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JP2008198668A - 平坦化研磨方法及び半導体装置の製造方法 - Google Patents

平坦化研磨方法及び半導体装置の製造方法 Download PDF

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Publication number
JP2008198668A
JP2008198668A JP2007029798A JP2007029798A JP2008198668A JP 2008198668 A JP2008198668 A JP 2008198668A JP 2007029798 A JP2007029798 A JP 2007029798A JP 2007029798 A JP2007029798 A JP 2007029798A JP 2008198668 A JP2008198668 A JP 2008198668A
Authority
JP
Japan
Prior art keywords
polishing
surfactant
polished
oxide film
planarization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007029798A
Other languages
English (en)
Japanese (ja)
Inventor
Mika Fujii
美香 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2007029798A priority Critical patent/JP2008198668A/ja
Priority to TW096150646A priority patent/TW200845168A/zh
Priority to KR1020080000065A priority patent/KR20080074722A/ko
Priority to US12/010,922 priority patent/US20080194183A1/en
Priority to CNA2008100048772A priority patent/CN101239453A/zh
Publication of JP2008198668A publication Critical patent/JP2008198668A/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/04—Protective tubing or conduits, e.g. cable ladders or cable troughs
    • H02G3/0456—Ladders or other supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B17/00—Connecting constructional elements or machine parts by a part of or on one member entering a hole in the other and involving plastic deformation
    • F16B17/006—Connecting constructional elements or machine parts by a part of or on one member entering a hole in the other and involving plastic deformation of rods or tubes to sheets or plates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B37/00—Nuts or like thread-engaging members
    • F16B37/04—Devices for fastening nuts to surfaces, e.g. sheets, plates
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/04—Protective tubing or conduits, e.g. cable ladders or cable troughs
    • H02G3/0406—Details thereof
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/30—Installations of cables or lines on walls, floors or ceilings
    • H10P95/062—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2007029798A 2007-02-08 2007-02-08 平坦化研磨方法及び半導体装置の製造方法 Pending JP2008198668A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007029798A JP2008198668A (ja) 2007-02-08 2007-02-08 平坦化研磨方法及び半導体装置の製造方法
TW096150646A TW200845168A (en) 2007-02-08 2007-12-27 Planarization polishing method and method for manufacturing semiconductor device
KR1020080000065A KR20080074722A (ko) 2007-02-08 2008-01-02 평탄화 연마 방법 및 반도체장치의 제조 방법
US12/010,922 US20080194183A1 (en) 2007-02-08 2008-01-31 Planarization polishing method and method for manufacturing semiconductor device
CNA2008100048772A CN101239453A (zh) 2007-02-08 2008-02-05 平坦化研磨法和半导体装置的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007029798A JP2008198668A (ja) 2007-02-08 2007-02-08 平坦化研磨方法及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
JP2008198668A true JP2008198668A (ja) 2008-08-28

Family

ID=39686243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007029798A Pending JP2008198668A (ja) 2007-02-08 2007-02-08 平坦化研磨方法及び半導体装置の製造方法

Country Status (5)

Country Link
US (1) US20080194183A1 (zh)
JP (1) JP2008198668A (zh)
KR (1) KR20080074722A (zh)
CN (1) CN101239453A (zh)
TW (1) TW200845168A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011171409A (ja) * 2010-02-17 2011-09-01 Disco Corp ウエーハの研磨方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI443741B (zh) * 2011-01-14 2014-07-01 國立交通大學 一種平整化氮化物基板的方法
TWI517935B (zh) * 2013-04-16 2016-01-21 國立台灣科技大學 氣體添加硏磨液的供應系統及其方法
CN105199668A (zh) * 2015-08-14 2015-12-30 芜湖真空科技有限公司 Low-e玻璃用磨边材料及其制备方法
US10199255B2 (en) * 2016-03-10 2019-02-05 Infineon Technologioes AG Method for providing a planarizable workpiece support, a workpiece planarization arrangement, and a chuck
CN109590820B (zh) * 2019-01-02 2021-07-06 中国科学院上海光学精密机械研究所 超硬激光晶体表面粗糙度的加工方法
JP7317532B2 (ja) * 2019-03-19 2023-07-31 キオクシア株式会社 研磨装置及び研磨方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011171409A (ja) * 2010-02-17 2011-09-01 Disco Corp ウエーハの研磨方法

Also Published As

Publication number Publication date
US20080194183A1 (en) 2008-08-14
TW200845168A (en) 2008-11-16
KR20080074722A (ko) 2008-08-13
CN101239453A (zh) 2008-08-13

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