JP2008121098A - 蒸発源およびこれを用いた真空蒸着装置 - Google Patents
蒸発源およびこれを用いた真空蒸着装置 Download PDFInfo
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- JP2008121098A JP2008121098A JP2006309798A JP2006309798A JP2008121098A JP 2008121098 A JP2008121098 A JP 2008121098A JP 2006309798 A JP2006309798 A JP 2006309798A JP 2006309798 A JP2006309798 A JP 2006309798A JP 2008121098 A JP2008121098 A JP 2008121098A
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- 238000001704 evaporation Methods 0.000 title claims abstract description 112
- 230000008020 evaporation Effects 0.000 title claims abstract description 110
- 238000007740 vapor deposition Methods 0.000 title claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 93
- 239000000463 material Substances 0.000 claims abstract description 37
- 238000005192 partition Methods 0.000 claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 238000000151 deposition Methods 0.000 claims description 20
- 230000008021 deposition Effects 0.000 claims description 18
- 238000001771 vacuum deposition Methods 0.000 claims description 6
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 230000008016 vaporization Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 42
- 238000007738 vacuum evaporation Methods 0.000 description 13
- 239000000126 substance Substances 0.000 description 6
- 239000010409 thin film Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
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- Chemical Kinetics & Catalysis (AREA)
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- Physical Vapour Deposition (AREA)
Abstract
【解決手段】蒸着材料を加熱により気化または昇華させることで生成された蒸気が長尺のノズル開口2より帯状に吐出される。一方、前記ノズル開口2に対峙した状態で、当該ノズル開口の長手方向に直交する方向に被蒸着基板3が矢印A方向に搬送されるように構成されている。前記ノズル開口2の長手方向における単位面積あたりの蒸気の吐出流量が、ノズル開口の中央部よりも基板端部の位置と同じノズル幅方向位置の部分において最大となるように構成されると共に、ノズル開口2内には蒸気の流れに指向性を付与する複数の仕切り板4が配置されている。
【選択図】図1
Description
1A 筐体部
1B 蒸発室(るつぼ)
2 ノズル開口
3 被蒸着基板
4 仕切り板
4a 整流板
5 ヒータ
6 蒸着材料
7 制御板
7a 蒸気通過孔
8 空間部
9 可動制御板
9a 蒸気通過孔
Claims (5)
- 蒸着材料が収容され前記蒸着材料を加熱により気化または昇華させて、前記蒸着材料の蒸気を発生させる蒸発室と、前記蒸発室に連通して前記蒸発室において生成された蒸気を、長尺のノズル開口より帯状に吐出させる筐体部とを具備した蒸発源であって、
前記ノズル開口の長手方向における単位面積あたりの蒸気の吐出流量Q(Kg/m2 sec)が、当該ノズル開口の中央部よりも基板端部の位置と同じノズル幅方向位置の部分において最大となるように蒸気の通過孔を形成した制御板が、前記筐体部内に配置されると共に、前記制御板と前記ノズル開口との間には、前記通過孔を経た蒸気の流れに指向性を付与する複数の仕切り板が配置されていることを特徴とする蒸発源。 - 前記ノズル開口の単位面積あたりの蒸気の吐出流量Q(Kg/m2 sec)が、当該ノズル開口の中央部から端部に向かって単調に増加し、基板端部の位置で最大となった後は単調に減少する流量分布を有することを特徴とする請求項1に記載された蒸発源。
- 前記複数の仕切り板の配列ピッチが、長手方向に沿って形成されたノズル開口の中央部における配列ピッチに対して両端部分における配列ピッチが狭く設定されていることを特徴とする請求項1または請求項2に記載された蒸発源。
- 請求項1ないし請求項3のいずれか1項に記載された前記蒸発源と被蒸着基板とが真空容器内に配置され、当該真空容器内において、前記蒸発源のノズル開口に対峙した状態で、当該ノズル開口の長手方向に直交する方向に前記被蒸着基板が搬送されるように構成されていることを特徴とする真空蒸着装置。
- 前記被蒸着基板の幅方向の端部に対峙する前記ノズル開口の単位面積あたりの蒸気の吐出流量Q1(Kg/m2 sec)と、前記ノズル開口の中央部におけるノズル開口の単位面積あたりの蒸気の吐出流量Q0(Kg/m2 sec)との流量比率をβ(=Q1/Q0)とし、前記βを、前記ノズル開口の端部と前記被蒸着基板との距離H(m)で割った値α(=β/H)が、10≦α≦30の範囲に設定されていることを特徴とする請求項4に記載された真空蒸着装置。
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006309798A JP4768584B2 (ja) | 2006-11-16 | 2006-11-16 | 蒸発源およびこれを用いた真空蒸着装置 |
| TW096142517A TWI386498B (zh) | 2006-11-16 | 2007-11-09 | 蒸鍍源及使用該蒸鍍源之真空蒸鍍機 |
| KR1020070116037A KR101450339B1 (ko) | 2006-11-16 | 2007-11-14 | 증발원 및 이것을 이용한 진공 증착 장치 |
| EP07022102A EP1927674B1 (en) | 2006-11-16 | 2007-11-14 | Evaporation source and vacuum evaporator using the same |
| US11/941,117 US8177912B2 (en) | 2006-11-16 | 2007-11-16 | Evaporation source and vacuum evaporator using the same |
| CN2007101694645A CN101182627B (zh) | 2006-11-16 | 2007-11-16 | 蒸发源以及使用该蒸发源的真空蒸镀装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006309798A JP4768584B2 (ja) | 2006-11-16 | 2006-11-16 | 蒸発源およびこれを用いた真空蒸着装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008121098A true JP2008121098A (ja) | 2008-05-29 |
| JP4768584B2 JP4768584B2 (ja) | 2011-09-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006309798A Active JP4768584B2 (ja) | 2006-11-16 | 2006-11-16 | 蒸発源およびこれを用いた真空蒸着装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8177912B2 (ja) |
| EP (1) | EP1927674B1 (ja) |
| JP (1) | JP4768584B2 (ja) |
| KR (1) | KR101450339B1 (ja) |
| CN (1) | CN101182627B (ja) |
| TW (1) | TWI386498B (ja) |
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| JP2010270363A (ja) * | 2009-05-21 | 2010-12-02 | Ulvac Japan Ltd | 真空蒸着装置 |
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| JP2011042874A (ja) * | 2009-08-24 | 2011-03-03 | Samsung Mobile Display Co Ltd | 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法 |
| JP2011052318A (ja) * | 2009-09-01 | 2011-03-17 | Samsung Mobile Display Co Ltd | 薄膜蒸着装置 |
| JP2011132596A (ja) * | 2009-12-22 | 2011-07-07 | Samsung Mobile Display Co Ltd | 蒸発源及びそれを用いた蒸着装置 |
| JP2011146377A (ja) * | 2010-01-14 | 2011-07-28 | Samsung Mobile Display Co Ltd | 薄膜蒸着装置、これを利用した有機発光ディスプレイ装置の製造方法及びこれにより製造された有機発光ディスプレイ装置 |
| JP2011219866A (ja) * | 2010-04-06 | 2011-11-04 | Samsung Mobile Display Co Ltd | 薄膜蒸着装置及びこれを用いた有機発光表示装置の製造方法 |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI386498B (zh) | 2013-02-21 |
| CN101182627B (zh) | 2011-06-22 |
| EP1927674B1 (en) | 2012-07-18 |
| CN101182627A (zh) | 2008-05-21 |
| KR101450339B1 (ko) | 2014-10-14 |
| TW200825192A (en) | 2008-06-16 |
| EP1927674A3 (en) | 2010-08-25 |
| US8177912B2 (en) | 2012-05-15 |
| EP1927674A2 (en) | 2008-06-04 |
| JP4768584B2 (ja) | 2011-09-07 |
| KR20080044775A (ko) | 2008-05-21 |
| US20080115729A1 (en) | 2008-05-22 |
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