1C of the first to third embodiments and the manufacturing method thereof, the displacement amount and the elastic stress of the probe pin 3 can be freely set to desired values. The horizontal cantilever-shaped probe pin 3 can be used for the continuity test of the integrated circuit 10 in which 11 is arranged in a grid.

  In addition, this invention is not limited to embodiment mentioned above etc., A various change is possible as needed.

The top view which looked at the probe card of a 1st embodiment from the integrated circuit side 2-2 sectional view of FIG. 3-3 arrow sectional view of FIG. The top view which shows the state which formed the columnar resist type | mold on the wiring board of 1st Embodiment seeing from the integrated circuit side 4-5 arrow sectional view The top view which shows the state which formed the thin film of the probe pin in the wiring board of FIG. 4 seeing from the integrated circuit side A plan view showing the formation state of the resist film and the resist pattern when the probe pin is formed by plating, as viewed from the integrated circuit side 8-8 cross-sectional view of FIG. FIG. 8 is a longitudinal sectional view showing a state in which probe pins are formed by plating inside the resist pattern shown in FIG. The top view which shows the probe card of 2nd Embodiment seeing from the integrated circuit side The top view which shows the state which formed the column-shaped resist type | mold on the wiring board of 2nd Embodiment, and formed the thin film of the probe pin from the integrated circuit side The top view which shows the pattern which is the probe card of 3rd Embodiment and which has arrange | positioned the probe pin of X direction in parallel seeing from the integrated circuit side The top view which shows the pattern which is the probe card of 3rd Embodiment, and was arrange | positioned after making the probe pin of X direction mirror-symmetrical from the integrated circuit side The top view which shows the state which formed the column-shaped resist type | mold on the wiring board of 2nd Embodiment shown in FIG. 12, and formed the thin film of the probe pin from the integrated circuit side The top view which shows the state which formed the pillar-shaped resist type | mold on the wiring board of 2nd Embodiment shown in FIG. 13, and formed the thin film of the probe pin from the integrated circuit side The top view which shows the state which contacted the several electrode of the integrated circuit arranged peripherally with the probe pin of the conventional probe card seeing from the integrated circuit side 17-17 sectional view of FIG. The top view which shows the state which contacted the several electrode of the integrated circuit grid-arranged to the probe pin of the conventional probe card seeing from the integrated circuit side 19-19 cross-sectional view of FIG.

Explanation of symbols

1A, 1B, 1C Probe card 2 Wiring board 3 Probe pin 3LD (Probe pin) extending direction 20 Columnar resist type 20LD (Columnar resist type) extending direction

Claims (9)

A plurality of probe pins that respectively contact a plurality of electrodes arranged in a grid on the integrated circuit;
A wiring board on which the plurality of probe pins are arranged;
The plurality of probe pins are each formed in a horizontal cantilever shape, one end of which is a free end that is a contact end with the electrode and the other end is a fixed end that is fixed to the wiring board. The probe pins are arranged so as to be inclined with respect to both two-dimensional directions in a grid arrangement of a plurality of electrodes.
A probe card characterized by that. The plurality of probe pins are arranged on the wiring board with a first arrangement pattern in which the plurality of probe pins are arranged in parallel in both two-dimensional directions in the grid arrangement of the plurality of electrodes. The probe card according to claim 1. The plurality of probe pins are alternately arranged with a plurality of probe pins in mirror symmetry in any one of the two-dimensional directions in the grid arrangement of the plurality of electrodes, and in parallel in the other directions. The probe card according to claim 1, wherein the probe card is arranged on the wiring board with a second arrangement pattern to be arranged. The plurality of probe pins are arranged in parallel while facing the extending direction of the plurality of probe pins in any one of the two-dimensional directions in the grid arrangement of the plurality of electrodes, and the plurality of probe pins in the other direction. 2. The probe card according to claim 1, wherein the probe card is arranged on the wiring board with a third arrangement pattern in which the two are arranged in mirror symmetry or in parallel. A plurality of probe pins that respectively contact a plurality of electrodes arranged in a grid on the integrated circuit are arranged on the wiring board, and
The plurality of probe pins is a method of manufacturing a probe card that is a horizontal cantilever whose one end is a free end that is a contact end with the electrode and the other end is a fixed end that is fixed to the wiring board,
The plurality of probe pins are:
Forming a columnar resist mold that lies parallel to one direction in a two-dimensional direction in the grid arrangement of the plurality of electrodes on the wiring board in accordance with the arrangement in the one direction;
Forming a thin film on the surface of the columnar resist mold, the probe pin extending in a direction inclined with respect to the extending direction of the columnar resist mold; and
A method of manufacturing a probe card, comprising: a step C after removing the columnar resist mold after the step B. The plurality of probe pins are arranged on the wiring board with a first arrangement pattern in which the plurality of probe pins are arranged in parallel in both two-dimensional directions in the grid arrangement of the plurality of electrodes. A method for manufacturing a probe card according to claim 5. The plurality of probe pins are alternately arranged with a plurality of probe pins in mirror symmetry in any one of the two-dimensional directions in the grid arrangement of the plurality of electrodes, and in parallel in the other directions. The probe card manufacturing method according to claim 5, wherein the probe card is arranged on the wiring board with a second arrangement pattern to be arranged. The plurality of probe pins are arranged in parallel while facing the extending direction of the plurality of probe pins in any one of the two-dimensional directions in the grid arrangement of the plurality of electrodes, and the plurality of probe pins in the other direction. The probe card manufacturing method according to claim 5, wherein the wiring board is arranged with a third arrangement pattern in which are arranged in mirror symmetry or parallel to each other. The method for manufacturing a probe card according to any one of claims 5 to 8, wherein a vertical cross section perpendicular to the extending direction in the columnar resist mold has a kamaboko shape.

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