JP2019009149A - Sheet sticking device and sticking method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet pasting device and a sticking method capable of sticking an adhesive sheet so that wrinkles and air bubbles are not formed between the adherend and the adherend. SOLUTION: A sheet attaching device 10 presses and attaches an adhesive sheet AS to a position facing an adhered surface WF1 of an adherend WF and an adhesive sheet AS drawn out to the adhered surface WF1. The pressing means 30, the cutting means 40 for forming an unnecessary sheet on the outside of the cut by providing a closed loop-shaped notch penetrating the adhesive sheet AS attached to the adherend surface WF1, and the winding means for winding the unnecessary sheet. 50 is provided with a sagging preventing means 60 for preventing the adhesive sheet AS from sagging due to slack in the peripheral edge of the hole formed by the notch of the adhesive sheet AS. [Selection diagram] Fig. 1

Description

  The present invention relates to a sheet sticking apparatus and a sticking method.

  2. Description of the Related Art Conventionally, there has been known a sheet sticking apparatus that sticks a fed adhesive sheet to an adherend and cuts the stuck adhesive sheet (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2016-39298

  Since the conventional sheet sticking apparatus as described in Patent Document 1 feeds out the protective tape while applying tension to the protective tape (adhesive sheet), as shown by an arrow in FIG. Tension acts from the peripheral edge portion of the hole CU formed by cutting in the direction toward the center portion in the width direction of the adhesive sheet AS. For this reason, as shown in FIG. 3B, the adhesive sheet AS is loosened and the central portion in the width direction hangs down. Since this sagging extends toward the downstream side of the feeding direction of the adhesive sheet AS, a part of the sagging may reach a position where the wafer WF is to be pasted. In this state, the adhesive sheet AS is pasted onto the pasting roller (pressing roller). When pressed against the adherend WK by PR, there is a disadvantage that wrinkles and bubbles are generated between the adhesive sheet AS and the adherend WK.

  The objective of this invention is providing the sheet sticking apparatus and sticking method which can stick an adhesive sheet so that a wrinkle and a bubble may not be formed between to-be-adhered bodies.

  The present invention employs the configurations described in the claims.

  According to the present invention as described above, since the sagging due to the loosening of the adhesive sheet is prevented, the adhesive sheet can be stuck so that no wrinkles or bubbles are formed between the adherend and the adherend.

  Moreover, if the adhesive sheet is blown to prevent dripping of the adhesive sheet, the adhesive sheet can be prevented from being damaged.

The side view which shows the sheet sticking apparatus which concerns on one Embodiment of this invention. Operation | movement explanatory drawing of the sheet sticking apparatus of FIG. (A), (B) is a figure which shows the malfunction example of the conventional sheet sticking apparatus. (C) is operation | movement explanatory drawing of the sheet sticking apparatus of FIG.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis that is orthogonal to the predetermined plane. To do. Furthermore, in the present embodiment, when viewed from the front side in FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis and “down” is the opposite direction, “ The “left” is the arrow direction of the X axis, “right” is the opposite direction, “front” is the front direction in FIG. 1 parallel to the Y axis, and “rear” is the opposite direction.

  In FIG. 1, the sheet sticking apparatus 10 is fed with a feeding means 20 that feeds the adhesive sheet AS to a position facing the adherend surface WF1 of a semiconductor wafer (hereinafter simply referred to as “wafer”) WF as an adherend. A pressing means 30 that presses and adheres the adhesive sheet AS to the adherend surface WF1, and a closed-loop cut that penetrates the adhesive sheet AS that is affixed to the adherend surface WF1, are provided, and an adhesive sheet portion is provided inside the cut. A cutting means 40 for forming and forming an unnecessary sheet US outside the cut, a winding means 50 for winding up the unnecessary sheet US, and a hole CU formed by cutting the adhesive sheet AS (see FIG. 3A) ), And a sag prevention means 60 for preventing the adhesive sheet AS from sagging due to the loosening of the peripheral edge portion thereof, and is disposed in the vicinity of the support means 70 for supporting the wafer WF.

  The feeding means 20 includes a support roller 21 that supports the original fabric RS having the adhesive sheet AS temporarily attached to one surface of the release sheet RL, guide rollers 22A and 22B that guide the original fabric RS, and a guide roller 22A. A load cell as a tension detecting means that supports a linear motion motor 23 as a driving device that supports a pressing member 23B sandwiching the raw fabric RS between its output shaft 23A and a guide roller 22B, and can measure the tension of the adhesive sheet AS. 24A, a peeling plate 24B as a peeling member for peeling the adhesive sheet AS from the peeling sheet RL, a driving roller 25 that is driven by a rotation motor 25A as a driving device and sandwiches the peeling sheet RL between the pinch roller 25B, and a peeling Of the above-mentioned components constituting the collecting roller 26 for collecting the sheet RL and the feeding means 20, the supporting roller 21 and A frame 27 that supports each member other than the collection roller 26, and a linear motor as a driving device that is supported by a slider 28A (see FIG. 2) of the linear motor 28 that supports the frame 27 by a slider (not shown). 29.

  The pressing means 30 can rotate via a bracket 33B to a linear motion motor 33 as a drive device supported by a slider 31A of a linear motor 31 as a drive device via a bracket 32, and to an output shaft 33A of the linear motion motor 33. And a pressing roller 34 as a pressing member that presses the adhesive sheet AS against the adherend surface WF1 of the wafer WF.

  The cutting means 40 includes an articulated robot 41 as a driving device and a cutting blade 42 supported by a work arm 41A of the articulated robot 41. The articulated robot 41 is a so-called six-axis robot that can displace the cutting blade 42 at any position and any angle within the working range.

  The winding means 50 includes a rotation motor 51 as a driving device supported by the slider 31B of the linear motor 31 via a bracket 51B, a frame 52 supported by the output shaft 51A of the rotation motor 51, and a frame 52. Driven by a rotation motor 53 as a supported drive device, the drive roller 54 sandwiches an unnecessary sheet US with a pinch roller 55, and a recovery roller driven by a drive device (not shown) to collect the unnecessary sheet US with a predetermined tension. 56 and a pedestal 57 that is supported by the slider 31B of the linear motor 31 and receives the frame 52.

  The sagging prevention means 60 is supported by the frame 27 and connected to the nozzle 61 as a gas blowing means for blowing a gas such as air or gas to the adhesive sheet AS, and connected to the nozzle 61 via a pipe 62A, and supplies the gas to the nozzle 61. Supply means 62 such as a pressure pump and a turbine.

  The support means 70 has a recess 71B capable of adsorbing and holding the wafer WF on the support surface 71A by a decompression means (not shown) such as a decompression pump or a vacuum ejector, and an adhesive sheet AS together with the wafer WF supported on the support surface 71A. A table 71 having an unnecessary sheet support surface 71C for supporting the unnecessary sheet US formed by cutting the means 40 is provided. The depth of the recess 71B is set to the same dimension as the thickness of the wafer WF.

In the sheet sticking apparatus 10 described above, a procedure for sticking the adhesive sheet AS to the adherend surface WF1 of the wafer WF will be described.
First, with respect to the sheet sticking apparatus 10 in which each member is waiting at an initial position indicated by a solid line in FIG. 1, a user of the sheet sticking apparatus 10 (hereinafter simply referred to as “user”) shows the original fabric RS. Set as shown by the solid line. Then, an automatic operation is instructed through an operation means (not shown) such as an operation panel or a personal computer, and a user or a transfer means (not shown) such as a conveyor or a drive device places the wafer WF on the support surface 71A of the table 71. Then, the support means 70 drives a decompression means (not shown), and the wafer WF is sucked and held by the support surface 71A.

  Thereafter, the winding means 50 drives the rotation motor 51 to rotate the frame 52 in the clockwise direction as indicated by a two-dot chain line in FIG. Next, the feeding means 20 and the winding means 50 drive the rotation motors 25A and 53, wind up the release sheet RL and the adhesive sheet AS, and the tension of the adhesive sheet AS located on the table 71 has reached a predetermined value. Is detected by the load cell 24A, the driving of the rotation motors 25A and 53 is stopped. Next, the feeding means 20 drives the linear motor 23 to sandwich the adhesive sheet AS between the pressing member 23B and the guide roller 22A, and suppresses the feeding of the adhesive sheet AS.

  Thereafter, the pressing means 30 drives the linear motor 33 to lower the pressing roller 34 and press the adhesive sheet AS against the unnecessary sheet support surface 71C with a predetermined pressure, as indicated by a two-dot chain line in FIG. Next, the pressing means 30 drives the linear motor 31 and moves the pressing roller 34 to the right as shown in FIG. 2, and the pressing roller 34 attaches the adhesive sheet AS to the adherend surface WF1 and the unnecessary sheet supporting surface 71C. Press to stick. At this time, when further tension is applied to the adhesive sheet AS along with the movement of the pressing roller 34, the feeding means 20 drives the linear motors 28 and 29 at the moment when the load cell 24A detects it, and the load cell 24A detects it. Control is performed to move the frame 27 in the left-right direction and the up-down direction so that the tension applied does not deviate from a predetermined value.

  When the application of the adhesive sheet AS is completed, the cutting means 40 drives the articulated robot 41, and as shown by a two-dot chain line in FIG. 2, the cutting blade 42 is pierced into the adhesive sheet AS, and the cutting blade 42 is attached to the wafer WF. Move along the perimeter. As a result, the adhesive sheet AS is provided with a closed-loop cut, the adhesive sheet portion left on the wafer WF is formed inside the cut, and the unnecessary sheet US is formed outside the cut. Next, when the wafer WF is transferred from the support surface 71A to the next process by a user or a transfer means (not shown), the winding means 50 drives the rotation motor 53, the linear motor 31 and a drive device (not shown), as shown in FIG. As indicated by a two-dot chain line, a hole CU is formed in the adhesive sheet AS by moving the frame 52 in the right direction and winding up the unnecessary sheet US. Thereafter, the pressing means 30 and the winding means 50 drive the linear motor 33 and the rotating motor 51 to separate the pressing roller 34 from the unnecessary sheet US and rotate the frame 52 counterclockwise to pinch rollers. 55 is also separated from the unnecessary sheet US. Next, after the feeding unit 20 drives the linear motor 29 and raises the frame 27 by a small amount to separate the unnecessary sheet US from the unnecessary sheet support surface 71C, the feeding unit 20 drives the linear motion motor 23 and presses the pressing member 23B. And the guide roller 22A are released from the sandwiching of the adhesive sheet AS.

  Then, in a state where the winding means 50 stops driving the rotation motor 53, each means drives each driving device and returns each member to the initial position. By this returning operation, the adhesive sheet AS having a predetermined feeding amount is peeled from the release sheet RL and is fed onto the table 71 with a predetermined tension. At this time, as shown by an arrow in FIG. 3A, tension acts from the peripheral portion of the hole CU formed by cutting the adhesive sheet AS toward the center in the width direction of the adhesive sheet AS. As shown in (B), the adhesive sheet AS is loosened and the central portion in the width direction hangs down. Thereafter, the sag prevention means 60 drives the supply means 62 and blows gas from the nozzle 61 toward the adhesive sheet AS. As a result, against the sagging caused by the loosening of the peripheral edge of the hole CU of the adhesive sheet AS, the center part in the width direction of the adhesive sheet AS is pushed up by the gas and swelled upward as shown by the solid line in FIG. Put out. As a result, when the pressing roller 34 is lowered, the bulging center portion in the width direction can gradually follow the pressing roller 34, and the adhesive sheet AS is pasted so that no wrinkles or bubbles are formed between the wafer WF and the wafer WF. can do. Thereafter, the wafer or the wafer WF is placed on the support surface 71A of the table 71 by a user or a transfer means (not shown), and thereafter the same operation as described above is repeated.

  According to the embodiment as described above, since the sagging due to the slack of the adhesive sheet AS is prevented, the adhesive sheet AS can be stuck so that no wrinkles or bubbles are formed between the wafer WF and the wafer WF.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.

For example, the feeding means 20 may be configured to feed the adhesive sheet AS that is not temporarily attached to the release sheet RL, and in this case, the release plate 24B may not be provided.
The feeding unit 20 may support the support roller 21 and the recovery roller 26 with a frame 27, and any device that can measure the tension of the adhesive sheet AS, such as a pressure sensor or a regulator, is used as the tension detection unit. Alternatively, the linear motion motor 23 may be omitted as a configuration in which the support roller 21 is supported by a drive device that can be driven and locked.
The feeding means 20 may move the frame 27 with a single drive device having two output shafts in the vertical direction and the horizontal direction, and the linear motors 28 and 29 are moved in the vertical direction and the horizontal direction, respectively. The linear motor 28 may be extended in a direction that is not perpendicular to each other, the linear motor 28 is supported by the slider of the linear motor 29, and the frame 27 is supported by the slider 28 </ b> A of the linear motor 28. Alternatively, the original fabric RS may be fed out from the support roller 21 as the pressing roller 34 moves rightward without using the linear motors 28 and 29.

  The cutting means 40 cuts into a different shape without cutting into the same shape as the adherend surface WF1 of the wafer WF as the shape of the adhesive sheet portion left on the wafer WF, or cuts larger than the adherend surface WF1. Alternatively, it may be cut smaller than the adherend surface WF1.

  The winding means 50 may omit the rotation motor 51, may wind up the unnecessary sheet US without moving the frame 52 in the right direction, and returns the feeding means 20 and the pressing means 30 to the initial positions. Then, the rotation motor 53 may be driven at a position indicated by a solid line in FIG. 2 to wind up the unnecessary sheet US.

As shown by the two-dot chain line in FIG. 3C, the sagging prevention means 60 may spray gas so that the adhesive sheet AS is substantially horizontal.
As shown by a two-dot chain line in FIG. 1, the sagging prevention means 60 may be provided with the nozzle 61 on the support means 70, or on the downstream side in the feeding direction of the adhesive sheet AS with respect to the sticking start position of the adhesive sheet AS. Alternatively, the gas may be blown toward the adhesive sheet AS that hangs down from the lower side of the adhesive sheet AS or from the upstream side in the feeding direction of the adhesive sheet AS.
The sagging prevention means lifts the center of the adhesive sheet AS in the width direction by holding means such as a suction pad or Bernoulli suction, or grips both ends of the adhesive sheet AS in the width direction by a gripping means such as a mechanical chuck or chuck cylinder. Then, the adhesive sheet AS may be prevented from drooping by being lifted up or pushed up by a member such as a roller or a stick from the adhesive surface side of the adhesive sheet AS.

  The support means 70 may be configured such that the depth of the recess 71B of the table 71 is greater than or equal to the thickness of the wafer WF, or may be less than the recess 71B, or may be configured not to be sucked and held. The configuration may include an inner table that supports the wafer WF and an outer table that supports the unnecessary sheet US, or may include a driving device that adjusts the height of the support surface 71A and the unnecessary sheet support surface 71C. Also good.

  Further, the material, type, shape and the like of the adhesive sheet AS and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS may be a circle, an ellipse, a polygon such as a triangle or a quadrangle, or other shapes, or may be of an adhesive form such as pressure sensitive adhesive or heat sensitive adhesive, When the heat-sensitive adhesive sheet AS is employed, it may be bonded by an appropriate method such as providing an appropriate coil heater for heating the adhesive sheet or a heating means such as a heat pipe. Such an adhesive sheet AS is, for example, a single layer having only an adhesive layer, an intermediate layer between the base sheet and the adhesive layer, a cover layer on the upper surface of the base sheet, etc. Three or more layers, or a so-called double-sided adhesive sheet that can peel the base sheet from the adhesive layer may be used. The double-sided adhesive sheet comprises a single-layer or multi-layer intermediate layer. It may be a single layer or a multilayer having no intermediate layer. Examples of the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes and the like can be attached to any adherend as described above.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, as long as the feeding means can feed the adhesive sheet to the position facing the adherend surface of the adherend, it is limited in any way as long as it is within the technical scope in light of the technical common sense at the beginning of the application. (There is no explanation for other means and steps).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).
In the above-described embodiment, when rollers are employed, a drive device that rotationally drives each roller may be provided, or the surface of each roller may be configured with a member capable of elastic deformation such as rubber or resin. In addition, each roller may be constituted by a member that does not elastically deform, or when a pressing means or pressing member such as a pressing roller or a pressing head is employed, instead of or in combination with those exemplified above, a roller , A pressing member made of a round bar, blade material, rubber, resin, sponge, etc., or a structure of pressing by blowing air such as air or gas, or a pressing means or pressing member The part may be formed of a member that can be elastically deformed, such as rubber or resin, or may be formed of a member that is not elastically deformed. Consists of rods, rollers, etc. Alternatively, when a structure that supports or holds a supported member such as a supporting (holding) means or a supporting (holding) member is employed, a gripping means such as a mechanical chuck or a chuck cylinder, coulomb force, adhesive In addition, a configuration in which the supported member is supported (held) by an adhesive, magnetic force, Bernoulli adsorption, a driving device, or the like may be employed, or when a cutting means or a cutting blade is employed, the configuration exemplified above may be used. Cutting blades, laser cutters, ion beams, thermal power, heat, water pressure, heating wires, cutting members such as spraying of gas or liquid, etc., or cutting with a combination of appropriate drive devices You may make it cut | disconnect by moving a member.

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 20 Feeding means 30 Pressing means 40 Cutting means 50 Winding means 60 Dripping prevention means 61 Gas blowing means 62 Supply means AS Adhesive sheet CU Hole US Unnecessary sheet WF Wafer (Substrate)
WF1 surface

Claims (3)

A feeding means for feeding the adhesive sheet to a position facing the adherend surface of the adherend;
A pressing means for pressing and sticking the drawn-out adhesive sheet to the adherend surface;
A cutting means for providing a closed loop-shaped cut through the adhesive sheet affixed to the adherend surface, and forming an unnecessary sheet outside the cut;
Winding means for winding the unnecessary sheet;
A sheet affixing device comprising: a drooping prevention means for preventing dripping of the adhesive sheet due to loosening of a peripheral edge of a hole formed by cutting the adhesive sheet.   The sheet sticking apparatus according to claim 1, wherein the sagging prevention means includes gas blowing means for blowing gas to the adhesive sheet, and supply means for supplying the gas to the gas blowing means. An unwinding step of feeding the adhesive sheet to a position facing the adherend surface of the adherend;
A pressing step of pressing and sticking the paid-out adhesive sheet to the adherend surface;
A cutting step of providing a closed loop-shaped cut that penetrates the adhesive sheet affixed to the adherend surface, and forming an unnecessary sheet outside the cut,
A winding step of winding up the unnecessary sheet;
And a sagging prevention step for preventing sagging of the adhesive sheet due to loosening of a peripheral edge of a hole formed by cutting the adhesive sheet.

Images