JP2009004213A - Light-transmitting conductive film, manufacturing method therefore, and light-transmitting electromagnetic wave shielding film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for obtaining a light-transmitting conductive film having high conductivity and light-transmittance, and to provide a light-transmitting electromagnetic wave shielding film using the light-transmitting conductive film. <P>SOLUTION: In the manufacturing method for the light-transmitting conductive film, a photosensitive material having at least one emulsion layer containing silver halide grains on a support is subjected to exposure, development, fixing, physical development, and plating to form a conductive metal portion. The physical development process consists of a silver ion solution step and a reducing solution step. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for producing a light transmissive conductive film, a light transmissive conductive film produced by the production method, and a light transmissive electromagnetic wave shielding film using the light transmissive conductive film.

  2. Description of the Related Art In recent years, with the increase in use of various electric facilities and electronic application facilities, electromagnetic interference (Electro-Magnetic Interference: EMI) has increased rapidly. It has been pointed out that the above-mentioned EMI causes malfunction and failure of electronic and electrical equipment, and also causes health problems for operators of these devices. For this reason, electronic and electronic equipment is required to keep the intensity of electromagnetic wave emission within the standard or regulation.

  Although it is necessary to shield the electromagnetic wave in order to take measures against the EMI, it is obvious that a property that does not allow the metal electromagnetic wave to penetrate may be used. For example, a method of making the casing a metal body or a high conductor, a method of inserting a metal plate between the circuit board and the circuit board, a method of covering the cable with a metal foil, and the like are adopted. However, in CRT, PDP, etc., since the operator needs to recognize characters displayed on the screen, transparency in the display is required. For this reason, in any of the above methods, the front surface of the display often becomes opaque, which is inappropriate as an electromagnetic wave shielding method.

  In particular, since PDP generates a larger amount of electromagnetic waves than CRT or the like, stronger electromagnetic shielding ability is required. The electromagnetic wave shielding ability can be simply expressed by a surface resistance value. For example, a translucent electromagnetic shielding material for CRT is required to have a surface resistance value of about 300 Ω / sq or less, whereas a translucent electromagnetic shielding material for PDP is required to be 2.5 Ω / sq or less. In addition, in a plasma plasma for consumer use using a PDP, there is a high need for 1.5 Ω / sq or less, and a very high conductivity of 0.1 Ω / sq or less is more desirable.

  Further, the required level of transparency is about 70% or more for CRT and 80% or more for PDP, and further higher transparency is desired.

  In order to solve the above problems, various materials and methods have been proposed so far that make use of a metal mesh having an opening as shown below to achieve both electromagnetic shielding properties and light transmission properties. As typical examples, etching processing using printing and photolithography, and a combination of ink jet and plating are recently known.

  However, in recent years, various circuits and the like have been miniaturized, and the electromagnetic shielding ability and transparency are both desired for a transparent conductive film for shielding electromagnetic waves by using a finer mesh. For this reason, pattern accuracy is insufficient in ink jet and printing, and in photolithography etching, there are problems that the process is complicated, complicated, and the production cost is high.

  Therefore, a method has been proposed in which a silver halide light-sensitive material is subjected to pattern exposure and then developed to produce a conductive pattern. However, a binder exists between silver particles, and high conductivity can be expected in development. Absent. In addition, plating after development has been proposed to assist conductivity, but electroless plating lacks the selectivity of plating and requires an adhesion treatment of a catalyst or the like. Even if it goes, it is difficult to obtain selectivity. Electrolytic plating requires prior conductivity for conducting electricity, so it is difficult to develop, and it is necessary to thicken the emulsion. Therefore, light transmittance is sacrificed.

  Further, a method has been proposed in which a silver halide photosensitive material is subjected to pattern exposure and development processing, and then physical development is performed to increase conductivity (for example, see Patent Document 1). However, the physical developer used in this physical development is an undeveloped silver halide that remains after development because the silver supply source is limited, so that the amount of silver supplied is limited, and the conductivity may be insufficient. The narrowly-defined physical developer to which ions are added has a drawback that the oxidation-reduction reaction proceeds in the physical developer in a short time, and the life of the solution is short.

In electroless copper plating having a function similar to that of physical development, it is difficult to selectively adhere to developed silver, so some pattern preparation technique is required. It is difficult to create a fine pattern by ink jet printing. Further, in electroplating, it is necessary to ensure conductivity in advance for conducting electricity, and in developed silver, it is difficult to ensure conductivity.
International Publication No. 06/98333 Pamphlet

  The present invention has been made in view of the above-mentioned problems, and its object is to provide a manufacturing method for obtaining a light-transmitting conductive film having high conductivity and light transmittance, and a light-transmitting electromagnetic wave using the light-transmitting conductive film. It is to provide a shielding film.

  The above object of the present invention is achieved by the following configurations.

  1. Method for producing a light-transmitting conductive film, wherein a photosensitive material having at least one emulsion layer containing silver halide grains on a support is exposed, developed, fixed, physically developed and plated to form a conductive metal part A method for producing a light-transmitting conductive film, wherein the physical development treatment comprises a silver ion solution treatment and a reducing solution treatment.

  2. 2. The method for producing a light-transmitting conductive film as described in 1 above, wherein in the physical development treatment, silver ion solution treatment and reducing solution treatment are alternately and continuously performed.

  3. 3. The method for producing a light-transmitting conductive film as described in 1 or 2 above, wherein the temperature of the physical development treatment is 20 ° C. or higher and 60 ° C. or lower.

  4). A light transmissive conductive film produced by the method for producing a light transmissive conductive film according to any one of 1 to 3 above.

  5). 5. A light-transmitting electromagnetic wave shielding film using the light-transmitting conductive film as described in 4 above.

  By the production method of the present invention, a light-transmitting conductive film having high conductivity and light transmittance was obtained, and a light-transmitting electromagnetic wave shielding film using the light-transmitting conductive film could be provided.

  The present invention relates to a light-transmitting conductive material in which a photosensitive material having at least one emulsion layer containing silver halide grains on a support is exposed, developed, fixed, physically developed and plated to form a conductive metal part. In the method for producing a film, the physical development treatment includes a silver ion solution treatment and a reducing solution treatment.

  Hereinafter, the present invention will be described in detail.

(Transparent support)
The transparent support used as the substrate of the light transmissive conductive film of the present invention is preferably transparent in the visible region and generally has a total light transmittance of 90% or more. Among these, a flexible resin film is particularly preferably used because it has excellent handleability and can be handled with a roll.

  Specific examples of the transparent resin film include polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), acrylic resins, epoxy resins, fluorine resins, silicone resins, polycarbonate resins, diacetate resins, triacetate resins, poly Single layer film of 30 to 300 μm in thickness composed of arylate resin, polyvinyl chloride, polysulfonic acid resin, polyether sulfonic acid resin, polyimide resin, polyamide resin, polyolefin resin, cyclic polyolefin resin, etc. or multiple layers composed of the transparent resin The composite film is mentioned.

[Subtracting processing]
By providing at least one reflectance lowering functional layer between the light transmissive conductive film (patterned layer made of conductive metal) and the support, and adjusting the refractive index of this reflectance lowering functional layer, Preventing the maximum absolute reflectivity from exceeding the maximum absolute reflectivity of the support alone minimizes adverse effects on the film surface, and provides a transparent conductive film with low haze and high transparency. This is a preferred embodiment from the viewpoint of easy formation. In addition, the aspect in which this reflectance fall functional layer serves as the pattern formation layer by an electroconductive metal and the contact bonding layer of a support body is preferable.

  Further, the film thickness of the reflectance lowering functional layer is not particularly limited, but an embodiment in which the film thickness is 0.2 to 2 times the film thickness of the pattern forming layer made of a conductive metal is preferable, and more preferably In this embodiment, the film thickness is 0.5 to 1.5 times. Further, from the viewpoint of improving the coating uniformity, the thickness of the reflectance-reducing functional layer is preferably 400 nm or less, and more preferably 200 nm or less. In addition, this reflectance fall functional layer may be comprised from the several layer.

  As the binder preferably used in the reflectance lowering functional layer, for example, gelatin, gelatin derivatives, gelatin and other polymer graft polymers, various latexes, water-soluble polymers, and the like can be preferably used.

Moreover, the aspect which adjusts a refractive index by adding a metal oxide to a reflectance fall functional layer is especially preferable. Examples of metal oxides are preferably ZnO, TiO ₂ , SnO ₂ , Al ₂ O ₃ , In ₂ O ₃ , SiO ₂ , MgO, BaO, MoO ₂ , V ₂ O _5, or a composite oxide thereof. In particular, SnO ₂ (tin oxide) is preferable from the viewpoints of miscibility with the binder, conductivity, and transparency. As an example including a different element, Sb, Nb, a halogen element, or the like can be added to SnO ₂ .

  Further, an aspect in which the maximum absolute reflectance of the visible region on the conductive pattern forming surface side is larger than the maximum absolute reflectance on the opposite surface side can be preferably used. When this light-transmitting conductive film is attached to a substrate such as glass and used, when the conductive pattern forming surface is attached to the substrate with an adhesive or the like, the improvement in visibility becomes significant. This is a particularly preferred embodiment.

[Silver halide emulsion-containing layer]
In the light-transmitting conductive film of the present invention, a silver halide emulsion-containing layer containing a photosensitive silver halide and a binder, which will be described later, is provided on the support. A film agent, a hardener, an activator and the like can be contained.

The content of the photosensitive silver halide, aspects in terms of silver is less than 0.05 g / m ² or more 3 g / m ² are preferred, particularly preferably less than 0.3 g / m ² or more 1 g / m ² in terms of silver It is a certain aspect. When the photosensitive silver halide content is less than 0.05 g / m ² , it is difficult to obtain sufficient electromagnetic wave shielding performance. This is presumably because the amount of developed silver nuclei serving as a catalyst for physical development or metal plating treatment described later becomes insufficient, and it becomes difficult to form an effective conductive mesh.

The amount of the binder of the light-sensitive material is 10 mg / m ² or more and 0.2 g / m ² or less, which is a particularly preferable embodiment from the viewpoint of achieving both conductivity and film properties. When the amount of the binder is less than 10 mg / m ^2, the amount of silver halide relative to the binder is relatively increased, so that the coating is fragile and it is difficult to maintain sufficient coating strength. On the other hand, when the amount of the binder is more than 0.2 g / m ² , the distance between the photosensitive silver halide grains is increased, so that it is difficult to form a developed silver network and it is difficult to form an effective conductive mesh. At the same time, durability against temperature and humidity changes becomes insufficient.

[Silver halide grains]
The composition of the silver halide grains used in the light transmissive conductive film of the present invention may be any halogen such as silver chloride, silver bromide, silver chlorobromide, silver iodobromide, silver chloroiodobromide, silver chloroiodide, etc. It may have a composition.

  In order to reduce the surface specific resistance after silver halide grains are developed to become metallic silver grains and effectively shield electromagnetic waves, the contact area between developed silver grains needs to be as large as possible. For that purpose, in order to increase the surface area ratio, the smaller the silver halide grain size, the better.However, too small grains tend to aggregate and form large agglomerates. Exists.

  The average grain size of the silver halide grains is preferably 0.01 to 0.5 [mu] m, more preferably 0.03 to 0.3 [mu] m in terms of a sphere equivalent diameter. In addition, the sphere equivalent diameter of silver halide grains represents the diameter of grains having the same volume and having a spherical shape. The average grain size of silver halide grains is the temperature at the time of preparation of silver halide grains, pAg, pH, addition rate of silver ion solution and halogen solution, grain size control agent (for example, 1-phenyl-5-mercaptotetrazole, 2-mercaptobenzimidazole, benztriazole, tetrazaindene compounds, nucleic acid derivatives, thioether compounds, etc.) can be appropriately combined and controlled.

When coating a silver halide emulsion, an embodiment in which the value obtained by dividing the coating silver amount (g / m ² ) by the particle size (μm) is 6 or more and 25 or less is preferable. When a large amount of photosensitive silver halide having a relatively small particle size is used, this value tends to be larger than 25. In this case, the silver halide grains are likely to slip off from the coating at the edge when the film is cut. Tend to be. In addition, when a small amount of photosensitive silver halide having a relatively large particle size is used, this value tends to be smaller than 6, and in this case, the number of photosensitive silver halide grains in a unit area is reduced. This is because it tends to decrease.

  The shape of the silver halide grains is not particularly limited. For example, various shapes such as a spherical shape, a cubic shape, a flat plate shape (hexagonal flat plate shape, triangular flat plate shape, quadrangular flat plate shape, etc.), octahedral shape, tetrahedral shape, etc. It can be in shape. In order to increase the sensitivity, tabular grains having an aspect ratio of 2 or more, 4 or more, and further 8 to 16 can be preferably used.

  The particle size distribution is not particularly limited, but a narrow distribution is preferable from the viewpoint of sharply reproducing the outline of the pattern during pattern formation by exposure and enhancing transparency while maintaining high conductivity. The particle size distribution of silver halide grains used in the light-sensitive material is preferably monodispersed silver halide grains having a coefficient of variation of 0.22 or less, more preferably 0.15 or less. Here, the variation coefficient is a coefficient representing the breadth of the particle size distribution and is defined by the following equation.

Coefficient of variation = S / R (wherein S represents the standard deviation of the particle size distribution and R represents the average particle size)
The silver halide grains may further contain other elements. For example, in a silver halide emulsion, it is also useful to dope metal ions used to obtain a high-contrast emulsion. In particular, Group 8-10 metal ions such as iron ion, rhodium ion, ruthenium ion and iridium ion are preferably used because the difference between the exposed portion and the unexposed portion tends to be clearly generated when the metal silver image is generated.

  These metal ions can be added to the silver halide emulsion in the form of a salt or a complex salt. Transition metal ions represented by rhodium ions and iridium ions can also be compounds having various ligands. Examples of such a ligand include cyanide ions, halogen ions, thiocyanate ions, nitrosyl ions, water, hydroxide ions, and the like. Specific examples of the compound include potassium bromide rhodate and potassium iridate.

The content of the metal ion compound contained in the silver halide is preferably 10 ⁻¹⁰ to 10 ⁻² mol / mol Ag per mol of silver halide, and 10 ⁻⁹ to 10 ⁻³ mol / mol. More preferably, it is Ag.

  In order to make the silver halide grains contain the above metal ions, in the silver halide grain forming step, the metal compound is formed before the silver halide grains are formed and during the formation of the silver halide grains. What is necessary is just to add in the arbitrary places in each process during physical ripening, such as after. Moreover, in addition, the solution of a heavy metal compound can be continuously performed over the whole particle formation process or a part.

  In order to further improve the sensitivity, chemical sensitization performed with a silver halide emulsion can be performed. As chemical sensitization, for example, noble metal sensitization such as gold, palladium and platinum sensitization, chalcogen sensitization such as sulfur sensitization with inorganic sulfur or organic sulfur compounds, reduction sensitization such as tin chloride and hydrazine, etc. are used. be able to.

  The silver halide grains are preferably subjected to spectral sensitization. Preferred spectral sensitizing dyes include cyanine, carbocyanine, dicarbocyanine, complex cyanine, hemicyanine, styryl dye, merocyanine, complex merocyanine, holopolar dye, and the like. Can be used alone or in combination. Particularly useful dyes are cyanine dyes, merocyanine dyes, and complex merocyanine dyes. These sensitizing dyes may be used alone or in combination. A combination of sensitizing dyes is often used for the purpose of supersensitization.

  In order to incorporate these sensitizing dyes in a silver halide emulsion, they may be dispersed directly in the emulsion, or water, methanol, propanol, methyl cellosolve, 2,2,3,3-tetrafluoro A solvent such as propanol may be added alone or in a mixed solvent and added to the emulsion.

  Further, as described in JP-B Nos. 44-23389, 44-27555, and 57-22089, an acid or a base is allowed to coexist to form an aqueous solution, or US Pat. No. 3,822,135. As described in the specifications of US Pat. No. 4,006,025, an aqueous solution or a colloidal dispersion prepared by coexisting a surfactant such as sodium dodecylbenzenesulfonate may be added to the emulsion. Further, after being dissolved in a substantially immiscible solvent such as phenoxyethanol, it may be added to the emulsion after being dispersed in water or a hydrophilic colloid. As described in JP-A Nos. 53-102733 and 58-105141, they may be directly dispersed in a hydrophilic colloid and the dispersion added to the emulsion.

  In the silver halide emulsion-containing layer used in the light-transmitting conductive film of the present invention, the silver halide grains are uniformly dispersed, and the silver halide grains are supported on the support, and the silver halide emulsion-containing layer and the support are supported. A binder is used for the purpose of ensuring the adhesion of the body. The binder that can be used is not particularly limited, and both water-insoluble polymers and water-soluble polymers can be used. From the viewpoint of improving developability, it is preferable to use a water-soluble polymer.

  It is advantageous to use gelatin as a binder in the light-sensitive material, but if necessary, gelatin derivatives, gelatin and other polymer graft polymers, proteins other than gelatin, sugar derivatives, cellulose derivatives, mono- or copolymers It is also possible to use hydrophilic colloids such as synthetic hydrophilic polymer substances such as

[Ultraviolet absorber]
In the light transmissive conductive film of the present invention, it is preferable to use an ultraviolet absorber in order to avoid deterioration due to ultraviolet rays.

  As the ultraviolet absorber, known ultraviolet absorbers such as salicylic acid compounds, benzophenone compounds, benzotriazole compounds, S-triazine compounds, cyclic imino ester compounds, and the like can be preferably used. Of these, benzophenone compounds, benzotriazole compounds, and cyclic imino ester compounds are preferred. As what is blended with the polyester, a cyclic imino ester compound is particularly preferable.

  There are no particular restrictions on the layer to which these UV absorbers are added, but from the viewpoint of preventing deterioration of the binder used in the silver halide emulsion-containing layer due to UV rays, it can be added directly to the silver halide emulsion-containing layer or halogenated. An embodiment in which the layer is provided closer to outside light than the silver emulsion-containing layer is preferable.

  When added to a silver halide emulsion-containing layer or a layer adjacent thereto, preferred ultraviolet absorbers include benzotriazoles. For example, in general formula [III-3] described in JP-A-1-250944 Compounds shown by the general formula [III] described in JP-A-64-66646, UV-1L to UV-27L described in JP-A-63-187240, and JP-A-4-1633 A compound represented by the general formula [I], a compound represented by the general formulas (I) and (II) described in JP-A No. 5-165144 is preferably used.

  These ultraviolet absorbers are, for example, high-boiling organic materials represented by phthalates such as dioctyl phthalate, di-i-decyl phthalate, and dibutyl phthalate, and phosphate esters such as tricresyl phosphate and trioctyl phosphate. An embodiment in which it is added in a dispersed form in a solvent is preferably used. Moreover, the aspect which adds these ultraviolet absorbers directly to a support body is also used preferably, In this case, the aspect as described in the Japanese translations of PCT publication No. 2004-531611 can also be used preferably, for example.

[High contrast agent]
In the light-transmitting conductive film of the present invention, it is preferable that the photosensitive material has a high contrast in order to draw a conductive pattern with a clear edge. As the method, the silver chloride content is increased to narrow the particle size distribution. It is preferable to use a hydrazine compound or a tetrazolium compound as a contrast enhancer. The hydrazine compound is a compound having a —NHNH— group, and a typical one is represented by the following general formula (1).

General formula (1) T-NHNHCO-V, T-NHNHCOCO-V
In the formula, each T represents an optionally substituted aryl group or heterocyclic group. The aryl group represented by T includes a benzene ring or a naphthalene ring, and this ring may have a substituent, and as a preferable substituent, a linear or branched alkyl group (preferably having 1 to 20 carbon atoms). Methyl group, ethyl group, isopropyl group, n-dodecyl group, etc.), alkoxy group (preferably C2-C21 methoxy group, ethoxy group, etc.), aliphatic acylamino group (preferably C2-C21 alkyl group) An acetylamino group, a heptylamino group, etc.), an aromatic acylamino group, and the like. Besides these, for example, the substituted or unsubstituted aromatic ring as described above is -CONH-, -O-, Also included are those bonded by a linking group such as —SO ₂ NH—, —NHCONH—, —CH ₂ CH═N—, and the like.

  V represents a hydrogen atom, an optionally substituted alkyl group (methyl group, ethyl group, butyl, trifluoromethyl group, etc.), aryl group (phenyl group, naphthyl group), heterocyclic group (pyridyl group, piperidyl group, pyrrolidyl group) , Furanyl group, thiophene group, pyrrole group and the like).

  The above hydrazine compound can be synthesized with reference to the description in US Pat. No. 4,269,929. The hydrazine compound can be contained in the silver halide grain-containing layer, in the hydrophilic colloid layer adjacent to the silver halide grain-containing layer, or in another hydrophilic colloid layer.

  Particularly preferred hydrazine compounds are listed below.

(H-1): 1-trifluoromethylcarbonyl-2-{[4- (3-n-butylureido) phenyl]} hydrazine (H-2): 1-trifluoromethylcarbonyl-2- {4- [ 2- (2,4-di-t-pentylphenoxy) butyramide] phenyl} hydrazine (H-3): 1- (2,2,6,6-tetramethylpiperidyl-4-amino-oxalyl) -2- { 4- [2- (2,4-di-t-pentylphenoxy) butyramide] phenyl} hydrazine (H-4): 1- (2,2,6,6-tetramethylpiperidyl-4-amino-oxalyl)- 2- {4- [2- (2,4-di-t-pentylphenoxy) butyramide] phenylsulfonamide} hydrazine (H-5): 1- (2,2,6,6-tetramethylpiperidyl-4- Amino- Oxalyl) -2- {4- [3- (4-chlorophenyl-4-phenyl-3-thia) butanamide] benzenesulfonamide} hydrazine (H-6): 1- (2,2,6,6-tetramethyl Piperidyl-4-amino-oxalyl) -2- (4- (3-thia-6,9,12,15-tetraoxatricosanamide) benzenesulfonamido) phenylhydrazine (H-7): 1- (1- Methylenecarbonylpyridinium) -2- (4- (3-thia-6,9,12,15-tetraoxatricosanamide) benzenesulfonamido) phenylhydrazine chloride.

  When hydrazine is used as the thickening agent, an amine compound or a pyridine compound can be preferably used in order to enhance the reducing action of hydrazine. As the amine compound that promotes the reducing action of the hydrazine compound, it is particularly preferable that the molecule has at least one piperidine ring or pyrrolidine ring, at least one thioether bond, and at least two ether bonds.

  In addition to the above-described amine compounds, pyridinium compounds and phosphonium compounds can also be preferably used as compounds that promote the reduction action of hydrazine. Since onium compounds are positively charged, they are adsorbed on silver halide grains that are negatively charged and promote electron injection from the developing agent during development, thereby promoting high contrast. It has been.

  As preferred pyridinium compounds, reference can be made to bispyridinium compounds described in JP-A-5-53231 and JP-A-6-242534. Particularly preferred pyridinium compounds are those in which a bispyridinium body is formed by linking at the 1-position or 4-position of pyridinium. In the salt, as the halogen anion, chlorine ion, bromine ion and the like are preferable, and other examples include boron tetrafluoride ion and perchlorate ion, and chlorine ion or boron tetrafluoride ion is preferable.

The hydrazine compound, amine compound, pyridinium compound, and tetrazolium compound are preferably contained in an amount of 1 × 10 ^{−6 to} 5 × 10 ⁻² mol per mol of silver halide, particularly 1 × 10 ⁻⁴ to 2 × 10 ^−2. Mole is preferred. It is easy to adjust the addition amount of these compounds to increase the degree of contrast γ to 6 or more.

  These compounds are used by being added to a layer containing halogenated particles or another hydrophilic colloid layer. If it is water-soluble, add it to an aqueous solution, and if it is water-insoluble, add it to a silver halide grain solution or hydrophilic colloid solution as a solution of an organic solvent miscible with water, such as alcohols, esters, and ketones. Good.

〔exposure〕
In the light-sensitive material having a silver halide emulsion-containing layer used for the light-transmitting conductive film of the present invention, the light-sensitive material is exposed to form a conductive pattern by development and intensification processing described later. Examples of the light source used for exposure include light such as visible light and ultraviolet light, radiation such as electron beam and X-ray, and ultraviolet light or near infrared light is preferably used. Further, a light source having a wide wavelength distribution may be used for exposure, or a light source having a narrow wavelength distribution may be used.

  Various light emitters that emit light in the spectral region are used as necessary for visible light. For example, one or more of a red light emitter, a green light emitter, and a blue light emitter are mixed and used. The spectral region is not limited to the above red, green, and blue, and phosphors that emit light in the yellow, orange, purple, or infrared region are also used. An ultraviolet lamp is also preferable, and g-line of a mercury lamp, i-line of a mercury lamp, etc. are also used.

  The exposure can also be performed using various laser beams. For example, scanning using monochromatic high-density light such as gas laser, light emitting diode, semiconductor laser, semiconductor laser, or second harmonic light source (SHG) that combines nonlinear laser and solid state laser using semiconductor laser as excitation light source An exposure method can be preferably used, and a KrF excimer laser, ArF excimer laser, F2 laser, or the like can also be used. Specifically, as the laser light source, an ultraviolet semiconductor, a blue semiconductor laser, a green semiconductor laser, a red semiconductor laser, a near infrared laser, or the like is preferably used.

  The method for exposing the silver halide emulsion-containing layer in the form of an image may be performed by surface exposure using a photomask or by scanning exposure using a laser beam. At this time, condensing exposure using a lens or reflection exposure using a reflecting mirror may be used, and exposure methods such as surface contact exposure, near field exposure, reduced projection exposure, and reflection projection exposure can be used. The output of the laser used for the exposure varies depending on the sensitivity of the silver halide grains, the exposure speed, and the optical system of the apparatus, but an aspect of about several tens of μW to 5 W is preferable.

[Development processing]
The light-sensitive material having a silver halide emulsion-containing layer used for the light-transmitting conductive film of the present invention is subjected to development processing after exposure. The development process is preferably a so-called black-and-white development process that does not contain a color developing agent.

  As the developing solution, in addition to hydroquinones such as hydroquinone, sodium hydroquinonesulfonate, chlorohydroquinone and the like as developing agents, 1-phenyl-3-pyrazolidone, 1-phenyl-4,4-dimethyl-3-pyrazolidone, 1- Use in combination with pyrazolidones such as phenyl-4-methyl-4-hydroxymethyl-3-pyrazolidone, 1-phenyl-4-methyl-3-pyrazolidone and superadditive developing agents such as N-methylparaaminophenol sulfate. Can do. Further, a reductone compound such as ascorbic acid or isoascorbic acid can be used in combination with the superadditive developing agent without using hydroquinone.

  Further, sodium sulfite salt or potassium sulfite salt as a preservative, sodium carbonate salt or potassium carbonate salt as a buffering agent, diethanolamine, triethanolamine, diethylaminopropanediol or the like as a development accelerator can be appropriately used in the developing solution.

  The development processing performed after exposure can also include physical development before fixing. The term “physical development before fixing” as used herein refers to a process of reinforcing developed silver by supplying silver ions from outside the silver halide grains having a latent image by exposure before performing a fixing process described later.

  As a specific method for supplying silver ions from the developing solution, for example, a method of dissolving silver nitrate or the like in advance in a developing solution and dissolving silver ions, or sodium thiosulfate in the developing solution, Examples include a method in which a silver halide solvent such as ammonium thiocyanate is dissolved, unexposed silver halide is dissolved during development, and development of silver halide grains having a latent image is supplemented. It is preferable to use a formulation in which a silver halide solvent is preliminarily dissolved in a developing solution because a decrease in the transmittance of the film due to fogging in unexposed areas can be suppressed.

  In the development process, after the development of the exposed silver halide grains, a fixing process is performed for the purpose of removing and stabilizing the unexposed silver halide grains. For the fixing process, a fixer formulation used for photographic film, photographic paper, and the like using silver halide grains can be used.

  The fixing solution used in the fixing process can use sodium thiosulfate, potassium thiosulfate, ammonium thiosulfate, ammonium thiocyanate, or the like as a fixing agent. As a hardening agent at the time of fixing, aluminum sulfate, chromium sulfate, or the like can be used. As the fixing agent preservative, sodium sulfite, potassium sulfite, ascorbic acid, erythorbic acid and the like described in the developing solution can be used, and citric acid, oxalic acid, and the like can be used.

  In the washing water used in the subsequent washing step, N-methyl-isothiazol-3-one, N-methyl-isothiazol-5-chloro-3-one, N-methyl-isothiazole- 4,5-dichloro-3-one, 2-nitro-2-bromo-3-hydroxypropanol, 2-methyl-4-chlorophenol, hydrogen peroxide, and the like can be used.

[Physical development processing]
The light-sensitive material having a silver halide emulsion-containing layer used in the light-transmitting conductive film of the present invention assists the contact between developed silver formed by the above-described development processing, and is subjected to physical development processing in order to increase conductivity. Preferably it is done.

  In the present invention, the physical development process means a process for increasing the conductivity by supplying a conductive material source not contained in the photosensitive material in advance during or after the development process. More specifically, it means that silver ions or silver complex ions are reduced with a reducing agent on the core of a metal or metal compound to deposit metal silver.

  A normal physical developer is composed of silver ions or silver complex ions and a reducing agent. However, since they are in the same bath, the reduction reaction proceeds in the solution and the durability as a processing solution is poor. In the present invention, the silver ion solution and the reducing solution are treated as separate baths, and further treated as separate baths alternately and continuously, high conductivity is obtained and durability as a treatment solution is improved.

  The supply source of silver ions or silver complex ions in the silver ion solution is not particularly limited, but a silver nitrate aqueous solution or the like is preferably used.

  The reducing agent in the reducing solution is not particularly limited, but in addition to hydroquinones such as hydroquinone, sodium hydroquinone sulfonate and chlorohydroquinone, 1-phenyl-3-pyrazolidone, 1-phenyl-4,4-dimethyl Pyrazolidones such as -3-pyrazolidone, 1-phenyl-4-methyl-4-hydroxymethyl-3-pyrazolidone, 1-phenyl-4-methyl-3-pyrazolidone, N-methylparaaminophenol sulfate, etc., ascorbine An acid, isoascorbic acid, etc. can be used.

  Further, a complexing agent, a pH buffering agent, a pH adjusting agent, an antioxidant and the like can be used alone or in combination in the reducing solution.

  In the present invention, the processing temperature of the silver ion solution and the reducing solution is 20 ° C. or more and 60 ° C. or less.

[Plating treatment]
For the plating treatment, various conventionally known plating methods can be used. For example, electrolytic plating and electroless plating can be performed alone or in combination. Among them, it is possible to preferably use electrolytic plating that has high plating efficiency and is less likely to cause a decrease in transmittance due to plating adhesion to unnecessary portions.

  As a metal that can be used for electrolytic plating, for example, copper, nickel, cobalt, tin, silver, gold, platinum, and other various alloys can be used, but the plating process is relatively easy and has high conductivity. From the viewpoint that it is easy to obtain, it is particularly preferable to use electrolytic copper plating.

  An embodiment in which the amount of metal applied by physical development or metal plating is 10 times or more and 100 times or less in terms of mass with respect to developed silver obtained by exposing and developing the photosensitive material is preferable. This value can be determined by quantifying the metal contained in the photosensitive material by, for example, fluorescent X-ray analysis before and after physical development or metal plating.

  When the amount of metal imparted by physical development or metal plating is less than 10 times in terms of mass relative to developed silver obtained by exposing and developing a photosensitive material, the conductivity tends to decrease slightly. If it is more than 100 times, the transmittance tends to decrease due to metal deposition on unnecessary portions other than the conductive pattern portion.

[Oxidation treatment]
The photosensitive material having a silver halide emulsion-containing layer used for the light-transmitting conductive film of the present invention can be oxidized after development, physical development, and plating. By the oxidation treatment, unnecessary metal components can be ionized and dissolved and removed, and the transmittance of the light-transmitting conductive film can be further increased.

  As the treatment liquid used for the oxidation treatment, for example, a treatment method using an aqueous solution containing Fe (III) ions, or hydrogen peroxide, persulfate, perborate, perphosphate, percarbonate, percarbonate, A treatment liquid containing a conventionally known oxidizing agent such as a method of treatment using an aqueous solution containing a peroxide such as a halogenate, a hypohalite, a halogenate, or an organic peroxide can be used.

  A mode in which the oxidation treatment is performed after the development processing is completed and before the plating processing is a preferable mode because the transmittance can be improved efficiently in a short time processing, and a mode in which the physical processing is preferably performed is particularly preferable. It is.

[Blackening treatment]
The light-sensitive material having a silver halide emulsion-containing layer used for the light-transmitting conductive film of the present invention is preferably subjected to blackening after completion of metal plating from the viewpoint of preventing reflection of external light on the film surface. .

  When such a blackened light-transmitting conductive film is used, for example, in a display such as a PDP, it is possible to reduce a decrease in contrast due to reflection of external light and to make the color tone of the screen black when not in use. It is preferable that it can be maintained. The blackening treatment method is not particularly limited, and known methods can be used alone or in combination as appropriate.

  For example, when the outermost surface of the conductive pattern is made of metallic copper, it is immersed in an aqueous solution containing sodium chlorite, sodium hydroxide, or trisodium phosphate, or oxidized, or copper pyrophosphate or pyrroline. A method of blackening by dipping in an aqueous solution containing potassium acid and ammonia and performing electrolytic plating can be preferably used.

  If the outermost layer of the conductive pattern is made of a nickel-phosphorus alloy film, it is immersed in an acidic blackening solution containing copper (II) chloride or copper (II) sulfate, nickel chloride or nickel sulfate, and hydrochloric acid. The method to do can be used preferably.

  In addition to the above-described method, blackening treatment can be performed by a method of finely roughening the surface, but from the viewpoint of maintaining high conductivity, blackening by oxidation rather than finer surface roughening is possible. The method of crystallization treatment is preferred.

[Configuration of light-transmitting electromagnetic wave shielding film]
The light-transmitting electromagnetic wave shielding film of the present invention is a conductive metal pattern by drawing a lattice-like fine line pattern by exposure and then performing development processing or the like in order to provide high light-transmitting property and high electromagnetic wave shielding performance. Is preferably formed. The conductive metal pattern is preferably an orthogonal mesh pattern, preferably having a line width of 30 μm or less and a line interval of 100 μm or more.

  In addition, the conductive metal portion may have a portion whose line width is larger than 30 μm for the purpose of ground connection or the like. From the viewpoint of making the image inconspicuous, the line width of the conductive metal portion is preferably less than 18 μm, more preferably less than 15 μm, still more preferably less than 14 μm, and most preferably less than 10 μm.

  From the viewpoint of visible light transmittance, the conductive metal part preferably has an aperture ratio of 85% or more, more preferably 90% or more, and most preferably 92% or more. The aperture ratio is the proportion of the entire portion of the mesh without fine lines. For example, the aperture ratio of a square grid mesh with a line width of 10 μm and a pitch of 200 μm is 90%.

[Functional film of electromagnetic shielding film]
When the light-transmitting electromagnetic wave shielding film of the present invention is used in combination with, for example, an optical filter for a plasma display panel (PDP), a near infrared absorbing dye layer below the silver halide grain layer is used. It is also preferable to provide an infrared absorption layer. In some cases, the near-infrared absorbing layer may be provided on the opposite side of the support to the silver halide grain layer side, or may be provided on both the silver halide grain layer side and the opposite side. A near-infrared absorbing layer can be provided between the silver halide grain layer containing silver halide and the support, or a near-infrared absorbing layer can be provided on the opposite side of the support as viewed from the silver halide grain layer. The former is preferred because it can be applied simultaneously with one side of the support.

  Specific examples of near-infrared absorbing dyes include polymethine, phthalocyanine, naphthalocyanine, metal complex, aminium, imonium, diimonium, anthraquinone, dithiol metal complex, naphthoquinone, indolephenol, azo And triallylmethane-based compounds.

  The PDP optical filter is required to have near-infrared absorptivity mainly for absorption of heat rays and noise prevention of electronic devices. For this purpose, a dye having a near-infrared absorbing ability having a maximum absorption wavelength of 750 to 1100 nm is preferable, and a metal complex, aminium, phthalocyanine, naphthalocyanine, diimonium, and squalium compound are particularly preferable.

  As the near-infrared absorbing dye, the diimonium compound is IRG-022, IRG-040 (above, manufactured by Nippon Kayaku Co., Ltd.), and the nickel dithiol complex compound is SIR-128, SIR-130, SIR-132, SIR-159. SIR-152, SIR-162 (manufactured by Mitsui Chemicals, Inc.), and phthalocyanine compounds may be commercially available products such as IR-10, IR-12 (manufactured by Nippon Shokubai Co., Ltd.).

  The near-infrared absorbing dye may be used after being dissolved in an organic solvent such as alcohol solvents such as methanol, ethanol and isopropanol, ketone solvents such as acetone, methyl ethyl ketone and methyl butyl ketone, dimethylsulfoxide, dimethylformamide, dimethyl ether and toluene. It is preferable to apply fine particles having an average particle size of 0.01 to 10 μm with a fine particle machine, and the addition amount is preferably used in the range of 0.05 to 3.0 concentration at the maximum wavelength.

  In addition, when making the color tone correction | amendment layer contain the pigment | dye which has near-infrared absorptivity, you may contain any 1 type in said pigment | dye, and may contain 2 or more types.

  When the light-transmitting electromagnetic wave shielding film of the present invention is used in combination with, for example, an optical filter for a plasma display panel (PDP), in order to prevent a decrease in color reproducibility due to emission of neon gas used for PDP, As a countermeasure, an embodiment containing a dye that absorbs light near 595 nm is preferable.

  Specific examples of the dye that absorbs the specific wavelength include, for example, azo, condensed azo, phthalocyanine, anthraquinone, indigo, perinone, perylene, dioxazine, quinacridone, and methine. And well-known organic pigments and organic dyes such as isoindolinone, quinophthalone, pyrrole, thioindigo, and metal complex, and inorganic pigments. Of these, phthalocyanine-based and anthraquinone-based dyes are particularly preferably used because of their good weather resistance.

  When the light-transmitting electromagnetic wave shielding film is used for the purpose of protecting the display screen, it is preferable to provide an antireflection layer. As the antireflection layer, inorganic materials such as metal oxides, fluorides, silicides, borides, carbides, nitrides, sulfides, etc., can be used by vacuum deposition, sputtering, ion plating, ion beam assist, etc. A method of laminating a thin film in a layer or a multilayer, a method of laminating a resin having a different refractive index such as an acrylic resin or a fluororesin into a single layer or a multilayer can be used.

  In the light-transmitting electromagnetic wave shielding film, when the antireflection layer is formed on the opposite side of the support metal with respect to the layer having the conductive metal pattern, the protective film is first formed after the antireflection layer is formed. An embodiment in which the conductive pattern layer is formed after pasting is preferable. When the antireflection layer is formed after the conductive pattern is formed first, the efficiency of the plasma treatment and corona treatment performed to improve the adhesion between the antireflection layer and the support tends to be reduced. The embodiment in which the layer is formed first is preferred.

  In addition, when the antireflection layer is formed first, from the viewpoint of preventing the layer from being deteriorated by development, plating treatment, etc., a mode in which a conductive pattern layer is formed after pasting a protective film in advance is preferable. .

  As the protective film, a commercially available protective film can be used, but the thickness of the film is 10 μm from the viewpoint of easy application of a photosensitive silver halide emulsion layer for forming a conductive pattern. The thickness is preferably 100 μm or less and particularly preferably 20 μm or more and 60 μm or less. If the thickness is less than 10 μm, the rigidity of the film is remarkably reduced, so that the work efficiency of the protection film is likely to be reduced, and if it is thicker than 100 μm, a failure such as a winding wrinkle is likely to occur when the film is wound. is there.

  Although there is no restriction | limiting in particular in the kind of adhesive used for a protective film, The thing which does not damage an antireflection film at the time of peeling, without altering an antireflection film is used preferably. From such a viewpoint, an acrylic or silicon adhesive is preferably used. Moreover, as the adhesive force, what is 0.08-0.6N / 25mm is used preferably.

[Adhesive]
In order to attach the light-transmitting conductive film of the present invention to a transparent substrate, the pressure-sensitive adhesive that can be used is not particularly limited as long as it has high transparency and has an appropriate adhesive force. Agents, rubber adhesives, silicon adhesives, and the like can be preferably used. Among these, from the viewpoint of excellent transparency, adhesiveness, and heat resistance, an embodiment in which the resin is used by being attached to a transparent substrate via an acrylic pressure-sensitive adhesive is preferably used.

  An acrylic pressure-sensitive adhesive is a pressure-sensitive adhesive obtained by copolymerizing a polar monomer component with an acrylic acid alkyl ester as a main component, and the copolymerization ratio of the polar monomer component is acrylic acid-based. Preferably it is 0.1-20 mass parts per 100 mass parts of alkyl ester components, More preferably, it is 0.5-15 mass parts, More preferably, about 1-10 mass parts is preferable.

[Curing agent]
At the time of adhesion, it is preferable to use a curing agent in order to perform intramolecular crosslinking or intermolecular crosslinking of the pressure-sensitive adhesive component. The curing agent is appropriately selected and used according to the type of the pressure-sensitive adhesive monomer. For example, aliphatic diisocyanates such as hexamethylene diisocyanate, trimethylene propane adduct of hexamethylene diisocyanate, tolylene diisocyanate, tolylene diisocyanate trimethylol propane Polyisocyanate compounds such as aromatic diisocyanates such as adducts, melamine compounds such as butyl etherified styrene melamine and trimethylol melamine, diamine compounds such as hexamethylene diamine and triethyl diamine, bisphenol A / epichlorohydrin, polyethylene glycol diglycidyl ether, trimethylol Epoxy such as propane triglycidyl ether, N, N, N ', N'-tetraglycidyl-m-xylenediamine Compounds, urea resin-based compound, aluminum chloride, ferric chloride, aluminum sulfate, metal salts such as copper acetate or the like is used.

  The embodiment in which the acrylic pressure-sensitive adhesive contains an epoxy curing agent is particularly preferably used. Epoxy curing agents are generally highly reactive with carboxyl groups of acrylic pressure-sensitive adhesives, and are considered to be able to further strengthen the bond between the light-transmitting conductive film containing gelatin having a carboxyl group and the pressure-sensitive adhesive. In addition, even when the film is stored for a long period of time in a high temperature and high humidity environment, the adhesion of the film is hardly lowered, and the discoloration of the developed silver can be reduced. The mechanism for reducing the degree of discoloration is not clear, but it is presumed that the effect of outside air is reduced by the effect of improving the adhesion.

  The amount of the curing agent is generally 0.001 to 10 parts by mass, preferably 0.005 to 5 parts by mass, and more preferably about 0.01 to 3 parts by mass per 100 parts by mass of the acrylic resin.

  EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited thereto.

Example 1
[Preparation of light-transmitting conductive film 1]
<Production of support>
Both surfaces of a 100 μm biaxially stretched PET support were subjected to a corona discharge treatment of 12 W · min / m ² , and the undercoat coating solution B-1 was applied to a dry film thickness of 0.1 μm, and 12 W · A corona discharge treatment of min / m ² was performed, and the undercoat coating liquid B-2 was applied to a dry film thickness of 0.06 μm.

<Undercoat coating liquid B-1>
Copolymer latex liquid (solid content 30%) of butyl acrylate 30% by mass, t-butyl acrylate 20% by mass, styrene 25% by mass, and 2-hydroxyethyl acrylate 25% by mass 50 g
Compound (UL-1) 0.2g
Hexamethylene-1,6-bis (ethyleneurea) 0.05g
Finish with water 1000ml
<Undercoat coating liquid B-2>
10g gelatin
Compound (UL-1) 0.2g
Compound (UL-2) 0.2g
Silica particles (average particle size 3μm) 0.1g
Hardener (UL-3) 1.0g
Finish with water 1000ml.

<< Preparation of silver halide emulsion >>
The following solution-A was kept at 34 ° C. in a reaction vessel, and the pH was adjusted to 2.95 using nitric acid (concentration 6%) while stirring at high speed using a mixing stirrer described in JP-A-62-160128. Adjusted. Subsequently, the following solution-B and the following solution-C were added at a constant flow rate over 8 minutes and 6 seconds using the double jet method. After completion of the addition, the pH was adjusted to 5.90 using sodium carbonate (concentration 5 mass%), and then the following Solution-D and Solution-E were added.

<Solution-A>
Alkali-treated inert gelatin (average molecular weight 100,000) 18.7g
Sodium chloride 0.31g
Surfactant: 1.59 ml of 10% by mass methanol solution of polyisopropylene polyethylene oxydisuccinate sodium salt
Pure water 1246ml
<Solution-B>
169.9g of silver nitrate
Nitric acid (concentration 6% by mass) 5.89 ml
Finish to 317.1 ml with pure water.

<Solution-C>
Alkali-treated inert gelatin (average molecular weight 100,000) 5.66 g
Sodium chloride 58.8g
13.3 g of potassium bromide
Surfactant: 10% by mass methanol solution of polyisopropylene polyethylene oxydisuccinate sodium salt 0.65 ml
10% by weight aqueous solution of rhodium hexachloride complex 2.72 ml
Finish to 317.1 ml with pure water.

<Solution-D>
2-Methyl-4hydroxy-1,3,3a, 7-tetraazaindene 0.56 g
112.1 ml of pure water
<Solution-E>
Alkali-treated inert gelatin (average molecular weight 100,000) 3.96 g
Surfactant: 10% by mass methanol solution of polyisopropylene polyethylene oxydisuccinate sodium salt 0.40 ml
128.5 ml of pure water.

  After completion of the above operation, desalting and washing with water using a flocculation method are performed at 40 ° C. according to a conventional method. Finally, a silver chlorobromide cubic grain emulsion having an average grain size of 0.09 μm and a variation coefficient of 10% containing 10 mol% of silver bromide was obtained.

<Solution-F>
Alkali-treated inert gelatin (average molecular weight 100,000) 16.5g
Pure water 139.8 ml.

<< Preparation of silver halide photosensitive material >>
The above-prepared silver halide emulsion is coated on the support having the subbing layer as described above so that the coated silver amount is 0.5 g / m ² , and then dried to form a halogen halide. A silver halide photosensitive material was prepared.

  In the preparation of the silver halide photosensitive material, a hardener (tetrakis (vinylsulfonylmethyl) methane) was added at a ratio of 50 mg / g gelatin. Further, as a coating aid, a surfactant (sulfosuccinic acid di (2-ethylhexyl) · sodium) was added to adjust the surface tension. Further, the amount of gelatin was adjusted so that the mass ratio of silver to gelatin was 0.5. The mass ratio of silver and gelatin referred to here is a value obtained by dividing the mass of silver equivalent to the silver halide applied by the mass of gelatin applied, and the amount of coated silver used The amount of the silver halide emulsion was expressed as a value converted to equimolar silver.

"exposure"
Aggregated light quantity at 405 nm using a mercury lamp light source through a photomask with a line width of 5 μm, a line pitch of 250 μm, and a pattern in which the lines are orthogonal to each other at an inclination of 45 degrees with respect to the silver halide photosensitive material prepared by the above method Was exposed to 20 mj / cm ² .

<Development processing>
The exposed silver halide photosensitive material is developed with the following developer at 20 ± 0.3 ° C. for 10 minutes, then fixed with the following fixing solution at 20 ± 1.0 ° C. for 10 minutes, and rinsed with pure water. did.

(Developer)
750 ml of water
Metol 2g
100 g of anhydrous sodium sulfite
Hydroquinone 5g
Borax 2g
Add water to bring the total volume to 1000 ml.

(Fixing solution)
600 ml of water
240g sodium thiosulfate
Sodium sulfite 15g
Acetic acid (28%) 48ml
Boric acid 7.5g
15g powdered alum
Add water to bring the total volume to 1000 ml and adjust to pH 4.3 using aqueous ammonia or glacial acetic acid.

《Physical development processing》
Further, the following physical developer was prepared, and immediately after the preparation and 60 minutes after the preparation, physical development was performed at 20 ° C. for 8 minutes, followed by washing with water.

(Physical developer)
Silver nitrate 10g
Citric acid 6g
Hydroquinone 10g
Water is added to finish the total volume to 1300 ml.

<< Plating treatment >>
Thereafter, electrolytic copper plating treatment was performed at 25 ° C. using the following electrolytic plating solution. The current control in the electrolytic copper plating was performed at 3A for 1 minute, then at 1A for 9 minutes, for a total of 10 minutes.

(Electrolytic plating solution)
Copper sulfate (pentahydrate) 200g
50g of sulfuric acid
Sodium chloride 0.1g
Add water to bring the total volume to 1000 ml.

  In this way, a light transmissive conductive film 1 having a metal mesh layer was produced.

[Preparation of light-transmitting conductive film 2]
In the physical development process in the production of the light transmissive conductive film 1, immediately after the preparation of the silver ionic liquid and the reducing liquid described below, and after 60 minutes of the preparation, the silver ionic liquid → the reducing liquid is processed at 20 ° C. for 4 minutes, A light-transmitting conductive film 2 was produced in the same manner except that it was washed with water.

<Silver ionic liquid>
1300 ml of water
Silver nitrate 10g
<Reducing liquid>
1300 ml of water
Citric acid 6g
10 g of hydroquinone.

[Preparation of Light-Transparent Conductive Film 3]
In the physical development process in the production of the light-transmitting conductive film 2, the treatment of the silver ion solution → reducing solution → silver ion solution → reducing solution was performed immediately after the preparation of the silver ion solution and the reducing solution and after 60 minutes of preparation, respectively. A light-transmitting conductive film 3 was produced in the same manner except that it was carried out at 0 ° C. for 2 minutes and then washed with water.

[Production of Light-Transparent Conductive Film 4]
In the physical development processing in the production of the light-transmitting conductive film 2, the treatment of the silver ion solution → reducing solution → silver ion solution → reducing solution was performed immediately after the preparation of the silver ion solution and the reducing solution and after 60 minutes of preparation, respectively. A light-transmitting conductive film 4 was produced in the same manner except that the treatment was carried out at ° C. for 2 minutes and then washed with water.

[Evaluation]
For the light-transmitting conductive films 1 to 4 having conductive metal mesh portions thus obtained, the surface resistance was measured by a resistivity meter (Loresta GP (MCP-T610 type): Dia Instruments Co., Ltd.) ).

  From Table 1, it can be seen that the light-transmitting conductive films 2 to 4 of the present invention have a smaller surface resistance than the comparative light-transmitting conductive film 1 and excellent conductivity. In addition, the durability as a treatment liquid is clearly excellent. The transparency was comparable.

Claims (5)

Method for producing a light-transmitting conductive film, wherein a photosensitive material having at least one emulsion layer containing silver halide grains on a support is exposed, developed, fixed, physically developed and plated to form a conductive metal part A method for producing a light-transmitting conductive film, wherein the physical development treatment comprises a silver ion solution treatment and a reducing solution treatment. The method for producing a light transmissive conductive film according to claim 1, wherein the silver ion solution treatment and the reducing solution treatment are alternately and continuously performed in the physical development treatment. 3. The method for producing a light-transmitting conductive film according to claim 1, wherein a temperature of the physical development treatment is 20 ° C. or more and 60 ° C. or less. It manufactures with the manufacturing method of the light transmissive conductive film of any one of Claims 1-3, The light transmissive conductive film characterized by the above-mentioned. A light transmissive electromagnetic wave shielding film using the light transmissive conductive film according to claim 4.