JP2010222618A - Cu-Ni-Si-based copper alloy rolled plate and electrical parts using the same - Google Patents
Cu-Ni-Si-based copper alloy rolled plate and electrical parts using the same Download PDFInfo
- Publication number
- JP2010222618A JP2010222618A JP2009069536A JP2009069536A JP2010222618A JP 2010222618 A JP2010222618 A JP 2010222618A JP 2009069536 A JP2009069536 A JP 2009069536A JP 2009069536 A JP2009069536 A JP 2009069536A JP 2010222618 A JP2010222618 A JP 2010222618A
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- alloy rolled
- texture
- mass
- rolled sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 58
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 9
- 239000013078 crystal Substances 0.000 claims abstract description 9
- 238000002441 X-ray diffraction Methods 0.000 claims abstract description 4
- 239000012535 impurity Substances 0.000 claims abstract description 3
- 229910052718 tin Inorganic materials 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 229910052749 magnesium Inorganic materials 0.000 claims description 5
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 238000005452 bending Methods 0.000 abstract description 10
- 239000000463 material Substances 0.000 description 31
- 238000005096 rolling process Methods 0.000 description 17
- 238000005097 cold rolling Methods 0.000 description 15
- 230000000694 effects Effects 0.000 description 12
- 238000007665 sagging Methods 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 238000004080 punching Methods 0.000 description 9
- 230000035882 stress Effects 0.000 description 8
- 230000032683 aging Effects 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 239000010731 rolling oil Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000002344 surface layer Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000005266 casting Methods 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 239000003610 charcoal Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000005098 hot rolling Methods 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000001028 reflection method Methods 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Landscapes
- Conductive Materials (AREA)
Abstract
【課題】プレス加工性、曲げ加工性及び強度に優れたCu−Ni−Si系銅合金圧延板を提供する。
【解決手段】Niを1.0〜4.0質量%、Siを0.1〜0.8質量%含有し、残部がCu及び不可避的不純物からなる銅合金圧延板であって、X線回折法により板表面から5μmの深さまでの結晶方位を測定したとき、{111}正極点図上のα=0±10°(但し、α:シュルツ法に規定する回折用ゴニオメータの回転軸に垂直な軸)の領域に相当する、せん断集合組織の極密度が2以上8以下であるCu−Ni−Si系銅合金圧延板である。
【選択図】図1A Cu-Ni-Si-based copper alloy rolled sheet excellent in press workability, bending workability and strength is provided.
A copper alloy rolled sheet containing 1.0 to 4.0% by mass of Ni and 0.1 to 0.8% by mass of Si, the balance being Cu and unavoidable impurities, and X-ray diffraction When measuring the crystal orientation from the plate surface to a depth of 5 μm by the method, α = 0 ± 10 ° on the {111} positive pole figure (where α is perpendicular to the rotational axis of the diffraction goniometer specified in the Schulz method) This is a Cu—Ni—Si based copper alloy rolled sheet having a pole texture of a shear texture corresponding to a region of (axis) of 2 or more and 8 or less.
[Selection] Figure 1
Description
本発明は強度と導電性に優れ、例えば電子機器用のばね材に好適に適用できる銅合金に関する。 The present invention relates to a copper alloy that is excellent in strength and conductivity, and can be suitably applied to, for example, a spring material for electronic equipment.
端子、コネクタ、スイッチ,リレー等の電気・電子機器用のばね材(コネクタ用材)には優れたばね特性、曲げ加工性、導電性が要求され、従来からりん青銅等が用いられてきた。しかしながら、近年、電子部品の一層の小型化の要請から、従来のりん青銅や黄銅といった固溶強化型銅合金に替わり、コルソン合金、ベリリウム銅およびチタン銅といった析出強化型銅合金が開発されている。 Spring materials (connector materials) for electrical and electronic equipment such as terminals, connectors, switches, and relays are required to have excellent spring characteristics, bending workability, and conductivity, and phosphor bronze has been conventionally used. However, in recent years, precipitation-strengthening-type copper alloys such as Corson alloy, beryllium copper, and titanium copper have been developed in place of conventional solid solution-strengthening-type copper alloys such as phosphor bronze and brass because of the demand for further miniaturization of electronic components. .
このような端子やコネクタ等は、プレス加工により銅合金素材から所望の形状に成形されるが、電子部品の小型化に伴い、打抜き後の寸法精度が重要になっている。
上記した電子機器用銅合金のプレス加工性を改善する技術として、銅合金の表面にCu層を覆う技術が開示されている(特許文献1参照)。又、銅合金の集合組織の方位を規制することで、プレス加工性を改善する技術が提案されている(特許文献2〜4参照)。
特に、プレス加工で問題となるダレやバリの抑制は、従来から金型の調整で対応されてきたが、電子部品の寸法精度の向上が要求されるのに伴い、ダレが小さくバリが低い材料が求められている。
Such terminals, connectors, and the like are formed into a desired shape from a copper alloy material by pressing, but with the miniaturization of electronic components, dimensional accuracy after punching has become important.
As a technique for improving the press workability of the above-described copper alloy for electronic devices, a technique for covering a Cu layer on the surface of the copper alloy is disclosed (see Patent Document 1). Moreover, the technique which improves press workability by restrict | limiting the orientation of the texture of a copper alloy is proposed (refer patent documents 2-4).
In particular, the suppression of sagging and burrs, which is a problem in press processing, has been addressed by adjusting the mold, but as the dimensional accuracy of electronic parts is required to improve, the sagging is small and the burrs are low. Is required.
ところで、通常、冷間圧延において材料の塑性変形に伴い、結晶格子回転が進行し、集合組織が形成されるが、圧延時にロールと接する材料の表層領域では、材料中央部とは異なる集合組織が形成されることが知られている。これは、材料中央部では、板厚方向の圧縮応力と、圧延方向の引張応力とにより材料が変形され、いわゆる圧延集合組織が形成されるのに対し、材料表層部では、ロールとの摩擦力の影響で材料がせん断変形され、表面集合組織(せん断集合組織)が形成されるからである。
そして、本発明者らが検討した結果、銅合金圧延板において、板表面から5μmの深さまでのせん断集合組織の極密度を高めることにより、プレス加工性が大幅に向上することが判明した。
しかしながら、従来の銅合金圧延板の場合、せん断集合組織の極密度が高い部分は、板の極表面に限られ、プレス加工性が十分とはいえない。
図1に、本発明の銅合金圧延板と従来の銅合金圧延板のせん断集合組織の極密度を模式的に示す。従来の銅合金圧延においても、板の極表面のせん断集合組織の極密度は2以上となるが、内部になるにつれて極密度が急激に低下し、板表面から5μmの深さでは極密度が2未満になっている。
By the way, normally, in the cold rolling, crystal lattice rotation proceeds with the plastic deformation of the material, and a texture is formed. However, in the surface layer region of the material in contact with the roll at the time of rolling, a texture different from the material center is formed. It is known to form. This is because the material is deformed by the compressive stress in the plate thickness direction and the tensile stress in the rolling direction at the center of the material, and a so-called rolling texture is formed. This is because the material is subjected to shear deformation under the influence of the above, and a surface texture (shear texture) is formed.
As a result of studies by the present inventors, it has been found that, in a copper alloy rolled plate, press workability is greatly improved by increasing the extreme density of the shear texture from the plate surface to a depth of 5 μm.
However, in the case of a conventional rolled copper alloy sheet, the portion where the extreme density of the shear texture is high is limited to the extreme surface of the sheet, and the press workability is not sufficient.
FIG. 1 schematically shows the extreme density of the shear texture of the rolled copper alloy sheet of the present invention and the conventional rolled copper alloy sheet. Also in conventional copper alloy rolling, the pole density of the shear texture on the pole surface of the plate is 2 or more, but the pole density rapidly decreases as it goes inside, and the pole density is 2 at a depth of 5 μm from the plate surface. Has become less.
以上のように、本発明は上記の課題を解決するためになされたものであり、プレス加工性、曲げ加工性及び強度に優れたCu−Ni−Si系銅合金圧延板の提供を目的とする。 As described above, the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a Cu-Ni-Si-based copper alloy rolled plate excellent in press workability, bending workability and strength. .
本発明のCu−Ni−Si系銅合金圧延板は、Niを1.0〜4.0質量%、Siを0.1〜0.8質量%含有し、残部がCu及び不可避的不純物からなる銅合金圧延板であって、X線回折法により板表面から5μmの深さまでの結晶方位を測定したとき、{111}正極点図上のα=0±10°(但し、α:シュルツ法に規定する回折用ゴニオメータの回転軸に垂直な軸)の領域に相当する、せん断集合組織の極密度が2以上8以下である。 The rolled Cu-Ni-Si copper alloy sheet of the present invention contains 1.0 to 4.0% by mass of Ni and 0.1 to 0.8% by mass of Si, with the balance being Cu and inevitable impurities. It is a rolled copper alloy plate, and when the crystal orientation from the plate surface to a depth of 5 μm is measured by the X-ray diffraction method, α = 0 ± 10 ° on the {111} positive pole figure (where α is a Schulz method) The polar density of the shear texture corresponding to the region of the axis of rotation defined by the diffraction goniometer is 2 to 8.
更にMg、Sn、Zn及びMnの群から選ばれる1種以上を合計0.05〜2.0質量%含有することが好ましい。
更にCoを1.0〜1.5質量%、Crを0.05〜0.2質量%含有することが好ましい。
板表面の十点平均粗さが0.4〜1.2μmであることが好ましい。
Furthermore, it is preferable to contain 0.05-2.0 mass% in total of 1 or more types chosen from the group of Mg, Sn, Zn, and Mn.
Furthermore, it is preferable to contain 1.0 to 1.5% by mass of Co and 0.05 to 0.2% by mass of Cr.
The ten-point average roughness of the plate surface is preferably 0.4 to 1.2 μm.
本発明の電気部品は、前記Cu−Ni−Si系銅合金圧延板を用いたものである。 The electrical component of the present invention uses the Cu-Ni-Si-based copper alloy rolled plate.
本発明によれば、プレス加工性、曲げ加工性及び強度に優れたに優れたCu−Ni−Si系銅合金圧延板が得られる。 According to the present invention, it is possible to obtain a Cu—Ni—Si based copper alloy rolled sheet excellent in press workability, bending workability and strength.
以下、本発明に係るCu−Ni−Si系銅合金圧延板の実施の形態について説明する。なお、本発明において%とは、特に断らない限り、質量%(重量%)を示すものとする。 Hereinafter, embodiments of the rolled Cu—Ni—Si copper alloy sheet according to the present invention will be described. In the present invention,% means mass% (% by weight) unless otherwise specified.
(組成)
[Ni及びSi]
銅合金圧延板中のNiの濃度を1.0〜4.0%とし、Siの濃度を0.1〜0.8%とする。Ni及びSiは、銅合金の溶解時に固溶し、溶体化処理後に熱処理して時効析出させることにより、Ni2Siを主とする金属間化合物の微細な粒子を形成する。その結果、銅合金の強度が著しく増加し、電気伝導度も高くなる。
Niの濃度が1.0%未満であると、銅合金の充分な強度が得られず、4.0%を超えると熱間圧延で割れが発生する。Siの濃度が0.1%未満であると、銅合金の充分な強度が得られず、0.8%を超えると導電性が低下する。
(composition)
[Ni and Si]
The concentration of Ni in the copper alloy rolled sheet is set to 1.0 to 4.0%, and the concentration of Si is set to 0.1 to 0.8%. Ni and Si are dissolved at the time of dissolution of the copper alloy, and heat treatment is performed after the solution treatment to cause aging precipitation, thereby forming fine particles of an intermetallic compound mainly containing Ni 2 Si. As a result, the strength of the copper alloy is remarkably increased and the electrical conductivity is also increased.
If the Ni concentration is less than 1.0%, sufficient strength of the copper alloy cannot be obtained, and if it exceeds 4.0%, cracking occurs during hot rolling. If the Si concentration is less than 0.1%, sufficient strength of the copper alloy cannot be obtained, and if it exceeds 0.8%, the conductivity is lowered.
[Mg、Sn、Zn及びMn]
銅合金圧延板中に、更にMg、Sn、Zn及びMnの群から選ばれる1種以上を合計0.05〜2.0%含有してもよい。
これらの元素の合計が0.05%未満であると、以下に示す応力緩和特性・熱間加工性・強度・耐熱性といった銅合金の特性改善効果が得られず、2.0%を超えると導電性が低下する場合がある。
ここで、Mgは銅合金の応力緩和特性および熱間加工性を改善する効果があるが、0.05%未満では上記効果が得られず、0.2%を超えると鋳造性(鋳肌品質)の低下、熱間加工性およびめっき耐熱剥離性の低下を招く場合があるので、Mgの濃度は0.05〜0.2%であることが好ましい。
Sn及びZnは、銅合金の強度及び耐熱性を改善する効果があり、さらにSnは銅合金の耐応力緩和特性を改善し、Znは銅合金のSnめっき時の耐熱剥離性を改善する。Snの濃度は0.2〜1%であることが好ましく、Znの濃度は0.2〜1%であることが好ましい。SnやZnの濃度が0.2%未満であると上記効果が得られず、1%を超えると導電性が低下する。
Mnは、固溶強化により強度を改善する効果に加え、熱間加工性を改善する効果がある。Mnが0.05%未満では上記効果が得られず、0.15%を超えると導電性が低下するので、Mnの濃度は0.05〜0.15%であることが好ましい。
[Mg, Sn, Zn and Mn]
The copper alloy rolled sheet may further contain 0.05 to 2.0% in total of one or more selected from the group consisting of Mg, Sn, Zn and Mn.
If the total of these elements is less than 0.05%, the effect of improving the characteristics of the copper alloy such as stress relaxation characteristics, hot workability, strength, and heat resistance shown below cannot be obtained, and if it exceeds 2.0% Conductivity may be reduced.
Here, Mg has the effect of improving the stress relaxation characteristics and hot workability of the copper alloy, but the effect cannot be obtained if it is less than 0.05%, and if it exceeds 0.2%, the castability (casting surface quality) ), Hot workability, and plating heat-resistant peelability may be lowered, so the Mg concentration is preferably 0.05 to 0.2%.
Sn and Zn have the effect of improving the strength and heat resistance of the copper alloy, Sn further improves the stress relaxation resistance of the copper alloy, and Zn improves the heat release resistance of the copper alloy during Sn plating. The concentration of Sn is preferably 0.2 to 1%, and the concentration of Zn is preferably 0.2 to 1%. If the concentration of Sn or Zn is less than 0.2%, the above effect cannot be obtained, and if it exceeds 1%, the conductivity decreases.
Mn has the effect of improving hot workability in addition to the effect of improving strength by solid solution strengthening. If Mn is less than 0.05%, the above effect cannot be obtained, and if it exceeds 0.15%, the conductivity decreases. Therefore, the Mn concentration is preferably 0.05 to 0.15%.
[Co,Cr]
銅合金圧延板中に、更にCoを1.0〜1.5質量%、Crを0.05〜0.2質量%含有してもよい。CoはSiと金属間化合物を形成し、析出強化により強度を改善する効果がある。Coが1.0%未満では上記効果が得られず、1.5%を超えると導電性が低下し、コストも上昇する。Crは熱間加工性を改善する効果がある。Crが0.05%未満では上記効果が得られず、0.2%を超えると導電性が低下する。
[Co, Cr]
The copper alloy rolled plate may further contain 1.0 to 1.5 mass% Co and 0.05 to 0.2 mass% Cr. Co forms an intermetallic compound with Si and has the effect of improving strength by precipitation strengthening. If Co is less than 1.0%, the above effect cannot be obtained, and if it exceeds 1.5%, the conductivity is lowered and the cost is also increased. Cr has the effect of improving hot workability. If Cr is less than 0.05%, the above effect cannot be obtained, and if it exceeds 0.2%, the conductivity is lowered.
(せん断集合組織の極密度)
通常、冷間圧延において、材料の塑性変形に伴い、結晶格子回転が進行し、集合組織が形成されるが、圧延時にロールと接する材料の表層領域と材料中央部では形成される集合組織に差異があることが知られている(上城ら、日本金属学会誌、p33、36巻,1972年,五弓勇雄編、「金属塑性加工の進歩」、p499、コロナ社、1978年)。これは、材料中央部では、板厚方向の圧縮応力と圧延方向の引張応力とが組み合わさった二軸応力により材料が変形されるのに対して、材料表層部では、ロールとの摩擦力の影響で材料がせん断変形されるためであり、これを表面集合組織(せん断集合組織)と呼んで、圧延集合組織と区別している。例えば、Al板では最適条件下で、板の両面から板厚の30%ずつに表面集合組織が形成され、薄い遷移層によって急激に内部組織に変わることが判明している。本発明者らが検討した結果、銅合金圧延板においては、製造条件を制御する事で表面集合組織を、板厚に対して10〜20%程度形成出来る事が明らかとなった。さらに検討した結果、銅合金圧延板において、表面集合組織(せん断集合組織)を制御することにより、プレス加工性が変化することが判明した。
(Extreme density of shear texture)
Usually, in cold rolling, the crystal lattice rotation proceeds with the plastic deformation of the material and a texture is formed, but there is a difference in the texture formed in the surface layer region of the material in contact with the roll during rolling and in the center of the material. (Jojo et al., Journal of the Japan Institute of Metals, p33, 36, 1972, edited by Isao Gokyu, “Advances in Metal Plastic Processing”, p499, Corona, 1978). This is because the material is deformed by the biaxial stress that combines the compressive stress in the plate thickness direction and the tensile stress in the rolling direction at the center of the material, whereas the frictional force with the roll is at the material surface layer. This is because the material undergoes shear deformation due to the influence, which is called a surface texture (shear texture) and is distinguished from a rolling texture. For example, it has been found that in an Al plate, a surface texture is formed on both sides of the plate by 30% of the plate thickness under optimum conditions, and the inner structure is rapidly changed by a thin transition layer. As a result of investigations by the present inventors, it has been clarified that, in a copper alloy rolled sheet, the surface texture can be formed about 10 to 20% with respect to the sheet thickness by controlling the manufacturing conditions. As a result of further investigation, it was found that the press workability is changed by controlling the surface texture (shear texture) in the rolled copper alloy sheet.
本発明において、X線回折法により板表面から5μmの深さまでの結晶方位を測定したとき、{111}正極点図上のα=0±10°(但し、α:シュルツ法に規定する回折用ゴニオメータの回転軸に垂直な軸)の領域に相当する、せん断集合組織の極密度を2以上8以下に規定する。
ここで、板表面から5μmの深さまでを対象とする理由は、本発明のCu−Ni−Si系銅合金圧延板を用いて表面集合組織とプレス加工性の関係を調査したところ、5μm以上の表面集合組織が形成されるとプレス加工性に有意な差異が生じた事から、この深さまでを測定対象とした。
In the present invention, when the crystal orientation from the plate surface to a depth of 5 μm is measured by the X-ray diffraction method, α = 0 ± 10 ° on the {111} positive pole figure (where α: for diffraction specified in the Schulz method) The pole density of the shear texture corresponding to the region of the axis perpendicular to the rotation axis of the goniometer is defined as 2 or more and 8 or less.
Here, the reason for the depth from the plate surface to a depth of 5 μm is that when the relationship between the surface texture and the press workability was investigated using the Cu—Ni—Si based copper alloy rolled plate of the present invention, it was 5 μm or more. Since a significant difference occurred in press workability when the surface texture was formed, this depth was used as the measurement target.
以上のようにして、せん断集合組織の極密度が測定される。そして、せん断集合組織の極密度が2以上8以下である圧延板を打抜プレス加工すると、プレス打抜後に発生する材料のダレが従来材に比べて小さく、バリが従来材に比べて低いことが判明した。
板表面から5μmの深さのせん断集合組織の極密度が2未満であると、せん断集合組織が十分に形成されず、ダレが大きくなると共にバリが高くなり、プレス加工性が向上しない。一方、せん断集合組織の極密度が8を超えることは工業的に困難であり極密度の上限を8と設定する。極密度が2以上から3以下の範囲では、せん断集合組織の極密度が増加するのに応じてプレス加工性は向上する(ダレは小さくバリは低くなる)が、極密度が3を超えるとプレス加工性の改善の度合いは鈍化し、極密度が5を超えると、プレス加工性に差異が見られなくなる。又、5を超える高い極密度を得るためには、粘度の高い圧延油の使用や圧延速度の高速化が必要であり、材料の表面粗さが大きくなる。一方、極密度が4.5を超えると、曲げ部加工部にしわが発生するようになる。このようなことから、極密度は2.2以上5以下とするのが好ましく、より好ましくは2.5以上4.5以下とする。
なお、従来の銅合金圧延板の場合、せん断集合組織の極密度が高い部分は、板の極表面に限られるので、プレス加工性が十分とはいえない。図1は、本発明の銅合金圧延板と従来の銅合金圧延板のせん断集合組織の極密度を模式的に示す。従来の銅合金圧延においても、板の極表面のせん断集合組織の極密度は2以上となるが、内部になるにつれて極密度が急激に低下し、板表面から5μmの深さでは極密度が2未満になっている。
As described above, the extreme density of the shear texture is measured. When a rolled plate having a shear texture with an extreme density of 2 or more and 8 or less is punched and pressed, the sag of the material generated after press punching is smaller than that of the conventional material, and the burr is lower than that of the conventional material. There was found.
When the extreme density of the shear texture having a depth of 5 μm from the plate surface is less than 2, the shear texture is not sufficiently formed, the sag increases and the burr increases, and the press workability is not improved. On the other hand, it is industrially difficult for the polar density of the shear texture to exceed 8, and the upper limit of the polar density is set to 8. When the extreme density is in the range of 2 to 3, the press workability improves as the extreme density of the shear texture increases (the sagging is small and the burr becomes low). The degree of improvement in workability slows down, and when the pole density exceeds 5, no difference is seen in press workability. Further, in order to obtain a high pole density exceeding 5, it is necessary to use a rolling oil having a high viscosity and to increase the rolling speed, and the surface roughness of the material increases. On the other hand, when the pole density exceeds 4.5, wrinkles are generated in the bent portion processed portion. Therefore, the pole density is preferably 2.2 or more and 5 or less, and more preferably 2.5 or more and 4.5 or less.
In the case of a conventional rolled copper alloy plate, the portion having a high extreme density of the shear texture is limited to the extreme surface of the plate, so that press workability is not sufficient. FIG. 1 schematically shows the extreme density of the shear texture of the rolled copper alloy sheet of the present invention and a conventional rolled copper alloy sheet. Also in conventional copper alloy rolling, the pole density of the shear texture on the pole surface of the plate is 2 or more, but the pole density rapidly decreases as it goes inside, and the pole density is 2 at a depth of 5 μm from the plate surface. Has become less.
板表面から5μmの深さまでのせん断集合組織の極密度を、2以上8以下に制御する方法としては、最終冷間圧延時のロールと銅合金圧延素材との間の摩擦力を高める方法が挙げられる。具体的には最終冷間圧延時の、1)圧延油の粘度を高くする、2)圧延ロールの粗度を高くする、3)圧延速度を高くする(ロール径を小さくする)、ことが挙げられる。
通常、冷間圧延時の圧延油の粘度は0.03〜0.06cm2/s程度であり、最終冷間圧延時の圧延油の粘度を0.06cm2/s以上とすることで、せん断集合組織の極密度を2以上8以下にすることができる。
なお、本発明の銅合金圧延板は、固溶したNi及びSiを熱処理して時効析出させるが、時効処理と上記最終冷間圧延の順序はいずれが先であってもよい。
As a method for controlling the extreme density of the shear texture from the plate surface to a depth of 5 μm to 2 or more and 8 or less, there is a method for increasing the frictional force between the roll and the copper alloy rolled material at the time of final cold rolling. It is done. Specifically, at the time of final cold rolling, 1) increase the viscosity of the rolling oil, 2) increase the roughness of the rolling roll, and 3) increase the rolling speed (reducing the roll diameter). It is done.
Usually, the viscosity of the rolling oil at the time of cold rolling is about 0.03 to 0.06 cm 2 / s, and the viscosity of the rolling oil at the time of the final cold rolling is set to 0.06 cm 2 / s or more, thereby shearing The extreme density of the texture can be 2 or more and 8 or less.
In addition, although the copper alloy rolled sheet of this invention heat-processes Ni and Si which carried out solid solution, and age-precipitates, any may be sufficient as the order of an aging treatment and the said last cold rolling.
本発明の銅合金圧延板において、板表面の十点平均粗さが0.4〜1.2μmであることが好ましい。板表面の十点平均粗さが0.4μm未満であると、プレス時に金型と材料間に潤滑油が十分に供給されず、破断面の比率やバリが高くなる場合がある。又、通常の方法で銅合金圧延板を製造した場合、板表面の十点平均粗さが1.2μmを超えることはない。 In the rolled copper alloy sheet of the present invention, the 10-point average roughness of the sheet surface is preferably 0.4 to 1.2 μm. If the 10-point average roughness of the plate surface is less than 0.4 μm, the lubricating oil may not be sufficiently supplied between the mold and the material during pressing, and the fracture surface ratio and burrs may increase. Further, when a copper alloy rolled sheet is produced by a normal method, the ten-point average roughness of the sheet surface does not exceed 1.2 μm.
(製造方法)
本発明の銅合金圧延板の製造プロセスは以下の通りである。まず、電気銅又は無酸素銅を主原料とし、上記化学成分その他を添加した組成を木炭被覆下で大気溶解し、インゴットを作製する。インゴットを熱間圧延した後、熱処理と冷間圧延を繰り返し所望の条または箔を作製する。熱処理には溶体化処理と時効処理があり、溶体化処理では700〜1000℃の高温域で材料を加熱し、母相に析出物の構成元素(Ni・Siおよび副成分)を固溶させる。その後、300〜600℃の温度域で時効処理を実施し、母相から微細な化合物を析出させ、強度を向上させる。時効前または時効後により高い強度を得る為、冷間圧延を行なうことがある。また、冷間圧延後に歪取焼鈍を実施する事もある。
(Production method)
The manufacturing process of the copper alloy rolled sheet of the present invention is as follows. First, electrolytic copper or oxygen-free copper is used as a main raw material, and the composition to which the above chemical components and others are added is dissolved in the atmosphere under charcoal coating to produce an ingot. After the ingot is hot-rolled, heat treatment and cold rolling are repeated to produce a desired strip or foil. The heat treatment includes a solution treatment and an aging treatment. In the solution treatment, the material is heated in a high temperature range of 700 to 1000 ° C., and the constituent elements (Ni · Si and subcomponents) of the precipitate are dissolved in the matrix. Thereafter, an aging treatment is performed in a temperature range of 300 to 600 ° C. to precipitate a fine compound from the parent phase and improve the strength. In order to obtain higher strength before or after aging, cold rolling may be performed. In addition, strain relief annealing may be performed after cold rolling.
本発明の銅合金圧延板は、ばね用材料(条)、箔等の種々の形態とすることができる。例えば、本発明の銅合金をばね材用の条とした場合、リードフレーム、コネクタ、ピン、端子、リレー、スイッチ等の電気部品に適用可能である。コネクタとしては、公知のあらゆる形態、構造のものに適用できるが、通常はオス(ジャック、プラグ)とメス(ソケット、レセプタクル)からなっている。端子は、例えば串状の多数のピンが並設され、他のコネクタと嵌合した際に端子同士が電気的に接触するよう、適宜折り曲げられてバネのようになっていることがある。そして、通常、コネクタの端子が本発明の銅合金圧延板で構成されている。 The rolled copper alloy sheet of the present invention can be in various forms such as spring materials (strips) and foils. For example, when the copper alloy of the present invention is used as a strip for a spring material, it can be applied to electrical parts such as lead frames, connectors, pins, terminals, relays, and switches. The connector can be applied to all known forms and structures, but usually consists of a male (jack, plug) and a female (socket, receptacle). For example, the terminals may be arranged like a spring, with a number of skewered pins arranged side by side and appropriately bent so that the terminals come into electrical contact with each other when fitted to other connectors. And the terminal of a connector is normally comprised with the copper alloy rolled sheet of this invention.
次に、実施例を挙げて本発明をさらに詳細に説明するが、本発明はこれらに限定されるものではない。 EXAMPLES Next, although an Example is given and this invention is demonstrated further in detail, this invention is not limited to these.
<実施例1>
1.試料の作製
電気銅に、Ni1.6%、Si0.4%、Sn0.4%、及びZn0.5%をそれぞれ添加して木炭被覆下の大気溶解炉中で溶解し、溶湯を攪拌した。その後、鋳込み温度1250℃でインゴットを鋳造し、これを900℃の温度で3時間の焼鈍後、板厚11mmまで熱間圧延した。熱間圧延材の表層の酸化スケールを面削で除去した後、板厚0.24mmまで冷間圧延を施し、さらに表1に示す溶体化温度で1分間の溶体化処理を施し、圧延板試料を得た。次に、450℃で10時間の条件で時効処理を施した後、0.2mmまで最終冷間圧延した。最終冷間圧延時の圧延速度及び圧延油の粘度を表1に示すように変化させて、せん断集合組織の極密度を調整した。
<Example 1>
1. Preparation of Sample Ni 1.6%, Si 0.4%, Sn 0.4%, and Zn 0.5% were added to electrolytic copper, respectively, and dissolved in an atmospheric melting furnace covered with charcoal, and the molten metal was stirred. Thereafter, an ingot was cast at a casting temperature of 1250 ° C., and this was annealed at 900 ° C. for 3 hours, and then hot-rolled to a thickness of 11 mm. After removing the oxide scale on the surface layer of the hot-rolled material by chamfering, it is cold-rolled to a sheet thickness of 0.24 mm, further subjected to a solution treatment at a solution temperature shown in Table 1 for 1 minute, and a rolled plate sample Got. Next, after an aging treatment was performed at 450 ° C. for 10 hours, final cold rolling was performed to 0.2 mm. The rolling density at the time of final cold rolling and the viscosity of the rolling oil were changed as shown in Table 1 to adjust the extreme density of the shear texture.
2.せん断集合組織の極密度の測定
X線ディフラクトメータ(株式会社リガク製 RINT2500)により、各試料の{111}正極点測定を反射法で行い、{111}正極点図を作製した。但し、反射法では、試料面に対するX線の入射角が浅くなると測定が困難になるため、実際に測定できる角度範囲は正極点図上で0°≦α≦75°、0°≦β≦360°(但し、α:シュルツ法に規定する回折用ゴニオメータの回転軸に垂直な軸、β:前記回転軸に平行な軸)となる。
測定では、αとβの回転間隔Δα、Δβを5°として上記した角度範囲内を走査し、16×73=1168点のX線強度を測定した。この際、集合組織を有しない状態(すなわち結晶方位がランダムである状態)を1として正極点図上の集合組織の強度を規格化した。結晶方位がランダムである状態として、銅粉末試料の{111}正極点測定を行い、これを1とした。
なお、X線照射条件として、Co管球を使用し、管電圧30kV、管電流100mAとし、板表面から5μmの深さまでX線が浸透するよう、条件を設定した。
以上のようにして、せん断集合組織に相当する{111}正極点図上のα=0°±10°の範囲の結晶方位の極密度を測定し、この範囲内における極密度の最大値を、せん断集合組織の極密度と定義した。
2. Measurement of polar density of shear texture Using an X-ray diffractometer (RINT2500, manufactured by Rigaku Corporation), {111} positive electrode points of each sample were measured by a reflection method to produce {111} positive electrode dot diagrams. However, in the reflection method, measurement becomes difficult when the incident angle of the X-ray with respect to the sample surface becomes shallow. Therefore, the angle ranges that can be actually measured are 0 ° ≦ α ≦ 75 ° and 0 ° ≦ β ≦ 360 on the positive electrode diagram. ° (where α is an axis perpendicular to the rotational axis of the diffraction goniometer defined in the Schulz method, β is an axis parallel to the rotational axis).
In the measurement, the X-ray intensity at 16 × 73 = 1168 points was measured by scanning the angle range described above with α and β rotation intervals Δα and Δβ set to 5 °. At this time, the strength of the texture on the positive point diagram was normalized by assuming that the texture has no texture (that is, the crystal orientation is random) as 1. Assuming that the crystal orientation was random, {111} positive electrode point measurement of a copper powder sample was performed, and this was set to 1.
As the X-ray irradiation conditions, a Co tube was used, the tube voltage was set to 30 kV, the tube current was set to 100 mA, and the conditions were set so that the X-ray penetrated to a depth of 5 μm from the plate surface.
As described above, the polar density of the crystal orientation in the range of α = 0 ° ± 10 ° on the {111} positive electrode diagram corresponding to the shear texture is measured, and the maximum value of the polar density in this range is It was defined as the extreme density of the shear texture.
3.ダレの大きさ
各試料について、金型クリアランスを10%とし、250spmの打抜き速度で、長さ30mm、幅0.5mmのリードを打抜き、コンフォーカル顕微鏡で打ち抜き材の断面を撮影した。撮影画像のうち、打ち抜き開始面側の最も高さの高い部分(打ち抜き材の中央部で打ち抜き位置から遠い部分)と、最も高さの低い部分(打ち抜き位置であって、材料がダレて下がっている部分)との高度差を、ダレの大きさと定義した。
ダレの大きさが30μm以内であれば、ダレが小さくて良好と判定した。
3. Size of Sagging For each sample, a die clearance was set to 10%, a lead having a length of 30 mm and a width of 0.5 mm was punched at a punching speed of 250 spm, and a cross section of the punched material was photographed with a confocal microscope. Of the photographed image, the highest part on the punching start surface side (the part far from the punching position in the center of the punching material) and the lowest part (the punching position, where the material sags down The difference in altitude from that of the part) was defined as the size of the sagging.
When the size of the sagging was within 30 μm, it was judged that the sagging was small and good.
4.バリの高さ
各試料について、金型クリアランスを10%とし、250spmの打抜き速度で、長さ30mm、幅0.5mmのリードを打抜き、コンフォーカル顕微鏡で打ち抜き材の断面を撮影した。撮影画像のうち、打ち抜き終了面側の最も高さの高い部分と、最も高さの低い部分との高度差を、バリの高さと定義した。
バリの高さが10μm以内であれば、バリが低く良好と判定した。
4). Burr Height For each sample, a die clearance was set to 10%, a lead having a length of 30 mm and a width of 0.5 mm was punched at a punching speed of 250 spm, and a cross section of the punched material was photographed with a confocal microscope. In the photographed image, the height difference between the highest part on the punching end surface side and the lowest part was defined as the burr height.
If the burr height was within 10 μm, the burr was judged to be low and good.
5.曲げ加工性
日本伸銅協会(JBMA)技術標準 T307(1999年)に従って、曲げ半径を0.1mmとし、曲げ軸が圧延方向に平行になるように、曲げ試験を実施した。同技術標準の5段階の評価A〜Eに対応し、以下のような基準で評価した。
○:同技術標準のA(良好)なもの
△:同技術標準のB(しわ小)及びC(しわ大)
×:同技術標準のD(割れ小)及びE(割れ大)
5). Bending workability According to the Japan Copper and Brass Association (JBMA) technical standard T307 (1999), a bending test was performed such that the bending radius was 0.1 mm and the bending axis was parallel to the rolling direction. Corresponding to the five grades A to E of the technical standard, the following criteria were used.
○: A (good) of the technical standard △: B (small wrinkle) and C (large wrinkle) of the technical standard
×: D (small crack) and E (large crack) of the same technical standard
6.引張強さ
各試料について、圧延方向に平行な方向に、JISZ2241に準拠して引張試験を行い、引張強さを求めた。引張強さが650MPa以上であれば、ばね材として良好である。
6). Tensile strength Each sample was subjected to a tensile test in accordance with JISZ2241 in a direction parallel to the rolling direction to determine the tensile strength. If the tensile strength is 650 MPa or more, the spring material is good.
得られた結果を表1に示す。 The obtained results are shown in Table 1.
表1から明らかなように、発明例1〜11の場合、ダレが小さくバリが低く、プレス加工性に優れ、曲げ加工性も良好であった。さらに引張強さも高いものとなった。
一方、最終冷間圧延時の圧延速度が160mpm未満である比較例1、比較例3および比較例5の場合、せん断集合組織の極密度が2未満となり、ダレが大きくバリが高く、プレス加工性が劣化した。
比較例2および比較例6の場合、圧延油の粘度が0.03cm2/s以下と低く、せん断集合組織の極密度が2未満となり、ダレが大きくバリが高く、プレス加工性が劣化した。
比較例4の場合、溶体化温度が700℃と低く、せん断集合組織の極密度が2未満となり、ダレが大きくバリが高く、プレス加工性が劣化した。これは、溶体化温度が低いため、溶体化処理時に再結晶が起こらず、溶体化処理以前に形成された圧延集合組織の影響により、所望のせん断集合組織が得られない事が原因である。なお、適正な溶体化温度の範囲は、銅合金圧延板の組成によって変動し、発明例に適用された760〜830℃の温度域に限定されるものではない。
As is clear from Table 1, in the case of Invention Examples 1 to 11, the sagging was small and the burrs were low, the press workability was excellent, and the bending workability was also good. Furthermore, the tensile strength was also high.
On the other hand, in the case of Comparative Example 1, Comparative Example 3 and Comparative Example 5 in which the rolling speed at the time of the final cold rolling is less than 160 mpm, the extreme density of the shear texture becomes less than 2, the sagging is large, the burr is high, and the press workability Deteriorated.
In Comparative Examples 2 and 6, the viscosity of the rolling oil was as low as 0.03 cm 2 / s or less, the extreme density of the shear texture was less than 2, the sagging was large, the burr was high, and the press workability was deteriorated.
In the case of Comparative Example 4, the solution temperature was as low as 700 ° C., the extreme density of the shear texture was less than 2, the sagging was large and the burr was high, and the press workability was deteriorated. This is because, since the solution temperature is low, recrystallization does not occur during the solution treatment, and a desired shear texture cannot be obtained due to the influence of the rolling texture formed before the solution treatment. In addition, the range of the appropriate solution treatment temperature varies depending on the composition of the copper alloy rolled sheet, and is not limited to the temperature range of 760 to 830 ° C. applied to the invention examples.
<実施例2>
電気銅に、Ni、Si、Mg、Sn、Zn、Co及びCrをそれぞれ表2に示す割合で添加して大気溶解炉中で溶解し、溶湯を攪拌した。その後、鋳込み温度1250℃でインゴットを鋳造し、900℃の温度で3時間の焼鈍後、板厚11mmまで熱間圧延した。熱間圧延材の表層の酸化スケールを面削で除去した後、板厚0.24mmまで冷間圧延を施し、さらに表3の溶体化温度で1分間の溶体化処理を施し、圧延板試料を得た。次に、450℃で10時間の条件で時効処理を施した後、0.2mmまで最終冷間圧延を実施した。最終冷間圧延時の圧延速度及び圧延油の粘度を、表3に示す値とした。各試料について、引張強さを除き、実施例1と全く同様の評価を行った。引張強さについては、組成の影響を大きく受けるため、600MPa以上を強度が良好と判定した。各試料の成分及び得られた結果をそれぞれ表2、表3に示す。
<Example 2>
Ni, Si, Mg, Sn, Zn, Co, and Cr were added to electrolytic copper in the proportions shown in Table 2, respectively, and dissolved in an atmospheric melting furnace, and the molten metal was stirred. Thereafter, an ingot was cast at a casting temperature of 1250 ° C., annealed at a temperature of 900 ° C. for 3 hours, and then hot-rolled to a plate thickness of 11 mm. After removing the oxide scale on the surface layer of the hot-rolled material by chamfering, it is cold-rolled to a sheet thickness of 0.24 mm, further subjected to a solution treatment for 1 minute at the solution temperature shown in Table 3, and a rolled plate sample is obtained. Obtained. Next, after aging treatment was performed at 450 ° C. for 10 hours, final cold rolling was performed to 0.2 mm. The rolling speed at the time of final cold rolling and the viscosity of the rolling oil were the values shown in Table 3. Each sample was evaluated in exactly the same manner as in Example 1 except for the tensile strength. About tensile strength, since it received to the influence of a composition greatly, 600 MPa or more was determined to be strong. The components of each sample and the results obtained are shown in Table 2 and Table 3, respectively.
表3から明らかなように、発明例12〜23の試料は、いずれもダレが小さくバリが低く、プレス加工性に優れ、曲げ加工性も良好であった。さらに引張強さも良好であった。
Niが1.0質量%未満である比較例7の場合、プレス加工性は良好なものの、強度が低下した。Niが4.0質量%を超えると共に、Siが0.8質量%を超えた比較例8の場合、熱間圧延時に割れが発生し、試料作製ができなかった。
As apparent from Table 3, all of the samples of Invention Examples 12 to 23 were small in sagging and low in burrs, excellent in press workability, and good in bending workability. Furthermore, the tensile strength was also good.
In the case of Comparative Example 7 where Ni is less than 1.0% by mass, the press workability was good, but the strength was lowered. In the case of Comparative Example 8 in which Ni exceeded 4.0% by mass and Si exceeded 0.8% by mass, cracking occurred during hot rolling, and sample preparation was not possible.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009069536A JP2010222618A (en) | 2009-03-23 | 2009-03-23 | Cu-Ni-Si-based copper alloy rolled plate and electrical parts using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009069536A JP2010222618A (en) | 2009-03-23 | 2009-03-23 | Cu-Ni-Si-based copper alloy rolled plate and electrical parts using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2010222618A true JP2010222618A (en) | 2010-10-07 |
Family
ID=43040127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009069536A Pending JP2010222618A (en) | 2009-03-23 | 2009-03-23 | Cu-Ni-Si-based copper alloy rolled plate and electrical parts using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010222618A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012124732A1 (en) * | 2011-03-16 | 2012-09-20 | Jx日鉱日石金属株式会社 | Cu-Ni-Si ALLOY WIRE HAVING EXCELLENT BENDABILITY |
| EP2706125A4 (en) * | 2011-05-02 | 2014-11-19 | Furukawa Electric Co Ltd | Copper alloy sheet material and process for producing same |
| JP2015034336A (en) * | 2013-07-11 | 2015-02-19 | 古河電気工業株式会社 | Copper alloy sheet material and production method thereof |
| CN107988512A (en) * | 2017-11-30 | 2018-05-04 | 中铝洛阳铜加工有限公司 | A kind of high strength and high flexibility cupro-nickel silicon cobalt system lead frame processing technology |
| EP4653562A1 (en) | 2023-02-24 | 2025-11-26 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Copper alloy sheet |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001244400A (en) * | 2000-02-29 | 2001-09-07 | Nippon Mining & Metals Co Ltd | Lead frame and copper alloy for lead frame |
| JP2006283120A (en) * | 2005-03-31 | 2006-10-19 | Nikko Metal Manufacturing Co Ltd | Cu-Ni-Si-Co-Cr-based copper alloy for electronic materials and method for producing the same |
| JP2007268596A (en) * | 2006-03-31 | 2007-10-18 | Nikko Kinzoku Kk | Copper alloy foil for roughening treatment |
-
2009
- 2009-03-23 JP JP2009069536A patent/JP2010222618A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001244400A (en) * | 2000-02-29 | 2001-09-07 | Nippon Mining & Metals Co Ltd | Lead frame and copper alloy for lead frame |
| JP2006283120A (en) * | 2005-03-31 | 2006-10-19 | Nikko Metal Manufacturing Co Ltd | Cu-Ni-Si-Co-Cr-based copper alloy for electronic materials and method for producing the same |
| JP2007268596A (en) * | 2006-03-31 | 2007-10-18 | Nikko Kinzoku Kk | Copper alloy foil for roughening treatment |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012124732A1 (en) * | 2011-03-16 | 2012-09-20 | Jx日鉱日石金属株式会社 | Cu-Ni-Si ALLOY WIRE HAVING EXCELLENT BENDABILITY |
| JP2012193408A (en) * | 2011-03-16 | 2012-10-11 | Jx Nippon Mining & Metals Corp | Cu-Ni-Si ALLOY HAVING EXCELLENT BENDABILITY |
| KR20140002001A (en) * | 2011-03-16 | 2014-01-07 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | Cu-ni-si alloy wire having excellent bendability |
| KR101590242B1 (en) * | 2011-03-16 | 2016-01-29 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | Cu-Ni-Si ALLOY WIRE HAVING EXCELLENT BENDABILITY |
| EP2706125A4 (en) * | 2011-05-02 | 2014-11-19 | Furukawa Electric Co Ltd | Copper alloy sheet material and process for producing same |
| JP2015034336A (en) * | 2013-07-11 | 2015-02-19 | 古河電気工業株式会社 | Copper alloy sheet material and production method thereof |
| CN107988512A (en) * | 2017-11-30 | 2018-05-04 | 中铝洛阳铜加工有限公司 | A kind of high strength and high flexibility cupro-nickel silicon cobalt system lead frame processing technology |
| EP4653562A1 (en) | 2023-02-24 | 2025-11-26 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Copper alloy sheet |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4601085B1 (en) | Cu-Co-Si-based copper alloy rolled plate and electrical component using the same | |
| JPH11335756A (en) | Copper alloy sheet for electronic parts | |
| JP5734156B2 (en) | Copper alloy sheet and manufacturing method thereof | |
| WO2012121109A1 (en) | Cu-Ni-Si BASED ALLOY AND PROCESS FOR MANUFACTURING SAME | |
| WO2016006053A1 (en) | Copper alloy sheet material, connector, and method for producing copper alloy sheet material | |
| JP5189708B1 (en) | Cu-Ni-Si-based copper alloy sheet having good mold wear resistance and shearing workability and method for producing the same | |
| JP2011508081A (en) | Copper-nickel-silicon alloy | |
| JP7430502B2 (en) | Copper alloy wire and electronic equipment parts | |
| JPWO2010016428A1 (en) | Copper alloy material for electrical and electronic parts | |
| WO2018079507A1 (en) | Copper alloy sheet and method for manufacturing same | |
| JP2017179569A (en) | Copper alloy for electronic material | |
| WO2012124732A1 (en) | Cu-Ni-Si ALLOY WIRE HAVING EXCELLENT BENDABILITY | |
| JP2010222618A (en) | Cu-Ni-Si-based copper alloy rolled plate and electrical parts using the same | |
| JP5339995B2 (en) | Cu-Zn-Sn alloy plate and Cu-Zn-Sn alloy Sn plating strip | |
| JP6265651B2 (en) | Copper alloy sheet, connector using the same, and method for producing the copper alloy sheet | |
| JP4444245B2 (en) | Cu-Zn-Sn alloy for electrical and electronic equipment | |
| JP4439003B2 (en) | Titanium copper alloy excellent in strength and bending workability and manufacturing method thereof | |
| JP4804266B2 (en) | Cu-Zn-Sn alloy for electrical and electronic equipment and method for producing the same | |
| JP4987155B1 (en) | Cu-Ni-Si alloy and method for producing the same | |
| JP6542817B2 (en) | Copper alloy for electronic materials | |
| JP4781145B2 (en) | Terminal, connector or relay using Cu-Zn-Sn alloy and Cu-Zn-Sn alloy strip | |
| JP5827530B2 (en) | Cu-Ni-Si based copper alloy sheet with excellent spring limit and stress relaxation resistance and good shear workability | |
| KR102345805B1 (en) | Cu-Ni-Si-BASED ALLOY STRIP EXCELLENT IN STRENGTH AND BENDING WORKABILITY IN ROLLING PARALLEL DIRECTION AND ROLLING ORTHOGONAL DIRECTION | |
| JP5988745B2 (en) | Cu-Ni-Si based copper alloy plate with Sn plating and method for producing the same | |
| JP7355569B2 (en) | Copper alloys, copper alloy products and electronic equipment parts |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20100903 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20101005 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120516 |
|
| A131 | Notification of reasons for refusal |
Effective date: 20120625 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120817 |
|
| A02 | Decision of refusal |
Effective date: 20130225 Free format text: JAPANESE INTERMEDIATE CODE: A02 |