JP2008177148A - connector - Google Patents

Abstract

Provided is a compact connector that can increase the density of equal-length wirings and substrates, and has good high-frequency characteristics suitable for a digital transmission system such as TMDS.
A connector includes a plurality of contacts connected to one connection object, a housing holding each contact, and a connection member including a plurality of terminals connected to the other connection object. The connecting member includes a plurality of first conductor patterns 41 arranged in parallel to each other, a plurality of second conductor patterns 42 intersecting with the pattern 41 and arranged in parallel to each other, and the same as the pattern 41 A plurality of third conductor patterns 43 arranged in a direction and parallel to each other, a plurality of third conductor patterns 43 intersecting the pattern 43, arranged in the same direction as the pattern 42, and arranged in parallel to each other And a fourth conductor pattern 44. The first to fourth patterns 41 to 44 are stacked and arranged at different positions.
[Selection] Figure 3

Description

  The present invention relates to a connector, and more specifically to an angle type connector.

  A conventional isometric right angle connector will be described with reference to a publication distributed before the present application (see, for example, Patent Document 1).

  FIG. 10A is a side view of the state before the assembly of the isometric right angle connector, and FIG. 10B is a cross-sectional view taken along the line AA in the direction of the arrow in FIG.

  The connector has three substrates 140, 150, 160 made of an insulating material. A plurality of signal patterns (conductor patterns) 141 are provided on both sides of the central substrate 140, and the signal patterns 141 on both sides are electrically connected by plating each through-hole 143. Reference numeral 145 denotes each through hole that has been plated for attaching a signal pin contact, and reference numeral 147 denotes each through hole that attaches a ground pin.

  A plurality of ground conductor patterns 161 are provided on the outer surfaces of the substrates 150 and 160 on both sides, and the ground conductor patterns 161 are connected by through holes that have been plated.

  11A is a side view of the connector after assembly, and FIG. 11B is a cross-sectional view taken along line BB in the direction of the arrow in FIG.

  A pin contact 108 is attached to each through hole 145 for attaching a signal pin, and a ground pin contact 109 is attached to each through hole 147 for inserting a ground pin contact.

Japanese Patent No. 2623435

  In the conventional connector, signal conductor patterns are provided on both sides of the central substrate, and ground conductor patterns are provided on the outer sides of the substrates on both sides.

  Therefore, although equal-length wiring is possible, it is difficult to increase the density of the substrate and thus make the connector compact.

  Therefore, the present invention provides a compact connector that improves the shortcomings of the conventional connector, enables high-density wiring and substrates, and has good high-frequency characteristics suitable for digital transmission systems such as TMDS. It is something to try.

  The present invention employs the following means in order to solve the above problems.

  1.2 In the connector for connecting two connection objects, the connector includes a plurality of contacts (10) connected to one of the connection objects, a housing (20) holding each of the contacts, and the other of the connection objects. A connection member (40) including a plurality of terminals (50, 60) connected to the connection object (70), and the connection member includes a plurality of first conductor patterns (41) arranged in parallel to each other. ), A plurality of second conductor patterns (42) that intersect with each first conductor pattern and are arranged in parallel to each other, and are arranged in the same direction as each of the first conductor patterns and are parallel to each other A plurality of third conductor patterns (43) disposed on the surface, intersecting with each of the third conductor patterns, disposed in the same direction as each of the second conductor patterns, and disposed in parallel to each other. A plurality of fourth conductor patterns ( 4), and the first to fourth conductor patterns are sequentially stacked and arranged at different positions, and one end sides (41a, 47) of the first conductor patterns are connected to the contacts, The other end side (41b) of each first conductor pattern is connected to one end side (42a) of each second conductor pattern, and the other end side (42b) of each second conductor pattern is each terminal. One end side (43a, 48) of each third conductor pattern is connected to each contact, and the other end side (43b) of each third conductor pattern is connected to each fourth conductor pattern. A connector that is connected to one end side (44a) and the other end side (44b) of each of the fourth conductor patterns is connected to each of the terminals.

  2. The connector according to claim 1, wherein the connector further includes a shell (30) covering the housing, and the shell includes a shell terminal (30a) connected to the other connection object.

  3. The terminals are arranged in three rows in the laminating direction of the first to fourth conductor patterns, and the connection member has a plurality of positioning portions (49), and the terminals ( 60) The connector according to 1, wherein the connector 60 is positioned in a pitch direction orthogonal to the stacking direction.

  4). Each of the first conductor patterns and each of the third conductor patterns are disposed at different positions in a direction orthogonal to the wiring direction of the both conductor patterns, and each of the second conductor patterns and each of the fourth conductors. 4. The connector according to 1, 2, or 3, wherein the patterns are arranged at different positions in a direction orthogonal to the wiring direction of the two conductor patterns.

  5. 5. The connector according to 1, 2, 3 or 4, wherein the conductor pattern length between each contact and each terminal is equal.

  6). At least one of the layer having each second conductor pattern or the layer having each third conductor pattern is provided with a ground layer (80) covering the entire area of one layer of the connection member, The connector according to 1, wherein the first to fourth conductor patterns are connected to a ground pattern.

  As is apparent from the description of the specification, the present invention has the following effects.

  1. It is possible to provide a connector with good high frequency characteristics adapted to a digital transmission system such as TMDS.

  2. Since the shell has a shell terminal that covers the housing and is connected to the other connection object, the EMI characteristics can be improved.

  3. Since the plurality of terminals of the connection member connected to the other connection object are arranged in three rows in the stacking direction of the plurality of first to fourth conductor patterns, the density of the connection member can be increased.

  4). Since the terminals in the center row among the plurality of terminals of the connection member are positioned in the pitch direction orthogonal to the stacking direction by the plurality of positioning portions of the connection member, the connection member is easily connected to the other connection object.

  5. Since the plurality of first and third conductor patterns and the plurality of second and fourth conductor patterns are arranged at different positions in the direction orthogonal to the arrangement direction, the connecting member is configured to be compact.

  6). A connector having the same conductor pattern length between the plurality of contacts and the plurality of terminals is obtained.

  7. Since the ground layer covers the entire area of one layer of the connection member, the high frequency characteristics are further improved.

  Three connectors according to the present invention will be described. This connector has a high frequency characteristic suitable for a digital transmission system such as TMDS by incorporating a board in which two equal-length right-angle boards in the prior art are pasted together and devising the arrangement of conductor patterns. Connector.

  A first embodiment of the present invention will be described with reference to FIGS.

  1A to 1D respectively show a front view, a side view, a rear view, and a plan view of a connector in which a built-in substrate (connecting member) 40 is built.

  The connector includes a plurality of contacts 10, an insulator (housing) 20 that holds each contact 10, and a shell 30 that covers each contact 10 and the insulator 20. The connector includes a built-in substrate 40, and a plurality of terminals 50, 60 of the built-in substrate 40 are connected to the mounting substrate 70. The shell 30 has a pair of shell terminals 30 a that are connected to the mounting substrate 70.

  The plurality of contacts 10 are assembled to the insulator 20 so as to be arranged in two rows at the fitting port, and are connected to the built-in substrate 40 by sandwiching SMT (surface mounting technology).

  2 to 4 are various views of the built-in substrate 40. 2A to 2C show a front view, a side view, and a rear view, respectively. 3A to 3D are cross-sectional views taken along one-dot chain lines AA, BB, CC, and DD as viewed in the direction of the arrow in FIG. 2B, and form a built-in substrate. Each of the 1st-4th conductor pattern to perform is shown. FIG. 3E is a plan view. 4A to 4C are cross-sectional views taken along one-dot chain lines EE, FF, and GG as viewed in the direction of the arrow in FIG. 2C, respectively. ) Shows a state where the terminals are assembled.

  Each terminal 50, 60 is assembled into the through hole of the built-in substrate 40 by press fitting or press fitting, or is electrically connected by soldering.

  Each terminal 50, 60 is inserted into a through hole of the mounting board 70 and electrically connected to a pattern (not shown) of the mounting board 70 by soldering, or a pattern (not shown) of the mounting board 70 by SMT. Electrically).

  FIG. 6 shows pin assignment of HDMI (High Definition Multimedia Interface). For example, terminals 1 to 3 are TMDS data 2, 1 is +, 2 is shield, and 3 is −. In the arrangement of these transmission lines, it is desirable that the positions of + and − have the same distance from the shield. The terminals 1 to 3 are indicated by circles 1 (refer to the number 1 surrounded by a circle. The same applies to the numbers 2 and below) in FIGS.

  As shown in FIG. 3A, a plurality of first conductor patterns 41 having different lengths are formed on the first layer of the built-in substrate 40 so as to extend in parallel with each other.

  In the second layer of the built-in substrate 40, as shown in FIG. 3B, a plurality of second conductor patterns 42 having different lengths are arranged in a direction orthogonal to the first conductor patterns 41, and The first conductor patterns 41 are extended from the end 41b in parallel to each other, the number of the first conductor patterns 41 is equal to the number of the second conductor patterns 42, and the second conductors Through holes 45 plated are provided at the start end 42a of the pattern 42 and the end 41b of each first conductor pattern 41, and both the through holes 45 are electrically connected.

  As shown in FIGS. 3C and 3D, a plurality of third and fourth conductor patterns 43 and 44 are provided on the third and fourth layers of the built-in substrate 40, respectively. , 42.

  As shown in FIGS. 3A and 3C, each first conductor pattern 41 and each third conductor pattern 43 are arranged at different positions in the direction orthogonal to the wiring direction. Further, each second conductor pattern 42 and each fourth conductor pattern 44 are arranged at different positions in the direction orthogonal to the wiring direction, as shown in FIGS.

  As shown in FIG. 4B, the circle 2 of the third conductor pattern 43 is located between the adjacent circle 1 and circle 3 in the first conductor pattern 41. As shown in FIG. 4C, the circle 2 of the fourth conductor pattern 44 is located between the adjacent circle 1 and circle 3 in the second conductor pattern 42.

  Terminals 50 and 60 for connection to the mounting substrate 70 are electrically connected and fixed to the end 42b of each second conductor pattern. Some of these terminals 60 are decentered by bending them into a crank shape (see FIG. 4B) in the thickness direction of the built-in substrate 40, and are arranged in the middle row of FIGS. 5A and 5B. Therefore, connection with the wiring of the mounting substrate 70 is facilitated.

  A plurality of semicircular grooves (positioning portions) 49 are formed in the lower part of the built-in substrate 40 as shown in FIG. 2C and the like. When the intermediate portion of the terminal 60 fits into the groove 49, the terminal 60 is positioned on the built-in substrate 40, and connection with the mounting substrate 70 becomes easy.

  The transmission lines (+, −) connected to each terminal 50 are wired with the same length. The transmission line (shield and others) connected to each terminal 60 is slightly longer than the transmission line connected to each terminal 50 by the amount of eccentricity in a crank shape.

  As shown in FIGS. 4B and 4C, the two signal contact circles 1, 3 and one ground contact circle 2 are arranged at the apex of the triangle, so that good high frequency characteristics can be obtained. It is done. Further, the characteristic impedance can be set to a predetermined value by adjusting the width of each conductor pattern.

  A second embodiment of the present invention will be described with reference to FIG.

  In the description of the second and third embodiments of the present invention, the description of the same points as in the first embodiment is omitted, and different points are described.

  FIGS. 7A and 7B are views of the built-in substrate (connection member) in Example 2 of the present invention, where FIG. 7A is a side view, FIG. 7B is a front view of the surface layer, and FIG. (D) is a cross-sectional view taken along the alternate long and short dash line B-B seen in the direction of the arrow in (A), (E) is a rear view of the back layer, and (F) is (B) ) Shows cross-sectional views taken along one-dot chain line CC in the direction of the arrows in FIG.

  FIG. 7C is a ground layer provided on the layer having the second conductor pattern 42 of the first embodiment, and is composed of a ground plate 80. The ground terminal is electrically connected to the ground plate 80 through the through hole 81. However, pattern wiring is not provided.

  In the surface layer shown in FIG. 7 (B) and the back layer shown in FIG. 7 (E), pads (terminals) 84, which are easily impedance-matched when connecting to the terminals 50, 60 for connection to the mounting substrate 70, 85 are provided, and are connected to the inner layer shown in FIGS. 7C and 7D by through-hole platings 82 and 83.

  Also, the pad 86 provided in FIGS. 7B and 7E is connected to the ground plate 80 of FIG.

  The escape portions 82 ′ and 83 ′ in FIG. 7C are portions where the ground plate 80 and the through-hole platings 82 and 83 are not connected.

  According to the second embodiment, since the ground plate 80 is wide, the inductance of the ground is reduced and a sufficient return path can be obtained, so that the high frequency characteristics are further improved. Furthermore, since there is no ground pattern wiring, the position of the ground pad can be freely selected by preparing a substrate in which the position of the through hole 81 is changed. Therefore, an advantage that the number of pin assignment options of the mounting substrate 70 is increased occurs.

  Further, since the terminals 50 and 60 for connection to the mounting board 70 are held by separate insulators, a work that may disturb the electrical performance is held in the built-in board (connection member) 40 for holding. There is no need to apply, and the thickness can be reduced. The coplanarity is better than holding the connection terminals 50 and 60 on the built-in substrate 40 by press fitting or the like.

  The ground plate 80 covering almost the entire area of one of the layers of the built-in substrate 40 is provided on at least one of the layer having each second conductor pattern 42 or the layer having each third conductor pattern 43. 80 may be configured to be connected to the ground pattern in each of the first to fourth conductor patterns 41 to 44.

  A third embodiment of the present invention will be described with reference to FIGS.

  8A and 8B are diagrams showing a state in which the built-in substrate according to the third embodiment of the present invention is built in. FIG. 8A is a side view, FIG. 8B is a rear view, FIG. 8C is a front view, and FIG. The figure and (E) show a bottom view, respectively. 9A and 9B are cross-sectional views in FIG. 8B, where FIG. 9A is a cross-sectional view taken along the alternate long and short dash line AA seen in the direction of the arrow, and FIG. Sectional drawing (C) shows a sectional view taken along one-dot chain line CC as viewed in the direction of the arrow.

  The terminals 50 and 60 for connection with the mounting substrate 70 are held by a separate insulator 90. The connection terminal 50 is disposed so as to sandwich the built-in substrate 40 and is held by the holding portions 93 and 94 of the insulator 90. Further, the shell 100 is extended along the upper surface 91 and the lower surface 92 of the insulator 90, and the shell 100 substantially covers the built-in substrate 40. The shell mounting terminals 101 to 104 are arranged so as to be adjacent to both ends of the connection terminal 50.

  According to the third embodiment, since the holding portions 93 and 94 of the connection terminal 50 are arranged in the thickness direction of the built-in substrate 40, high frequency characteristics such as crosstalk are improved. Further, since the shell 100 can be extended along the insulator 90, the shell mounting terminals 101 to 104 are arranged next to the connection terminals 50a to 50d, and all the terminals of the connection terminals 50 are high-frequency. The same condition can be set. (Characteristic impedance changes depending on whether or not there are metal terminals on both sides.) Further, by covering most of the built-in substrate 40 with the shell 100, unnecessary unnecessary radiation can be suppressed.

BRIEF DESCRIPTION OF THE DRAWINGS It is various figures of the connector in the state in which the internal substrate in Example 1 of this invention is incorporated, (A) is a front view, (B) is a side view, (C) is a rear view, (D) is a top view. Are shown respectively. It is various drawings of the built-in substrate, (A) shows a front view, (B) shows a side view, and (C) shows a rear view. It is various figures of the built-in board, (A)-(D) is sectional drawing by a dashed-dotted line AA, BB, CC, DD seen in the direction of an arrow in Drawing 2 (B), (E) shows a plan view. It is various figures of the built-in board, (A)-(C) shows a sectional view by a dashed-dotted line EE, FF, GG seen in the direction of an arrow in Drawing 2 (C), respectively, (A) and (B) show the state where the terminals are assembled. FIG. 2 is a layout view of a plurality of contacts (PIN) of the connector, FIG. 3A is a layout view of the contacts with respect to a mounting substrate, and FIG. HDMI pin assignments are shown. It is various figures of the internal substrate in Example 2 of this invention, (A) is a side view, (B) is a front view of a surface layer, (C) is the dashed-dotted line AA seen in the arrow direction in (A). (D) is a cross-sectional view taken along one-dot chain line BB as viewed in the direction of the arrow in (A), (E) is a rear view of the back layer, and (F) is viewed in the direction of the arrow in (B). Cross-sectional views taken along one-dot chain line CC are shown. It is various figures of the state in which the internal substrate in Example 3 of this invention is incorporated, (A) is a side view, (B) is a rear view, (C) is a front view, (D) is a top view, E) shows bottom views respectively. FIG. 9B is a cross-sectional view in FIG. 8B, where FIG. 8A is a cross-sectional view taken along an alternate long and short dash line AA seen in the direction of the arrow, and FIG. (C) is a cross-sectional view taken along one-dot chain line CC as viewed in the direction of the arrow. It is a state before the assembly of the conventional equal length right angle connector, (A) is a side view, (B) shows sectional drawing by line AA seen in the arrow direction in (A), respectively. It is a state after the assembly of the connector, (A) is a side view, (B) is a sectional view taken along line BB in the arrow direction in (A).

Explanation of symbols

10 Contacts 20 Insulator (housing)
30 Shell 30a Shell terminal 40 Built-in board (connection member)
41 First conductor pattern 41a One end side 41b Termination, other end side 42 Second conductor pattern 42a Start end, one end side 42b Termination, other end side 43 Third conductor pattern 43a One end side 43b Other end side 44 Fourth conductor Pattern 44a One end side 44b The other end side 45, 46 Through hole 47 One end side of the first conductor pattern 48 One end side of the third conductor pattern 49 Groove (positioning portion)
50, 50a, 50b, 50c, 50d Terminal 60 Terminal 70 Mounting board 80 Ground plate (ground layer)
81 Through hole 82, 83 Through hole plating 82 ', 83' Escape part 84, 85, 86 Pad (terminal)
90 Insulator 91 Upper surface 92 Lower surface 93, 94 Holding portion 100 Shell 101, 102, 103, 104 Shell mounting terminal

Claims (6)

In a connector that connects two objects to be connected,
The connector includes a plurality of contacts that connect to one of the connection objects, a housing that holds the contacts, and a connection member that includes a plurality of terminals that connect to the other connection object.
The connecting member includes a plurality of first conductor patterns arranged in parallel with each other, a plurality of second conductor patterns intersecting with each of the first conductor patterns and arranged in parallel with each other, A plurality of third conductor patterns arranged in the same direction as the first conductor pattern and parallel to each other, intersecting each of the third conductor patterns, and in the same direction as each of the second conductor patterns A plurality of fourth conductor patterns disposed in parallel with each other,
The first to fourth conductor patterns are sequentially stacked and arranged at different positions,
One end side of each first conductor pattern is connected to each contact, the other end side of each first conductor pattern is connected to one end side of each second conductor pattern, and each second conductor The other end side of the pattern is connected to each terminal, one end side of each third conductor pattern is connected to each contact, and the other end side of each third conductor pattern is each fourth conductor pattern. The other end side of each said 4th conductor pattern is connected with the said each terminal.   2. The connector according to claim 1, wherein the connector further includes a shell covering the housing, and the shell includes a shell terminal connected to the other connection object.   The terminals are arranged in three rows in the stacking direction of the first to fourth conductor patterns, the connecting member has a plurality of positioning portions, and the terminals in the center row are positioned in the stacking direction by the positioning portions. The connector according to claim 1, wherein the connector is positioned in a pitch direction perpendicular to the connector.   The first conductor patterns and the third conductor patterns are disposed at different positions in a direction orthogonal to the wiring direction of the two conductor patterns, and the second conductor patterns and the fourth conductors 4. The connector according to claim 1, wherein the patterns are arranged at different positions in a direction orthogonal to the wiring direction of the two conductor patterns.   The connector according to claim 1, 2, 3, or 4, wherein the length of the conductor pattern between each contact and each terminal is equal.   At least one of the layer having each second conductor pattern or the layer having each third conductor pattern is provided with a ground layer covering the entire area of one layer of the connecting member, and the ground layer is formed by the first to first layers. The connector according to claim 1, wherein the connector is connected to a ground pattern in the four conductor patterns.

Images